JP3663311B2

JP3663311B2 - Soaking equipment

Info

Publication number: JP3663311B2
Application number: JP2142899A
Authority: JP
Inventors: 真二宮崎; 久明山蔭; 功夫好永
Original assignee: Toshiba Mitsubishi Electric Industrial Systems Corp
Current assignee: Toshiba Mitsubishi Electric Industrial Systems Corp
Priority date: 1999-01-29
Filing date: 1999-01-29
Publication date: 2005-06-22
Anticipated expiration: 2019-01-29
Also published as: JP2000218516A

Description

【０００１】
【発明の属する技術分野】
この発明は、例えば樹脂成型品、半導体ウエハ、液晶パネル等の被加工物を加工される定盤上で均一に加熱あるいは冷却する均熱装置に関するものである。
【０００２】
【従来の技術】
従来の均熱装置としては、図示はしないが例えば特開平６−２７８１３９号公報に示されるように、定盤の内部に加工された穴にヒータおよび冷却管をそれぞれ挿入し、ヒータに通電および冷却管に冷却水を流通させることにより、定盤を直接加熱、冷却するもの、又、図１２に示すように、定盤１の下面に平板状の発熱体２を配置して、定盤１を均一に加熱することにより、定盤１上に載置された複数の被加工物３をそれぞれ加熱処理するもの等がある。
【０００３】
【発明が解決しようとする課題】
従来の均熱装置は以上のように構成され、図１２に示すものは平板状の発熱体２で定盤１の全面を同時に加熱することによって、温度分布の不均一を改善しようとするものであるが、平板状の発熱体２はヒータ配線を絶縁物で被覆したものであり、外形寸法精度に限界があるので、定盤１へ取り付ける際、全面にわたって定盤１と接触させることは困難であり、定盤１の表面の温度分布の均一性には限界があるため、厳しい温度分布精度を要求される被加工物３への適用は無理であり、又、仮に全体が均一に加熱されたとしても、定盤１の周辺部は中心部に比べて放熱が大きく、図１３に示すように定盤１の周辺部で温度が低下するため、温度むらによる反りが発生して被加工物３が全面で均一に加熱されず、加工精度が低下する等の課題があった。
【０００４】
この発明は上記のような課題を解決するためになされたもので、熱源の熱が定盤の表面に均等に供給され、定盤の表面温度を均一に保持することにより、厳しい温度分布を要求される被加工物への適用、および加工精度の向上を図ることが可能な均熱装置を提供することを目的とするものである。
【０００５】
【課題を解決するための手段】
この発明の請求項１に係る均熱装置は、溝が複数形成された第１の板状部材とこの第１の板状部材に形成された溝を覆うように第１の板状部材に接合された第２の板状部材とにより、内部に所定量の作動液が充填される密閉された複数の流通路が形成され、上面に被加工物が載置される定盤と、被加工物を定盤の下面から加熱または冷却する平面状の熱源とを設けたものである。
【０００６】
又、この発明の請求項２に係る均熱装置は、請求項１において、定盤と平面状の熱源との間に伝熱性部材を装着したものである。
【０００７】
又、この発明の請求項３に係る均熱装置は、請求項１において、定盤の外周縁部に設けられたフランジ体と、フランジ体に係合され、平面状の熱源を定盤との間で挟持する押え部材とを設けたものである。
【０００８】
又、この発明の請求項４に係る均熱装置は、請求項１において、定盤の外周縁部に設けられた傾斜部を有するフランジ体と、平面状の熱源を定盤に接触させる押え部材と、一方側が枢点となり、他方側が締付部となるとともに一方側を枢点として開閉し、フランジ体の傾斜部と係合する傾斜部を有し、フランジ体の傾斜部と押え部材とに係合し、締付部を締め付けることによって、平面状の熱源を定盤と押え部材との間で挟持させる取付具とを設けたものである。
【０００９】
