JP3629396B2 - Substrate plating jig - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate plating jig for holding a substrate such as a semiconductor wafer when electrolytic plating is performed.
[0002]
[Prior art]
Conventionally, this type of substrate plating jig is configured such that a current-carrying pin contacts a conductive film formed on a substrate to be plated while the substrate to be plated is held. Then, with the plating jig holding the substrate to be plated, the substrate to be plated is immersed together with the jig in the electrolytic plating solution in the plating bath, and plated between the anode electrode facing the substrate to be plated through the energizing pins. An electric current is applied to perform electroplating.
[0003]
And as a method of sealing to the energization pins, a seal packing that straddles both the substrate to be plated and the holding member that holds the substrate to be plated is used, and the seal packing is tightened with a plurality of bolts so that the surface pressure is evenly distributed. For example, and a method of tightening with a U-shaped clamper as disclosed in Japanese Patent No. 2704966 is employed.
[0004]
The method of applying uniform surface pressure to the seal packing by tightening with the plurality of bolts described above is poor in workability, and it is difficult to equalize the force applied to each bolt. There are problems such as penetration.
[0005]
In addition, the conventional U-shaped clamper has to be clamped at a time to hold the holding members, and the position to be clamped is not fixed, so that the reliability is inferior to provide a stable seal. There is a problem. In addition, since there is a distance between the clamper position and the seal packing, the holding member is required to be strong, and a sturdy holding member structure is required, resulting in a heavy weight.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and an object of the present invention is to provide a substrate plating jig that can easily tighten a seal packing and that can uniformly apply a tightening force to the vicinity of the outer periphery of the seal packing. And
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the invention described in claim 1 includes a plate-like first holding member and a second holding member provided with an annular seal packing and having an opening formed inside the annular seal packing. And by sandwiching and holding the substrate to be plated between the first holding member and the second holding member, the annular seal packing is brought into close contact with the surface of the substrate to be plated, and the plate to be plated of the substrate to be plated is provided. In the substrate plating jig configured such that the surface is exposed to the opening, the one end of the substrate plating jig is supported by the first holding member or the second holding member so as to be rotatable around a fulcrum and holds the substrate to be plated. The first holding member and the second holding member are provided with first and second clampers having a U-shaped cross-section that sandwich both opposite sides of the first holding member and the second holding member.
[0008]
As described above, the first holding member and the second holding member in a state in which the substrate to be plated is held by the first and second clampers supported by the first holding member or the second holding member so as to be rotatable about the fulcrum. Since both sides of the holding member facing each other are sandwiched along the sides, the first and second clampers do not lose the first and second clampers discretely, and the first and second clampers The position where the second holding member is sandwiched is constant, and a stable seal is obtained. Further, the risk of the first and second clampers coming off due to external impact or the like is reduced.
[0009]
In addition, the first and second clampers are rotated around the fulcrum to sandwich the first and second holding members, that is, the lever is used for clamping, so that the clamping force can be reduced and the jig is plated. It is easy to attach the substrate or remove the substrate to be plated from the jig, improving workability.
[0010]
According to a second aspect of the present invention, in the substrate plating jig according to the first aspect, the side that is sandwiched between the first and second clampers of the first and second holding members is close to the outer periphery of the substrate to be plated. It is formed in a shape, and the shape of the side that sandwiches the side of the first and second clampers is formed to have substantially the same shape.
[0011]
As described above, the side edges sandwiched between the first and second clampers of the first holding member and the second holding member are formed in a shape close to the outer periphery of the substrate to be plated, and the side edges of the first and second clampers are formed. Since the shape of the side to be sandwiched is formed in substantially the same shape, the position where the annular seal packing and the first and second holding members are sandwiched approaches, the sealing effect of the annular seal packing is improved, and the sealing effect is improved. The weight of the jig can be reduced without designing the first holding member, the second holding member, and the first and second clampers to be robust.
