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JP3662785B2 - Electronic equipment - Google Patents
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JP3662785B2 - Electronic equipment - Google Patents

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JP3662785B2
JP3662785B2 JP27605099A JP27605099A JP3662785B2 JP 3662785 B2 JP3662785 B2 JP 3662785B2 JP 27605099 A JP27605099 A JP 27605099A JP 27605099 A JP27605099 A JP 27605099A JP 3662785 B2 JP3662785 B2 JP 3662785B2
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electronic component
contact
metal member
electrode
connector
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JP2001102716A (en
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隆 岡戸
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埼玉日本電気株式会社
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Description

【0001】
【発明の属する技術分野】
電子部品と、これを搭載する基板と、を備える電子装置に関し、特に、薄型化、軽量化できる電子装置に関する。
【0002】
【従来の技術】
従来技術を図面を用いて説明する。図8は、従来の一例に係る電子装置の分解斜視図であり、(A)は分解斜視図であり、(B)は組立時におけるW−W’間の断面図である。
【0003】
従来の携帯電話機等に実装される電子装置101における電子部品103及びコネクタ104は、基板102の板面上の所定の位置に実装されている。電子部品103は、電子部品ユニット等のようなものであり、基板との実装面には電極105を有し、この電極105は、これと対応する基板の接点108とはんだ接合等により電気的に接続されている。コネクタ104は、その開口部の反対側の面にコンタクトと電気的に繋がる端子110を有しており、筐体ではさみ込んだり、コネクタの外殻を接着剤により基板と接着したり、コネクタの外殻に設けた爪を基板に設けた穴に引掛けたりすることによって基板に実装されている。コネクタの端子は、これと対応する基板上の接点109と電気的に接続されている。
【0004】
【発明が解決しようとする課題】
この従来例のように、電子部品をコネクタの実装面と反対側の基板の面に実装すると、かなりの厚みとなり、電子機器の筐体の体積が大きくなる。これでは電子機器の小型化・薄型化の実情に沿わない。
【0005】
また、この従来例のように電子部品とコネクタを基板の板面の表側と裏側にそれぞれ実装すると、この基板上のそれぞれの実装面には他の部品を配置することができず、配線の少ないいわゆるデッドスペースができ、配線効率が悪くなるという問題点がある。また、電子部品とコネクタとが基板を介して相対する位置に実装したときはデッドスペースを減らすことができるものの、依然としてデッドスペースを有する状態にある。さらに、このデッドスペースは、基板の軽量化の妨げともなっている。
【0006】
本発明の目的は、小型化・薄型化・軽量化することができる電子装置を提供することである。
【0007】
【課題を解決するための手段】
本発明の第1にの視点において、電子装置は、電極を有する第一電子部品と、前記第一電子部品を実装するとともに前記電極と電気的に接続する電極部と、前記電極部から延在する端子部と、を有する金属部材と、本体から延在するリード端子と、本体の全体ないし一部を覆う絶縁殻と、を有するとともに、前記絶縁殻に前記金属部材の一部を入れ子式に埋め込む第二電子部品と、前記第一電子部品を収納する空所と、前記金属部材の端子部と電気的に接続する第一接点と、前記第二電子部品のリード端子と電気的に接続する第二接点と、を有するとともに、前記空所と対応する板面上に前記第二電子部品を実装する基板と、を備えることを特徴とする。
【0008】
本発明の第2にの視点において、電子装置は、電極を有する第一電子部品と、前記第一電子部品を実装するとともに前記電極と電気的に接続する電極部と、前記電極部から延在する端子部と、を有する金属部材と、本体から延在するリード端子と、本体の全体ないし一部を覆う絶縁殻と、を有するとともに、前記絶縁殻上に前記金属部材を配設する第二電子部品と、前記第二電子部品を収納し嵌合する空所と、前記金属部材の端子部と電気的に接続する第一接点と、前記第二電子部品のリード端子と電気的に接続する第二接点と、を有する基板と、を備えることを特徴とする。
【0009】
また、前記電子装置において、前記第一接点は、スルーホールであり、前記金属板の端子部は、前記スルーホールに挿入されることが好ましい。
【0010】
また、前記電子装置において、前記第二電子部品は、複数の接触端子が平面上で平行に配列されている第一コタクトと、同軸型コンタクトからなる第二コンタクトと、を有する複合コネクタであり、前記電子装置は、携帯電話機に実装される、ことが好ましい。
【0011】
【発明の実施の形態】
基板上の第二電子部品との実装面は、他の電子部品を実装することができず、これに伴い基板中の配線もほとんどないスペース(デッドスペース)ができるので、このデッドスペースを削除することで機器の軽量化につながる。そして、前記基板の削除したスペースに第一電子部品を収納することで、機器を軽量化すると同時に薄型にすることができる。このように実装する結果、以下のようにすることが好ましい。
【0012】
