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JP3668122B2 - Thin film transistor substrate and liquid crystal display device including the same - Google Patents
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JP3668122B2 - Thin film transistor substrate and liquid crystal display device including the same - Google Patents

Thin film transistor substrate and liquid crystal display device including the same Download PDF

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Publication number
JP3668122B2
JP3668122B2 JP2000339174A JP2000339174A JP3668122B2 JP 3668122 B2 JP3668122 B2 JP 3668122B2 JP 2000339174 A JP2000339174 A JP 2000339174A JP 2000339174 A JP2000339174 A JP 2000339174A JP 3668122 B2 JP3668122 B2 JP 3668122B2
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Japan
Prior art keywords
electrode
thin film
film transistor
pixel electrode
gate
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JP2000339174A
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JP2002149086A (en
Inventor
修 小林
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Sanyo Electric Co Ltd
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Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
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  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は薄膜トランジスタ基板及びそれを備える液晶表示装置に関する。
【0002】
【従来の技術】
液晶表示装置を構成する薄膜トランジスタアレイ基板において、補助容量を形成するための一方の電極として画素電極を、他方の電極としてゲート配線を利用するものが知られている(例えば。特開平1−169430号公報参照)。この補助容量を増大させるためには、画素電極とゲート配線が重なる面積を大きくすることが有効であるが、開口率との関係から限界が有る。そこで、図4に示すように、ゲート絶縁層とその上の保護層の間に別途補助容量用の電極CMを設け、この電極CMと画素電極ITOを保護層に形成したコンタクトホールCHを介して接続することにより、補助容量を増加する構造としたものが実用化されている。
【0003】
【発明が解決しようとする課題】
図4に示す従来の構造は、画素電極ITOがゲート配線GLを介在して隣接画素電極と対面する領域の全範囲、特に薄膜トランジスタTFTから離れたゲート配線GL上にもコンタクトホールCHが形成され、それを覆うように画素電極ITOが形成されているので、画素電極ITOの間隔が非常に狭く、この隙間部分に異物が入り込むことによって画素電極の短絡事故が発生しやすいという問題が有った。
【0004】
そこで本発明はゲート配線を挟んで対向する画素電極同士の短絡事故の発生を防止することを課題の1つとする。また、開口率を犠牲にすることなく補助容量を大きく設定することを課題の1つとする。また、画質の良い液晶表示装置を提供することを課題の1つとする。
【0005】
【課題を解決するための手段】
本発明の薄膜トランジスタ基板は請求項1に記載のように、複数のゲート配線と複数のソース配線によって区画される領域に薄膜トランジスタとそれに接続した画素電極を配置し、ゲート配線とそれに重ねるように配置した次段の画素電極の間に、ゲート絶縁層、補助容量用の電極、保護層を介在した薄膜トランジスタ基板において、ゲート電極を挟んで位置する画素電極と次段の画素電極の間隔を広くするように、次段の画素電極が補助容量用電極に重なる面積を薄膜トランジスタ側に比べて薄膜トランジスタと反対の側が小さくなるようにし、画素電極と補助容量用の電極を接続するために保護層に形成したコンタクトホールを、薄膜トランジスタをゲート配線に投影した長さ範囲内に収まるように形成したことを特徴とする。
【0008】
本発明の液晶表示装置は請求項4に記載のように、一対の基板間に液晶層を挟持した液晶表示装置において、前記基板の一方の基板として上記のいずかに記載の基板を用いたことを特徴とする。
