JP3656072B2 - Method for manufacturing gas discharge panel - Google Patents

Description

  The present invention relates to a method for manufacturing a gas discharge panel.

  Conventionally, an AC type plasma display panel (hereinafter referred to as PDP) as shown in FIG. 7 is known as an example of a gas discharge panel.

  The panel configuration and operation of a conventional PDP will be described below with reference to the drawings.

  FIG. 20 is a schematic cross-sectional perspective view of a conventional PDP.

  In the figure, 4 is a front substrate (also referred to as an upper panel substrate), and 8 is a back substrate (also referred to as a lower panel substrate). In the envelope 10, the front substrate 4 and the back substrate 8 are arranged to face each other, and a sealing member 9 made of low melting point glass (see FIG. 21) is formed between the outer peripheral edge portions to form a gas discharge space. And a noble gas (mixed gas of helium and xenon) of 300 Torr to 500 Torr is sealed in the sealed space.

  The front substrate 4 includes a front panel glass 201, a display electrode 1 patterned on the front panel glass 201, a dielectric film 2 formed so as to cover it, and an MgO protective film formed thereon It is composed of three.

  On the other hand, the back substrate 8 includes a back panel glass 202, an address electrode 5 (also referred to as a data electrode) patterned on the surface of the back panel glass 202, and a dielectric 6 formed so as to cover it, It is comprised from the partition 7 which consists of a some rib, and the RGB fluorescent substance 11a-11c apply | coated between these ribs. Here, the partition 7 is a means for partitioning the gas discharge space. The space 12 thus divided becomes a light emitting region, and the phosphor 11 is applied to each light emitting region. The rib of the partition wall 7 and the address electrode 5 are formed in the same direction, and the display electrode 1 is orthogonal to the address electrode 5.

  The envelope 10 configured as described above applies a voltage to the address electrode 5 and the display electrode 1 at an appropriate timing, so that a discharge is generated in the space 12 that is divided by the partition walls 7 and corresponds to the display pixel. Then, ultraviolet rays are generated, and visible light is emitted from the RGB phosphors 11a to 11c excited by the ultraviolet rays and displayed as an image.

Note that the front panel glass and the back panel glass are sealed with discharge gas sealed inside. Generally, however, the pressure of the sealed discharge gas is lower than atmospheric pressure. Thus, the upper end of the partition wall 7, that is, the apex of each rib, and the inner surface of the front panel glass 201 are in contact with each other, and the gap between the front panel glass 201 and the back panel glass 202 is maintained. Therefore, the upper end portion of the partition wall 7 and the inner surface of the front panel glass 201 do not need to be bonded, and are simply in contact with each other.
Next, a method for manufacturing such a conventional PDP will be described with reference to the drawings.

  FIG. 21 is a schematic partial sectional perspective view of the same conventional PDP as shown in FIG.

  As shown in FIG. 21, for the front substrate 4, the electrode 1 is formed on the glass substrate 201, the dielectric 2 is formed over the electrode substrate 1, fired, and a protective film (MgO) 3 is formed on the EB. Films are produced by vapor deposition.

  For the back substrate 8, the electrode 5 is formed on the glass substrate 202, the dielectric film 6 is formed thereon, fired, and a partition wall material is formed on the entire surface by printing, and then sandblasting is performed. Thus, the portion where the partition wall 7 is not formed is scraped off, and the partition wall 7 in a line shape is formed through a baking process. Thereafter, the phosphor 11 is filled between the ribs of the partition wall 7 by a printing method or the like, dried and fired.

  The front substrate 4 and the back substrate 8 thus completed are coated with a low-melting glass as a sealing member 9 and then sealed by baking, and are evacuated from a chip tube (also called a piping member) 13. Then, a rare gas is sealed, the chip is turned off, and the PDP is completed.

  Next, noble gas encapsulation using the tip tube 13 and tip-off will be described in more detail with reference to FIGS.

  That is, as shown in FIG. 21, when manufacturing a conventional PDP (gas-filled vessel), it communicates with the gas discharge space in the envelope 10 through the through-hole 8a formed in the lower panel substrate 8. The piping member 13 to be attached is attached to the external position of the lower panel substrate 8. Next, after the exhaust and the discharge gas are sealed in the envelope (the container before gas filling) 10 through the piping member 13, the inside of the envelope 10 is sealed along with the sealing of the piping member 13. The sealing is done.

  Here, when this piping member 13 is sealed, as shown in FIG. 22A, the sealed portion 13a of the piping member 13 is softened and melted while being heated from the outside using a gas burner 14 or the like. Thereafter, as shown in FIG. 22 (b), after the material portion of the piping member 13 is contracted by moving the lower portion of the softened and melted sealed portion 13a away from the envelope 10, As shown by 22 (c), the method of fusing the piping member 13 is performed. As described above, in the conventional case, since the atmospheric pressure is higher than the internal pressure of the envelope 10, the sealed portion 13a of the piping member 13 in which the material contraction occurs is completely blocked by contraction of the inner wall portion of the piping. Will be.

  Note that the piping member 13 used at the time of exhausting the envelope 10 and sealing the discharge gas remains adhered to the lower panel substrate 8 using the same material as the sealing member 9.

  However, in the configuration of the conventional PDP as described above, the front substrate 4 and the back substrate 8 are fixed by a frit glass (sealing member 9) for sealing, but most of them are applied from the outside. The front substrate is fixed in such a manner that it is pressed against the partition wall by the pressure difference between the atmospheric pressure and a gas of 1 atm or less enclosed between the front substrate and the back substrate, and the shape is maintained.

  The gas to be enclosed is generally 300 Torr to 500 Torr, and the difference from the atmospheric pressure 760 Torr is not so large.

  For this reason, for example, when a conventional PDP is mounted on an airplane or the like and the flight conditions are such that the air pressure inside the airplane is much lower than the normal atmospheric pressure, There has been a problem that the inner surface of the front substrate is lifted from the upper end of the partition wall at the center, and crosstalk occurs.

  Further, even under normal atmospheric pressure, when vibration is applied to the PDP, the front substrate is temporarily separated from the partition wall, so that there is a problem that crosstalk occurs and the image is disturbed.

  For this reason, in the conventional PDP configuration, when mounted on a vehicle such as a train or a bus, there is a problem that an image is disturbed due to vibration or the like.

  Furthermore, the conventional PDP manufacturing process has many firing steps and requires many electric furnaces, so the utility cost is very high and it is difficult to realize efficient production with energy saving. There were also challenges.

  On the other hand, the configuration of the conventional PDP described above has a problem that it is not always possible to obtain sufficiently satisfactory luminance. In order to improve the luminance, it is considered necessary to increase the internal pressure of the discharge gas sealed in the envelope 10 to a level exceeding 500 Torr.

  However, in the conventional structure, when the internal pressure of the discharge gas in the envelope 10 is increased from 760 Torr to 1000 Torr, the space between the upper end of the partition wall 7 formed on the lower panel substrate 8 and the upper panel substrate 4 is increased. In other words, a gap is generated, or the upper panel substrate 4 and the lower panel substrate 8 swell outward.

  As a result, the adjacent space portions 12 separated by the ribs of the partition walls 7 are connected to each other due to the gap, and the display quality of the PDP is deteriorated. Had problems. In addition, when the internal pressure of the discharge gas sealed in the envelope 10 is close to atmospheric pressure or higher than atmospheric pressure, the sealed gas as described in the conventional manufacturing method described above is used. There is also a problem that the sealing method using the atmospheric pressure, which is higher than the pressure, can no longer be adopted.

