JP3650532B2 - Print circuit board disassembly processing method and disassembly processing system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
Disclosed is a printed circuit board that removes mounted electronic components and various molded products from the printed circuit board for the purpose of recycling the printed circuit board incorporated in, for example, home appliances and information communication devices. The present invention relates to a processing method and a dismantling processing system.
[0002]
[Prior art]
In recent years, technological development for recycling waste has been actively promoted in various fields in order to conserve the global environment and save resources. In the electric field, technological development to recycle the waste of household electrical appliances that has been generated in large quantities every year has become a development issue that should be promoted rapidly. Among the components of home appliances, technological development to recycle printed circuit boards that have both high content of valuable resources and high content of harmful substances such as lead has become a research theme that should be promoted particularly quickly. Yes.
[0003]
Conventionally, when removing a mounting component from a printed circuit board of a household electrical appliance as waste, the following removal means is generally employed. That is, in the first removing means, the metal blade rotating the printed circuit board while heating the printed circuit board in the tunnel furnace is pressed against the mounting surface of the printed circuit board, thereby scraping the mounted component from the printed circuit board with the metal blade. . In the second removing means, the solder is melted by immersing the soldered portion of the mounted component in the printed circuit board in a molten solder bath, and the mounted component is lifted and removed from the printed circuit board in this state. In the third removing means, the printed circuit board is placed in a mesh drum whose internal temperature is kept higher than the melting temperature of the solder, and the mounted component is removed from the printed circuit board by rotating the mesh drum.
[0004]
[Problems to be solved by the invention]
However, each of the conventional mounting component removal means described above has a problem.
[0005]
In other words, the first removing means is limited to those in which the removable electronic component is mainly surface-mounted on the printed circuit board, and the electronic component is soldered by inserting the lead wire into the mounting hole of the printed circuit board. Etc. cannot be removed easily. Furthermore, among the electronic components mounted with lead wires, it is extremely difficult to remove electronic components that are clinched with lead wires or fixed with eyelets, and the lead wires can be cut or The resin package of the part is easily damaged. Therefore, the printed circuit board and the mounted components which have been removed from the mounting parts and collected at the corners have a drawback that some of them cannot be recycled.
[0006]
Further, since the second removing means requires a large number of dedicated jigs for lifting the mounted component in a state where the solder is melted, it is applied to a disassembly processing system that needs to process a wide variety of discarded printed circuit boards. It is impossible. Furthermore, as with the first removing means, it is not possible to remove an electronic component that is mounted by clinching the lead wire.
[0007]
Further, in the third removing means, in order to raise the temperature of the entire soldered portion in the printed circuit board to be higher than the melting temperature of the solder, the ambient temperature in the mesh drum is set to 30 to 40 ° C. higher than the melting temperature of the solder. It needs to be raised to some extent. Under such a high temperature, there is a high possibility that an electrolytic capacitor or the like of the mounted parts will burst, and there is a disadvantage that costs for maintaining safety increase. Similarly to the first and second removing means, it is not possible to remove electronic components mounted by clinching the lead wires.
[0008]
Furthermore, since the printed circuit board cannot be completely separated into individual members such as a board body, a mounting component, solder, and copper foil, it is not possible to efficiently recycle them.
[0009]
Therefore, the present invention has been made in view of the above-described conventional problems, and can easily and reliably remove an electronic component mounted by clinching or eyelet of a lead wire from a printed circuit board. A method for disassembling a printed circuit board and a method for disassembling a printed circuit board that can be disassembled into a substrate body, a mounting component, and a molded product can be disassembled and can be disassembled with the same configuration. It aims at providing the dismantling processing system which can be embodied.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a printed circuit board disassembly processing method according to the present invention includes a solder surface component removing step of removing an electronic component mounted on a solder surface of the printed circuit board while melting the solder, Remove the solder surface after removing Predetermined depth A solder surface cutting step for cutting, a component surface component peeling step for melting the solder on the component surface opposite to the solder surface of the printed circuit board, and peeling the electronic component mounted on the component surface; The part surface after peeling off the electronic parts Predetermined depth And a part surface cutting process for cutting.
[0011]
In this method of disassembling a printed circuit board, in general, prior to removing an electronic component with a lead wire mounted on the component surface, the electronic component surface-mounted on the solder surface is removed while melting the solder, and then soldered. Face Predetermined depth Even if there is an electronic component that is mounted by clinching the lead wire inserted through the mounting hole or through hole from the component surface on the solder surface side and an electronic component fixed by eyelet on the solder surface side, These electronic components can be easily peeled off while melting the solder on the component surface after cutting and removing the joint portion with the solder surface in advance. For this reason, this disassembly processing method can easily and surely remove all the various electronic components mounted while preventing the occurrence of inconveniences such as damage to the resin package. The printed circuit board can be efficiently recovered in a recyclable and good state.
