JP3608351B2 - Embossing roll mold and its manufacturing method - Google Patents
Embossing roll mold and its manufacturing method Download PDFInfo
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- JP3608351B2 JP3608351B2 JP25879897A JP25879897A JP3608351B2 JP 3608351 B2 JP3608351 B2 JP 3608351B2 JP 25879897 A JP25879897 A JP 25879897A JP 25879897 A JP25879897 A JP 25879897A JP 3608351 B2 JP3608351 B2 JP 3608351B2
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- embossing roll
- plating layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、プレス成型などに用いられるエンボスロ−ル金型に関し、特に金型表面の硬度が高く、化学的耐性の優れたエンボスロール金型及びその製造方法に関する。
【0002】
【従来の技術】
エンボスロ−ル金型を用いた成型品としては、LCD用バックライトやリヤプロジェクションスクリーン等に用いられるプリズムシート、レンチキュラーシート、フレネルシートが例示される。
従来、これらのレンズシート類を成型する方法として、鉄芯に銅めっきを行い、このめっき層をダイヤモンドバイトによる切削加工によってエンボスロール金型を作成し、下記の様な成型方法が取られていた。
【0003】
(1)エクストル−ダによる溶融押出し成型の際に、溶融状態で押し出される樹脂表面にエンボスロール金型を用いて型押しする。
(2)紫外線や電子線硬化性樹脂をエンボスロール金型の成型面に塗工し、透明基材をエンボスロール金型に供給して、前記透明基材を介して紫外線や電離放射線の照射により、前記樹脂を硬化させると同時に樹脂成型物を透明基材に重合接着せしめる。
等が挙げられる。(以下、これらの成型を「プレス成型」と総称する)
【0004】
上記プレス成型にて、光学部品としてのレンズシート類を成型する場合、成型品の形状の再現性や金型の耐久性が光学特性や製品のコストに大きく影響する。従って、長期の繰り返しのプレス成型によって、エンボスロール金型が変形や腐食等の起こらない、安定した形状を再現できるエンボスロール金型が要求される。
【0005】
従来、エンボスロール金型を実用に供する際には、下記の理由により成型面にクロムやニッケル等のめっきを施していた。
(イ)プレス成型時の耐久性(機械的強度)に乏しい。
(ロ)表面が酸化し易く、成型面の平滑性(光沢性)が低下しやすい。
【0006】
そこで、成型面に厚さ2乃至4μm 程度のクロムめっきを施すことによって硬度が向上し(ビッカース硬度約400)、耐久性を向上させることができるが、それでもなお下記のような欠点があった。
(a)レベリング(めっき層の厚さの均一性)が悪く、成型面の形状が切削加工を行った形状に比較して厳密には異なるため、成型品がレンズシートの場合には目的とする光学特性を正確に反映できない。
(b)クロムめっき層は表面にマイクロクラックが入り、成型品表面の光学特性を低下させる。
【0007】
クロムめっきに代えてニッケルめっき(電解ニッケルめっき)を施した場合には、成型面の平滑性は良好であるが、一方で硬度が低下し(ビッカース硬度約300)、耐久性が低下するだけでなく、上記(a)の欠点は依然として残ることになる。
【0008】
上記した理由からエンボスロール金型の表面耐性を向上させるために、本出願人による提案として特開平8ー133306号公報が公知であり、
シリンダーロール表面にニッケルめっき層、銅めっき層、TiN層がこの順に形成されている構成のエンボスロール金型を提案している。
【0009】
上記提案は、エンボスロール金型の成型面の平滑性の向上と、めっき表面の硬度を高いものにすることによって、耐久性の向上を図ったものであるが、銅めっき層の上に直接TiN層を設けると錆が発生しやすいという問題があった。
【0010】
【発明が解決しようとする課題】
本発明は以上のような従来技術の欠点を解決し、機械的耐久性のみならず、使用による錆の発生のない化学的耐久性と成型面の平滑性が良好で、エンボスにより得られる成型品の形状が金型の表面形状を良く再現できるエンボスロール金型とその製造方法を提供するものである。
【0011】
【課題を解決するための手段】
上記課題は下記の手段によって解決できる。
すなわち本発明は、シリンダーロール表面に、銅めっき層、ニッケルめっき層、TiN層がこの順に形成されている構成のエンボスロール金型であることを特徴とする。
また、そのエンボスロール金型の製造方法は、シリンダーロール表面に、銅めっき層を形成し、その表面を切削加工によってパターンを形成した後、ニッケルめっき層を設け、さらにその表面に、イオンプレーティング法によりTiN層を形成することを特徴とする。
