JP3661801B2 - Dislocation density measurement method for II-VI group compound semiconductor single crystal - Google Patents
Dislocation density measurement method for II-VI group compound semiconductor single crystal Download PDFInfo
- Publication number
- JP3661801B2 JP3661801B2 JP14392395A JP14392395A JP3661801B2 JP 3661801 B2 JP3661801 B2 JP 3661801B2 JP 14392395 A JP14392395 A JP 14392395A JP 14392395 A JP14392395 A JP 14392395A JP 3661801 B2 JP3661801 B2 JP 3661801B2
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- dislocation density
- znse
- substrate
- compound semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013078 crystal Substances 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 18
- 239000004065 semiconductor Substances 0.000 title description 8
- 150000001875 compounds Chemical class 0.000 title description 7
- 238000001739 density measurement Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 13
- MODGUXHMLLXODK-UHFFFAOYSA-N [Br].CO Chemical compound [Br].CO MODGUXHMLLXODK-UHFFFAOYSA-N 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 3
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims 3
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 23
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
Landscapes
- Recrystallisation Techniques (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Sampling And Sample Adjustment (AREA)
Description
【0001】
【産業上の利用分野】
本発明は、青色発光デバイスの材料として期待されるセレン化亜鉛(ZnSe)等のII-VI 族化合物半導体単結晶中の転位密度を測定する方法に関する。
【0002】
【従来の技術】
II-VI 族化合物半導体の一種であるセレン化亜鉛(ZnSe)は、従来、気相成長法や高圧溶融法により製造されているが、これら製造法によって得られた単結晶は結晶学的には不完全であり転位と呼ばれる結晶内の不完全部分を含んでいる。この転位の単位面積当りの数を転位密度と呼ぶが、これは青色発光デバイスの発光寿命等と密接な関係を持ち、エピタキシャル成長用基板として適当であるか否かを判断する上で非常に重要な特性の一つである。
【0003】
これまでZnSe単結晶の転位密度を計測する方法は、単結晶体の(111)面および(110)面を計測する方法が知られているが、まだ(100)面に対する計測方法は知られておらず、エピタキシャル成長する結晶方位が(100)面である場合でも、その方位に配位した単結晶基板から転位密度に関する情報を直接知ることができなかった。
【0004】
このため、例えば高圧溶融法で得られた大口径で長尺のバルク結晶体からエピタキシャル成長用基板の方位面出しと、転位密度調査用単結晶の方位面出しとの2種類のスライスが必要であった。
【0005】
【発明が解決しようとする課題】
前述のように従来の転位密度計測方法では、直接的に(100)面での転位密度を測定できないため、例えばZnSe単結晶基板(100)面上にエピタキシャル成長を行う場合に、基板自体として使用可能な基板であるか否かの判断を短時間で行えないという欠点を有していた。
【0006】
したがって本発明の目的は、青色発光デバイスの材料として期待されるZnSeを含めて、II-VI 族化合物半導体結晶体の(100)面上の転位密度を直接計測する方法を提供することにある。
【0007】
【課題を解決するための手段】
本発明者らは上記目的を達成すべく鋭意研究した結果、希薄臭素メタノール溶液を用いてZnSe単結晶基板の(100)面を食刻すれば、転位部分が鮮明な食刻像として得られるので、転位密度が測定でき、しかもこの方法がZnSe単結晶以外のII-VI 族化合物半導体単結晶体にも適用できることを見いだし本発明に到達した。
【0008】
すなわち本発明は第1に、ZnSe単結晶体の(100)面をスライスして得た基板に、表面研磨および鏡面エッチング処理を施した後、臭素メタノール溶液に浸漬することによって食刻せしめ、得られた食刻像から該(100)面上の転位を計測することを特徴とするZnSe単結晶体の転位密度測定方法;第2に、前記臭素メタノール溶液が0 . 1〜1容積%の臭素メタノール溶液である、第1記載のZnSe単結晶体の転位密度測定方法を提供するものである。
【0009】
【作用】
