JP3592786B2 - Imaging device - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to an image apparatus used for an image forming apparatus such as an optical printer head and an image reading apparatus such as an image sensor.
[0002]
[Prior art]
Conventional image devices, for example, an image device used in an image forming apparatus such as an optical printer head, generally include a lens plate made of a resin such as polycarbonate in which a plurality of lenses are linearly arranged and supported at predetermined intervals, and a large number of lenses. A structure in which a light emitting diode element array is linearly arranged and mounted on a base plate made of an aluminum oxide sintered body, glass, or the like, and each lens and each light emitting diode element array are fixed in a one-to-one correspondence. Each of the light emitting diode elements of each light emitting diode element array selectively emits light in accordance with an external electric signal, and the light emitted by the light emitting diode elements is transmitted through a lens to an external photosensitive member. The image forming apparatus functions as an image forming apparatus by forming a latent image on the photosensitive member.
[0003]
A light emitting diode element array mounted linearly on the base plate generally has 64 light emitting diode elements linearly arranged inside the light emitting diode element array, and is used in a B4 size image forming apparatus. In this case, the 32 light emitting diode element arrays are mounted on the base plate such that each of the 32 corresponds to one lens.
[0004]
Further, each of the light emitting diode element arrays has a common electrode on its lower surface, and for example, silver powder or the like is added to epoxy resin to a common electrode wiring which has been formed by applying the common electrode on the upper surface of the base plate in advance. The common electrode is mounted on the base plate while being electrically connected to the common electrode wiring by bonding through a conductive resin adhesive.
[0005]
Furthermore, each light emitting diode element array mounted on the upper surface of the base plate has its individual electrode electrically connected to an individual electrode wiring formed on the upper surface of the base plate via a bonding wire, and the upper surface of the upper surface of the base plate. By connecting the common electrode wiring and the individual electrode wiring to an external electric circuit, each light emitting diode element of the light emitting diode element array is electrically connected to the external electric circuit.
[0006]
However, in this conventional image device, the individual electrodes provided on the light emitting diode element array are connected to the individual electrode wiring of the base plate via bonding wires, and the number of the individual electrodes of the light emitting diode element array is extremely large. Therefore, it takes a long time to electrically connect the individual electrodes of the light emitting diode element array to the individual electrode wirings of the base plate, and the manufacturing workability of the image device is poor, and the image device as a product has the disadvantage of being expensive. Was.
[0007]
In the above-described embodiment, an image apparatus used for an image forming apparatus such as an optical printer head has been described as an example. However, an image reading apparatus such as an image sensor using a solid-state image sensor array is used. Imaging devices have similar disadvantages.
[0008]
In order to solve the above-mentioned drawbacks, the applicant of the present application has previously arranged an image element array facing a lens between a first substrate having common electrode wiring and a second substrate having individual electrode wiring. An image device in which the common electrode is connected to the common electrode wiring of the first substrate and the individual electrode is flip-chip connected to the individual electrode wiring of the second substrate has been proposed.
[0009]
According to such an image device, the individual electrodes of the image element array and the individual electrode wirings of the second substrate are flip-chip connected, that is, the second substrate is placed on the image element array mounted on the first substrate, Since each individual electrode and the individual electrode wiring of the second substrate are placed in contact with each other and connected by joining each individual electrode and the individual electrode wiring via solder, the number of individual electrodes of the image element array is reduced. Even if there are many, all of them are connected to the individual electrode wirings of the second substrate at once and firmly, and as a result, the productivity of the image apparatus becomes extremely excellent.
[0010]
[Problems to be solved by the invention]
However, in this conventional image device, the image element member is mounted on the first substrate by connecting the common electrode of the image element array to the common electrode wiring of the first substrate, and then the image element array is mounted. Is manufactured by flip-chip connecting each individual electrode of the second substrate to the individual electrode wiring of the second substrate. When a positional shift occurs in the connection between the common electrode wiring of the first substrate and the common electrode of the image element array, the image element is displaced. The individual electrodes of the array and the individual electrode wirings of the second substrate do not abut exactly, and the individual electrodes of the image element array cannot be accurately electrically connected to the individual electrode wirings of the second substrate. .