又、この発明の請求項５に係る均熱装置は、請求項３又は請求項４において、平面状の熱源をあらかじめお椀状に形成し、定盤と押え部材との間で挟持させるものである。
【００１０】
又、この発明の請求項６に係る均熱装置は、請求項１において、平面状の熱源を複数に分割したものである。
【００１１】
又、この発明の請求項７に係る均熱装置は、請求項６において、複数に分割された平面状の熱源に対応して第１の板状部材と第２の板状部材との間に形成された流通路も複数に分割したものである。
【００１２】
【発明の実施の形態】
実施の形態１．
図１はこの発明の実施の形態１における均熱装置の構成を示す平面図、図２は図１における断面を示す側断面図である。
図において、４は定盤であり、例えば下面に同心状に配置される複数の溝６が形成された第１の板状部材５とこの第１の板状部材５の溝６部を覆うよう第１の板状部材５に接合された第２の板状部材７とで構成されており、定盤４の上面には複数の被加工物３が載置される。８は第１の板状部材５と第２の板状部材７との間の環状の溝６で形成される複数の流通路であり、各内部にはそれぞれ真空排気された後、所定の量の作動液９が充填されて、定盤４が均熱板として形成される。１０は定盤４の下面に配置された例えばヒータ等の加熱源である平面状の発熱体である。
【００１３】
上記のように構成された実施の形態１における均熱装置において、定盤１の下面から、平面状の発熱体１０により加熱されると、各流通路８内の作動液９も加熱され、蒸気となって密閉された流通路８内にある空間に拡散し、この蒸気は流通路８内の温度の低い定盤４の上面側で凝縮潜熱として熱を放出し液化する。そして、この液化した作動液９は流通路８の内部で定盤４の下面側に重力により落下して還流し、この動作が順次繰り返されることにより、加熱源である平面状の発熱体１０から定盤４の上面に熱輸送され、定盤４の上面に載置される被加工物３は加熱される。
【００１４】
このように上記実施の形態１によれば、加熱源である平面状の発熱体１０からの熱量を、作動液９の蒸気により流通路８の内部に拡散し、定盤４の上面側で凝縮させることにより定盤４の上面側に熱輸送するようにしているので、定盤４の表面を均一に加熱することができるため、外形寸法精度の悪い平面状のヒータである発熱体１０と定盤４との間に接触の不均一な部分があっても、平面状の発熱体１０の寸法精度にとらわれることなく均一に被加工物３を加熱することができる。また厳しい温度分布を要求される被加工物への適用、および加工精度の向上を図ることが可能な均熱装置を得ることができる。
【００１５】
実施の形態２．
上述した図１および図２に示す実施の形態１の構成では、定盤４と平面状の発熱体１０とが直接接触で伝熱される場合を示しているが、この発明の実施の形態２においては、図３に示すように、定盤４と平面状の発熱体１０との間に例えば伝熱性の高い接着剤若しくはグリースなど高伝熱性材料から成る伝熱性部材１１を装着して接触させても良く、発熱体１０の寸法精度等により接触状態の不均一が起こりにくくなり、定盤４の均熱性が更に向上でき、また伝熱性も高くなるため発熱体１０からの発熱量を小さくすることができる。また、厳しい温度分布を要求される被加工物への適用、および加工精度の向上を図ることが可能であることは勿論、さらに外形寸法精度の悪い発熱体でも適用することができる均熱装置を得ることができる。
【００１６】
実施の形態３．
この発明の実施の形態３を図４および図５に基づいて説明する。これら各図において、４〜１０は上述した実施の形態１の構成と同様である。１２は定盤４の外周縁部に設けられたフランジ体、１３はこのフランジ体１２に係合され、平面状の発熱体１０を定盤４との間で挟持する押え部材、１４はこの押え部材１３とフランジ体１２とを締め付け固定する固定ボルトである。このように、固定ボルト１４を締め付け固定することにより、押え部材１３によつて発熱体１０が定盤４に押さえつけられ、発熱体１０と定盤４との接触状態の密着性が向上でき、更に発熱体１０を定盤４にしっかりと固定することができる。すなわち発熱体１０からの熱を定盤４に効率よく伝えることができ、より高い均熱性を有する均熱装置を得ることができる。なお、定盤４と発熱体１０との間は高伝熱性材料が介していてもよいことは言うまでもない。
【００１７】
実施の形態４．
