JP3578476B2 - Printed circuit laminate - Google Patents
Printed circuit laminate Download PDFInfo
- Publication number
- JP3578476B2 JP3578476B2 JP30207993A JP30207993A JP3578476B2 JP 3578476 B2 JP3578476 B2 JP 3578476B2 JP 30207993 A JP30207993 A JP 30207993A JP 30207993 A JP30207993 A JP 30207993A JP 3578476 B2 JP3578476 B2 JP 3578476B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- inorganic filler
- printed circuit
- mohs hardness
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003822 epoxy resin Substances 0.000 claims description 40
- 229920000647 polyepoxide Polymers 0.000 claims description 40
- 239000011256 inorganic filler Substances 0.000 claims description 37
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 37
- 239000011521 glass Substances 0.000 claims description 21
- 239000002966 varnish Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 13
- 239000004745 nonwoven fabric Substances 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 6
- 239000002759 woven fabric Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 description 9
- 239000011190 CEM-3 Substances 0.000 description 6
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 229910001679 gibbsite Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- 229910052919 magnesium silicate Inorganic materials 0.000 description 2
- 235000019792 magnesium silicate Nutrition 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- -1 barbegulite Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052599 brucite Inorganic materials 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【０００１】
【産業上の利用分野】
本発明は、ドリル加工性、打抜加工性に優れた印刷回路用積層板に関するものである。
【０００２】
【従来の技術】
印刷回路用の銅張積層板は、その印刷回路板への加工工程中におけるコストの削減の目的のため、従来の銅メッキによるスルーホールの形成に代わって、銀ペーストによるスルーホールの形成が導入され、フェノール樹脂積層板においては十数年前より実施されているが、回路の精密化のため、そして積層板の臭気の問題からエポキシ樹脂コンポジット基材銅張積層板（以下、ＣＥＭ−３という）においても使用され始めている。しかしながら、フェノール樹脂銅張積層板（以下、ＰＬＣという）ではドリル穴開けにおけるドリルライフが１００００ショット程度であるのに対して、従来のＣＥＭ−３では、２０００ショット程度しかなく、また、打抜加工性が劣り端面の欠けや穴周りの白化現象などが発生するという不具合があった。
【０００３】
一方、ＣＥＭ−３はＰＬＣで発生する臭気がないこと、大型部品を搭載可能なこと、電気絶縁信頼性がＰＬＣに比べて大幅に優れていること、更に印刷回路板の小型化に対応できることから注目をあびているが、上記のような問題のため大幅に実用化されるに至っていない。
【０００４】
ところで、一般にＣＥＭ−３は、中間層にはガラス不織布が基材として用いられ、含有する無機フィラーは水酸化アルミニウム（モース硬度３）であり、ドリル穴開け時のドリル磨耗が大きいためドリルライフが短い欠点がある。また、従来のＣＥＭ−３は銅スルホール用に厚み方向の線膨張率を抑えるために、フィラーの含有率を大きくしていることより、積層板が剛直となり打抜性が悪くなる傾向にあった。
【０００５】
【発明が解決しようとする課題】
本発明は、上記のような問題点を解決するために種々検討の結果なされたもので、ドリル加工性及び打抜加工性が良好であり、加工コストが低減できる印刷回路用積層板を提供することにある。
【０００６】
【課題を解決するための手段】
本発明は、エポキシ樹脂ワニスを含浸したガラス織布を表面層とし、エポキシ樹脂と無機フィラーを含有したワニスを含浸したガラス不織布を中間層とし、これらを加熱加圧成形してなる印刷回路用積層板であって、中間層におけるエポキシ樹脂の固形分と無機フィラーとの体積比率が、エポキシ樹脂／無機フィラー＝０．７〜１．２５であり、かつ、無機フィラーがモース硬度２〜３のものとモース硬度１〜１．５のものとの混合物であり、その重量比率が（前者）／（後者）＝１．５〜３．８であることを特徴とする印刷回路用積層板に関するものである。