[0012]
Further, in the solder surface cutting step and the component surface cutting step in the dismantling method, all of the solder, solder resist, copper foil, etc. on the solder surface and the component surface are cut and removed, respectively, and the entire surface of the printed circuit board main body is removed. It is preferable to expose.
[0013]
As a result, the board body of the printed circuit board is recovered in a state where paper phenol or glass epoxy, which is a constituent material of the printed circuit board, is exposed over the entire surface. Can be effectively reused.
[0014]
Furthermore, in the dismantling method, the board body from which all the formations on both sides of the printed circuit board are removed, various electronic components removed from the board body, solder and copper foil metals removed from the board body, It is preferable to collect and collect resins such as resists individually.
[0015]
As a result, not only the board body, but also each component collected separately and individually can be effectively reused for optimal recycling purposes by member, so recycling efficiency and removal of harmful substances such as lead Both rates improve.
[0016]
The printed circuit board disassembly processing system of the present invention is mounted on the solder surface of the printed circuit board. Ruden Solder surface part removal device that removes child parts while melting solder, and front Power saving Arrangement of the printed circuit board with the child parts removed with the solder surface facing upward Hard The solder surface is removed by a solder surface cutting cutter. Predetermined depth The solder surface cutting device that cuts and exposes the entire surface of the printed circuit board main body, and the printed circuit board that is transferred from the solder surface cutting device, with the component surface opposite to the solder surface facing upward. Orientation In And is mounted on the component surface. Ruden Parts removal device that removes child parts with a blade and front Power saving The component surface of the printed circuit board from which the child component has been peeled is removed with a component surface cutting cutter. Predetermined depth A component surface cutting device for cutting and exposing the entire surface of the substrate body.
[0017]
This disassembly processing system for a printed circuit board can surely obtain the above-described effects of the disassembly processing method while realizing the disassembly processing method of the present invention with a relatively simple configuration.
[0018]
Further, the solder surface component removing apparatus in the dismantling processing system described above embeds electronic components with lead wires on the component surface in a large number of substrate holding media housed therein, so that the solder surface of the printed circuit board faces upward. A substrate fixing tank for fixing the soldering surface in place, a substrate heating heater for heating the solder surface to a temperature equal to or higher than the melting temperature of the solder, and rotating to remove the surface mounted electronic component by moving in contact with the solder surface while rotating. It can be set as the structure with a brush.
[0019]
This makes it possible to reliably and easily remove electronic components such as hard chip resistors, chip capacitors, and jumper wires that are surface-mounted on the solder surface of the printed circuit board, and to remove the solder surface after removing the electronic components. It is possible to extend the life of a cutting cutter for cutting.
[0020]
Further, the solder surface cutting apparatus in the dismantling processing system described above embeds electronic components with lead wires on the component surface in a large number of substrate holding media housed therein, so that the solder surface of the printed circuit board faces upward. A substrate fixing tank for fixing by placement, a solder surface cutting cutter that moves along the solder surface while rotating, and cuts the solder surface to a predetermined depth at which the substrate body of the printed circuit board is exposed; and a solder surface It can be set as the structure which has a dust collector which sucks cutting powder from the suction inlet which moves upwards and is located upwards with respect to the cutter for cutting.
[0021]
As a result, the printed circuit board can be reliably fixed in the positioning state while preventing damage to the electronic components even though the electronic components with lead wires are still mounted on the component surface. In addition, the cutting powder generated by cutting the solder surface by the solder surface cutting cutter is efficiently recovered by the dust collector from the suction port that is located above and moves integrally with the part surface cutting cutter. The resources such as reusable solder, copper, and resin contained in can be efficiently recovered, and the scattering of harmful substances can be prevented.
[0022]
Further, the component peeling apparatus in the dismantling processing system includes a plurality of substrate pressing rods that press the component surface of the printed circuit board placed on the surface plate with a heater against the surface plate with a heater, and a pressing by the substrate pressing rod. And the board chuck portion for chucking and moving the printed circuit board with the stripping blade in contact with the component surface.
[0023]
As a result, the printed circuit board is pressed against the surface plate with the heater by the plurality of substrate pressing rods, so that the degree of adhesion between the printed circuit board and the surface plate with the heater is increased. For this reason, the printed circuit board is efficiently transferred from the surface plate with a heater to increase the rate of temperature increase, and the temperature variation is reduced and the temperature is increased so that the entire temperature becomes substantially uniform. To improve efficiency. In addition, the thermal damage of the electronic component can be significantly reduced as compared with the case where the electronic component is put in a high ambient temperature.
[0024]
In addition, each of a plurality of the dismantling processing system substrate The presser rod has the same weight with a weight at the upper end. Things When the rod holding plate is slidably inserted into each rod insertion hole of the rod holding plate that is horizontally disposed and freely movable up and down, and the rod holding plate is raised to the upper limit position, the weight portion is inserted into the insertion hole. When the rod holding plate is lowered to the lower limit position when the rod holding plate is lowered to the lower limit position, it is held on the upper surface of the printed circuit board. The printed circuit board may be provided so as to abut on a component and press the printed circuit board against a surface plate with a heater by a pressing force due to its own weight.