本発明において原料として用いるZnSe単結晶基板は、まず垂直ブリッジマン炉または垂直徐冷炉を用いて高圧溶融法によるZnSe多結晶を種結晶として該種結晶上に育成することにより単結晶を得る。すなわち前者では溶融体の入ったるつぼを温度勾配のついた電気炉中を降下させて結晶を育成し、後者では上下方向に温度勾配のついた電気炉中にるつぼを置き温度勾配のついたまま徐冷してるつぼ下面より結晶を析出成長させる。
【0010】
次いでこの単結晶をスライサーで(100)方位に切り出したものを遊離砥粒を介在させて行うラッピングにより研磨し、さらに表面を鏡面仕上げするために鏡面エッチングして所定形状に切り出したものである。
【0011】
本発明では、単結晶基板を0.1容積%の臭素メタノール溶液に浸漬することにより基板表面を食刻させるが、食刻条件としては室温で溶液を攪拌しながら80〜150秒程度浸漬すれば鮮明な食刻像が得られるので、これから転位密度を計測することができる。
【0012】
【実施例】
図1は本実施例に用いられた単結晶基板食刻装置を示す模式断面図、図2はZnSe単結晶基板を食刻した後の腐食部分を示す顕微鏡写真で同図(a)は400倍、同図(b)は1000倍に拡大したものであって、これらを参照して以下説明する。
【0013】
あらかじめ高圧溶融法によって得られたZnSe単結晶体から(100)面をスライスして5mm角×1mm厚の基板を切り取り、該基板の表面を研磨した後、鏡面エッチング処理を施したものを供試基板とした。
【0014】
図1に示す単結晶基板食刻装置の反応槽1に入れられた常温(約20℃)の1容積%臭素メタノール溶液6に上記ZnSe基板5が浸漬するようにテフロン製バスケット2に入れて反応槽中にセットした。
【0015】
反応槽底部にはあらかじめ攪拌子3が設けられてあり、反応槽下部にあるマグネチックスターラー4で撹拌子3を250rpm の速度で120秒回転させ、食刻処理を行った。
【0016】
上記食刻処理を施したZnSe基板を反応槽より取り出し、メタノール中で超音波洗浄し乾燥した後、ノマルスキー微分干渉顕微鏡で腐食部分(転位部分)を観察した。
【0017】
観察したZnSe基板上の転位部分を図2(a)の400倍、同図(b)の1000倍の写真として示したが、これらから単位面積当りの転位密度を容易に計測することができた。
【0018】
なお、ZnSe以外のII-VI 族化合物半導体単結晶についても食刻処理を試みたが、ZnSeの場合とほぼ同様の結果が得られた。
【0019】
【発明の効果】
以上説明したように、従来II-VI 族化合物半導体単結晶の(100)面における転位密度を直接計測する手段がなかったが、本発明の方法によれば、簡易な装置を用いて(100)面に食刻処理を施すことにより明確鮮明になった転位を計測できるので、短時間で(100)面の転位密度が測定され、II-VI 族半導体のエピタキシャル成長基板としての適否が容易に判断できるようになった。
【図面の簡単な説明】
【図1】実施例に用いられた単結晶基板食刻装置を示す模式断面図である。
【図2】ZnSe単結晶基板を食刻した後の腐食部分を示す顕微鏡写真で(a)は400倍、(b)は1000倍の拡大写真である。
【符号の説明】
1 反応槽
2 バスケット
3 攪拌子
4 マグネチックスターラー
5 ZnSe基板
6 臭素メタノール溶液[0001]
[Industrial application fields]
The present invention relates to a method for measuring a dislocation density in a II-VI group compound semiconductor single crystal such as zinc selenide (ZnSe), which is expected as a material for blue light-emitting devices.
[0002]
[Prior art]
Zinc selenide (ZnSe), a type of II-VI group compound semiconductor, has been conventionally produced by vapor phase growth or high pressure melting, but single crystals obtained by these production methods are not crystallographically. It is incomplete and includes an incomplete part in the crystal called dislocation. The number of dislocations per unit area is called the dislocation density, which has a close relationship with the emission lifetime of the blue light emitting device and is very important in determining whether it is suitable as an epitaxial growth substrate. One of the characteristics.
[0003]
Until now, as a method for measuring the dislocation density of a ZnSe single crystal, a method for measuring the (111) plane and the (110) plane of a single crystal is known, but a measurement method for the (100) plane is still known. Even when the crystal orientation for epitaxial growth is the (100) plane, information on the dislocation density cannot be directly obtained from the single crystal substrate coordinated in that orientation.
