JP3604355B2 - Inspection method and inspection device for film carrier tape for mounting electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, ASIC (Application Specific Integrated Circuit) tape, COF (Chip On Film) tape, etc.) (hereinafter simply referred to as “electronic component mounting film carrier tape”). The present invention relates to a method and an apparatus for inspecting a film carrier tape for mounting electronic components for inspecting a wiring pattern which is about to be lost.
[0002]
[Prior art]
With the development of the electronics industry, demand for printed wiring boards on which electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) are mounted has been rapidly increasing. There is a demand for higher functionality, and as a mounting method of these electronic components, a mounting method using a TAB tape, a T-BGA tape, an ASIC tape, a COF tape, or the like has recently been adopted. In particular, the importance thereof is increasing in the electronic industry using a liquid crystal display device (LCD), such as a personal computer, which requires high definition, thinness, and a narrow frame area of a liquid crystal screen.
[0003]
A method for manufacturing such a film carrier tape for mounting electronic components will be described.
[0004]
Here, first, a plurality of transport sprocket holes are continuously formed in the longitudinal direction of the insulating film by punching or the like an insulating film serving as a base material such as a polyimide film, and an adhesive or the like is formed on the surface of the insulating film. The conductive layer is formed by sticking the copper foil by thermocompression bonding. Next, a photoresist is applied to the entire surface or a part of the conductive layer, and the photoresist is exposed to ultraviolet light or the like through a photomask having a desired pattern shape, and the exposed photoresist portion is dissolved by a developer. Remove. Next, the conductive layer that is not covered with the photoresist is removed by chemically dissolving (etching) with an acidic solution as an etchant, and the photoresist is dissolved and removed with an alkaline solution. Thereby, a desired wiring pattern made of the conductive layer remaining on the insulating film is formed.
[0005]
Then, a short circuit due to dust, whiskers, or migration during mounting of the electronic component is prevented, and the wiring pattern is covered with a solder resist layer for protection and insulation between the wiring patterns. Specifically, in a wiring pattern, except for an inner lead portion connected to an electronic component such as an IC and an outer lead portion connected to an external terminal, a solder resist that is an insulating resin is applied, for example. Then, a solder resist layer is formed by a screen printing method.
[0006]
After the formation of the solder resist layer in this manner, the exposed lead portions are subjected to, for example, tin plating, gold plating, eutectic alloy plating of tin-lead, or the like to obtain a film carrier tape for mounting electronic components. This plating is performed to prevent oxidation and discoloration of the exposed lead portions and to secure bonding strength at each lead portion.
[0007]
By the way, in each step and final step of manufacturing such a film carrier tape for mounting an electronic component, quality inspection, for example, quality inspection of a wiring pattern is performed. In recent years, a more efficient and accurate inspection method can be performed by bringing a pair of probe pins into contact with a wiring pattern provided on one surface of a film carrier tape for mounting an electronic component, so that the distance between the wiring patterns can be reduced. There is a method of electrically inspecting for disconnection and short-circuit, or insulation resistance between adjacent wiring patterns.
[0008]
[Problems to be solved by the invention]
However, such an inspection method can surely detect a broken wiring pattern, but cannot detect a wiring pattern that is about to be broken due to a defect in the wiring pattern or the like. Therefore, when the electronic component mounting film carrier tape is bent and used, there is a problem that a defect such as disconnection of a wiring pattern occurs.
[0009]
Further, in recent years, film carrier tapes for mounting electronic components have become thinner, and fine pitches of wiring patterns have been rapidly progressing, so that defects such as disconnection due to bending of the film carrier tapes for mounting electronic components have increased. There is a problem that there is.
[0010]
In view of such circumstances, an object of the present invention is to provide an inspection method and an inspection apparatus for an electronic component mounting film carrier tape that can prevent the occurrence of a defect in the electronic component mounting film carrier tape.
[0011]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided an electronic component for detecting a conductive state of a wiring pattern of a film carrier tape for mounting an electronic component by applying a potential by bringing a pair of probe pins into contact with the wiring pattern. In the method for inspecting a mounting film carrier tape, detecting a conduction state of the wiring pattern in a state where a portion corresponding to the wiring pattern between the pair of probe pins of the electronic component mounting film carrier tape is bent. An inspection method for a film carrier tape for mounting electronic components, characterized in that:
[0012]
In the first aspect, it is possible to reliably detect a wiring pattern that may be disconnected when the film carrier tape for mounting electronic components is bent and used, such as a defective wiring pattern.
