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JP3589909B2 - Optical element insulation structure - Google Patents
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JP3589909B2 - Optical element insulation structure - Google Patents

Optical element insulation structure Download PDF

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Publication number
JP3589909B2
JP3589909B2 JP22626599A JP22626599A JP3589909B2 JP 3589909 B2 JP3589909 B2 JP 3589909B2 JP 22626599 A JP22626599 A JP 22626599A JP 22626599 A JP22626599 A JP 22626599A JP 3589909 B2 JP3589909 B2 JP 3589909B2
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Prior art keywords
chamber
optical element
optical
optical cable
partition
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JP22626599A
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JP2001053295A (en
Inventor
徳次 松沼
規雄 熊倉
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Origin Electric Co Ltd
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Origin Electric Co Ltd
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  • Led Device Packages (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、光素子の絶縁構造に関するものであり、特に高電圧に荷電されて絶縁油中にある電位に接続された光素子の絶縁構造に関するものである。
【0002】
【従来の技術】
エックス線管用の電源やレーザ管などの電子管用電源装置では、高電圧に荷電されているので、装置を絶縁油で充填したタンク内に収納される構造のものが多い。そのタンク内の回路の中の高電圧に荷電された回路に、タンク外から直接制御信号を伝達する必要のある場合がある。その場合は、光素子を利用して制御信号を伝達しつつ、高電圧絶縁する方式が考えられるが、絶縁油中に光素子を配設することは、光素子への絶縁油の及ぼす悪影響があり、その問題が残る。
【0003】
【発明が解決しようとする課題】
本発明は、絶縁油で充填したタンク内に収納されて高電圧に荷電された光素子の絶縁構造において、絶縁油の及ぼす影響から保護できる構造を提供することを課題とする。
【0004】
【課題を解決するための手段】
この課題を解決するために、本発明では以下の手段を提案するものである。すなわち、
光素子の絶縁構造であって:
所定の高電圧絶縁に適した材質と充分な長さの光ケーブルと;
その光ケーブルに光学的に結合された光素子と;
この光素子を一方の面に取り付けたプリント基板と;
合成樹脂性のケースであって底板部とこの底板部の上に配設されて矩形を囲む形状の堤壁部とこの堤壁部の高さの内側途中に設けられた段縁部とこの段縁部の高さと等しい高さに設けられ第1室と第2室とを形成する仕切部とからなる合成樹脂性のケースと;
前記第1室に形成された密閉空間であって前記段縁部上に前記プリント基板を配設して前記光素子を収納するとともに前記仕切部から前記第2室へと前記光ケーブルを密接貫通させてなる密閉空間と;
この密閉空間から前記第2室に伸延する前記光ケーブルを前記堤壁部より密接貫通させるとともに前記第2室と前記段縁部より上部に連なって熱硬化性樹脂でモールドされた固体絶縁体層とからなることを特徴とする光素子の絶縁構造を提案する。
【0005】
また、前記第2室に仕切部を設けて前記光ケーブルを貫通させてなることも提案する。
【0006】
また、前記光ケーブルが貫通する仕切部および堤壁部にゴムブッシングを介在させてなることも提案する。
【0007】
【発明の実施の形態】
図1は、本発明に係る光素子の絶縁構造の実施の形態の上面図と側面図であり、図2は、本発明に係る光素子の絶縁構造を適用する電子管用電源装置の回路図である。
【0008】
図2において、電子管用電源装置50は、絶縁油58を充填したタンク57の中に回路部品が収容されている。高電圧電源55の一方の出力端子が接地端子59を経て接地され、他方の出力端子が高電圧端子61に接続されるとともに、電子回路53の一端に接続される。また、電子回路53の他の一端は出力端子63に接続される。電子回路53には、光受信モジュール5と光送信モジュール51とが接続されて、光受信モジュール5からは制御信号を得て、光送信モジュール51には、電子回路53の動作状態を検出する信号を与える。したがって、高電圧端子61に接続される電子回路53、光受信モジュール5及び光送信モジュール51には、高電圧電源55の出力電圧の値と等しい値か又はその値に対応した値に荷電される。例えば、50kVとすれば、ほぼその値に等しい値の高電圧が、電子回路53、光受信モジュール5及び光送信モジュール51に荷電される。光受信モジュール5の入力側は光ケーブル17が接続されて、その光ケーブル17が適当な長さに延長されてタンク57の外部に導出される。この光ケーブル17のタンク57の外壁まで延長された長さの部分が高電圧絶縁に与る。同様に、光送信モジュール51の出力側は光ケーブル65が接続されて、その光ケーブル65が適当な長さに延長されてタンク57の外部に導出される。この光ケーブル65のタンク57の外壁まで延長された長さの部分が高電圧絶縁に作用する。
【0009】
図1は、本発明に係る光素子の絶縁構造の実施の形態の上面図(a)と側断面図(b)であり、光受信モジュール5を含む光受信モジュール内蔵絶縁構造体1を示す。図1(a)は、熱硬化性樹脂をモールドする前の状態を示し、図1(b)は、熱硬化性樹脂を注入後の状態を示す。図において、合成樹脂ケース3は、底板部31と、その底板部31の4隅に穿ってある取り付け穴32と、堤壁部33と、この堤壁部33の内側にその高さよりやや低い高さの段縁部34が設けられる。この段縁部34の高さにおいて、さらにその内側に、仕切部35、36が設けられて、合成樹脂で囲まれて上方のみが開放となるやや広い第1室37とそれよりやや狭い第2室38、第3室39が形成される。これら第1室37、第2室38、第3室39は、互いに段縁部34の高さまでは分離されて、段縁部34の高さから堤壁部33の高さまでの間は、共通空間となる。第1室の段縁部34の上には、プリント基板7がねじ9で取り付けられる。プリント基板7の第1室の側の面には光受信モジュール5が取り付けられる。光受信モジュール5は、底板部31と堤壁部33と仕切部35プリント基板7の各面により閉鎖された第1室の中に収納される。光受信モジュール5のプリント基板7への接続線は、図の上面の導体パターン及びリード線22を経て、堤壁部33の右壁部33bに取り付けられたコネクタ21に接続される。