【0012】
【発明の実施の形態】
以下、図面に基づいて本発明の実施形態を説明する。
まずはじめに図3に示すように、直径250mmで面長800mmのシリンダー(32)を砥石研磨し、水洗して、希硫酸による活性化を行なった後、その表面に銅めっき層(31)を形成した。めっき層の膜厚は500乃至700μm の範囲が望ましい。使用した硫酸銅めっき浴は、硫酸銅200ー250g/L、硫酸80ー100g/L、光沢剤適量、めっき温度30ー35°Cの組成のものを用いた。
【0013】
銅めっき終了後、めっき層膜厚にバラツキがあることから均一なめっき膜厚にするために、専用の旋盤にセットして、超硬バイトを用いて表面荒さを3μm以下になるように調整し、さらにダイヤモンドバイトを用いて表面荒さが1μm以下になるように下地切削を行った。
【0014】
次に、ダイヤモンドバイト(33)を用いて銅めっき層を切削加工によって所望の形状を有する溝を切削した。
【0015】
エンボスロ−ルを専用旋盤から降ろして、アルカリ脱脂(摂氏40度)を15分以上行い、水洗し、稀塩酸に3乃至5分間浸せきして、再度水洗し、電解脱脂(室温)を2乃至6分間行い、水洗した後、電解ニッケルめっき層を形成した。めっき層の膜厚は1乃至2μm の範囲が望ましい。めっき後、水洗及び湯洗し、乾燥させてた。使用したニッケルめっき浴は、スルファミン酸ニッケル300ー450g/L、硼酸30ー40g/L、塩化ニッケル10ー20g/L、光沢剤適量、pH4.0ー4.5の組成のものを用いた。このニッケルめっき層は電解ニッケルめっきでも、無電解ニッケルめっきでも良く、適宜何れかのめっき法を選択することができる。
【0016】
次に、エンボスロールを有機溶剤液中に浸せきした後、引き上げて液残りの無いように窒素ガンを用いてロール表面の溶剤を完全に吹き飛ばした。溶剤は、トルエン、キシレン、アセトンなどの何れでもよい。続いて、脱脂を行ったロール表面にイオンプレーティングによりTiN膜を形成した。形成方法は図4に示すように、脱脂処理を行ったエンボスロール(40)を予め200ー400℃に加熱しておき、次に、該エンボスロールに60ー80Vの電圧をかけて、マイナスに帯電させる。一方、TiN処理チャンバー(50)全体に電圧をかけてプラスに帯電させる。この時、チャンバー内に配置してあるチタンターゲット(51)からプラズマ状のチタンを発生させ、TiN処理チャンバー(50)内に約100sccmの流量で導入した窒素ガスと共にプラスに帯電したTiNがマイナスに帯電したエンボスロール(40)に引き寄せられ、その表面にTiN膜を形成されたエンボスロール得られる。
【0017】
このようにしてシリンダー表面に、銅めっき層、ニッケルめっき層、TiN層がこの順に形成されている構成のエンボスロール金型(20)得られた。
【0018】
【発明の効果】
以上のように本発明によれば、表面硬度が高く、成型面の平滑性と機械的耐久性が良好である上に、TiN層の下層にニッケルめっきを設けたことにより、錆の発生が完全に防止でき、化学的耐久性の優れたエンボスロール金型が提供できる。
従って、本発明のエンボスロール金型を使用したプレス成型において、光学部品としてのレンズシート類を成型する場合、成型品の形状の再現性に優れているために、光学部品としての良好な光学性能を有する製品が得られる。また、金型の耐久性に優れているため、長期の繰り返しのプレス成型においても、エンボスロール金型の変形や腐食等が起こらない。金型寿命が長く、結果的に製品のコストダウンが可能となった。
【0019】
【図面の簡単な説明】
【図1】従来のエンボスロール金型断面を示す説明図である。
【図2】本発明のエンボスロール金型断面を示す説明図である。
【図3】エンボスロール金型の製造工程を示す説明図である。
【図4】イオンプレーティングによるTiN処理を示す説明図である。
【符号の説明】
10,20……エンボスロール金型
13,24,32……シリンダー
12,23,31……銅めっき層
11,21……TiN層
22……ニッケルめっき層
40……エンボスロール
50……TiN処理チャンバー
51……Tiターゲット
52……窒素ガス導入口
53……排気口[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an embossing roll mold used for press molding, and more particularly to an embossing roll mold having high mold surface hardness and excellent chemical resistance, and a method for producing the same.
[0002]
[Prior art]
Examples of molded products using an embossing roll mold include prism sheets, lenticular sheets, and Fresnel sheets used for LCD backlights, rear projection screens, and the like.
