JP3627538B2 - Jet soldering equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a jet soldering apparatus, and more particularly to a jet soldering apparatus for soldering an electronic component or the like by bringing a board on which the electronic component or the like is mounted into contact with the solder jet.
[0002]
[Prior art]
As shown in FIG. 6, a jet soldering apparatus is used when soldering the electronic component 50 on the circuit board 51 on which the electronic component 50 is mounted as represented by a printed board. This jet soldering apparatus performs soldering by transporting a printed circuit board 51 on which an electronic component 50 is mounted to a jet solder bath and bringing it into contact with the solder jet.
[0003]
As shown in FIG. 7, the conventional jet soldering apparatus conveys the substrate 51 by a chain conveyor 52 in the order of a preheater 53, a primary jet solder bath 54, and a secondary jet solder bath 55. When the substrate 51 passes, the substrate 51 is heated before soldering to prevent deterioration of the soldering quality due to warpage of the substrate 51. In addition, the solder is attached to the surface to be processed of the substrate 51 by conveying the surface of the substrate 51 in contact with the primary solder jet in the primary jet solder bath 54, and the secondary solder in the secondary jet solder bath 55. The solder adhered to the substrate 51 is shaped by carrying the substrate 51 while immersing the surface to be processed of the substrate 51 in the jet.
[0004]
[Problems to be solved by the invention]
However, generally, when the substrate 51 is immersed in solder, it expands due to the heat of the solder. As shown in FIG. 8, the substrate 51 is constrained by chuck claws 56 and 57 and cannot freely expand, causing deformation such as warping. Since the deformation of the substrate 51 changes the soldering conditions in each part on the substrate 51, the soldering quality is deteriorated.
[0005]
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a jet soldering apparatus capable of improving the soldering quality by suppressing substrate deformation due to heat when the substrate contacts the solder jet. Is to provide.
[0006]
[Means for Solving the Problems]
According to the first aspect of the present invention, the spring means is interposed in the transmission system of the clamping force of the pair of claws in the chuck mechanism, and intersects the conveyance direction of the substrate conveyed from the primary jet solder bath to the secondary jet solder bath. The side to be held is sandwiched between the pair of claws. Therefore, even when the substrate comes into contact with the solder jet and the substrate expands due to heat, the expansion of the substrate is allowed by the spring means provided in the transmission system of the clamping force of the pair of claws. As a result, the deformation of the substrate due to heat when the substrate contacts the solder jet can be suppressed, and the soldering quality can be improved.
[0007]
Here, as described in claim 2, it is practically preferable to check the biasing force of the spring means when the substrate is held between the pair of claws by the distance sensor.
[0008]
Further, as described in claim 3, it is practically preferable to stop the operation when the biasing force of the spring means by the distance sensor when the substrate is sandwiched between the pair of claws is out of a predetermined range. .
[0009]
Furthermore, as described in claim 4, it is practically preferable that the substrate is transported by a robot arm that transports the chuck mechanism.
The invention described in claim 5 is characterized in that a spring means biased in the horizontal direction with respect to the surface to be processed of the substrate is interposed in the transmission system of the clamping force of the pair of claws in the chuck mechanism. Therefore, even when the substrate comes into contact with the solder jet and the substrate expands due to heat, the expansion of the substrate is allowed by the spring means provided in the transmission system of the clamping force of the pair of claws. As a result, the deformation of the substrate due to heat when the substrate contacts the solder jet can be suppressed, and the soldering quality can be improved.
In particular , as described in claim 5 , the first spring means for urging the pair of claws to approach each other and the second spring means for contracting and deforming as the substrate held between the claws expands. When the spring means is configured, it becomes practically preferable.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
In FIG. 1, the perspective view of the jet soldering apparatus in this Embodiment is shown. A robot 1 is installed on the floor, the robot 1 has an arm 2, and a chuck mechanism 3 is provided at the tip thereof. The printed circuit board 4 can be gripped by the chuck mechanism 3. The robot arm 2 transports the chuck mechanism 3 to a desired position in a desired direction by movement such as rotation and expansion / contraction by a joint mechanism or the like. The robot arm 2 constitutes a transfer unit for the chuck mechanism 3 (ie, the substrate 4). That is, in this example, a robot arm is used as a substrate transfer means instead of the conveyor 52 of FIG.
