JP3604789B2 - Connection structure of printed wiring board and optical apparatus having the connection structure - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection structure of a printed wiring board and an optical device having the connection structure, and more particularly, to a connection between a flexible printed board (hereinafter abbreviated as flexible) and another printed wiring board (flexible or rigid board). The present invention relates to a printed wiring board connection structure capable of performing a good connection without increasing the thickness of a connection portion and without the possibility of peeling, and an optical apparatus having the connection structure.
[0002]
[Prior art]
When electrically connecting the flexible board to the rigid board or as a method for electrically connecting the flexible boards, there are two methods: (1) a connector-using connection method using a connector, and (2) a connection terminal between the two without using a connector. And a direct connection method in which they are directly melt-bonded.
[0003]
FIG. 4 is a diagram showing a cross section of a main part of a direct connection structure between a flexible board 41 and a rigid board 44 which is implemented in electrical mounting in a lens barrel for a single-lens reflex camera. In the figure, reference numeral 42 denotes a connection terminal pattern formed on the flexible 41, reference numeral 45 denotes a reinforcing pattern formed around a positioning hole (not shown), reference numeral 46 denotes a coverlay of the flexible 41, and reference numeral 44 denotes a connection with the flexible 41. The rigid substrate 43 is a connection terminal pattern formed on the surface of the rigid substrate 44. The connection terminal patterns 42 and 43 of both are solder-plated in a known manner, and in the direct connection method described above, the two patterns 42 and 43 are connected to each other by pressing the two together and heating to melt the solder of the pattern. The electrical connection between the flexible board 41 and the rigid board 44 is performed by bonding.
[0004]
[Problems to be solved by the invention]
The above methods (1) and (2) have the following problems.
[0005]
(1) In the connector-using connection structure of (1), since the thickness of the connector is large, the thickness of the electrical connection portion between the two substrates is increased. Therefore, it is necessary to increase the thickness of the electrical connection portion between the two substrates. This cannot be performed for equipment that cannot be used. In addition, when the board to be inserted into the connector is flexible (as is often the case), it becomes difficult to insert the connector into the connector of the flexible board unless it is lined with a hard insulating plate. There is a problem that the backing of the insulating plate is costly.
[0006]
(2) The method (2) in which the connection terminals of the two printed wiring boards are heat-fused to each other has the following problems.
[0007]
1) A highly accurate positioning operation is required to position the connection terminals of both substrates so as to match each other exactly.
[0008]
2) The flatness of the connection terminal arrangement portion where the respective connection terminals of the flexible board 41 and the rigid board 44 are arranged is required. However, the positioning holes around which the reinforcing patterns are formed are covered with the coverlay 46 and the reinforcing patterns 45. Therefore, the positioning hole needs to be provided at a position far away from the connection terminal disposing portion because the thickness becomes larger than the thickness of the connection terminal disposing portion. For this reason, the required area of the interconnecting portion is increased, and the size of the device is increased. In addition, when the two substrates were heated for bonding, the entire bonded portion could not be heated to a uniform temperature, and there was a high risk of peeling after bonding in portions where the temperature during heating was low.
[0009]
Similarly, even when the number of connection terminals is large, the area of the connection terminal arrangement portion becomes large, which not only causes an increase in the size of the device but also makes it difficult to bring the entire connection terminal arrangement portion to a uniform temperature. There was a risk of peeling after bonding.
[0010]
3) When the positioning hole is disposed immediately beside the connection terminal arranging portion in order to reduce the area of the interconnecting portion between the two substrates, the thickness of the portion around the positioning hole is reduced as described above. Since the thickness is much larger than the thickness of the arrangement portion, when heated for bonding the two substrates, a temperature difference occurs between the thin portion and the thick portion, and the bonding strength around the positioning hole is significantly deteriorated. The risk of peeling from the part was high. Therefore, when the heating temperature is increased in order to sufficiently melt the solder around the positioning hole, the solder of the connection terminal fluidizes more than necessary and a solder bridge is formed between the adjacent connection terminal and the adjacent connection. There is a risk that a problem of causing a short circuit between terminals may occur.