  An object of the present invention is to provide a method of manufacturing a gas discharge panel that can form a more stable image with less crosstalk than the conventional one in consideration of the above-described problems of the conventional plasma display panel. To do.

  Another object of the present invention is to provide a method for manufacturing a gas discharge panel that can increase the luminance as compared with the conventional case in consideration of the above-described problems of the conventional plasma display panel.

In order to solve the above-mentioned problem, the first present invention includes a first panel substrate having a first electrode,
A second panel substrate having a second electrode facing the first panel substrate;
A sealing portion provided between outer peripheral edge portions of both of the substrates for forming a gas discharge space between the first and second panel substrates;
A partition wall provided on the second panel substrate for partitioning the gas discharge space;
A method of manufacturing a gas discharge panel comprising:
An assembly step of assembling the gas discharge panel using the first panel substrate, the second panel substrate, and the sealing portion;
Attaching a piping member communicating with the gas discharge space to the panel substrate having the through hole via a through hole formed in the first or second panel substrate;
An enclosing step of enclosing a discharge gas in the gas discharge space using the piping member;
A sealing step of sealing the piping member by setting an ambient pressure of the piping member higher than an internal pressure of the sealed discharge gas;
Is a method for manufacturing a gas discharge panel.

  As is apparent from the above description, the present invention can provide a method for manufacturing a gas discharge panel that is less prone to crosstalk than the prior art and can form a more stable image.

  In addition, the present invention can provide a method for manufacturing a gas discharge panel capable of increasing the luminance as compared with the conventional case.

Embodiments of a gas discharge panel and a method for manufacturing the same according to the present invention and a method for manufacturing the gas discharge panel according to the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 is a diagram showing a schematic partial cross section of a plasma display panel (PDP) which is an embodiment of a gas discharge panel according to a technique related to the present invention. The configuration of the PDP according to the present embodiment will be described with reference to FIG.

  This embodiment is basically the same as the configuration of the conventional PDP described with reference to FIG. 20 except that a frit glass 31 is used as an adhesive member of the technology related to the present invention. The frit glass 31 will be described later.

  That is, in FIG. 1, 21 is a front panel glass and 22 is a back panel glass. A display electrode 24 is patterned on the front panel glass 21, and a dielectric film 28 and a protective film 29 are laminated on the display electrode 24 to constitute a front substrate 104.

  On the other hand, the back substrate 108 includes a back panel glass 22, an address electrode 23 patterned on the back panel glass 22, a partition wall 30, and a phosphor 25. The partition wall 30 is integrally formed with a dielectric film covering the address electrode 23, and is formed by spraying alumina in the present embodiment. In addition, as described above, the point that the partition wall 30 is integrally formed with the dielectric film is also different from the structure of FIG. The partition wall 30 is composed of a plurality of plate-like ribs.

  In the PDP 100, the front substrate 104 and the back substrate 108 are opposed to each other, and a sealing member (not shown) made of low-melting glass is formed between the outer peripheral edges to form a gas discharge space. It is configured such that a rare gas (mixed gas of helium and xenon) of 300 Torr to 500 Torr is sealed in the sealed space. The partition wall 30 is a means for dividing the gas discharge space. The space portion 112 partitioned in this way becomes a light emitting region.

  Next, the frit glass 31 that is a feature of the present embodiment will be described.

  The frit glass 31 is previously applied to the upper end of the partition wall 30 in the manufacturing process. Then, the front substrate 104 and the back substrate 108 are arranged to face each other and the panel is sealed, whereby the inner surface of the front substrate 104 and the upper end portion of the partition wall 30 are bonded via the melted frit glass 31. is there.

  There are some small holes on the surface of the partition wall 30. These holes can be formed when the partition wall 30 is formed by a thermal spraying method. Since the frit glass 31 penetrates into the hole of the partition wall 30 when melted, the strength of the partition wall 30 is increased and the adhesive force between the substrates 104 and 108 is increased.

  The partition 30 and the dielectric integrated with the partition 30 can be produced by printing or the like. Further, the partition wall 30 and the lower dielectric may be the same material or different materials.

  Thereby, it is possible to realize a good image quality with less crosstalk and image disturbance.

Further, with such a configuration, the enclosed gas pressure can be increased to atmospheric pressure or higher, and in this case, a high-luminance and high-efficiency PDP can be realized.
(Embodiment 2)
FIG. 2 shows a schematic partial cross section of a PDP which is a second embodiment of the gas discharge panel of the technology related to the present invention. The configuration of the PDP according to the present embodiment will be described below with reference to FIG.

  The configuration of the PDP in the present embodiment is substantially the same as the configuration shown in FIG. 1 except that the bottom of the partition wall 50 is bonded to the back substrate 108 side by the frit glass 52, and the description thereof is omitted. To do.

  As for the partition 50, the frit glasses 31 and 52 are previously apply | coated to the bottom part 50b and the upper end part 50a.

  The frit glass 31 used for bonding the inner surface of the front substrate 21 and the upper end portion 50a of the partition wall 50 may be applied in advance to the upper end portion 50a of the partition wall 50, or a pattern application may be applied in advance to the inner surface of the front substrate 21. Alternatively, it may be bonded to the partition wall 50.

  On the other hand, the frit glass 52 between the partition wall 50 and the dielectric 53 is effective when the material of the partition wall 50 and the material of the dielectric film 53 are different and the adhesive strength between the two is relatively weak. Further, the frit glass 52 has a function of strengthening the partition wall 50 by penetrating into the hole formed in the partition wall 50. The frit glass 52 may be formed at the same time when the partition 50 is formed, or may be patterned on the dielectric 53 in advance and the partition 50 may be formed thereon.

Thus, according to the present embodiment, the same effect as in the first embodiment is exhibited.
(Embodiment 3)
FIG. 3A to FIG. 3E are diagrams showing schematic steps of an embodiment of a method for manufacturing a gas discharge panel according to a technique related to the present invention. A method for manufacturing the PDP according to the present embodiment will be described below with reference to FIG.

  As shown in FIG. 3A, 61 is an address electrode, and 62 is a back panel glass. In this step, the address electrode 61 is formed by patterning on the surface of the back panel glass 62.

  Next, as shown in FIG. 3B, 63 is a dielectric film, and the dielectric film 63 is applied so as to cover the surfaces of the address electrodes 61 and the back panel glass 62.

  Thereafter, as shown in FIG. 3C, a resist 64 is applied to the surface of the dielectric film 63 and is patterned by exposure.

  Next, as shown in FIG. 3D, a partition wall 65 containing alumina as a main component is buried in the portion where the resist 64 has been removed by a thermal spraying method, and then a frit glass 66 is buried. The frit glass 66 may be embedded by thermal spraying, or may be embedded by other methods such as printing or simple squeezing.

  Thereafter, as shown in FIG. 3E, the resist 64 is peeled off, and the upper end of the partition wall 65 is left with a frit glass 66 applied.

  The back substrate manufactured through the series of steps as described above is disposed opposite to the front substrate, sealed by a firing step, and sealed with gas.

  By the above method, a PDP having the same configuration as that described in the first and second embodiments, in which the front substrate and the back substrate are bonded together by the upper end portion of the partition wall 65, can be obtained very simply.

  By adopting such a method, the baking process of the partition walls becomes unnecessary, and energy saving is obtained.