[0011]
[Object of the invention]
The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to surely electrically connect an individual electrode of an image element array to an individual electrode wiring, a common electrode to a common electrode wiring, and to connect a light emitting diode element to an external electric signal. It is an object of the present invention to provide an image device which can emit light accurately in accordance with an image signal, or can extract an accurate electric signal corresponding to external image information from a solid-state image sensor array.
[0012]
[Means for Solving the Problems]
An image device according to an aspect of the invention is an image device in which a lens member including a plurality of lenses and an image element member having a large number of image element arrays are fixed together, wherein the image element member has a common electrode wiring. Between a first substrate and a second substrate having a plurality of individual electrode wirings, a plurality of the image element arrays separate the common electrodes of the image element array to the common electrode wirings of the first substrate. The electrodes are arranged in a state of being in contact with the individual electrode wirings of the second substrate, respectively, and the first substrate and the second substrate are made of a sheet-like thermoplastic resin, and The image element array is bonded via an adhesive member having a plurality of holes which are larger than the external dimensions and in which the image element arrays are respectively arranged.
[0014]
Further, the present invention is characterized in that a concave portion is provided in the first substrate of the image element member, and a part of the image element array is inserted into the concave portion.
[0015]
Still further, the present invention is characterized in that a template for regulating the position of the image element array is provided on the first substrate of the image element member.
[0016]
[Action]
According to the image device of the present invention, a plurality of image element arrays are provided between a first substrate having a common electrode wiring and a second substrate having a plurality of individual electrode wirings. Are arranged in such a manner that the individual electrodes are in contact with the common electrode wiring of the first substrate and the individual electrodes are in contact with the individual electrode wiring of the second substrate, respectively, and the first substrate and the second substrate are made of a sheet-like thermoplastic resin. And an image element member formed by bonding via an adhesive member having a plurality of holes which are larger than the outer dimensions of the image element array and in which the image element array is respectively arranged, and which are formed. When the misalignment occurs in the connection between the common electrode wiring of the first substrate and the common electrode of the image element array as in the image device of the above, the individual electrode of the image element array and the individual electrode wiring of the second substrate come into accurate contact. Do not use There is no drawback that the individual electrodes of (a) cannot be accurately electrically connected to the individual electrode wiring of the second substrate. The common electrode of the image element array is connected to the common electrode wiring of the first substrate, and the individual electrode is The individual electrodes of the second substrate can be accurately brought into contact with each other. As a result, the common electrodes of the image element array are securely connected to the predetermined common electrode wiring, and the individual electrodes are securely connected to the predetermined individual electrode wiring. be able to.
[0017]
According to the image apparatus of the present invention, the first substrate and the second substrate are bonded via the bonding member in a state where the individual electrode wiring of the second substrate is in contact with the individual electrodes of each image element array. By electrically connecting the individual electrodes of the image element array to the individual electrode wirings of the second substrate by doing so, even if there are a large number of individual electrodes of the image element array, all of them are connected to the individual electrode wirings of the second substrate at once. In addition, since the electrical connection is made firmly, the image device as a product is inexpensive.
[0018]
Further, according to the image apparatus of the present invention, a concave portion is provided in the first substrate and a part of the image element array is inserted into the concave portion, or a template for regulating the position of the image element array is arranged on the first substrate. By doing so, the position of the image element array on the first substrate is fixed, and as a result, the common electrodes of the image element array are easily connected to the common electrode wiring of the first substrate, and the individual electrodes are easily connected to the individual electrode wiring of the second substrate. And the workability of forming the image element member is simple and easy, and the common electrodes of the image element array are accurately connected to the predetermined common electrode wiring, and the individual electrodes are accurately connected to the predetermined individual electrode wiring. Electrical connection is possible.
