JP3575656B2 - Mounting bracket for hybrid IC - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mounting bracket for mounting a hybrid IC having a base for absorbing heat to a substrate.
[0002]
[Prior art]
Conventionally, a hybrid IC (hereinafter abbreviated as HIC) 104 having a block-shaped heat sink 106 is fixed to the housing 100 in the configuration shown in FIG. 6, for example, and is electrically connected to the substrate 101. . In this configuration, the heat sink 106 is disposed in the opening 107 provided in the substrate 101, and is fixed to the housing 100 by screwing the screws 105. Although not shown, the substrate 101 is fixed to the housing 100. The HIC 104 is electrically connected to the substrate 101 by a lead terminal 102, and the heat sink 106 is electrically connected to an earth line (not shown) of the substrate 101 by an earth connection line 103.
In this technique, when removing the substrate 101 from the housing 100 for maintenance or repair, it is necessary to loosen the screw 105 and also remove the heat sink 106 from the housing 100.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional technique, when the substrate 101 is removed from the housing 100, the HIC 104 is fixed to the substrate 101 only by the lead terminals 102. Therefore, when an external load acts on the HIC 104, stress is applied to the lead terminals 102. There is a problem that the electrical connection is concentrated in the HIC 104 and the electrical connection in the HIC 104 is disconnected.
Further, since the grounding of the HIC 104 is performed by the long and thin ground connection line 103, the HIC 104 has inductance and conductance components, and since it is grounded at one point, the high-frequency transmission characteristics deteriorate and the characteristics become unstable. There is also.
[0004]
Therefore, in view of the above problems, an object of the present invention is to stably fix a substrate and an HIC, reduce stress concentration on a lead terminal when an external load is applied, and prevent disconnection of an electrical connection portion in the HIC. It is to be. Another object is to prevent high-frequency transmission characteristics from deteriorating.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the means described in claim 1 can be adopted. According to this means, the mounting bracket formed in a frame shape is arranged and fixed along the side wall of the opening provided in the substrate. The HIC has a base for absorbing heat, and the peripheral surface of the base and the mounting bracket are slidably in contact with each other, and the peripheral surface of the base is elastically urged by the mounting bracket.
As a result, the HIC is satisfactorily held against the substrate by being elastically urged by the mounting bracket, so that even when an external load acts on the HIC when the substrate is removed from the housing for maintenance or repair, the lead is not affected. Stress concentration on the terminal can be reduced, and disconnection of the electrical connection portion in the HIC can be prevented.
[0006]
According to the second aspect of the present invention, the mounting bracket has a claw portion formed by projecting a part of the side surface portion in a tapered shape inward, so that the claw portion can be used with respect to the peripheral surface of the base. Good elastic bias can be achieved.
[0007]
According to the third aspect of the present invention, the mounting bracket has a grounding portion projecting from an outer surface thereof, and the grounding portion is directly grounded to the substrate, thereby performing grounding at a shorter distance. And good and stable high-frequency transmission characteristics can be obtained.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described based on specific examples.
FIG. 1 is a perspective view showing a configuration of a mounting bracket 8 according to a specific embodiment of the present invention. The mounting bracket 8 has a substantially frame shape including side portions 8a, 8b, 8c, and 8d, and the front side portion 8c is opened at a substantially central portion where lead terminals 52 of the HIC 5 described later are provided. As a result, although not shown, the mounting member 8 is elastically deformed in a bow shape so as to widen the opening width of the side surface portion 8c in an initial state where no load is applied.
Each of the side surfaces 8a to 8d is provided with a claw portion 84 which protrudes inward from the upper side to the lower side in a tapered shape. On both sides of the upper end portion 80a of the side surface portion 8a, fixed portions 82 are formed by being bent outward at right angles from the side surface portion 8a. In FIG. 1, the fixing portions 82 are provided corresponding to the positions of the claw portions 84. However, the fixing portions 82 may be provided at arbitrary positions, and may be provided in a required number. Each fixing portion 82 is provided with a fixing hole 81 for fixing to the substrate 4. Further, on both sides of the upper end 80c of the side surface portion 8c, ground portions 83 are formed by being bent outward at right angles from the side surface portion 8c.