  In addition, the phosphor is applied between the ribs of the partition wall 65 after the formation of the partition walls by the spraying method and the application of the frit glass is completed, and the phosphor is fired and the substrates are bonded and sealed at the same time. The firing process can be made one.

  That is, in the conventional case, the firing process of the barrier ribs, the firing process of the phosphor, and the firing process performed at the time of sealing the whole panel are provided independently, according to the present embodiment. Therefore, the firing process can be reduced by two processes, and a great effect can be expected in the equipment reduction and the reduction of the utility cost.

  In addition, when a meltable glass is included as the partition wall material, a firing step is required. However, by performing the firing step simultaneously with the firing step at the time of sealing the entire panel, In comparison, the firing process can be reduced by two processes.

Moreover, when the adhesive member used for adhesion between the upper end of the partition wall and the inner surface of the front substrate contains meltable glass, an organic binder, and an organic solvent, the organic binder and the organic solvent contained in the adhesive member are removed. Therefore, heating by temporary baking is required. This temporary baking step is provided after the adhesive member is applied and before the panel is sealed.
(Embodiment 4)
4 (a) to 4 (e) are diagrams showing schematic steps of an embodiment of a method for manufacturing a gas discharge panel according to the technique related to the present invention. A method for manufacturing the PDP according to the present embodiment will be described below with reference to FIG.

  As shown in FIG. 4A, 71 is an address electrode, 72 is a dielectric, and 73 is a back panel glass. A mixture of alumina and frit glass, which is a material for forming the partition wall 74, was formed on one surface of the dielectric 72 (indicated by reference numeral 701 in the figure).

  Thereafter, as shown in FIG. 4B, one surface of the frit glass 75 is formed. The partition wall 74 and the frit glass 75 are formed by thermal spraying.

  Note that the frit glass 75 may be applied and baked by a printing method or the like.

  Thereafter, as shown in FIG. 4C, the resist 76 or a dry film is exposed and patterned.

  Thereafter, as shown in FIG. 4 (d), the partition 74 is formed by removing the portion to which the resist 76 is not attached by sandblasting. The frit glass film described in FIG. 4B adheres to the upper end of the partition wall 74.

  Thereafter, as shown in FIG. 4E, a panel is assembled using the front substrate, the back substrate, and the sealing member, and sealed by baking, and at the same time, bonded to the partition wall 74. As described above, the sealing and the bonding between the upper end portion of the partition wall 74 and the inner surface of the front substrate are preferably performed simultaneously from the viewpoint of realizing energy saving in the manufacturing process. Is of course good.

  Further, the phosphor 78 is applied after the partition 74 is formed, but the phosphor 78 may be fired at the time of sealing or separately before sealing.

  This manufacturing method can also reduce the firing process, and has a significant effect on equipment and utility costs.

In this embodiment, since frit glass is mixed with alumina as the partition material, the frit glass fills the pores of alumina at the time of sealing, so the porosity is reduced and a partition wall with less outgas is realized. it can. Therefore, it is possible to reduce the contamination by the impurity gas and to prolong the panel life.
(Embodiment 5)
FIG. 5 is a schematic explanatory diagram of a method for forming partition walls by a thermal spraying method, which is an embodiment of a method for manufacturing a gas discharge panel according to a technique related to the present invention. The thermal spraying method of the present embodiment will be described below with reference to FIG.

  As shown in FIG. 5, 81 is a thermal spraying torch, and 82 is a cooling gas. The cooling gas 82 cools wasteful heat generated by spraying again, and can keep the substrate temperature at 200 ° C. or lower. 83 is raw material powder, and supplies the material which forms the partition 84, and the frit glass 87 in powder form. Reference numeral 86 denotes a dry film that masks a place where a partition wall is not desired to be formed. 85 is a back panel glass, 89 is an address electrode, and 88 is a dielectric film.

  Of the raw material powder 83 melted and ejected from the thermal spraying torch 81, the partition wall material is formed in the gap between the dry film 86 exposed and developed in advance, and is formed to a depth of about 60% of the gap depth, and then the frit glass. No. 87 is sprayed to form a film. Since the thermal spraying is performed while being cooled by the cooling gas 82, the dry film 86 is cooled to a temperature at which there is no damage. Thereafter, the dry film is peeled off to obtain a film in which a frit glass 87 is formed on the upper part of the partition wall 84.

  According to this embodiment, a partition can be formed by a very simple method, and a frit glass film can be formed on the upper end of the partition. This greatly reduces the firing process, equipment, and utility costs. It is effective.

  As described above, according to the present embodiment, the front substrate and the back substrate are bonded to each other. Therefore, even when the internal pressure of the PDP increases, the panel does not swell at the center of the panel as in the past. .

  Even when vibration is applied, different vibrations do not occur due to the difference in resonance frequency due to the difference in mass between the front substrate and the back substrate.

  Therefore, according to the present embodiment, crosstalk and image disturbance may occur even in places where the atmospheric pressure tends to become unstable, such as in airplanes, in places where the atmospheric pressure is low, or in environments where there is a lot of vibration. There are few, and it can implement | achieve favorable image quality.

  In addition, with the configuration as described above, it is possible to increase the sealed gas pressure to atmospheric pressure or higher, thereby realizing a PDP with high brightness and high efficiency.

  In addition, by implementing the manufacturing method of the technology related to the present invention, the firing process can be greatly reduced, and a great effect can be expected in equipment reduction and utility cost reduction.

  As is clear from the description in each of the above embodiments, the PDP of the technology related to the present invention has, for example, a partition formed on the back substrate or the front substrate bonded to the other substrate by frit glass. It has the structure which was made. In addition, for example, the partition wall is formed by a thermal spraying method, and the frit glass to be applied to the upper end of the partition wall is also formed by the thermal spraying method. The partition wall and the front substrate are bonded, and the front substrate and the back substrate are sealed. And firing of the phosphor are performed at once.

  Therefore, since the front substrate and the back substrate are bonded to each other through the frit glass at the upper part of the partition wall, the panel is not cracked and the panel does not swell even when the pressure of the gas in the panel becomes higher than the external pressure. . Therefore, there is no problem such as crosstalk, and a good image can be obtained and safety is high even when mounted on an airplane or the like. Even if vibration or the like is applied to the panel, the front substrate and the back substrate are bonded to each other, so that each substrate does not bend, and a good image can be obtained even in a train, an automobile, and the like. Moreover, since the pressure of the discharge gas sealed inside can be raised to atmospheric pressure or higher by implementing the technology related to the present invention, a high-luminance and high-efficiency PDP can be realized.

  On the other hand, unlike the conventional case, the number of firing processes can be reduced by simultaneously bonding the partition wall and the front substrate, sealing the front substrate and the back substrate, and firing the phosphor, and the electrical energy for manufacturing the PDP. Can be reduced and the cost can be reduced.

Hereinafter, it demonstrates based on drawing centering on embodiment which concerns on the manufacturing method of the gas discharge panel of this invention.
(Embodiment 6)
FIG. 6 is a cutaway perspective view schematically showing a main configuration of a PDP according to an embodiment of a gas discharge panel produced by the method for manufacturing a gas discharge panel of the present invention, and FIG. 7 is a cross-section according to the modification. FIG. 8 is an explanatory view showing a method for sealing a piping member in the method for producing a PDP of the present invention according to the present embodiment. FIG. 9 thru | or FIG. 11 is explanatory drawing which shows the 1st modification thru | or 3rd modification of the method of sealing a piping member, and the sealing procedure of a piping member.