[0011]
[Object of the invention]
An object of the present invention is to provide a connection structure in which two connection terminals of two printed wiring boards are directly melt-bonded to each other to electrically connect the two substrates, so that the positioning hole is located at a position close to the connection terminal arrangement portion. The heating and pressurizing area is reduced by providing Do It is an object of the present invention to provide an improved connection structure that enables uniform joining.
[0012]
further, Claim 1 The object of the invention is to form a reinforcing pattern around the positioning hole in order to prevent breakage that may occur in the positioning hole, and to improve the flatness of the connection terminal arrangement portion at the time of joining. It is to provide a connection structure that can be used.
[0013]
Claim 2 It is an object of the present invention to provide a connection structure in which both substrates are joined with high joining strength so that the joints are not separated after joining the connection terminals of the two substrates.
[0014]
Claim 3 An object of the present invention is to provide a connection structure capable of preventing a short circuit due to a solder bridge from occurring between adjacent connection terminals when the connection terminals of the two substrates are joined to each other.
[0015]
Claim 4 An object of the present invention is to provide an optical device having a connection structure for directly fusing and joining respective connection terminals of a printed wiring board and a flexible printed board without increasing the area of the joint between the two substrates without increasing the size of the connection terminals. An object of the present invention is to provide an optical device having a connection structure capable of increasing the bonding strength of the optical device.
[0016]
further, Claim 4 SUMMARY OF THE INVENTION An object of the present invention is to provide an optical apparatus having a connection structure for directly fusing and joining respective connection terminals of a printed wiring board and a flexible printed circuit board without causing breakage around a positioning hole provided near the connection terminal. An object of the present invention is to provide an optical device having a structure.
[0017]
Claim 5 An object of the present invention is to provide an optical device having a connection structure having a high bonding strength in an optical device having a connection structure in which respective connection terminals of a printed wiring board and a flexible printed board are directly melt-bonded. is there.
[0018]
Claim 6 SUMMARY OF THE INVENTION An object of the present invention is to provide an optical device having a connection structure for directly fusing and joining respective connection terminals of a printed wiring board and a flexible printed board so that a short circuit due to a solder bridge can be prevented from occurring at the time of joining. An object of the present invention is to provide an optical device having a structure.
[0019]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is based on “the connection terminals of the first and second printed wiring boards. To Heat fusion bonding with each other Do By , Both printed wiring boards To Electrically connected to each other Do In the printed wiring board connection structure, the first printed wiring board includes a plurality of first connection terminals, and first positioning holes formed at radially outer positions at both ends of the first connection terminals. When And the second printed wiring board is configured as a flexible printed circuit board. , A number of second connection terminals superimposed on the first connection terminal, and second second connection terminals formed at radially outer positions at both ends of the second connection terminal and superimposed on the first positioning hole. Positioning hole When Has, A reinforcing pattern for increasing the bonding strength is formed around the second positioning hole, Around the positioning hole Reinforcement pattern And said Second A connection terminal and the connection structure are exposed as a single coverlay uncovered area.
[0020]
According to the present invention, the positioning hole is connected to the connection end. Of child Since they are arranged at radially outer positions at both ends, the area to be heated and pressed at the time of joining the two substrates can be reduced, so that the joint portion between the two substrates can be heated to a substantially uniform temperature, After joining, a decrease in the strength of the joined portion can be prevented. In the flexible printed circuit board, the connection end With child Since the periphery of the positioning hole is exposed as a coverlay uncovered area, the flatness of the portion to be joined is increased, so that the joining that does not easily peel after joining can be performed.
[0022]
further, According to the present invention, since the connection terminal and the reinforcing pattern are on the same plane, the pressure distribution in the pressurized state at the time of joining is uniform, so that the joining structure is high and the peeling does not occur. Is provided.
[0023]
Claims to achieve the purpose 2 The invention of "Claims 1 In the printed wiring board connection structure of the first, the first and second connection terminal placement portion in the longitudinal direction of the first and second connection terminal placement portion in the longitudinal direction of the first and second for increasing the bonding strength. Are provided, and the second reinforcing terminal is formed so as to be continuous with the reinforcing pattern.
