JP3565063B2 - Ultrasonic crimping apparatus and ultrasonic crimping method for electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic crimping apparatus and an ultrasonic crimping method for an electronic component that applies ultrasonic vibration to an electronic component and presses the electronic component on a work.
[0002]
[Prior art]
For example, as a method of mounting an electronic component such as a flip chip on a work such as a substrate, a method using an ultrasonic pressure bonding device is known. The ultrasonic crimping apparatus presses a tool for crimping against an electronic component and causes the tool to ultrasonically vibrate, thereby applying ultrasonic vibration to the electronic component and crimping the electronic component on a workpiece. A tool has a unique resonance frequency due to its size and shape, and when the tool is pressed against an electronic component and the electronic component is pressed against a workpiece, it is necessary to vibrate the tool strongly at the resonance frequency and a predetermined power. .
[0003]
The tool is exchanged according to the type of electronic component. Therefore, when the tool is replaced, the unique resonance frequency of the new tool and the impedance at that time are measured, and the ultrasonic pressure bonding apparatus is operated based on the measurement result. Therefore, conventionally, when a new tool is set in an ultrasonic crimping device and used, the resonance frequency and impedance of the tool are measured by a measuring device prior to the setting, and the ultrasonic crimping device is operated according to the measurement result. Then, the electronic component was crimped to the work.
[0004]
[Problems to be solved by the invention]
However, conventionally, equipment cost is required because a measuring device for measuring the resonance frequency and impedance is required in addition to the ultrasonic crimping device, and the operator has to perform the measurement of the resonance frequency and impedance with the measuring device. Was also big.
[0005]
Accordingly, the present invention aims to provide an ultrasonic bonding apparatus and an ultrasonic bonding method for an electronic component having a function of measuring the resonant frequency of the ultrasonic crimping tool.
[0006]
[Means for Solving the Problems]
The present invention is an ultrasonic crimping apparatus for an electronic component that presses an exchangeable tool against an electronic component and presses the electronic component against a workpiece while ultrasonically oscillating the tool, and a vibrator that ultrasonically vibrates the tool. an ultrasonic controller for controlling the driving of the vibrator based on the drive command including the frequency vibrating the tools, the first for outputting a driving command to change the pre distichum wavenumber in the ultrasonic control unit ultra a wave command unit, a measuring unit for measuring the first current and voltage flowing in the vibrator while changing the pre distichum wavenumber by a command of the ultrasonic command unit, from said measurement data measured by the measuring section a resonance state detection unit for detecting the resonant frequency of the tool, the resonant data storage unit for registering the number of resonance frequency detected by the resonant state detecting unit, or in the resonant frequency which is registered in the resonant data storage unit A second ultrasonic wave command section for outputting a drive command calls the resonance frequency to the ultrasonic control unit of the tool used, the resonance frequency tracking means for resonating said tool by correcting the frequency, the first The measurement mode in which the vibrator is driven based on the drive command from the ultrasonic command section to detect and register the resonance frequency of the tool and the resonance frequency included in the drive command from the second ultrasonic command section is A mode setting unit capable of setting any one of an automatic tracking mode for driving the vibrator by correcting the resonance frequency by means of a resonance frequency tracking unit .
[0007]
Also, the present invention provides a vibrator for vibrating a tool which is exchangeably mounted on a bonding unit , the ultrasonic vibrator in a state where a resonance frequency automatic tracking function for resonating the tool by correcting a frequency output to the tool is turned off. the current and voltage by outputting a drive command from the command section flowing to the vibrator while changing the oscillation frequency of the tool is measured by the measuring unit, the resonant frequency of the tool from the measured measurement data detected at resonance detector Te registers the resonant frequency of the tool to the resonant data storage unit performs a registration operation, when crimping the electronic parts to the work, call resonant frequency of the tool to be used from the resonant data storage unit, the resonant An ultrasonic crimping method for an electronic component , wherein the resonator is driven by correcting the resonance frequency while the automatic frequency tracking function is turned on .