[0013]
According to a second aspect of the present invention, in the first aspect, a member having at least one convex portion is provided on any one surface side of the electronic component mounting film carrier tape, and the convex portion is provided on the other surface side. Inspecting a film carrier tape for mounting an electronic component, comprising: providing a member having at least one concave portion sandwiching the film carrier tape, and holding and bending the film carrier tape for mounting an electronic component between the convex portion and the concave portion. In the way.
[0014]
In the second aspect, the projections and the depressions can relatively easily bend the film carrier tape for mounting electronic components.
[0015]
According to a third aspect of the present invention, in the first or second aspect, the pair of probe pins are brought into contact with an outer lead portion, which is a portion connecting the external pins of the wiring, and an inner lead portion to which an electronic component is connected. And detecting the conduction state of the film carrier tape for mounting electronic components.
[0016]
In the third aspect, the conduction state of each wiring can be accurately detected.
[0017]
According to a fourth aspect of the present invention, in the first or the second aspect, each of the outer lead portions, which are connection portions between the inner lead portions to which the electronic components are connected and the external terminals of the wiring connected by the conductive terminals , are provided. In addition, there is provided a method for inspecting a film carrier tape for mounting electronic components, wherein the conductive state is detected by connecting the pair of probe pins.
[0018]
In the fourth aspect, the conduction state of each wiring can be efficiently detected.
[0019]
A fifth aspect of the present invention, in the fourth aspect, applying a bending between the conducting said respective inner lead portions wires are connected to each other the inner lead portions by terminal and the outer lead portions An inspection method for a film carrier tape for mounting electronic components, characterized in that:
[0020]
In the fifth aspect, when the electronic component mounting film carrier tape is bent and used, it is possible to reliably and efficiently detect a wiring pattern that may be disconnected.
[0021]
According to a sixth aspect of the present invention, there is provided a film carrier tape for mounting an electronic component, which detects a conduction state of the wiring pattern by applying a potential by bringing a pair of probe pins into contact with the wiring pattern of the film carrier tape for mounting an electronic component. In the inspection device of (1), a film carrier tape for mounting electronic components, characterized in that the film carrier tape for mounting electronic components has bending means for bending a portion corresponding to the wiring pattern between the pair of probe pins. Inspection equipment.
[0022]
According to the sixth aspect, when the film carrier tape for mounting electronic components is bent and used, such as a defective wiring pattern, a wiring pattern that may be disconnected can be reliably detected.
[0023]
According to a seventh aspect of the present invention, in the sixth aspect, the bending member has a convex member having at least one convex portion provided on any one surface side of the electronic component mounting film carrier tape, And a concave material having at least one concave portion sandwiching the convex portion and provided on the side of the film carrier tape.
[0024]
In the seventh aspect, it is possible to relatively easily impart bending to the film carrier tape for mounting electronic components by the projections and the depressions.
[0025]
According to an eighth aspect of the present invention, in the sixth or seventh aspect, there is provided a conduction terminal that connects the other end of another wiring in which each of the pair of probe pins is connected to one end and conducts the connection. An inspection apparatus for a film carrier tape for mounting electronic components, characterized in that:
[0026]
In the eighth aspect, the conductive state of the wiring can be accurately and efficiently detected.
[0027]
A ninth aspect of the present invention is the electronic component mounting film carrier tape according to the eighth aspect, wherein the electronic component mounting film carrier tape is provided with a device hole therethrough, and the wiring projects in the device hole. When connecting the conduction terminal to the wirings protruding into the device hole, a support member for supporting the wiring from a surface of the wiring opposite to a surface contacting the conduction terminal is provided. A feature is an inspection device for a film carrier tape for mounting electronic components.
[0028]
In the ninth aspect, since the wiring is supported by the support member, the wiring can be prevented from being deformed, and the wiring and the conductive terminal can be brought into good contact.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments.
[0030]
FIG. 1 shows a schematic configuration of an inspection device for a film carrier tape for mounting electronic components according to an embodiment of the present invention.
[0031]
As shown in FIG. 1, an inspection device 10 for a film carrier tape for mounting electronic components (hereinafter simply referred to as a film carrier tape) is a delivery unit for delivering a film carrier tape 1 of a type such as, for example, TAB, CSP, COF. 20, a pattern inspection unit 30 for inspecting a defect of a wiring pattern, and a winding unit 40 for winding the film carrier tape 1 after the inspection.