[0011]
In FIG. 1, a preheater 5, a primary jet solder tank 6, and a secondary jet solder tank 7 are arranged on the floor surface around the robot 1. In the primary and secondary jet solder tanks 6 and 7, as shown in FIG. 2, molten solder is jetted upward. Then, by the operation of the robot arm 2, as shown in FIG. 2, the substrate 4 is transported to the jet solder baths 6 and 7 with the chuck mechanism 3 sandwiching the substrate 4, and the substrate 4 is brought into contact with the solder jet. It is like that.
[0012]
FIG. 3 is a longitudinal sectional view of the chuck mechanism 3 provided at the tip of the robot arm 2. The chuck mechanism 3 has a pair of claws 17 and 26 arranged so as to face each other, and the claws 17 and 26 are moved toward and away from each other by the motor 12 as a chuck actuator. The printed circuit board 4 can be clamped and the printed circuit board 4 can be clamped and released by separating the claws 17 and 26. That is, the first claw 17 holds one side of the rectangular printed circuit board 4, and the second claw 26 holds the side opposite to the side to be clamped by the first claw 17.
[0013]
Specifically, the main frame 10 is attached to the robot arm 2 with respect to the chuck mechanism 3. The main frame 10 includes parallel plate portions 10a and 10b, and a first claw frame 11 is supported by the parallel plate portions 10a and 10b so as to be slidable in the horizontal direction. A chuck claw opening / closing motor 12 is fixed to the first claw frame 11, and a feed screw 13 is fixed to the output shaft of the motor 12. The feed screw 13 is screwed into a screw hole 14 formed in the main frame 10. Has been. Then, by rotating the output shaft of the motor 12 in the forward direction, the first claw frame 11 moves in the Y1 direction in the figure, and by rotating the output shaft of the motor 12 in the reverse direction, the first claw frame. 11 moves in the Y2 direction in the figure. In this example, an AC servo motor is used as the chuck pawl opening / closing motor 12.
[0014]
The first claw frame 11 is provided with a guide rail 15, and the main frame 10 is provided with a guide block 16, while the first claw frame 11 is guided by the guide rail 15 and the guide block 16. Moving.
[0015]
A first claw 17 is detachably supported at the tip of the first claw frame 11. Specifically, a guide pin 18 protrudes from the first claw 17, and the guide pin 18 is fitted into the guide hole 19 at the tip of the first claw frame 11. A hook 20 is rotatably supported by a shaft 21 at the tip of the first claw frame 11 and is biased by a spring 22 in the Z1 direction in the figure. The claw 20a of the hook 20 is fitted into the concave portion 23 on the side surface of the first claw 17 so that the first claw 17 does not fall off from the first claw frame 11.
[0016]
A second claw frame 24 is disposed between the parallel plate portions 10a and 10b in the main frame 10, and the second claw frame 24 is horizontally oriented by a shaft 25 installed between the parallel plate portions 10a and 10b. Is supported so as to be movable. A second claw 26 is detachably supported at the tip of the second claw frame 24. Specifically, a guide pin 27 protrudes from the second claw 26, and the guide pin 27 is fitted into the guide hole 28 at the tip of the second claw frame 24. A hook 29 is rotatably supported by a shaft 30 at the tip of the second claw frame 24 and is urged by a spring 31 in the Z2 direction in the figure. The claw 29a of the hook 29 is fitted into the concave portion 32 on the side surface of the second claw 26 so that the second claw 26 does not fall off from the second claw frame 24.
[0017]
A compression coil spring 33 is disposed between the parallel plate portion 10 b and the second claw frame 24 between the parallel plate portions 10 a and 10 b of the main frame 10, and the second claw frame is provided by the spring 33. 24 is urged in the direction W1 in the drawing.
[0018]
On the other hand, the first claw 17 has an L-shaped cross section, and a recess 34 is formed at the tip. Similarly, the cross-sectional shape of the second claw 26 is L-shaped, a concave portion 35 is formed at the tip, and the second claw 26 is opposed to the concave portion 34 of the first claw 17. Then, as shown in FIG. 4, the printed circuit board 4 can be sandwiched between the recess 34 of the first claw 17 and the recess 35 of the second claw 26. Further, in a state where the printed circuit board 4 is sandwiched between the concave portion 34 of the first claw 17 and the concave portion 35 of the second claw 26, the second claw frame 24 and the parallel plate portion 10a of the main frame are interposed. A gap 36 is formed.