[0024]
According to the present invention, since the reinforcing pattern is formed so as to be continuous with the second reinforcing terminal, when the two connection terminals are melt-pressed to each other, the excess molten solder of the two reinforcing terminals is removed from the reinforcing pattern. Therefore, there is no risk of a solder bridge between adjacent connection terminals, and when the amount of solder of both reinforcing terminals is small, molten solder flows from the reinforcing pattern, so that a high-precision bonding state and high bonding Strength is obtained.
[0025]
Claims to achieve the purpose 3 According to the invention, "in the printed wiring board connection structure of claim 1, the length of the second connection terminal (that is, the connection terminal of the non-flexible printed wiring board) is equal to the length of the first connection terminal (flexible Connection structure of a printed wiring board characterized by being longer than the connection terminal).
[0026]
According to the present invention, when the two connection terminals are melt-pressed to each other, excess molten solder flows along the second connection terminal, so that there is no possibility that a solder bridge is generated at the first connection terminal, and a good connection is obtained. It can be performed.
[0027]
Claims to achieve the purpose 4 The invention discloses that "the first and second printed wiring boards are built-in, and the first and second printed wiring boards are electrically connected to each other by heating and fusion-bonding respective connection terminals to each other, so that the two printed wiring boards are electrically connected to each other. In an optical device in which at least one of the printed circuit boards is a flexible printed circuit board, the first printed circuit board has a large number of first connection terminals and radial directions at both ends of the first connection terminals. First positioning hole formed at the outer position When The second printed wiring board has a plurality of second connection terminals superimposed on the first connection terminals, and is formed at radially outer positions at both ends of the second connection terminals. A second positioning hole superimposed on the first positioning hole When Has, A reinforcing pattern for increasing the bonding strength is formed around the second positioning hole, Around the positioning hole Reinforcement pattern And said Second Connection terminals are exposed as a single coverlay uncovered area And Optical equipment characterized in that
[0028]
According to the present invention, in an optical apparatus having a connection structure for electrically connecting a flexible board and a rigid board or a flexible board to each other by directly joining them, positioning holes are provided at radially outer positions at both ends of the connection terminal arrangement portion. Is provided, it is possible to reduce the size of the heating and pressurizing surface at the time of joining the two, and therefore, it is possible to provide an optical device having a connection structure having a high joining strength and hardly causing peeling.
[0030]
further, According to the present invention, since the connection terminal of the flexible cable and the reinforcing pattern are flush with each other, the planar portion of the joint is large at the time of bonding the flexible cable and the printed wiring board. An optical instrument is provided.
[0031]
Claims to achieve the purpose 5 The invention of "Claims 4 In the optical device having the configuration of (1), reinforcing terminals for increasing the bonding strength with the other printed wiring board are arranged at both ends in the longitudinal direction of the connection terminal disposing portion having an arc shape, The optical device "is characterized in that the terminal is formed so as to be continuous with the reinforcing pattern.
[0032]
According to the present invention, since the reinforcing pattern is formed so as to be continuous with the reinforcing terminal, excess fusion solder of the reinforcing terminal flows toward the reinforcing pattern when the connection terminals are melt-pressed to each other, When there is no risk of a solder bridge between adjacent connection terminals, and when the amount of solder in the reinforcement terminals is small, the molten solder flows from the reinforcement pattern. Optical device is provided.
[0033]
Claims to achieve the purpose 6 The invention of "Claims 4 In the optical device having the above configuration, the length of the connection terminal of the printed wiring board which is not the flexible printed board is longer than the length of the connection terminal of the flexible printed board.
[0034]
According to the present invention, since the connection terminal of the printed wiring board which is not the flexible printed board is long, the solder bridge of the connection terminal of the flexible printed board flows along the connection terminal of the printed wiring board at the time of joining, so that a solder bridge is generated. Therefore, it is possible to provide an optical device having a connection structure that does not cause a short circuit.
[0035]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described below with reference to FIGS.