  The overall configuration of the PDP of the present embodiment is basically the same as that of the conventional PDP described with reference to FIGS. 20 and 21, and therefore, the same or equivalent parts as those described with reference to FIGS. Or the same code | symbol is attached | subjected to the part.

  As shown in FIG. 6, the envelope 10 according to the present embodiment has an upper panel substrate 4 and a lower panel substrate 8 facing each other, and the outer peripheral edge portions of both panel substrates 4 and 8 have a low melting point. It is the structure which is sealed by the sealing member 9 which consists of glass, and forms the space for discharge inside.

  The upper panel substrate 4 includes a plurality of display electrodes 1, a low melting point glass dielectric layer 2 covering these display electrodes 1, and a thin-film protective layer 3 made of magnesium oxide formed on the inner surface. It is a made substrate. The lower panel substrate 8 has a plurality of data electrodes 5 and a low melting point glass dielectric layer 6 arranged along the direction orthogonal to the display electrode 1 formed on the inner surface, and the dielectric. This is a glass substrate in which partition walls 7 made of low-melting glass that divide a light emitting region are formed in parallel at predetermined positions on the body layer 6.

  The partition walls 7 are bonded to the uppermost end portion with an adhesive made of a low melting point material such as frit glass having a melting point lower than that of the partition wall 7 made of a material having a melting point of 500 to 600 ° C. (melting point of about 450 ° C.) or water glass. A member 15 is provided, and the partition wall 7 formed on the lower panel substrate 8 and the upper panel substrate 4 are bonded to each other through the bonding member 15.

  In addition, as a forming material of the adhesive member 15, it is also possible to use an ultraviolet-ray adhesive with low hygroscopicity and low outgas, and a general sealing material in a vacuum apparatus. Here, the material of the adhesive member 15 is considered to have a lower melting point than the partition wall 7 in consideration of the convenience in the manufacturing process. It is also possible to use it. Further, the adhesive member 15 may not be provided over the entire length of the rib of the partition wall 7. That is, it goes without saying that the adhesive member 15 may be provided in a state of being separated at each predetermined position.

  By the way, as shown in FIG. 7, the bonding target portion 2 a on the dielectric layer 2 of the upper panel substrate 4, that is, a predetermined portion bonded to the upper end portion of the partition wall 7 through the bonding member 15, and the lower panel Formed portions 6a of the partition wall 7 on the dielectric layer 6 of the substrate 8, that is, the predetermined portions 2a and 6a of the dielectric layer 2 and the dielectric layer 6 or either one of them, or fine irregularities are formed. It may be a rough surface portion. With such a configuration, the anchor effect is exhibited due to the rough surface.

  That is, the adhesive strength between the dielectric layer 2 of the upper panel substrate 4 and the upper end of the partition 7 through the thin protective film 3 and the adhesive member 15, and the dielectric layer 6 and the partition of the lower panel substrate 8. 7 and the adhesive strength between the bottoms of the respective parts increases.

  In order to provide such a rough surface portion, a general method may be used in which sand blasting is performed after a portion that does not require roughening is covered with a mask. In this case, since the dielectric layer 6 of the lower panel substrate 8 is covered with the phosphor 11, the entire surface of the dielectric layer 6 can be roughened.

  Further, a phosphor 11 for realizing color display is applied on the dielectric layer 6 for each light emitting region partitioned by the partition walls 7. Further, inside the envelope 10 in which the upper panel substrate 4 and the partition wall 7 on the lower panel substrate 8 are bonded via an adhesive member 15, a discharge gas formed by mixing helium, xenon, neon, etc. is 500 Torr. It is sealed after an internal pressure exceeding 5,000, for example, an internal pressure of 760 Torr or 1000 Torr.

  In this case, as shown in FIG. 6, the pipe member 13 used at the time of exhausting the envelope 10 and filling the discharge gas is equivalent to the sealing member 9 at a predetermined portion of the lower panel substrate 8. The material remains adhered.

  Further, according to this configuration, even if the outer ambient pressure of the envelope 10, that is, the inner pressure of the envelope 10 is higher than the atmospheric pressure, the upper panel substrate 4 and the lower panel substrate 8 are separated from each other by the partition wall 7. It adhere | attaches with the adhesive member 15 provided in the uppermost end part. For this reason, the adjacent space portions 12 serving as the light emitting regions do not communicate with each other through a gap, and separation between the adjacent space portions 12 is reliably ensured. Does not bulge outward and deform.

  Here, the discharge gas having a pressure exceeding 500 Torr is enclosed in the envelope 10 provided in the PDP. However, the enclosure pressure of the discharge gas does not necessarily have to exceed 500 Torr. Of course, may be 500 Torr or less.

  That is, PDPs are also used in airplanes, trains, etc., and when the aircraft suddenly rises or falls, changes in atmospheric pressure or vibrations caused by running trains may be applied to the PDP. If the upper panel substrate 4 and the lower panel substrate 8 constituting the container 10 are bonded to each other with the adhesive member 15 provided at the uppermost end of the partition wall 7, the envelope 10 can be used even when atmospheric pressure changes or vibrations are applied. It is impossible for the to bulge outward and deform.

  Next, as an embodiment of the method for manufacturing a gas discharge panel according to the present invention, a method for manufacturing the PDP having the above configuration will be described with reference to the drawings.

  First, an upper panel substrate 4 on which a display electrode 1, a dielectric layer 2 and a protective layer 3 are formed, a data electrode 5, a dielectric layer 6 and barrier ribs 7 are formed, and a lower panel on which a phosphor 11 is applied. Each of the substrates 8 is manufactured.

  Then, both the panel substrates are prepared, and an adhesive member 15 made of a low melting point material such as frit glass is provided on the uppermost end portion of the partition wall 7 in the lower panel substrate 8.

  When the adhesive member 15 is provided, a technique such as screen printing or transfer using a stamper is employed. However, the phosphor 11 is applied after the adhesive member 15 is provided by a technique such as lift-off. Is also possible. If the partition wall 7 is formed by screen printing or the like multiple times, the adhesive member 15 can be provided by forming only the uppermost layer of frit glass or the like, or the lower panel substrate. It is also possible to apply frit glass or the like to be the adhesive member 15 to a predetermined portion on the upper panel substrate 4 corresponding to the partition wall 7 on the substrate 8. By the way, in the screen printing, it is common to form a pattern through which an adhesive material having a predetermined viscosity passes in advance on the screen plate contacting the uppermost end of the partition wall 7, but the screen plate itself is bonded to the entire surface. Of course, the adhesive member 15 may be provided only at the uppermost end of the partition wall 7 by screen printing with the material passing therethrough.

  Next, the upper panel substrate 4 and the lower panel substrate 8 are arranged opposite to each other via the partition wall 7 provided with the adhesive member 15 as described above, and the outer peripheral edge portions of both the panel substrates 4 and 8 are disposed. Heating is performed after the sealing member 9 is interposed between them. As a result, the outer peripheral edge portions of the upper panel substrate 4 and the lower panel substrate 8 are sealed by the sealing member 9, and as a result, the envelope 10 is configured. The upper panel substrate 4 and the lower panel substrate 8 are bonded to each other by the adhesive member 15 melted in the heating process at that time.

  Further, a piping member 13 communicating with the inside of the envelope 10 through a through hole 8 a formed in the lower panel substrate 8 constituting the envelope 10 is attached to an external position of the lower panel substrate 8.

