JP3607445B2 - Electronic component suction nozzle - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a suction nozzle for an electronic component mounted on a mounting head of an electronic component mounting apparatus that mounts the sucked electronic component on a substrate or the like.
[0002]
[Prior art]
Conventionally, as a suction nozzle for this type of electronic component, one described in JP-A-7-190050 is known. In this electronic component mounting apparatus, a supply system that supplies electronic components to the mounting apparatus main body with the mounting apparatus main body interposed therebetween, and a mounting system that receives mounting of the electronic components from the mounting apparatus main body are disposed. A mounting head holding a plurality of suction nozzles is provided on the outer periphery of the rotary table. While the rotary table rotates intermittently, the mounting head rotates and feeds between the supply system and the mounting system. At that time, the mounting head picks up the electronic components from the supply system with the suction nozzle and corrects the position before mounting it. Attach to the system board.
[0003]
The tip of each suction nozzle is a circular and flat nozzle forming surface, and a circular nozzle hole connected to the vacuum suction device is formed at the center of the nozzle forming surface. That is, the electronic component is sucked and held by using the air flow sucked from the nozzle hole.
[0004]
[Problems to be solved by the invention]
In such a conventional suction nozzle, electronic components are often supplied with a slight displacement in the supply system, and this is sucked as it is, so in the middle of the rotational feed from the suction position to the mounting position, It was necessary to correct the position of the θ (rotation) direction almost every time. In addition, since this rotational feed is intermittent feed that repeats movement and stop, if the mounting device main body becomes high speed, the electronic components after position correction and position recognition will again be misaligned due to inertia during movement and stop. There was a bug that would cause
[0005]
It is an object of the present invention to provide an electronic component suction nozzle capable of correcting the position of an electronic component during suction and effectively preventing positional displacement of the electronic component sucked during movement. It is aimed.
[0006]
[Means for Solving the Problems]
An electronic component suction nozzle according to the present invention is an electronic component suction nozzle in which an air flow sucked from a nozzle hole is applied to the entire area of the electronic component so that the electronic component is attracted to a nozzle forming surface. The nozzle hole so that the flow velocity distribution of the flow gradually decreases from the center of the nozzle forming surface toward the radially outward direction , and the constant velocity line in the flow velocity distribution is substantially similar to the planar shape of the electronic component. Is configured and arranged with a plurality of suction holes.
[0007]
According to this configuration, the air flow sucked from the nozzle holes acts on the entire electronic component. That is, a suction force using the electronic component as an adsorption force is generated by the flow of air, which is a viscous fluid, and this suction force acts on the entire area of the electronic component. In this case, if the electronic component has, for example, a rectangular planar shape and is adsorbed in a state of being displaced in the long side direction, the electronic component is arranged from one short side that is close to the center of the nozzle forming surface. The air that reaches the nozzle hole along the surface has a small viscosity resistance and a decrease in the flow velocity because the flow path is short. On the contrary, the air reaching the nozzle hole along the surface of the electronic component from the other short side located at a far position has a large viscous resistance and a large decrease in the flow velocity due to the long flow path.
[0008]
That is, the air flow from one short side to the nozzle hole is faster than the air flow from the other short side to the nozzle hole. Therefore, according to Bernoulli's theorem, the pressure on the high speed side is lower than that on the low speed side (even if the electronic component is displaced in the short side direction), and the electronic component tries to move laterally to the center position of the nozzle hole. Power works. In addition, since the flow velocity distribution of the air flow is configured to gradually decrease from the center of the nozzle formation surface toward the radially outward direction, the flow velocity difference between the high speed side and the low speed side becomes larger. The force to move the electronic component laterally becomes stronger.
[0009]
This flow velocity difference is caused by the air flowing sufficiently on the surface of the electronic component during the process of adsorbing the electronic component, so that the electronic component instantly rides on the strong air flow like a conventional single nozzle hole. If it is adsorbed and the air does not flow sufficiently on the surface of the electronic component, it is unlikely to occur. That is, in the conventional one, the above-described flow velocity difference is small, and the force for moving the electronic component laterally is small. In addition, after the electronic component is adsorbed, the nozzle hole is composed of a plurality of suction holes, so that the cross-sectional area blocked by the adsorbed electronic component is small compared to the conventional single nozzle hole, Accordingly, the air flow rate is maintained and the suction force is increased. That is, the suction holding force of the electronic component is increased.