[0036]
1 to 3 show a connection structure of a printed wiring board configured by applying the present invention, and a lens barrel for a single-lens reflex camera as an optical device having the connection structure.
[0037]
The lens barrel shown in FIG. 3 is configured as a zoom lens barrel with an image stabilizing function incorporating an image blur prevention device (image stabilizing device). In the figure, the figure above the center axis of the lens barrel is a cross-sectional view when the angle of view of the lens barrel is set to a wide angle state (wide), and the figure below the center axis is the image of the lens barrel. FIG. 4 is a cross-sectional view when the angle is set to a telephoto state (telephoto).
[0038]
In FIG. 1, reference numeral 1 denotes a first-group lens holding barrel that holds the first-group lens L1 and rotates while moving along the optical axis direction. A manually operated ring 3 that can be rotated only by hand and has a grip portion that is operated by the camera user's hand on the outer peripheral surface, and a zoom ring that is fitted on the ring 2 so that it can be rotated only. Reference numeral 4 denotes an anti-vibration switch provided on the lens barrel exterior body, reference numeral 5 denotes an AF (automatic focusing) / MF (manual focusing) switching operation switch also provided on the lens barrel exterior body, and reference numeral 6 denotes the lens mirror. A known mount 7 for mounting the tube on a camera body (not shown) is mounted on the mount 6 for connecting an electronic circuit and a power supply in the camera body (not shown) with an electronic circuit and motors in the lens barrel. A known electrical contact block provided, 8 A circuit board (hereinafter, abbreviated as a main board) constituting an electronic circuit provided in the lens barrel, 9 is a vibration sensor that constitutes a part of the above-described vibration isolator, that is, a vibration detecting device, 10 is An image blur correction actuator unit 11 for finely moving the image blur correction lens L2 in a direction orthogonal to the optical axis to correct the image blur on the image forming surface, and controls the image blur correction actuator unit 10. Image correction electronic circuit board (hereinafter abbreviated as sub-substrate) on which electronic circuits are mounted, and electronic circuit board 12 having both ends connected to main board 8 and sub-board 11 A flexure 13 described later disposed in the lens barrel for signal transmission and power supply between them, an electromagnetic actuator 13 for a diaphragm device controlled by an electronic circuit on the main board 8 via a flexure (not shown), and a flexure 14 An annular decorative plate attached to the front of the image blur correction unit to cover the substrate 11 and the like from the front of the lens barrel, L3 is a third lens group, L4 is a fourth lens group, and L5 is a fifth lens lens. , L6 is a sixth group lens.
[0039]
The image blur correction lens L2, the actuator unit 10, the sub-substrate 11, and the like constitute a known image blur correction unit. The operation of this known image blur correction unit is already well-known, and therefore the description is omitted.
[0040]
FIG. 1 shows an enlarged view of the connection structure between the tip of the flexible 12 and the sub-substrate 11 in the above-mentioned lens barrel. In this drawing, the sub-substrate 11 is drawn in a perspective view from the back side of the connection surface with the flexible 12, and the illustration of the wiring pattern on the back side of the connection surface that should be originally seen and the electrical components and the like on the substrate are omitted. It is.
[0041]
The sub-substrate 11 is adhered and fixed to an annular end plate surface at the front end of a lens barrel carrying an image blur correction unit, and has a connection terminal arrangement portion formed in an arc shape. A large number of connection terminals 24 extending in a direction perpendicular to the arc of the arrangement portion (that is, substantially in a radial direction with respect to the center of curvature of the arc) are arranged at regular intervals and in a comb-like shape in the connection terminal arrangement portion, Reinforcement terminals 25 (which are electrically independent of the connection terminals 24) for increasing the bonding strength with the flexible 12 are formed at both ends of the arc-shaped connection terminal arrangement portion.
[0042]
The positioning holes 21 and 22, the reinforcing terminals 25, and the connection terminals 24 are exposed in a single opening region 23.
[0043]
In addition, independent reinforcing patterns 26 and 27 are formed in an island shape, and the reinforcing patterns 26 and 27 further strengthen the bonding strength between the flexible 12 and the substrate 11.