この発明の実施の形態４を図６および図７に基づいて説明する。これら各図において、４〜１０は上述した実施の形態１の構成と同様である。１５は定盤４の外周縁部に設けられた傾斜部を有するフランジ体、１６は平面状の発熱体１０を定盤４に接触させる押え部材、１７はフランジ体１５と押え部材１６とに係合され、一方側１７ａが枢点部を成し、他方側１７ｂが締付部を成し一方側１７ａを枢点として開閉し、他方側１７ｂを締付ボルト１８により閉状態に保持させて、平面状の発熱体１０を定盤４と押え部材１６とで挟持させる取付具である。
このように、平面状の熱源１０を定盤４に固定する際に取付具１７の他方側１７ｂの１カ所だけを締めつけることで固定することができ、また取付具１７にも定盤１に設けられたフランジ体１５と同様の傾斜部が設けられているため、他方側１７ｂの１カ所を締め付けていくだけで定盤４と平面状の発熱体１０との密着性を向上させることができる。すなわち組立性を改善させることができるとともに、より高い均熱性を有する均熱装置を得ることができる。なお、定盤４と発熱体１０との間は高伝熱性材料が介していてもよいことは言うまでもない。
【００１８】
実施の形態５．
この発明の実施の形態５を図８に基づいて説明する。図８において、４〜９、１２、１３は上述した実施の形態３の構成と同様である。１９はあらかじめ中央が高くなるようなお椀状に形成された発熱体であり、上述した実施の形態３あるいは実施の形態４などの固定方法により、お椀状の発熱体１９を押え部材１３と定盤４とで挟持することによって発熱体１９を平面状と成すようにしている。これにより、接触性の比較的低い中央部の密着性を上述した実施の形態３あるいし実施の形態４のものより向上され、発熱体１９から定盤４への伝熱性がより向上され、定盤４の均熱性も更に向上できる。なお、定盤４と発熱体１９との間は高伝熱性材料が介することでさらに均熱性が向上できる。
【００１９】
実施の形態６．
この発明の実施の形態６を図９に基づいて説明する。図９において、４〜９は上述した各実施の形態の構成と同様である。２０および２１は上述した各実施の形態における平面状の発熱体を複数に分割して例えば部分的に発熱量の異なる発熱体であり、定盤４の中央側に位置する発熱体２０と、定盤４の外周側に位置する発熱体２１としたものである。これにより定盤４の面内の温度分布をある程度コントロールすることができるため、たとえば放熱の影響で定盤４の外周側の温度が低い場合、外周側の発熱体２１の発熱量を増加させることで定盤４の外周側の温度低下を補うことができので、定盤４を均熱に保持することができ、信頼性に優れた均熱装置を得ることができる。
【００２０】
実施の形態７．
この発明の実施の形態７を図１０および図１１に基づいて説明する。これら各図において、４〜７、９、２０、２１は上述した実施の形態６の構成と同様である。２２および２３は複数に分割された発熱体２０および２１にそれぞれ対応して複数に分割された流通路であり、すなわち定盤４の中央側に位置する発熱体２０に対応して流通路２２を設け、定盤４の外周側に位置する発熱体２１に対応して流通路２３を流通路２２と分離して設けたことにより、定盤４の面内の温度分布を細かくコントロールすることができるため、たとえば放熱の影響で定盤４の外周側の温度が極端に低い場合でも、外周側の発熱体２１の発熱量を増加させ効率よく定盤４の外周側の温度低下を補うことができる。
【００２１】
【発明の効果】
以上のように、この発明の請求項１によれば、溝が複数形成された第１の板状部材とこの第１の板状部材に形成された溝を覆うように第１の板状部材に接合された第２の板状部材とにより、内部に所定量の作動液が充填される密閉された複数の流通路が形成され、上面に被加工物が載置される定盤と、被加工物を定盤の下面から加熱または冷却する平面状の熱源とを設けたことにより、被加工物の加工精度の向上を図ることができる。
【００２２】
又、この発明の請求項２によれば、請求項１において、定盤と平面状の熱源との間に伝熱性部材を装着したことにより、さらに被加工物の加工精度の向上を図ることができる。
【００２３】
又、この発明の請求項３によれば、請求項１において、定盤の外周縁部に設けられたフランジ体と、フランジ体に係合され、平面状の熱源を定盤との間で挟持する押え部材とを設けたことにより、発熱体からの熱を定盤に効率よく伝えることができ、より高い均熱性を有する均熱装置を得ることができる。
【００２４】