【0009】
次段の画素電極が補助容量用電極に重なる面積を薄膜トランジスタ側に比べて薄膜トランジスタと反対の側が小さくなるようにすることにより、画素電極の間隔を広くして画素電極間の短絡事故の発生を防止することができる。画素電極と補助容量用の電極を接続するために保護層に形成したコンタクトホールを、薄膜トランジスタをゲート配線に投影した長さ範囲内に収まるように形成したので、薄膜トランジスタの介在によって画素電極の間隔を広く確保することができる領域にコンタクトホールとそれを覆う画素電極を配置することができる。このような薄膜トランジスタ基板を一方の基板に備える液晶表示装置は、画素電極間の短絡事故の発生が少なく表示品位を高めた表示を行なうことができる。また、補助容量用の電極をゲート配線に重ねて配置することにより、開口率を犠牲にすることなく蓄積容量を高めて表示品位を良好にすることができる。
【0010】
【発明の実施の形態】
以下本発明の実施形態について、逆スタガ型の薄膜トランジスタ(以下TFT)1をマトリックス状に配列した薄膜トランジスタ基板(以下TFTアレイ)2を例にとって説明する。図1は、TFTアレイ2の概略的な平面図である。図2は図1のA−Aに沿った断面図で、要部(TFT1)の概略的な断面図である。図3はTFT1の概略構造を模式的に示す平面図である。
【0011】
TFTアレイ2は、無アルカリガラスなどの基板3の上に、左右方向に延びる複数のゲート配線4、並びに、このゲート配線4に接続したゲート電極5を形成している。前記ゲート電極5の上には、窒化シリコン(SiNx)などのゲート絶縁層6を介して半導体アイランド7を形成している。この半導体アイランド7は、後述するソース電極9やドレイン電極10に接続されてチャンネル領域を形成する半導体層としてのアモルファスタイプのシリコン層によって形成している。半導体アイランド7の形成後、ゲート配線4と直交する方向(縦方向に延びる)の複数のソース配線8、これに接続したソース電極9、並びにこのソース電極9と一定の距離を置いて対向配置したドレイン電極10、このドレイン電極10の基端部と接続した画素電極とのコンタクト用電極11、補助容量用の電極12が形成される。これらの配線8〜電極12は、同一金属層をパターニングすることによって同時に形成しているが、別々に形成することもできる。
【0012】
半導体アイランド7、ソース電極9、ドレイン電極10などを含むTFTアレイ2上面は、保護層(SiNxなど)13によって覆っている。この保護層13に前記コンタクト用電極11に至るコンタクトホール14、並びに補助容量用電極12に至るコンタクトホール15を形成している。そして、ゲート配線4とソース配線8によって区画される領域にITO,IZOなどの透明な画素電極16が個々に形成される。保護層13上に形成された画素電極16は、コンタクトホール14を介してTFT1のドレイン電極10に接続され、コンタクトホール15を介して補助容量用電極12に接続される。
【0013】
画素電極の下に位置するゲート絶縁層6と保護層13は、画素電極16とその下に位置する電極や配線との絶縁を行なう部分を除いてそのほとんどが除去されているので、基板3の上に画素電極16の大部分が直接接している。このように、画素電極16の下に位置する絶縁層や保護層を除去することにより、透過光量を増加することができる。また、画素電極16は、遮光性のゲート電極5との平面的な重なりを避けて配置するためにその隅にTFT1に相応する切り欠きを有しているので、画素電極16とそれに隣接する次段の画素電極16との間には、TFT1に対応した隙間が介在することになる。
【0014】
画素電極16はTFT1に隣接して配置しているが、TFT1を覆うような層間絶縁層を形成する場合は、TFT1の大部分と平面的に重なるように配置することもできる。TFT1とそれに接続した画素電極16は共にマトリックス状に配列される。画素電極16は、表示装置を反射形とする場合には、反射性のある金属膜などによって構成することもできる。
【0015】
前記ソース電極9は、前記ソース配線8と直交する方向に長い横長形状であり、ゲート電極5並びに半導体アイランド7と平面的に重なる位置に形成している。ソース電極9の途中のドレイン電極10と対向する側には、ドレイン電極10の先端部10aを受け入れる半円状の凹部9aを形成している。ゲート電極5並びに半導体アイランド7と平面的に重なるように配置したドレイン電極10は、ソース配線8の延長方向と同方向に延びる縦長形状をしており、ソース電極9を基準にソース配線8の延長方向と同方向に配置している。ドレイン電極10の円弧状先端部10aがソース電極9の凹部9aに嵌まり込むことにより、ドレイン電極10の先端周囲とソース電極9間が一定の間隔(チャンネル幅)を保った状態にされる。
【0016】
ソース電極9、ドレイン電極10がゲート絶縁層6や半導体アイランド7を介在して平面的にゲート電極5と重なる部分が主にTFT1の寄生容量を構成するが、なかでも画素電圧の変動に大きな影響を与えるのは、ドレイン電極10とゲート電極5の重なりによって形成される寄生容量である。図3に示す構造は、このゲート・ドレイン間の寄生容量の変動を抑制する構造となっている。
【0017】
