JP3662400B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for processing a glass substrate (hereinafter collectively referred to as “substrate”) used for manufacturing a semiconductor substrate for manufacturing a semiconductor device and a flat panel display such as a liquid crystal display.
[0002]
[Prior art]
2. Description of the Related Art A substrate processing apparatus that performs processing such as coating, developing, and cleaning on a substrate is provided with a number of pipes that serve as a flow path for a liquid such as a chemical solution or pure water, or a gas such as air. In addition, depending on the processing content, a pipe for supplying water for temperature adjustment is also provided.
[0003]
Many of these pipes are connected to a moving part that moves when processing the substrate, and a chemical solution is discharged from the nozzle provided in the moving part toward the substrate so that the substrate is processed. It has become. That is, the pipe connected to the moving part serves as a fluid supply path that is not affected by the movement of the moving part.
[0004]
In addition, like the piping, the moving part is also provided with a lot of wiring as a power supply path, etc., and the wiring is bent or extended as the moving part moves, so that stable power to the moving part is provided. Supply etc. are realized.
[0005]
[Problems to be solved by the invention]
By the way, with the recent increase in size of the substrate, the amount of liquid and the like used for processing the substrate is also increasing. In such a situation, if a conventional chemical flow rate is supplied using a pipe having a conventional diameter, the time required for discharging the chemical solution becomes longer, reducing the throughput of the substrate processing apparatus and reducing the quality of the substrate. The problem of being lowered arises. Therefore, it is necessary to increase the diameter of piping used in the substrate processing apparatus.
[0006]
When the pipe diameter is increased, the curvature of the pipe that can withstand bending is naturally reduced. In particular, considering the cleanliness and chemical resistance, substrate processing equipment uses many fluororesin tubes that are difficult to bend and deform, and when the pipe diameter increases, such pipes can be bent more freely. Can not be.
[0007]
As described above, in spite of difficulty in freely bending and deforming the pipe, if a pipe having the same length as that of the conventional pipe is used, a large force is applied to the fixing portion to the apparatus body which is the root of the pipe. In addition, particles are generated and piping is damaged. Therefore, in order to increase the pipe diameter, it is necessary to design a long pipe length. That is, with an increase in the amount of chemicals used due to the increase in size of the substrate, it is necessary to increase the pipe diameter and pipe length of the pipe provided in the substrate processing apparatus.
[0008]
When the pipe diameter and the pipe length are increased, the movement of the pipe accompanying the movement of the moving part has a great influence on the substrate processing apparatus. That is, there arises a problem that the pipes interfere with other members in the substrate processing apparatus and are damaged with each other, or particles are generated by rubbing strongly with the other members.
[0009]
Such a problem is not limited to one pipe having a large diameter, and the same is true when a plurality of pipes are in a thick bundle or a plurality of wirings are in a thick bundle. In particular, along with the recent progress in complexity and sophistication of substrate processing equipment, there are many pipes and wirings connected to moving parts such as the head part, and bundled pipes and wirings are difficult to bend and deform freely. For this reason, it is necessary to design a long length of piping and wiring from a portion fixed to the apparatus main body to a portion connected to the moving portion. Accordingly, there arises a problem that a bundle of pipes and wirings is damaged due to interference with other members inside the apparatus, and particles are generated to deteriorate the quality of the substrate.
[0010]
The present invention has been made in view of the above problems, and can prevent damage to piping and wiring connected to the moving section and prevent generation of particles, thereby enabling safe operation of the apparatus and the substrate. An object of the present invention is to provide a substrate processing apparatus capable of improving the quality.
[0011]
[Means for Solving the Problems]
The invention of claim 1 is a substrate processing apparatus for processing a substrate, and in a predetermined processing operation on the substrate, is connected to a moving unit that is moved by a driving force from a predetermined driving source, and is connected to the moving unit. Pass the fluid used in the processing operation Deformable Connected to a pipe and a predetermined guide part defined in a part of the pipe, the movement of the moving part Transform with Of the piping Part of Guidance means for guiding the position change.
[0012]
A second aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein the pipe extends from the moving portion in a direction substantially perpendicular to the moving direction of the moving portion.