電極を有する第一電子部品と、前記第一電子部品を実装するとともに前記電極と電気的に接続する電極部と、前記電極部から延在する端子部と、を有する金属部材と、により、第一電子部品の電極とこの電極に対応する基板上の接点とが離れても、電気的に接続することができる。そして、本体から延在するリード端子と、本体の全体ないし一部を覆う絶縁殻と、を有するとともに、前記絶縁殻に前記金属部材の一部を入れ子式に埋め込む第二電子部品を備えることにより、第一電子部品と第二電子部品とが一体的になる。そして、前記第一電子部品を収納する空所と、前記金属部材の端子部と電気的に接続する第一接点と、前記第二電子部品のリード端子と電気的に接続する第二接点と、を有するとともに、前記空所と対応する板面上に前記第二電子部品を実装する基板を備えることにより、第一電子部品と基板と及び第二電子部品と基板とがそれぞれ電気的に接続することができる。
【0013】
【実施例】
本発明の実施例1を図面を用いて説明する。図1は、本発明の実施例1に係る電子装置であり、(A)は分解斜視図であり、(B)は組立時におけるX−X’間の断面図である。この電子装置1は、基板2と、電子部品ユニット3と、コネクタ4と、金属部材5と、からなる。
【0014】
基板2は、プリント配線基板であり、電子部品ユニット3を収納する空所21と、金属部材の端子部52と電気的に接続する第一接点22と、前記第二電子部品のリード端子と電気的に接続する第二接点23と、を有するとともに、前記空所21と対応する板面上にコネクタ4が実装される(図2参照)。第一接点22は、スルーホールであり、金属部材の端子部52が差込まれ、はんだ等により電気的に接続する。
【0015】
電子部品ユニット3は、その一の面に電極31を有し、基板の空所に収納され、コネクタのシェルに一部埋め込まれた金属部材上に実装される。電極31は、金属部材の電極部51とはんだ、導電性接着剤等の接着手段や外部からの押圧手段等により電気的に接続する。
【0016】
コネクタ4は、複合コネクタであり、シェル41と、第一コネクタ部6と、第二コネクタ部7と、を有する(図3参照)。
【0017】
シェル41は、樹脂等の絶縁体で形成された箱状のシェルであり、その一の面に開口部42を有し、中は空洞で、開口部の反対側の面に第一コネクタ部6及び第二コネクタ部7をそれぞれ装着するための第一穴43及び第二穴44を有し、基板2との実装面に金属部材5の一部を入れ子式に埋め込む凹部45を有する。シェル41の空洞内には第一コンタクト61と第二コンタクト71とが配されており、シェルの第一穴43及び第二穴44からはそれぞれ第一リード端子62と第二リード端子72とが外側に延在する。
【0018】
第一コネクタ部6は、第一コンタクト61と、第一リード端子62と、から成る。第一コンタクト61は、シェル内の2つの第二コンタクト71の間に配され、上下面に溝を有する絶縁体からなる配列板63と、前記溝内に配されたコンタクト部64と、を有し、シェルの第一穴43を貫通して第一リード端子62とつながる。第一リード端子62は、基板の第二接点23中の対応する接点とはんだ等により電気的に接続し、シェルの第一穴43を貫通して第一コンタクト61とつながる。
【0019】
第二コネクタ部7は、第二コンタクト71と、第二リード端子72と、から成る。第二コンタクト71は、シェル内の第一コンタクト61の所定間隔をおいて両脇に存在し、絶縁材料により形成された筒状のインシュレ−タ73と、その外周面を覆い導電材料から成る外部コンタクト部74と、インシュレ−タの内周面を覆い導電材料から成る内部コンタクト部75と、を有し、シェルの第二穴44を貫通して第二リード端子72とつながる。第二リード端子72は、基板の第二接点23中の対応する接点とはんだ等により電気的に接続し、シェルの第二穴44を貫通して第二コンタクト43とつながる。
【0020】
金属部材5は、電子部品ユニット3を実装するとともに電子部品ユニットの電極31と電気的に接続する電極部51と、前記電極部から延在する端子部52と、を有し、コネクタシェルの実装面の凹部45に一部入れ子式に埋め込まれる(図3参照)。端子部52は、基板の第一接点52であるスルーホールに差込まれ、はんだ等により電気的に接続する。
【0021】
電子装置の組立について説明する。まず、基板の空所21の片側を塞ぐようにしてコネクタ4を実装する。この時、コネクタの第一リード端子62、第二リード端子72、及び、コネクタに埋め込まれている金属部材の端子部52をそれぞれ対応する基板上の接点22、23に合わせるようにし、はんだ等で接続する。この段階では、基板の空所21のコネクタ実装面の反対側には、コネクタに一部埋め込まれた金属部材の電極部51が露出している。次に、基板の空所21のコネクタ実装面の反対側から電子部品ユニット3を挿入し、基板の空所21に収納する。次に、コネクタ4及び電子部品ユニット3の外側から筐体などのモ−ルドを利用し、コネクタ4と電子部品ユニット3を挟み込むように押さえ込んで装着する。これにより、コネクタに一部埋め込まれたの金属部材の電極部51と、電子部品ユニットの電極31と、が接触し導通する。
【0022】
以上のように装着することにより、電子部品ユニットは、基板の第一接点から金属部材の端子部に電力が供給され、金属部材の電極部から電子部品ユニットの電極に電力が供給されることにより、作動する。
【0023】
次に、本発明の実施例2について図面を用いて説明する。図4は、本発明の実施例2に係る電子装置であり、(A)は分解斜視図であり、(B)は組立時におけるY−Y’間の断面図である。図5は、本発明の実施例2に係る電子装置の基板及びコネクタの構成部品であり、(A)は基板の上面斜視図であり、(B)は基板の下面斜視図、(C)は金属部材の斜視図、(D)はシェルの正面斜視図、(E)はシェルの背面斜視図である。この電子装置11は、基板の第一接点24及び金属部材の端子部54の電気的接続手段以外は実施例1とほぼ同様のものである。
【0024】
金属部材の端子部54は、電極部53から延在し、シェルの凹部85から開口部82の反対側の面にかけて空けられた第三穴86を挿通し、基板の第一接点24であるランドとはんだ等により電気的に接続する。
【0025】
これにより、基板に貫通穴を設けることなく、電子部品ユニットは、基板の第一接点から金属部材の端子部に電力が供給され、金属部材の電極部から電子部品ユニットの電極に電力が供給されることにより、作動する。
【0026】
次に、本発明の実施例3について図面を用いて説明する。図6は、本発明の実施例3に係る電子装置であり、(A)は分解斜視図であり、(B)は組立時におけるZ−Z’間の断面図である。この電子装置12は、基板の空所にコネクタを収納し嵌合することを特徴とし、基板2と、電子部品ユニット3と、コネクタ9と、金属部材5と、からなる。図7は、本発明の実施例3に係る電子装置の基板及びコネクタの構成部品であり、(A)は基板の上面斜視図であり、(B)は基板の下面斜視図、(C)は金属部材の斜視図、(D)はシェルの正面斜視図、(E)はシェルの背面斜視図である。