[0025]
As a result, the temperature of the printed circuit board can be increased at a substantially uniform temperature while increasing the heating rate, and the efficiency can be improved as the process tact time is shortened. In addition to obtaining the effects that can be obtained, when the plurality of board pressing rods also contact the upper surface of the mounted electronic component in addition to the component surface of the printed circuit board, the printed circuit board and the electronic component Depending on the height difference of the electronic parts, the contact height position of the lower end of each board holding rod is different, but both of them are pressed by the same weight, so the entire printed circuit board is covered. A substantially uniform pressing force can be applied. Therefore, since it is not necessary to arrange the board holding rod in an arrangement avoiding electronic components, the board holding rod is applied to various printed circuit boards having different arrangement positions of electronic parts, and a substantially uniform pressing force is applied to the whole. be able to.
[0026]
Further, the plurality of rod insertion holes of the rod holding plate in the dismantling processing system are configured such that a plurality of rows are radially extended around one point corresponding to the positioning end of the printed circuit board. Can do.
[0027]
Accordingly, in addition to the effect that it can be applied to various printed circuit boards having different arrangement positions of electronic components and a substantially uniform pressing force can be applied to the entire printed circuit board, the shape dimensions from small to large are different. A substantially uniform pressing force can be applied to various printed circuit boards throughout.
[0028]
Further, the component surface cutting apparatus in the dismantling processing system is transported by a plurality of substrate feed rollers that rotate in the same direction and transport a printed circuit board placed above to the next process, and the substrate feed rollers. Cutting the printed circuit board to a predetermined depth while rotating a component surface of the printed circuit board being transferred, a plurality of board pressing rollers for pressing and holding the printed circuit board against each of the board feed rollers, and the printed circuit It can be set as the structure which has the cutter for component surface cutting which exposes the board | substrate body in a board | substrate, and the dust collector which sucks cutting powder from the suction inlet located above the said cutter for component surface cutting.
[0029]
As a result, since the printed circuit board has all the mounted electronic components on both sides removed, the printed circuit board is transferred to the next process as the board feed roller rotates while being held between the board feed roller and the board pressing roller. The part surface can be cut with a cutting cutter, and the tact time can be shortened to improve the efficiency. In addition, cutting powder generated by cutting the part surface is collected in the dust collector from the suction port located above the part surface cutting cutter, so reusable solder, copper, resin, etc. contained in the cutting powder It is possible to collect the resources and prevent the scattering of harmful substances.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
[0031]
[First Embodiment]
FIG. 1 is a schematic longitudinal sectional view showing a printed circuit board disassembly processing system that embodies the printed circuit board disassembly processing method according to the first embodiment of the present invention. In this figure, the printed circuit board disassembly processing system includes a preprocessing device 1, a solder surface component removing device 2, a solder surface cutting device 3, a component stripping device 4, and a component surface cutting device 5 in the order of disassembly processing steps. It has a configuration in which they are juxtaposed sequentially from left to right in the figure.
[0032]
In the preprocessing apparatus 1, the printed circuit board 7 to be disassembled is placed on the work table 8 with the component surface 7 a facing upward, and the electronic components 11, 12 attached to the printed circuit board 7. A pretreatment for removing the metal frame 9 and the screws 10 other than the above is performed. Accordingly, the pre-processed printed circuit board 7 has an electronic component 11 with a lead wire on the upper component surface 7a and a surface-mounted electronic component 12 or an electronic component 11 with a lead wire on the lower solder surface 7b. The lead wire 11a to which the solder is attached remains around.
[0033]
Next, the pre-processed printed circuit board 7 is turned upside down and transferred to the solder surface component removing device 2 in an arrangement in which the solder surface 7b faces upward, and is stored in a full state inside the substrate fixing tank 13. By embedding each electronic component 11 with a lead wire in the substrate holding medium 14 made of a steel ball, it is securely fixed in a positioning state. Subsequently, the upper solder surface 7b of the fixed printed circuit board 7 is heated by the substrate heating heater 17 so as to have a temperature equal to or higher than the temperature at which the solder adhering to the solder surface 7b melts. At the same time, on the solder surface 7b heated to a high temperature, the metallic rotating brush 18 that rotates in the direction of the arrow shown in FIG.
[0034]
As a result, the surface mounted electronic component 12 such as the hard chip resistor and the chip capacitor mounted on the solder surface 7b, the jumper wire 11a, and the like are surely secured by the rotating brush 18 in a state where the solder is melted and the fixing is released. In addition, the life of a later-described solder surface cutting cutter 21 for cutting the solder surface 7b after the removal of the electronic component 12 can be increased. Here, the solder fume generated when the solder is in a molten state is also harmful to the human body, and therefore is sucked into the exhaust device 19 installed above and quickly removed from the upper space of the printed circuit board 7.