[0013]
A third aspect of the present invention is the substrate processing apparatus according to the first or second aspect, wherein the fluid is a developing solution for performing a developing process on the substrate, and the moving portion is provided via the pipe. A developer application unit for applying the supplied developer on the substrate is coupled.
[0014]
According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for performing processing on a substrate, wherein a predetermined movement of the substrate is moved by a driving force from a predetermined driving source, and is connected to the moving portion. Deformable Wiring and movement of the moving part connected to a predetermined guide part defined in the middle of the wiring Transform with Of the wiring Part of Guidance means for guiding the position change.
[0015]
A fifth aspect of the present invention is the substrate processing apparatus according to any one of the first to fourth aspects, wherein the guide means includes means for linearly guiding the guide portion.
[0016]
A sixth aspect of the present invention is the substrate processing apparatus according to any one of the first to fourth aspects, wherein the guiding means includes means for two-dimensionally guiding the guiding portion.
[0017]
A seventh aspect of the present invention is the substrate processing apparatus according to any one of the first to sixth aspects, wherein the guide means includes means for guiding the rotational swing of the guide portion.
[0018]
The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the motion generated by the drive source is transmitted to the guide means, whereby the guide operation by the guide means is performed. A motion transmission mechanism is further provided.
[0019]
A ninth aspect of the present invention is the substrate processing apparatus according to any one of the first to seventh aspects, wherein the guide drive source that drives the guide means to cause a guide operation and the movement of the moving unit are synchronized. And a control means for controlling the guide drive source.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
<1. First Embodiment>
FIG. 1 is a perspective view showing a substrate processing apparatus 100 according to a first embodiment of the present invention. FIGS. 3 and 4 show the substrate processing apparatus 100 in FIG. 1 from the (−Y) direction to the (+ Y) direction. Each configuration is shown when facing the screen. Also, in each drawing, only the configuration necessary for the description is shown as appropriate.
[0021]
The substrate processing apparatus 100 is an apparatus that applies a developing solution to the substrate 9 and performs a developing process. The head unit 10 and the head unit 10 that move above the substrate 9 when the developing solution is applied are shown in FIG. A driving unit 20 (see FIG. 3) that moves in the X direction, a pipe 30 that is a supply path of a developer supplied to the head unit 10, and a guide unit that guides a part of the pipe 30 according to bending deformation of the pipe 30. 40 and a rotating unit 50 that rotates the substrate 9 while supporting the substrate 9 in a horizontal posture.
[0022]
The head unit 10 has a nozzle 11 that discharges the developer toward the substrate 9, a moving plate 12 that moves in the X direction while the nozzle 11 is fixed, and a developer that is fixed to the moving plate 12 and that supplies the developer to the nozzle 11. It has piping 13 for the head to send in.
[0023]
One end of the head pipe 13 is fixed to the moving plate 12 and connected to the nozzle 11, and the other end is fixed to the moving plate 12 and connected to the pipe 30. As a result, the developer supplied from the pipe 30 is supplied to the nozzle 11 via the head pipe 13.
[0024]
As shown in FIG. 3, the drive unit 20 includes a motor 21 as a drive source, a belt 22 hung on a pulley 25 a attached to the rotation shaft of the motor 21 and another pulley 25 b, and attached to the belt 22. A head support plate 23 is provided.
[0025]
With the movement of the belt 22 by the rotational driving force of the motor 21, the head support plate 23 is moved in the X direction indicated by the arrow 23S in FIG. The head portion 10 attached to the upper portion of the head also moves in the X direction.
[0026]
One end of the pipe 30 is fixed to the moving plate 12 of the head unit 10 and is fixed so that the pipe 30 extends in a direction substantially perpendicular to the X direction which is the moving direction of the moving plate 12. One end of the pipe 30 is connected to the head pipe 13 via the moving plate 12, and the other end is connected to the developer supply port 34 inside the substrate processing apparatus 100. The developing solution is supplied from a developing solution supply source (not shown) provided inside the substrate processing apparatus 100 from the developing solution supply port 34.
[0027]
As shown in FIG. 2, the pipe 30 has a double structure having an inner pipe 31 and an outer pipe 32, and a developer flows in an inner region 31 a inside the inner pipe 31. Temperature adjusting water for adjusting the temperature of the developer flows in an outer region 32a that is a space between the outer tube 32 and the outer tube 32. Note that the temperature-controlled water flowing to the head unit 10 is sent back from the head unit 10 through a separately provided pipe (not shown) as in the case of the developer.
