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JP3664077B2 - How to apply tape to the lead frame - Google Patents
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JP3664077B2 - How to apply tape to the lead frame - Google Patents

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Publication number
JP3664077B2
JP3664077B2 JP2000397698A JP2000397698A JP3664077B2 JP 3664077 B2 JP3664077 B2 JP 3664077B2 JP 2000397698 A JP2000397698 A JP 2000397698A JP 2000397698 A JP2000397698 A JP 2000397698A JP 3664077 B2 JP3664077 B2 JP 3664077B2
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JP
Japan
Prior art keywords
lead frame
tape
lead
sealing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000397698A
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Japanese (ja)
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JP2002198480A (en
Inventor
厚 堀木
尚 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000397698A priority Critical patent/JP3664077B2/en
Publication of JP2002198480A publication Critical patent/JP2002198480A/en
Application granted granted Critical
Publication of JP3664077B2 publication Critical patent/JP3664077B2/en
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Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、３次元形状のリードフレームへのテープ貼り付け方法に関し、特にＱＦＮ（Ｑｕａｄ Ｆｌａｔｐａｃｋ Ｎｏｎ−ｌｅａｄｅｄ ｐａｃｋａｇｅ）型パッケージを代表とする裏面露出型ノンリードパッケージに用いるリードフレームへのテープ貼り付け方法に関する。
【０００２】
【従来の技術】
ＩＣ等の樹脂封止型半導体装置として、パッケージの側方に突出していたアウターリードをなくし、パッケージの下面側に外部端子を設けたＱＦＮ型パッケージが知られている。
【０００３】
このＱＦＮ型パッケージにパワー半導体など発熱量の大きい半導体チップを搭載する場合、放熱性を向上させるため半導体チップを搭載したダイパットの下面は封止樹脂で覆わずに露出させた構造のＱＦＮ型パッケージが採用されている。
【０００４】
図３は、このようなＱＦＮ型パッケージの一例を示す断面図である。ＱＦＮ型パッケージは信号用リード２と、ダイパット３と、ダイパット３を支持する吊りリード４からなるリードフレーム１を備えている。ダイパット３上に導電性ペースト６により半導体チップ５を接合し、半導体チップ５の電極パッド（図示せず）と信号用リード２とは金属細線７により電気的に接続されている。そして、ダイパット３の下面を除く部分と、半導体チップ５と、信号用リード２と、吊りリード４と、金属細線７とは封止樹脂８により封止されている。信号用リード２の裏面側には封止樹脂は存在せず外部電極９となっている。
【０００５】
ダイパット３の下面は封止樹脂８に覆われずに露出して放熱板として機能しており、このダイパット３を実装基板の放熱部に接触させることにより、消費電力の高いパワー素子から出る熱量を外部に放出させて、パッケージ内の温度上昇を抑制するようにしている。
【０００６】
このようなＱＦＮ型パッケージは、例えば以下のような工程により製造している。まず、信号用リード２、ダイパット３、吊りリード４などを有するリードフレーム１を用意する。次に、ダイボンド工程において、用意したリードフレーム１のダイパット３の上に半導体チップ５を導電性ペースト６により接合する。そして、ワイヤボンディング工程において、ダイパット３上に接合された半導体チップ５と信号用リード２とを金属細線７により電気的に接続する。
【０００７】
次に、ダイパット３の下面を除く部分、信号用リード２、吊りリード４および金属細線７をエポキシからなる封止樹脂８により封止する。この場合、半導体チップ５が接合されたリードフレーム１が封止金型内に収納されてトランスファーモールドされるが、信号用リード２の裏面が封止金型に接触した状態で樹脂封止が行われる。最後に、樹脂封止後に封止樹脂８から外方に突出している信号用リードの先端部を切断する。