【0027】
基板2は、コネクタを収納し嵌合する空所27と、金属部材の端子部と電気的に接続する第一接点28と、前記第二電子部品のリード端子と電気的に接続する第二接点29と、を有する。第一接点28は、ランドであり、金属部材の端子部とはんだ等により電気的に接続する。
【0028】
電子部品ユニット3は、その一の面に電極31を有し、コネクタのシェル91上に配設された金属部材5上に実装される。電極31は、金属部材の電極部55とはんだ、導電性接着剤等の接着手段や外部からの押圧手段等により電気的に接続する。
【0029】
コネクタ9は、複合コネクタであり、シェル91と、第一コネクタ部6と、第二コネクタ部7と、を有する。
【0030】
シェル91は、樹脂等の絶縁体で形成された箱状のシェルであり、その一の面に開口部92を有し、中は空洞で、開口部の反対側の面に第一コネクタ部6及び第二コネクタ部7をそれぞれ装着するための第一穴93及び第二穴94を有し、側面両側に基板の空所の端部を摺動させて取付けるための摺動溝96を有する。シェル91の空洞内には第一コンタクト61と第二コンタクト71とを有し、シェルの第一穴93及び第二穴94からは第一リード端子62と第二リード端子72とが外側に延在し、シェルの一の面には金属部材が取付けられている。
【0031】
第一コネクタ部6は、第一コンタクト61と、第一リード端子62と、から成る。第一コンタクト61は、シェル内の2つの第二コンタクト71の間に存在し、上下面に溝を有する絶縁体からなる配列板63と、前記溝内に配されたコンタクト部64と、を有し、シェルの第一穴93を貫通して第一リード端子62とつながる。第一リード端子62は、基板の第二接点29中の対応する接点とはんだ等により電気的に接続し、シェルの第一穴43を貫通して第一コンタクト42とつながる(図3(D)参照)。
【0032】
第二コネクタ部7は、第二コンタクト71と、第二リード端子72と、から成る。第二コンタクト71は、シェル内の第一コンタクト61の所定間隔をおいて両脇に存在し、絶縁材料により形成された筒状のインシュレ−タ73と、その外周面を覆い導電材料から成る外部コンタクト部74と、インシュレ−タの内周面を覆い導電材料から成る内部コンタクト部75と、を有し、シェルの第二穴94を貫通して第二リード端子72とつながる。第二リード端子72は、基板の第二接点29中の対応する接点とはんだ等により電気的に接続し、シェルの第二穴94を貫通して第二コンタクト71とつながる(図3(E)参照)。
【0033】
金属部材5は、電子部品ユニット3を実装するとともに電子部品ユニットの電極31と電気的に接続する電極部55と、前記電極部から延在する端子部56と、を有し、コネクタシェルの一の面に取付けられる。端子部56は、基板の第一接点28であるランドとはんだ等により電気的に接続する。
【0034】
電子装置の組立について説明する。まず、基板の空所27の端部をコネクタの摺動溝96に合わせ押し込んでコネクタ9を実装する。この時、コネクタの第一リード端子62及び第二リード端子72をそれぞれ対応する基板上の第二接点29に合わせるようにして、はんだ等で接続する。次に、金属部材の電極部55をコネクタシェル91に接着し、端子部56を基板の第一接点28に合わせてはんだ等で接続する。次に、電子部品ユニット3を金属部材5にはんだ等で接続する。次に、コネクタ9及び電子部品ユニット3の外側から筐体などのモ−ルドを利用し、コネクタ9と電子部品ユニット3を挟み込むように押さえ込んで装着する。
【0035】
以上のように装着することにより、電子部品ユニットは、基板の第一接点から金属部材の端子部に電力が供給され、金属部材の電極部から電子部品ユニットの電極に電力が供給されることにより、作動する。
【0036】
【発明の効果】
本発明によれば、コネクタのシェル外周面部に金属部材を設けることにより、携帯電話等の電気機器装置に使用される電子部品ユニットを基板に直接接続することなく、このコネクタを介して基板に接続することができ、基板上のランドパタンが削除でき、これに伴って基板の一部を削減することができる。
【0037】
また、コネクタのシェル外周面部に金属部材を有し、前記コネクタが実装された基板に空所を設け、基板裏面部から電気部品ユニットを挿入し収納することにより、電子機器装置の厚さを薄くでき、かつ、空所を設けることによる基板自体の重さを軽くすることができる。
【0038】
また、コネクタのシェル外周面部に金属部材を有し、前記コネクタを収納し嵌合する空所を基板に設け、金属部材上に電子部品ユニットを実装することにより、電子装置の厚さを薄くでき、かつ、空所を設けることによる基板自体の重さを軽くすることができる。
【0039】
また、電子装置の薄型化に伴い、これを実装する電子機器の小型化を図ることができる。
【図面の簡単な説明】
【図1】本発明の実施例1に係る電子装置であり、(A)は分解斜視図であり、(B)は組立時におけるX−X’間の断面図である。
【図2】本発明の実施例1に係る電子装置の基板であり、(A)は上面斜視図であり、(B)は下面斜視図である。
【図3】本発明の実施例1に係る電子装置のコネクタの構成部品であり、(A)は金属部材の斜視図、(B)はシェルの正面斜視図、(C)はシェルの背面斜視図、(D)は第一コンタクトの斜視図、(E)は第二コンタクトの斜視図である。
【図4】本発明の実施例2に係る電子装置であり、(A)は分解斜視図であり、(B)は組立時におけるY−Y’間の断面図である。
【図5】本発明の実施例2に係る電子装置の基板及びコネクタの構成部品であり、(A)は基板の上面斜視図であり、(B)は基板の下面斜視図、(C)は金属部材の斜視図、(D)はシェルの正面斜視図、(E)はシェルの背面斜視図である。
【図6】本発明の実施例3に係る電子装置であり、(A)は分解斜視図であり、(B)は組立時におけるZ−Z’間の断面図である。
【図7】本発明の実施例3に係る電子装置の基板及びコネクタの構成部品であり、(A)は基板の上面斜視図であり、(B)は基板の下面斜視図、(C)は金属部材の斜視図、(D)はシェルの正面斜視図、(E)はシェルの背面斜視図である。
【図8】従来の一例に係る電子装置の分解斜視図であり、(A)は分解斜視図であり、(B)は組立時におけるW−W’間の断面図である。
【符号の説明】
1、11、12 電子装置
2 基板
3 電子部品ユニット
4、8、9 コネクタ
5 金属部材