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an ultrasonic pressure bonding apparatus for an electronic component according to an embodiment of the present invention, FIG. 2 is a block diagram of the ultrasonic control unit, FIG. 3 is a functional block diagram thereof, FIG. , FIG. 7 is a screen view of the monitor, and FIGS. 8, 9, and 10 are flowcharts of the operation.
[0009]
First, the overall configuration of an ultrasonic pressure bonding apparatus for electronic components will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a bonding unit, below which a tool 2 for ultrasonic pressure bonding is exchangeably mounted. A vibrator 3 for ultrasonically vibrating the tool 2 is mounted on a side portion of the tool 2. The tool 2 is provided with a protrusion 2a. The bumps 5 of the flip chip 4 are pressed against the electrodes of the substrate 6 while pressing the projections 2a against the upper surface of the flip chip 4 and performing ultrasonic vibration. Reference numeral 7 denotes a table for positioning the substrate 6. The work to be subjected to ultrasonic pressure bonding is not limited to a flip chip, but may be, for example, an outer lead of an electronic component.
[0010]
Next, a control system for ultrasonically vibrating the tool 2 will be described. Reference numeral 10 denotes a bus to which an ultrasonic control unit 11, a measurement unit 12, a control unit 13 including a CPU, a storage unit 14, a display unit 15, an operation / input unit 16 such as a keyboard and a mouse, and an input / output unit 17 are connected. I have.
[0011]
The ultrasonic control unit 11 and the measuring unit 12 are connected to the vibrator 3, and the ultrasonic control unit 11 controls driving of the vibrator 3. The current I and the current V of the vibrator 3 are fed back to the ultrasonic controller 11 and the measuring unit 12. The measuring unit 12 measures a current I flowing through the vibrator 3 and outputs data of the measured current and voltage as measurement data.
[0012]
The control unit 13 performs control necessary for executing a program (a program for ultrasonic pressure bonding, impedance detection, resonance point detection, tool setting, and the like). The storage unit 14 stores resonance frequency and impedance data for each tool calculated from the measurement data measured by the measurement unit 12. The input / output unit 17 outputs signals for operating actuators such as motors and cylinders, outputs data, and inputs signals and data sent from various sensors. The actuator, various sensors, and the like are incorporated in the ultrasonic pressure bonding apparatus. Since these are well-known elements, detailed description thereof will be omitted.
[0013]
FIG. 2 shows a detailed configuration of the ultrasonic controller 11. In FIG. 2, frequency data is sent from the control unit 13 to the frequency setting unit 21. Then, while storing data of this frequency, a signal (voltage) proportional to the frequency is output. The ultrasonic oscillator 22 outputs an ultrasonic signal having a frequency corresponding to the input voltage. An oscillation command signal is sent from the control unit 13 to the ultrasonic oscillation unit 22. The ultrasonic oscillating unit 22 inputs an ultrasonic signal to the amplifier 23 at the timing specified by the oscillation command signal. The amplifier 23 amplifies the ultrasonic signal with an amplification factor according to the gain signal sent from the control unit 13, boosts the ultrasonic signal with the transformer 25, and inputs the boosted ultrasonic signal to the transducer 3.
[0014]
The current I and the voltage V of the vibrator 3 are input to the phase comparator 26. The phase comparing section 26 outputs a signal (voltage) proportional to the phase difference between the current I and the voltage V. Here, if the resonance point shifts due to a crimping operation or the like, the phases of the current I and the voltage V also shift. Therefore, the phase comparing unit 26 compares the phase shifts, and feeds back a voltage corresponding to the comparison result to an adding unit (described later) 28.
[0015]
A mode setting unit 27 is connected to the phase comparison unit 26. The mode setting unit 27 includes a changeover switch 27a. During normal operation (when the tool 2 is ultrasonically vibrated to press the flip chip 4 against the substrate 6), the changeover switch 27a is closed (the resonance frequency automatic tracking function is ON). When the measuring unit 12 measures the current I and the voltage V, the changeover switch 27a is opened (the resonance frequency automatic tracking function is turned off), and the frequency f is increased from fs to fe by a command from the control unit 13. This will be described later with reference to FIG.