[0011]
Furthermore, since the plurality of suction holes are arranged so that the constant velocity line in the flow velocity distribution is substantially similar to the planar shape of the electronic component, the air flow velocity distribution can be matched with the planar shape of the electronic component. Therefore, it is possible to more efficiently exhibit the force for moving the electronic component laterally and the suction holding force of the electronic component.
[0012]
In these cases, the plurality of suction holes are preferably composed of a large-diameter suction hole formed at the center of the nozzle forming surface and a plurality of small-diameter suction holes formed around the large-diameter suction hole.
[0013]
When sucking small electronic components, it is necessary to reduce the diameter of the nozzle forming surface and each suction hole in accordance with this, making it difficult to form each suction hole. If a plurality of suction holes are composed of a large-diameter suction hole at the center position and a plurality of small-diameter suction holes around it, formation of each suction hole for creating a desired flow velocity distribution of air Can be performed relatively easily with as few suction holes as possible.
[0014]
In this case, the electronic component has a rectangular planar shape, and the plurality of small-diameter suction holes are composed of four suction holes formed in the same diameter, and the four suction holes are large-diameter suction holes. It is preferable that the two are arranged symmetrically in the vertical and horizontal lines with respect to each other on the left and right sides.
[0015]
According to this configuration, it is possible to form the nozzle holes with the fewest and simplest in accordance with an electronic component having a rectangular planar shape.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electronic component mounting apparatus equipped with an electronic component suction nozzle according to an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a side view of the electronic component mounting apparatus, and FIG. 2 is a plan view thereof. As shown in both figures, the electronic component mounting apparatus 1 includes a supply system 3 for supplying an electronic component A and a mounting system 4 for mounting the electronic component A on a substrate B in parallel with each other with the mounting apparatus main body 2 interposed therebetween. And arranged. The mounting apparatus body 2 is provided with an index unit 11 serving as a main body of the drive system, a rotary table 12 connected thereto, and a plurality (12) of mounting heads 13 mounted on the outer periphery of the rotary table 12. The rotary table 12 is intermittently rotated by the index unit 11 at an intermittent pitch corresponding to the number of mounting heads 13. When the rotary table 12 rotates intermittently, the suction nozzle 14 mounted on each mounting head 13 appropriately faces the supply system 3 and the mounting system 4 and sucks the electronic component A supplied from the supply system 3 and then rotates to the mounting system 4. It is transported and mounted on the substrate B introduced into the mounting system 4.
[0017]
The supply system 3 has a number of tape cassettes 21 corresponding to the type of electronic component A to be mounted on the substrate B, and the tape cassette 21 is provided on a supply table 23 slidably guided by a pair of guide rails 22 and 22. It is attached side by side and detachably. A ball screw 24 is screwed to the supply base 23 in the sliding direction. The supply base 23 is advanced and retracted by forward and reverse rotation of a feed motor 25 connected to one end of the ball screw 24, so that the mounting head 13 A desired tape cassette 21 is selectively brought to the suction position. Each tape cassette 21 is loaded with a carrier tape C loaded with electronic components A at a predetermined pitch in a state of being wound around a tape reel 26, and the electronic components A are unwound from the tape reel 26. The carrier tape C is sucked by the suction nozzle 14 as needed.
[0018]
The mounting system 4 includes an XY table 31 that moves the placed substrate B in the X-axis direction and the Y-axis direction, a carry-in conveyance path 32 and a carry-out conveyance path 33 that are arranged before and after the XY table 31, and a carry-in conveyance path 32. The upper substrate B is constituted by an XY table 31 and a substrate transfer device 34 for simultaneously transferring the substrate B on the XY table 31 to a carry-out conveyance path 33. The substrate B sent to the downstream end of the carry-in transport path 32 is transferred onto the XY table 31 by the substrate transfer device 34, and the substrate B on the XY table 31 on which the mounting of the electronic component A is completed is the same as this substrate. It is transferred to the carry-out conveyance path 33 by the transfer device 34. The board B introduced onto the XY table 31 is appropriately moved by the XY table 31 and corresponds to the electronic parts A sent one after another by the respective mounting heads 13 so that the component mounting part faces the mounting position. The electronic component A is mounted from each suction nozzle 14.
[0019]
The mounting apparatus main body 2 has an index unit 11 that is the main body of a drive system on a support base 15. The index unit 11 intermittently rotates the rotary table 12 and is synchronized (interlocked) with the intermittent cycle of the rotary table 12. And various devices of the mounting device body 2 are operated.