[0019]
That is, in the present apparatus, the substrate 4 is sandwiched between the claws 17 and 26 with a dimension slightly smaller than the actual width dimension of the printed board 4 (for example, 2 mm narrower) as a target value, and a predetermined gap 36 is formed. More specifically, for example, if the width dimension (unit is mm) of the substrate is d, the claw interval of FIG. 3 is set at (d−2) mm, and the gap of 2 mm in the state of FIG. Make 36.
[0020]
Thus, as shown in the conceptual diagram of FIG. 5, the compression coil spring 33 as the spring means is interposed in the transmission system of the clamping force of the pair of claws 17 and 26 in the chuck mechanism 3.
[0021]
In FIG. 3, an L-shaped attachment member 37 is fixed to the upper surface of the second claw frame 24, and a distance sensor 38 is attached to the attachment member 37. A distance L from the sensor 38 to the parallel plate portion 10b of the main frame is measured by the distance sensor 38. This distance L is a value corresponding to the distance between the frame 24 and the parallel plate portion 10b, and the compression state of the compression coil spring 33 when the substrate 4 is sandwiched between the claws 17 and 26, that is, the urging force of the spring 33 is obtained. Will be. Therefore, when the substrate 4 is held between the claws 17 and 26 as shown in FIG. 4, if there is a foreign object in the recesses 34 and 35 of the claws 17 and 26, the distance between the frame 24 and the parallel plate portion 10b is bitten. The measured value L by the sensor 38 becomes smaller than a predetermined value (threshold value). Therefore, it can be seen that the spring 33 is in a more compressed state than the compressed state in which an appropriate biasing force is generated, and is not an appropriate biasing force.
[0022]
Thus, the urging force of the compression coil spring 33 when the substrate 4 is clamped by the pair of claws 17 and 26 by the distance sensor 38 can be checked.
Further, when the printed circuit board 4 is gripped by the claws 17 and 26 of the chuck mechanism (in the state of FIG. 4), if the distance L by the distance sensor 38 of FIG. 34, 35) that foreign matter is caught and the urging force of the spring 33 is not appropriate, the machine is stopped and an alarm is issued. That is, the operation stops when the biasing force of the compression coil spring 33 by the distance sensor 38 when the substrate 4 is sandwiched between the pair of claws 17 and 26 is out of the predetermined range. In this way, the substrate 4 is clamped only in a state where the urging force of the spring 33 becomes an appropriate value.
[0023]
Next, the operation of the jet soldering apparatus configured as described above will be described.
First, the robot 1 transports the chuck mechanism 3 at the tip of the arm 2 to a temporary storage place for the printed circuit board 4 and holds the printed circuit board 4 by the claws 17 and 26 by the motor 12 of the chuck mechanism 3 as shown in FIG. To do. As shown in FIG. 6, the printed circuit board 4 is an object to be soldered on which electronic components and the like are mounted, and soldering is performed on electrode portions and the like.
[0024]
Then, by the operation of the robot arm 2, the printed circuit board 4 is conveyed onto the preheater 5 in FIG. 1 and the printed circuit board 4 is preheated. Then, the printed circuit board 4 is immersed in the solder jet of the primary jet solder tank 6 by operation | movement of the robot arm 2, as shown in FIG. In the primary jet solder bath 6, the solder adheres to the surface to be processed of the substrate 4 by transporting the primary solder jet while bringing the surface to be processed of the substrate 4 into contact therewith.
[0025]
Then, the printed circuit board 4 is immersed in the solder jet of the secondary jet solder tank 7 of FIG. In this secondary jet solder bath 7, the solder attached to the substrate 4 is shaped by conveying the surface of the substrate 4 while being immersed in the secondary solder jet.
[0026]
When the printed board 4 is brought into contact with the solder jet in the primary jet solder tank 6 and the secondary jet solder tank 7, the printed board 4 is thermally expanded. When the deformation force in the surface direction of the substrate 4 due to this thermal expansion exceeds the urging force by the compression coil spring 33 in FIG. 4, the claw 26 moves to the right in FIG. Further, when the printed board 4 is pulled up from the solder jet and the board 4 is cooled, the board 4 contracts. At this time, the claw 26 is also moved to the left in FIG. 4 by the biasing force of the spring 33, and the distance between the claws 17, 26 is narrowed.
[0027]
As described above, in the conventional method shown in FIG. 7, when the thermal expansion force is applied to the substrate 51 when the substrate 51 comes into contact with the solder jet, the substrate 51 cannot be extended in the lateral direction as shown in FIG. It has been transformed into. That is, since the printed circuit board 51 expands due to the heat of the solder jet, the substrate 51 is deformed and a solder failure occurs in a conventional soldering apparatus using conveyor conveyance.
