JP3580207B2 - Display device - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a display device such as a liquid crystal display device.
[0002]
[Prior art]
FIG. 5 is a plan view showing an example of a conventional liquid crystal display device. This liquid crystal display device includes an active matrix type liquid crystal display panel 1. The liquid crystal display panel 1 is composed of a lower glass substrate 2 and an upper glass substrate 3 bonded together via a sealing material (not shown), and a liquid crystal (not shown) sealed therebetween. In this case, the lower side and the right side of the lower glass substrate 2 project from the upper glass substrate 3.
[0003]
The semiconductor chip 4 is provided with an anisotropic conductive adhesive in a semiconductor chip mounting area 21 (see FIG. 6A) provided in series at predetermined four places on the upper surface of the lower projecting portion 2a of the lower glass substrate 2. (Not shown). A semiconductor chip 5 is mounted via an anisotropic conductive adhesive (not shown) in a semiconductor chip mounting area provided at a predetermined location on the upper surface of the right protrusion 2b of the lower glass substrate 2. The semiconductor chips 4 and 5 are composed of a liquid crystal driving LSI or the like.
[0004]
Although not shown, a plurality of scanning lines are provided in the display area 6 surrounded by the two-dot chain line on the upper surface of the lower glass substrate 2 so as to extend in the row direction (the left-right direction in FIG. 5). A plurality of signal lines are provided so as to extend in the column direction (vertical direction in FIG. 5). The right end of the scanning line is connected to the right semiconductor chip 5 via an output wiring 7 provided at a predetermined position on the upper surface of the lower glass substrate 2. Therefore, the semiconductor chip 5 on the right side is for driving a scanning line for supplying a voltage to a plurality of scanning lines. The lower ends of the signal lines are connected to the lower semiconductor chip 4 via output wirings 8 provided at four predetermined locations on the upper surface of the lower glass substrate 2. Therefore, the lower semiconductor chip 4 is for driving a signal line for supplying a voltage to a plurality of signal lines.
[0005]
The lower surface of one end of the flexible wiring board 11 is bonded to the upper surface of the lower protrusion 2a on the lower side of the lower glass substrate 2 outside the mounting area of the semiconductor chip 4 via an anisotropic conductive adhesive (not shown). . The flexible wiring board 11 and the lower semiconductor chip 4 are connected via the lower protrusion 2a on the lower glass substrate 2 and input wirings 12 provided at four predetermined locations on the upper surface in the vicinity of the lower protrusion 2a. The flexible wiring board 11 and the right semiconductor chip 5 are connected via the right projection 2b of the lower glass substrate 2 and input wiring 13 provided at a predetermined location on the upper surface in the vicinity thereof.
[0006]
Next, FIG. 6A is an enlarged transmission plan view showing a part of the lower right portion of the liquid crystal display panel 1 shown in FIG. 5 in an exploded state. A region 21 surrounded by an alternate long and short dash line on the upper surface of the lower projection 2a on the lower glass substrate 2 is a semiconductor chip mounting region on which the semiconductor chip 4 is mounted. The input wiring 12 includes a signal input wiring and a power supply wiring. The signal input wiring includes a plurality of signal input connection terminals 12a (see FIG. 7B) provided at the upper right portion in the semiconductor chip mounting area 21, and the signal input connection terminals 12a and the semiconductor chip mounting area. 21 and a plurality of signal input lines 12b extending to the vicinity of the lower protruding end of the lower glass substrate 2. The power supply wiring includes four power supply connection terminals 12c (see FIG. 7B) provided at the lower right of the semiconductor chip mounting area 21 and these power supply connection terminals 12c to the right of the semiconductor chip mounting area 21. On the lower side, four power supply lines 12d are extended to the vicinity of the lower protruding end of the lower glass substrate 2.
[0007]
Here, the signal input wiring and the power supply wiring are formed of a transparent metal such as ITO. The reason why the power supply wiring is formed wider than the signal input wiring is to reduce the wiring resistance because a larger current flows through the power supply wiring than the signal input wiring. The detailed description of the input wiring 13 and the cross wiring 14 provided in the vicinity thereof is omitted.
[0008]
As shown in FIG. 5, the flexible wiring board 11 includes a film 22 having a band 22a and a protrusion 22b protruding from a predetermined position on the lower side of the band 22a. Then, as shown in the transmission enlarged plan view of FIG. 6B, the signal input lines 12 b and the power supply lines 12 d of the four input wirings 12 are provided at predetermined positions on the lower surface of the strip 22 a of the film 22. Four sets of connection terminals 23a and 23b to be connected, one set of connection terminals 24 connected to one set of input wirings 13, and connection terminals 25 connected to the cross wiring 14 are provided.