[0035]
The printed circuit board 7 from which the surface-mounted electronic component 12 on the solder surface 7b has been removed in this way is transferred to the solder surface cutting device 3 as it is, and is fixed on the same substrate as the solder surface component removing device 2. By embedding each electronic component 11 with a lead wire in a substrate holding medium 14 made of steel balls housed in a filled state inside the tank 20, it is securely fixed in a positioning state. Subsequently, the solder surface 7b above the fixed printed circuit board 7 is moved in the illustrated arrow direction while contacting with the solder surface cutting cutter 21 rotating in the illustrated arrow direction, so that a predetermined depth is obtained. Only cut. The cutting powder 22 generated by the cutting is sucked from a suction port 24 that is located above and moves integrally with the solder surface cutting cutter 21 in order to recover resources and prevent the scattering of harmful substances. And collected in the dust collector 23. The collected cutting powder 22 contains solder, copper, resin, paper, glass, and the like, and those that can be reused as resources are collected.
[0036]
Next, the printed circuit board 7 taken out from the board fixing tank 20 of the solder surface cutting device 3 is turned upside down again and transferred to the component stripping device 4 with the component surface 7a facing upward. After being placed on the surface plate 28, it is pressed against the surface plate 28 with heater by the substrate pressing rod 29 that has been lowered. Thereby, the printed circuit board 7 is heated from the surface plate 28 with a heater, and further heated by a hot air from a hot air heater 30 as an auxiliary heat source, thereby raising the temperature to a temperature equal to or higher than the melting temperature of the solder in a short time. To do. Subsequently, the stripping blade portion at the tip of the stripping blade 31 that has been lowered is brought into contact with the component surface 7 a of the printed circuit board 7, and one end portion of the printed circuit board 7 is chucked by the substrate chuck portion 32. Is done.
[0037]
In the above state, the printed circuit board 7 is pulled by the pulling device (not shown) via the board chuck portion 32 and moved in the direction of the arrow shown in the drawing after the pressing by the board pressing rod 29 is released. At this time, since the various electronic components 11 with lead wires on the component surface 7a are melted and the fixation with the printed circuit board 7 is released, the tips of the stripping blade 31 that slides on the component surface 7a It is removed by the stripping blade part. Here, the solder fume generated when the solder is in a molten state is harmful to the human body, so it is sucked into the exhaust device 26 installed at the upper part and quickly removed from the upper space of the printed circuit board 7. The
[0038]
Finally, the printed circuit board 7 is transferred to the component surface cutting device 5, placed on the plurality of board feed rollers 34, and pressed onto each board feed roller 34 by the plurality of board press rollers 37, It is sandwiched and held between each substrate pressing roller 37 and each substrate feeding roller 34. In this state, the printed circuit board 7 is transferred in the direction indicated by the arrow in accordance with the rotation of each board feed roller 34, and the component surface 7 a has a predetermined depth by the component surface cutting cutter 38 that rotates in the direction indicated by the arrow. It will be cut.
[0039]
Thus, since all the mounted electronic components 11 and 12 of both surfaces 7a and 7b have been removed, the printed circuit board 7 is held between the board feed roller 34 and the board pressing roller 37 in the state of being held by the board feed roller 37. Since the component surface 7a is cut by the component surface cutting cutter 38 while being transferred to the next process with the rotation of 34, the tact time of the process can be shortened and the efficiency can be improved. The cutting powder 39 generated by this cutting is sucked from a suction port 41 disposed above the component surface cutting cutter 38 in order to recover resources and prevent the scattering of harmful substances, and then enter the dust collector 40 via the duct 42. To be collected. Since the collected cutting powder 39 contains solder, copper, resin, paper, glass, etc., those that can be reused as resources are collected.
[0040]
In the dismantling processing system, a large-sized substrate fixing tank that can be shared by the solder surface component removing device 2 and the solder surface cutting device 3 is provided, and the metal rotating brush 18 and the solder surface are provided above and below the substrate fixing tank. By installing the cutting cutter 21, a configuration in which a solder surface processing device having a configuration in which the solder surface component removing device 2 and the solder surface cutting device 3 are combined can be provided. Thereby, the removal of the surface-mounted electronic component 12 on the solder surface 7b in the printed circuit board 7 and the cutting of a predetermined depth can be performed in a continuous process.
[0041]
Furthermore, after embedding each electronic component 11 with lead wires in the substrate holding medium 14 and fixing the printed circuit board 7 in the positioning state, a magnetic force is applied to the steel balls as the substrate holding medium 14. The printed circuit board 7 can be more reliably fixed, and the removal process of the surface-mounted electronic component 12 on the solder surface 7b and the cutting process of a predetermined depth can be performed more smoothly. Furthermore, in the above embodiment, the hot air heater 30 is exemplified as the auxiliary heat source of the component stripping device 4, but instead of this, even if a radiant heater is used as the auxiliary heat source, the temperature can be increased rapidly and effectively. can do.