[0012]
According to a third aspect of the present invention, in the substrate plating jig according to the second aspect of the present invention, the shape of the substrate to be plated is circular, and the side edges sandwiched between the first and second clampers of the first and second holding members Is formed in the shape of a letter close to the outer periphery of the substrate to be plated, and the shape of the side that sandwiches the side of the first and second clampers is formed in the shape of a letter corresponding thereto.
[0013]
As described above, the sides of the first holding member and the second holding member are formed in a U-shape close to the outer periphery of the substrate to be plated, and the sides of the first and second clampers are formed in a U-shape. As in the second aspect of the invention, the sealing effect of the annular seal packing is improved, and the first and second holding members and the first and second clampers are made robust in order to improve the sealing effect. The weight of the jig can be reduced without designing.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are external views showing the configuration of the substrate plating jig of the present invention. In this embodiment, a substrate plating jig for plating a semiconductor wafer will be described as an example, but the present invention is not limited to a semiconductor wafer plating jig. As shown in the drawing, the substrate plating jig according to the present invention includes a plate-like first holding member 1 and a second holding member 2 provided with an annular seal packing 3. The first holding member 1 and the second holding member 2 are coupled to each other by hinge mechanisms 4 and 4 so as to be freely opened and closed.
[0015]
A circular recess 6 in which the semiconductor wafer 5 is accommodated is provided on the upper surface of the first holding member 1, and first energizing contacts 7 are provided on the outer periphery at predetermined intervals. An inner peripheral side of the annular seal packing 3 of the second holding member 2 is an opening 8, and the annular seal packing 3 has a second energization contact 13 that abuts the first energization contact 7 at a predetermined interval in the circumferential direction. Is provided.
[0016]
Reference numerals 9 and 10 respectively denote a first clamper and a second clamper that sandwich both opposing sides thereof in a state where the first holding member 1 and the second holding member 2 are closed (overlapped state). , 12 are supported by the first holding member 1 so as to be rotatable. The first and second clampers 9, 10 are provided with concave grooves 9a, 10a having a U-shaped cross section so that the sides of the first and second holding members 1, 2 overlapping the concave grooves are inserted. It has become.
[0017]
1 shows a state in which the first holding member 1, the second holding member 2, the first clamper 9, and the second clamper 10 are opened, and FIG. 2 shows the semiconductor wafer 5 in the recess 6 of the first holding member 1. FIG. 3 is a diagram showing the mounted state. FIG. 3 closes the first holding member 1 and the second holding member 2, and the first clamper 9 and the second clamper 10 cover the sides of the first holding member 1 and the second holding member 2. It is a figure which shows the state pinched | interposed.
[0018]
In the substrate plating jig configured as described above, the first holding member 1, the second holding member 2, the first clamper 9, and the second clamper 10 are opened as shown in FIG. As shown in FIG. 2, the semiconductor wafer 5 is placed with the surface to be plated facing upward, and the second holding member 2 is rotated around the hinge mechanisms 4, 4 to overlap the first holding member 1. Match. In this state, the first clamper 9 and the second clamper 10 are rotated around the support shafts 11 and 12, and the sides of the first holding member 1 and the second holding member 2 superimposed on the concave grooves 9a and 10a are moved. Insert and pinch.
[0019]
Sides sandwiched between the first clamper 9 and the second clamper 10 of the first holding member 1 and the second holding member 2 are formed in a U-shape so as to approach the outer periphery of the semiconductor wafer 5. The side edges of the first clamper 9 and the second clamper 10 where the concave grooves 9a and 10a are formed are formed in a U-shape.
[0020]
As described above, since the first clamper 9 and the second clamper 10 are supported by the first holding member 1 by the support shafts 11 and 12, respectively, the first clamper 9 and the second clamper 9 are mounted each time the semiconductor wafer 5 is loaded and unloaded. 10 is not separated from the first holding member 1, and the clamper that sandwiches the first holding member 1 and the second holding member 2 is not separated and lost as in the prior art. The first clamper 9 and the second clamper 10 may be attached to the second holding member so as to be rotatable about the support shaft.