[0009]
In FIG. 5 and FIG. 6B, the rightmost pair of connection terminals 23a and 23b and the connection terminals 24 and 25 are connection terminals (not shown) provided on the lower surface of the projecting end of the projecting portion 22b of the film 22. ) Are connected to each other via a lead wire (not shown) provided on the lower surface of the strip 22a and the protruding portion 22b of the film 22. On the other hand, the remaining three sets of connection terminals 23a and 23b are connected to the rightmost one set via a through hole (not shown) and a relay wire formed across the connection terminals 23a and 23b on the upper surface of the film 22. The connection terminals 23a and 23b are connected to corresponding connection terminals. That is, in the flexible wiring board 11, the connection terminals 24 and 25 and four sets of connection terminals 23a and 23b are formed on the lower surface, and the rightmost set of connection terminals 23a and 23b and the remaining three sets of connection terminals 23a and 23a. The relay wiring for connecting to the wiring 22b is formed as a double-sided wiring board formed on the upper surface, and four sets of connection terminals 23a and 23b are provided in parallel on the lower surface of the strip 22a of the film 22, and One of the predetermined sets is directly connected to a wiring line provided on the lower surface of the strip 22a of the film 22, and the remaining three sets are connected to the wiring lines through through holes and the like.
[0010]
Next, FIG. 7A is a transparent enlarged plan view showing the terminal positions of the semiconductor chip 4 mounted on the semiconductor chip mounting area 21 of the liquid crystal display panel 1 shown in FIG. 6A, and FIG. FIG. 7 is an enlarged plan view of a semiconductor chip mounting area 21 of the liquid crystal display panel 1 shown in FIG. An output connection terminal 8 a formed of one end of the output wiring 8 is provided at an upper side in the semiconductor chip mounting area 21. A plurality of signal input bump electrodes 31 are provided in the upper right portion of the lower surface of the semiconductor chip 4, four power supply bump electrodes 32 are provided in the lower right portion, and a plurality of output bump electrodes 33 are provided in the upper side portion. A plurality of dummy bump electrodes 34 are provided on the lower side. In the above description, the power supply bump electrodes 32 are connected in pairs (not shown) in a pattern, and each set corresponds to one power supply line 12d.
[0011]
When the semiconductor chip 4 is mounted on the semiconductor chip mounting area 21 via an anisotropic conductive adhesive, the signal input bump electrode 31, the power supply bump electrode 32, and the output bump electrode 33 of the semiconductor chip 4 The liquid crystal display panel 1 is connected to the signal input connection terminal 12a, the power supply connection terminal 12c, and the output connection terminal 8a. The dummy bump electrode 34 is designed so that the pressure when the semiconductor chip 4 is mounted on the semiconductor chip mounting area 21 by thermocompression bonding via an anisotropic conductive adhesive is uniformly applied to the anisotropic conductive adhesive under the semiconductor chip 4. It is to make it.
[0012]
[Problems to be solved by the invention]
By the way, in the flexible wiring board 11 in such a conventional liquid crystal display device, four sets of connection terminals 23a and 23b are provided in parallel on the lower surface of the strip 22a of the film 22, and three predetermined sets of connection terminals 23a and 23b are provided. Is connected to a common lead line provided on the lower surface of the band-shaped portion 22a of the film 22 through a through hole or the like, so that the width of the band-shaped portion 22a of the film 22 is increased, and the overall occupied area is increased. In addition, there is a problem that the structure becomes complicated with double-sided wiring having through holes, and thus the cost is increased.
An object of the present invention is to reduce the area occupied by a flexible wiring board and to provide a simple structure of single-sided wiring.
[0013]
[Means for Solving the Problems]
The present invention provides a display panel having a plurality of semiconductor chip mounting areas arranged on one side, a plurality of semiconductor chips mounted on each of the semiconductor chip mounting areas of the display panel, and one side of the display panel. A flexible wiring board bonded to the outside of the semiconductor chip mounting area, the display panel corresponding to a semiconductor chip mounting area corresponding to one end of the plurality of semiconductor chip mounting areas. One end of the signal input wiring and one end of the power supply line are arranged so as to extend in a direction perpendicular to one side of the display panel along one side of the display panel. One end of the power supply line is provided, and the signal input wiring is provided so as to pass from one end of the signal input wiring to the inside of each of the semiconductor chip mounting regions. A portion having a power connection terminal provided in the semiconductor chip mounting region from the portion and the other end portion extending through the power connection terminal and outside the semiconductor chip mounting region; A connection terminal connected to one end of the signal input wiring, a connection terminal connected to one end of the power supply line, and one end of a power supply line adjacent to the other end of the power supply line on a surface corresponding to the panel And a power supply relay wiring for connecting the power supply and the power supply .
