JP3663670B2 - Semiconductor wafer splitting device - Google Patents

Description

[0001]
[Industrial application fields]
The present invention prevents silicon debris from adhering to the formation surface of a functional element when a functional element having a movable part or a protrusion formed on a semiconductor wafer is divided into chips, and a simple method for dividing the functional element. The present invention relates to a semiconductor wafer dividing apparatus which can be easily performed.
[0002]
[Prior art]
In general, a semiconductor wafer dividing apparatus according to the prior art is a half-cutting method in which a semiconductor wafer attached to an adhesive sheet is cut vertically by a dicing cut device, leaving the surface attached to the adhesive sheet as a continuous surface. It is widely known as an apparatus that cuts a semiconductor wafer either by a full cut that vertically cuts the entire thickness of the semiconductor wafer and applies a stress along a dicing line after the dicing cut.
[0003]
For example, in JP-A-3-177705, a semiconductor wafer bonded to a soft adhesive sheet is cut vertically, leaving at least a surface of the semiconductor wafer bonded to the sheet as a continuous surface, and then the soft adhesive sheet and the sheet. The semiconductor wafer cutting method and apparatus are characterized in that a fluid is supplied to a stage to dispose the substrate, the continuous surface is cut, the semiconductor wafer is divided into a plurality of pellets, and the soft adhesive sheet is stretched. Is disclosed.
[0004]
On the other hand, functional elements having movable parts such as transistor-type acceleration sensors and pressure sensors, and functional elements having protrusions having a problem in mechanical strength such as an air bridge structure with multi-layer wiring as the density of semiconductor integrated circuits increases. In the dividing technique, a semiconductor wafer is placed on an adhesive sheet and cut by a dicing cut device.
[0005]
However, when removing silicon chips generated by cutting, the functional elements may be destroyed, and the semiconductor wafer is chipped while flowing a large amount of cutting water for the purpose of improving cutting ability and releasing processing heat. In the method of dividing into two, there is a problem that the functional element is destroyed by the pressure of the cutting water or the surface tension, and the normal operation is not performed.
[0006]
On the other hand, in Japanese Patent Laid-Open No. 2-106947, a resist is embedded in a cavity of a functional element having an air bridge structure, and a dicing cut is performed in a state where a resist as a protective layer is further applied and cured on the air bridge structure. In addition, a technique relating to a “method for manufacturing a semiconductor device” is disclosed in which the resist is removed by ultraviolet irradiation in an ozone atmosphere.
[0007]
[Problems to be solved by the invention]
However, with the technique disclosed in the above Japanese Patent Laid-Open No. 3-177051, the problem that the soft adhesive sheet gives friction resistance to the blade and shortens the life of the blade, and the problem that the pellet peels from the soft adhesive sheet are solved to some extent. However, there is a problem that silicon debris generated at the time of division adheres to the element, and the element is damaged or broken when the silicon debris is removed.
[0008]
Further, in the method disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2-106947, a resist may remain in a region not exposed to ultraviolet rays, and there is no preferred method for completely removing the resist, and a functional element having a movable part However, there is a problem in that the movable part is damaged due to the viscosity of the resist or the rotation (angular velocity) of the spinner at the time of applying the resist, and the functional element does not operate normally.
[0009]
The present invention has been made in view of the above problems, and an object of the present invention is to protect a functional element in an apparatus that divides a semiconductor wafer on which a functional element having a movable part and a protrusion is formed into chips. Easily achieve high yields without going through steps such as resist coating or resist removal by ultraviolet irradiation in an ozone atmosphere, and eliminating defects that impair the function of functional elements due to silicon scraps generated when dividing into chips. An object of the present invention is to provide a semiconductor wafer dividing apparatus for dividing a semiconductor wafer on which functional elements are formed into chips.