[0044]
Next, the flexible member 12 bonded to the sub-substrate 11 will be described with reference to FIGS. FIG. 2 shows the entire planar shape of the flexible 12. The flexure 12 has an arc-shaped connection terminal arrangement portion 38 which is superimposed on the connection terminal arrangement portion of the sub-substrate 11, a connection terminal arrangement portion 39 which is joined to the above-mentioned main substrate 8, and an image blur correction device. A connection terminal arrangement portion 37 connected to the actuator unit 10. The connection terminal arranging portion 38 superposed on the connection terminal arranging portion of the sub-substrate 11 is formed in an arc shape having the same curvature as the connection terminal arranging portion of the sub-substrate 11, and has the same circumferential length and the same configuration. ing.
[0045]
A large number of connection terminals 31 extending in a direction perpendicular to the arc of the arrangement portion (that is, in a substantially radial direction with respect to the center of curvature of the arc) are arranged at regular intervals in the connection terminal arrangement portion 38 formed in an arc shape. When the connection terminals 31 of the flexible 12 are joined to the connection terminals 24 of the sub-substrate 11, the connection terminals 31 are superimposed on the connection terminals 24 of the sub-substrate 11. Reinforcing terminals 32 (which are electrically independent of the connecting terminals 31) are formed at both ends of the connecting terminal arrangement portion 38 to increase the bonding strength with the sub-board 11. Is bonded to the reinforcing terminal 25 of the sub-board 11 when the sub-board 11 and the flexible 12 are joined. Both reinforcing terminals 32 are formed integrally with reinforcing patterns 35 and 36 around positioning holes 33 and 34 provided at positions radially outward from their own positions. The positioning holes 33 and 34 are formed at positions where the positioning holes 33 and 34 overlap with the positioning holes 21 and 22 of the sub-substrate 11 when the flexible 12 and the sub-substrate 11 are joined. The positioning holes 33 and 34 are located slightly radially outward from the arc-shaped connection terminal arrangement portion, but the positioning holes are located sufficiently farther in the circumferential direction than the arrangement position of the connection terminals 31. Since the periphery is reinforced by the reinforcing patterns 35 and 36, there is a possibility that a crack may be generated from the hole edges (edges) of the positioning holes 33 and 34 after the connection between the flexible 12 and the substrate 11 or during the handling operation of the flexible 12. Also, even if cracks are formed at the hole edges of the positioning holes 33 and 34, the positioning holes and the connection terminals 31 are sufficiently separated from each other. . Reinforcement patterns 28 and 29 are formed separately from the reinforcement patterns 35 and 36 around the positioning holes 33 and 34, and the reinforcement patterns 28 and 29 are joined to the reinforcement patterns 26 and 27 of the sub-substrate 11. The bonding strength between the flexible substrate 12 and the sub-substrate 11 is further enhanced.
[0046]
In the connection terminal portion 38 of the flexible 12, as shown in FIG. 1, an area 30 surrounded by a two-dot chain line is an uncovered area, and the length of the connection terminal 31 exposed in this area 30 is It is shorter than the length of the connection terminal 24 of the sub-board 11. This is because when the connection terminal 31 of the flexible board 12 is superimposed on the connection terminal 24 of the sub-substrate 11 and heated and pressed, the molten solder of the connection terminal 31 flows along the terminal direction of the connection terminal 24 of the sub-substrate 11. This is to prevent the occurrence of a solder bridge between adjacent terminals on the flexible side.
[0047]
When joining the flexible 12 having the above configuration to the sub-substrate 11, the connection terminals of the sub-substrate 11 can be connected by inserting the positioning pins inserted into the positioning holes 21 and 22 of the sub-substrate 11 into the positioning holes 33 and 34 of the flexible 12. Since each connection terminal 31 of the flexible 12 naturally overlaps with 24, in this state, the connection terminals 24 and 31 are melt-bonded by simultaneously pressing them with a heating / pressing jig (not shown) having the same shape as the region 30 and simultaneously heating them. At the same time, the two reinforcing terminals 25 and 32 are melt-bonded, and Reinforcement pattern 35 , 36, 26 to 29 are melt-bonded.