[0020]
The turntable 12 is fixed to a vertical shaft 41 that hangs down from the index unit 11 and rotates intermittently clockwise in plan view. Twelve mounting heads 13 are attached to the outer peripheral portion of the rotary table 12 via brackets 42 so as to be movable up and down at equal intervals in the circumferential direction. In this case, the intermittent rotation of the rotary table 12 is 12 intermittent cycles per rotation in accordance with the number of mounting heads 13, and each mounting head 13 revolving by this intermittent rotation has an adsorption position and a mounting position. It stops at each of the 12 stop positions.
[0021]
Each mounting head 13 is provided with a plurality (about 5) of suction nozzles 14 arranged at equal intervals in the circumferential direction so as to be able to appear and retract and revolve as a whole. The suction nozzle 14 can select an appropriate suction nozzle 14 corresponding to the size of the electronic component A from a plurality of the suction nozzles 14. This selection is performed by causing the selected suction nozzle 14 to revolve and protrude to the nozzle set position of the mounting head 13. Each suction nozzle 14 is configured to be detachable with respect to the mounting head 13 and can be appropriately replaced.
[0022]
On the other hand, various devices for accessing the suction nozzle 14 are incorporated in the 12 stop positions including the suction position and the mounting position accompanying intermittent rotation of the rotary table 12 so as to be attached to the support base 15. .
[0023]
At the suction position, a mounting head lifting / lowering device 51 for lowering the mounting head 13 for sucking the electronic component A is provided so as to be connected to the bracket 42 described above. Similarly, a mounting head lifting device 52 for lowering the mounting head 13 for mounting the electronic component A is also provided at the mounting position.
[0024]
Further, as shown in FIG. 2, at the next stop position next to the mounting position in the clockwise direction, the suction nozzle 14 is revolved and the selected one suction nozzle 14 is moved to the nozzle set position located outside. At the next stop position, the selection device 53 lowers the mounting head 13 and abuts against the abutment table to immerse the unnecessary suction nozzle 14, and projects the selected suction nozzle 14 while raising the mounting head 13. A nozzle length adjusting device 55 for adjusting the protruding length of the protruding suction nozzle 14 is incorporated in the next stop position of the nozzle retracting device 54 to be moved.
[0025]
Similarly, the nozzle that revolves the suction nozzle 14 to the stop position immediately before the subsequent suction position and corrects the position of the suction nozzle 14 facing the suction position in the left-right direction (the direction orthogonal to the advancing and retreating direction of the supply table). A position correction device 56 is provided. A nozzle return device 57 that revolves the suction nozzle 14 at the next stop position of the suction position and returns the suction nozzle 14 to the original nozzle set position. The component recognition device 58 that recognizes an image of the posture of the component A (the posture in the horizontal plane) revolves the suction nozzle 14 to the next stop position based on the recognition result of the component recognition device 58, and sucked the electronic component A component angle correction device 59 for correcting A so as to be in the posture at the time of mounting is incorporated.
[0026]
Further, at the stop position next to the mounting position, there is provided a component discharging device 60 that removes the electronic component A that has been recognized as being uncorrectable by the component recognition device 58 and canceled mounting from the suction nozzle 14.
[0027]
Here, a series of operations of the mounting apparatus body 2 will be briefly described by taking the operation of any one mounting head 13 as an example. The mounting head 13 that mounts the electronic component A on the substrate B at the mounting position is publicly transferred toward the suction position by the rotary table 12 that rotates intermittently, and the selection of the suction nozzle 14 and the suction nozzle 14 based on the control command are performed. The suction position is reached while the protrusion / immersion, protrusion length adjustment, and position correction are sequentially performed. On the other hand, in the suction system 3, while the mounting head 13 moves from the stop position immediately before the suction position to the suction position, the supply base 23 is advanced and retracted based on the control command, and the tape for the corresponding electronic component is moved. The cassette 21 is brought to the suction position.
[0028]
Here, the mounting head 13 that sucks the electronic component A is publicly transferred toward the mounting position, and the return of the suction nozzle 14 to the nozzle set position, recognition of the sucked electronic component A based on the control command, Based on this, the mounting position is reached while the angle correction (θ) of the electronic component A is sequentially performed. On the other hand, in the mounting system 4, while the mounting head 13 moves from the stop position just before the mounting position to the mounting position, the XY table 31 is operated based on the control command, and the component mounting site of the board B To face the mounting position. Then, the mounting head 13 is lowered by the mounting head lifting device 52, and the electronic component A is mounted on the board B.
