JP3606763B2 - Method for manufacturing flexible circuit board - Google Patents
Method for manufacturing flexible circuit board Download PDFInfo
- Publication number
- JP3606763B2 JP3606763B2 JP08820199A JP8820199A JP3606763B2 JP 3606763 B2 JP3606763 B2 JP 3606763B2 JP 08820199 A JP08820199 A JP 08820199A JP 8820199 A JP8820199 A JP 8820199A JP 3606763 B2 JP3606763 B2 JP 3606763B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring pattern
- flexible circuit
- pattern
- mask pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、スパッタリング法又は蒸着法によるリフトオフ法を採用しながら電解メッキ手段等では形成できない金属で所要の配線パタ−ンを好適に形成可能な可撓性回路基板の製造法に関する。
【０００２】
【従来の技術】
この種の可撓性回路基板を製作する従来の手法としては、サブトラクティブ法又はアディティブ法がある。サブトラクティブ法は、可撓性絶縁べ−ス材に銅箔等の導電層を積層したもの又は可撓性絶縁べ−ス材の少なくとも一方面に電解メッキ等の手段で導電層を一様に形成したものを用意し、その導電層の必要部分をフォトレジスト材等を用いてマスキング処理した後、露出している不要な導電層領域をエッチング手段で除去することによって所要の配線パタ−ンを形成するものである。
【０００３】
また、アディティブ法によって可撓性回路基板を製作するには、適当な可撓性絶縁べ−ス材の表面にメッキリ−ドとなるシ−ド層を形成した後、所要の配線パタ−ンを形成できるパタ−ンでシ−ド層の表面にフォトレジスト材等を用いてマスクパタ−ンを形成し、次に、電解メッキ法によりシ−ド層の露出した領域に銅等の導電性部材を被着して配線パタ−ンを形成し、また、必要に応じてそれらの配線パタ−ンの表面には同じく電解メッキ法で金等の異種金属を用いて表面導電層を形成し、最後に、不要となったマスクパタ−ン及びその底部に位置するシ−ド層の領域を除去することにより、可撓性絶縁べ−ス材の上面にシ−ド層部分、配線パタ−ン及び表面導電層等から構成される所要の配線パタ−ンを形成するものである。
【０００４】
【発明が解決しようとする課題】
上記従来の手法では、必要な配線パタ−ンの形成を電解メッキ手段で行うのが主体である為、配線パタ−ンの材質は電解メッキ法で形成可能な材質に限定されてしまう。従って、実装時に於ける電子部品との電気的接合性或いは配線パタ−ンの耐環境性等を高める為に、配線パタ−ンを電解メッキでは形成できないチタンなどの金属で形成することは不可能であった。
【０００５】
このような不都合を解消する他の手法としてはリフトオフ法がある。このリフトオフ法は、可撓性絶縁べ−ス材の表面の不要領域部分にフォトレジスト材等を用いてマスキング処理を施した後、スパッタリング法又は蒸着法により所要の金属を被着させて導電層を形成し、次いで不要となったマスク部材を除去することにより所要の配線パタ−ンを形成するものである。
【０００６】
しかし、可撓性絶縁べ−ス材は薄く剛性がない為に放熱板に密着しないことから、スパッタリング又は蒸着時にマスク部材の放熱が十分に行われない為、このマスク部材が熱による損傷を受けて適正な配線パタ−ンを形成することが不可能な場合がある。
【０００７】
そこで、本発明では、スパッタリング法又は蒸着法によるリフトオフ法を採用した場合でも電解メッキ手段等では形成できない金属で所要の配線パタ−ンを好適に形成可能な可撓性回路基板の製造法を提供するものである。
【０００８】
【課題を解決するための手段】
その為に、本発明に係る可撓性回路基板の製造法では、上面に所要の配線パタ−ンを形成できるパタ−ンでフォトレジスト材等のマスクパタ−ンを形成した可撓性絶縁べ−ス材を高真空下でもガスの発生しない耐熱性高真空用シリコングリス等からなる密着液を介して放熱板に密着させた状態で前記可撓性絶縁べ−ス材の上面にスパッタリング法又は蒸着法でチタン等の金属によって所要の配線パタ−ンを形成するものである。
【０００９】
その場合、前記スパッタリング法又は蒸着法により前記所要の配線パタ−ンを形成する工程の前に、サブトラクティブ法又はアディティブ法で前記配線パタ−ンの下地を形成することもできる。
【００１０】
【発明の実施の形態】
以下、図示の実施例を参照しながら本発明を更に詳述する。図１は、本発明の一実施例による可撓性回路基板の製造工程図である。
【００１１】
先ず、図１（１）の如く、ポリイミドフィルム等の適当な可撓性絶縁べ−ス材１の表面に所要の配線パタ−ンを形成できるパタ−ンでフォトレジスト材等を用いてマスクパタ−ン２を形成する。
【００１２】
上記のマスクパタ−ン２の膜厚は、形成すべき所要の配線パタ−ンの厚みより厚く形成し、また、そのマスクパタ−ン２の側面形状は垂直又は逆台形に形成することができる。
【００１３】
次いで、同図（２）の如く、可撓性絶縁べ−ス材１の裏面に耐熱性であって高真空下でもガスの発生しない高真空用シリコングリス等からなる密着液６を一様に介在させて放熱板５を配置し、これにより可撓性絶縁べ−ス材１と放熱板５とを密着液６を介して均一に密着させて、マスクパタ−ン２の放熱性を確保しておく。
【００１４】
そこで、矢印で示す如く、電解メッキ法では形成できないチタン等の金属をスパッタリング法又は蒸着法により被着して配線パタ−ン３を形成するが、その際にはマスクパタ−ン２の上面にも被着層４が形成される。
【００１５】