[0016]
An addition unit 28 is connected between the frequency setting unit 21 and the mode setting unit 27. The addition unit 28 adds the voltage from the frequency setting unit 21 and the voltage from the phase comparison unit 26 sent through the mode setting unit 27, and inputs the added voltage to the ultrasonic oscillation unit 22. When the crimping operation is performed, the resonance frequency of the tool 2 fluctuates due to a change in the load acting on the tool 2. This change is detected by the phase comparison unit 26 and output from the ultrasonic oscillation unit 22 by the addition unit 28. Correct the frequency of the ultrasonic signal. That is, the phase comparing section 26 and the adding section 28 serve as resonance frequency tracking means. The resonance frequency tracking means can track the resonance frequency only within a relatively limited range around the frequency set in the frequency setting unit 21. Therefore, when the resonance frequency greatly changes due to tool exchange or the like, the frequency setting unit It is necessary to change the frequency itself to be set.
[0017]
Next, a functional block diagram will be described with reference to FIG. A first ultrasonic command unit 31 and a second ultrasonic command unit 32 are connected to the ultrasonic control unit 11. The first ultrasonic instructing unit 31 changes the setting mode switching signal and a frequency signal for detecting the resonance frequency (a signal for gradually changing the frequency, in this embodiment, the frequency gradually from the measurement start frequency fs to the measurement end frequency fe). The signal to be increased is input to the ultrasonic controller 11. The second ultrasonic instructing unit 32 is configured to output a frequency (resonant frequency) during normal operation (operation in which the tool 2 is ultrasonically vibrated at a resonance frequency to press the flip chip 4 onto the substrate 6) and an ultrasonic signal generated by the amplifier 24. , That is, a gain signal for determining the output (power) of the ultrasonic controller, is input to the ultrasonic controller 11.
[0018]
The storage unit 14 has an impedance waveform data storage unit 14a and a resonance data storage unit 14b. The data of the current I and the voltage V sent from the measurement unit 12 are converted into impedance by the impedance calculation unit 34, and then registered in the impedance waveform data storage unit 14a. The resonance state detection unit 33 detects a resonance frequency from the impedance waveform registered in the impedance waveform data storage unit 14a and inputs the resonance frequency to the resonance data storage unit 14b. At the same time, the impedance at the time of resonance is detected and the value is input to the resonance data storage unit 14b.
[0019]
The second ultrasonic command unit 32 selects a predetermined resonance frequency from a plurality of resonance frequencies registered in the resonance data storage unit 14b and inputs the selected resonance frequency to the ultrasonic control unit 11. Further, an amplification factor that determines the ultrasonic output of the ultrasonic control unit 11 is obtained from the impedance of the resonance data storage unit 14b and a predetermined ultrasonic output from the tool 2, and is output to the ultrasonic control unit 11 as a gain signal. . The first ultrasonic command unit 31, the second ultrasonic command unit 32, the resonance state detecting unit 33, and the impedance calculating unit 34 are software executed by the control unit 13.
[0020]
Next, the operation will be described with reference to FIGS. 4 to 7 show screens of the display unit 15 (FIG. 1), and FIGS. 8 to 10 show flowcharts of the operation. FIG. 4 shows a menu screen of the display unit 15. The menus are "Automatic operation" and "Tool setting". The “automatic operation” is a normal operation operation in which the tool 2 is pressed against the flip chip 4 and the bumps 5 of the flip chip 4 are ultrasonically pressed to the substrate 6. At this time, the changeover switch 27a of the mode setting unit 27 in FIG. 2 is closed, the signal of the phase comparison unit 26 is fed back to the addition unit 28, and the ultrasonic oscillation unit 22 causes the tool 2 to vibrate at a predetermined resonance frequency. And outputs a signal to the multiplier 23. Also, "tool setting" refers to the work of measuring and setting the resonance frequency of a new tool when a tool is replaced due to a change in the type of electronic component such as a flip chip that is the object of ultrasonic crimping. . At this time, the changeover switch 27a is open. The mode switching signal to the mode setting unit 27 is output from the control unit 13. Hereinafter, the tool setting operation will be described.