6 第一コネクタ部
7 第二コネクタ部
21、24、27 空所
22、25、28 第一接点
23、26、29 第二接点
31 電極
41、81、91 シェル
42、82、92 開口部
43、83、93 第一穴
44、84、94 第二穴
45、85、95 凹部
51、53、55 電極部
52、54、56 端子部
61 第一コンタクト
62 第一リード端子
63 配列板
64 コンタクト部
71 第二コンタクト
72 第二リード端子
73 インシュレ−タ
74 外部コンタクト部
75 内部コンタクト部
86 第三穴
96 摺動溝
101 電子装置
102 基板
103 電子部品
104 コネクタ
105 電極
106 第一コネクタ部
107 第二コネクタ部
108、109 接点
110 リード端子
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device including an electronic component and a substrate on which the electronic component is mounted, and particularly to an electronic device that can be reduced in thickness and weight.
[0002]
[Prior art]
The prior art will be described with reference to the drawings. FIG. 8 is an exploded perspective view of an electronic device according to a conventional example. FIG. 8A is an exploded perspective view, and FIG. 8B is a cross-sectional view taken along WW ′ during assembly.
[0003]
The electronic component 103 and the connector 104 in the electronic device 101 mounted on a conventional mobile phone or the like are mounted at predetermined positions on the plate surface of the substrate 102. The electronic component 103 is an electronic component unit or the like, and has an electrode 105 on the mounting surface with the substrate. The electrode 105 is electrically connected to the corresponding contact 108 of the substrate by soldering or the like. It is connected. The connector 104 has a terminal 110 electrically connected to the contact on the surface on the opposite side of the opening. The connector 104 is inserted into the housing, the outer shell of the connector is bonded to the substrate with an adhesive, The nail provided on the outer shell is mounted on the board by hooking it on a hole provided on the board. The terminal of the connector is electrically connected to the corresponding contact 109 on the substrate.
[0004]
[Problems to be solved by the invention]
When the electronic component is mounted on the surface of the board opposite to the mounting surface of the connector as in this conventional example, the thickness becomes considerable and the volume of the housing of the electronic device increases. This does not follow the actual situation of downsizing / thinning electronic devices.
[0005]
In addition, when electronic components and connectors are mounted on the front side and the back side of the board surface of the board as in this conventional example, other parts cannot be placed on each mounting surface on the board, and wiring is reduced. There is a problem that a so-called dead space is formed and wiring efficiency is deteriorated. Further, when the electronic component and the connector are mounted at positions facing each other through the substrate, the dead space can be reduced, but the dead space is still present. Furthermore, this dead space also hinders weight reduction of the substrate.