【0010】
光受信モジュール5の入力側の光ケーブル17については、第1室37から仕切部35の上縁に設けられたゴムブッシング11を通り、第2室38を通り、仕切部36の上縁に設けられたゴムブッシング13を通り、第3室39を通り、堤壁部33の左壁部33aに設けられたゴムブッシング15を通過して、この光受信モジュール内蔵絶縁構造体1の外部に伸延する。
【0011】
堤壁部33で囲まれた空間の上部から、熱硬化性樹脂19が充填モールドされて光受信モジュール5を含む第1室37のみが閉鎖されて空気層となる他は、完全に熱硬化性樹脂19により固体絶縁体層40となる。熱硬化性樹脂19がモールド硬化されるときに、接触する表面に密着するとともに収縮して圧力が印加される。したがって、この光受信モジュール内蔵絶縁構造体1を絶縁油内に埋設した場合においても、光受信モジュール5を含む第1室37は密閉空間30を形成し、絶縁油が浸透してくるのを防止できる。
【0012】
合成樹脂ケース3の材料は、絶縁油に耐える性質と、モールドする熱硬化性樹脂19とのなじみのよい性質を備えていることが必要であり、例えば、エポキシ樹脂やポリカーボネート樹脂が好ましい。そして、熱硬化性樹脂19については、絶縁油に耐える性質と、合成樹脂ケース3とのなじみのよい性質を備えていることが必要であり、エポキシ樹脂は好ましい例である。
【0013】
光ケーブル17、65については、電気絶縁性の良好な材質を選定する必要がある。また、それらの長さは絶縁油中で所定の高電圧の電圧値に耐える長さであることが必要である。光ケーブルの既製品の多くは、充分な電気絶縁特性を備えており、選択は比較的容易ではある。
【0014】
本発明において、ゴムブッシング11、13、15については必ずしも必要な構成要素ではなく、仕切部35、36と光ケーブル17との接着性を保つことができれば、必ずしも必要ではない。また、仕切部35は第1室37を密閉空間とするために必須のものであるが、仕切部36は必ずしも必要とはしない。つまり仕切部36は、光ケーブル17を固体絶縁層の中に保持させるためであり、必要に応じてその配設個数をゼロから複数まで任意に選ぶことができる。また、第2室38と第3室39の位置に対応する段縁部34は必ずしも必要ではない。
【0015】
以上は、光受信モジュールについての実施の形態を説明したが、光送信モジュールについても、同様に本発明は適用できるものである。
【0016】
以上、絶縁油を用いる場合について説明してきたが、本発明に係る光素子の絶縁構造は、空気や絶縁ガスなどの気体絶縁の場合でも適用できるものである。
【0017】
【発明の効果】
以上述べたように本発明によれば、熱硬化性樹脂の硬化時の収縮特性により、光ケーブルとの間に圧力を与えるので、光素子のある第1室には絶縁油の浸透を防止でき、絶縁油の及ぼす影響から保護できる。
【図面の簡単な説明】
【図1】本発明に係る光素子の絶縁構造の実施の形態の上面図と部分断面図である。
【図2】本発明に係る光素子の絶縁構造を適用する電子管用電源装置の回路図である。
【符号の説明】
1…光受信モジュール内蔵絶縁構造体 3…合成樹脂ケース
5…光受信モジュール 7…プリント基板 9…ビス
11、13、15…ゴムブッシング 17…光ケーブル
19…熱硬化性樹脂 21…コネクタ 30…密閉空間
31…底板部 32…取り付け穴 33…堤壁部 34…段縁部
35、36…仕切部 37…第1室 38…第2室 39…第3室
40…固体絶縁体層
50…電子管用電源装置 51…光送信モジュール 53…電子回路
55…高電圧電源 57…タンク 59…接地端子
61…高電圧端子 63…出力端子 65…光ケーブル
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an insulating structure of an optical element, and more particularly to an insulating structure of an optical element charged to a high voltage and connected to a potential in insulating oil.
[0002]
[Prior art]
In a power supply for an X-ray tube or a power supply for an electron tube such as a laser tube, since the device is charged to a high voltage, the device is often housed in a tank filled with insulating oil. It may be necessary to transmit control signals directly from outside the tank to the high voltage charged circuits in the tank. In this case, high voltage insulation may be used while transmitting control signals using optical elements.However, arranging optical elements in insulating oil has the negative effect of insulating oil on optical elements. Yes, the problem remains.
[0003]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a structure for protecting an optical element, which is housed in a tank filled with insulating oil and charged with a high voltage, from the influence of the insulating oil.
[0004]
[Means for Solving the Problems]
In order to solve this problem, the present invention proposes the following means. That is,
The insulation structure of the optical element,
A material suitable for the required high-voltage insulation and an optical cable of sufficient length;
An optical element optically coupled to the optical cable;
A printed circuit board having the optical element mounted on one surface;