[0010]
[Means for Solving the Problems]
To achieve the above object, by the first aspect of the present invention lever, the dividing apparatus of a semiconductor wafer to divide the semiconductor wafer function element is formed with at least the movable portion or the protruding portion into a plurality of chips, After dicing the dicing jig having a shape in which the movable part or the projecting part is not in contact with the semiconductor wafer on which the functional element having the movable part or the projecting part is formed, and dicing the semiconductor wafer mounted on the dicing jig A soft adhesive sheet having an annular body on its periphery for attaching, a concave jig for attaching the soft adhesive sheet to which the semiconductor wafer is attached, and a semiconductor wafer attached to the concave jig are attached. A holding jig for holding the annular body of the soft adhesive sheet, a concave surface of the concave tool jig, and a soft adhesive sheet to which the semiconductor wafer is attached The first exhaust device for sucking space Nasu, in a state where the soft pressure sensitive adhesive sheet is attached, and inverting means for the concave mold surface on which the semiconductor wafer is morning affixed entire jig reverses so that the lower A dome-shaped jig that covers the formation surface of the functional element of the semiconductor ware, and a second exhaust device that exhausts air in a space formed by the dome-shaped jig and the concave-shaped jig. With the reversing means, the surface of the concave jig on which the semiconductor wafer is stuck is turned down, and the soft adhesive sheet is brought into the concave surface of the concave jig by suction of the first exhaust device. Bend along the entire surface of the semiconductor wafer to divide into a plurality of chips by applying uniform stress to the entire surface of the semiconductor wafer, and collect silicon scraps generated by the division by suction of the dome-shaped jig and the second exhaust device. Dividing apparatus of a semiconductor wafer, characterized in Rukoto is provided.
And according to a 2nd aspect, in the said 1st aspect, the inside of the said dome shape jig | tool is exhausted by the said 2nd exhaust apparatus on the mating surface of the said holding jig and the said dome shape jig | tool. An apparatus for dividing a semiconductor wafer is provided, further comprising an air flow passage through which external air is introduced to quickly discharge the silicon scraps when the silicon waste is discharged.
Further, according to the third aspect, in the first or second aspect, the suction force when the air inside the dome-shaped jig is exhausted by the second exhaust device is used as the dead weight of the silicon scrap. There is provided a semiconductor wafer dividing apparatus, further comprising an adjustment valve that adjusts to promote falling.
[0017]
[Action]
That is, in the semiconductor wafer dividing apparatus according to the first aspect of the present invention, after the functional element having the movable portion or the protrusion is mounted on the dicing jig so that the movable portion or the protrusion does not come in contact with the dicing jig. And affixed to a soft adhesive sheet having an annular body at its periphery. The soft adhesive sheet having the semiconductor wafer attached thereto is attached to the concave jig, and the annular body of the soft adhesive sheet to which the semiconductor wafer attached to the concave jig is further attached by the pressing jig. Is retained. Further, a space formed between the concave surface of the concave tool jig and the soft adhesive sheet to which the semiconductor wafer is attached is sucked by the first exhaust device, and the concave adhesive type is attached with the soft adhesive sheet attached by the reversing means. The entire jig is inverted so that the surface to which the semiconductor wafer is bonded is down, the dome-shaped jig is placed on the surface on which the functional element of the semiconductor wear is formed, and the dome-shaped jig is formed by a second exhaust device. And the concave jig are exhausted. In particular, the soft adhesive sheet is sucked into the concave jig by the suction of the first exhaust device in a state where the surface of the concave jig attached with the semiconductor wafer is faced down by the reversing means. Is curved along the concave surface of the semiconductor wafer, and uniform stress is applied to the entire surface of the semiconductor wafer to divide it into a plurality of chips, and silicon dust generated by the division is sucked by the dome-shaped jig and the second exhaust device. Collected.
In the semiconductor wafer dividing apparatus according to the second aspect, in the first aspect, the inside of the dome-shaped jig is arranged on the mating surface of the holding jig and the dome-shaped jig via the air flow passage. When the second exhaust device exhausts the air, external air for promptly discharging the silicon waste is introduced. Therefore, the silicon waste is efficiently and promptly discharged when the inside of the dome-shaped jig is exhausted by the second exhaust device.
Further, according to a third aspect, in the first or second aspect, the suction force when the air inside the dome-shaped jig is exhausted by the second exhaust device by the adjustment valve is the silicon. It is adjusted so as to promote the falling of dead weight. Accordingly, the displacement of the space between the jig concave surface and the soft adhesive sheet is controlled in a well-balanced manner, and the function can be performed without impairing the action of promoting the falling of the silicon scrap by its own weight and the stress relieving action when divided into chips.