[0021]
Further, both sides of the first holding member 1 and the second holding member 2 which are overlapped by the first clamper 9 and the second clamper 10 which are supported by the first holding member 1 so as to be rotatable about the support shafts 11 and 12. Since the side is sandwiched, the position where the first holding member 1 and the second holding member 2 are sandwiched by the first clamper 9 and the second clamper 10 becomes constant, and the sealing state of the annular seal packing 3 is stabilized. In addition, there is no fear that the first clamper 9 and the second clamper 10 are detached due to an external impact or the like.
[0022]
Further, the first clamper 9 and the second clamper 10 are rotated around the support shafts 11 and 12 to sandwich the first holding member 1 and the second holding member 2, that is, by adopting this principle, The force sandwiching the first holding member 1 and the second holding member 2 can be reduced, the semiconductor wafer 5 can be attached to the jig, and the semiconductor wafer 5 can be easily detached from the jig, thereby improving workability.
[0023]
Further, as described above, the sides of the first holding member 1 and the second holding member 2 are formed in a U-shape close to the outer periphery of the circular semiconductor wafer 5, and the first clamper 9 and the second clamper 9 are correspondingly formed. Since the side of the 2 clamper 10 is formed in a square shape, the sealing effect of the annular seal packing 3 is improved, and the first holding member 1, the second holding member 2, and the first clamper are used in order to improve the sealing effect. It is possible to reduce the weight of the jig without designing the 9 and the second clamper 10 firmly.
[0024]
FIG. 4 is a view showing the configuration of the hinge mechanism 4, the cross-sectional shape of the annular seal packing 3, and the contact state between the first energizing contact 7 and the second energizing contact 13. The annular seal packing 3 has a substantially U-shaped cross section, and one end 3 a is in contact with the upper surface of the first holding member 1, and the other end 3 b is in contact with the upper surface of the semiconductor wafer 5. Thereby, even if the surface of the semiconductor wafer 5 on the inner peripheral side of the annular seal packing 3 is in contact with the plating solution, the plating solution penetrates through the tip portion 3b of the annular seal packing 3 and the contact portion of the semiconductor wafer 5. The first energizing contact 7 and the second energizing contact 13 are not exposed to the plating solution.
[0025]
The second energizing contact 13 has a cylindrical shape, and a groove 13a is formed at the tip of the second energizing contact 13 so that the cross section is U-shaped. The first tip 13b is in contact with the conductive film (not shown) exposed on the upper surface of the semiconductor wafer 5, and the other tip 13c is in contact with the upper surface of the first energizing contact 7 through the spring member 14. 2 It is attached to the holding member 2. The first energizing contact 7 is connected to the external terminal 15 (see FIG. 2) by a conductive wire (not shown). Note that 16 is a jig support member, and 17 is a jig mounting member.
[0026]
The hinge mechanism 4 includes a hinge joint 4a attached to the first holding member 1 and a hinge pin 4b attached to the second holding member 2, and is engaged with the hinge joint 4a and the hinge pin 4b. When a predetermined negative voltage is applied to the first energizing contact 7 from the external terminal 15 connected to the negative electrode of the DC power supply, the negative voltage passes through the second energizing contact 13 and is applied to the conductive film formed on the surface of the semiconductor wafer 5. Applied.
[0027]
In the above-described embodiment, the sides of the first holding member 1 and the second holding member 2 are formed in a U-shape close to the outer periphery of the circular semiconductor wafer 5, and the first clamper 9 is correspondingly formed. The side edges of the second clamper 10 are formed in a square shape, but the present invention is not limited to this. For example, as shown in FIG. 5, the side edges of the first holding member 1 and the second holding member 2 are formed. The circular semiconductor wafer 5 may be formed in an arc shape close to the outer periphery, and the side edges of the first clamper 9 and the second clamper 10 may be formed in an arc shape correspondingly.
[0028]
Even if it does in this way, while the sealing effect of the annular seal packing 3 improves, in order to improve a sealing effect, the 1st holding member 1, the 2nd holding member 2, the 1st clamper 9, and the 2nd clamper 10 are designed robustly. This makes it possible to reduce the weight of the jig.