[0009]
FIG. 2 is a perspective view showing the configuration of the HIC 5. The HIC 5 for amplifying a high-frequency signal has a main body 51 in which a circuit unit is incorporated, a block-shaped heat sink 53 serving as a base for absorbing heat generated by the HIC 5 and a plurality of lead terminals 52 joined thereto. I have. The heat sink 53 is provided with a pair of holes 54 in the up-down direction and a pair of screw holes 55 in the front-rear direction, and is used for fixing to another member (for example, a case or the like).
FIG. 3 is a perspective view showing the configuration of the substrate 4. The substrate 4 has an opening 41 corresponding to the shape of the mounting bracket 8, a hole 43 corresponding to each lead terminal 52, and a hole 42 corresponding to each fixing hole 81. A ground pattern 40 is formed on the surface 4a of the substrate 4.
[0010]
Next, the mounting of the mounting bracket 8 and the HIC 5 described above to the substrate 4 will be described below with reference to FIGS.
First, along the side wall 410 of the opening 41 of the substrate 4, the side face 8 c is substantially parallel to the side face 8 a from the upper side to the lower side of the opening 41, and the mounting bracket 8 is moved to the lower end side (the fixing part 82 and the ground From the side where the part 83 is not formed). FIG. 4 is a perspective view showing this state. At this time, since the elastic force is urged from the side surface portion 8c to the side wall 410, the mounting bracket 8 is favorably supported. In addition, the fixing portion 82 and the grounding portion 83 abut on the surface 4 a of the substrate 4, so that the mounting bracket 8 is positioned in the storage direction and the fixing hole 81 of the mounting bracket 8 and the hole 42 of the substrate 4 are aligned. Aligned. In the present embodiment, the mounting bracket 8 is fixed to the substrate 4 with rivets inserted through the fixing holes 81 and the holes 42. The ground portion 83 is electrically connected to the ground pattern 40 by soldering. Since the ground pattern 40 is also formed around the hole 42, the mounting bracket 8 is also electrically connected to the ground pattern 40 by the fixing portion 82.
[0011]
After the mounting bracket 8 is mounted on the substrate 4 in this manner, while the lead terminals 52 of the main body 51 are inserted into the holes 43 of the substrate 4, the peripheral surface 530 of the heat sink 53 is brought into sliding contact with the mounting bracket 8. To store. FIG. 5 is a perspective view showing a state where the HIC 5 is attached. At this time, the peripheral surface 530 of the heat sink 53 is elastically urged from the respective side surfaces by the claw portions 84. Further, the heat sink 53 and the mounting bracket 8 have good electrical contact with the claws 83. Each lead terminal 52 inserted into each hole 43 is electrically connected to a wiring pattern (not shown) formed on the back surface of the substrate 4 by soldering. Thus, the HIC 5 is attached to the substrate 4.
[0012]
By mounting the HIC 5 to the substrate 4 using the mounting bracket 8 described above, the heat sink 53 is elastically urged from each side surface by the claw portions 84, so that the HIC 5 can be stably held on the substrate 4. As a result, even when an external load is applied to the HIC 5 when the HIC 5 is mounted on the substrate 4 before shipment or when the substrate 4 incorporated in the case is removed, the stress acting on each lead terminal 52 is reduced, and the HIC 5 Disconnection of the root electrical connection of each lead terminal 52 in the main body 51 can be effectively prevented. Further, since the grounding portion 83 and the fixing portion 82 of the mounting bracket 8 are directly grounded to the substrate 4, grounding can be performed at a shorter distance and at a number of locations. As a result, stray inductance, capacitance and resistance can be reduced, so that good and stable high-frequency transmission characteristics can be obtained.
[0013]
In the above-described embodiment, a part of each of the side surfaces 8a to 8d of the mounting bracket 8 is configured to protrude inward to provide the claw portion 84. However, a leaf spring separate from the mounting bracket 8 is provided on the inner side surface. The heat sink 53 may be elastically biased by a leaf spring.
In the above-described embodiment, the side wall 8c of the mounting bracket 8 is opened to elastically urge the side wall 410 and to secure a space between the lead terminal 52 and the mounting bracket 8. When the space between the lead terminal 52 and the mounting bracket 8 can be sufficiently ensured, the side surface portion 8c does not necessarily have to be open. Further, in a configuration in which the heat sink 53 is screwed and fixed to another fixing member by the screw hole 55, a hole may be formed in the side surfaces 8a and 8c so that a screw can be inserted so that the screw can be tightened.