[0019]
【Example】
Next, the present invention will be described in detail with reference to the accompanying drawings.
1 to 3 show an embodiment in which the image apparatus of the present invention is applied to an optical printer head as an image forming apparatus, wherein 1 is an image element member, 2 is a lens member, and 3 is a support.
[0020]
The image element member 1 comprises a first substrate 4, a plurality of light emitting diode element arrays 5, and a second substrate 6, as shown in FIG.
[0021]
The first substrate 4 functions as a support member for supporting the light emitting diode element array 5, and a plurality of light emitting diode element arrays 5 are linearly arranged and mounted on the upper surface thereof.
[0022]
The first substrate 4 is made of an aluminum oxide sintered body, crystallized glass, quartz, a glass epoxy resin, a liquid crystal polymer resin, or the like. For example, when the first substrate 4 is made of an aluminum oxide sintered body, alumina, silica, calcia, magnesia, or the like is used. A ceramic green sheet (ceramic green sheet) is obtained by adding a suitable organic solvent and a solvent to the raw material powder to form a slurry by employing a well-known doctor blade method or a calender roll method. Thereafter, the ceramic green sheet is manufactured by punching into a predetermined shape and firing at a high temperature (about 1600 ° C.).
[0023]
Further, a common electrode wiring 4a is formed on the first substrate 4 and serves to connect the common electrode 5b of the light emitting diode element array 5 to an external electric circuit.
[0024]
The common electrode wiring 4a is made of a conductive material such as aluminum or copper. The conductive material such as aluminum or copper is applied to a predetermined thickness by a vapor deposition method or a sputtering method, and is processed into a predetermined pattern by an etching method. Thereafter, the surface is nickel-plated or gold-plated to be formed on the upper surface of the first substrate 4.
[0025]
Further, the light emitting diode element array 5 arranged and mounted on the first substrate 4 includes a plurality of light emitting diode elements 5a, and the light emitting diode elements 5a individually and selectively emit light according to an external electric signal. The latent image for forming an image is formed on the photoconductor P by irradiating the photoconductor P with the light thus generated.
[0026]
As the light-emitting diode element 5a, a GaAsP-based or GaP-based light-emitting diode is used. For example, in the case of a GaAsP-based light-emitting diode, first, a GaAs substrate is heated to a high temperature in a furnace and mixed with AsH ₃ (arsine). An n-type semiconductor GaAsP (gallium-arsenic-phosphorus) single crystal is grown on the substrate surface by contacting PH ₃ (phosphine) and a gas containing an appropriate amount of Ga (gallium), and then Si _{3 is} formed on the GaAsP single crystal surface. A windowed film of N ₄ (silicon nitride) is deposited, and a window is exposed to a gas of Zn (zinc), and Zn is diffused into a part of the n-type semiconductor GaAsP single crystal to form a p-type semiconductor. , Pn junction.
[0027]
In the case of a B4 size optical printer head, 2048 (8 per mm) light emitting diode elements 5a are linearly arranged. Specifically, 64 light emitting diode elements 5a are used as one unit. By arranging 32 element arrays 5 linearly, 2048 light emitting diode elements 5a are arranged and mounted on the first substrate 4.
[0028]
On the upper surface of the light emitting diode element array 5 mounted on the first substrate 4, a second substrate 6 having individual electrode wirings 6 a on the lower surface is provided with the individual electrodes 5 c of the light emitting diode element array 5. It is arranged in a state of being in contact with.
[0029]
The second substrate 6 is made of an aluminum oxide sintered body, crystallized glass, quartz, glass epoxy resin, or the like. For example, when the second substrate 6 is made of an opaque material such as an aluminum oxide sintered body, an opening is provided at the center thereof. The opening serves as a window for forming a light passage between the light emitting diode element array 5 and a lens 7 described later. When the opening is made of a transparent material such as crystallized glass or quartz, the central region thereof is left as it is. It serves as a window for forming a light path between the array 5 and the lens 7.