[0048]
When the connection terminal portion of the flexible 12 and the connection terminal portion of the sub-substrate 11 are overlapped and heated and pressurized, the connection length of the connection terminal 31 of the flexible 12 is shorter than the connection terminal 24 of the sub-substrate 11. The molten solder of the connection terminal 31 does not flow to the adjacent connection terminal side but flows in the terminal direction of the connection terminal 24, and therefore, there is no possibility that a solder bridge between the connection terminals will occur on the flexible 12 side.
[0049]
Further, when the connection terminals of the flexible 12 and the connection terminals of the sub-substrate 11 are superimposed and heated and pressed, the reinforcement terminals and the reinforcement patterns of both are superimposed and heated, so that they are melted. When the solder amount of the reinforcing terminal is small, the molten solder flows from the reinforcing pattern, so that the bonding strength at the reinforcing terminal does not become insufficient.
[0050]
When the connection terminals of the flexible 12 and the connection terminals of the sub-substrate 11 are superimposed and heated and pressurized, a temperature difference occurs between the connection terminal arrangement portion and the periphery of the positioning hole. The temperature difference does not adversely affect the joining of the connection terminals because the temperature difference is located at the outer positions of both ends and is separated from the connection terminal 31.
[0051]
In the above embodiment, an example of the optical device having the printed circuit board connection structure of the present invention has been described, but the device having the connection structure of the present invention is not limited to the optical device.
[0052]
【The invention's effect】
According to the first aspect of the present invention, since the positioning holes are arranged at radially outer positions at both ends of the connection terminal, an area to be heated and pressed when the two substrates are joined can be reduced. Since the joint between the two substrates can be heated to a substantially uniform temperature, it is possible to prevent a decrease in the strength of the joint after joining. In the flexible printed circuit board, the connection end With child Since the periphery of the positioning hole is exposed as a coverlay uncovered area, the flatness of the portion to be joined is increased, so that the joining that does not easily peel after joining can be performed.
[0053]
further, Claim 1 According to the invention, since the connection terminal and the reinforcing pattern are on the same plane, the pressure distribution in the pressurized state at the time of joining becomes uniform, and the reinforcing patterns are also joined together with the connecting terminal. Provided is a connection structure having a high bonding strength and no risk of peeling.
[0054]
Claim 2 According to the invention, since the reinforcing pattern is formed so as to be continuous with the reinforcing terminal, excessive fusion solder of the reinforcing terminal flows toward the reinforcing pattern when the two connection terminals are fusion-bonded to each other, When there is no possibility that a solder bridge is generated between adjacent connection terminals, and when the amount of solder of the reinforcing terminal is small, molten solder flows from the reinforcing pattern, so that an accurate bonding state and high bonding strength can be obtained.
Claim 3 According to the invention, when the two connection terminals are fusion-bonded to each other, excess molten solder flows along the second connection terminal, so that there is no possibility that a solder bridge is generated at the first connection terminal, and good connection is achieved. It can be performed.
[0055]
Claim 4 According to the invention, an optical device having a connection structure for electrically connecting a flexible substrate and a rigid substrate or a flexible substrate directly to each other by directly joining the flexible substrate or the flexible substrate, wherein positioning holes are provided at radially outer positions at both ends of the connection terminal. Therefore, the heating and pressurizing surface at the time of joining the two can be reduced, and therefore, it is possible to provide an optical device having a connection structure having a high joining strength and hardly causing peeling.
[0056]
further, Claim 4 According to the invention, since the connection terminal of the flexible cable and the reinforcing pattern are on the same plane, the joint portion between the flexible cable and the printed wiring board has a large planar portion at the time of joining the flexible cable and the printed wiring board. An optical instrument is provided.
[0057]
Claim 5 According to the invention, since the reinforcing pattern is formed so as to be continuous with the reinforcing terminal, excessive fusion solder of the reinforcing terminal flows toward the reinforcing pattern when the two connection terminals are fusion-bonded to each other, When there is no risk of a solder bridge between adjacent connection terminals, and when the amount of solder in the reinforcement terminals is small, molten solder flows from the reinforcement pattern. An optical device having the same is provided.