A synthetic resin case, a bottom plate portion, a levee wall portion disposed on the bottom plate portion and having a shape surrounding a rectangle, a step edge portion provided halfway inside the height of the levee wall portion, and a step. A synthetic resin case comprising a partition provided at a height equal to the height of the edge and forming a first chamber and a second chamber;
The printed circuit board is disposed on the stepped edge in the closed space formed in the first chamber to house the optical element, and the optical cable is closely penetrated from the partition to the second chamber. A closed space;
The optical cable extending from the closed space to the second chamber is closely penetrated from the levee wall, and the second chamber is connected to the upper part of the stepped edge and molded with a solid insulator layer formed of a thermosetting resin. An insulating structure for an optical device, comprising:
[0005]
It is also proposed that a partition be provided in the second chamber to allow the optical cable to pass therethrough.
[0006]
It is also proposed that a rubber bushing be interposed between the partition and the bank wall through which the optical cable passes.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a top view and a side view of an embodiment of an optical element insulating structure according to the present invention, and FIG. 2 is a circuit diagram of an electron tube power supply device to which the optical element insulating structure according to the present invention is applied. is there.
[0008]
In FIG. 2, in the power supply device for an electron tube 50, circuit components are accommodated in a tank 57 filled with insulating oil 58. One output terminal of the high voltage power supply 55 is grounded via the ground terminal 59, and the other output terminal is connected to the high voltage terminal 61 and to one end of the electronic circuit 53. The other end of the electronic circuit 53 is connected to the output terminal 63. The optical receiving module 5 and the optical transmitting module 51 are connected to the electronic circuit 53, a control signal is obtained from the optical receiving module 5, and a signal for detecting the operation state of the electronic circuit 53 is transmitted to the optical transmitting module 51. give. Therefore, the electronic circuit 53, the optical receiving module 5, and the optical transmitting module 51 connected to the high voltage terminal 61 are charged to a value equal to or corresponding to the value of the output voltage of the high voltage power supply 55. . For example, if the voltage is set to 50 kV, a high voltage having a value substantially equal to that value is charged to the electronic circuit 53, the optical receiving module 5, and the optical transmitting module 51. An optical cable 17 is connected to the input side of the optical receiving module 5, and the optical cable 17 is extended to an appropriate length and led out of the tank 57. The length of the optical cable 17 extending to the outer wall of the tank 57 contributes to high-voltage insulation. Similarly, an optical cable 65 is connected to the output side of the optical transmission module 51, and the optical cable 65 is extended to an appropriate length and led out of the tank 57. The length of the optical cable 65 extended to the outer wall of the tank 57 acts on high-voltage insulation.