[0028]
The guide unit 40 guides a part of the movement of the pipe 30 which is deformed with the movement of the head unit 10. As shown in FIG. 1, a guide rail 41 extending in the X direction and an arrow 42 </ b> S along the guide rail 41. A guide plate 42 guided in the X direction as shown, and a bearing 43 (accurately guided in the Y direction as indicated by an arrow 43S along a guide groove 42a formed in the guide plate 42 extending in the Y direction. The bearing 43 is mounted on a block that moves along the guide groove 42a), and a clamp portion that is mounted on the bearing 43 and rotates about an axis that faces the Y direction as indicated by an arrow 44R. 44.
[0029]
With the configuration of the guide portion 40 as described above, a part of the route of the pipe 30 held by the clamp portion 44 (hereinafter referred to as “guide portion 33”) is two-dimensionally along a plane parallel to the XZ plane. It can be guided freely, and is held by the clamp portion 44 in a state of being freely rotated and guided around an axis facing the Y direction.
[0030]
The rotating unit 50 includes a chuck 51 that holds the substrate 9 and a motor 52 that rotates the chuck 51. When the chuck 51 rotates, the substrate 9 also rotates in a horizontal plane. Further, the developing process is performed by discharging the developer from the nozzle 11 toward the rotating substrate 9, and the substrate 9 is used to receive the scattered developer from the substrate 9. A cup 53 is also provided to cover the periphery of the side.
[0031]
Next, the movement of the movable plate 12 in the substrate processing apparatus 100, that is, the deformation of the piping 30 accompanying the movement of the head unit 10 will be described with reference to FIGS.
[0032]
FIG. 3 is a diagram illustrating a state in which the head unit 10 has moved in the (−X) direction, and the pipe 30 is curved with a relatively small curvature as a whole. FIG. 4 is a diagram showing a state in which the head unit 10 has moved in the (+ X) direction. The pipe 30 is greatly curved near the center and is almost linear near both ends.
[0033]
3 and 4 are compared, the clamp portion 44 is rotated along the inclination of the pipe 30 at the guide portion 33 along with the deformation that is the position change of the pipe 30, and the guide portion 33 is also rotated. With this movement, the bearing 43 located at the center of rotation of the clamp portion 44 moves along a plane parallel to the XZ plane.
[0034]
As described above, the guide unit 40 can guide the guide part 33 in a plane parallel to the XZ plane without resisting displacement of the position and posture of the guide part 33 accompanying the deformation of the pipe 30. Yes. Thereby, even if the moving plate 12 moves in the (± X) direction, the pipe 30 does not deform while being greatly warped or twisted in the (± Y) direction. That is, even if the pipe 30 is deformed as the moving plate 12 is moved, the pipe 30 is deformed in a plane parallel to the XZ plane. As a result, it is possible to prevent the pipe 30 from being damaged due to interference with other parts inside the substrate processing apparatus 100, and it is possible to prevent particles from being generated due to the interference of the pipe 30. Thereby, the safe driving | operation of the substrate processing apparatus 100 and the improvement of the quality of the board | substrate 9 can be aimed at.
[0035]
In particular, in the present embodiment, a double-structure pipe 30 as shown in FIG. 2 is used as the pipe 30 and the inner pipe 31 is formed of a fluororesin that hardly causes a chemical reaction with the developer. It itself has poor flexibility. For this reason, it is indispensable to lengthen the entire length of the pipe 30. Even in such a case, the pipe 30 is stably guided without warping from a plane parallel to the XZ plane.
[0036]
<2. Second Embodiment>
5 and 6 are views showing the configuration of the substrate processing apparatus 101 according to the second embodiment of the present invention. The substrate processing apparatus 101 is obtained by adding another configuration to the drive unit 20 of the substrate processing apparatus 100 according to the first embodiment, and is otherwise common to the first embodiment. Yes. 5 and FIG. 6 correspond to FIG. 3 and FIG. 4, respectively, and the same reference numerals are given to the same configurations as those in the first embodiment.