まず、同一金属によって同時に形成されるソース電極9とドレイン電極10を縦方向に配列しているので、その電極配置が横方向に多少ずれてもゲート・ドレイン間の寄生容量に変動はない。また、縦方向にずれると、ドレイン電極10とゲート電極5の重なり面積が大小変動するが、ドレイン電極10が縦長であるので、コンタクト電極11のように横長部分をゲート電極5上に重ねる場合に比べて、変動する面積を非常に小さくすることができる。ここで、ドレイン電極10が縦長であるのでチャンネル幅が短くなる恐れが有るが、ソース電極9に凹部9aを設けてドレイン電極10先端部10aの周囲を一定の間隔を保ってソース電極9が囲む形状としているので、チャンネル幅も比較的広く確保することができる。
【0018】
このようにドレイン電極10の先端部10aをソース電極9の凹部9aに配置しているので、TFT1の寄生容量の変動を抑制することができる。
【0019】
したがって、液晶層を挟んで対向配置した基板の一方にこのTFTアレイ2を組み込んで液晶表示装置を提供する場合、TFT1の寄生容量の変動による表示ムラを抑制した表示を行なうことができる。また、寄生容量の変動による影響を抑制するための補助容量をTFT1に設ける場合は、その容量を小さく設定することができ、補助容量による遮光面積を削減して液晶表示装置の開口率を高めることができる。
【0020】
ドレイン電極10の先端部10aの形状は、その角を丸めるように予め設定したパターンを利用して形成している。この角の丸めは、その半径を露光装置の解像度よりも大きな値に設定することが望ましく、そうすることによって設計形状と実際の形状の差を小さくすることができる。この実施形態では、ドレイン電極10の先端部10aをソース電極9側に向けて凸で平面的に見て円弧状にした。この先端形状は当初の設計パターンと同じ形状になる。したがって、角形の場合の様に角が丸まることに起因するドレイン10電極の面積変動とそれによる寄生容量変動の問題、もしくはソース電極9とドレイン電極10の間隔変動の問題を解消することができる。
【0021】
ソース電極9もその凹部9aを円弧状とした。すなわち。ソース・ドレイン電極間の距離を一定にするために、ソース電極9のドレイン電極10と対向する側に平面的に見て凹の円弧状凹部9aを設けた。そして、凹部9aの円弧形状は、ドレイン電極10先端部10aの円弧形状と同心円状を成すように形成している。このように、凹部9aもドレイン電極先端10aと同心の円弧状としているので、ソース・ドレイン間隔、すなわちTFT1のチャンネル長を一定に保つことができ、トランジスタの特性を良好にすることができる。ソース電極9のドレイン電極10に対向する側と反対側9bは任意形状でよいが、この例では前記凹部9aと同様にドレイン電極先端10aの円弧と同心円状に形成している。このように図に示す実施形態は、ドレイン電極10のソース電極9に対向する側の先端10a、ソース電極9のドレイン電極10に対向した側9a、ソース電極9のドレイン電極10と反対の側9bを平面的に見て同心円状に、その半径を順次大きくするように形成している。ここで、同心の円弧形状としては、円以外にも楕円形状を含めることができる。
【0022】
露光解像度よりも大きな半径で事前に角丸めを行なう上述の角丸め処理は、TFT1の寄生容量やチャンネル状態に影響を与える度合いが最も高いドレイン電極10、特にそのソース電極9と対向する側の先端部10aや、この先端部と対向するソース電極9の凹部9aに適用するのが好ましいが、それ以外の部分に適用することもでき、例えば、コンタクト電極11、コンタクト電極11とドレイン電極10の接続部、ソース電極9とソース配線8の接続部、ゲート電極5、ゲート電極5とゲート配線4の接続部、画素電極16などに適用することもできる。
【0023】
補助容量用電極12は、ゲート絶縁層6上に平面的に見てゲート配線4からのはみ出しが殆どない状態で積層されている。補助容量用電極12の長さは、画素電極16の短辺方向の長さ(ゲート配線4と同方向の長さ)と実質的に同一の長さに設定している。
【0024】
保護層13に形成したコンタクトホール15は、画素電極16をゲート配線4に投影した際の半分以下の投影長さ範囲内に収まるように、より好ましくは、この例のように、TFT1をゲート配線4に投影した際の投影長さ範囲内に収まるように、あるいは、ゲート電極5をゲート配線4に投影した際の投影長さ範囲内に収まるように、あるいは、ソース電極9をゲート配線4に投影した際の投影長さ範囲内に収まるように、あるいは、コンタクト用電極11をゲート配線4に投影した際の投影長さ範囲内に収まるようにするのがよい。このように、ゲート電極5と画素電極16の間にゲート絶縁層6、補助容量用電極12、保護層13を配置した構造において、補助容量用電極12上のTFT1側に偏った位置にコンタクトホール15を形成しているので、コンタクトホール15とは反対側の画素電極16の設計自由度が増して画素電極間隔を広く設定でき、電極16間の短絡を防ぐ上で有用な構造を提供することができる。
【0025】
ゲート配線4上の隣接(次段)の画素電極16は、このコンタクトホール15を覆う一方で、補助容量用電極12上のコンタクトホール15が形成された側とは反対側に、補助容量用電極12の大部分が平面的に見て画素電極16の縁から露出するような切り欠き部16aを有している。この切り欠き部16aは、画素電極16がゲート配線4を挟んで隣接する次段の画素電極16と対抗する部分の間隔、特に、画素電極16間にTFTが介在しない部分の間隔を広くする役割を果たすので、隣接画素電極同士の短絡事故やそれに伴う表示品位の低下の発生を未然に防止することができる。
【0026】