  Then, the exhaust process in the envelope 10 and the discharge gas sealing process are performed via the piping member 13.

  Then, when the inside of the envelope 10 is sealed by sealing the piping member 13, the PDP shown in FIG. 6 is completed.

  By the way, when a discharge gas having a pressure exceeding 500 Torr is enclosed in the envelope 10, the sealing of the piping member 13 is performed by, for example, a method as shown in FIG.

  That is, as shown in FIG. 8, first, the piping member 13 that communicates with the inside of the envelope 10 through the through hole 8 a provided in the lower panel substrate 8 constituting the envelope 10 is attached to the lower panel substrate 8. Then, the envelope 10 to which the pipe member 13 is attached is placed at a predetermined position in the high-pressure chamber 16, and the heating means 17 such as a high-frequency heater or an electric heater is placed around the sealed portion 13 a of the pipe member 13. Arrange along.

  The piping member 13 is used to exhaust the inside of the envelope 10, and the discharge gas is further sealed in the envelope 10 until the internal pressure reaches a required internal pressure exceeding 500 Torr.

  Thereafter, the internal pressure of the high-pressure chamber 16 is set higher than the internal pressure of the discharge gas sealed in the envelope 10.

  Thereby, since the internal pressure of the high-pressure chamber 16 is higher than the internal pressure of the envelope 10, the piping member 13 can be sealed by the same procedure as that of the conventional embodiment.

  That is, when the sealed portion 13a of the piping member 13 is softened and melted while being heated by the heating means 17, and the lower portion of the sealed portion 13a is moved away from the envelope 10, it is blown out. The sealed portion 13 a of the member 13 is closed, and the inside of the envelope 10 is sealed with the sealing of the piping member 13. Here, the outer peripheral pressure of the entire envelope 10 is set to be higher than the inner pressure of the discharge gas, and the piping member 13 is sealed. However, it is not necessary to employ such a large-scale method. The sealing of the piping member 13 is performed in the same manner as in the prior art only by setting at least the outer peripheral pressure of the piping member 13 to be higher than the internal pressure of the discharge gas sealed in the envelope 10. Of course, it becomes possible.

  Next, a modified example of the method and procedure for sealing the piping member 13 will be described with reference to FIGS.

  First, FIG. 9A to FIG. 9C show a first modification of the method and procedure for sealing the piping member 13.

  In adopting this method, the sealing jig 17, that is, a semicircular shape in a sectional view or a triangle that presses the pipe member 13 along the radial direction from at least two directions facing along the radial direction of the pipe member 13. A sealing jig 17 is used which has a projection 17a having a shape and the like and has a function of heating the piping member 13 through the projection 17a. That is, in this method, after attaching the piping member 13 communicating with the inside of the envelope 10 through the through hole 8a formed in the lower panel substrate 8 which is the one side panel substrate, and through the piping member 13 After exhausting the envelope 10 and sealing the discharge gas, as shown in FIG. 9A, the projection 17a of the sealing jig 17 is applied to the sealing portion 13a of the piping member 13. After that, as shown in FIG. 9B, the pipe member 13 is heated while being pressed along the radial direction by the projection 17a of the sealing jig 17, and as shown in FIG. The piping member 13 that has been softened and melted with heating is melted. And when this method is adopted, as a result of being pressed by the projection 17a of the piping member 13 which has been softened and melted with heating, although the internal pressure of the envelope 10 is higher than the atmospheric pressure. Since the sealing portion 13a is closed, the piping member 13 can be easily sealed, and the envelope 10 is sealed.

  Further, as in the second modification shown in FIG. 10, a pipe is formed by fitting a cylindrical heating jig 18 to the piping member 13 and heating the heating jig 18 with a gas burner 14 or the like. Piping is performed by softening and melting the sealed portion 13 a of the member 13, pressing the lower portion of the sealed portion 13 a in the direction of the arrow, and twisting the sealed portion 13 a while approaching the envelope 10. It is also possible to seal the member 13. Note that the heating jig 18 here may be any one that can prevent the piping member 13 having an internal pressure higher than the atmospheric pressure from expanding outward, and is not illustrated. It may be produced using a net or the like. By the way, when this heating jig 18 adheres to the piping member 13, the heating jig 18 is left fixed to the piping member 13. Of course, even if 18 is left, no inconvenience is caused.

  Furthermore, the sealing method of the piping member 13 as shown in FIGS. 11A and 11B can be employed instead of the above sealing method.

  That is, in the method according to the third modification, the piping member 13 communicating with the inside of the envelope 10 is attached through the through hole 8a formed in the lower panel substrate 8 which is the one side panel substrate, and the piping member 13 After the exhaust gas inside the envelope 10 and the discharge gas sealing are sequentially executed via the pipe, as shown in FIG. 11 (a), it is manufactured as a short bar shape made of a material having a lower melting point than the piping member 13. In addition, the sealing member 19 accommodated in the piping member 13 was melted while being heated from the outside with a gas burner 14 or the like, and the piping member 13 was closed as shown in FIG. The top sealing is performed. And the unnecessary part of the piping member 13 sealed with the sealing member 19 is removed after adopting a technique such as cutting. It should be noted that the sealing member 19 at this time is one that has been stored in the piping member 13 that is already attached to the lower panel substrate 8 even if it is previously stored in the piping member 13. Alternatively, a black pigment or the like may be mixed, and the heat absorption may be excellent, and the pigment may be melted by laser light irradiation.

  In the case where a discharge gas having a filling gas pressure of 500 Torr or less is enclosed in the envelope 10 as described above, it is common to employ a manufacturing method having a procedure similar to the conventional one. However, in such a case, that is, even when the internal pressure of the envelope 10 at the time of manufacture is lower than the external pressure, the method of the present embodiment may be adopted.

As is apparent from the above description, the gas discharge panel according to the present invention is bonded, for example, with the panel substrates constituting the envelope being bonded via an adhesive member provided at the uppermost end of the partition wall. In this case, a discharge gas having a pressure exceeding 500 Torr may be enclosed in the envelope. In addition, it is preferable that the adhesive member here consists of a low melting-point material rather than a partition. When an envelope having a structure in which panel substrates are bonded to each other is adopted, the envelope cannot bulge outward and deform, and a discharge gas having a pressure exceeding 500 Torr can be generated. When the structure enclosed in the envelope is adopted, there is an advantage that the luminance of the gas discharge panel is improved.
The increase in the luminance of the gas discharge panel is due to the improvement in gas discharge efficiency.

  On the other hand, the manufacturing method of the gas discharge panel according to the present invention is a manufacturing method in the case where, for example, the internal pressure of the envelope at the time of manufacture is higher than the external pressure, and at least the external ambient pressure of the piping member is After the piping member is sealed after being set to a state higher than the internal pressure of the discharge gas enclosed in the tube, or heated while pressing the piping member from at least two directions facing along the radial direction of the piping member. The piping member is sealed by sealing the piping member or by melting a sealing member accommodated in the piping member. And according to these manufacturing methods, even if it is a case where the internal pressure of an envelope is higher than an external pressure, sealing of a piping member can be performed easily and reliably.

  As described above, according to the gas discharge panel of the present invention, for example, the panel substrates constituting the envelope are bonded to each other via the bonding member provided at the uppermost end of the partition wall. Therefore, it is possible to obtain an effect that a gap is not generated between the partition wall and the panel substrate, and the envelope cannot bulge outward and deform. Therefore, even if a discharge gas having a pressure exceeding 500 Torr is enclosed in the envelope, no inconvenience arises, and luminance improvement in the gas discharge panel can be realized.