[0042]
Next, the disassembly processing by the disassembly processing system will be described in more detail with reference to FIG. 2 and FIG. FIG. 2A shows a longitudinal sectional view of a single-sided mounted printed circuit board 7A, and a predetermined circuit is formed on the solder surface 7b by printing a copper foil 51. The copper foil 51 is formed by a solder resist 52. It is covered and protected in an insulated state with respect to the outside, and silk printing ink 53 adheres on the solder resist 52. In the electronic component 11 with a lead wire, the lead wire 11a inserted through the mounting hole 7c from the component surface 7a is fixed in an electrically connected state to the copper foil 51 by a solder fillet 54.
[0043]
Since this single-sided printed circuit board 7A is pre-processed by the pre-processing device 1, there is no electronic component to be removed on the solder surface 7b. 3, the solder surface 7 b is cut by the solder surface cutting cutter 21. At this time, as shown in FIG. 6B, the single-sided mounted printed circuit board 7A has all the members on the solder surface 7b, that is, the copper foil 51, the solder fillet 54, the solder resist 52, the silk printing ink 53, and the leads. The line 11a is cut and removed, and a material such as paper phenol or glass epoxy constituting the substrate body 7e is exposed over the entire surface. Thereby, since the substrate body 7e is recovered in a state in which the impurities are not mixed in, the usage as a recycled material is widened and can be effectively reused.
[0044]
FIG. 3A shows a longitudinal sectional view of the double-sided printed circuit board 7B. A predetermined circuit is formed on the component surface 7a and the solder surface 7b by a printed copper foil 51. The copper foil 51 is covered with a solder resist 52 and protected from the outside. An ink 53 for silk printing adheres on the resist 52. In the electronic component 11 with a lead wire, the lead wire 11a inserted through the through hole 7d from the component surface 7a is fixed to the copper foil 51 in an electrically connected state by a solder fillet 54. Although not shown, the surface-mounted electronic component 12 is mounted on the component surface 7b.
[0045]
The double-sided printed circuit board 7B is pre-processed by the pre-processing device 1, and then the surface-mounted electronic component 12 is removed by the solder-side component removing device 2, and the solder-side cutting device 3 is further used for cutting the solder surface. By cutting the solder surface 7b to a predetermined depth by the cutter 21, as shown in FIG. 5B, all members on the solder surface 7b, that is, the copper foil 51, the solder fillet 54, the solder resist 52, The silk printing ink 53 and the lead wire 11a are cut and removed, and a material such as paper phenol or glass epoxy constituting the substrate body 7e is exposed over the entire surface.
[0046]
Next, as shown in FIG. 3C, the double-sided printed circuit board 7B has the electronic component 11 with lead wires removed by the peeling blade 31 of the component surface peeling device 4, and finally, the component surface cutting device. The component surface 7 a is cut by the component surface cutting cutter 38. At this time, as shown in FIG. 4D, the double-sided mounted printed circuit board 7B has all the members on the component surface 7a, that is, the component surface 7a in the copper plating 7f of the copper foil 51, the solder resist 52, and the through hole 7d. A portion existing above is cut and removed, and a material such as paper phenol or glass epoxy constituting the substrate body 7e is exposed over the entire surface. As a result, the substrate body 7e is recovered with a small amount of impurities, as in the case of the single-sided mounted printed circuit board 7A, so that it can be used as a recycled material and can be effectively reused.
[0047]
By the way, as clearly shown in FIGS. 2B and 3B, in both the single-sided mounted printed circuit board 7 </ b> A and the double-sided mounted printed circuit board 7 </ b> B, these solder surfaces 7 b are formed by the solder surface cutting device 3. The substrate body 7e is cut to a depth at which the material is exposed over the entire surface, and all the formations on the solder surface 7b are completely removed. Accordingly, the electronic component 11 mounted by clinching the lead wire 11a inserted from the component surface 7b of the printed circuit boards 7A and 7B into the mounting hole 7c or the through hole 7d on the solder surface 7b side, or the eyelet on the solder surface 7b side. Even if the electronic component 11 fixed by the above is present, the joint portion between the electronic component 11 and the solder surface 7b is all cut and removed by the solder surface cutting cutter 21. The electronic component 11 mounted by the fixing means can be easily and reliably peeled off simply by melting the solder 54 on the component surface 7a.
[0048]
For this reason, since this dismantling processing system can easily remove all of the mounted various electronic components 11 and 12 while preventing the occurrence of inconvenience such as causing damage to the resin package, a wide variety All the printed circuit boards 7A and 7B can be efficiently collected in a recyclable and good state.
[0049]
FIG. 4 is an explanatory diagram showing a flow of a series of disassembly processing processes performed by the printed circuit board disassembly processing system. After the metal frame 9 and the screw 10 are removed by the pretreatment process P1 by the pretreatment apparatus 1, the chip-shaped surface mounting type removed from the printed circuit board 7 in the solder face part removal process P2 by the solder face component removal apparatus 2 The electronic components 12 are collected in the electronic component assembly E, and the solder 54 removed by melting is collected individually in the metal and resin assembly MB. Next, the resin 54 such as the solder 54, the copper foil 51, and the solder resist removed from the solder surface 7b in the solder surface cutting step P3 by the solder surface cutting device 3 is individually collected in the metal and the resin assembly part MB.