【０００７】
本発明において、表面ガラス織布層において、用いるエポキシ樹脂は臭素化エポキシ樹脂、非臭素化エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂いずれであってもよく、それらの混合であってもよいが、好ましくは、ビスフェノールＡ型エポキシ樹脂及びノボラック型エポキシ樹脂を主成分とするエポキシ樹脂である。
【０００８】
中間層は表面層と同様のエポキシ樹脂に無機質フィラーが含有されているエポキシ樹脂ワニスを含浸したガラス不織布からなり、その無機質フィラーを含有したエポキシ樹脂は、エポキシ樹脂／無機フィラーの体積比率が０．７〜１．２５、好ましくは、０．９５〜１．２である。無機フィラーの体積は重量をタップ密度により換算した値である。また、モース硬度が２〜３の比較的硬いフィラーとモース硬度が１〜１．５である軟質のフィラーを併用し、その重量比は１．５〜３．８であり、より好ましくは１．８〜３．０である。
【０００９】
エポキシ樹脂／無機フィラーの体積比率が０．７未満では打抜加工性が低下し、１．２５を超えると積層板におけるエポキシ樹脂の比率が増大し材料のコストが大きくなり、トータルの印刷回路板の加工コストが増大することとなる。次に、モース硬度が２〜３の無機フィラーとモース硬度が１〜１．５の無機フィラーとの重量比を１．５未満とすると打抜加工時端面の白化の幅が大きくなり、３．８を超えるとドリル磨耗に対する効果が小さくなる。
【００１０】
モース硬度１〜１．５の無機フィラーとしては、カオリンクレー、タルク、パイロフイライト、バーベギュライト、グラファイトなどがあり、モース硬度２〜３の無機フィラーとしては、石膏、水酸化アルミニウム、マイカ、クロライト、ブルーサイトなどがある。
【００１１】
【作用】
本発明の印刷回路用積層板は、無機フィラーの適切な体積含有割合と軟質のフィラーを適当量併用することによって、印刷回路板への加工工程中のコストを低減することが可能となる。より具体的には、ドリル磨耗率を大幅に減少させることによって、ドリルライフを２０００ショット程度から４０００ショット程度に長くすることが可能となった。また、打抜加工性においても従来のＣＥＭ−３より向上する。
【００１２】
【実施例】
以下に本発明の実施例および比較例（従来例）を示す。「部」は「重量部」を表す。
【００１３】
《実施例１》
表面層及び中間層のエポキシ樹脂ワニスの組成は次の通りである。
（１）臭素化エポキシ樹脂（油化シェル製 Ｅｐ−１０４６） ８０部
（２）ノボラック型エポキシ樹脂（油化シェル製 Ｅｐ−１５２） ２０部
エポキシ樹脂の比重による体積換算：７４
（３）ジシアンジアミド ４部
（４）２エチル４メチルイミダゾール ０．１５部
（５）メチルセロソルブ ３６部
（６）アセトン ６０部
前記材料を混合して均一なエポキシ樹脂ワニスを調製した。
【００１４】
このエポキシ樹脂ワニスをガラス織布（日東紡 ＷＥ−１８ＫＲＢ−８４）に樹脂含有量が３５〜５０％になるように含浸乾燥してガラス織布プリプレグ（Ａ）を得た。
続いて、上記のエポキシ樹脂ワニスに樹脂分１００部対し次の配合の無機フィラーを添加し、撹拌混合して無機フィラー含有ワニスを調製した。
（１）ギブサイト型水酸化アルミニウム（モース硬度３） ５０部
（昭和電工製 ハイジライト Ｈ−１４１）
（２）カオリンクレー（モース硬度１） ２０部
タップ密度による体積換算：６６．７
無機フィラー重量比率 （１）／（２）＝２．５
エポキシ樹脂／無機フィラー体積比率 ７４／６６．７＝１．１１
【００１５】
この無機フィラー含有ワニスをガラス不織布（日本バイリーン製 ＥＰ−４０７５）にエポキシ樹脂及び無機フィラーの含有量が９０％になるように含浸乾燥して、ガラス不織布プリプレグ（Ｂ）を得た。
次に、前記ガラス不織布プリプレグ（Ｂ）を３枚重ねて中間層とし、上下表面層に前記ガラス織布プリプレグ（Ａ）を各１枚配置し、更にその両面に厚さ１８μｍの銅箔を配置し、成形温度１６５℃、圧力６０ｋｇ／ｃｍ２ で９０分間積層成形して厚さ１．６ｍｍの銅張積層板を得た。
【００１６】
《実施例２》
表面層プリプレグは実施例１と同様に作製した。中間層用無機フィラー含有エポキシ樹脂ワニスは前記エポキシ樹脂ワニスに樹脂分１００部に対し次の配合の無機フィラーを添加し、撹拌混合して調製した。
（１）ギブサイト型水酸化アルミニウム（モース硬度３） ３０部
（昭和電工製 ハイジライト Ｈ−１４１）
（２）含水ケイ酸マグネシウム（モース硬度１） １５部
タップ密度による体積換算：７５．５
無機フィラー重量比率 （１）／（２）＝２．０
エポキシ樹脂／無機フィラー体積比率 ７４／７５．５＝０．９８
【００１７】
この無機フィラー含有エポキシ樹脂ワニスをガラス不織布（日本バイリーン製ＥＰ−４０７５）にエポキシ樹脂及び無機フィラーの含有量が ７５〜８５％になるように含浸乾燥して、ガラス不織布プリプレグ（Ｂ’）を得た。
次に、前記ガラス不織布プリプレグ（Ｂ’）を３枚重ねて中間層とし、上下表面層に前記ガラス織布プリプレグ（Ａ）を各１枚配置し、更にその両面に厚さ１８μｍの銅箔を配置し、成形温度１６５℃、圧力６０ｋｇ／ｃｍ２ で９０分間積層成形して厚さ１．６ｍｍの銅張積層板を得た。
【００１８】
《比較例１》
表面層プリプレグは実施例１と同様に作製した。中間層用無機フィラー含有エポキシ樹脂ワニスは前記エポキシ樹脂ワニスに樹脂分１００部に対し次の配合の無機フィラーを添加し、撹拌混合して調製した。
（１）ギブサイト型水酸化アルミニウム（モース硬度３） ８０部
（昭和電工製 ハイジライト Ｈ−１４１）
（２）含水ケイ酸マグネシウム（モース硬度１） ２０部
タップ密度による体積換算：１３５．６