In addition, according to the method for manufacturing a gas discharge panel according to the present invention, for example, the internal pressure of the discharge gas sealed in the envelope at the time of manufacture is close to the atmospheric pressure or higher than the atmospheric pressure. However, as a result that the piping member can be easily and stably sealed, an effect of easily producing a gas discharge panel with improved luminance can be obtained.
By the way, in embodiment mentioned above, screen printing etc. can be considered as a formation means of the adhesive member 15 to the upper end part of the partition 7, for example. However, the uppermost end of the partition wall 7 is a very thin and long region, and it may be difficult to uniformly form the adhesive member 15 thereon.

  The partition wall 7 is formed by a method such as printing, lift-off, or sand blasting, but the uppermost end portion may be uneven. In particular, an adhesive member may not be formed in the concave portion at the uppermost end of the partition wall 7, and the upper panel substrate 4 and the partition wall 7 cannot be bonded to each other, and this part may lead to deterioration of display quality. It is done.

  Further, when the amount of the adhesive member 15 formed is large, or when the adhesive member 15 is formed beyond the width of the partition wall 7, the width of the adhesive member 15 after bonding becomes larger than the width of the partition wall 7, and the portion It is also conceivable to reduce the luminance by narrowing the light emitting area viewed from the outside of the upper panel substrate 4.

  On the other hand, the conventional sealing member 9 is formed only at the outer peripheral edge of the panel substrate, and only the outer peripheral edge of the panel substrate is pressurized during sealing. However, in order to realize an envelope that can be easily prevented from being deformed, it is necessary to securely bond the partition wall 7 and the upper panel substrate 4 with the adhesive member 15 as described above. There may be a case where sufficient pressurization cannot be realized in the display area inside the panel substrate by pressurizing only the peripheral edge.

Therefore, in consideration of these points, a gas discharge panel that can prevent the deformation of the PDP more reliably and can realize an improvement in luminance and a manufacturing method thereof will be described below.
FIG. 12 is a plan view for explaining application of the adhesive member 15. FIG. 14 is a plan view according to the modification. FIG. 13 is a schematic cross-sectional view for explaining the relationship between the material particle diameter and the partition wall width of the adhesive member of the PDP according to the present embodiment. FIG. 17 is a cross-sectional view showing a pressurizing method at the time of sealing, and FIGS. 18 and 19 are cross-sectional views showing specific methods for pressurizing at the time of sealing.

  The overall configuration of the PDP in the present embodiment is basically the same as that described with reference to FIG. 6. Therefore, in the following description, the same or equivalent parts and portions are denoted by the same reference numerals as those in FIG. The description is omitted.

  The PDP according to the present embodiment is as described with reference to FIG.

  That is, an adhesive member 15 made of a transparent material is provided in a line shape along the longitudinal direction of the partition wall 7 as shown in FIG. The partition wall 7 formed on the lower panel substrate 8 and the upper panel substrate 4 are bonded to each other through an adhesive member 15.

  As described above, it is conceivable that the adhesive member formed at the uppermost end of the partition wall 7 partially protrudes from the partition wall width due to uneven coating amount. In addition, when the amount of application is large when bonded to the upper panel substrate 4, the adhesive member may be spread out at the top of the partition wall and may protrude beyond the partition width into the light emitting region.

  However, since the adhesive member 15 is a transparent material, even if the adhesive member 15 protrudes somewhat, the light emission is not blocked, and display characteristics, particularly luminance, are not deteriorated.

Furthermore, a phosphor 11 for realizing color display is applied on the dielectric layer 6 for each light emitting region partitioned by the partition walls 7. Then, the discharge gas formed by mixing helium, xenon, neon, etc. is 500 Torr in the envelope 10 in which the upper panel substrate 4 and the partition wall 7 on the lower panel substrate 8 are bonded via the adhesive member 15. The internal pressure is over, for example, 760 Torr or 1000 Torr.
Next, a modified example of the adhesive member 15 will be described with reference to FIG.

  Conventionally, a frit glass used as an adhesive member contains a filler such as ceramics in order to adjust the thermal characteristics and obtain an adhesive strength with a glass substrate in a material such as lead oxide.

  FIG. 13 shows a case where the maximum particle diameter D of a material such as a filler contained in the adhesive member 15 does not exceed W with respect to the width W of the partition wall 7. In this case, the adhesive member 15 does not protrude from the partition wall width when the maximum particles are located at the center of the partition wall 7, and does not protrude greatly from the partition wall width even if the maximum particles are formed slightly shifted from the center of the partition wall 7. In addition, a PDP having good display characteristics can be realized without covering the display area with the adhesive member 15 after the partition wall 7 and the upper panel 4 are bonded. In this case, what is important is that it does not protrude greatly from the width of the upper end portion of the partition wall after bonding, and this can be realized with the above configuration. Here, “not to protrude excessively from the width of the upper end portion of the partition wall” means that the width of the fluorescent region of each space portion 12 (see FIG. 6) is not reduced so as to be substantially reduced. This fluorescent region is determined by the application region of the phosphor 11 applied to each space portion 12.

  Although not shown, when there is a gap exceeding 5 μm between the partition wall and the upper panel substrate, display deterioration such as crosstalk occurs when the panel is turned on.

  On the other hand, when the size of the particles contained in the adhesive member is large, uneven formation of the adhesive member is likely to occur, and there is a possibility that the partition wall and the upper panel are bonded only at the portion where the maximum particle exists. Therefore, it is more desirable that the maximum particle size in the adhesive member is 5 μm or less. In the present embodiment, the rib rib width W (see FIG. 13) is about 40 μm.

  Furthermore, a PDP according to another modification of the adhesive member 15 will be described with reference to FIG.

  The adhesive member 15 described above is provided at the uppermost end of the partition wall 7. In this example, the adhesive member 15 is provided in a line shape on the inner surface of the upper panel substrate 4. That is, as shown in FIG. 14, the adhesive member 15 is substantially orthogonal to the partition wall 7 formed on the lower panel substrate 8 (eg, substantially perpendicular to the extending direction (longitudinal direction) of the partition wall 7). The display electrode 1 group arranged in a pair and the display electrode 1 group adjacent thereto are provided in a line shape at the center.

  In this case, the method of forming the adhesive member 15 may be screen printing or may be drawn by a dispenser or the like. The panel substrates 4 and 8 facing each other at the portion where the adhesive member 15 and the partition wall 7 cross each other are bonded. Here, since the adhesive member 15 is formed on a flat surface, it can be easily formed, and the partition wall 7 and the adhesive member 15 are both in a line shape and substantially intersect with each other, so that alignment at the time of sealing is easy. Become. Also, adhesion is more reliable.

  The adhesive member 15 also has a function of visually separating pixels adjacent in the longitudinal direction of the partition wall 7 to prevent the envelope 10 from bulging outward and deforming, and to improve contrast. Also effective.

  In the present embodiment, the case where the adhesive member 15 is formed only on the inner surface of the upper panel substrate 4 is shown, but the adhesive member 15 may also be formed on the uppermost end of the partition wall 7 formed on the lower panel substrate 8. There is no problem, and an adhesive member is sufficiently formed at the bonded portion for reliable bonding, which is more effective.

  Moreover, when the adhesive member 15 shown in FIGS. 13 and 14 is made of a light absorbing material, it goes without saying that the PDP contrast is further improved.