Conventionally, as a method of molding these lens sheets, copper plating is performed on an iron core, and an embossing roll mold is created by cutting this plating layer with a diamond bite, and the following molding method has been taken. .
[0003]
(1) At the time of melt extrusion molding using an extruder, the resin surface extruded in a molten state is embossed using an emboss roll die.
(2) Applying ultraviolet ray or electron beam curable resin to the molding surface of the embossing roll mold, supplying a transparent base material to the embossing roll mold, and irradiating with ultraviolet rays or ionizing radiation through the transparent base material The resin is cured, and at the same time, the resin molding is polymerized and bonded to the transparent substrate.
Etc. (Hereinafter, these moldings are collectively referred to as “press molding”)
[0004]
When lens sheets as optical parts are molded by the above press molding, the reproducibility of the shape of the molded product and the durability of the mold greatly affect the optical characteristics and the cost of the product. Therefore, there is a need for an embossing roll mold that can reproduce a stable shape without deformation or corrosion of the embossing roll mold by repeated press molding over a long period of time.
[0005]
Conventionally, when an embossing roll mold is put to practical use, plating such as chromium or nickel has been applied to the molding surface for the following reasons.
(B) Poor durability (mechanical strength) during press molding.
(B) The surface is easily oxidized and the smoothness (glossiness) of the molding surface is likely to be lowered.
[0006]
Therefore, by applying chromium plating with a thickness of about 2 to 4 μm to the molding surface, the hardness can be improved (Vickers hardness about 400) and the durability can be improved, but there are still the following drawbacks.
(A) Since leveling (thickness uniformity of the plating layer) is poor and the shape of the molding surface is strictly different from the shape after cutting, the objective is when the molded product is a lens sheet. The optical characteristics cannot be accurately reflected.
(B) The chromium plating layer has micro cracks on the surface, and deteriorates the optical characteristics of the surface of the molded product.
[0007]
When nickel plating (electrolytic nickel plating) is applied instead of chromium plating, the smoothness of the molding surface is good, but on the other hand, the hardness decreases (Vickers hardness of about 300) and the durability decreases. However, the above-mentioned drawback (a) still remains.
[0008]
In order to improve the surface resistance of the embossing roll mold for the reason described above, JP-A-8-133306 is known as a proposal by the present applicant,
The embossing roll metal mold | die of the structure by which the nickel plating layer, the copper plating layer, and the TiN layer are formed in this order on the cylinder roll surface is proposed.
[0009]
The above proposal aims to improve the durability by improving the smoothness of the molding surface of the embossing roll mold and increasing the hardness of the plating surface. When the layer was provided, there was a problem that rust was easily generated.
[0010]
[Problems to be solved by the invention]
The present invention solves the above-mentioned drawbacks of the prior art, and is a molded product obtained not only by mechanical durability but also by chemical embossing that does not generate rust and smoothness of the molding surface. The present invention provides an embossing roll mold capable of well reproducing the surface shape of the mold and a method for producing the same.
[0011]
[Means for Solving the Problems]
The above problem can be solved by the following means.
That is, the present invention is characterized by being an embossing roll mold having a structure in which a copper plating layer, a nickel plating layer, and a TiN layer are formed in this order on the surface of a cylinder roll.
The embossing roll mold manufacturing method includes forming a copper plating layer on the surface of the cylinder roll, forming a pattern on the surface by cutting, providing a nickel plating layer, and further forming ion plating on the surface. A TiN layer is formed by a method.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, as shown in FIG. 3, a cylinder (32) having a diameter of 250 mm and a surface length of 800 mm is ground by grinding, washed with water, activated with dilute sulfuric acid, and then a copper plating layer (31) is formed on the surface. did. The thickness of the plating layer is preferably in the range of 500 to 700 μm. The copper sulfate plating bath used was one having a composition of 200 to 250 g / L of copper sulfate, 80 to 100 g / L of sulfuric acid, an appropriate amount of brightener, and a plating temperature of 30 to 35 ° C.
[0013]
After finishing the copper plating, the plating layer thickness varies, so in order to obtain a uniform plating thickness, set it on a dedicated lathe and adjust the surface roughness to 3 μm or less using a carbide tool. Further, the base was cut using a diamond tool so that the surface roughness was 1 μm or less.
[0014]
Next, a groove having a desired shape was cut by cutting the copper plating layer using a diamond tool (33).