[0021]
On the menu screen in FIG. 4, when the user clicks and selects “tool setting”, a tool setting screen is displayed (step 1 in FIG. 8). FIG. 5 shows a tool setting screen. In the tool setting screen, the tool name (the planar shape of the protrusion 2a of the tool 2 of the present embodiment is rectangular, and in this example, the length of one side is 1.0 mm, 1.5 mm... The name is displayed), the resonance frequency KHz, the impedance Z at the time of resonance, and the work menu (setting, deletion, measurement, cancellation) are displayed. As the resonance frequency and impedance Z of each tool, existing data stored in the resonance data storage unit 14b (FIG. 3) is displayed.
[0022]
In steps 2a, 2b, and 2c of FIG. 8, one of “setting”, “deletion”, and “measurement” is clicked and selected. Here, when "setting" is selected, the selected resonance frequency is set to the frequency of the frequency setting unit 21 (FIG. 2), and the amplification factor (gain signal) obtained from the impedance is set to the amplifier 23. The display screen of FIG. 5 shows that a tool of 1.5 mm is set. When "delete" is selected, the selected resonance frequency and impedance data are deleted. When "measurement" is selected, a measurement process is executed. "Cancel" is the cancellation of the operation.
[0023]
The present invention relates to the measurement and setting of the resonance frequency and impedance of the tool. Therefore, "measurement" is selected on the display screen of FIG. 5, and the measurement process is executed in the steps of FIGS. That is, in step 3 of FIG. 9, the message screen of FIG. 6 is displayed. On this message screen, the operator is urged to check whether the tool 2 is correctly set in the bonding unit 1. After confirming that the tool is set correctly, the operator presses the confirmation button in FIG. When the confirmation button is pressed in step 4, the process proceeds to the next process.
[0024]
In step 5, the changeover switch 27a of the mode setting unit 27 is opened to switch to the measurement mode. Next, at step 6, the measurement start frequency fs is set. Next, in step 7, the oscillation command signal is turned ON and input to the ultrasonic oscillation unit 22 (FIG. 2). Then, the current I is measured by the measuring unit 12 (FIG. 2) while gradually increasing the frequency to the measurement end frequency fe in steps 8 to 10.
[0025]
When the frequency reaches the measurement end frequency fe, the oscillation command signal (see also FIG. 2) is turned off (step 11), and the changeover switch 27a of the mode setting unit 27 is closed to switch to the automatic tracking mode (step 12). A detection process is performed (step 13), and a measurement screen is displayed (step 14 in FIG. 10). FIG. 7 shows the measurement screen at this time.
[0026]
The measurement screen of FIG. 7 shows the waveform data of the impedance Z when the frequency is gradually increased from fs to fe, and this waveform is registered in the impedance waveform data storage unit 14a (FIG. 3). The frequency when the impedance Z is minimum (min) is the resonance frequency fa of the tool. This resonance frequency fa is detected by the resonance state detector 33 (FIG. 3). Next, in step 15, "save" is clicked, and the unique resonance frequency fa of the tool and the impedance Zmin at this time are saved together with the tool name (registered in the resonance data storage unit 14b) (step 16). Thus, the measurement mode ends, and the screen returns to the tool setting screen of FIG. 5 (step 17).
[0027]
The above-described measurement of the resonance frequency and the impedance of the tool is performed for a new tool every time the tool is replaced. Then, the resonance frequencies and impedances of various tools are registered in the resonance data storage unit 14b. When the tool is to be reused, the second ultrasonic command unit 32 calls the resonance frequency registered under the name of the tool from the resonance data storage unit 14b, and drives the ultrasonic control unit 11 to drive the resonance frequency. A command is output, and the electronic component is ultrasonically crimped to the work while causing the tool to resonate at the resonance frequency.