この切り欠き部16aの存在によって、隣接する次段の画素電極16が補助容量用電極12に重なる面積がTFT1側に比べてTFT1と反対の側が小さくなり、全体的に画素電極16の重なり面積が減少するが、補助容量は補助容量用電極12の面積によってその大部分が規定されるので、切り欠き部16aが補助容量に与える影響は非常に少ない。
【0027】
上記TFTアレイ2は、表示画素の駆動用にトランジスタを用いる表示装置、例えば、2枚の基板間に液晶を挟み込んだ液晶表示装置や、有機もしくは無機タイプのEL表示装置の一方の基板に利用することができる。また、上記実施形態はアモルファスシリコンを利用した逆スタガ型のTFTを例にとって説明したが、本発明の一部の構造はそれ以外のトランジスタにも適用することができ、順スタガ型のTFTや多結晶シリコンを半導体アイランドに採用したトランジスタ、並びにそれを利用したものなどにも適用することができる。
【0028】
【発明の効果】
以上のように本発明によれば、ゲート配線を挟んで対向する画素電極同士の短絡事故の発生を未然に防止することができる。また、補助容量用電極を設けているので、開口率を犠牲にすることなく補助容量を大きく設定することができる。その結果、画質の良い液晶表示装置を提供することができる。
【図面の簡単な説明】
【図1】本発明の実施形態を説明するためのTFTアレイの概略構造を示す平面図である。
【図2】図1のA−Aに沿った概略的な断面図である。
【図3】本発明の実施形態に関わるTFTの概略構造を模式的に示す平面図である。
【図4】従来例のTFTの概略構造を模式的に示す平面図である。
【符号の説明】
1 TFT
2 TFTアレイ
5 ゲート電極
7 半導体アイランド
9 ソース電極
10 ドレイン電極
12 補助容量用の電極
13 保護層
14 コンタクトホール
15 コンタクトホール
16 画素電極
16a 切り欠き部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a thin film transistor substrate and a liquid crystal display device including the same.
[0002]
[Prior art]
In a thin film transistor array substrate constituting a liquid crystal display device, one using a pixel electrode as one electrode for forming an auxiliary capacitor and a gate wiring as the other electrode is known (for example, Japanese Patent Laid-Open No. 1-169430). See the official gazette). In order to increase the auxiliary capacitance, it is effective to increase the area where the pixel electrode and the gate wiring overlap, but there is a limit from the relationship with the aperture ratio. Therefore, as shown in FIG. 4, an auxiliary capacitor electrode CM is separately provided between the gate insulating layer and the protective layer thereon, and the contact hole CH in which the electrode CM and the pixel electrode ITO are formed in the protective layer is provided. A structure in which the auxiliary capacity is increased by connection is put into practical use.
[0003]
[Problems to be solved by the invention]
In the conventional structure shown in FIG. 4, the contact hole CH is also formed over the entire area where the pixel electrode ITO faces the adjacent pixel electrode via the gate wiring GL, particularly over the gate wiring GL away from the thin film transistor TFT. Since the pixel electrode ITO is formed so as to cover it, the interval between the pixel electrodes ITO is very narrow, and there is a problem that a short circuit accident of the pixel electrode is liable to occur when foreign matter enters the gap portion.