[0032]
The delivery section 20 is provided with a reel 21 on which the film carrier tape 1 is wound via a spacer tape (not shown) and a delivery drive shaft 22 on which the reel 21 is mounted. When driven by a drive motor or the like, the film carrier tape 1 is sent out and conveyed to the pattern inspection unit 30 via the guide roller 11.
[0033]
The pattern inspection unit 30 is provided with an inspection stage 31 and a fixing member 34 to which the pair of probe pins 32 and 33 are fixed, and the film carrier tape 1 positioned between the inspection stage 31 and the fixing member 34. A continuity test is performed by bringing a pair of probe pins 32 and 33 into contact with the wiring pattern and applying a potential between both probe pins 32 and 33. The pattern inspection unit 30 will be described later in detail.
[0034]
The winding unit 40 is provided with a reel 41 for winding the film carrier tape 1 and a winding drive shaft 42 on which the reel 41 is mounted. The carrier tape 1 is wound around a reel 41 via a guide roller 11.
[0035]
A marking unit (not shown) may be provided at the defective portion of the wiring pattern based on the defective portion detection information detected by the pattern inspection unit 30 to perform marking indicating that the wiring pattern cannot be used by ink, punch, or the like. .
[0036]
In the present embodiment, the continuity test of the wiring pattern of the film carrier tape 1 is performed by using such an inspection device 10. At this time, by providing the film carrier tape 1 with a bend, a more reliable continuity test is performed. Testing has been done.
[0037]
Hereinafter, the pattern inspection unit 30 that performs the continuity test will be described in detail. FIG. 2 is a schematic diagram showing the pattern inspection unit.
[0038]
As shown in FIG. 2, an inspection stage 31 and a fixing member 34 to which a pair of probe pins 32 and 33 are fixed are arranged in the pattern inspection unit 30 so as to be movable in the vertical direction. I have.
[0039]
The pair of probe pins 32 and 33 are for contacting with the wiring pattern 4 of the film carrier tape 1 to apply a potential, and in this embodiment, are connected to one end of the wiring pattern 4, that is, to an external terminal. It is fixed to the fixing member 34 so as to face the pad portions 6 provided at the ends of the outer leads 4b, which are the portions.
[0040]
Further, the other end of the wiring to which the pair of probe pins 32 and 33 are connected, that is, the fixing member 34 in a region opposed to the inner lead 4 a portion which is a portion to which the electronic component of the wiring pattern 4 is connected, A connection terminal 25 for connecting and electrically connecting the wires to which the pair of probe pins 32 and 33 abut is fixed.
[0041]
Further, the inspection stage 31 is provided with a convex portion 26 protruding toward the fixing member 34 over the width direction of the film carrier tape 1. The height of the convex portion 26 may be determined as appropriate, and for example, is set to about 240 μm in the present embodiment.
[0042]
On the other hand, the fixing member 34 is provided with a concave portion 27 so as to sandwich the convex portion 26. For example, in the present embodiment, two wall members 28 protruding toward the fixing member 34 are provided on the fixing member 34 in a region facing the widthwise outside of the projection 26, and the recess 27 is defined by these wall members 28. Done. The method of forming the concave portion 27 is not particularly limited. For example, as shown in FIG. 3, a part of the fixing member 34 in the thickness direction may be removed to form the concave portion 27A.
[0043]
Then, the conduction test is performed in a state where the film carrier tape 1 is held between the inspection stage 31 having the convex portion 26 and the fixing member 34 having the concave portion 27 to bend at a predetermined position. The method of the continuity test will be described later in detail.
[0044]
Here, an example of a film carrier tape on which a continuity test is performed by such an inspection device will be described. FIG. 4 is a front view and a cross-sectional view illustrating an example of a film carrier tape.
[0045]
As shown in FIGS. 4A and 4B, the film carrier tape 1 is a wiring comprising a tape-shaped insulating film 2 and a conductive layer 3 attached to the surface of the insulating film 2 via an adhesive layer. Pattern 4. Sprocket holes 5 are provided on both sides of the wiring pattern 4 in the width direction. Further, the wiring pattern 4 is provided with an inner lead portion 4a which is a connection portion with an electronic component, and an outer lead portion 4b which is a connection portion with an external terminal of the wiring pattern 4, and an end portion of the outer lead portion 4b. Is provided with a pad portion 6 for connection to an external terminal. Further, on the wiring pattern 4, a solder resist layer 7 made of a solder resist material is formed in a region excluding the inner lead portion 4a and the outer lead portion 4b. In addition, as shown in FIG. 4C, a device hole 8 may be provided in a portion where the electronic component is mounted, through the insulating film 2 or the like.