又、この発明の請求項４によれば、請求項１において、定盤の外周縁部に設けられた傾斜部を有するフランジ体と、平面状の熱源を定盤に接触させる押え部材と、一方側が枢点となり、他方側が締付部となるとともに一方側を枢点として開閉し、フランジ体の傾斜部と係合する傾斜部を有し、フランジ体の傾斜部と押え部材とに係合し、締付部を締め付けることによって、平面状の熱源を定盤と押え部材との間で挟持させる取付具とを設けたことにより、組立性を改善させることができるとともに、より高い均熱性を有する均熱装置を得ることができる。
【００２５】
又、この発明の請求項５によれば、請求項３または請求項４において、平面状の熱源をあらかじめお椀状に形成し、定盤と押え部材との間で挟持させることにより、定盤と発熱体との中央付近の密着性をより向上させることができ、発熱体からの熱を定盤に効率よく伝えることができ、より高い均熱性を有する均熱装置を得ることができる。
【００２６】
又、この発明の請求項６によれば、請求項１において、平面状の熱源を複数に分割したことにより、発熱量によるある程度の温度分布のコントロールができるためより高い均熱性を有する均熱装置を得ることができる。
【００２７】
又、この発明の請求項７によれば、請求項６において、複数に分割された平面状の熱源に対応して第１の板状部材と第２の板状部材との間に形成された流通路も複数に分割したことにより、発熱量による細かな温度分布のコントロールができるため、より高い均熱性を有する均熱装置を得ることができる。
【図面の簡単な説明】
【図１】この発明の実施の形態１を示す平面図である。
【図２】この発明の実施の形態１を示す断面図である。
【図３】この発明の実施の形態２を示す断面図である。
【図４】この発明の実施の形態３を示す平面図である。
【図５】この発明の実施の形態３を示す断面図である。
【図６】この発明の実施の形態４を示す平面図である。
【図７】この発明の実施の形態４を示す断面図である。
【図８】この発明の実施の形態５を示す断面図である。
【図９】この発明の実施の形態６を示す断面図である。
【図１０】この発明の実施の形態７を示す平面図である。
【図１１】この発明の実施の形態７を示す断面図である。
【図１２】従来の均熱装置を示す断面図である。
【図１３】従来の均熱装置の表面温度分布を示す特性図である。
【符号の説明】
４定盤、５第１の板状部材、６溝、７第２の板状部材、８流通路、
９流通路、１０発熱体、１１伝熱性部材、１２フランジ体、
１３押え部材、１５フランジ体、１６押え部材、１７取付具、
１９発熱体、２０発熱体、２１発熱体、２２流通路、２３流通路。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat equalizing apparatus that uniformly heats or cools a workpiece such as a resin molded product, a semiconductor wafer, a liquid crystal panel or the like on a surface plate to be processed.
[0002]
[Prior art]
As a conventional heat equalizing device, although not shown, for example, as disclosed in Japanese Patent Laid-Open No. 6-278139, a heater and a cooling pipe are respectively inserted into holes processed in the surface plate, and the heater is energized and cooled. The surface plate 1 is directly heated and cooled by circulating cooling water through the pipe, or, as shown in FIG. There exist some which heat-process the some to-be-processed object 3 mounted on the surface plate 1 by heating uniformly.