[0004]
For this reason, for example, two types of slicing are necessary, that is, orientation orientation of a substrate for epitaxial growth and orientation orientation of a single crystal for investigation of dislocation density from a large-diameter and long bulk crystal obtained by a high pressure melting method. It was.
[0005]
[Problems to be solved by the invention]
As described above, the conventional dislocation density measurement method cannot directly measure the dislocation density on the (100) plane, and thus can be used as the substrate itself, for example, when epitaxial growth is performed on the ZnSe single crystal substrate (100) plane. It has a drawback that it cannot be determined in a short time whether or not it is a simple substrate.
[0006]
Accordingly, an object of the present invention is to provide a method for directly measuring the dislocation density on the (100) plane of a II-VI group compound semiconductor crystal including ZnSe, which is expected as a material for blue light-emitting devices.
[0007]
[Means for Solving the Problems]
As a result of diligent research to achieve the above object, the present inventors have obtained a clear etched image of the dislocation portion when the (100) plane of a ZnSe single crystal substrate is etched using a dilute bromine methanol solution. The present inventors have found that the dislocation density can be measured and that this method can be applied to II-VI group compound semiconductor single crystals other than ZnSe single crystals.
[0008]
That is, according to the present invention, first, a substrate obtained by slicing the (100) plane of a ZnSe single crystal is subjected to surface polishing and mirror etching, and then immersed in a bromine-methanol solution. dislocation density measuring method of ZnSe single crystal, characterized in that to measure the dislocation on the (100) plane from the etched image that is;. second, the bromine methanol solution 0 1 to 1% by volume of bromine A dislocation density measurement method for a ZnSe single crystal according to the first aspect, which is a methanol solution, is provided.
[0009]
[Action]
A ZnSe single crystal substrate used as a raw material in the present invention is obtained by first growing a ZnSe polycrystal by a high pressure melting method on a seed crystal as a seed crystal using a vertical Bridgman furnace or a vertical annealing furnace. That is, in the former, the crucible containing the melt is lowered in an electric furnace with a temperature gradient to grow the crystal, and in the latter, the crucible is placed in an electric furnace with a temperature gradient in the vertical direction and the temperature gradient remains. Gradually cool and precipitate crystals from the bottom of the crucible.
[0010]
Next, this single crystal cut in the (100) direction with a slicer is polished by lapping performed with free abrasive grains interposed, and further mirror-etched to cut the surface into a predetermined shape for mirror finishing.
[0011]
In the present invention, the surface of the substrate is etched by immersing the single crystal substrate in a 0.1% by volume bromine methanol solution. As the etching conditions, the solution is stirred at room temperature for about 80 to 150 seconds. Since a clear etched image is obtained, the dislocation density can be measured from this.
[0012]
【Example】
FIG. 1 is a schematic cross-sectional view showing a single crystal substrate etching apparatus used in this example, and FIG. 2 is a micrograph showing a corroded portion after etching a ZnSe single crystal substrate. FIG. FIG. 5B is an enlarged view of 1000 times, and will be described below with reference to these drawings.
[0013]
A sample obtained by slicing a (100) plane from a ZnSe single crystal obtained in advance by the high-pressure melting method, cutting a 5 mm square × 1 mm thick substrate, polishing the surface of the substrate, and then performing a mirror etching process. A substrate was used.
[0014]
The Teflon
[0015]
A
[0016]
The ZnSe substrate subjected to the above etching treatment was taken out from the reaction vessel, ultrasonically washed in methanol and dried, and then a corroded portion (dislocation portion) was observed with a Nomarski differential interference microscope.
[0017]
The observed dislocation portion on the ZnSe substrate is shown as a photograph 400 times as large as FIG. 2A and 1000 times as large as FIG. 2B. From these, the dislocation density per unit area could be easily measured. .
[0018]
In addition, although the etching process was tried also about II-VI group compound semiconductor single crystal other than ZnSe, the result almost the same as the case of ZnSe was obtained.
[0019]
【The invention's effect】
As described above, there has been no means for directly measuring the dislocation density in the (100) plane of a conventional II-VI group compound semiconductor single crystal. However, according to the method of the present invention, (100) Dislocations that are clearly clarified by etching the surface can be measured, so the dislocation density of the (100) surface can be measured in a short time, and the suitability of the II-VI group semiconductor as an epitaxial growth substrate can be easily determined. It became so.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing a single crystal substrate etching apparatus used in Examples.