【０００８】
上記樹脂封止工程においては、リードフレーム１を封止金型内に収納し、下金型に信号用リードを密着させて樹脂封止しているが、狭ピッチ、長リードのリードフレームの場合、封止樹脂が信号用リードの裏面側にまわり込んで、外部電極の表面に樹脂ばりが発生するという不具合があった。
【０００９】
これを防止するため、あらかじめリードフレームの裏面側に封止テープを貼り付けた状態でダイボンド工程、ワイヤボンディング工程を行い、リードフレームを封止金型内で樹脂封止する方法が行われている。
【００１０】
従来、リードフレームの裏面に封止テープを貼り付ける方法としては、図４（ａ）に示すように、ローラー３１，３１間にリードフレーム１とフープ状の封止テープ１１を挟んだ状態で圧着する方法や、図４（ｂ）に示すように、プレート３２上にリードフレーム１をセットし、フープ状の封止テープ１１をローラ３１で圧着するといった方法が用いられている。
【００１１】
【発明が解決しようとする課題】
しかしながら従来のテープ貼り付け方法では、突起部形状を備えた三次元形状のリードフレームである場合、ローラからの荷重によりリードフレームの突起部形状が変形したりテープ未着部分が生じるなどの問題がある。
【００１２】
また、テープへの荷重（張力）によってリードフレームに反りが発生するという問題も発生する。
【００１３】
本発明は、上記問題を解決するものであり、突起部形状を備えた三次元形状のリードフレームに変形や反りが生じることなく、リードフレームにテープを貼り付ける方法を提供することを目的とする。
【００１４】
【課題を解決するための手段】
上記課題を解決するために本発明は、突起部形状を有する３次元形状のリードフレームへのテープ貼り付け方法であって、多数の凹部が形成されたプレート上にリードフレームを載置し、この突起部を凹部内に収納した状態で位置決めするとともに、プレートの上方に配置した上金型でテープを保持し、上金型を下降させてリードフレームにテープを加圧プレスするものである。
【００１５】
これによれば、プレートに形成した凹部にリードフレームの突起部形状を逃すことができるため、テープを貼り付ける際に荷重をかけてもリードフレームが変形することがない。
【００１６】
【発明の実施の形態】
以下、本発明の一実施形態について図面を参照しながら説明する。
【００１７】
図１は本実施形態によるリードフレームへのテープ貼り付け方法を示す説明図である。
【００１８】
下金型１２に多数の凹部１５が形成されたプレート１４をセットし、このプレート１４上にＱＦＮパッケージ用のリードフレーム１をセットする。凹部１５はリードフレーム１に形成されたダイパットなどの突起部Ａの外形寸法に対して、＋０．１〜０．２ｍｍ程度に設計されており、突起部Ａが凹部１５内に収納された状態でリードフレーム１は、プレート１４上に位置決めピン（図示せず）により位置決めされている。
【００１９】
プレート１４の上方には、上金型１３が配置されており、上金型１３は真空吸着により封止テープ１１を保持している。封止テープ１１はリール１６に巻き取られたフープ状のものを用いている。
【００２０】
そして、上金型１３を下降させて、リードフレーム１上に封止テープ１１を加圧プレスして貼り付けている。
【００２１】
この後、リードフレームはダイボンド工程、ワイヤボンド工程を経て、図２に示すように、封止金型２１内にリードフレーム１をセットして樹脂封止する。この際、リードフレーム１の裏面には封止テープ１１が貼り付けられているため、封止樹脂８が裏面にまわり込んで樹脂ばりを発生させるといった不具合を防ぐことができる。
【００２２】
【発明の効果】
以上説明したように本発明によれば、突起部形状を有する三次元形状のリードフレームを変形させることなくリードフレームの裏面にテープを貼り付けることができる。
【図面の簡単な説明】
【図１】本発明によるリードフレームへのテープ貼り付け方法の説明図
【図２】ＱＦＮ型パッケージを樹脂封止する際の説明図
【図３】ＱＦＮ型パッケージの一例を示す断面図
【図４】従来のリードフレームへのテープ貼り付け方法の説明図
【符号の説明】
１ リードフレーム
２ 信号用リード
３ ダイパット
４ 吊りリード
５ 半導体チップ
６ 導電性ペースト
７ 金属細線
８ 封止樹脂
９ 外部電極
１１ 封止テープ
１２ 下金型
１３ 上金型
１４ プレート
１５ 凹部
１６ リール
２１ 封止金型
３１ ローラ
３２ プレート
Ａ 突起部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for attaching a tape to a lead frame having a three-dimensional shape, and in particular, a method for attaching a tape to a lead frame used in a backside exposed non-lead package represented by a QFN (Quad Flatpack Non-leaded package) type package. About.