斯かるリフトオフ法による配線パタ−ン３の形成時には、可撓性絶縁べ−ス材１と放熱板５とが密着液６を介して均一に密着して、マスクパタ−ン２の放熱性が確保されているので、スパッタリング又は蒸着時にマスクパタ−ン２の損傷が好適に防止され、これにより精度の良好な高品質の配線パタ−ン３を形成することができる。
【００１６】
最後に、同図（３）のように、被着層４と共に不要となったマスクパタ−ン２を除去することにより、可撓性絶縁べ−ス材１の上面に電解メッキ法では形成できないチタン等の金属からなる所要の配線パタ−ン３を形成した可撓性回路基板を得ることができる。
【００１７】
なお、上記のリフトオフ法による配線パタ−ン３の形成前に、サブトラクティブ法又はアディティブ法でその配線パタ−ンの下地を形成することもできる。
【００１８】
【発明の効果】
本発明による可撓性回路基板の製造法によれば、リフトオフ法による配線パタ−ンの形成時に、可撓性絶縁べ−ス材と放熱板とが密着液を介して均一に密着して、マスクパタ−ンの放熱性が確保されているので、スパッタリング又は蒸着時にマスクパタ−ンの損傷が好適に防止され、従って、精度の良好な高品質の配線パタ−ンを形成することができる。
【００１９】
上記手法の採用により、本発明によれば従来の電解メッキ手段では形成できないチタン等の金属をスパッタリング法又は蒸着法で被着して確実に所要の配線パタ−ンを形成することができる。
【００２０】
従って、実装時に於ける電子部品との電気的接合性或いは配線パタ−ンの耐環境性等を高めることの可能な可撓性回路基板を安定的に製作できる。
【図面の簡単な説明】
【図１】本発明の一実施例による可撓性回路基板の製造工程図。
【符号の説明】
１ 可撓性絶縁べ−ス材
２ マスクパタ−ン
３ 配線パタ−ン
４ 被着層
５ 放熱板
６ 密着液[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a flexible circuit board in which a required wiring pattern can be suitably formed of a metal that cannot be formed by electrolytic plating means or the like while employing a lift-off method by sputtering or vapor deposition.
[0002]
[Prior art]
As a conventional method for manufacturing this type of flexible circuit board, there is a subtractive method or an additive method. In the subtractive method, a conductive layer such as copper foil is laminated on a flexible insulating base material, or the conductive layer is uniformly formed on at least one surface of the flexible insulating base material by means such as electrolytic plating. Prepare the formed one, mask the necessary part of the conductive layer with a photoresist material, etc., and then remove the unnecessary conductive layer area exposed by etching means to obtain the required wiring pattern. To form.
[0003]
In addition, in order to manufacture a flexible circuit board by the additive method, after forming a seed layer serving as a plating lead on the surface of a suitable flexible insulating base material, a required wiring pattern is formed. A mask pattern is formed on the surface of the seed layer with a pattern that can be formed using a photoresist material or the like, and then a conductive member such as copper is applied to the exposed area of the seed layer by electrolytic plating. A wiring pattern is formed by deposition, and if necessary, a surface conductive layer is formed on the surface of the wiring pattern using a different metal such as gold by the same electrolytic plating method. By removing the mask pattern that is no longer needed and the region of the seed layer located at the bottom, the seed layer portion, the wiring pattern, and the surface conductivity are formed on the upper surface of the flexible insulating base material. A required wiring pattern composed of layers and the like is formed.