[0030]
When the second substrate 6 is made of an opaque material such as an aluminum oxide sintered body, the center of the second substrate 6 is subjected to a drilling process using a laser or the like so that each light emitting diode element array 5 emits light. An opening is formed in a predetermined shape as a window for transmitting light emitted from the diode element 5a to the lens 7 side.
[0031]
The individual electrode wiring 6a formed on the lower surface of the second substrate 6 serves to electrically connect the individual electrodes 5c of the light emitting diode element array 5 to an external electric circuit. It is formed of a conductive material.
[0032]
The individual electrode wiring 6a is formed by depositing a conductive material such as aluminum or copper to a predetermined thickness on the lower surface of the second substrate 6 by a vapor deposition method, a sputtering method, or the like, and processing this into a predetermined pattern by an etching method. By applying nickel plating or gold plating on the surface, it is adhered and formed in a predetermined shape on the lower surface of the second substrate 6.
[0033]
The arrangement of the image element array between the first substrate 4 and the second substrate 6 is performed between the first substrate 4 having the common electrode wiring 4a and the second substrate 6 having the plurality of individual electrode wirings 6a. The plurality of light emitting diode element arrays 5 are arranged such that the common electrodes 5b of the light emitting diode element arrays 5 correspond to the common electrode wirings 4a of the first substrate 4 and the individual electrodes 5c correspond to the individual electrode wirings 6a of the second substrate 6, respectively. The first substrate 4 and the second substrate 6 are adhered to each other through an adhesive member 8. In this case, the light emitting diode element array 5 is disposed between the first substrate 4 and the second substrate 6, and the common electrode 5b and the individual electrode 5c of the light emitting diode element array 5 are connected to the common electrode wiring 4a of the first substrate 4 and the second electrode. Positioning can be performed so as to abut each of the individual electrode wirings 6a of the substrate 6 so that the common electrode 5b of the light emitting diode element array 5 can be very accurately positioned on the predetermined common electrode wiring 4a, and the individual electrode 5c can be precisely positioned on the predetermined individual electrode wiring 6a. Can be electrically connected. At the same time, even if the total number of the individual electrodes 5c of the light emitting diode element array 5 is large, the individual electrodes 5c can be electrically connected to the individual electrode wirings 6a of the second substrate 6 at once and firmly. You can do it.
[0034]
Further, as the bonding member 8 for bonding the first substrate 4 and the second substrate 6, for example, a sheet made of a thermoplastic elastomer such as vinyl chloride resin, ionomer resin, polyethylene, polyurethane, or polyamide is used. A hole corresponding to the light emitting diode element array 5 is made in advance in the adhesive member 8 of the above, and the light emitting diode element array 5 is arranged in the hole and inserted between the first substrate 4 and the second substrate 6 to form The first substrate 4 and the second substrate 6 are bonded.
[0035]
The image element member 1 including the first substrate 4 having the common electrode wiring 4a, the second substrate 6 having the individual electrode wiring 6a, and the light emitting diode element array 5 is provided on the upper surface of the first substrate 4 as shown in FIG. When the concave portion 4b is provided and a part of the light emitting diode element array 5 is inserted into the concave portion 4b, the position of the light emitting diode element array 5 on the first substrate 4 is fixed. The common electrode 5b of the array 5 can be easily brought into contact with the common electrode wiring 4a of the first substrate 4 and the individual electrode 5c can be easily brought into contact with the individual electrode wiring 6a of the second substrate 6, so that the workability of manufacturing the image element member 1 can be improved. Is simple and easy, and the common electrode 5b and the individual electrode 5c of the light emitting diode element array 5 are accurately electrically connected to the predetermined individual electrode wiring 6a. It becomes possible. Therefore, in order to accurately electrically connect the common electrode 5b of the light emitting diode element array 5 to the predetermined common electrode wiring 4a and the individual electrode 5c to the predetermined individual electrode wiring 6a, the concave portion 4b is provided on the upper surface of the first substrate 4. It is preferable to insert a part of the light emitting diode element array 5 into the recess 4b.