FIGS. 2A and 2B are micrographs showing a corroded portion after etching a ZnSe single crystal substrate. FIG. 2A is an enlarged photograph of 400 times, and FIG.
[Explanation of symbols]
DESCRIPTION OF
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14392395A JP3661801B2 (en) | 1995-05-18 | 1995-05-18 | Dislocation density measurement method for II-VI group compound semiconductor single crystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14392395A JP3661801B2 (en) | 1995-05-18 | 1995-05-18 | Dislocation density measurement method for II-VI group compound semiconductor single crystal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08316586A JPH08316586A (en) | 1996-11-29 |
| JP3661801B2 true JP3661801B2 (en) | 2005-06-22 |
Family
ID=15350249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14392395A Expired - Fee Related JP3661801B2 (en) | 1995-05-18 | 1995-05-18 | Dislocation density measurement method for II-VI group compound semiconductor single crystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3661801B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2813392B1 (en) * | 2000-08-28 | 2002-12-06 | Snecma Moteurs | STRUCTURAL REVELATION PROCESS FOR MONOCRYSTALLINE SUPERALLOYS |
| KR20120092673A (en) * | 2009-11-18 | 2012-08-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Novel wet etching agent for ii-vi semiconductors and method |
| CN114184613A (en) * | 2021-12-07 | 2022-03-15 | 江苏天鼎检测科技有限公司 | Method capable of clearly displaying carbide |
-
1995
- 1995-05-18 JP JP14392395A patent/JP3661801B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08316586A (en) | 1996-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3491402B2 (en) | Single crystal manufacturing method and single crystal manufacturing apparatus | |
| EP2733239B1 (en) | Sic single crystal and manufacturing process therefor | |
| JPH05262599A (en) | SiC single crystal and method for growing the same | |
| CA2519885A1 (en) | Indium phosphide substrate, indium phosphide single crystal and process for producing them | |
| US11319646B2 (en) | Gallium arsenide single crystal substrate | |
| US12247318B2 (en) | Method for producing SiC single crystal and method for suppressing dislocations in SiC single crystal | |
| WO2023209867A1 (en) | Group iii-v compound semiconductor single crystal substrate and manufacturing method therefor | |
| JP3491429B2 (en) | Method for producing silicon carbide single crystal | |
| EP1420440B1 (en) | An epitaxial wafer and a method for producing it | |
| JP3661801B2 (en) | Dislocation density measurement method for II-VI group compound semiconductor single crystal | |
| JPH0797299A (en) | Method for growing SiC single crystal | |
| JPH0977595A (en) | Method for producing silicon carbide single crystal | |
| US20060260536A1 (en) | Vessel for growing a compound semiconductor single crystal, compound semiconductor single crystal, and process for fabricating the same | |
| JP4184622B2 (en) | Method for producing silicon carbide single crystal ingot | |
| JP2003068744A (en) | Silicon wafer manufacturing method, silicon wafer, and soi wafer | |
| JP3872838B2 (en) | Crystal growth method | |
| JP4200690B2 (en) | GaAs wafer manufacturing method | |
| JPH09199559A (en) | Method for evaluating crystal defects in semiconductor single crystal film | |
| JP3560180B2 (en) | Method for producing ZnSe homoepitaxial single crystal film | |
| JP2004099390A (en) | Method for producing compound semiconductor single crystal and compound semiconductor single crystal | |
| JPH10297997A (en) | Method for producing silicon carbide single crystal | |
| JPH10152393A (en) | Bulk crystal growth method and seed crystal for bulk crystal growth | |
| JP3969319B2 (en) | Method for evaluating phosphide single crystal wafer | |
| JP6989897B2 (en) | Dislocation evaluation method for lithium tantalate crystals | |
| JP2023145595A (en) | Indium phosphide substrate and semiconductor epitaxial wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040127 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20040206 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20040318 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040326 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050315 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050316 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080401 Year of fee payment: 3 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080401 Year of fee payment: 3 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090401 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090401 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100401 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110401 Year of fee payment: 6 |
|
| LAPS | Cancellation because of no payment of annual fees |