[0037]
In the first embodiment, each member of the guide unit 40 is moved by using the deforming force of the pipe 30, but in the guide unit 40 of the substrate processing apparatus 101 according to the second embodiment, The guide plate 42 is moved by receiving a force from the motor 21 as a drive source. That is, in the first embodiment, the entire guide portion 40 moves passively according to the deformation of the pipe 30, but in the second embodiment, a part of the guide portion 40 moves actively. It is like that.
[0038]
As in the first embodiment, the drive unit 20 has a belt 22 hung on a pulley 25a and another pulley 25b attached to a motor 21 that is a drive source. Is attached. Therefore, the head support plate 23 is moved in the X direction while being guided by the guide rail 24 according to the rotation of the motor 21.
[0039]
In this embodiment, a belt 26 is hung between another pulley 25c and a pulley 25a on the motor 21 side, and the pulley 25d fixed to the rotation shaft of the pulley 25c and the pulley 25d in the X direction side. A belt 27 is also hung between the pulley 25e provided. A guide plate 42 of the guide unit 40 is attached to the belt 27. The diameter of the pulley 25c is larger than the diameter of the pulley 25d, and the rotational motion of the motor 21 is decelerated and transmitted to the belt 27. That is, the four pulleys 25a, 25c, 25d, 25e and the two belts 26, 27 constitute a motion transmission mechanism 20T that mechanically transmits the rotational motion of the motor 21 to the guide plate 42.
[0040]
By providing the motion transmission mechanism 20T as described above, in this substrate processing apparatus 101, the guide plate 42 is also X in synchronism with the movement of the head support plate 23 by the rotation of the motor 21, that is, the movement of the head 10. Move in the direction. Further, since the diameter of the pulley 25c is larger than the diameter of the pulley 25d, the movement amount of the guide plate 42 is smaller than the movement amount of the head portion support plate 23. As a result, the guide plate 42 of the guide unit 40 actively guides the displacement in the X direction of the guide portion 33 of the pipe 30 in accordance with the deformation of the pipe 30.
[0041]
In addition, by actively guiding the pipe 30 in this way, the pipe 30 can be guided reliably and extremely smoothly, and damage to the pipe 30 inside the apparatus can be reduced while reducing unnecessary internal stress generated in the pipe 30. In addition, the generation of particles due to the interference of the pipe 30 can be prevented. Thereby, the safe operation of the substrate processing apparatus 101 and the quality of the substrate 9 can be improved.
[0042]
<3. Third Embodiment>
FIG. 7 is a perspective view showing a substrate processing apparatus 200 according to the third embodiment of the present invention.
[0043]
The substrate processing apparatus 200 includes an indexer unit 281 on which the substrate 209 is accommodated in a carrier 291, a spin coater 282 that performs a coating process on the substrate 209, a spin developer 283 that performs a developing process on the substrate 209, and a substrate 209. A plurality of heat treatment units 284 for heating and cooling, and a transfer robot 200R for transferring various substrates and an interface separately provided outside the apparatus and the substrate 209 are provided.
[0044]
The indexer unit 281 has an entry / exit robot 285 for taking in / out the substrate 209 from / into the carrier 291, and the substrate 209 taken out from the entry / exit robot 285 is transferred to the transfer robot 200R. Predetermined processing is performed via the processing unit. Then, the substrate 209 that has been processed is transferred to the access robot 285 and accommodated in the carrier 291.
[0045]
The transfer robot 200R in the substrate processing apparatus 200 is configured such that the vicinity of the hand moves greatly in the X direction as indicated by an arrow 200S in FIG. Further, the two hands 211a and 211b provided on the upper part perform a sliding motion and a rotational motion to transfer the substrate 209 to various processing units and the like.
[0046]
FIG. 8 is a perspective view showing the structure of the transfer robot 200R. The transport robot 200R has two hands 211a and 211b that perform a sliding motion on the hand base 212. The hand base 212 is rotated by a motor 213 about an axis 210C that faces the Z direction. The bracket 214 to which the motor 213 is attached is moved up and down in the Z direction along the guide rail 215 by a mechanism using the motor 217 and the ball screw 216. Further, the moving table 223 to which the motor 217 is fixed is connected by a ball screw 224 and a nut portion 223a, and when the ball screw 224 rotates, the moving table 223 moves in the X direction.