[0003]
[Problems to be solved by the invention]
The conventional heat equalizing apparatus is configured as described above, and the one shown in FIG. 12 is intended to improve uneven temperature distribution by simultaneously heating the entire surface of the surface plate 1 with a flat heating element 2. However, since the plate-like heating element 2 is formed by coating the heater wiring with an insulator and there is a limit to the external dimension accuracy, it is difficult to contact the surface plate 1 over the entire surface when attaching to the surface plate 1. In addition, since the uniformity of the temperature distribution on the surface of the surface plate 1 is limited, it cannot be applied to the workpiece 3 that requires strict temperature distribution accuracy, and the whole is heated uniformly. Even so, the peripheral part of the surface plate 1 has larger heat dissipation than the central part, and the temperature decreases in the peripheral part of the surface plate 1 as shown in FIG. Are not heated evenly over the entire surface, causing problems such as reduced processing accuracy. Was Tsu.
[0004]
The present invention has been made to solve the above-described problems. The heat of the heat source is evenly supplied to the surface of the surface plate, and the surface temperature of the surface plate is kept uniform, thereby requiring a strict temperature distribution. An object of the present invention is to provide a soaking device capable of being applied to a workpiece to be processed and improving processing accuracy.
[0005]
[Means for Solving the Problems]
The heat equalizing apparatus according to claim 1 of the present invention is joined to the first plate-like member so as to cover the first plate-like member having a plurality of grooves formed thereon and the grooves formed in the first plate-like member. the second plate-shaped member that is, a plurality of flow passages predetermined amount of hydraulic fluid is sealed is filled therein is formed, and a surface plate workpiece is placed on the upper surface, the workpiece And a planar heat source that heats or cools the plate from the lower surface of the surface plate.
[0006]
According to a second aspect of the present invention, there is provided a heat equalizing apparatus according to the first aspect, wherein a heat transfer member is mounted between the surface plate and the planar heat source.
[0007]
According to a third aspect of the present invention, there is provided a heat equalizing device according to the first aspect of the present invention, wherein the flange body provided on the outer peripheral edge of the surface plate is engaged with the flange body, and a planar heat source is connected to the surface plate. And a pressing member sandwiched between them.
[0008]
According to a fourth aspect of the present invention, there is provided a heat equalizing apparatus according to the first aspect, wherein the flange member having an inclined portion provided on the outer peripheral edge portion of the surface plate and a press member for bringing a flat heat source into contact with the surface plate. If, now one side is the pivot point, the other side is opened and closed as pivot point on one side with a part tightening has an inclined portion that engages with the inclined portion of the flange body, the inclined portion and the pressing member of the flange body And a fixture that clamps the flat heat source between the surface plate and the pressing member by tightening the tightening portion .
[0009]
According to a fifth aspect of the present invention, there is provided the heat equalizing device according to the third or fourth aspect, wherein the planar heat source is formed in a bowl shape in advance and is sandwiched between the surface plate and the pressing member. .
[0010]
According to a sixth aspect of the present invention, in the first aspect, the flat heat source is divided into a plurality of parts.
[0011]
According to a seventh aspect of the present invention, there is provided a heat equalizing apparatus according to the sixth aspect, wherein the flat plate is divided between the first plate-like member and the second plate-like member corresponding to the planar heat source divided into a plurality of pieces. The formed flow path is also divided into a plurality of parts.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
1 is a plan view showing a configuration of a heat equalizing apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a side sectional view showing a section in FIG.
In the figure, reference numeral 4 denotes a surface plate, which covers, for example, the first plate member 5 in which a plurality of grooves 6 arranged concentrically on the lower surface and the groove 6 portion of the first plate member 5 are covered. The second plate member 7 is joined to the first plate member 5, and a plurality of workpieces 3 are placed on the upper surface of the surface plate 4. Reference numeral 8 denotes a plurality of flow passages formed by an annular groove 6 between the first plate-like member 5 and the second plate-like member 7. Each of the flow passages is evacuated to a predetermined amount after being evacuated. The working liquid 9 is filled, and the surface plate 4 is formed as a soaking plate. Reference numeral 10 denotes a planar heating element that is a heating source such as a heater disposed on the lower surface of the surface plate 4.