[0029]
【The invention's effect】
As described above, according to the first aspect of the present invention, the first and second clampers supported by the first holding member or the second holding member so as to be rotatable about the fulcrum are used to mount the substrate to be plated. Since the opposite holding sides of the first holding member and the second holding member in the held state are sandwiched along the sides, the following excellent effects can be obtained.
[0030]
(1) The first and second clampers are not scattered and lost from the jig, the positions at which the first and second clampers sandwich the first and second holding members are constant, and a stable seal is obtained.
[0031]
(2) The risk of the first and second clampers coming off due to external impact or the like is reduced.
[0032]
(3) The first and second holding members are sandwiched by rotating the first and second clampers about the fulcrum, that is, the first and second holding members are sandwiched by adopting the lever principle. The power can be reduced, and it is easy to attach and remove the substrate to be plated from the jig, improving workability.
[0033]
According to the second aspect of the present invention, the side edges sandwiched between the first and second clampers of the first holding member and the second holding member are formed in a shape close to the outer periphery of the substrate to be plated. Since the shape of the side that sandwiches the side of the two clampers is formed to be substantially the same shape, the annular seal packing and the position where the first and second holding members are sandwiched approach each other, so the sealing effect of the annular seal packing In addition, the weight of the jig can be reduced without designing the first holding member, the second holding member, and the first and second clampers to be robust in order to improve the sealing effect.
[0034]
According to the third aspect of the present invention, the sides of the first holding member and the second holding member are formed in a U-shape close to the outer periphery of the substrate to be plated, and the sides of the first and second clampers are formed. In the same manner as in the second aspect of the invention, the sealing effect of the annular seal packing is improved, and the first and second holding members and the first holding member are used to improve the sealing effect. And the weight of the jig can be reduced without designing the second clamper firmly.
[Brief description of the drawings]
FIG. 1 is an external perspective view showing a configuration of a substrate plating jig according to the present invention.
FIG. 2 is an external perspective view showing a configuration of a substrate plating jig according to the present invention.
FIG. 3 is an external perspective view showing a configuration of a substrate plating jig according to the present invention.
FIG. 4 is a cross-sectional view showing a configuration near a hinge mechanism of a substrate plating jig according to the present invention.
FIG. 5 is a plan view showing a configuration of a substrate plating jig according to the present invention.
[Explanation of symbols]
Reference Signs List 1 first holding member 2 second holding member 3 annular seal packing 4 hinge mechanism 5 semiconductor wafer 6 recess 7 first energizing contact 8 opening 9 first clamper 10 second clamper 11 support shaft 12 support shaft 13 second energizing contact 14 Spring member 15 External terminal 16 Jig support member 17 Jig attachment member

Claims (3)

A plate-like first holding member; and a second holding member provided with an annular seal packing and having an opening formed inside the annular seal packing, the first holding member and the second holding member A substrate configured such that the annular seal packing is brought into close contact with the surface of the substrate to be plated and the surface to be plated of the substrate to be plated is exposed to the opening by interposing and holding the substrate to be plated. In plating jig,
Both ends of the first holding member and the second holding member facing each other with one end supported rotatably by the first holding member or the second holding member about a fulcrum and holding the substrate to be plated A substrate plating jig comprising first and second clampers having a U-shaped cross-section that sandwiches the substrate along the side. The substrate plating jig according to claim 1,
The side sides sandwiched between the first and second clampers of the first and second holding members are formed in a shape close to the outer periphery of the substrate to be plated, and the side sides sandwiching the side sides of the first and second clampers The substrate plating jig is characterized in that it is formed in substantially the same shape correspondingly. The substrate plating jig according to claim 2,
The shape of the substrate to be plated is circular, and the side edges sandwiched between the first and second clampers of the first and second holding members are formed in a U-shape close to the outer periphery of the substrate to be plated, A substrate plating jig characterized in that a side shape sandwiching the side sides of the first and second clampers is formed in a corresponding U-shape.

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