[0058]
Claim 6 According to the invention, since the connection terminal of the printed wiring board which is not the flexible printed board is long, molten solder of the connection terminal of the flexible printed board flows along the connection terminal of the printed wiring board at the time of joining, so that a solder bridge is generated. Therefore, it is possible to provide an optical device having a connection structure that does not cause a short circuit.
[Brief description of the drawings]
FIG. 1 is a diagram showing a printed wiring board connection structure of the present invention.
FIG. 2 is a diagram showing an example of a flexible printed board used in the printed wiring board connection structure of the present invention.
FIG. 3 is a cross-sectional view of a lens barrel as an optical device having the printed wiring board connection structure of the present invention.
FIG. 4 is a cross-sectional view of a conventional printed wiring board connection structure for explaining an example of the structure.
[Explanation of symbols]
1: 1 group lens holding cylinder 2: Manual operation ring 3: Zoom ring
4: Anti-vibration switch 5: AF / MF switch operation switch
6: Mount 7 Contact block 8: Circuit board (main board)
9: Vibration detection device 10: Image blur correction actuator unit
11: Electronic circuit board for image blur correction (sub-board)
12, 41: Flexible printed circuit board
13: Electromagnetic actuator for diaphragm device
14: decorative board L1-L6: lens
37, 38, 39: connection terminal arrangement part 24, 31, 42, 43: connection terminal
25, 32: reinforcement terminal
26-29 , 35 , 36, 45: Reinforcement pattern
21, 22, 33, 34: positioning hole 44: rigid substrate
46: Coverlay

Claims (6)

By mutually heat melt bonding respective connection terminals of the first and second printed circuit board, the connection structure of a printed wiring board for electrically connecting both said printed wiring board to each other, said first printed circuit substrate, a plurality of first connecting terminals, and a first positioning hole formed in the radially outer position of the two ends of the first connection terminal, the printed wiring board of the second flexible printed circuit board as is constituted, and a number of second connecting terminals which are superimposed on the connection terminals of the first, both ends radially outward position to be formed positioning holes of said first of said second connecting terminals has a second positioning hole to be superimposed on the periphery of the second positioning hole formed reinforcement pattern for increasing the bonding strength, the reinforcing pattern around the said second positioning hole first second connection Son and is connected structure of a printed wiring board, characterized in that it is exposed as a single coverlay uncoated region. First and second reinforcing terminals for increasing the bonding strength are formed at both ends in the longitudinal direction of the first connection terminal arrangement part and both ends in the longitudinal direction of the second connection terminal arrangement part, 2. The connection structure for a printed wiring board according to claim 1 , wherein said second reinforcing terminal is formed so as to be continuous with said reinforcing pattern. 2. The printed circuit board connection structure according to claim 1, wherein the first connection terminal of the first and second connection terminals is longer than the second connection terminal. The first and second printed wiring boards are built-in, and the first and second printed wiring boards are electrically connected to each other by heating and joining the respective connection terminals to each other. In an optical device in which at least one printed wiring board is a flexible printed board, the first printed wiring board is formed at a number of first connection terminals and radially outer positions at both ends of the first connection terminals. was first and a positioning hole, the printed wiring board of the second comprises a plurality of second connection terminals are superimposed on the connection terminals of said first, radial ends of said second connecting terminals A second positioning hole formed at an outer position and overlapped with the first positioning hole, and a reinforcing pattern for increasing the bonding strength is formed around the second positioning hole, said second An optical apparatus characterized in that the reinforcement pattern and the surrounding-decided Me hole and the second connection terminals are exposed as single coverlay uncoated region. Reinforcing terminals for increasing the bonding strength with the other printed wiring board are arranged at both ends in the longitudinal direction of the connection terminal disposing portion having an arc shape, and the reinforcing terminals are provided in the reinforcing pattern. The optical device according to claim 4 , wherein the optical device is formed continuously. The optical device according to claim 4 , wherein the length of the connection terminal of the printed wiring board which is not the flexible printed board is longer than the length of the connection terminal of the flexible printed board.

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