[0013]
In the heat equalizing apparatus according to the first embodiment configured as described above, when heated by the planar heating element 10 from the lower surface of the surface plate 1, the hydraulic fluid 9 in each flow passage 8 is also heated, and the steam The steam diffuses into a space in the sealed flow passage 8, and this vapor releases heat as condensed latent heat on the upper surface side of the surface plate 4 having a low temperature in the flow passage 8 and liquefies. Then, the liquefied hydraulic fluid 9 falls by gravity to the lower surface side of the surface plate 4 inside the flow path 8 and is refluxed, and this operation is sequentially repeated, so that the planar heating element 10 serving as a heating source The workpiece 3 that is heat transported to the upper surface of the surface plate 4 and placed on the upper surface of the surface plate 4 is heated.
[0014]
As described above, according to the first embodiment, the amount of heat from the flat heating element 10 serving as the heating source is diffused into the flow path 8 by the vapor of the hydraulic fluid 9 and condensed on the upper surface side of the surface plate 4. Since heat transfer is performed to the upper surface side of the surface plate 4 by heating, the surface of the surface plate 4 can be uniformly heated. Even if there is a non-uniform contact portion with the board 4, the workpiece 3 can be heated uniformly without being limited by the dimensional accuracy of the planar heating element 10. Further, it is possible to obtain a heat equalizing apparatus that can be applied to a workpiece that requires a strict temperature distribution and that can improve machining accuracy.
[0015]
Embodiment 2. FIG.
In the configuration of the first embodiment shown in FIG. 1 and FIG. 2 described above, a case where the surface plate 4 and the planar heating element 10 are transferred by direct contact is shown, but in the second embodiment of the present invention, As shown in FIG. 3, a heat transfer member 11 made of a high heat transfer material such as a highly heat transfer adhesive or grease is attached between the surface plate 4 and the flat heating element 10 and brought into contact therewith. The contact state is less likely to be uneven due to the dimensional accuracy of the heating element 10, the heat uniformity of the surface plate 4 can be further improved, and the heat transfer is also increased, so the amount of heat generated from the heating element 10 can be reduced. Can do. In addition, it is possible to apply to a workpiece that requires a strict temperature distribution and to improve machining accuracy. Can be obtained.
[0016]
Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIGS. In these drawings, 4 to 10 are the same as the configuration of the first embodiment described above. 12 is a flange body provided on the outer peripheral edge of the surface plate 4, 13 is a presser member that is engaged with the flange body 12 and clamps the flat heating element 10 between the surface plate 4, and 14 is the presser It is a fixing bolt that fastens and fixes the member 13 and the flange body 12. Thus, by fixing and fixing the fixing bolt 14, the heating element 10 is pressed against the surface plate 4 by the pressing member 13, and the adhesion of the heating element 10 and the surface plate 4 can be improved. The heating element 10 can be firmly fixed to the surface plate 4. That is, the heat from the heating element 10 can be efficiently transmitted to the surface plate 4, and a heat equalizing device having higher heat equalization properties can be obtained. Needless to say, a highly heat-conductive material may be interposed between the surface plate 4 and the heating element 10.
[0017]
Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIGS. In these drawings, 4 to 10 are the same as the configuration of the first embodiment described above. 15 is a flange body having an inclined portion provided on the outer peripheral edge of the surface plate 4, 16 is a pressing member for bringing the flat heating element 10 into contact with the surface plate 4, and 17 is related to the flange body 15 and the pressing member 16. The one side 17a forms a pivot point, the other side 17b forms a tightening portion, the one side 17a opens and closes as a pivot point, and the other side 17b is held closed by the tightening bolt 18, This is a fixture for holding the flat heating element 10 between the surface plate 4 and the pressing member 16.
In this way, when the flat heat source 10 is fixed to the surface plate 4, it can be fixed by tightening only one place on the other side 17 b of the attachment 17, and the attachment 17 is also provided on the surface plate 1. Since the inclined part similar to the flange body 15 is provided, it is possible to improve the adhesion between the surface plate 4 and the flat heating element 10 only by tightening one place on the other side 17b. That is, the assembling property can be improved, and a heat equalizing device having higher heat equalizing properties can be obtained. Needless to say, a highly heat-conductive material may be interposed between the surface plate 4 and the heating element 10.
[0018]
Embodiment 5 FIG.