[0050]
Further, the electronic components 11 with lead wires, which are relatively large components removed from the printed circuit board 7 in the component surface component peeling process P4 by the component stripping device 4, are collected in the electronic component assembly part E. Finally, the resin 54 such as the solder 54, the copper foil 51, and the solder resist removed in the component surface cutting step P5 by the component surface cutting apparatus 5 is individually collected in the metal and the resin assembly part MB. The substrate body 7e from which all the moldings on both surfaces 7a and 7b have been removed is collected in the substrate assembly portion PB. Thus, in order to individually collect the board body 7e of the printed circuit board 7, the electronic components 11 and 12, the solder 54, the copper foil 51, and the resin 52 that are the substrate surface formation products, not only the board body 7e, Each member that is separated and individually collected can be effectively reused for optimum recycling applications, so that both the recycling efficiency and the removal rate of harmful substances such as lead are improved.
[0051]
[Second Embodiment]
FIG. 5 is a longitudinal sectional view showing a component stripping device 43 in a disassembly processing system for a printed circuit board according to the second embodiment of the present invention, and the devices 1 to 3 and 5 other than the component stripping device 43 are the first. This is the same as the first embodiment. That is, the disassembly processing system of the second embodiment has a configuration in which only the component peeling device 4 in FIG. 1 is replaced with the component peeling device 43 in FIG.
[0052]
In the figure, the same or equivalent parts as those in the component peeling apparatus 4 in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. Next, only different configurations will be described. The component stripping device 43 includes a plurality of substrate pressing rods 29 similar to those shown in FIG. 1, and each of the substrate pressing rods 29 presses the printed circuit board 7 against the surface plate 28 with a heater at the same time. As a result, the degree of adhesion between the printed circuit board 7 and the surface plate 28 with the heater is increased, and heat is efficiently transferred from the surface plate 28 with the heater to the printed circuit board 7. The temperature of the circuit board 7 is increased so that the temperature variation is reduced and the entire circuit board 7 has a substantially uniform temperature. Therefore, in this component stripping device 43, the temperature of the printed circuit board 7 can be quickly increased to the melting temperature of the solder 54 in a short time without using an auxiliary heat source such as the warm air heater 30 in the first embodiment. The temperature can be raised. The stripping operation of the electronic component 11 with a lead wire by the component stripping device 43 is as described in FIG.
[0053]
Instead of the plurality of substrate pressing rods 29 described above, the printed circuit board 7 has a configuration in which a number of suction holes are formed in the surface plate with heater 28 and an air intake device is installed below the surface plate with heater 28. The same effect as described above can be obtained by sucking the air through the suction holes from the intake device and bringing it into close contact with the surface plate 28 with a heater.
[0054]
[Third Embodiment]
FIG. 6A is a sectional plan view showing a component stripping device 44 in a disassembly processing system for a printed circuit board according to the third embodiment of the present invention, and FIG. The devices 1 to 3 and 5 other than the take-up device 44 are the same as those in the first embodiment. That is, the disassembly processing system of the third embodiment has a configuration in which only the component peeling device 4 in FIG. 1 is replaced with the component peeling device 44 in FIG.
[0055]
In the figure, the same or equivalent components as those in the component stripping device 4 in FIG. In this component stripping device 44, the horizontally disposed rod holding plate 48 has an upper limit position indicated by a two-dot chain line and a lower limit position indicated by a solid line above the place where the printed circuit board 7 is placed on the surface plate 28 with a heater. It is provided to move up and down within the range. A plurality of rod insertion holes 47 are formed in the rod holding plate 48 in such a manner that a plurality of rows extend radially around one point corresponding to the positioning end portion (left end portion in the figure) of the printed circuit board 7. Each rod insertion hole 47 is slidably inserted from above with a substrate pressing rod 49 of the same weight having a weight 50 of a predetermined weight at the upper end.
[0056]
The electronic component 11 with a lead wire is stripped by the component stripping device 44 as follows. That is, in the normal state, the rod holding plate 48 is raised to the upper limit position, and each substrate pressing rod 49 is suspended by the weight portion 50 being engaged with the upper hole edge of the rod insertion hole 47 in the rod holding plate 48. And spaced above the heater-equipped surface plate 28. In this state, the printed circuit board 7 transferred from the solder surface cutting device 3 is placed on the surface plate 28 with a heater. Subsequently, when the rod holding plate 48 is lowered to the lower limit position, each board pressing rod 49 comes into contact with the printed circuit board 7 or the electronic component 11 with lead wires and presses them by its own weight by the weight portion 50. As a result, the degree of adhesion between the printed circuit board 7 and the surface plate with heater 28 is increased, so that the printed circuit board 7 is efficiently transferred from the surface plate with heater 28 to reduce the temperature of the printed circuit board 7 for a short time. Thus, the temperature can be raised rapidly above the melting temperature of the solder.
