JP3636063B2 - Electronic component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.
[0002]
[Prior art]
In a mounting apparatus for mounting an electronic component on a substrate, the mounting operation of picking up the electronic component by a suction nozzle mounted on the mounting head and mounting it on the substrate is repeatedly performed. At the time of mounting on the substrate, the electronic component is pressed against the substrate with a predetermined mounting load via the suction nozzle. Conventionally, a method of realizing a predetermined mounting load by adjusting the amount of compressive displacement of a spring provided in the mounting head has been used.
[0003]
[Problems to be solved by the invention]
By the way, the mounting load differs depending on the electronic component to be mounted. In the conventional electronic component mounting apparatus, when multiple types of electronic components with greatly different mounting loads are mounted by the same mounting head, the pressure corresponding to each type There is a problem that it is difficult to realize a mounting operation for a large number of parts by a simple method because a change-over operation is required for changing the product type such as changing a spring for generating a load.
[0004]
Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that can target a plurality of types of electronic components having different mounting loads.
[0005]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that picks up an electronic component from a supply part of the electronic component by a mounting head and mounts the electronic component on a substrate, and abuts the electronic component on the mounting head for suction. A suction nozzle for holding , a nozzle holding portion having a nozzle holder at the bottom for detachably holding the suction nozzle, and a rotary joint portion incorporated in the nozzle holding portion to allow θ rotation of the nozzle holding portion; A vacuum suction source that vacuum-sucks the inside of the suction nozzle through a conduit provided in the rotary joint portion, and a spline shaft that is a nozzle lifting shaft that is coupled to the nozzle holding portion and is held up and down freely When the θ rotary drive means for rotating the splined shaft θ in the upper part of the spline shaft, rotary blanking coupled via a coupling to a rotary shaft of the θ rotary drive means Click and the suction when the electronic component mounting by the action of a downward load by the air pressure to the spline shaft provided at the upper end from above through a conduit formed in the rotation block of the spline shaft A pressing unit that presses the electronic component against the substrate via the nozzle, an air pressure supply unit that supplies air pressure to the pressing unit, and a control unit that controls the pressure of the air pressure supplied from the air pressure supply unit; Equipped with.
[0006]
According to the present invention, the electronic component is placed on the substrate via the suction nozzle when the electronic component is mounted by applying a downward load due to air pressure to the spline shaft that is provided at the upper end portion of the nozzle lifting shaft. By providing a pressing means that presses against the pressure, an air pressure supply section that supplies air pressure to the pressing means, a control section that controls the pressure of the air pressure supplied from the air pressure supply section, etc. It is possible to mount a plurality of types of electronic components having different mounting loads without requiring the above.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. It is a sectional side view of the mounting head of a component mounting apparatus.
[0008]
First, the structure of the electronic component mounting apparatus will be described with reference to FIGS. 1 and 2, a conveyance path 3 is disposed in the X direction on the gantry 2 of the electronic component mounting apparatus 1. The conveyance path 3 conveys the board | substrate 4 with which an electronic component is mounted. Both sides of the conveyance path 3 serve as electronic component supply units. As shown in FIG. 2, a tape feeder 6 for supplying electronic components held on tape is mounted on the supply portion 5A on one side, and a tray containing electronic components is stored on the supply portion 5B on the other side. A tray feeder 7 for supplying 7a is set. FIG. 1 shows a state in which the tape feeder 6 and the tray feeder 7 are removed.
[0009]
At both ends of the gantry 2, Y-axis tables 8 </ b> A and 8 </ b> B are arranged in a direction orthogonal to the conveyance path 3. The Y-axis tables 8A and 8B drive the X-axis tables 9A and 9B in the Y direction, respectively. A mounting head 10 is mounted on the X-axis tables 9A and 9B. By driving the X-axis table 9A and the Y-axis table 8A, the mounting head 10 picks up electronic components from the tape feeder 6 of the supply unit 5A. It is mounted on the substrate 4 on the transport path 3. Further, by driving the X-axis table 9B and the Y-axis table 8B, the mounting head 10 picks up electronic components from the tray 7a held by the tray feeder 7 of the supply unit 5B.