[0002]
[Prior art]
As a resin-encapsulated semiconductor device such as an IC, a QFN type package is known in which an outer lead protruding to the side of the package is eliminated and an external terminal is provided on the lower surface side of the package.
[0003]
When a semiconductor chip having a large heat generation amount such as a power semiconductor is mounted on this QFN type package, a QFN type package having a structure in which the lower surface of the die pad on which the semiconductor chip is mounted is exposed without being covered with a sealing resin in order to improve heat dissipation. It has been adopted.
[0004]
FIG. 3 is a cross-sectional view showing an example of such a QFN type package. The QFN type package includes a lead frame 1 including a signal lead 2, a die pad 3, and a suspension lead 4 that supports the die pad 3. A semiconductor chip 5 is bonded onto the die pad 3 with a conductive paste 6, and an electrode pad (not shown) of the semiconductor chip 5 and the signal lead 2 are electrically connected by a thin metal wire 7. The portion excluding the lower surface of the die pad 3, the semiconductor chip 5, the signal lead 2, the suspension lead 4, and the fine metal wire 7 are sealed with a sealing resin 8. There is no sealing resin on the back side of the signal lead 2, and the external electrode 9 is formed.
[0005]
The lower surface of the die pad 3 is exposed without being covered with the sealing resin 8 and functions as a heat radiating plate. By bringing the die pad 3 into contact with the heat radiating portion of the mounting substrate, the amount of heat emitted from the power element with high power consumption can be reduced. It is discharged outside to suppress the temperature rise in the package.
[0006]
Such a QFN type package is manufactured by the following processes, for example. First, a lead frame 1 having a signal lead 2, a die pad 3, a suspension lead 4, and the like is prepared. Next, in the die bonding process, the semiconductor chip 5 is bonded to the prepared die pad 3 of the lead frame 1 with the conductive paste 6. Then, in the wire bonding step, the semiconductor chip 5 bonded on the die pad 3 and the signal lead 2 are electrically connected by the thin metal wire 7.
[0007]
Next, the portion excluding the lower surface of the die pad 3, the signal lead 2, the suspension lead 4, and the metal thin wire 7 are sealed with a sealing resin 8 made of epoxy. In this case, the lead frame 1 to which the semiconductor chip 5 is bonded is housed in a sealing mold and transfer molded, but resin sealing is performed with the back surface of the signal lead 2 in contact with the sealing mold. Is called. Finally, the tip of the signal lead protruding outward from the sealing resin 8 after resin sealing is cut.
[0008]
In the resin sealing process, the lead frame 1 is housed in a sealing mold, and the signal lead is brought into close contact with the lower mold for resin sealing. However, in the case of a lead frame having a narrow pitch and a long lead. There is a problem in that the sealing resin wraps around the back side of the signal lead and a resin flash is generated on the surface of the external electrode.
[0009]
In order to prevent this, a method of performing a die bonding process and a wire bonding process in a state in which a sealing tape is attached to the back side of the lead frame in advance, and resin-sealing the lead frame in a sealing mold is performed. .
[0010]
Conventionally, as a method of attaching a sealing tape to the back surface of a lead frame, as shown in FIG. 4A, pressure bonding is performed with the lead frame 1 and a hoop-shaped sealing tape 11 being sandwiched between rollers 31 and 31. As shown in FIG. 4B, the lead frame 1 is set on the plate 32, and the hoop-shaped sealing tape 11 is pressure-bonded by a roller 31.
[0011]
[Problems to be solved by the invention]
However, in the conventional tape application method, when the lead frame has a three-dimensional shape having a protrusion shape, there is a problem that the protrusion shape of the lead frame is deformed due to the load from the roller or a tape non-attached portion is generated. is there.
[0012]
Further, there is a problem that the lead frame is warped due to the load (tension) on the tape.
[0013]
The present invention solves the above problems, and an object of the present invention is to provide a method for attaching a tape to a lead frame without causing deformation or warping of a three-dimensional shape lead frame having a protrusion shape. .