無機フィラー重量比率 （１）／（２）＝４．０
エポキシ樹脂／無機フィラー体積比率 ７４／１３５．６＝０．５５
【００１９】
この無機フィラー含有エポキシ樹脂ワニスをガラス不織布（日本バイリーン製ＥＰ−４０７５）にエポキシ樹脂及び無機フィラーの含有量が ７５〜８５％になるように含浸乾燥して、ガラス不織布プリプレグ（Ｂ”）を得た。
次に、前記ガラス不織布プリプレグ（Ｂ”）を３枚重ねて中間層とし、上下表面層に前記ガラス織布プリプレグ（Ａ）を各１枚配置し、更にその両面に厚さ１８μｍの銅箔を配置し、成形温度１６５℃、圧力６０ｋｇ／ｃｍ２ で９０分間積層成形して厚さ１．６ｍｍの銅張積層板を得た。
【００２０】
得られたそれぞれの銅張積層板について、ドリル摩耗性、曲げ強さ及び打抜加工性を測定した。その結果を表１に示す。
【表１】
【発明の効果】
前記結果からも明らかなように、本発明の印刷回路用積層板は、印刷回路板への加工時において、ドリル磨耗が改善され、且つ打抜加工性が改善される。[0001]
[Industrial applications]
The present invention relates to a printed circuit board having excellent drilling and punching properties.
[0002]
[Prior art]
For copper-clad laminates for printed circuits, through-holes made of silver paste have been introduced in place of conventional copper-plated through-holes in order to reduce costs during the process of processing the printed circuit boards. It has been practiced in phenolic resin laminates for more than a decade, but due to the precision of the circuit and the problem of odor of the laminates, epoxy resin composite substrate copper-clad laminates (hereinafter referred to as CEM-3). ) Has begun to be used. However, a phenolic resin-clad laminate (hereinafter referred to as PLC) has a drill life of about 10,000 shots in drilling a hole, whereas the conventional CEM-3 has only about 2,000 shots and a punching process. There was a problem that the properties were poor and chipping of the end face and whitening around the hole occurred.
[0003]
On the other hand, CEM-3 has no odor generated in PLC, can mount large components, has much better electrical insulation reliability than PLC, and can cope with miniaturization of printed circuit boards. Although it is receiving attention, it has not been put into practical use because of the above-mentioned problems.
[0004]
By the way, CEM-3 generally uses a glass non-woven fabric as a base material for an intermediate layer, contains aluminum hydroxide (Mohs hardness of 3) as an inorganic filler, and has a large drill wear when drilling holes. There are shortcomings. In addition, in the conventional CEM-3, since the content of the filler was increased in order to suppress the coefficient of linear expansion in the thickness direction for copper through-holes, the laminate was rigid and the punching properties tended to be poor. .
[0005]
[Problems to be solved by the invention]
The present invention has been made as a result of various studies in order to solve the above-described problems, and provides a laminated board for a printed circuit which has good drilling and punching properties and can reduce the processing cost. It is in.