[0047]
Also, pulleys 225a and 225b are attached to the rotation shaft of the motor 221 as a drive source and the ball screw 224, respectively, and the driving force of the motor 221 is transmitted to the ball screw 224 by hanging the belt 222 on these pulleys 225a and 225b. It has become so.
[0048]
The mechanical configuration of the transfer robot 200R has been described above. In order to realize the movement of such a complicated mechanism of the transfer robot 200R, cables serving as current supply paths to various motors and the operation of the transfer robot 200R are detected. A wiring 230, which is a bundle of signal lines from various sensors, extends from the nut portion 223a of the moving base 223.
[0049]
A guide portion 233 which is a part of the wiring 230 is held and guided by a guide portion 240 provided below the movable table 223. That is, the clamp portion 244 is supported by the bearing 243 so as to be able to rotate and swing as indicated by an arrow 244R about an axis facing the Y direction, and the bearing 243 is indicated by an arrow 243S along the guide rail 242. The guide rail 242 is slidable in the Z direction as indicated by an arrow 242S along the two guide rails 241.
[0050]
With the configuration of the guide portion 240 described above, the clamp portion 244 can freely move in a two-dimensional manner in a plane parallel to the XZ plane and can be rotated. Therefore, when the movable table 223 moves in the X direction, the position of the wiring 230 changes, that is, deforms accordingly. However, the guide portion 233 of the wiring 230 moves in a plane parallel to the XZ plane without applying unnecessary force. It is smoothly guided in a two-dimensional manner so as to freely rotate and swing. FIG. 9 and FIG. 10 show this guidance when looking from the (−Y) direction shown in FIG. 8 toward the (+ Y) direction. FIG. 9 shows a state when the nut portion 223a of the moving base 223 moves in the (−X) direction, and FIG. 10 shows a state when the nut portion 223a moves in the (+ X) direction.
[0051]
As shown in FIGS. 9 and 10, in this substrate processing apparatus 200, a guide part 233, which is a part of the route of the wiring 230 connected to the moving part of the transfer robot 200 R, is placed on the XZ plane by the guide unit 240. Since it is guided along the parallel plane, the curved portion of the wiring 230 is not warped from the XZ plane and the wiring 230 is not twisted. As a result, there is no problem that the wiring 230 interferes with other parts in the substrate processing apparatus 200 and is damaged, or particles are generated due to the interference of the wiring 230. Thereby, the safe operation of the substrate processing apparatus 200 and the improvement of the quality of the substrate 209 can be achieved.
[0052]
<4. Fourth Embodiment>
FIG. 11 is a perspective view showing a transfer robot 300R used for transferring a substrate in the substrate processing apparatus according to the fourth embodiment of the present invention. The transfer robot 300 </ b> R delivers a substrate to and from each processing unit in the substrate processing apparatus, similarly to the transfer robot 200 </ b> R in the third embodiment.
[0053]
The transfer robot 300R has two hands 311a and 311b for holding a substrate, and these hands slide in a horizontal direction as indicated by an arrow 311S. The hand base 312 that supports the hands 311a and 311b moves up and down with respect to the moving base 323 as indicated by an arrow 312S, and this lifting motion is a nut portion attached to a ball screw 313b driven by a motor 313a. The movement of 313c is realized by being converted into a lifting motion by the pantograph mechanism 313d.
[0054]
The moving base 323 is connected to the ball screw 324 at the nut portion 323a, and the moving base 323 is indicated by the arrow 323S along the guide rod 322 by rotating the ball screw 324 by the motor 321 attached to the base 352. It is supposed to go up and down.
[0055]
Further, in the transfer robot 300R, the base 352 to which the motor 321 and the guide rod 322 are attached receives the action of the motor 351 and rotates about an axis facing the Z direction as indicated by arrows 352F and 352B. Yes.
[0056]
With the configuration as described above, the transfer robot 300R can move the substrate up and down and slide it in an arbitrary horizontal direction.
[0057]
As described above, in the transfer robot 300R, a complicated mechanism is provided above the moving table 323. In order to realize the movement of the complicated mechanism, cables and sensors serving as power supply paths to various drive sources are used. These signal lines are bundled to form a wiring 330. In other words, the wiring 330 serves as a current path that plays various roles. The wiring 330 extends from the moving table 323 so as to be substantially perpendicular to the moving direction of the moving table 323.