[0006]
An object of the present invention is to provide an electronic device that can be reduced in size, thickness, and weight.
[0007]
[Means for Solving the Problems]
In a first aspect of the present invention, an electronic device includes a first electronic component having an electrode, an electrode portion that mounts the first electronic component and is electrically connected to the electrode, and extends from the electrode portion. And a lead member extending from the main body, and an insulating shell covering the whole or a part of the main body, and a part of the metal member is nested in the insulating shell. A second electronic component to be embedded, a space for storing the first electronic component, a first contact electrically connected to the terminal portion of the metal member, and a lead terminal of the second electronic component And a board for mounting the second electronic component on a plate surface corresponding to the space.
[0008]
In a second aspect of the present invention, an electronic device includes a first electronic component having an electrode, an electrode portion that mounts the first electronic component and is electrically connected to the electrode, and extends from the electrode portion. A second metal member having a terminal portion to be connected, a lead terminal extending from the main body, and an insulating shell covering the whole or a part of the main body, and the second metal member disposed on the insulating shell. An electronic component, a space for accommodating and fitting the second electronic component, a first contact electrically connected to the terminal portion of the metal member, and a lead terminal of the second electronic component And a substrate having a second contact.
[0009]
In the electronic device, it is preferable that the first contact is a through hole, and the terminal portion of the metal plate is inserted into the through hole.
[0010]
Further, in the electronic device, the second electronic component is a composite connector having a first co emissions tact plurality of contact terminals are arranged parallel to on the plane, and a second contact comprising a coaxial contact, the Preferably, the electronic device is mounted on a mobile phone.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
The mounting surface with the second electronic component on the board cannot be mounted with other electronic components, and as a result, there is a space (dead space) with almost no wiring in the board, so this dead space is deleted. This leads to lighter equipment. By storing the first electronic component in the deleted space of the substrate, the device can be reduced in weight and at the same time thinned. As a result of mounting in this way, the following is preferable.
[0012]
A first electronic component having an electrode, an electrode portion that mounts the first electronic component and is electrically connected to the electrode, and a metal member that has a terminal portion extending from the electrode portion, Even if the electrode of one electronic component and the contact on the substrate corresponding to this electrode are separated, electrical connection can be made. And a second electronic component having a lead terminal extending from the main body and an insulating shell covering the whole or a part of the main body and embedding part of the metal member in the insulating shell in a nested manner. The first electronic component and the second electronic component are integrated. And a space for storing the first electronic component, a first contact electrically connected to the terminal portion of the metal member, a second contact electrically connected to the lead terminal of the second electronic component, And a board on which the second electronic component is mounted on the plate surface corresponding to the space, the first electronic component and the board, and the second electronic component and the board are electrically connected to each other. be able to.
[0013]
【Example】
A first embodiment of the present invention will be described with reference to the drawings. 1A and 1B show an electronic device according to a first embodiment of the present invention, in which FIG. 1A is an exploded perspective view and FIG. 1B is a cross-sectional view taken along line XX ′ during assembly. The electronic device 1 includes a substrate 2, an electronic component unit 3, a connector 4, and a metal member 5.
[0014]
The board 2 is a printed wiring board, and includes a space 21 for housing the electronic component unit 3, a first contact 22 that is electrically connected to a terminal portion 52 of a metal member, and a lead terminal of the second electronic component. The connector 4 is mounted on a plate surface corresponding to the space 21 (see FIG. 2). The first contact 22 is a through hole, into which a terminal portion 52 of a metal member is inserted, and is electrically connected by solder or the like.
[0015]
The electronic component unit 3 has an electrode 31 on one surface thereof, is housed in a space in the board, and is mounted on a metal member partially embedded in the shell of the connector. The electrode 31 is electrically connected to the electrode portion 51 of the metal member by an adhesive means such as solder or a conductive adhesive, an external pressing means, or the like.
[0016]
The connector 4 is a composite connector, and includes a shell 41, a first connector portion 6, and a second connector portion 7 (see FIG. 3).
[0017]
The shell 41 is a box-shaped shell formed of an insulator such as a resin, and has an opening 42 on one surface thereof, a hollow inside, and a first connector portion 6 on a surface opposite to the opening. And a first hole 43 and a second hole 44 for mounting the second connector part 7, respectively, and a recess 45 for embedding part of the metal member 5 in a nested manner on the mounting surface with the substrate 2. A first contact 61 and a second contact 71 are disposed in the cavity of the shell 41, and a first lead terminal 62 and a second lead terminal 72 are provided from the first hole 43 and the second hole 44 of the shell, respectively. Extends outside.
[0018]
The first connector portion 6 includes a first contact 61 and a first lead terminal 62. The first contact 61 is arranged between two second contacts 71 in the shell, and has an array plate 63 made of an insulator having grooves on the upper and lower surfaces, and a contact portion 64 arranged in the grooves. The first lead terminal 62 is connected through the first hole 43 of the shell. The first lead terminal 62 is electrically connected to a corresponding contact in the second contact 23 of the substrate by solder or the like, and is connected to the first contact 61 through the first hole 43 of the shell.