[0036]
Alternatively, a template 9 may be arranged on the first substrate as shown in FIG. 5, and the position of the light emitting diode element array 5 may be regulated by the template 9. In this case, since the position of the light emitting diode element array 5 is regulated by the template 9, the common electrode 5b of the light emitting diode element array 5 is connected to the common electrode wiring 4a of the first substrate 4, and the individual electrode 5c is connected to the individual electrode 5 of the second substrate 6. The contact can be easily made by the wiring 6a, so that the workability of manufacturing the image element member 1 is simple and easy, and the common electrode 5b of the light emitting diode element array 5 is connected to the predetermined common electrode wiring 4a by the individual electrode. 5c can be accurately and electrically connected to the predetermined individual electrode wiring 6a. Therefore, in order to accurately electrically connect the common electrode 5b of the light emitting diode element array 5 to the predetermined common electrode wiring 4a and the individual electrode 5c to the predetermined individual electrode wiring 6a, the light emitting diode element array is provided on the upper surface of the first substrate 4. It is preferable to arrange a template 9 that regulates the position of 5.
[0037]
Further, an image element member 1 composed of the first substrate 4, the light emitting diode element array 5 and the second substrate 6 is provided with a lens member 2 at an upper portion thereof at a predetermined distance, and the lens member 2 has a plurality of holes. Are composed of a lens plate 10 which is linearly arranged and a lens 7 which is adhered and fixed to the lens plate 10 via an adhesive such as a resin so as to cover the hole.
[0038]
The lens plate 10 of the lens member 2 functions as a support member for supporting the plurality of lenses 7 at predetermined intervals on the upper surface, and the holes transmit light emitted from the light emitting diode elements 5 a of the light emitting diode element array 5 to the lens 7. It acts to transmit light.
The lens plate 10 is formed of a material such as a glass epoxy resin.
[0039]
Each lens 7 supported by the lens plate 10 functions to irradiate the surface of the photoconductor P with light emitted from each light emitting diode element 5a, and is made of a transparent resin such as an acrylic resin or a polycarbonate resin, or a transparent inorganic material such as a glass. Are preferably used.
[0040]
Each of the lenses 7 is linearly bonded to the lens plate 10 at a predetermined interval by bonding a part of the outer surface to the lens plate 10 via, for example, an epoxy resin adhesive.
[0041]
Further, each of the image element member 1 and the lens member 2 is fixed to a pair of supports 3 so that each light emitting diode element array 5 and each lens 7 correspond one-to-one with a predetermined distance. Have been.
[0042]
The support 3 has a first alignment reference surface 3a at an upper portion thereof and a second alignment reference surface 3b at a lower portion thereof. The lower surface of the lens plate 10 is provided on the first alignment reference surface 3a of the support 3. By fixing the outer peripheral portion of the upper surface of the second substrate 6 of the image element member 1 to the second alignment reference plane 3b, each light emitting diode element array 5 and each lens 7 are separated from each other by a predetermined distance. 1.
Thus, according to the imaging apparatus of the present invention, a predetermined power is applied to each of the light emitting diode elements 5a of the image element member 1 so that each of the light emitting diode elements 5a selectively emits light, and each of the light emitting diode elements 5a emits light. The formed light forms an image on the surface of the external photoconductor P via the lens 7 to form a predetermined latent image on the photoconductor P, thereby functioning as an image forming apparatus.
[0043]
It should be noted that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. Although the case where the present invention is used for an apparatus has been described as an example, the present invention can be used for an image reading device such as an image sensor by changing a light emitting diode element array to an individual image sensor array.