[0029]
Next, the mounting head 13 and the suction nozzle 14 mounted on the mounting head 13 will be described in detail with reference to FIGS. 3 and 4. As shown in FIG. 3, the lower half portion of the mounting head 13 is rotatably attached to the lower end portion of the bracket 42 so that the mounted suction nozzles 14 can revolve. Of the plurality of suction nozzles 14, the other suction nozzles 14 are held in a state of being hooked and pulled up by the claw members 16 except for the protruding suction nozzles 14. A suction passage 17 is formed in the axis of each suction nozzle 14, and the suction passage 17 of the protruding suction nozzle 14 communicates with a main passage 18 connected to a vacuum suction device (not shown).
[0030]
As shown in FIG. 4, the tip of the suction nozzle 14 is configured by mounting a nozzle tip 72 having a nozzle hole 73 on a nozzle body 71 having a suction passage 17. The lower end portion of the suction passage 17 is a chamber portion 17a formed as a sub-expansion, and the nozzle tip 72 is mounted so that the nozzle hole 73 faces the chamber portion 17a. The lower surface of the nozzle chip 72 is a substantially square and flatly formed nozzle forming surface 74. The nozzle forming surface 74 has a main suction hole 73a having a large diameter located at the center thereof and a narrow main suction hole 73a located at the periphery thereof. A nozzle hole 73 composed of four sub suction holes 73b, 73b, 73b, 73b having a diameter is formed through. In addition, the diameter of the main suction hole 73a is about 0.4 mm, and all the sub suction holes 73b are the same diameter, and the diameter is about 0.2 mm.
[0031]
The suction nozzle 14 mainly sucks an electronic component A such as a capacitor having a rectangular planar shape, and has a rectangular shape in which a nozzle forming surface 74 is chamfered in accordance with the shape of the electronic component A. The four sub suction holes 73b, 73b, 73b, 73b are also arranged symmetrically with each other in a vertical and horizontal line so as to form a rectangle in accordance with the shape of the electronic component A. Accordingly, as shown in FIG. 5, the air flow velocity distribution in the plane direction gradually becomes slower from the center position of the nozzle forming surface 74, that is, from the center of the main suction hole 73a toward the outer side in the radial direction (FIG. 5B). )) And the constant velocity line is substantially rectangular ((a) in the figure).
[0032]
Therefore, as shown in FIG. 6, when the electronic component A is supplied in a position shifted in the long side direction with respect to the nozzle forming surface, the air in the short side portion on the left side of the electronic component A is electronic component A A short distance along the surface of the electronic component A reaches the nozzle hole 73, and air on the short side on the right side of the drawing reaches the nozzle hole 73 along the surface of the electronic component A at a long distance. For this reason, the air on the right side in the figure has a higher viscous resistance due to the electronic component A and the flow velocity is slower than the air on the left side in the figure. In other words, the air flow on the left side of the figure is faster than the air flow on the right side of the figure, and Bernoulli's theorem causes the pressure on the high speed side to be lower than the low speed side, causing the electronic component A to move to the left side . The same applies to the case where the electronic component A is supplied while being displaced in the short side direction with respect to the nozzle forming surface 74.
[0033]
Therefore, the electronic component A is adsorbed so as to move laterally toward the center of the nozzle forming surface 74 due to the air flow during the adsorption. Particularly, in the air flow velocity distribution as in the embodiment, since the flow velocity of the air flowing along the surface of the electronic component A is fast as a whole, the deceleration due to the viscous resistance becomes remarkable, and the flow velocity difference between the left and right based on the positional deviation is large. Become. For this reason, by arranging the nozzle holes 73 so that the suction air acts on the entire area of the electronic component A to be sucked, the position of the electronic component A can be automatically corrected at the time of suction.
[0034]
In addition, since the nozzle hole 73 is formed by a plurality of main and sub suction holes 73a and 73b and is arranged in a distributed manner on the nozzle forming surface 74, the area blocked by the sucked electronic component A is reduced. That is, in a state where the electronic component A is sucked and held, the total opening area of the nozzle holes 73 is larger than that of the conventional nozzle holes 73. Therefore, the flow of air around the adsorbed electronic component A is maintained in a fast state, that is, the negative pressure for adsorbing and holding the electronic component A is larger than that of the conventional one and acts on the entire area of the electronic component A. Thus, the electronic component A is attracted and held with a relatively strong force.