[0004]
Accordingly, an object of the present invention is to prevent the occurrence of a short-circuit accident between pixel electrodes facing each other across a gate wiring. Another object is to increase the auxiliary capacity without sacrificing the aperture ratio. Another object is to provide a liquid crystal display device with high image quality.
[0005]
[Means for Solving the Problems]
According to the thin film transistor substrate of the present invention, the thin film transistor and the pixel electrode connected to the thin film transistor are arranged in a region defined by the plurality of gate wirings and the plurality of source wirings, and the gate wiring is arranged to overlap the gate wiring. In a thin film transistor substrate having a gate insulating layer, an auxiliary capacitor electrode, and a protective layer interposed between the pixel electrodes of the next stage, the interval between the pixel electrode positioned with the gate electrode interposed therebetween and the pixel electrode of the next stage is widened. The contact hole formed in the protective layer to connect the pixel electrode and the auxiliary capacitor electrode so that the area where the pixel electrode of the next stage overlaps the auxiliary capacitor electrode is smaller on the side opposite to the thin film transistor than on the thin film transistor side. The thin film transistor is formed so as to be within a length range projected onto the gate wiring.
[0008]
According to a liquid crystal display device of the present invention, as described in claim 4, in the liquid crystal display device in which a liquid crystal layer is sandwiched between a pair of substrates, one of the above substrates is used as one of the substrates. It is characterized by that.
[0009]
By making the area where the pixel electrode of the next stage overlaps the auxiliary capacitor electrode smaller on the side opposite to the thin film transistor than on the thin film transistor side, the distance between the pixel electrodes is widened to prevent occurrence of a short circuit between the pixel electrodes. can do. Since the contact hole formed in the protective layer for connecting the pixel electrode and the auxiliary capacitor electrode is formed so as to be within the length range of the thin film transistor projected onto the gate wiring, the space between the pixel electrodes is reduced by the intervening thin film transistor. A contact hole and a pixel electrode covering the contact hole can be arranged in a region that can be secured widely. A liquid crystal display device including such a thin film transistor substrate on one substrate can perform display with improved display quality with less occurrence of a short circuit between pixel electrodes. Further, by arranging the auxiliary capacitor electrode so as to overlap the gate wiring, the storage capacity can be increased and the display quality can be improved without sacrificing the aperture ratio.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described by taking as an example a thin film transistor substrate (hereinafter referred to as TFT array) 2 in which inverted staggered thin film transistors (hereinafter referred to as TFT) 1 are arranged in a matrix. FIG. 1 is a schematic plan view of the TFT array 2. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and is a schematic cross-sectional view of the main part (TFT 1). FIG. 3 is a plan view schematically showing a schematic structure of the TFT 1.
[0011]
In the TFT array 2, a plurality of gate wirings 4 extending in the left-right direction and a gate electrode 5 connected to the gate wiring 4 are formed on a substrate 3 such as non-alkali glass. A semiconductor island 7 is formed on the gate electrode 5 via a gate insulating layer 6 such as silicon nitride (SiNx). The semiconductor island 7 is formed of an amorphous silicon layer as a semiconductor layer that is connected to a source electrode 9 and a drain electrode 10 described later to form a channel region. After the formation of the semiconductor island 7, a plurality of source wirings 8 in a direction orthogonal to the gate wiring 4 (extending in the vertical direction), a source electrode 9 connected to the source wirings 8, and the source electrode 9 are arranged facing each other with a certain distance. A drain electrode 10, a contact electrode 11 with a pixel electrode connected to the base end of the drain electrode 10, and an auxiliary capacitance electrode 12 are formed. These wirings 8 to 12 are simultaneously formed by patterning the same metal layer, but can also be formed separately.
[0012]
The upper surface of the TFT array 2 including the semiconductor island 7, the source electrode 9, the drain electrode 10 and the like is covered with a protective layer (SiNx or the like) 13. A contact hole 14 reaching the contact electrode 11 and a contact hole 15 reaching the storage capacitor electrode 12 are formed in the protective layer 13. Transparent pixel electrodes 16 such as ITO and IZO are individually formed in regions partitioned by the gate wiring 4 and the source wiring 8. The pixel electrode 16 formed on the protective layer 13 is connected to the drain electrode 10 of the TFT 1 through the contact hole 14 and is connected to the storage capacitor electrode 12 through the contact hole 15.