[0057]
In addition, the plurality of substrate pressing rods 49 have different contact height positions at their lower ends depending on whether the printed circuit board 7 and the electronic component 11 are different and the height of each electronic component 11 is different. Since these are pressed by the same weight, the substantially equal pressing force can be applied to the entire printed circuit board 7. Therefore, the temperature of the printed circuit board 7 is increased so that the temperature variation is reduced and the entire temperature becomes substantially uniform. By the way, when an urging force such as a spring pressure is applied to the plurality of substrate pressing rods 49, the pressing force differs depending on the contact height position of the lower end. The components 11 must be disposed so as to be in contact with each other on the component surface 7a of the printed circuit board 7 and cannot be applied to various printed circuit boards 7 in which the arrangement positions of the electronic components 11 are different. On the other hand, the component peeling device 44 of this embodiment applies a substantially equal pressing force to any printed circuit board 7 over the whole while applying it to various printed circuit boards 7. Can do.
[0058]
Further, in this component peeling device 44, since the plurality of substrate pressing rods 49 are provided in such a manner that a plurality of rows radially extend around one point, a large size indicated by a solid line from a small size indicated by a two-dot chain line. A substantially uniform pressing force can be applied to the various printed circuit boards 7 having different shapes. Therefore, the component peeling device 44 can increase the temperature increase rate and make the temperature uniform for various types of printed circuit boards 7 having different arrangement positions and sizes of the electronic components 11.
[0059]
【The invention's effect】
As described above, according to the method for disassembling a printed circuit board according to the present invention, after the electronic component mounted on the solder surface of the printed circuit board is removed by melting the solder, the solder surface is removed. Predetermined depth Then, the electronic component mounted on the component surface was peeled off while melting the solder, so the lead wire inserted from the component surface into the mounting hole or through hole was clinched on the solder surface side. Even if there is a mounted electronic component or an electronic component fixed by eyelet on the solder side, these electronic components will melt the solder on the component side after cutting the joint with the solder surface in advance. It can be easily and reliably peeled off. Therefore, all the various electronic components mounted can be easily removed while preventing the occurrence of inconveniences such as causing damage to the resin package, so that a wide variety of all printed circuit boards can be recycled. Can be efficiently recovered in a stable state.
[0060]
In addition, the printed circuit board has both sides after removing the electronic components. Predetermined depth Since it is cut, the board body can be recovered in a state where there is little contamination of impurities, and the use as a recycled material can be expanded and reused effectively, and the formation on both sides of the printed circuit board is removed. Therefore, these molded parts can be separately separated and recovered, and these can be effectively reused for optimal recycling purposes by member, recycling efficiency and removal rate of harmful substances such as lead Both improve.
[0061]
Further, according to the printed circuit board disassembly processing device of the present invention, the solder surface component removing device, the solder surface cutting device, the component stripping device, and the component surface cutting device are arranged side by side in the order of the processes. While realizing the processing method with a simple configuration, the above-described effects of the disassembly processing method can be reliably obtained.
[Brief description of the drawings]
FIG. 1 is a schematic longitudinal sectional view showing a printed circuit board disassembly processing system that embodies a printed circuit board disassembly processing method according to a first embodiment of the present invention;
2A is a longitudinal sectional view of a single-sided mounted printed circuit board before being disassembled by the dismantling processing system, and FIG. 2B is a longitudinal sectional view of the circuit board after a solder surface cutting step.
3A is a longitudinal sectional view of a double-sided mounted printed circuit board before being disassembled by the dismantling processing system, and FIG. 3B is a longitudinal sectional view of the circuit board after a solder surface cutting step; FIG. ) Is a longitudinal sectional view of the circuit board after the component surface component peeling process, and (d) is a longitudinal sectional view of the circuit board after the component surface cutting process.
FIG. 4 is an explanatory diagram showing a flow of a series of dismantling processing processes by the dismantling processing system same as above.
FIG. 5 is a longitudinal sectional view showing a component stripping device in a printed circuit board disassembly processing system according to a second embodiment of the present invention.
FIG. 6A is a sectional plan view showing a component peeling device in a disassembly processing system for a printed circuit board according to a third embodiment of the present invention, and FIG. 6B is a longitudinal sectional view thereof.