[0009]
FIG. 1 is a top view (a) and a side sectional view (b) of an embodiment of an insulating structure for an optical element according to the present invention, and shows an insulating structure 1 with a built-in light receiving module including a light receiving module 5. FIG. 1A shows a state before the thermosetting resin is molded, and FIG. 1B shows a state after the thermosetting resin is injected. In the figure, a synthetic resin case 3 has a bottom plate portion 31, mounting holes 32 formed at four corners of the bottom plate portion 31, a bank wall portion 33, and a height slightly lower than the height inside the bank wall portion 33. A step edge 34 is provided. At the height of the step edge portion 34, partition portions 35 and 36 are provided further inside, and the first chamber 37, which is surrounded by the synthetic resin and is open only at the upper portion, and the second chamber 37, which is slightly narrower, are opened. A chamber 38 and a third chamber 39 are formed. The first chamber 37, the second chamber 38, and the third chamber 39 are separated from each other at the height of the step edge portion 34, and are common between the height of the step edge portion 34 and the height of the bank wall 33. It becomes space. The printed circuit board 7 is mounted on the step edge 34 of the first chamber with the screw 9. The light receiving module 5 is mounted on the surface of the printed circuit board 7 on the first chamber side. The light receiving module 5 is housed in a first chamber closed by each surface of the printed circuit board 7, the bottom plate 31, the bank wall 33, and the partition 35. The connection line of the light receiving module 5 to the printed circuit board 7 is connected to the connector 21 attached to the right wall portion 33b of the bank wall portion 33 via the conductor pattern and the lead wire 22 on the upper surface of the drawing.
[0010]
The optical cable 17 on the input side of the optical receiving module 5 is provided at the upper edge of the partition 36 from the first chamber 37 through the rubber bushing 11 provided at the upper edge of the partition 35, through the second chamber 38. Through the rubber bushing 13, the third chamber 39, the rubber bushing 15 provided on the left wall portion 33 a of the bank wall portion 33, and extends to the outside of the light receiving module built-in insulating structure 1.
[0011]
From the upper part of the space surrounded by the bank wall 33, the thermosetting resin 19 is filled and molded, and only the first chamber 37 including the light receiving module 5 is closed to form an air layer. The resin 19 forms the solid insulator layer 40. When the thermosetting resin 19 is cured in the mold, the thermosetting resin 19 is in close contact with the contacting surface and shrinks to apply pressure. Therefore, even when the light receiving module built-in insulating structure 1 is buried in insulating oil, the first chamber 37 including the light receiving module 5 forms the closed space 30 to prevent the insulating oil from penetrating. it can.
[0012]
The material of the synthetic resin case 3 needs to have a property of withstanding insulating oil and a property of being compatible with the thermosetting resin 19 to be molded. For example, an epoxy resin or a polycarbonate resin is preferable. The thermosetting resin 19 needs to have a property of withstanding insulating oil and a property of being compatible with the synthetic resin case 3, and an epoxy resin is a preferable example.
[0013]
For the optical cables 17 and 65, it is necessary to select a material having good electrical insulation. Further, it is necessary that these lengths are long enough to withstand a predetermined high voltage value in the insulating oil. Many off-the-shelf optical cables have adequate electrical insulation properties and are relatively easy to select.
[0014]
In the present invention, the rubber bushings 11, 13, and 15 are not necessarily required components, but are not necessarily required as long as the adhesiveness between the partitions 35 and 36 and the optical cable 17 can be maintained. Further, the partition 35 is indispensable to make the first chamber 37 a closed space, but the partition 36 is not necessarily required. That is, the partition portion 36 is for holding the optical cable 17 in the solid insulating layer, and the number of the partitions can be arbitrarily selected from zero to a plurality as necessary. Further, the step edge portions 34 corresponding to the positions of the second chamber 38 and the third chamber 39 are not necessarily required.