[0046]
Hereinafter, a method for inspecting such a film carrier tape, specifically, a method for testing the continuity of the wiring pattern of the film carrier tape using the inspection apparatus of the present invention will be described in detail.
[0047]
First, the film carrier tape 1 conveyed from the feeding section 20 is guided substantially horizontally by a back tension gear and a drive gear (not shown), and then inspected by temporarily stopping the drive gear and reversing the back tension gear. It is positioned at a predetermined position between the stage 31 and the fixing member 34.
[0048]
Next, the inspection stage 31 provided with the convex portion 26 is raised, and the fixing member 34 provided with the pair of probe pins 32 and 33 and the conduction terminal 25 is lowered, so that the convex portion 26 and the concave portion 27 are separated. By holding the film carrier tape 1, bending is applied to a predetermined position (see FIG. 2). At the same time, the pair of probe pins 32 and 33 are brought into contact with the pad portion 6 provided at the end of the outer lead portion 4b of the wiring pattern 4, and the conduction terminal 25 is brought into contact with the inner lead portion 4a.
[0049]
Next, in the state where the bending is applied, a potential is applied to the wiring pattern 4 through the pair of probe pins 32 and 33 to conduct a continuity test of the wiring pattern 4. Here, in the continuity test, specifically, the presence or absence of disconnection of the wiring pattern 4 is inspected by applying a potential to both ends of the wiring pattern 4. In addition, in addition, a short check is performed in which a potential is applied between the adjacent pad portions 6 to check whether there is a short circuit between the adjacent wirings.
[0050]
When the continuity test of the wiring pattern 4 is completed in this way, the film carrier tape 1 is transported to the winding unit 40 and wound on the reel 41.
[0051]
As described above, in the present embodiment, the conduction test is performed in a state where the area corresponding to the wiring pattern 4 of the film carrier tape 1 is bent, so that the bending is applied together with the completely disconnected wiring. This makes it possible to detect a wiring that may be disconnected. That is, it is possible to positively disconnect the wire by giving a bend to the disconnected wire such as the defective wiring pattern 4 and to detect this. Thereby, when the film carrier tape 1 is used in a bent state, there is no possibility that a defect occurs, and the film carrier tape 1 with improved reliability can be realized.
[0052]
Further, by repeatedly performing such a continuity test, a defect of each wiring pattern 4 of the film carrier tape can be continuously and automatically detected, and a large number of inspections can be performed in a relatively short time.
[0053]
In the present embodiment, the bend is applied to one portion of the film carrier tape 1. However, the present invention is not limited to this. For example, as shown in FIG. The film carrier tape 1 may be bent at a plurality of positions. The bending is preferably applied to a place where the bending may be applied after the electronic component is mounted, and it is sufficient if the bending is applied to a possible location.
[0054]
In the present embodiment, the pair of probe pins 32 and 33 are brought into contact with the outer lead portion 4b (pad portion 6) of the wiring pattern, and the inner lead portions 4a of the wiring contacted by the pair of probe pins 32 and 33 are connected to each other. Are conducted by the conduction terminal 25 to conduct the conduction test. However, the present invention is not limited to this. For example, as shown in FIG. 6, a pair of probe pins 32A and 33A are connected to the inner lead portion 4a and the outer The continuity test may be performed for each wiring by contacting the lead portion 4b (pad portion 6).
[0055]
When the film carrier tape 1 is provided with a device hole 8 through which the inner lead portion 4a protrudes (see FIG. 4C), as shown in FIG. A support member 29 for supporting the inner lead portion 4a from the opposite side may be provided. Accordingly, when the pair of probe pins 32, 33 or the conduction terminal 25 is brought into contact with the inner lead portion 4a, the inner lead portion 4a can be satisfactorily contacted without being deformed.
[0056]
【The invention's effect】
As described above, according to the present invention, the defect of the wiring pattern of the electronic component mounting film carrier tape can be easily detected, and the defective wiring pattern due to the use of the electronic component mounting film carrier tape after being bent is used. It can be prevented from occurring.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a schematic configuration of an inspection device for a film carrier tape for mounting electronic components according to an embodiment of the present invention.