Further, in the above-described embodiment, the claw portions 84 are provided on the side surfaces 8a to 8d, but the positions may be arbitrary as long as the heat sink 53 can be sufficiently held.
Further, instead of the claw portion 84, the peripheral surface 530 of the heat sink 53 may be held in contact with the metal elasticity of the metal fitting 8 in the form of a tape-shaped frame.
In the above-described embodiment, the mounting bracket 8 is fixed to the substrate 4 using rivets. However, the mounting bracket 8 may be fixed using bolts and nuts or screws.
[0014]
Further, by providing the grounding portions 83 in place of the fixing portions 82, the grounding portions 83 are provided at the four corners of the mounting bracket 8, and they are soldered to the grounding pattern 40 to perform the electrical connection and the fixing of the mounting bracket 8. Is also good.
Alternatively, the side surface 8a of the mounting member 8 or the upper end portion 80a thereof may be directly fixed to the substrate 4 by soldering.
Further, the fixing may be performed by an engaging force between the opening 41 and the mounting bracket 8. For example, a protruding projection is provided on the outer peripheral surface of the mounting bracket 8, and the protruding portion and the opening 41 are fitted to each other, or the outer peripheral surface of the mounting bracket 8 is outwardly directed upward and downward. The opening 41 and the mounting bracket 8 may be fixed by, for example, elastically urging the edge of the opening 41 with the formed claw. When a claw is formed on the outside of the mounting bracket 8 from the bottom to the top, a notch may be provided at a portion of the substrate 4 that engages with the claw.
In short, it is only necessary that the mounting bracket 8 can be fixed to the substrate 4 with a holding force stronger than the holding force of the heat sink 53 by the claw portion 84.
In the above embodiment, the fixing portion 82 and the grounding portion 83 of the mounting bracket 8 are electrically connected to the grounding pattern 40. However, the fixing portion 82 may be non-grounded.
Further, in the above-described embodiment, the procedure for attaching the heat sink 53 after attaching the mounting bracket 8 to the substrate 4 has been described. However, the procedure for attaching the mounting bracket 8 and the heat sink 53 to the substrate 4 may be adopted.
[0015]
As described above, according to the present invention, the HIC is satisfactorily held by the elastic fitting against the peripheral surface of the heat sink by the mounting bracket formed in a frame shape, and the HIC is removed by the action of an external load. Stress concentration on the lead terminal can be reduced, and disconnection of the electrical connection portion in the HIC can be prevented. Also, by directly electrically connecting the grounding portion provided on the outer surface of the mounting bracket to the grounding pattern of the substrate, grounding can be performed at a shorter distance and at a number of locations, thereby reducing stray inductance, capacitance and resistance, and Thus, stable high-frequency transmission characteristics can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a mounting bracket according to a specific embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration of an HIC according to a specific embodiment of the present invention.
FIG. 3 is a perspective view showing a configuration of a substrate according to a specific embodiment of the present invention.
FIG. 4 is a perspective view showing a state where a mounting bracket is mounted on a substrate in a specific embodiment of the present invention.
FIG. 5 is a perspective view showing a state where a mounting bracket and a HIC are mounted on a substrate in a specific embodiment of the present invention.
FIG. 6 is an explanatory view showing mounting of a HIC by a conventional mounting bracket.
[Explanation of symbols]
4 Substrate 5 HIC
8 Mounting bracket 41 Opening 42 Fixing hole 43 Terminal mounting hole 52 Lead terminal 53 Heat sink 82 Fixing part 83 Grounding part 84 Claw part

Claims (3)

A mounting bracket for housing and fixing a hybrid IC having a base for heat absorption in an opening provided in a substrate,
A frame is provided along the side wall of the opening and fixed to the substrate, slidably contacts the peripheral surface of the base, and elastically biases the peripheral surface of the base. A mounting bracket for a hybrid IC, wherein the mounting bracket is formed. 2. The mounting bracket for a hybrid IC according to claim 1, wherein the mounting bracket has a claw formed by projecting a part of a side surface inwardly in a tapered shape. The mounting bracket according to claim 1, wherein the mounting bracket has a grounding portion formed to protrude from an outer surface thereof and directly grounded to the substrate.

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