[0024]
With this configuration, a conventional resist is applied and cured, and after dicing cut, dicing using a dicing jig is not required, such as removing the resist by ultraviolet irradiation in an ozone atmosphere and dividing it into chips. The semiconductor wafer half-cut by the cutting device is bent using a concave jig and an exhaust device. At this time, the silicon scrap generated by the division is dropped by its own weight, and further, by taking the means for promoting the falling of its own weight, it is possible to easily divide the chip into uniform chips with a high yield without destroying the functional element.
[0025]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
FIGS. 1A to 1D, 2 and 3 are diagrams showing the configuration of a semiconductor wafer dividing apparatus according to the present invention. As shown in FIGS. 1A to 1D, this semiconductor wafer dividing apparatus divides a semiconductor wafer 1 on which a functional element 3 having a movable portion or a protruding portion 2 is formed into a plurality of chips. It is.
[0026]
This apparatus includes a dicing jig 4 having a shape that does not contact the movable portion or the protrusion 2 on which the semiconductor wafer 1 on which the functional element 3 having the movable portion or the protrusion 2 is formed, and a vacuum chuck port 15. A vacuum chuck stage 16, a soft adhesive sheet 6 having an annular body 5 on its periphery for pasting a semiconductor wafer 1 mounted on the dicing jig 4 after dicing with a blade 14, and the semiconductor wafer 1 A concave jig 7 for attaching the attached soft adhesive sheet 6 and a holding jig for holding the annular body 5 of the soft adhesive sheet 6 to which the semiconductor wafer 1 attached to the concave jig 7 is attached. 17, an exhaust device 13 for sucking a space 9 formed by the concave surface 8 of the concave jig 7 and the soft adhesive sheet 6 to which the semiconductor wafer 1 is attached, and the exhaust device 13 An adjustment valve 21 that controls the amount of suction when the space 9 formed by the soft adhesive sheet 6 to which the semiconductor wafer 1 is attached and the concave jig 7 is sucked, and the soft adhesive to which the semiconductor wafer 1 is attached. The seal ring 12 is configured to hermetically seal the space formed by the sheet 6 and the concave jig 7.
[0027]
Further, as shown in FIG. 2, the apparatus includes a dome-shaped jig 11 that covers the surface of the semiconductor wafer 1 where the functional element 3 is formed, and the dome-shaped jig 11 and the concave-shaped jig 7. It further has an exhaust device 13 for accelerating the fall of the silicon scrap 10 generated when the semiconductor wafer 1 is divided by exhausting the air in the space formed. Further, external air is allowed to flow into the mating surface between the concave holding jig 7 and the dome-shaped jig 11, and silicon dust generated when the semiconductor wafer is divided is dropped by its own weight, so that the dome-shaped jig is used. 11 is further provided with an air flow passage 20 for quickly discharging the silicon waste 10 when the exhaust device 19 is exhausted through the exhaust port 18 by the exhaust device 19. Then, the suction force when the air inside the dome-shaped jig 11 is exhausted by the exhaust device 19 is adjusted so as to promote the falling weight of the silicon scrap 10 generated when the semiconductor wafer 1 is divided into chips. The adjusting valve 22 is further provided.
[0028]
Also, as shown in FIG. 3, a circular soft adhesive sheet 6 to which a circular semiconductor wafer 1 having a movable part and a protrusion 3 is attached is mounted on a circular concave jig 7, and its annular shape. The body 5 is fixed by a circular holding jig 17 and a seal ring 12. The exhaust port 18 is disposed on the side surface of the concave jig 7 as shown. It should be noted that the size and shape of the soft adhesive sheet 6 are not limited to those described above as long as the size and shape of the concave jig 7 are formed.
[0029]
Hereinafter, a process of actually dividing a semiconductor wafer by the semiconductor wafer dividing apparatus having such a configuration will be described with reference to FIGS.