[Explanation of symbols]
2 Solder surface parts removal device
3 Solder surface cutting device
4 Parts stripping device
5 Parts surface cutting machine
7,7A, 7B Printed circuit board
7a Parts side
7b Solder surface
7e Board body
11 Electronic components with lead wires
12 Surface-mount electronic components
13 Substrate fixing tank
14 Substrate holding medium
17 Heater for substrate heating
18 Rotating brush
20 Substrate fixing tank
21 Solder surface cutting cutter
22 Cutting powder
23 Dust collector
24 Suction mouth
28 Surface plate with heater
29 Substrate presser rod
31 Stripping blade
32 Substrate chuck part
34 Substrate feed roller
37 Substrate pressing roller
38 Cutter for cutting parts
39 Cutting powder
40 Dust collector
41 Suction port
43 Parts stripping device
44 Parts peeling device
47 Rod insertion hole
48 Rod holding plate
49 Substrate presser rod
50 Weight part
51 copper foil
52 Solder Resist
54 Solder

Claims (10)

A solder surface component removal process in which the electronic component mounted on the solder surface of the printed circuit board is removed while melting the solder;
A solder surface cutting step of cutting the solder surface after removing the electronic component to a predetermined depth ;
A component surface component peeling step of melting the solder of the component surface opposite to the solder surface of the printed circuit board and stripping the electronic component mounted on the component surface;
A method for disassembling a printed circuit board, comprising: a component surface cutting step of cutting the component surface after peeling off an electronic component to a predetermined depth . 2. The printed circuit according to claim 1, wherein in the solder surface cutting step and the component surface cutting step, the solder and the copper foil on the solder surface and the component surface are respectively cut and removed to expose the entire surface of the printed circuit board body. A method for disassembling a substrate. The board body from which all the formations on both sides of the printed circuit board are removed, the various electronic components removed from the board body, and the solder and copper foil metals removed from the board body are individually collected and recovered. The method for disassembling a printed circuit board according to claim 2. And the solder surface component removing apparatus to remove while melting the solder implemented have that electronic components on the solder side of the printed circuit board,
With the previous SL electronic said solder surface the printed circuit board parts removed to fixed in an arrangement facing upward, in the printed circuit board by cutting the solder side predetermined depth by soldering surface cutting cutters A solder surface cutting device that exposes the entire surface of the substrate body;
The printed circuit board which is transferred from the solder side cutting device, wherein while heated by location mounting in the arrangement the component side of the opposite side is facing upward and the solder side, electrodeposition that have been mounted on the component side A component stripping device that strips the child parts with a blade,
By comprising a front Symbol electronic components and stripped the printed circuit and the component surface the component side at the cutting cutters predetermined depth cut to part surface cutting apparatus for exposing the entire surface of the substrate main body of the substrate A disassembled processing system for printed circuit boards. Solder side component removal device
A substrate fixing tank for fixing the printed circuit board in an arrangement solder surface facing upward by causing embedded the electronic components of the component surface in a plurality of substrate holding medium housed therein,
A substrate heating heater for heating the solder surface to a temperature equal to or higher than the melting temperature of the solder;
5. The disassembled processing system for a printed circuit board according to claim 4, further comprising a rotating brush that moves in contact with the solder surface while rotating to remove an electronic component on the solder surface . Solder surface cutting device
A substrate fixing tank for fixing the printed circuit board in an arrangement solder surface facing upward by causing embedded the electronic components of the component surface in a plurality of substrate holding medium housed therein,
A solder surface cutting cutter that moves along the solder surface while rotating, and cuts the solder surface by a predetermined depth at which a board body in the printed circuit board is exposed;
6. The disassembled processing system for a printed circuit board according to claim 4, further comprising a dust collector that sucks cutting powder from a suction port that is located above and moves integrally with the solder surface cutting cutter. Parts stripping device
A plurality of substrate pressing rods that press the component surface of the printed circuit board placed on the surface plate with the heater against the surface plate with the heater;
7. A substrate chuck portion for chucking and moving the printed circuit board having a peeling blade abutted against the component surface after releasing the pressing by the substrate pressing rod. A disassembly processing system for a printed circuit board according to claim 1. Each substrate presser rod plurality book be of the same weight with a weight portion on the upper end, is slidably inserted into the rod insertion hole of the rod retaining plate which freely moves up and down is arranged horizontally, When the rod holding plate is raised to the upper limit position, the weight portion is held in a suspended state at an upper position spaced from the printed circuit board by being locked to the upper hole edge of the insertion hole, and the rod holding 5. When the board is lowered to a lower limit position, it is provided so as to abut on a component surface of the printed circuit board or an electronic component and press the printed circuit board against a surface plate with a heater by a pressing force due to its own weight. 8. A dismantling system for a printed circuit board according to 7.   9. The disassembled printed circuit board according to claim 8, wherein the plurality of rod insertion holes of the rod holding plate are formed such that a plurality of rows extend radially around one point corresponding to the positioning end of the printed circuit board. Processing system. The component surface cutting device
A plurality of substrate feed rollers that rotate in the same direction and transport printed circuit boards placed above to the next process;
A plurality of substrate pressing rollers that press and hold the printed circuit boards transferred by the substrate feeding rollers against the substrate feeding rollers;
A component surface cutting cutter that exposes the substrate body in the printed circuit board by cutting only a predetermined depth while rotating the component surface of the printed circuit board being transferred,
10. The disassembled processing system for a printed circuit board according to claim 4, further comprising a dust collector that sucks cutting powder from a suction port located above the component surface cutting cutter.

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