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a plan view of a liquid crystal display device according to an embodiment of the present invention, FIG. 2A is an enlarged transmission plan view of a part of the lower right portion of the liquid crystal display panel shown in FIG. 3) is a transparent enlarged plan view of a portion of the flexible wiring board corresponding to the area of the liquid crystal display panel of FIG. 2A, and FIG. 3A is a view of FIG. 2A at the lower right of the liquid crystal display panel shown in FIG. FIG. 3B is an enlarged transmission plan view of a part of a different disassembled state, FIG. 3B is an enlarged transmission plan view of a portion of the flexible wiring board corresponding to the area of the liquid crystal display panel in FIG. FIG. 4A is an enlarged transparent plan view showing a terminal position of a semiconductor chip mounted in a semiconductor chip mounting area of the liquid crystal display panel shown in FIG. 2A, and FIG. 4B is a liquid crystal display panel shown in FIG. 2 is an enlarged plan view of the semiconductor chip mounting area of FIG. . In these figures, the same reference numerals are given to the same parts as those in FIGS. 5 to 7, and the description thereof will be omitted as appropriate.
[0015]
As shown in FIG. 4B, a signal input wiring 41 among input wirings input to the semiconductor chip 4 of the liquid crystal display panel 1 in this embodiment is provided at an upper right portion in the semiconductor chip mounting area 21. It has a plurality of electrode connection terminals 42a. 2A, when looking at the semiconductor chip mounting area 21 on the right end side, the lower glass substrate 2 is located on the right side of the semiconductor chip mounting area 21 from the electrode connection terminals 42a provided in the semiconductor chip mounting area 21. A signal input terminal 42b extending to the vicinity of the lower protruding end is provided. Next, regarding the adjacent semiconductor chip mounting areas 21, electrode connection terminals 42a provided in the right semiconductor chip mounting area 21 and electrode connection terminals 42a provided in the left semiconductor chip mounting area 21 are shown. The signal input relay wiring 43 to be connected is provided in the right semiconductor chip mounting area 21 and between the right semiconductor chip mounting area 21 and the left semiconductor chip mounting area 21. That is, the signal input wiring 41 is formed on the lower glass substrate 2 so as to connect the signal input electrodes of the semiconductor chips 4 in common. The power supply wiring, which will be described later, is routed to the display area 6 side as a signal input relay wiring 43 between the semiconductor chip mounting areas 21.
[0016]
As shown in FIG. 4B, the power supply wiring among the input wirings includes four power supply connection terminals 44 provided on the right side in the semiconductor chip mounting area 21 and the lowermost wiring in FIG. 4B. The power supply line 45 extends from the power supply connection terminal 44 to the vicinity of the lower protruding end of the lower glass substrate 2 downward, and the power supply line 45 extends downward from the remaining three power supply connection terminals 44 to the lower right. The power supply line 46 extends to the vicinity of the lower protruding end of the glass substrate 2, and extends from the remaining three power supply connection terminals 44 to the lower left side to the vicinity of the lower protruding end of the lower glass substrate 2. And a power supply line 47. However, in this case, regarding the leftmost semiconductor chip mounting area 21 in FIG. 1, the power supply line 47 is not provided as shown in FIG. Further, the end of the predetermined power supply line is substantially L-shaped, but may be linear like other power supply lines. As shown in FIG. 4A, four sets of power supply bump electrodes 32 are provided on the right side of the lower surface of the semiconductor chip 4.
[0017]
As shown in FIG. 1, the flexible wiring board 11 includes a film 22 having a narrow band portion 22a and a protruding portion 22b protruding from a predetermined position on the lower side of the band portion 22a. Then, as shown in FIG. 2 (b), the right side power supply lines 45 and 46, the signal input terminal 42b, the cross wiring 14 and the input are provided at predetermined positions on the right side of the lower surface of the strip 22a of the film 22. Connection terminals 51 to 55 connected to the wiring 13 are provided. These connection terminals 51 to 55 are connected to connection terminals (not shown) provided on the lower surface of the protruding end of the protruding portion 22 b of the film 22, and routed on the lower surface of the strip 22 a and the protruding portion 22 b of the film 22. It is connected via a line 56.