[0019]
The second connector portion 7 includes a second contact 71 and a second lead terminal 72. The second contact 71 exists on both sides of the first contact 61 in the shell at a predetermined interval, and has a cylindrical insulator 73 formed of an insulating material and an outer surface made of a conductive material covering its outer peripheral surface. It has a contact portion 74 and an internal contact portion 75 made of a conductive material that covers the inner peripheral surface of the insulator, and is connected to the second lead terminal 72 through the second hole 44 of the shell. The second lead terminal 72 is electrically connected to a corresponding contact in the second contact 23 of the substrate by solder or the like, and is connected to the second contact 43 through the second hole 44 of the shell.
[0020]
The metal member 5 includes an electrode part 51 that mounts the electronic component unit 3 and is electrically connected to the electrode 31 of the electronic component unit, and a terminal part 52 that extends from the electrode part. It is partially embedded in the recess 45 of the surface (see FIG. 3). The terminal portion 52 is inserted into a through hole that is the first contact 52 of the substrate, and is electrically connected by solder or the like.
[0021]
The assembly of the electronic device will be described. First, the connector 4 is mounted so as to block one side of the void 21 of the board. At this time, the first lead terminal 62 of the connector, the second lead terminal 72, and the terminal portion 52 of the metal member embedded in the connector are respectively aligned with the corresponding contacts 22 and 23 on the board, and solder or the like is used. Connecting. At this stage, the electrode part 51 of a metal member partially embedded in the connector is exposed on the opposite side of the board space 21 from the connector mounting surface. Next, the electronic component unit 3 is inserted from the side opposite to the connector mounting surface of the board space 21 and accommodated in the board space 21. Next, the connector 4 and the electronic component unit 3 are pressed and mounted so as to sandwich the connector 4 and the electronic component unit 3 from outside the connector 4 and the electronic component unit 3 using a mold such as a housing. Thereby, the electrode part 51 of the metal member partially embedded in the connector and the electrode 31 of the electronic component unit come into contact with each other and are electrically connected.
[0022]
By mounting as described above, the electronic component unit is supplied with electric power from the first contact of the substrate to the terminal portion of the metal member, and supplied with electric power from the electrode portion of the metal member to the electrode of the electronic component unit. ,Operate.
[0023]
Next, Embodiment 2 of the present invention will be described with reference to the drawings. 4A and 4B show an electronic apparatus according to Embodiment 2 of the present invention, in which FIG. 4A is an exploded perspective view and FIG. 4B is a cross-sectional view taken along YY ′ during assembly. 5A and 5B are components of the board and the connector of the electronic device according to the second embodiment of the present invention. FIG. 5A is a top perspective view of the board, FIG. 5B is a bottom perspective view of the board, and FIG. (D) is a front perspective view of the shell, and (E) is a rear perspective view of the shell. The electronic device 11 is substantially the same as that of the first embodiment except for electrical connection means of the first contact 24 of the substrate and the terminal portion 54 of the metal member.
[0024]
The terminal portion 54 of the metal member extends from the electrode portion 53, passes through a third hole 86 formed from the concave portion 85 of the shell to the surface opposite to the opening portion 82, and is a land that is the first contact 24 of the substrate. Electrically connected with solder etc.
[0025]
Thus, without providing a through hole in the substrate, the electronic component unit is supplied with electric power from the first contact point of the substrate to the terminal portion of the metal member, and supplied with electric power from the electrode portion of the metal member to the electrode of the electronic component unit. By operating.
[0026]
Next, Embodiment 3 of the present invention will be described with reference to the drawings. 6A and 6B show an electronic device according to Embodiment 3 of the present invention, in which FIG. 6A is an exploded perspective view, and FIG. 6B is a cross-sectional view taken along the line ZZ ′ during assembly. The electronic device 12 is characterized in that a connector is housed and fitted in a space of the board, and includes a board 2, an electronic component unit 3, a connector 9, and a metal member 5. 7A and 7B are components of the board and connector of the electronic device according to the third embodiment of the present invention. FIG. 7A is a top perspective view of the board, FIG. 7B is a bottom perspective view of the board, and FIG. (D) is a front perspective view of the shell, and (E) is a rear perspective view of the shell.
[0027]
The board 2 includes a space 27 for housing and fitting the connector, a first contact 28 electrically connected to the terminal portion of the metal member, and a second contact electrically connected to the lead terminal of the second electronic component. 29. The first contact 28 is a land and is electrically connected to the terminal portion of the metal member by solder or the like.
[0028]
The electronic component unit 3 has an electrode 31 on one surface thereof, and is mounted on a metal member 5 disposed on a connector shell 91. The electrode 31 is electrically connected to the electrode portion 55 of the metal member by an adhesive means such as solder or conductive adhesive, a pressing means from the outside, or the like.
[0029]
The connector 9 is a composite connector and includes a shell 91, a first connector portion 6, and a second connector portion 7.
[0030]
The shell 91 is a box-shaped shell formed of an insulator such as a resin, and has an opening 92 on one surface thereof, a hollow inside, and the first connector portion 6 on the surface opposite to the opening. And a first hole 93 and a second hole 94 for mounting the second connector portion 7, respectively, and a sliding groove 96 for sliding and attaching the end portion of the void in the board on both sides of the side surface. A first contact 61 and a second contact 71 are provided in the cavity of the shell 91, and the first lead terminal 62 and the second lead terminal 72 extend outward from the first hole 93 and the second hole 94 of the shell. A metal member is attached to one surface of the shell.