[0015]
Remove the embossing roll from the dedicated lathe, perform alkaline degreasing (40 degrees Celsius) for 15 minutes or more, rinse with water, immerse in dilute hydrochloric acid for 3 to 5 minutes, rinse again with water, and electrolytic degreasing (room temperature) at 2 to 6 After performing for a minute and washing with water, an electrolytic nickel plating layer was formed. The thickness of the plating layer is preferably in the range of 1 to 2 μm. After plating, it was washed with water and hot water and dried. The nickel plating bath used was a composition of nickel sulfamate 300-450 g / L, boric acid 30-40 g / L, nickel chloride 10-20 g / L, brightener appropriate amount, pH 4.0-4.5. The nickel plating layer may be electrolytic nickel plating or electroless nickel plating, and any plating method can be selected as appropriate.
[0016]
Next, after the embossing roll was immersed in an organic solvent solution, the embossing roll was pulled up and completely blown off the solvent on the roll surface using a nitrogen gun so that no liquid residue remained. The solvent may be any of toluene, xylene, acetone and the like. Subsequently, a TiN film was formed by ion plating on the degreased roll surface. As shown in FIG. 4, the embossing roll (40) subjected to the degreasing treatment is heated to 200 to 400 ° C. in advance, and then a voltage of 60 to 80 V is applied to the embossing roll to make it negative. Charge. On the other hand, the entire TiN processing chamber (50) is charged positively by applying a voltage. At this time, plasma-like titanium is generated from the titanium target (51) disposed in the chamber, and TiN charged positively with the nitrogen gas introduced at a flow rate of about 100 sccm into the TiN processing chamber (50) becomes negative. An embossing roll having a TiN film formed on the surface thereof is obtained by being attracted to the charged embossing roll (40).
[0017]
Thus, the embossing roll metal mold | die (20) of the structure by which the copper plating layer, the nickel plating layer, and the TiN layer were formed in this order on the cylinder surface was obtained.
[0018]
【The invention's effect】
As described above, according to the present invention, the surface hardness is high, the smoothness and mechanical durability of the molding surface are good, and the nickel plating is provided in the lower layer of the TiN layer, so that the generation of rust is complete. Therefore, it is possible to provide an embossing roll mold having excellent chemical durability.
Therefore, in press molding using the embossing roll mold of the present invention, when molding lens sheets as optical parts, excellent reproducibility of the shape of the molded product, so good optical performance as optical parts A product having is obtained. In addition, since the mold has excellent durability, the embossing roll mold is not deformed or corroded even in the long-term repeated press molding. The mold life is long, and as a result, the cost of the product can be reduced.
[0019]
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a cross section of a conventional embossing roll mold.
FIG. 2 is an explanatory view showing a cross section of an embossing roll mold according to the present invention.
FIG. 3 is an explanatory view showing a manufacturing process of an embossing roll mold.
FIG. 4 is an explanatory diagram showing TiN treatment by ion plating.
[Explanation of symbols]
10, 20 ... Embossing
Claims (5)
(2)刃先が所定形状のバイトを用いたネジ切り法による切削加工によって銅めっき層の表面にパターンを形成する工程と、
(3)前記パターン表面に、電解ニッケルめっきまたは無電解ニッケルめっきの何れかによる方法によってニッケルめっき層を形成する工程と、
(4)前記ニッケルめっき層の表面に、イオンプレーティング法により、TiN層を形成する工程とからならるエンボスロール金型の製造方法。(1) forming a copper plating layer on the cylinder roll surface;
(2) a step of forming a pattern on the surface of the copper plating layer by cutting by a threading method using a cutting tool having a predetermined shape;
(3) forming a nickel plating layer on the pattern surface by a method of either electrolytic nickel plating or electroless nickel plating;
(4) A method for producing an embossing roll mold comprising the step of forming a TiN layer on the surface of the nickel plating layer by an ion plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25879897A JP3608351B2 (en) | 1997-09-24 | 1997-09-24 | Embossing roll mold and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25879897A JP3608351B2 (en) | 1997-09-24 | 1997-09-24 | Embossing roll mold and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11100683A JPH11100683A (en) | 1999-04-13 |
| JP3608351B2 true JP3608351B2 (en) | 2005-01-12 |
Family
ID=17325219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25879897A Expired - Fee Related JP3608351B2 (en) | 1997-09-24 | 1997-09-24 | Embossing roll mold and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3608351B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4592244B2 (en) * | 2002-01-24 | 2010-12-01 | 三菱レイヨン株式会社 | Mold for optical sheet manufacturing |
| JP2007316292A (en) * | 2006-05-25 | 2007-12-06 | Hitachi Chem Co Ltd | Optical sheet and light source using the same |
-
1997
- 1997-09-24 JP JP25879897A patent/JP3608351B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11100683A (en) | 1999-04-13 |
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