[0018]
Connection terminals connected to power supply lines 45, 46, 47 (except for the power supply lines 45, 46 on the right side in FIG. 2A) are provided at other predetermined positions on the lower surface of the strip 22a of the film 22, respectively. 57, 58, and 59 are provided. The connection terminal 57 is connected to a lead wire 56 connected to the connection terminal 51 via a power supply relay wire 61 provided on the lower surface of the strip 22 a of the film 22. The left connection terminal 58 and the right connection terminal 59 are connected to each other via a power supply relay wire 62 provided on the lower surface of the strip 22 a of the film 22.
[0019]
Next, the lower surface of one end of the flexible wiring board 11 is bonded to the outside of the semiconductor chip mounting area 21 on the upper surface of the lower projecting portion 2a of the lower glass substrate 2 via an anisotropic conductive adhesive (not shown). A part of the state will be described. The connection terminal 53 of the flexible wiring board 11 is connected to the electrode connection terminal 42a in the semiconductor chip mounting area 21 on the right side of FIG. 2A via the signal input terminal 42b, and further the signal input relay wiring on the left side. It is connected to an electrode connection terminal 42a in the semiconductor chip mounting area 21 on the left side via 43, and further similarly to an electrode connection terminal 42a in the remaining two semiconductor chip mounting areas 21.
[0020]
The connection terminals 51 and 57 of the flexible wiring board 11 are connected to the power supply connection terminal 44 at the lowermost side in FIG. That is, the lowermost power supply connection terminal 44 in FIG. 4B in the semiconductor chip mounting area 21 on the right side in FIG. 2A is connected to the connection terminal 51 via the power supply line 45 and the connection terminal 51. Connected to the routing line 56. In FIG. 4B, the lowermost power supply connection terminal 44 in the remaining three semiconductor chip mounting areas 21 is connected to the connection terminal 51 via the power supply line 45, the connection terminal 57, and the power supply relay wiring 61. Connected to the routing line 56.
[0021]
The connection terminals 52 of the flexible wiring board 11 are connected to the remaining three power supply connection terminals 44 in the semiconductor chip mounting area 21 on the right side of FIG. 2A via the power supply line 46 on the right side of FIG. The remaining three power supply connection terminals 44 in the semiconductor chip mounting area 21 on the left side are further connected to the left power supply line 47, the connection terminal 59, the power supply relay wiring 62, the connection terminal 58, and the power supply line 46. , And similarly connected to the remaining three power supply connection terminals 44 in the remaining two semiconductor chip mounting areas 21. That is, the remaining three power supply connection terminals 44 in the four semiconductor chip mounting areas 21 are finally connected to the connection terminals 52 via the power supply line 46 and the connection terminals 52 on the right side of FIG. It is connected to the connected routing line 56.
[0022]
As described above, in this liquid crystal display device, the power supply lines 45, 46, 47 including the power supply connection terminals 44 are provided on the right side and in the vicinity of each of the four semiconductor chip mounting areas 21 of the liquid crystal display panel 1, and the flexible wiring On the lower surface of the band portion 22a of the film 22 of the substrate 11, adjacent ones (45, 45 and 46) of the power supply lines 45, 46 and 47 provided for each semiconductor chip mounting area 21 of the liquid crystal display panel 1 are provided. And 47) are provided. Thus, among the power supply connection terminals 44 provided on each right side in the four semiconductor chip mounting areas 21 of the liquid crystal display panel 1, the upper three power supply connection terminals 44 in FIG. 4B are connected in series. , And the remaining one power supply connection terminal 44 is connected in parallel. As a result, the connection terminals 57, 58, 59 and the power supply relay wires 61, 62 may be provided on the left side of the lower surface of the strip 22a of the film 22 of the flexible wiring board 11, and the width of the strip 22a of the film 22 is reduced. As a result, the area occupied by the flexible wiring board 11 can be reduced, and a simple structure with single-sided wiring can be achieved. As a result, the cost of the flexible wiring board 11 can be reduced.
[0023]
In this liquid crystal display device, the signal input relay wiring 43 is provided on the upper surface of the lower projecting portion 2a of the lower glass substrate 2 of the liquid crystal display panel 1. The signal input relay wiring 43 is mounted on a semiconductor chip. Since it is provided in the region 21, it is possible to prevent the width (width of the frame) of the lower protrusion 2 a on the lower glass substrate 2 from increasing.