[0013]
Most of the gate insulating layer 6 and the protective layer 13 located under the pixel electrode are removed except for the portion that insulates the pixel electrode 16 from the electrode and wiring located thereunder. Most of the pixel electrodes 16 are in direct contact with each other. In this way, the amount of transmitted light can be increased by removing the insulating layer and the protective layer located under the pixel electrode 16. Further, since the pixel electrode 16 has a notch corresponding to the TFT 1 at the corner in order to avoid the planar overlap with the light-shielding gate electrode 5, the pixel electrode 16 and the next adjacent to the pixel electrode 16 are provided. A gap corresponding to the TFT 1 is interposed between the pixel electrode 16 in the stage.
[0014]
The pixel electrode 16 is disposed adjacent to the TFT 1. However, when an interlayer insulating layer covering the TFT 1 is formed, the pixel electrode 16 may be disposed so as to overlap most of the TFT 1 in plan view. The TFT 1 and the pixel electrode 16 connected to the TFT 1 are both arranged in a matrix. The pixel electrode 16 can also be formed of a reflective metal film or the like when the display device is of a reflective type.
[0015]
The source electrode 9 has a horizontally long shape in a direction orthogonal to the source wiring 8 and is formed at a position overlapping the gate electrode 5 and the semiconductor island 7 in a plane. On the side of the source electrode 9 facing the drain electrode 10, a semicircular recess 9 a that receives the tip 10 a of the drain electrode 10 is formed. The drain electrode 10 disposed so as to overlap the gate electrode 5 and the semiconductor island 7 in plan view has a vertically long shape extending in the same direction as the extension direction of the source wiring 8, and the extension of the source wiring 8 with reference to the source electrode 9. It is arranged in the same direction as the direction. By fitting the arcuate tip 10a of the drain electrode 10 into the recess 9a of the source electrode 9, the periphery of the tip of the drain electrode 10 and the source electrode 9 are maintained at a constant interval (channel width).
[0016]
A portion where the source electrode 9 and the drain electrode 10 overlap with the gate electrode 5 in plan view with the gate insulating layer 6 and the semiconductor island 7 interposed therebetween mainly constitutes the parasitic capacitance of the TFT 1. It is a parasitic capacitance formed by the overlap between the drain electrode 10 and the gate electrode 5. The structure shown in FIG. 3 is a structure that suppresses variations in the parasitic capacitance between the gate and the drain.
[0017]
First, since the source electrode 9 and the drain electrode 10 simultaneously formed of the same metal are arranged in the vertical direction, the parasitic capacitance between the gate and the drain does not change even if the electrode arrangement is slightly shifted in the horizontal direction. In addition, when the vertical displacement occurs, the overlapping area of the drain electrode 10 and the gate electrode 5 changes in size. However, since the drain electrode 10 is vertically long, when a horizontally long portion is overlapped on the gate electrode 5 like the contact electrode 11. In comparison, the fluctuating area can be made very small. Here, since the drain electrode 10 is vertically long, the channel width may be shortened. However, the recess 9a is provided in the source electrode 9, and the source electrode 9 surrounds the periphery of the distal end portion 10a of the drain electrode 10 with a certain interval. Because of the shape, the channel width can be secured relatively wide.
[0018]
As described above, since the distal end portion 10a of the drain electrode 10 is disposed in the recess 9a of the source electrode 9, fluctuations in parasitic capacitance of the TFT 1 can be suppressed.
[0019]
Therefore, when providing the liquid crystal display device by incorporating the TFT array 2 on one of the substrates opposed to each other with the liquid crystal layer interposed therebetween, it is possible to perform display while suppressing display unevenness due to variations in the parasitic capacitance of the TFT 1. Further, when the auxiliary capacitor for suppressing the influence due to the fluctuation of the parasitic capacitance is provided in the TFT 1, the capacitance can be set small, and the light shielding area by the auxiliary capacitor can be reduced to increase the aperture ratio of the liquid crystal display device. Can do.
[0020]
The shape of the tip portion 10a of the drain electrode 10 is formed using a pattern set in advance so as to round the corner. In this rounding of the corners, it is desirable to set the radius to a value larger than the resolution of the exposure apparatus, so that the difference between the design shape and the actual shape can be reduced. In this embodiment, the tip end portion 10a of the drain electrode 10 is convex toward the source electrode 9 side and has an arc shape when viewed in plan. This tip shape is the same as the original design pattern. Accordingly, it is possible to solve the problem of the fluctuation of the area of the drain 10 electrode due to rounding of the corner and the fluctuation of the parasitic capacitance due to the rounding as in the case of the square or the problem of the fluctuation of the distance between the source electrode 9 and the drain electrode 10.