[0006]
[Means for Solving the Problems]
The present invention provides a printed circuit laminate obtained by forming a glass woven fabric impregnated with an epoxy resin varnish as a surface layer, a glass nonwoven fabric impregnated with a varnish containing an epoxy resin and an inorganic filler as an intermediate layer, and heat-press molding these. A plate wherein the volume ratio between the solid content of the epoxy resin and the inorganic filler in the intermediate layer is epoxy resin / inorganic filler = 0.7 to 1.25, and the inorganic filler has a Mohs hardness of 2 to 3. And a Mohs hardness of 1 to 1.5, wherein the weight ratio is (former) / (latter) = 1.5 to 3.8. is there.
[0007]
In the present invention, the epoxy resin used in the surface glass woven fabric layer may be any of a brominated epoxy resin, a non-brominated epoxy resin, and a bisphenol A type epoxy resin, and may be a mixture thereof. , A bisphenol A type epoxy resin and a novolak type epoxy resin.
[0008]
The intermediate layer is made of a glass nonwoven fabric impregnated with an epoxy resin varnish in which the same epoxy resin as the surface layer contains an inorganic filler, and the epoxy resin containing the inorganic filler has a volume ratio of epoxy resin / inorganic filler of 0. 7 to 1.25, preferably 0.95 to 1.2. The volume of the inorganic filler is a value obtained by converting the weight by the tap density. Further, a relatively hard filler having a Mohs hardness of 2 to 3 and a soft filler having a Mohs hardness of 1 to 1.5 are used in combination, and the weight ratio is 1.5 to 3.8, more preferably 1. 8 to 3.0.
[0009]
If the volume ratio of epoxy resin / inorganic filler is less than 0.7, the punching processability is reduced , and if it exceeds 1.25 , the ratio of epoxy resin in the laminate increases and the cost of materials increases, resulting in a total printed circuit board. Will increase the processing cost. Next, when the weight ratio between the inorganic filler having a Mohs 'hardness of 2 to 3 and the inorganic filler having a Mohs' hardness of 1 to 1.5 is less than 1.5, the width of whitening of the end face at the time of punching becomes large . If it exceeds 8, the effect on drill wear is reduced.
[0010]
Examples of the inorganic filler having a Mohs hardness of 1 to 1.5 include kaolin clay, talc, pyrophyllite, barbegulite, and graphite. Examples of the inorganic filler having a Mohs hardness of 2 to 3 include gypsum, aluminum hydroxide, mica, Chlorite, Brucite, etc.
[0011]
[Action]
The laminated board for printed circuits of the present invention can reduce the cost during the process of processing into a printed circuit board by using an appropriate volume content ratio of an inorganic filler and an appropriate amount of a soft filler. More specifically, the drill life can be lengthened from about 2000 shots to about 4000 shots by drastically reducing the drill wear rate. Also, the punching workability is improved as compared with the conventional CEM-3.
[0012]
【Example】
Examples of the present invention and comparative examples (conventional examples) are shown below. “Parts” represents “parts by weight”.
[0013]
<< Example 1 >>
The composition of the epoxy resin varnish of the surface layer and the intermediate layer is as follows.
(1) 80 parts of brominated epoxy resin (Ep-1046 made by Yuka Shell) (2) 20 parts novolak type epoxy resin (Ep-152 made of Yuka Shell) Volume conversion by specific gravity of epoxy resin: 74
(3) Dicyandiamide 4 parts (4) 2-ethyl 4-methylimidazole 0.15 part (5) Methyl cellosolve 36 parts (6) Acetone 60 parts The above materials were mixed to prepare a uniform epoxy resin varnish.
[0014]
This epoxy resin varnish was impregnated and dried in a glass woven fabric (Nittobo WE-18KRB-84) so that the resin content was 35 to 50%, to obtain a glass woven fabric prepreg (A).
Subsequently, an inorganic filler having the following composition was added to the above epoxy resin varnish based on 100 parts of the resin component, followed by stirring and mixing to prepare an inorganic filler-containing varnish.
(1) Gibbsite type aluminum hydroxide (Mohs hardness 3) 50 parts (Heidilite H-141 manufactured by Showa Denko)
(2) Kaolin clay (Mohs hardness 1) 20 parts Volume conversion by tap density: 66.7
Inorganic filler weight ratio (1) / (2) = 2.5
Epoxy resin / inorganic filler volume ratio 74 / 66.7 = 1.11
[0015]
This inorganic filler-containing varnish was impregnated and dried in a glass nonwoven fabric (EP-4075 manufactured by Japan Vilene) so that the contents of the epoxy resin and the inorganic filler became 90%, to obtain a glass nonwoven fabric prepreg (B).