[0058]
As described above, the movable table 323 moves up and down as indicated by the arrow 323S and rotates as indicated by the arrows 352F and 352B. Therefore, the wiring 330 extending from the moving table 323 is deformed with the movement of the moving table 323, but the transport robot 300R is provided with a guide unit 340 for guiding the deformation of the wiring 330. This prevents the wiring 330 from being caught and damaged by the ball screw 324 due to the up-and-down movement or the turning movement of the moving base 323, and the wiring 330 is loosened and interferes with other parts to cause particles. Is also prevented from occurring.
[0059]
FIG. 12 and FIG. 13 are diagrams illustrating the operation of the guide unit 340 that guides the wiring 330 and keeps the deformation state, which is the position change of the wiring 330, within a certain range. In addition, these figures have shown the case where it looks to the (+ Y) direction from (-Y) direction in FIG. 11, and has shown only the outline of the structure required for description.
[0060]
As shown in FIG. 12, the guide part 340 rotates and swings about a clamp part 344 that holds a guide part 333 that is a part of the wiring 330, and the clamp part 344 about an axis that faces the Y direction as indicated by an arrow 344R. A bearing 343 that freely supports, a guide rail 342 that slides the bearing 343 and the clamp portion 344 in the Z direction indicated by an arrow 343S is provided. The bearing 343 and the clamp portion 344 are ball screws that are rotated by a motor 341 (not shown). ) To forcibly move up and down. The guide rail 342 is provided so as to be fixed to a support plate 353 fixed on the base 352 shown in FIG.
[0061]
As shown in FIG. 12, a signal from an encoder that moves the moving table 323 up and down is input to the guide control unit 360, and the guide control unit 360 rotates the motor 341 of the guide unit 340. It comes to control. That is, the lifting / lowering movement of the clamp part 344 is controlled to synchronize with the lifting / lowering movement of the movable table 323, and the guide portion 333 is reliably and smoothly guided.
[0062]
With the configuration of the guide section 340 as described above, the guide portion 333 of the wiring 330 is smoothly guided linearly and freely rotationally and swingably without any excessive force. As a result, fatigue fracture due to the deformation of the wiring 330 due to the movement of the moving base 323, damage to the wiring 330 due to interference with other parts, generation of particles due to interference with other parts of the wiring 330, and the like are effectively prevented. can do. Thereby, the safe driving | operation of a substrate processing apparatus and the improvement of the quality of a board | substrate can be aimed at.
[0063]
12 and 13, the guide movement of the guide unit 340 is synchronized only with the up-and-down movement of the moving table 323, but the rotating movement of the base 352 shown in FIG. 11 is also the rotating movement of the moving table 323. Therefore, the guide movement of the guide unit 340 may be synchronized with the rotation of the motor 351.
[0064]
<5. Modification>
Although the embodiment according to the present invention has been described above, the present invention is not limited to the above embodiment, and various design changes are possible.
[0065]
For example, in the above embodiment, the case where a pipe or a part of wiring that is a flexible line connected to a moving part in the substrate processing apparatus is guided is described. As long as it becomes a passage, any one may be used, and a passage such as air or processing gas may be used. Further, the wiring is not limited to a power or signal path, that is, a current path, and may be an optical fiber that is a path for an optical signal or the like. In particular, if the optical fiber is deformed with a large curvature, the transmission efficiency of the optical signal is lowered, so that the total length has to be increased, and the present invention can be used effectively.
[0066]
In the above embodiment, the guide portion of the pipe or wiring is guided linearly, two-dimensionally or freely swingably. However, the guide may be curved or curved and in any direction. It may be guided by a swingable hinge.
[0067]
In the above embodiment, the linear motion guide mechanism that is a combination of a guide rail and a member that slides on the rail is shown. However, any of these detailed structures may be used. Examples thereof include a guide mechanism that smoothly slides by inserting a ball between them, an accumulator mechanism in which a roller is disposed on a guide rail, and a guide mechanism that uses a linear ball bush.
[0068]
Further, the mechanism for actively guiding the guide unit to perform the guide operation is not limited to the combination of the guide and the drive system, and the guide and the drive system may be integrated as in the rodless cylinder.