[0031]
The first connector portion 6 includes a first contact 61 and a first lead terminal 62. The first contact 61 exists between two second contacts 71 in the shell, and includes an array plate 63 made of an insulator having grooves on the upper and lower surfaces, and a contact portion 64 disposed in the grooves. Then, the first lead terminal 62 is connected through the first hole 93 of the shell. The first lead terminal 62 is electrically connected to a corresponding contact in the second contact 29 of the substrate by solder or the like, and is connected to the first contact 42 through the first hole 43 of the shell (FIG. 3D). reference).
[0032]
The second connector portion 7 includes a second contact 71 and a second lead terminal 72. The second contact 71 exists on both sides of the first contact 61 in the shell at a predetermined interval, and has a cylindrical insulator 73 formed of an insulating material and an outer surface made of a conductive material covering its outer peripheral surface. It has a contact portion 74 and an inner contact portion 75 made of a conductive material that covers the inner peripheral surface of the insulator, and is connected to the second lead terminal 72 through the second hole 94 of the shell. The second lead terminal 72 is electrically connected to the corresponding contact in the second contact 29 of the substrate by solder or the like, and is connected to the second contact 71 through the second hole 94 of the shell (FIG. 3E). reference).
[0033]
The metal member 5 includes an electrode portion 55 that mounts the electronic component unit 3 and is electrically connected to the electrode 31 of the electronic component unit, and a terminal portion 56 that extends from the electrode portion. Mounted on the surface of. The terminal portion 56 is electrically connected to a land that is the first contact 28 of the substrate by solder or the like.
[0034]
The assembly of the electronic device will be described. First, the connector 9 is mounted by pushing the end portion of the void 27 of the board into the sliding groove 96 of the connector. At this time, the first lead terminal 62 and the second lead terminal 72 of the connector are respectively connected to the second contact 29 on the corresponding substrate and connected by solder or the like. Next, the electrode part 55 of a metal member is bonded to the connector shell 91, and the terminal part 56 is connected to the first contact 28 of the substrate and connected with solder or the like. Next, the electronic component unit 3 is connected to the metal member 5 with solder or the like. Next, the connector 9 and the electronic component unit 3 are pressed and mounted so as to sandwich the connector 9 and the electronic component unit 3 from the outside of the connector 9 and the electronic component unit 3 using a mold such as a housing.
[0035]
By mounting as described above, the electronic component unit is supplied with electric power from the first contact of the substrate to the terminal portion of the metal member, and supplied with electric power from the electrode portion of the metal member to the electrode of the electronic component unit. ,Operate.
[0036]
【The invention's effect】
According to the present invention, by providing a metal member on the outer peripheral surface portion of the shell of the connector, an electronic component unit used in an electric device such as a mobile phone can be connected to the substrate via the connector without being directly connected to the substrate. The land pattern on the substrate can be eliminated, and part of the substrate can be reduced accordingly.
[0037]
In addition, the thickness of the electronic device is reduced by having a metal member on the outer peripheral surface of the connector shell, providing a space in the board on which the connector is mounted, and inserting and storing the electrical component unit from the back of the board. In addition, the weight of the substrate itself can be reduced by providing the void.
[0038]
In addition, the thickness of the electronic device can be reduced by having a metal member on the outer peripheral surface of the shell of the connector, providing a space in the substrate for housing and fitting the connector, and mounting the electronic component unit on the metal member. In addition, the weight of the substrate itself can be reduced by providing the void.
[0039]
Further, as electronic devices are made thinner, electronic devices for mounting them can be reduced in size.
[Brief description of the drawings]
FIG. 1 is an electronic device according to a first embodiment of the invention, (A) is an exploded perspective view, and (B) is a cross-sectional view taken along the line XX ′ during assembly.
2A and 2B are substrates of an electronic device according to Embodiment 1 of the present invention, in which FIG. 2A is a top perspective view and FIG. 2B is a bottom perspective view.
3A and 3B are component parts of a connector of an electronic device according to Embodiment 1 of the present invention, in which FIG. 3A is a perspective view of a metal member, FIG. 3B is a front perspective view of a shell, and FIG. (D) is a perspective view of the first contact, (E) is a perspective view of the second contact.
4A is an exploded perspective view of an electronic apparatus according to Embodiment 2 of the present invention, and FIG. 4B is a cross-sectional view taken along line YY ′ during assembly.
5A and 5B are component parts of a board and a connector of an electronic device according to Embodiment 2 of the present invention, wherein FIG. 5A is a top perspective view of the board, FIG. 5B is a bottom perspective view of the board, and FIG. (D) is a front perspective view of the shell, and (E) is a rear perspective view of the shell.
6A is an exploded perspective view of an electronic apparatus according to Embodiment 3 of the present invention, and FIG. 6B is a cross-sectional view taken along the line ZZ ′ during assembly.
7A and 7B are component parts of a board and a connector of an electronic device according to Embodiment 3 of the present invention, FIG. 7A is a top perspective view of the board, FIG. 7B is a bottom perspective view of the board, and FIG. (D) is a front perspective view of the shell, and (E) is a rear perspective view of the shell.