Embodiment 5 of the present invention will be described with reference to FIG. In FIG. 8, 4 to 9, 12, and 13 are the same as the configuration of the third embodiment described above. Reference numeral 19 denotes a heating element formed in a bowl shape whose center is raised in advance, and the bowl-shaped heating element 19 is fixed to the holding member 13 and the surface plate by the fixing method of the third embodiment or the fourth embodiment described above. 4, the heating element 19 is made flat. As a result, the adhesiveness of the central portion having a relatively low contact property is improved as compared with that in the third or fourth embodiment described above, the heat transfer from the heating element 19 to the surface plate 4 is further improved, and The soaking property of the panel 4 can be further improved. It should be noted that the heat uniformity can be further improved by interposing a highly heat-conductive material between the surface plate 4 and the heating element 19.
[0019]
Embodiment 6 FIG.
A sixth embodiment of the present invention will be described with reference to FIG. In FIG. 9, 4-9 are the same as the structure of each embodiment mentioned above. 20 and 21 are divided into a plurality of the planar heating elements in each of the embodiments described above, for example, heating elements that partially differ in calorific value, and the heating elements 20 located on the center side of the surface plate 4 and the fixed heating elements. The heating element 21 is located on the outer peripheral side of the panel 4. As a result, the temperature distribution in the surface of the surface plate 4 can be controlled to some extent. For example, when the temperature on the outer peripheral side of the surface plate 4 is low due to heat dissipation, the amount of heat generated by the heat generating element 21 on the outer peripheral side is increased. Thus, the temperature decrease on the outer peripheral side of the surface plate 4 can be compensated for, so that the surface plate 4 can be kept in a uniform temperature, and a heat equalizing device excellent in reliability can be obtained.
[0020]
Embodiment 7 FIG.
A seventh embodiment of the present invention will be described with reference to FIGS. In these drawings, reference numerals 4 to 7, 9, 20, and 21 are the same as those of the above-described sixth embodiment. 22 and 23 are divided into a plurality of flow passages corresponding to the heat generating members 20 and 21 divided into a plurality of portions, that is, the flow passages 22 corresponding to the heat generation members 20 located on the center side of the surface plate 4 are provided. The temperature distribution in the surface of the surface plate 4 can be finely controlled by providing the flow path 23 separately from the flow path 22 corresponding to the heating element 21 located on the outer peripheral side of the surface plate 4. Therefore, for example, even when the temperature on the outer peripheral side of the surface plate 4 is extremely low due to the influence of heat dissipation, the amount of heat generated by the heat generating element 21 on the outer peripheral side can be increased to efficiently compensate for the temperature decrease on the outer peripheral side of the surface plate 4. .
[0021]
【The invention's effect】
As described above, according to the first aspect of the present invention, the first plate-like member so as to cover the first plate-like member formed with a plurality of grooves and the grooves formed in the first plate-like member. And a second plate member joined to each other to form a plurality of sealed flow paths filled with a predetermined amount of hydraulic fluid therein, and a surface plate on which a workpiece is placed on the upper surface , By providing a planar heat source that heats or cools the workpiece from the lower surface of the surface plate , the machining accuracy of the workpiece can be improved.
[0022]
According to the second aspect of the present invention, in the first aspect, by mounting the heat transfer member between the surface plate and the planar heat source, the processing accuracy of the workpiece can be further improved. it can.
[0023]
According to claim 3 of the present invention, in claim 1, a flange body provided on the outer peripheral edge of the surface plate and the flange body are engaged with each other, and a flat heat source is sandwiched between the surface plate. By providing the pressing member, the heat from the heating element can be efficiently transmitted to the surface plate, and a heat equalizing device having higher heat equalization can be obtained.
[0024]
Further, according to a fourth aspect of the present invention, in claim 1, and a flange body having an inclined portion formed on the outer peripheral edge of the surface plate, the pressing member contacting a planar heat source to the base, one One side serves as a pivot point, the other side serves as a tightening portion, and one side serves as a pivot point, and has an inclined portion that engages with the inclined portion of the flange body, and engages with the inclined portion of the flange body and the presser member. In addition, it is possible to improve the assemblability and provide higher heat uniformity by providing a fixture that clamps the flat heat source between the surface plate and the presser member by tightening the tightening portion. It is possible to obtain a soaking device.