  Furthermore, a PDP according to another modification of the adhesive member 15 will be described with reference to FIG. The above-mentioned adhesive member 15 is provided at most of the uppermost end of the partition wall 7 and adheres to the upper panel substrate 4. However, it is not always necessary to adhere at most of the part, as shown in FIG. It is effective even with bonding.

  As described repeatedly, these bonds not only have the effect of preventing the panel from bulging outward and deforming, but also adhering the gap with the upper panel substrate that occurs at the uppermost end of the partition wall. Filling with a member and completely partitioning each discharge cell (discharge space) also has an effect of preventing crosstalk between the discharge cells.

  At this time, the part to be bonded and the part to be not bonded can be arbitrarily selected. However, as shown in FIG. 15, the adhesive member is attached to the part intersecting with the display electrode 1 and the part in the vicinity thereof in the upper end part of the partition wall. 15 is more desirable. This is because a larger discharge occurs in such a part.

  Note that FIG. 15 shows an example in which all the portions in the vicinity of the display electrode 1 are uniformly bonded, but it is not necessarily uniform, and only a portion where crosstalk is likely to occur is bonded, or a portion For example, the uppermost end of the partition may be bonded in a line.

  Here, another example according to this embodiment will be described with reference to FIG. In the PDP according to the present embodiment, as in the conventional embodiment, the upper panel substrate 4 having a plurality of display electrodes 1 formed on the inner surface and the plurality of data arranged in a direction perpendicular to the display electrode 1. An envelope having a configuration in which the electrodes 5 and the lower panel substrate 8 having the partition walls 7 formed on the inner surface are arranged opposite to each other, and the outer peripheral edges of both panels are sealed with an adhesive member 15 made of low-melting glass. It has. The uppermost ends of the partition walls 7 have a concave groove, and an adhesive member 15 is provided so as to fill the groove. The upper panel substrate 4 and the partition wall 7 are joined via the adhesive member 15. ing. The partition wall 7 is formed as follows, for example. A dry film resist is laminated as a resin coating layer on the lower panel substrate 8, and after a selective exposure using an exposure mask, development processing is performed to provide a negative pattern. Further, the paste is embedded to the same height as the outermost surface of the resin coating layer using a squeegee or the like in the opening of the pattern. Thereafter, when the lower panel substrate 8 is dried and the solvent in the paste is removed, the paste has a concave shape with a depressed central portion. This shape can be controlled by the amount of solvent contained in the paste, the amount of filler, or the opening shape of the resin coating layer. In addition, it is also possible to mechanically process the uppermost end of the partition wall 7 or process it into a concave shape by irradiating a laser beam. When the adhesive member 15 is formed in the concave portion of the partition wall 7 formed in this way, the bonding area between the partition wall 7 and the adhesive member 15 is increased, the bonding strength is increased, and the apparent light emitting area is reduced due to the reduction of the protrusion of the adhesive member 15 from the partition wall width. Can be increased.

  Next, the manufacturing method of the PDP according to the present embodiment will be described according to the procedure.

  First, an upper panel substrate 4 on which a display electrode 1, a dielectric layer 2 and a protective layer 3 are formed, a data electrode 5, a dielectric layer 6 and barrier ribs 7 are formed, and a lower panel on which a phosphor 11 is applied. After preparing the substrate 8, an adhesive member 15 made of a low melting point material such as frit glass is provided at the uppermost end of the partition wall 7.

  Note that when the adhesive member 15 is provided, a method such as screen printing or transfer using a stamper is employed, but it is also possible to apply by a method such as lift-off. Alternatively, the adhesive member 15 can be provided by forming only the layer positioned at the uppermost end of the partition wall 7 with frit glass or the like. Alternatively, it is possible to apply frit glass or the like to be the adhesive member 15 to a predetermined portion on the upper panel substrate 4 corresponding to the partition wall 7 on the lower panel substrate 8.

  By the way, in the screen printing, it is common to form a pattern through which an adhesive material having a predetermined viscosity passes in advance on the screen plate contacting the uppermost end of the partition wall 7, but the screen plate itself is bonded to the entire surface. Of course, the adhesive member 15 may be provided only at the uppermost end of the partition wall 7 by screen printing with the material passing therethrough.

  Next, the upper panel substrate 4 and the lower panel substrate 8 are arranged opposite to each other via the partition wall 7 provided with the adhesive member 15 as described above, and the outer peripheral edges of the two panel substrates 4 and 8 are arranged. The sealing member 9 is interposed between them.

  In this case, as shown in FIG. 17, when heated while pressing from the outer surface to the inner surface of both panel substrates, the outer peripheral edge portions of the upper panel substrate 4 and the lower panel substrate 8 are the sealing members at the peripheral portion. 9 is sealed. At the same time, the upper panel substrate 4 and the lower panel substrate 8 are bonded to each other by the adhesive member 15 melted by heating in the central display portion, and as a result, the envelope 10 is configured.

  Further, a piping member 13 communicating with the inside of the envelope 10 through a through hole 8a formed in the lower panel substrate 8 constituting the envelope 10 is attached to an external position of the lower panel substrate 8, and this piping member 6, after the exhaust process and the discharge gas sealing process in the envelope 10 are performed via 13, the interior of the envelope 10 is sealed by sealing the piping member 13, so that the PDP shown in FIG. Complete.

  By the way, the pressurization at the time of bonding the upper panel substrate 4 and the lower panel substrate 8 is performed by a method as shown in FIG. 18, for example.

  That is, first, the upper panel substrate 4 and the lower panel substrate 8 constituting the envelope 10 are temporarily fixed according to a predetermined positional relationship and then placed on the flat table 16.

  Next, a plurality of pressing jigs 23 are installed at a predetermined pressing site. The pressing jig 23 includes a spring receiver A (20), a spring receiver B (22), a spring 21, and a bolt 19. The spring receiver A (20) and the spring receiver B (22) are separated, and the spring is interposed therebetween. 21 is sandwiched between them.

  Note that the pressure of the spring 21 can be adjusted by the bolt 19 in the position of the spring receiver B (22). Between the envelope 10 and the frame 18 fixed to the base 16 via the support column 17, the spring support B (22) is arranged so that the entire length of the pressing jig 23 is larger than the interval. ) Is adjusted by the bolt 19 and inserted. In this way, since the spring 21 is installed with a compressive force applied, a pressing force is applied to both panel substrates.

  The frit glass constituting the adhesive member 15 and the sealing member 9 is usually heated and melted at 450 degrees, and the spring 21 used here is made of a material that does not lose its elasticity even at 450 degrees. Needless to say. For example, inconel material is used.

Next, a modification of the pressurizing method will be described with reference to FIG.
First, the upper panel substrate 4 and the lower panel substrate 8 constituting the envelope 10 are temporarily fixed according to a predetermined positional relationship and then installed on the flat table 16 in the same manner as in the above embodiment. Next, an elastic cushioning material 24 that does not change the property even in a heated state of 450 degrees is installed so as to cover the entire surface of the envelope 10. Here, a material such as steel wool is effective as the buffer material 24.

  Next, a plate material 25 having a predetermined thickness and a uniform plate thickness and covering the entire surface of the envelope is placed on the cushioning material 24 above the envelope 10. Here, the cushioning material 24 needs to have a foreign substance or the like sandwiched between the plate material 24 and the envelope 10 because the pressing force changes partially and the gap between the upper panel substrate 4 and the lower panel substrate 8 constituting the envelope 10 is increased. This is because non-uniformity may occur, and if the foreign matter is large, a force is locally applied, which may lead to destruction of the envelope 10.