8A and 8B are exploded perspective views of an electronic device according to a conventional example, FIG. 8A is an exploded perspective view, and FIG. 8B is a cross-sectional view taken along WW ′ during assembly.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 11, 12 Electronic device 2 Board | substrate 3 Electronic component unit 4, 8, 9 Connector 5 Metal member 6 1st connector part 7 2nd connector part 21,24,27 Space 22,25,28 1st contact 23,26 , 29 Second contact 31 Electrode 41, 81, 91 Shell 42, 82, 92 Opening 43, 83, 93 First hole 44, 84, 94 Second hole 45, 85, 95 Recess 51, 53, 55 Electrode 52 , 54, 56 Terminal part 61 First contact 62 First lead terminal 63 Array plate 64 Contact part 71 Second contact 72 Second lead terminal 73 Insulator 74 External contact part 75 Internal contact part 86 Third hole 96 Sliding groove DESCRIPTION OF SYMBOLS 101 Electronic device 102 Board | substrate 103 Electronic component 104 Connector 105 Electrode 106 First connector part 107 Second connector part 108, 109 Contact 110 Lee Terminal

Claims (7)

電極を有する第一電子部品と、
前記第一電子部品を実装するとともに前記電極と電気的に接続する電極部と、前記電極部から延在する端子部と、を有する金属部材と、
本体から延在するリード端子と、本体の全体ないし一部を覆う絶縁殻と、を有するとともに、前記絶縁殻に前記金属部材の一部を入れ子式に埋め込む第二電子部品と、
前記第一電子部品を収納する空所と、前記金属部材の端子部と電気的に接続する第一接点と、前記第二電子部品のリード端子と電気的に接続する第二接点と、を有するとともに、前記空所と対応する板面上に前記第二電子部品を実装する基板と、を備えることを特徴とする電子装置。
A first electronic component having an electrode;
A metal member having an electrode part for mounting the first electronic component and electrically connecting to the electrode; and a terminal part extending from the electrode part;
A second electronic component having a lead terminal extending from the main body, an insulating shell covering the whole or a part of the main body, and a part of the metal member embedded in the insulating shell in a nested manner;
A space for housing the first electronic component; a first contact electrically connected to a terminal portion of the metal member; and a second contact electrically connected to a lead terminal of the second electronic component. An electronic device comprising: a substrate on which the second electronic component is mounted on a plate surface corresponding to the void.
電極を有する第一電子部品と、
前記第一電子部品を実装するとともに前記電極と電気的に接続する電極部と、前記電極部から延在する端子部と、を有する金属部材と、
本体から延在するリード端子と、本体の全体ないし一部を覆う絶縁殻と、を有するとともに、前記絶縁殻上に前記金属部材を配設する第二電子部品と、
前記第二電子部品を収納し嵌合する空所と、前記金属部材の端子部と電気的に接続する第一接点と、前記第二電子部品のリード端子と電気的に接続する第二接点と、を有する基板と、を備えることを特徴とする電子装置。
A first electronic component having an electrode;
A metal member having an electrode part for mounting the first electronic component and electrically connecting to the electrode; and a terminal part extending from the electrode part;
A second electronic component having a lead terminal extending from the main body and an insulating shell covering the whole or a part of the main body and disposing the metal member on the insulating shell;
A space for accommodating and fitting the second electronic component; a first contact electrically connected to a terminal portion of the metal member; and a second contact electrically connected to a lead terminal of the second electronic component; And an electronic device.
前記第一接点は、スルーホールであり、
前記金属部材の端子部は、前記スルーホールに挿入される、ことを特徴とする請求項1又は2記載の電子装置。
The first contact is a through hole,
The electronic device according to claim 1, wherein the terminal portion of the metal member is inserted into the through hole.
前記第二電子部品は、複数の接触端子が平面上で平行に配列されている第一コタクトと、同軸型コンタクトからなる第二コンタクトと、を有する複合コネクタであり、
前記電子装置は、携帯電話機に実装される、ことを特徴とする請求項1乃至3のいずれか一に記載の電子装置。
The second electronic component is a composite connector having a first co emissions tact plurality of contact terminals are arranged parallel to on the plane, and a second contact comprising a coaxial contact, a,
The electronic device according to claim 1, wherein the electronic device is mounted on a mobile phone.
前記第二電子部品は、外部との接続コネクタであることを特徴とする請求項1乃至3のいずれか一に記載の電子装置。The electronic device according to claim 1, wherein the second electronic component is a connection connector with the outside. 前記第一電子部品と前記金属部材との電気的接続を押圧手段により行う請求項1乃至5のいずれか一に記載の電子装置。The electronic device according to claim 1, wherein the first electronic component and the metal member are electrically connected by a pressing unit. 前記第一電子部品と前記金属部材との電気的接続を接着手段により行う請求項1乃至のいずれか一に記載の電子装置。Electronic device according to any one of claims 1 to 5 carried out by adhesive means an electrical connection between the metallic member and the first electronic component.
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JP4591385B2 (en) * 2006-03-01 2010-12-01 株式会社デンソー Connector mounting structure and electronic device

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JPS61144669U (en) * 1985-02-27 1986-09-06
JPH0696815A (en) * 1992-09-11 1994-04-08 Fujitsu Ltd Connector
JPH08180915A (en) * 1994-12-26 1996-07-12 Hosiden Corp Modulator jack

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