[0021]
The source electrode 9 also has a concave portion 9a in an arc shape. That is. In order to make the distance between the source and drain electrodes constant, a concave arcuate recess 9a is provided on the side of the source electrode 9 facing the drain electrode 10 when viewed in plan. The arc shape of the recess 9a is formed to be concentric with the arc shape of the distal end portion 10a of the drain electrode 10. Thus, since the concave portion 9a is also formed in an arc shape concentric with the drain electrode tip 10a, the source-drain distance, that is, the channel length of the TFT 1 can be kept constant, and the transistor characteristics can be improved. The side 9b opposite to the side opposite to the drain electrode 10 of the source electrode 9 may have an arbitrary shape, but in this example, it is formed concentrically with the arc of the drain electrode tip 10a, like the recess 9a. Thus, in the embodiment shown in the figure, the tip 10a of the drain electrode 10 facing the source electrode 9, the side 9a of the source electrode 9 facing the drain electrode 10, and the side 9b of the source electrode 9 opposite to the drain electrode 10 are provided. Are formed concentrically in a plan view so that their radii are successively increased. Here, the concentric arc shape can include an elliptical shape in addition to a circle.
[0022]
The above-described rounding process in which rounding is performed in advance with a radius larger than the exposure resolution has the highest degree of influence on the parasitic capacitance and channel state of the TFT 1, particularly the tip on the side facing the source electrode 9. Although it is preferable to apply to the part 10a and the recessed part 9a of the source electrode 9 facing this tip part, it can also be applied to other parts, for example, the contact electrode 11, the connection between the contact electrode 11 and the drain electrode 10. It can also be applied to the connection portion between the source electrode 9 and the source wiring 8, the gate electrode 5, the connection portion between the gate electrode 5 and the gate wiring 4, the pixel electrode 16, and the like.
[0023]
The auxiliary capacitance electrode 12 is laminated on the gate insulating layer 6 in a state where there is almost no protrusion from the gate wiring 4 when viewed in plan. The length of the auxiliary capacitor electrode 12 is set to be substantially the same as the length of the pixel electrode 16 in the short side direction (the length in the same direction as the gate wiring 4).
[0024]
More preferably, the contact hole 15 formed in the protective layer 13 is within a projection length range of half or less when the pixel electrode 16 is projected onto the gate wiring 4, and more preferably, the TFT 1 is connected to the gate wiring as in this example. 4 so as to be within the projection length range when projected onto 4, or within the projection length range when the gate electrode 5 is projected onto the gate wiring 4, or the source electrode 9 to the gate wiring 4. It is preferable that the contact length is within the projected length range when projected, or within the projected length range when the contact electrode 11 is projected onto the gate wiring 4. Thus, in the structure in which the gate insulating layer 6, the auxiliary capacitor electrode 12, and the protective layer 13 are arranged between the gate electrode 5 and the pixel electrode 16, the contact hole is located at a position biased toward the TFT 1 side on the auxiliary capacitor electrode 12. 15 is formed, the degree of design freedom of the pixel electrode 16 on the side opposite to the contact hole 15 is increased, the pixel electrode interval can be set wide, and a structure useful for preventing a short circuit between the electrodes 16 is provided. Can do.
[0025]
The adjacent (next stage) pixel electrode 16 on the gate wiring 4 covers the contact hole 15, while the auxiliary capacitance electrode is provided on the side opposite to the side on which the contact hole 15 is formed on the auxiliary capacitance electrode 12. 12 has a cutout portion 16a that is exposed from the edge of the pixel electrode 16 when viewed in plan. The notch 16a serves to widen the interval between the portions where the pixel electrode 16 is opposed to the next-stage pixel electrode 16 with the gate wiring 4 interposed therebetween, in particular, the interval where the TFT is not interposed between the pixel electrodes 16. Therefore, it is possible to prevent the occurrence of a short circuit between adjacent pixel electrodes and the accompanying deterioration in display quality.
[0026]
Due to the presence of the notch 16a, the area where the adjacent pixel electrode 16 adjacent to the auxiliary capacitor electrode 12 overlaps on the side opposite to the TFT 1 is smaller than the TFT 1 side, and the overlapping area of the pixel electrode 16 as a whole is reduced. Although the amount of auxiliary capacitance is reduced, the majority of the auxiliary capacitance is defined by the area of the auxiliary capacitance electrode 12, so that the influence of the notch 16a on the auxiliary capacitance is very small.