[0004]
[Problems to be solved by the invention]
In the above conventional method, the formation of the necessary wiring pattern is mainly performed by the electrolytic plating means. Therefore, the material of the wiring pattern is limited to a material that can be formed by the electrolytic plating method. Therefore, it is impossible to form the wiring pattern with a metal such as titanium, which cannot be formed by electrolytic plating, in order to improve the electrical connection with the electronic parts during mounting or the environmental resistance of the wiring pattern. Met.
[0005]
There is a lift-off method as another method for solving such inconvenience. In this lift-off method, a conductive layer is formed by applying a required metal by sputtering or vapor deposition after performing a masking process using a photoresist material or the like on an unnecessary region on the surface of a flexible insulating base material. Then, a required wiring pattern is formed by removing unnecessary mask members.
[0006]
However, since the flexible insulating base material is thin and not rigid, it does not adhere to the heat radiating plate. Therefore, the mask member is not sufficiently radiated during sputtering or vapor deposition, so that the mask member is damaged by heat. In some cases, it is impossible to form an appropriate wiring pattern.
[0007]
Therefore, the present invention provides a method of manufacturing a flexible circuit board that can suitably form a required wiring pattern with a metal that cannot be formed by electrolytic plating means or the like even when a lift-off method by sputtering or vapor deposition is adopted. To do.
[0008]
[Means for Solving the Problems]
For this purpose, in the method for manufacturing a flexible circuit board according to the present invention, a flexible insulating board in which a mask pattern such as a photoresist material is formed with a pattern capable of forming a required wiring pattern on the upper surface. Sputtering or vapor deposition is performed on the upper surface of the flexible insulating base material in a state in which the glass material is in close contact with the heat sink through an adhesive liquid made of heat-resistant high vacuum silicon grease that does not generate gas even under high vacuum. In this method, a required wiring pattern is formed of a metal such as titanium.
[0009]
In that case, the base of the wiring pattern can be formed by the subtractive method or the additive method before the step of forming the required wiring pattern by the sputtering method or the vapor deposition method.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail with reference to the illustrated embodiments. FIG. 1 is a manufacturing process diagram of a flexible circuit board according to an embodiment of the present invention.
[0011]
First, as shown in FIG. 1A, a mask pattern using a photoresist material or the like with a pattern capable of forming a required wiring pattern on the surface of an appropriate flexible
[0012]
The film thickness of the
[0013]
Next, as shown in FIG. 2 (2), the back surface of the flexible
[0014]
Therefore, as shown by the arrows, a
[0015]
When the
[0016]
Finally, as shown in FIG. 3 (3), the
[0017]
Note that the base of the wiring pattern can be formed by the subtractive method or the additive method before the formation of the
[0018]
【The invention's effect】
According to the method for manufacturing a flexible circuit board according to the present invention, when forming a wiring pattern by a lift-off method, the flexible insulating base material and the heat radiating plate are in close contact with each other through an adhesion liquid, Since the heat dissipation of the mask pattern is ensured, damage to the mask pattern is suitably prevented during sputtering or vapor deposition, and therefore a high-quality wiring pattern with good accuracy can be formed.
[0019]
By adopting the above method, according to the present invention, it is possible to reliably form a required wiring pattern by depositing a metal such as titanium, which cannot be formed by conventional electrolytic plating means, by sputtering or vapor deposition.
[0020]
Therefore, it is possible to stably manufacture a flexible circuit board capable of improving the electrical bondability with an electronic component during mounting or the environment resistance of a wiring pattern.
[Brief description of the drawings]
FIG. 1 is a manufacturing process diagram of a flexible circuit board according to an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08820199A JP3606763B2 (en) | 1999-03-30 | 1999-03-30 | Method for manufacturing flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08820199A JP3606763B2 (en) | 1999-03-30 | 1999-03-30 | Method for manufacturing flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000286530A JP2000286530A (en) | 2000-10-13 |
| JP3606763B2 true JP3606763B2 (en) | 2005-01-05 |
Family
ID=13936295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08820199A Expired - Fee Related JP3606763B2 (en) | 1999-03-30 | 1999-03-30 | Method for manufacturing flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3606763B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4713131B2 (en) | 2004-11-19 | 2011-06-29 | 株式会社マルチ | Printed wiring board and method for manufacturing the printed wiring board |
| US10136945B2 (en) * | 2015-12-09 | 2018-11-27 | Biosense Webster (Israel) Ltd. | Ablation catheter with light-based contact sensors |
-
1999
- 1999-03-30 JP JP08820199A patent/JP3606763B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000286530A (en) | 2000-10-13 |
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