[0025]
According to a fifth aspect of the present invention, in the third or fourth aspect, the planar heat source is formed in a bowl shape in advance and is sandwiched between the surface plate and the pressing member. Adhesion in the vicinity of the center with the heating element can be further improved, heat from the heating element can be efficiently transmitted to the surface plate, and a heat equalizing apparatus having higher temperature uniformity can be obtained.
[0026]
According to a sixth aspect of the present invention, in the first aspect, by dividing the planar heat source into a plurality of parts, it is possible to control the temperature distribution to some extent by the amount of heat generated, so that the heat equalizing apparatus having higher temperature uniformity. Can be obtained.
[0027]
According to claim 7 of the present invention, in claim 6, formed between the first plate-like member and the second plate-like member in correspondence with the planar heat source divided into a plurality of parts. Since the flow passage is also divided into a plurality of parts, a fine temperature distribution can be controlled by the amount of heat generated, so that a heat equalizing device having higher heat equalization can be obtained.
[Brief description of the drawings]
FIG. 1 is a plan view showing a first embodiment of the present invention.
FIG. 2 is a sectional view showing Embodiment 1 of the present invention.
FIG. 3 is a cross-sectional view showing a second embodiment of the present invention.
FIG. 4 is a plan view showing Embodiment 3 of the present invention.
FIG. 5 is a sectional view showing Embodiment 3 of the present invention.
FIG. 6 is a plan view showing Embodiment 4 of the present invention.
FIG. 7 is a sectional view showing Embodiment 4 of the present invention.
FIG. 8 is a sectional view showing Embodiment 5 of the present invention.
FIG. 9 is a sectional view showing Embodiment 6 of the present invention.
FIG. 10 is a plan view showing Embodiment 7 of the present invention.
FIG. 11 is a sectional view showing Embodiment 7 of the present invention.
FIG. 12 is a cross-sectional view showing a conventional heat equalizer.
FIG. 13 is a characteristic diagram showing a surface temperature distribution of a conventional heat equalizer.
[Explanation of symbols]
4 surface plate, 5 first plate member, 6 groove, 7 second plate member, 8 flow passage,
9 flow passage, 10 heating element, 11 heat transfer member, 12 flange body,
13 Pressing member, 15 Flange body, 16 Pressing member, 17 Mounting tool,
19 heating element, 20 heating element, 21 heating element, 22 flow path, 23 flow path.

Claims

The second plate-like member having a groove is bonded to the first plate member so as to cover the first plate member and a groove formed in the first plate-like member formed with a plurality of internal a plurality of flow passages predetermined amount of hydraulic fluid is sealed is filled is formed in the heating or cooling a surface plate workpiece is placed on the upper surface, the upper Symbol workpiece from the lower surface of the plate And a flat heat source.

2. The heat equalizing apparatus according to claim 1, wherein a heat transfer member is mounted between the surface plate and the planar heat source.

2. A flange according to claim 1, further comprising: a flange body provided at an outer peripheral edge of the surface plate; and a pressing member that is engaged with the flange body and sandwiches a planar heat source with the surface plate. Soaking device.

In claim 1, the flange body having an inclined portion formed on the outer peripheral edge of the platen and the pressing member contacting a planar heat source to the surface plate, becomes one side is the pivot point, the other side are tightened And has an inclined portion that engages with the inclined portion of the flange body, engages with the inclined portion of the flange body and the pressing member, and tightens the tightening portion. Thus, there is provided a heat equalizing device comprising a fixture for holding the planar heat source between the surface plate and the presser member.

5. The heat equalizing apparatus according to claim 3, wherein the planar heat source is formed in a bowl shape in advance and is sandwiched between the surface plate and the pressing member.

2. The heat equalizing apparatus according to claim 1, wherein the planar heat source is divided into a plurality of parts.

The flow path formed between the first plate-like member and the second plate-like member corresponding to the planar heat source divided into a plurality of parts is also divided into a plurality of parts. Soaking device.