[0024]
In the above embodiment, among the power supply connection terminals 44 provided on each right side in the four semiconductor chip mounting areas 21 of the liquid crystal display panel 1, the lowest power supply connection terminal 44 in FIG. Although the connection is made in parallel, the invention is not limited to this, and the power supply connection terminal 44 may be connected in series similarly to the remaining three power supply connection terminals 44. In the above-described embodiment, the signal input relay wiring 43 is provided on the liquid crystal display panel 1. However, the present invention is not limited to this. Like the power supply relay wirings 61 and 62, the film 22 of the flexible wiring board 11 is provided. May be provided on the lower surface of the band-shaped portion 22a.
[0025]
As described above, according to the present invention, the connection terminal connected to one end of the signal input wiring formed on the display panel and the connection terminal connected to one end of the power supply line are formed on the surface of the flexible wiring board corresponding to the display panel. The connection terminal and the power supply relay wiring for connecting the other end of the power supply line to one end of the adjacent power supply line are provided, so that the area occupied by the flexible wiring board can be reduced, and the single-sided wiring can be provided. And the cost of the flexible wiring board can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view of a liquid crystal display device according to an embodiment of the present invention.
2 (a) is an enlarged transmission plan view of a part of the lower right portion of the liquid crystal display panel shown in FIG. 1 in an exploded state, and FIG. 2 (b) is a portion corresponding to the area of the liquid crystal display panel in FIG. 2 (a). FIG. 4 is a transparent enlarged plan view of the flexible wiring board of FIG.
3A is an enlarged transmission plan view of the lower right part of the liquid crystal display panel shown in FIG. 1 in a partially disassembled state different from FIG. 2A, and FIG. 3B is a liquid crystal of FIG. 3A. FIG. 3 is a transparent enlarged plan view of a portion of a flexible wiring board corresponding to a region of a display panel.
FIG. 4A is an enlarged transparent plan view showing a terminal position of a semiconductor chip mounted on a semiconductor chip mounting area of the liquid crystal display panel shown in FIG. 2A, and FIG. FIG. 2 is an enlarged plan view of a semiconductor chip mounting area of the liquid crystal display panel shown in FIG.
FIG. 5 is a plan view showing an example of a conventional liquid crystal display device.
6A is an enlarged transmission plan view of a part of the lower right portion of the liquid crystal display panel shown in FIG. 5 in an exploded state, and FIG. 6B is a portion corresponding to the area of the liquid crystal display panel in FIG. FIG. 4 is a transparent enlarged plan view of the flexible wiring board of FIG.
7A is a transmission enlarged plan view showing a terminal position of a semiconductor chip mounted on a semiconductor chip mounting area of the liquid crystal display panel shown in FIG. 6A, and FIG. FIG. 2 is an enlarged plan view of a semiconductor chip mounting area of the liquid crystal display panel shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2 Lower glass substrate 2a Projection 4 Semiconductor chip 11 Flexible wiring board 22 Film 22a Strip 22b Projection 41 Signal input wiring 42a Electrode connection terminal 42b Signal input terminal 43 Signal input relay wiring 44 Power supply connection Terminals 45, 46, 47 Power supply lines 51, 52, 53 Connection terminals 57, 58, 59 Connection terminals 61, 62 Relay wiring for power supply

Claims (1)

A display panel having a plurality of semiconductor chip mounting areas arranged on one side, a plurality of semiconductor chips mounted on the respective semiconductor chip mounting areas of the display panel, and the semiconductor chip being one side of the display panel A display device comprising: a flexible wiring board bonded to an outer side of the mounting area ; wherein the plurality of semiconductor chip mounting areas correspond to a semiconductor chip mounting area corresponding to one end side; One end of the signal input wiring and one end of the power supply line are arranged so as to extend in a direction perpendicular to one side of the display panel, and one end of the power supply line corresponds to another semiconductor chip mounting area. The signal input wiring is provided so as to pass through the semiconductor chip mounting area from one end of the signal input wiring, and the power supply lines are provided from one end of the power supply line. A shape having a power supply connection terminal provided in the conductive chip mounting area and the other end extending outside the semiconductor chip mounting area passing through the power supply connection terminal and corresponding to the display panel of the flexible wiring board A connection terminal connected to one end of the signal input wiring, a connection terminal connected to one end of the power supply line, and the other end of the power supply line to one end of an adjacent power supply line A display device provided with a power supply relay wiring .

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