FIG. 2 is a view showing a defective pattern inspection unit of the inspection device for an electronic component mounting film carrier tape according to an embodiment of the present invention.
FIG. 3 is an enlarged view of a main part of a defective pattern inspection section of a film carrier tape for mounting electronic components according to an embodiment of the present invention.
FIG. 4 is a view showing an example of an electronic component mounting film carrier tape to be inspected by the electronic component mounting film carrier tape inspection apparatus of the present invention, wherein (a) is a front view and (b) and (c). Is a sectional view.
FIG. 5 is a diagram showing another example of the defective pattern inspection unit of the inspection device for an electronic component mounting film carrier tape according to one embodiment of the present invention.
FIG. 6 is a view showing another example of the defective pattern inspection section of the inspection device for the film carrier tape for mounting electronic components according to the embodiment of the present invention.
FIG. 7 is a view showing another example of the defective pattern inspection unit of the inspection device for the film carrier tape for mounting electronic components according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Film carrier tape 2 Insulating film 4 Wiring pattern 4a Inner lead part 4b Outer lead part 6 Pad part 7 Solder resist layer 8 Device hole 10 Inspection device 20 Sending part 25 Conduction terminal 26 Convex part 27 Depression 28 Wall member 29 Support member 30 Pattern inspection unit 31 Inspection stages 32 and 33 Probe pin 34 Fixing member 40 Winding unit

Claims (9)

In the inspection method of the electronic component mounting film carrier tape for detecting the conductive state of the wiring pattern by applying a potential by contacting a pair of probe pins to the wiring pattern of the electronic component mounting film carrier tape,
Detecting a conduction state of the wiring pattern in a state where a portion corresponding to the wiring pattern between the pair of probe pins of the electronic component mounting film carrier tape is bent. Inspection method of tape. 2. The electronic component mounting film carrier tape according to claim 1, wherein a member having at least one protrusion is provided on any one side of the film carrier tape, and a member having at least one concave portion sandwiching the protrusion is provided on the other side. A method of inspecting a film carrier tape for mounting an electronic component, wherein the projection and the recess hold the film carrier tape for mounting an electronic component to bend. 3. The conductive state according to claim 1, wherein the conductive state is detected by contacting an outer lead portion that connects the pair of probe pins to an external terminal of a wiring and an inner lead portion to which an electronic component is connected. Inspection method for film carrier tape for mounting electronic components. The pair of probe pins according to claim 1 or 2, wherein the pair of probe pins is connected to each of the outer lead portions, which are connection portions between the inner lead portions to which the electronic components are connected and the external terminals of the wiring connected by the conduction terminals. A method for inspecting a film carrier tape for mounting electronic components, comprising detecting a conduction state. In claim 4, the electronic component mounting film carrier, which comprises applying a bending between the said conductive terminals and said inner lead portions are connected to the wiring each of the inner lead portion and the outer lead portions Inspection method of tape. In the electronic component mounting film carrier tape inspection device for detecting the conduction state of the wiring pattern by applying a potential by contacting a pair of probe pins to the wiring pattern of the electronic component mounting film carrier tape,
An inspection device for an electronic component mounting film carrier tape, comprising a bending means for applying a bending to a portion corresponding to the wiring pattern between the pair of probe pins of the electronic component mounting film carrier tape. 7. The method according to claim 6, wherein the bending unit includes a convex member having at least one convex portion provided on any one surface side of the electronic component mounting film carrier tape and the convex portion provided on the other surface side. An inspection device for a film carrier tape for mounting electronic components, comprising: a concave material having at least one concave portion sandwiched therebetween. 8. The electronic component mounting device according to claim 6, further comprising a conduction terminal for connecting and electrically connecting the other ends of another pair of wires each connected to one end of the pair of probe pins. Inspection equipment for film carrier tape. 9. The electronic component mounting film carrier tape according to claim 8, wherein a device hole is provided through the film carrier tape, and the wiring protrudes into the device hole, and the conduction terminal protrudes into the device hole. A film carrier tape for electronic component mounting, comprising: a support member that supports the wiring from a surface of the wiring opposite to a surface that contacts the conductive terminal when the wiring is connected to each other. Inspection equipment.

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