[0028]
In this apparatus, the substrate 4 is gripped by the chuck mechanism 3 attached to the robot arm 2, and a spring 33 is inserted into the chuck mechanism 3 as shown in the conceptual diagram of FIG. Have For this reason, the deformation | transformation of the board | substrate at the time of soldering can be suppressed. That is, in this method, when the spring 33 is added to the chuck mechanism 3 and the substrate 4 is expanded by heat, the thermal expansion force of the substrate 4 is released by the spring 33, and the deformation of the substrate 4 can be avoided. Thus, an expansion space can be secured within the movable range of the chuck claws 17 and 26, and deformation of the substrate 4 can be suppressed.
[0029]
Thus, this embodiment has the following characteristics.
(A) Since the compression coil spring 33 is interposed in the transmission system of the clamping force of the pair of claws 17 and 26 in the chuck mechanism 3, when the printed board 4 comes into contact with the solder jet, the board 4 tends to expand due to heat. However, at this time, the expansion of the printed circuit board 4 is allowed by the compression coil spring 33. As a result, the board deformation due to heat when the board 4 comes into contact with the solder jet can be suppressed, and the soldering quality can be improved.
[0030]
Although the compression coil spring 33 is used as the spring means, any mechanical element may be used as long as it is elastic and can receive stress distortion and store energy.
[Brief description of the drawings]
FIG. 1 is a perspective view of a jet soldering apparatus according to an embodiment.
FIG. 2 is a front view of a jet soldering apparatus.
FIG. 3 is a longitudinal sectional view of a chuck mechanism.
FIG. 4 is a longitudinal sectional view of a chuck mechanism when a substrate is sandwiched.
FIG. 5 is a conceptual diagram when a substrate is sandwiched.
FIG. 6 shows a substrate.
FIG. 7 is a perspective view of a conventional jet soldering apparatus.
FIG. 8 shows a substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 2 ... Arm, 3 ... Chuck mechanism, 4 ... Printed circuit board, 6 ... Primary jet solder tank, 7 ... Secondary jet solder tank, 12 ... Motor, 17 ... 1st nail | claw, 24 ... Frame for 2nd nail | claw , 26 ... second nail.

Claims (5)

A primary jet solder bath and a secondary jet solder bath for jetting molten solder upward;
A chuck mechanism having a pair of claws disposed opposite to each other, moving the claws in a direction approaching and separating, and clamping the substrate by the approach of the claws and releasing the substrate by the separation of the claws; and the chuck The substrate is transported from the primary jet solder bath to the secondary jet solder bath while the substrate is sandwiched by the mechanism, and the substrate is transported while a part of the surface to be processed of the substrate is in contact with the solder jet. Conveying means;
A jet soldering apparatus comprising:
A jet soldering apparatus, wherein a spring means is interposed in a transmission system of a clamping force of a pair of claws in the chuck mechanism, and a side intersecting with the conveyance direction of the substrate is clamped by the pair of claws. In the jet soldering apparatus according to claim 1,
A jet soldering apparatus characterized by checking a biasing force of a spring means when a substrate is sandwiched between a pair of claws by a distance sensor. In the jet soldering apparatus of Claim 2,
A jet soldering apparatus, wherein the operation is stopped when the biasing force of the spring means by the distance sensor when the substrate is sandwiched between the pair of claws is out of a predetermined range. In the jet soldering apparatus according to claim 1,
A jet soldering apparatus, wherein a substrate is transported by a robot arm that transports the chuck mechanism. A jet solder bath for jetting molten solder upward;
A chuck mechanism having a pair of claws disposed opposite to each other, moving the claws in a direction approaching and separating, and clamping the substrate by the approach of the claws and releasing the substrate by the separation of the claws; and the chuck In a state where the substrate is sandwiched by the mechanism, a transport means for transporting the substrate to the jet solder bath and bringing the substrate into contact with the solder jet,
A jet soldering apparatus comprising:
A spring means that is urged in a horizontal direction with respect to the surface to be processed of the substrate is interposed in a transmission system of the clamping force of the pair of claws in the chuck mechanism , and the spring means approaches the pair of claws. A jet soldering apparatus comprising: a first spring means for urging the second spring means; and a second spring means for contracting and deforming as the substrate held between the claws expands .

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