[0014]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention is a method of attaching a tape to a three-dimensional shape lead frame having a protrusion shape, wherein the lead frame is placed on a plate on which a large number of recesses are formed. The protrusion is positioned in a state where it is housed in the recess, and the tape is held by an upper mold placed above the plate, and the upper mold is lowered to press the tape against the lead frame.
[0015]
According to this, since the shape of the protrusion of the lead frame can be escaped from the recess formed in the plate, the lead frame is not deformed even when a load is applied when the tape is applied.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0017]
FIG. 1 is an explanatory view showing a method for attaching a tape to a lead frame according to the present embodiment.
[0018]
A plate 14 in which a large number of recesses 15 are formed is set in the lower mold 12, and a lead frame 1 for a QFN package is set on the plate 14. The recess 15 is designed to be about +0.1 to 0.2 mm with respect to the outer dimensions of the protrusion A such as a die pad formed on the lead frame 1, and the protrusion A is stored in the recess 15. The lead frame 1 is positioned on the plate 14 by positioning pins (not shown).
[0019]
An upper mold 13 is disposed above the plate 14, and the upper mold 13 holds the sealing tape 11 by vacuum suction. The sealing tape 11 is a hoop wound around a reel 16.
[0020]
Then, the upper mold 13 is lowered and the sealing tape 11 is pressed and pasted onto the lead frame 1.
[0021]
Thereafter, the lead frame undergoes a die bonding step and a wire bonding step, and as shown in FIG. 2, the lead frame 1 is set in a sealing mold 21 and resin-sealed. At this time, since the sealing tape 11 is affixed to the back surface of the lead frame 1, it is possible to prevent a problem that the sealing resin 8 wraps around the back surface and generates a resin flash.
[0022]
【The invention's effect】
As described above, according to the present invention, it is possible to affix the tape to the back surface of the lead frame without deforming the three-dimensional lead frame having the protruding portion shape.
[Brief description of the drawings]
FIG. 1 is an explanatory view of a method for attaching a tape to a lead frame according to the present invention. FIG. 2 is an explanatory view when resin-sealing a QFN type package. FIG. 3 is a cross-sectional view showing an example of a QFN type package. [Explanation of the method of pasting tape on a lead frame] [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Lead frame 2 Signal lead 3 Die pad 4 Hanging lead 5 Semiconductor chip 6 Conductive paste 7 Metal thin wire 8 Sealing resin 9 External electrode 11 Sealing tape 12 Lower mold 13 Upper mold 14 Plate 15 Recess 16 Reel 21 Sealing Mold 31 Roller 32 Plate A Projection

Claims (2)

突起部形状を有する３次元形状のリードフレームへのテープ貼り付け方法であって、前記突起部形状の外形寸法に対して０．１〜０．２ｍｍ大きな多数の凹部が形成されたプレート上にリードフレームを載置し、前記突起部を前記凹部内に収納した状態で位置決めするとともに、前記プレートの上方に配置した上金型に真空吸着によりテープを保持し、前記上金型を下降させて前記リードフレームに前記テープを加圧プレスすることを特徴とするリードフレームへのテープ貼り付け方法。A tape affixing method to a three-dimensional lead frame having a protrusion shape, wherein the lead is formed on a plate on which a large number of recesses having a size of 0.1 to 0.2 mm are formed with respect to the external dimensions of the protrusion shape. A frame is placed, and the protrusion is positioned in a state of being accommodated in the recess, and a tape is held by vacuum suction on an upper mold disposed above the plate, and the upper mold is lowered to lower the upper mold. A method for attaching a tape to a lead frame, wherein the tape is press-pressed onto the lead frame. 前記テープは、リールに巻き取られたフープ状である請求項１記載のリードフレームへのテープ貼り付け方法。  The method of attaching a tape to a lead frame according to claim 1, wherein the tape has a hoop shape wound around a reel.
JP2000397698A 2000-12-27 2000-12-27 How to apply tape to the lead frame Expired - Fee Related JP3664077B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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JP3664077B2 true JP3664077B2 (en) 2005-06-22

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JP5907084B2 (en) * 2013-02-01 2016-04-20 株式会社デンソー Manufacturing method of semiconductor device

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