[0015]
Although the embodiments of the optical receiving module have been described above, the present invention can be similarly applied to the optical transmitting module.
[0016]
Although the case where the insulating oil is used has been described above, the insulating structure of the optical element according to the present invention can be applied to the case of gas insulation such as air or insulating gas.
[0017]
【The invention's effect】
As described above, according to the present invention, a pressure is applied between the thermosetting resin and the optical cable due to the shrinkage characteristic of the thermosetting resin during curing, so that the insulating oil can be prevented from penetrating into the first chamber having the optical element, Protects against the effects of insulating oil.
[Brief description of the drawings]
FIG. 1 is a top view and a partial cross-sectional view of an embodiment of an insulating structure of an optical element according to the present invention.
FIG. 2 is a circuit diagram of a power supply device for an electron tube to which the insulating structure of an optical element according to the present invention is applied.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Insulating structure with built-in light receiving module 3 ... Synthetic resin case 5 ... Light receiving module 7 ... Printed circuit board 9 ... Screw 11, 13, 15 ... Rubber bushing 17 ... Optical cable 19 ... Thermosetting resin 21 ... Connector 30 ... Sealed space DESCRIPTION OF SYMBOLS 31 ... Bottom plate part 32 ... Mounting hole 33 ... Empartment wall part 34 ... Step edge part 35, 36 ... Partition part 37 ... First chamber 38 ... Second chamber 39 ... Third chamber 40 ... Solid insulator layer 50 ... Electron tube power supply Device 51 Optical transmission module 53 Electronic circuit 55 High voltage power supply 57 Tank 59 Ground terminal 61 High voltage terminal 63 Output terminal 65 Optical cable

Claims (3)

光素子の絶縁構造であって:
所定の高電圧絶縁に適した材質と充分な長さの光ケーブルと;
その光ケーブルに光学的に結合された光素子と;
この光素子を一方の面に取り付けたプリント基板と;
合成樹脂性のケースであって底板部とこの底板部の上に配設されて矩形を囲む形状の堤壁部とこの堤壁部の高さの内側途中に設けられた段縁部とこの段縁部の高さと等しい高さに設けられ第1室と第2室とを形成する仕切部とからなる合成樹脂性のケースと;
前記第1室に形成された密閉空間であって前記段縁部上に前記プリント基板を配設して前記光素子を収納するとともに前記仕切部から前記第2室へと前記光ケーブルを密接貫通させてなる密閉空間と;
この密閉空間から前記第2室に伸延する前記光ケーブルを前記堤壁部より密接貫通させるとともに前記第2室と前記段縁部より上部に連なって熱硬化性樹脂でモールドされた固体絶縁体層とからなることを特徴とする光素子の絶縁構造。
The insulation structure of the optical element,
A material suitable for the required high-voltage insulation and an optical cable of sufficient length;
An optical element optically coupled to the optical cable;
A printed circuit board having the optical element mounted on one surface;
A synthetic resin case, a bottom plate portion, a levee wall portion disposed on the bottom plate portion and having a shape surrounding a rectangle, a step edge portion provided halfway inside the height of the levee wall portion, and a step. A synthetic resin case comprising a partition provided at a height equal to the height of the edge and forming a first chamber and a second chamber;
The printed circuit board is disposed on the stepped edge in the closed space formed in the first chamber to house the optical element, and the optical cable is closely penetrated from the partition to the second chamber. A closed space;
The optical cable extending from the closed space to the second chamber is closely penetrated from the levee wall, and the second chamber is connected to the upper part of the stepped edge and molded with a solid insulator layer formed of a thermosetting resin. An insulating structure for an optical element, comprising:
前記第2室に仕切部を設けて前記光ケーブルを貫通させてなることを特徴とする請求項1に記載の光素子の絶縁構造。The insulating structure for an optical element according to claim 1, wherein a partition portion is provided in the second chamber so that the optical cable penetrates through the partition. 前記光ケーブルが貫通する仕切部および堤壁部にゴムブッシングを介在させてなることを特徴とする請求項1又は請求項2に記載の光素子の絶縁構造。The insulating structure for an optical element according to claim 1 or 2, wherein a rubber bushing is interposed between a partition portion and a bank wall portion through which the optical cable penetrates.
JP22626599A 1999-08-10 1999-08-10 Optical element insulation structure Expired - Fee Related JP3589909B2 (en)

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