[0044]
【The invention's effect】
According to the image device of the present invention, a plurality of image element arrays are provided between a first substrate having a common electrode wiring and a second substrate having a plurality of individual electrode wirings. Are arranged in such a manner that the individual electrodes are in contact with the common electrode wiring of the first substrate and the individual electrodes are in contact with the individual electrode wiring of the second substrate, respectively, and the first substrate and the second substrate are made of a sheet-like thermoplastic resin. And an image element member formed by bonding via an adhesive member having a plurality of holes which are larger than the outer dimensions of the image element array and in which the image element array is respectively arranged, and which are formed. When the misalignment occurs in the connection between the common electrode wiring of the first substrate and the common electrode of the image element array as in the image device of the above, the individual electrode of the image element array and the individual electrode wiring of the second substrate come into accurate contact. Do not use There is no drawback that the individual electrodes of (a) cannot be accurately electrically connected to the individual electrode wiring of the second substrate. The common electrode of the image element array is connected to the common electrode wiring of the first substrate, and the individual electrode is The individual electrodes of the second substrate can be accurately brought into contact with each other. As a result, the common electrodes of the image element array are securely connected to the predetermined common electrode wiring, and the individual electrodes are securely connected to the predetermined individual electrode wiring. be able to.
[0045]
According to the image apparatus of the present invention, the first substrate and the second substrate are bonded via the bonding member in a state where the individual electrode wiring of the second substrate is in contact with the individual electrodes of each image element array. By electrically connecting the individual electrodes of the image element array to the individual electrode wirings of the second substrate by doing so, even if there are a large number of individual electrodes of the image element array, all of them are connected to the individual electrode wirings of the second substrate at once. In addition, since the electrical connection is made firmly, the image device as a product is inexpensive.
[0046]
Further, according to the image apparatus of the present invention, a concave portion is provided in the first substrate and a part of the image element array is inserted into the concave portion, or a template for regulating the position of the image element array is arranged on the first substrate. By doing so, the position of the image element array on the first substrate is fixed, and as a result, the common electrodes of the image element array are easily connected to the common electrode wiring of the first substrate, and the individual electrodes are easily connected to the individual electrode wiring of the second substrate. And the workability of forming the image element member is simple and easy, and the common electrodes of the image element array are accurately connected to the predetermined common electrode wiring, and the individual electrodes are accurately connected to the predetermined individual electrode wiring. Electrical connection is possible.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an embodiment in which an image forming apparatus according to the present invention is employed in an optical printer head as an image forming apparatus.
FIG. 2 is a sectional view taken along line XX of FIG.
FIG. 3 is an enlarged sectional view of a main part of the image apparatus shown in FIG. 1;
FIG. 4 is an enlarged sectional view of a main part showing another embodiment of the present invention.
FIG. 5 is an enlarged sectional view of a main part showing another embodiment of the present invention.
[Explanation of symbols]
1 image element member 2 lens member 4 first substrate 4a common electrode wiring 5 light emitting diode element array 5a ... Light emitting diode element 5b... Common electrode 5c... Individual electrode 6... Second substrate 6a. Lens 8 Adhesive member 10 Lens plate P Photoconductor

Claims (3)

An image device in which a lens member composed of a plurality of lenses and an image element member having a large number of image element arrays are fixed together, wherein the image element member has a first substrate having a common electrode wiring, between the second substrate having individual electrode wires of a plurality of the picture elements array, to said first substrate and a common electrode common electrode line of the picture element array, the individual electrodes of the second substrate wherein arranged in a state of being respectively contact the individual electrode wires, and the first substrate and the second substrate is made of a sheet-like thermoplastic resin, and within the larger than the external dimension of the image element array An image apparatus, wherein the image element array is adhered via an adhesive member having a plurality of holes for arranging the image element arrays . The image element is provided with recesses on the first substrate member, an image apparatus according to claim 1, wherein a part of the image array the recess is inserted. Image apparatus according to claim 1, characterized in that the template for regulating the position of the picture element array on the first substrate of the image element member is disposed.

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