JP3608089B2 - Automatic cutting machine for ceramic composite substrates - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an automatic cutting machine that cuts a composite substrate in which a metal such as aluminum is bonded onto a ceramic substrate surface into a predetermined size.
[0002]
[Prior art]
Conventionally, a copper-clad ceramic composite substrate produced by bonding a copper plate to the surface of a ceramic substrate has been used as a substrate used for mounting a high-power electronic component such as a power module. This composite substrate is further divided into a copper / alumina direct bonding substrate, a copper / aluminum nitride direct bonding substrate, a copper / alumina brazing substrate, and a copper / aluminum nitride brazing substrate, depending on the type of ceramic substrate used and its manufacturing method. ing.
[0003]
In recent years, with the development of power modules for electric vehicles, there has been a particularly increasing demand for composite substrates with excellent heat cycle resistance. However, the copper / ceramic composite substrate currently used cannot meet such a demand.
[0004]
The present applicant has developed a metal / ceramic composite substrate by a direct bonding method using aluminum having excellent conductivity and thermal conductivity similar to copper instead of the copper / ceramic composite substrate (Japanese Patent Application No. Hei. No. 4-355111, Japanese Patent Application No. 6-96941).
[0005]
Furthermore, the present applicant has similarly developed an apparatus for continuously joining these metal / ceramic composite substrates (Japanese Patent Application No. 7-26068), which has enabled mass production of the composite substrates. .
[0006]
[Problems to be solved by the invention]
As described above, it has been mass-produced by the above-described manufacturing apparatus, but it is necessary to sequentially feed ceramic substrates of a specific size in the joining process, and to cut the metal plates joined to both sides of the substrate at a predetermined place. It was cut manually according to the size of the ceramic substrate.
[0007]
[Means for Solving the Problems]
The inventors of the present invention have intensively studied to solve such problems. As a result, the ceramic composite substrate obtained in the joining process is automatically positioned by detecting a specific portion of the ceramic substrate while positioning the ceramic composite substrate. We were able to develop a machine for cutting as a substrate.
[0008]
That is, in the present invention, the first invention, the side surface positioning portions of the ceramic composite substrate in which two or more of the ceramic substrate by a metal plate is bonded together, a notch formed in said junction of said substrate A ceramic composite substrate automatic cutting machine comprising: a sensor for detection; and a cutter portion for cutting the metal plate at a notch portion of the substrate. The second invention is characterized in that the side surface positioning portion is a guide. It is comprised from an attached flat plate and the side surface positioning tool which can move on this flat plate in the width direction.
[0009]
【Example】
The ceramic composite substrate automatic cutting machine of the present invention will be described in detail below with reference to the drawings.
[0010]
The ceramic composite substrate 1 obtained in the joining process is sequentially conveyed to the automatic cutting machine shown in FIGS. 1 and 2 at the same level. The ceramic composite substrate 1 advances along the side surface of the guide 3 of the flat plate 2 on which the guide 3 is provided, and at the same time, the side surface positioning tool 4 movable in the width direction on the flat plate 2 is placed on the left side of the composite substrate 1. Press against the side. In this case, the substrate 1 is not fixed and proceeds substantially linearly in the traveling direction.
[0011]
Next, the position of the notch 8 provided in advance on the substrate 1 is detected by the optical fiber sensor 5 provided in front of the upper and lower cutters 6 and 7, and the ceramic composite including the notch 8 is interlocked. The upper cutter 6 is lowered by 5 mm with respect to the tip portion of the substrate and cuts the metal plate 1 ′ bonded on the substrate surface.
[0012]
In this case, the lower cutter 7 is in a fixed state, while the upper cutter 6 is connected to the tool post 9 of the hydraulic press cutting part and adjusted to a cutting load between 430 and 3000 kg. It descends with the operation of. As the upper cutter 6 descends, the respective blade surfaces of the upper cutter 6 and the lower cutter 7 come into contact with the metal bonded to both surfaces of the ceramic. Further, when the upper cutter 6 is lowered, the upper and lower cutting edges bite into the metal, and the metal is pushed open to the left and right by the action of the taper of the cutting edge portion. At this time, a gap is generated in the front and rear end surfaces of the ceramic substrate that are continuously in contact with the metal. Further, when the upper cutter 6 was lowered, the upper and lower cutting edges entered the gap between the front and rear end face portions of the ceramic substrate, and were cut immediately before the cutting edges contacted to obtain individual metal ceramic composite substrates. The gap generated at the front and rear end surfaces of the ceramic substrate at the time of cutting has an extremely great effect on the quality of the product and the apparatus in which the cutting edge and the ceramic are prevented from coming into direct contact and the ceramic substrate and the cutting edge are not damaged. This gap was confirmed to be 0.2 to 0.3 mm when the metal was aluminum. In addition, 10 is a mechanical stopper that supports the tool post 9, 11 is a hydraulic cylinder, and 12 is a gantry.
[0013]
Moreover, as the cutters 6 and 7, commercially available cutters were used. In addition, shearing or a diamond saw may be used, but the cost increases.
[0014]
【The invention's effect】
As described above, the automatic cutting machine according to the present invention can automatically cut the metal bonded on the ceramic substrate along the front and rear end surfaces of the substrate, and has an effect of simplifying the etching process in the subsequent process. It is.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an entire automatic cutting machine according to the present invention.
FIG. 2 is a partial plan view showing a main part of the present invention.
FIG. 3 is a partial cross-sectional view showing a cutting portion of the present invention.
FIG. 4 is a partial plan view of a composite substrate obtained in the bonding process of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal-ceramics composite substrate 1 'Metal plate 2 Guided flat plate 3 Guide 4 Side positioning tool 5 Sensor 6 Upper cutter 7 Lower cutter 8 Notch 9 Tool post 10 Mechanical stopper 11 Hydraulic cylinder 12 Mounting base

Claims (2)

A sensor for detecting a side positioning portions of the ceramic composite substrate by the metal plate 2 or more ceramic substrates are bonded together, the cutout portion formed in the joint portion of the substrate, with notch of the substrate An automatic cutting machine for a ceramic composite substrate comprising a cutter unit for cutting the metal plate . 2. The automatic cutting machine for a ceramic composite substrate according to claim 1, wherein the side surface positioning portion is composed of a planar plate with a guide and a side surface positioning tool capable of moving in the width direction on the flat plate.

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