[0069]
【The invention's effect】
According to the first to ninth aspects of the present invention, since the pipes and wirings connected to the moving part are guided by the guide part, the pipes and wirings interfere with other parts of the substrate processing apparatus and are damaged or particles caused by the interference. Can be prevented. Thereby, the safe driving | operation of a substrate processing apparatus and the improvement of the quality of a board | substrate can be aimed at.
[0070]
In the inventions according to claims 8 and 9, since the movement of the moving part and the guiding operation of the guiding means can be synchronized, the guiding part can be guided reliably and smoothly.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a substrate processing apparatus according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a cross section of a pipe.
FIG. 3 is a side view showing the inside of the substrate processing apparatus shown in FIG. 1;
4 is a side view showing the inside of the substrate processing apparatus shown in FIG. 1;
FIG. 5 is a side view showing the inside of a substrate processing apparatus according to a second embodiment of the present invention.
FIG. 6 is a side view showing the inside of a substrate processing apparatus according to a second embodiment of the present invention.
FIG. 7 is a perspective view showing a substrate processing apparatus according to a third embodiment of the present invention.
8 is a perspective view showing a configuration of a transfer robot included in the substrate processing apparatus shown in FIG.
FIG. 9 is a diagram illustrating a state of guiding a wiring included in the transfer robot illustrated in FIG. 8;
FIG. 10 is a diagram illustrating a state of wiring guidance included in the transfer robot illustrated in FIG. 8;
FIG. 11 is a perspective view showing a configuration of a transfer robot included in a substrate processing apparatus according to a third embodiment of the invention.
12 is a diagram illustrating a state of guidance of wiring included in the transfer robot illustrated in FIG. 11;
13 is a diagram showing a state of guidance of wirings that the transport robot shown in FIG. 11 has. FIG.
[Explanation of symbols]
9, 209 substrate
10 Head
11 nozzles
12 Moving plate
21, 221, 321 Motor
20T motion transmission mechanism
30 Piping
33, 233, 333 Guide part
40, 240, 340 Guide
41, 241, 242, 342 Guide rail
42 Guide plate
43, 243, 342 Bearing
44, 244, 344 Clamping part
100, 101, 200 Substrate processing apparatus
223, 323 mobile stand
230, 330 wiring
341 motor
360 Guidance control means

Claims (9)

A substrate processing apparatus for processing a substrate,
In a predetermined processing operation on the substrate, a moving unit that moves by a driving force from a predetermined driving source;
Deformable piping connected to the moving part and passing a fluid used in the processing operation;
Guide means connected to a predetermined guide portion defined in a part of the pipe and guiding a position change of a part of the pipe which is deformed with the movement of the moving part ;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the pipe extends from the moving part in a direction substantially perpendicular to the moving direction of the moving part. The substrate processing apparatus according to claim 1, wherein:
The fluid is a developer for performing development processing of the substrate,
The substrate processing apparatus, wherein the moving unit is coupled with a developing solution applying unit for applying the developing solution supplied via the pipe onto the substrate. A substrate processing apparatus for processing a substrate,
In a predetermined processing operation on the substrate, a moving unit that moves by a driving force from a predetermined driving source;
A deformable wiring connected to the moving part;
Guide means connected to a predetermined guide portion defined in the middle of the wiring and guiding a change in the position of a part of the wiring deformed with the movement of the moving part ;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1, wherein:
The guiding means is
Means for linearly guiding the guiding portion;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1, wherein:
The guiding means is
Means for guiding the guide part two-dimensionally;
A substrate processing apparatus comprising: A substrate processing apparatus according to any one of claims 1 to 6,
The guiding means is
Means for guiding the rotational swing of the guide part;
A substrate processing apparatus comprising: A substrate processing apparatus according to any one of claims 1 to 7,
A motion transmission mechanism for generating a guide operation by the guide means by transmitting the motion generated by the drive source to the guide means;
A substrate processing apparatus further comprising: A substrate processing apparatus according to any one of claims 1 to 7,
A guide drive source for driving the guide means to cause a guide operation;
Control means for controlling the guide drive source in synchronization with the movement of the moving section;
A substrate processing apparatus further comprising:

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