[0010]
The X-axis tables 9A and 9B are equipped with cable bearers 11X and 11Y that accommodate cables connected to the mounting head 10. The cable bearer 11X is disposed along the X-axis tables 9A and 9B, and leads cables to the X-axis tables 9A and 9B via the terminal 12. Further, the cable bearer 11Y guides cables connected to the X-axis table 9A to the fixed portion 13. The cable bearers 11X and 11Y are not shown for the X-axis table 9B.
[0011]
Next, the structure of the mounting head 10 will be described with reference to FIG. In FIG. 3, the mounting head 10 includes a vertical mounting plate 20 and is mounted on the X-axis tables 9 </ b> A and 9 </ b> B by the mounting plate 20. A motor 21 is vertically disposed on a flat surface portion 20 a provided on the upper portion of the mounting plate 20. A rotating shaft 21 a of the motor 21 is coupled to an upper end shaft 23 a of the rotating block 23 through a coupling 22. The lower portion of the rotary block 23 is coupled to the hollow shaft 24, and the hollow portion 23b provided at the coupling portion with the hollow shaft 24 is connected to the positive pressure supply source 25 (pneumatic pressure supply portion) via the pipe line 23c. Has been. The hollow portion 23 b and the pipe line 23 c are formed in the rotating block 23.
[0012]
A housing 28 is fixed to the side surface of the mounting plate 20, and the housing 28 rotatably supports the hollow shaft 24 via upper and lower bearings 29. A spline shaft 31 is vertically inserted into the spline housing 30 mounted in the hollow shaft 24 so as to be movable up and down. The upper end portion of the spline shaft 31 is in contact with the bellophram 26 mounted in the hollow portion 23b, and the lower end portion is coupled to a nozzle block 32 (nozzle holding portion) that holds the suction nozzle 36. As the spline shaft 31 moves up and down, the suction nozzle 36 moves up and down. Therefore, the spline shaft 31 is a nozzle lifting shaft.
[0013]
When the positive pressure supply source 25 is driven to apply a positive pressure into the hollow portion 23b from above through the pipe line 23c above the spline shaft 31 , the belofram 26 presses the spline shaft 31 downward by this pressure. That is, the bellophram 26 serves as a pressing unit that presses the electronic component against the substrate via the suction nozzle 36 by applying a downward load due to air pressure to the nozzle lifting shaft. At this time, the pressure load for pressing the electronic component is controlled by controlling the pneumatic pressure supplied from the positive pressure supply source 25 by the control unit 40. It should be noted that other types of air actuators other than belofram may be used as the pressing means.
[0014]
The lower part of the nozzle block 32 coupled to the lower end of the spline shaft 31 is a nozzle holder 35 to which the suction nozzle 36 is detachably mounted. When the suction nozzle 36 is mounted, the suction of the suction nozzle 36 is achieved. The hole 36a is connected to the vacuum suction source 34 via a pipe line 33 provided in the rotary joint portion 32a (described later) . By driving the vacuum suction source 34, vacuum suction is performed through the pipe line 33, whereby the electronic component is vacuum-sucked and held in the suction hole 36 a of the suction nozzle 36. A filter 38 is attached to the nozzle holder 35 so as to collect foreign matters during vacuum suction.
[0015]
By rotating the motor 21, the rotation is transmitted to the nozzle block 32 via the rotary block 23, the hollow shaft 24, the spline housing 30, and the spline shaft 31. As a result, the suction nozzle 36 rotates in the θ direction together with the nozzle block 32. The motor 21 is a θ-rotation driving means that is above the spline shaft 31 and rotates theta by θ.