Next, three glass non-woven fabric prepregs (B) are stacked to form an intermediate layer, one glass woven prepreg (A) is disposed on each of the upper and lower surface layers, and copper foil having a thickness of 18 μm is disposed on both surfaces thereof. Then, the laminate was molded at a molding temperature of 165 ° C. under a pressure of 60 kg / cm 2 for 90 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.
[0016]
<< Example 2 >>
The surface layer prepreg was produced in the same manner as in Example 1. The inorganic filler-containing epoxy resin varnish for the intermediate layer was prepared by adding an inorganic filler having the following composition to the epoxy resin varnish with respect to 100 parts of the resin, followed by stirring and mixing.
(1) Gibbsite type aluminum hydroxide (Mohs hardness 3) 30 parts (Showa Denko Hijilite H-141)
(2) Hydrous magnesium silicate (Mohs hardness 1) 15 parts Volume conversion by tap density: 75.5
Inorganic filler weight ratio (1) / (2) = 2.0
Epoxy resin / inorganic filler volume ratio 74 / 75.5 = 0.98
[0017]
This inorganic filler-containing epoxy resin varnish is impregnated and dried in a glass non-woven fabric (EP-4075 manufactured by Japan Vilene) so that the contents of the epoxy resin and the inorganic filler become 75 to 85% to obtain a glass non-woven prepreg (B '). Was.
Next, the three glass nonwoven fabric prepregs (B ') are stacked to form an intermediate layer, and one glass woven prepreg (A) is disposed on each of the upper and lower surface layers, and a copper foil having a thickness of 18 μm is further provided on both surfaces thereof. They were placed and laminated and molded at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to obtain a 1.6 mm-thick copper-clad laminate.
[0018]
<< Comparative Example 1 >>
The surface layer prepreg was produced in the same manner as in Example 1. The inorganic filler-containing epoxy resin varnish for the intermediate layer was prepared by adding an inorganic filler having the following composition to the epoxy resin varnish with respect to 100 parts of the resin, followed by stirring and mixing.
(1) Gibbsite type aluminum hydroxide (Mohs hardness 3) 80 parts (Heidilite H-141 manufactured by Showa Denko)
(2) Hydrous magnesium silicate (Mohs hardness 1) 20 parts Volume conversion by tap density: 135.6
Inorganic filler weight ratio (1) / (2) = 4.0
Epoxy resin / inorganic filler volume ratio 74 / 135.6 = 0.55
[0019]
This inorganic filler-containing epoxy resin varnish is impregnated and dried in a glass nonwoven fabric (EP-4075 manufactured by Japan Vilene) so that the content of the epoxy resin and the inorganic filler is 75 to 85%, to obtain a glass nonwoven prepreg (B ″). Was.
Next, the three glass nonwoven fabric prepregs (B ″) are stacked to form an intermediate layer, and one glass woven prepreg (A) is disposed on each of the upper and lower surface layers, and a copper foil having a thickness of 18 μm is further provided on both surfaces thereof. They were placed and laminated and molded at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to obtain a 1.6 mm-thick copper-clad laminate.
[0020]
For each of the obtained copper-clad laminates, the drill wear property, bending strength, and punching workability were measured. Table 1 shows the results.
[Table 1]
【The invention's effect】
As is clear from the above results, the printed circuit board of the present invention has improved drill abrasion and improved punching workability when processed into a printed circuit board.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30207993A JP3578476B2 (en) | 1993-12-01 | 1993-12-01 | Printed circuit laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30207993A JP3578476B2 (en) | 1993-12-01 | 1993-12-01 | Printed circuit laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07162112A JPH07162112A (en) | 1995-06-23 |
| JP3578476B2 true JP3578476B2 (en) | 2004-10-20 |
Family
ID=17904673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30207993A Expired - Fee Related JP3578476B2 (en) | 1993-12-01 | 1993-12-01 | Printed circuit laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3578476B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4784011B2 (en) * | 2001-07-25 | 2011-09-28 | 住友ベークライト株式会社 | Laminate production method |
| JP5598190B2 (en) * | 2010-09-09 | 2014-10-01 | 住友ベークライト株式会社 | Thermosetting resin composition for circuit board |
-
1993
- 1993-12-01 JP JP30207993A patent/JP3578476B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07162112A (en) | 1995-06-23 |
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