[0028]
【The invention's effect】
According to the present invention described above is provided with the function of measuring the resonant frequency of the tool to the ultrasonic bonding device for the electronic component, at the time of tool change can be measured resonant frequency of the Easy rapid tool. Also the tools of various kinds, by each of the resonant frequencies continue to register the resonant data storage unit, in the case of reusing the tool, by calling the resonant frequency of the tool, setup well electronic component Ultrasonic crimping to a workpiece can be performed.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an ultrasonic crimping apparatus for electronic components according to an embodiment of the present invention; FIG. 2 is a block diagram of an ultrasonic control unit of the ultrasonic crimping apparatus for electronic components according to an embodiment of the present invention; FIG. 3 is a functional block diagram of an ultrasonic crimping apparatus for electronic components according to one embodiment of the present invention; FIG. 4 is a screen view of a monitor of the ultrasonic crimping apparatus for electronic components according to one embodiment of the present invention; FIG. 6 is a screen view of a monitor of an ultrasonic crimping apparatus for electronic components according to one embodiment of the present invention. FIG. 6 is a screen view of a monitor of an ultrasonic crimping apparatus for electronic parts according to one embodiment of the present invention. FIG. 8 is a screen view of a monitor of an ultrasonic bonding apparatus for electronic components according to an embodiment of the present invention. FIG. 8 is a flowchart of an operation of the ultrasonic bonding apparatus for electronic parts according to an embodiment of the present invention. Of the operation of the ultrasonic crimping apparatus for electronic components according to the embodiment [FIG. 10] Flowchart EXPLANATION OF REFERENCE NUMERALS electronic components one embodiment of the operation of the ultrasonic bonding device
DESCRIPTION OF SYMBOLS 1 Bonding tool 2 Tool 3 Transducer 4 Flip chip 6 Substrate 11 Ultrasonic control unit 12 Measurement unit 13 Control unit 14 Storage unit 14a Impedance waveform data storage unit 14b Resonance data storage unit 21 Frequency setting unit 22 Ultrasonic oscillation unit 26 Phase comparison Unit 27 mode setting unit 31 first ultrasonic command unit 32 second ultrasonic command unit 33 resonance state detecting unit

Claims (2)

An ultrasonic crimping apparatus for an electronic component for pressing an exchangeable tool against an electronic component and pressing the electronic component against a workpiece while ultrasonically vibrating the tool, comprising: a vibrator that ultrasonically vibrates the tool; an ultrasonic controller for controlling the driving of the vibrator based on the drive command including the frequency to vibrate, a first ultrasound command section for outputting a drive command to change the pre distichum wavenumber in the ultrasonic control unit , the resonance frequency of the first and the measuring unit for measuring the current and voltage flowing in the vibrator while changing the pre distichum wavenumber by a command of the ultrasonic command section, the tool from the measurement data measured by the measuring section a resonance state detection unit for detecting the number, and the resonance data storage unit for registering the number of resonance frequency detected by the resonant state detecting unit, for use from the resonant frequency registered in the resonant data storage unit A second ultrasonic wave command section for outputting a drive command to the ultrasonic control unit calls the resonant frequency Lumpur, the resonance frequency tracking means for resonating said tool by correcting the frequency, the first The vibration mode is driven based on the drive command from the ultrasonic command section to detect and register the resonance frequency of the tool, and the resonance mode included in the drive command from the second ultrasonic command section is set to the resonance mode. A mode setting unit that can set any one of an automatic tracking mode in which the vibrator is driven by correcting the frequency by a frequency tracking unit . A drive command from an ultrasonic command unit with the resonance frequency automatic tracking function of turning off the resonance frequency of the tool by correcting the frequency output to the tool to the vibrator that vibrates the tool exchangeably mounted on the bonding unit is turned off. output to was measured by the measuring unit current and voltage flowing in the vibrator while changing the oscillation frequency of the tools, the resonant frequency of the tool from the measured measurement data detected at resonance detector resonance of the tool performs a registration operation for registering the frequency to the resonant data storage unit, when pressed against the workpiece the electronic components, by calling the resonant frequency of the tool to be used from the resonant data storage unit, the resonant frequency automatic tracking function An ultrasonic crimping method for an electronic component, wherein the vibrator is driven by correcting the resonance frequency in a state of being turned on .

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