As shown in FIG. 1A, a dicing process having a shape in which a functional element 3 having a movable portion or a protrusion 2 is not in contact with a semiconductor wafer 1 on which a functional element 3 having a movable portion or a protrusion 2 is formed. The tool 4 is mounted with the surface on which the functional elements 3 of the semiconductor wafer 1 are formed facing each other. Then, the semiconductor wafer 1 is fixed to the dicing jig 4 by a suction force from the vacuum chuck stage 16 of the dicing cut device through the vacuum chuck port 15 provided in the dicing jig 4, and then the dicing jig 4. The semiconductor wafer 1 is grooved with the blade 14 of the dicing cut device, leaving the surface facing the flat surface as a connection surface. Needless to say, the fixing of the soft adhesive sheet 6 to the dicing jig 4 is not limited to the vacuum suction. Further, in the present embodiment, the dicing method is adopted for cutting the semiconductor wafer 1, but the invention is not limited to this, and a scribing method or a laser beam may be used.
[0030]
Then, as shown in FIG. 1B, after the surface of the semiconductor wafer 1 cut by the blade 14 is cleaned using pure nitrogen gas, an annular body 6 is attached to the periphery of the surface. The soft adhesive sheet 6 was affixed, and the suction force of the vacuum chuck stage 16 of the dicing cut device was released, so that the dicing jig 4 provided with a concave portion on the surface was affixed to the annular body 5 and the soft adhesive sheet 6. The diced semiconductor wafer 1 is removed.
[0031]
Further, as shown in FIGS. 1 (c) and 3, the diced semiconductor wafer 1 attached to the soft adhesive sheet 6 with the annular body 5 attached to the periphery is attached to the concave jig 7 to form an annular shape. The holding jig 17 having the holding part of the body 5 is fixed. At this time, the space 9 between the concave surface 8 of the concave jig 7 and the pressure-sensitive adhesive sheet 6 to which the semiconductor wafer 1 is attached is structured to be kept airtight by the seal ring 12.
[0032]
Then, as shown in FIG. 1D, after attaching the diced semiconductor wafer 1 to the concave jig 7, the entire concave jig 7 is inverted 180 degrees. Then, the semiconductor wafer 1 and the semiconductor wafer 1 were attached by connecting the exhaust port 18 provided inside the concave jig 7 and an external exhaust device 13 and making the space 9 in a vacuum state. The soft adhesive sheet 6 is curved along the concave surface 8 of the jig, a uniform stress is applied to the dicing line on the entire surface of the semiconductor wafer 1, and the chips are divided into chips of a predetermined size with high accuracy. At this time, the adjusting valve 21 attached to the piping path of the exhaust device 13 adjusts the evacuation speed of the space 9 to control the speed at which the wafer surface is attracted to the concave surface portion of the jig 7 and curved. In other words, by preventing the semiconductor wafer 11 from being bent sharply, an optimum division stress is given without giving a sudden stress to the dicing line. The bending speed, the division stress, and the curvature radius of the concave surface 8 are determined in advance by simulation in accordance with the half cut depth of the dicing cut and the division size of the chip. Further, silicon scrap generated by the division falls by its own weight drop without adhering to the surface of the functional element, and there is no adverse effect on the functional element.
[0033]
However, when the functional elements divided into chips in this way are magnified about 200 times using a microscope and observed, very fine silicon debris is observed in the vicinity of the dicing line. In order to collect these, the annular body 5 on which the diced semiconductor wafer 1 is pasted, the holding jig 17 for the annular body 5 and the like are attached to the dome-shaped jig 11 whose inside is processed into a dome shape as shown in FIG. The entire concave jig 7 is covered, and the air inside the dome-shaped jig 11 is exhausted by an external exhaust device 19.
[0034]
At this time, air flow passages 20 are radially provided on the mating surface of the dome-shaped jig 11 with the concave-shaped jig 7 so that a small amount of external air can flow. It is always pulled outside the dome by the exhaust system. In other words, the silicon scrap 10 generated by the division can be quickly separated from the surface of the semiconductor wafer 10 by the suction force of the exhaust device 19 in combination with the action of falling by its own weight. The exhaust speed of the exhaust device 13 that evacuates the space 9 in the space 7 and the exhaust speed of the exhaust device 19 that promotes the falling of the silicon dust by its own weight are controlled by the adjusting valve 22. By these, the fine silicon | silicone scraps which are going to adhere to the dicing line vicinity of the functional element made into the chip can be discharged | emitted rapidly and reliably outside.