  As described above, according to the gas discharge panel of the present invention, for example, the upper panel substrate and the lower panel substrate constituting the envelope are bonded via an adhesive member, so that the pressure exceeding 500 Torr. Even if the discharge gas is sealed in the envelope, there is an effect that a gap is not generated between the partition wall and the panel substrate, or the envelope cannot bulge outward and deform. .

  In addition, since the adhesive member does not protrude from the partition wall width or uses a transparent member even if it protrudes, the characteristics of the panel are not deteriorated. Further, when the adhesive member is formed in a direction perpendicular to the partition wall, pixels adjacent to the partition wall direction can be separated, and an effect of improving contrast can be obtained.

  In addition, according to the method for manufacturing a gas discharge panel according to the present invention, for example, a gas discharge panel with improved brightness can be easily produced as a result of uniformly realizing adhesion between the partition walls and the panel substrate facing the entire surface of the envelope. The effect that it can be obtained.

  In the above-described embodiment, the case where the PDP has a dielectric film has been described. However, the present invention is not limited to this. For example, a configuration without a dielectric film may be used.

  In the above embodiment, the gas discharge panel is an AC type PDP. However, the gas discharge panel is not limited to an AC type PDP, and the present invention can also be applied to a DC type PDP. Of course.

  Further, the first panel substrate and the second panel substrate of the present invention correspond to the front substrate and the back substrate, respectively, in the above embodiment, but the present invention is not limited to this. For example, the first panel substrate of the present invention A configuration corresponding to the back substrate and the second panel substrate corresponding to the front substrate may be employed. In this case, the bottom of the partition is provided on the inner surface of the front substrate, and the upper end of the partition is bonded to the inner surface of the back substrate.

  In the above embodiment, the description has been made on the assumption that the adhesive member is used. However, the present invention is not limited to this. For example, the example described in FIG. 5 and the example described in FIGS. The structure which does not presuppose use may be sufficient. That is, in that case, for example, as a modification of the above-described example described in FIG. 5, a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates; and provided on the second panel substrate. A method of manufacturing a gas discharge panel comprising a partition wall that partitions the gas discharge space, the step of exposing a photosensitive material provided on the second panel substrate to form a groove, and the partition wall A thermal spraying process for embedding a dielectric material or frit glass to form the groove by the thermal spraying method, and in the thermal spraying process, along the flow of the material ejected from the thermal spray nozzle, the second panel Cooling gas for cooling the substrate Mentioned method for producing a gas discharge panel, wherein a flow is. In this manufacturing method, the gas discharge panel preferably includes a dielectric film covering the second electrode, and the dielectric film and the partition walls are preferably made of alumina. Thereby, the same effect as the above is exhibited. Further, for example, as a modification of the above example described in FIG. 8 to FIG. 9, a first panel substrate having a first electrode, a second panel substrate having a second electrode facing the first panel substrate, A sealing portion provided between outer peripheral edges of both substrates for forming a gas discharge space between the first and second panel substrates; and provided on the second panel substrate. In addition, a method for manufacturing a gas discharge panel including partition walls that divide the gas discharge space, wherein the gas discharge panel is formed using the first panel substrate, the second panel substrate, and the sealing portion. An assembling step for assembling, a step of attaching a piping member communicating with the gas discharge space through a through hole formed in the first or second panel substrate to the panel substrate having the through hole, and the piping member To the gas discharge space A sealing step of sealing the piping member by sealing an electrical gas and setting an ambient pressure of the piping member higher than an internal pressure of the sealed discharge gas. And a method for producing a gas discharge panel. Thereby, there exists an effect that the manufacturing method different from the past can be provided.

  The method for manufacturing a gas discharge panel according to the present invention has advantages in that crosstalk is less likely to occur than in the prior art and a more stable image can be formed, and is useful as a method for manufacturing a gas discharge panel.

  Further, the method for manufacturing a gas discharge panel according to the present invention has an advantage that the luminance can be increased as compared with the conventional method, and is useful as a method for manufacturing a gas discharge panel.

1 is a schematic partial cross-sectional view of a plasma display panel according to a first embodiment of the technology related to the present invention. Schematic partial cross-sectional view of a laser display panel in a second embodiment of the technology related to the present invention (A)-(e): Schematic process drawing of the manufacturing method of the plasma display panel in the third embodiment of the technology related to the present invention. (A)-(e): Schematic process drawing of the plasma display panel manufacturing method in the fourth embodiment of the technology related to the present invention. Schematic which shows the formation method of the partition by thermal spraying in the Example of the technique relevant to this invention The fracture | rupture perspective view which simplifies and shows an example of the principal part structure of PDP which concerns on the manufacturing method of the gas discharge panel of this invention Sectional drawing which concerns on the modification of the structure shown in FIG. Explanatory drawing which shows the method of sealing the piping member of PDP which concerns on this Embodiment (A)-(c): Explanatory drawing which shows the 1st modification of the method and procedure of sealing the piping member of PDP which concerns on this Embodiment. Explanatory drawing which shows the 2nd modification of the method and procedure which seal the piping member of PDP which concerns on this Embodiment. (A)-(b): Explanatory drawing which shows the 3rd modification of the method and procedure which seal the piping member of PDP which concerns on this Embodiment. The top view which shows the adhesion member of PDP which concerns on this Embodiment Schematic cross-sectional view for explaining the particle size of the adhesive member of the present embodiment The top view which concerns on the modification regarding the coating method of the adhesive member of this Embodiment The top view which concerns on another example regarding the application | coating method of the adhesive member of this Embodiment The top view which concerns on another example regarding the shape of the upper end part of the partition of this Embodiment Schematic which shows the method of sealing PDP which concerns on this Embodiment Sectional drawing which shows the pressurization method at the time of sealing of this Embodiment Sectional drawing which shows the modification of the pressurization method at the time of sealing of this Embodiment A perspective sectional view of a conventional plasma display panel part The fracture | rupture perspective view which simplifies and shows the principal part structure of PDP which concerns on the conventional form (A)-(c): Explanatory drawing which shows the procedure which seals the piping member of PDP which concerns on the conventional form.

Explanation of symbols

1 Display electrode 2, 6 Dielectric film 3 Protective film 4 Upper panel substrate (front substrate)
5 Address electrode 7 Bulkhead 8 Lower panel substrate (back substrate)
DESCRIPTION OF SYMBOLS 10 Envelop 11 Phosphor 12 Space part 13 Piping member 15 Adhesive member 19 Sealing member

Claims (1)

A first panel substrate having a first electrode;
A second panel substrate having a second electrode facing the first panel substrate;
A sealing portion provided between outer peripheral edge portions of both of the substrates for forming a gas discharge space between the first and second panel substrates;
A partition wall provided on the second panel substrate for partitioning the gas discharge space;
A method of manufacturing a gas discharge panel comprising:
An assembly step of assembling the gas discharge panel using the first panel substrate, the second panel substrate, and the sealing portion;
Attaching a piping member communicating with the gas discharge space to the panel substrate having the through hole via a through hole formed in the first or second panel substrate;
An enclosing step of enclosing a discharge gas in the gas discharge space using the piping member;
A sealing step of sealing the piping member by setting an ambient pressure of the piping member higher than an internal pressure of the sealed discharge gas;
A method for producing a gas discharge panel, comprising:

Images