[0035]
Therefore, it is difficult for the electronic component A to be displaced from the nozzle forming surface 74 with respect to an impact (inertial force when repeating the movement stop) generated when the mounting head 13 moves intermittently. In particular, as the speed of the apparatus increases, the inertial force increases, so that the position shift of the electronic component A after the position correction and the position shift after the position recognition can be effectively prevented, and the reliability of the apparatus can be improved. it can. Further, since the number of types of electronic components A that can be sucked by one suction nozzle 14 increases as the suction force increases, the number of suction nozzles 14 mounted on the mounting head 13 can be reduced.
[0036]
Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, six sub suction ports 73b are arranged concentrically around the main suction port 73a. Of the six sub-suction ports 73b, the left and right sub-suction ports 73b are formed with a relatively large diameter, and the remaining four sub-suction ports 73b have a smaller diameter toward the outer side in the short side direction. Is formed. Even in such a configuration, the flow velocity distribution of the suction air gradually decreases from the center of the nozzle forming surface 74 toward the radially outer side, and the constant velocity line is substantially rectangular.
[0037]
Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment, as in the first embodiment, the nozzle hole 73 is composed of five suction holes 73c, but these suction holes 73c are all formed with the same diameter. The nozzle forming surface 74 is a spherical surface that curves downward. The flow velocity distribution in this case also gradually decreases from the center of the nozzle forming surface 74 toward the radially outer side, and the constant velocity line is substantially rectangular.
[0038]
In order to gradually reduce the flow velocity distribution of the suction air from the center of the nozzle formation surface toward the radially outward direction, a large-diameter suction hole is formed in the center portion as in the above embodiment. In addition to arranging the nozzle forming surface to be a spherical surface, the suction holes may be collectively arranged at the central portion. In this embodiment, the suction nozzle has been described for an electronic component having a rectangular planar shape. However, the present invention can also be applied to an electronic component having another planar shape such as a square depending on the position of the suction hole. It is.
[0039]
【The invention's effect】
As described above, according to the electronic component suction nozzle of the present invention, when the electronic component is sucked, the position of the electronic component is automatically corrected and held with a strong force. It is possible to reduce the frequency of component position correction, and to effectively prevent displacement of the electronic component that is attracted during movement, and the constant velocity line in the flow velocity distribution indicates the planar shape of the electronic component. Since a plurality of suction holes are arranged so as to have a substantially similar shape, the air flow velocity distribution can be matched to the planar shape of the electronic component, so the force to move the electronic component laterally and the adsorption holding force of the electronic component Can be exhibited more efficiently. Therefore, it is possible to reduce mounting mistakes of electronic components and improve the reliability of the apparatus.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component mounting apparatus equipped with a suction nozzle according to an embodiment of the present invention.
FIG. 2 is a plan view of the electronic component mounting apparatus on which the suction nozzle according to the embodiment is mounted.
FIG. 3 is a partially cut side view around a mounting head on which the suction nozzle of the embodiment is mounted.
FIG. 4 is a structural diagram illustrating a tip portion of the suction nozzle according to the embodiment.
FIG. 5 is an explanatory view showing a velocity distribution of suction air in the suction nozzle of the embodiment.
FIG. 6 is an explanatory diagram illustrating an electronic component suction operation performed by the suction nozzle according to the embodiment.
FIG. 7 is a structural diagram illustrating a tip portion of a suction nozzle according to a second embodiment.
FIG. 8 is a structural diagram illustrating a tip portion of a suction nozzle according to a third embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Mounting main body 13 Mounting head 14 Suction nozzle 17 Suction passage 73 Nozzle hole 73a Main suction hole 73b Sub suction hole 74 Nozzle formation surface A Electronic component

Claims (3)

In the suction nozzle of the electronic component that causes the electronic component to be sucked to the nozzle forming surface by causing the air flow sucked from the nozzle hole to act on the entire area of the electronic component,
The flow velocity distribution of the air flow is gradually slowed radially outward from the center of the nozzle forming surface , and the constant velocity line in the flow velocity distribution is substantially similar to the planar shape of the electronic component. In addition, the nozzle hole is constituted by a plurality of suction holes and is arranged in a suction nozzle for an electronic component. The plurality of suction holes are composed of a large-diameter suction hole formed at the center of the nozzle forming surface and a plurality of small-diameter suction holes formed around the large-diameter suction hole. Item 9. An electronic component suction nozzle according to Item 1. The electronic component has a rectangular planar shape, and the plurality of small-diameter suction holes are composed of four suction holes formed in the same diameter, and the four suction holes are the large-diameter suction holes. two by two around the hole to the right and left, the suction nozzle of an electronic component according to claim 2, characterized in that it is arranged vertically and horizontally symmetrical to each other.

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