[0016]
Therefore, the rotation position in the θ direction of the electronic component sucked and held by the suction nozzle 36 can be arbitrarily adjusted. In this rotation, the rotary joint portion 32a incorporated in the nozzle block 32, the rotation θ of the nozzle block 32 is adapted to be acceptable with respect to the vacuum suction source 34 connected to the conduit 33. The rotary joint portion 32 a is prevented from turning by a turning stop member 37.
[0017]
When mounting the electronic component held by the suction nozzle 36 on the substrate, it is necessary to press the electronic component with a predetermined mounting load determined by the type of the electronic component. This pressing is performed by applying a positive pressure from the positive pressure supply source 25 to the hollow portion 23 b and pressing the spline shaft 31 downward by the bellophram 26. At this time, by adjusting the pressure supplied from the positive pressure supply source 25, the load pressed by the bellophram 26 can be arbitrarily set. Therefore, it is possible to mount various types of electronic components having different mounting loads using the same mounting head 10.
[0018]
This electronic component mounting apparatus is configured as described above, and the mounting operation will be described below. Prior to the start of the mounting operation, a tape feeder 6 is mounted on the supply unit 5A, and a tray feeder 7 holding a tray 7a containing electronic components is mounted on the supply unit 5B. When the mounting operation is started, the mounting head 10 driven by the X-axis table 9A and the Y-axis table 8A picks up an electronic component from the tape feeder 6 of the supply unit 5A and mounts it on the substrate 4 on the transport path 3. . Similarly, the mounting head 10 driven by the X-axis table 9B and the Y-axis table 8B picks up electronic components from the tray 7a of the supply unit 5B and mounts them on the substrate 4.
[0019]
In the process of repeating this mounting operation, when it is necessary to change the setting of the mounting load at the time of mounting according to the type of electronic component, the control unit 40 controls the positive pressure supply source 25 to cope with the mounting load. Supply the pressure. As a result, it is possible to change the setting of the mounting load without performing a setup change operation such as a spring change required in the conventional electronic component mounting apparatus.
[0020]
【The invention's effect】
According to the present invention, pressing for pressing the electronic part to the substrate through the suction nozzle when the electronic component mounting by the action of a downward load by the air pressure to the spline shaft provided at the upper end of the spline shaft Means, an air pressure supply part for supplying air pressure to the pressing means, a control part for controlling the pressure of air pressure supplied from the air pressure supply part, etc. , and adjusting the pressure according to the type of electronic component As described above, a plurality of types of electronic components having different mounting loads can be mounted without performing a setup change operation.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. Cross-sectional side view of mounting head of electronic component mounting equipment [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Conveyance path 4 Board | substrate 5A, 5B Supply part 8A, 8B Y-axis table 9A, 9B X-axis table 10 Mounting head 21 Motor 25 Positive pressure supply source 26 Bellofram 32 Nozzle block 34 Vacuum suction source 36 Adsorption nozzle 40 Control unit

Claims (1)

An electronic component mounting apparatus that picks up an electronic component from a supply unit of an electronic component by a mounting head and mounts the electronic component on a board, and a suction nozzle that contacts and holds the electronic component on the mounting head, and attaches and detaches the suction nozzle A nozzle holding part having a nozzle holder to be freely held at the lower part, a rotary joint part incorporated in the nozzle holding part to allow θ rotation of the nozzle holding part, and a pipe line provided in the rotary joint part A vacuum suction source for vacuum suction through the suction nozzle , a spline shaft which is a nozzle lifting shaft having a lower end coupled to the nozzle holding portion and held up and down , and a spline above the spline shaft. and theta rotational drive means for rotating the shaft theta, a rotating block which is coupled via a coupling to a rotary shaft of the theta rotation driving means, the upper end portion of the spline shaft With respect to the substrate an electronic component through the suction nozzle when the electronic component mounting by the action of a downward load by the air pressure from above through the provided pipe path formed in the rotary block relative to the spline shaft Electronic component mounting comprising: a pressing unit that presses; an air pressure supply unit that supplies air pressure to the pressing unit; and a control unit that controls the pressure of the air pressure supplied from the air pressure supply unit. apparatus.

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