[0035]
As described above, in the present invention, the semiconductor wafer on which the functional element having the movable portion or the protrusion is formed is diced using a dicing jig having a concave portion on the surface, and then the annular body is formed. A soft adhesive sheet affixed to the periphery is affixed to a diced semiconductor wafer, this annular body is attached to a concave jig, and the concave surface of the jig that is kept airtight is evacuated to vacuum the semiconductor wafer. Since it can be curved along the concave surface of the jig and stress can be concentrated on the dicing line, the entire surface of the semiconductor wafer can be divided into uniform chips with no damage to the wafer and no cracks. Can be improved.
[0036]
In addition, silicon scraps that adhere to the chip also use a self-weight drop of the silicon scrap itself, and use a jig that promotes the self-weight drop to eliminate any adverse effects on the functional element, Chip division of a semiconductor wafer on which functional elements having protrusions are formed can be performed at a high yield.
[0037]
【The invention's effect】
According to the present invention, in an apparatus that divides a semiconductor wafer on which a functional element having a movable part and a protrusion is formed into chips, resist application or resist removal by ultraviolet irradiation in an ozone atmosphere is performed to protect the functional element. The silicon scrap generated when dividing into chips without going through the process eliminates the problems that impair the function of the functional elements, and the semiconductor wafer on which the functional elements are formed easily and with high yield. A semiconductor wafer dividing apparatus for dividing can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining the configuration and operation of a semiconductor wafer dividing apparatus according to the present invention;
FIG. 2 is a cross-sectional view of a semiconductor wafer dividing apparatus further provided with a jig for promoting the discharge of silicon waste generated when the semiconductor wafer is divided.
FIG. 3 is a perspective view of a semiconductor wafer dividing jig and a dicing jig according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 2 ... Movable part or projection part, 3 ... Functional element, 4 ... Dicing jig, 5 ... Ring body, 6 ... Soft adhesive sheet, 7 ... Concave type jig, 8 ... Concave surface, 9 ... Concave surface Space, 10 ... Silicon scrap, 11 ... Dome-shaped jig, 12 ... Seal ring, 13, 19 ... Exhaust device, 14 ... Blade, 15 ... Vacuum chuck port, 16 ... Vacuum chuck stage, 17 ... Holding jig, 18 ... Exhaust port, 20 ... Air flow passage, 21,22 ... Regulator valve

Claims (3)

In a semiconductor wafer dividing apparatus for dividing a semiconductor wafer on which a functional element having at least a movable part or a protrusion is formed into a plurality of chips,
A dicing jig having a shape in which the movable part or the projecting part is not in contact with the semiconductor wafer on which the functional element having the movable part or the projecting part is formed;
A soft adhesive sheet having an annular body at the periphery thereof for pasting after dicing a semiconductor wafer mounted on the dicing jig;
A concave jig for attaching the soft adhesive sheet to which the semiconductor wafer is attached;
A holding jig for holding an annular body of a soft adhesive sheet to which a semiconductor wafer attached to the concave jig is attached;
A first exhaust device for sucking a space formed by the concave surface of the concave tool jig and the soft adhesive sheet to which the semiconductor wafer is attached;
Reversing means for inverting the entire surface of the concave jig so that the surface to which the semiconductor wafer is attached is down, with the soft adhesive sheet attached.
A dome-shaped jig that covers the formation surface of the functional element of the semiconductor wear;
A second exhaust device for exhausting air in a space formed by the dome-shaped jig and the concave-shaped jig;
Comprising
With the reversing means, the surface of the concave jig on which the semiconductor wafer is stuck is turned down, and the soft adhesive sheet is brought into the concave surface of the concave jig by suction of the first exhaust device. And is divided into a plurality of chips by applying uniform stress to the entire surface of the semiconductor wafer, and silicon scrap generated by the division is collected by suction of the dome-shaped jig and the second exhaust device. A semiconductor wafer dividing apparatus. External air for quickly discharging the silicon waste when the inside of the dome-shaped jig is exhausted by the second exhaust device on the mating surface of the holding jig and the dome-shaped jig. The apparatus for dividing a semiconductor wafer according to claim 1, further comprising an air flow passage through which the air flows. The apparatus further comprises an adjustment valve that adjusts the suction force when the air inside the dome-shaped jig is exhausted by the second exhaust device so as to promote the falling of the silicon dust by its own weight. Item 3. The semiconductor wafer dividing apparatus according to Item 1 or 2.

Images