[0027]
The TFT array 2 is used for a display device using a transistor for driving a display pixel, for example, a liquid crystal display device in which liquid crystal is sandwiched between two substrates or an organic or inorganic type EL display device. be able to. Further, although the above embodiment has been described by taking an example of an inverted staggered TFT using amorphous silicon, a part of the structure of the present invention can be applied to other transistors. The present invention can also be applied to a transistor using crystalline silicon as a semiconductor island and a transistor using the transistor.
[0028]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent the occurrence of a short circuit accident between pixel electrodes facing each other with a gate wiring interposed therebetween. Further, since the auxiliary capacitance electrode is provided, the auxiliary capacitance can be set large without sacrificing the aperture ratio. As a result, a liquid crystal display device with high image quality can be provided.
[Brief description of the drawings]
FIG. 1 is a plan view showing a schematic structure of a TFT array for explaining an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view along AA in FIG.
FIG. 3 is a plan view schematically showing a schematic structure of a TFT according to an embodiment of the present invention.
FIG. 4 is a plan view schematically showing a schematic structure of a conventional TFT.
[Explanation of symbols]
1 TFT
2 TFT array 5 Gate electrode 7 Semiconductor island 9 Source electrode 10 Drain electrode 12 Auxiliary capacitance electrode 13 Protective layer 14 Contact hole 15 Contact hole 16 Pixel electrode 16a Notch

Claims (2)

複数のゲート配線と複数のソース配線によって区画される領域に薄膜トランジスタとそれに接続した画素電極を配置し、ゲート配線とそれに重ねるように配置した次段の画素電極の間に、ゲート絶縁層、補助容量用の電極、保護層を介在した薄膜トランジスタ基板において、前記ゲート電極を挟んで位置する画素電極と次段の画素電極の間隔を広くするように、前記次段の画素電極が前記補助容量用電極に重なる面積を前記薄膜トランジスタ側に比べて薄膜トランジスタと反対の側が小さくなるようにし、前記画素電極と前記補助容量用の電極を接続するために前記保護層に形成したコンタクトホールを、前記薄膜トランジスタを前記ゲート配線に投影した長さ範囲内に収まるように形成したことを特徴とする薄膜トランジスタ基板。A thin film transistor and a pixel electrode connected to the thin film transistor are arranged in a region partitioned by a plurality of gate wirings and a plurality of source wirings, and a gate insulating layer and an auxiliary capacitor are arranged between the gate wiring and the next pixel electrode arranged so as to overlap with the gate wiring. In the thin film transistor substrate with the electrode and the protective layer interposed therebetween , the next-stage pixel electrode serves as the auxiliary capacitor electrode so as to widen the distance between the pixel electrode located between the gate electrode and the next-stage pixel electrode. The overlapping area is smaller on the side opposite to the thin film transistor than on the thin film transistor side, a contact hole formed in the protective layer for connecting the pixel electrode and the auxiliary capacitance electrode, and the thin film transistor is connected to the gate wiring. A thin film transistor substrate, wherein the thin film transistor substrate is formed so as to be within a length range projected onto the substrate. 一対の基板間に液晶層を挟持した液晶表示装置において、前記基板の一方の基板として請求項1に記載の基板を用いたことを特徴とする液晶表示装置。2. A liquid crystal display device having a liquid crystal layer sandwiched between a pair of substrates, wherein the substrate according to claim 1 is used as one of the substrates.
JP2000339174A 2000-11-07 2000-11-07 Thin film transistor substrate and liquid crystal display device including the same Expired - Fee Related JP3668122B2 (en)

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CN107170834A (en) * 2017-06-30 2017-09-15 上海天马微电子有限公司 Thin film transistor, array substrate and display device

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KR20040039738A (en) * 2002-11-04 2004-05-12 비오이 하이디스 테크놀로지 주식회사 Liquid crystal display device and the fabricating method thereof
CN100406971C (en) * 2004-02-03 2008-07-30 友达光电股份有限公司 Active element array substrate and liquid crystal display panel with same
KR101061856B1 (en) * 2004-11-03 2011-09-02 삼성전자주식회사 Thin film transistor array panel
CN108227327B (en) * 2018-02-28 2024-06-11 上海中航光电子有限公司 Array substrate, display panel and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107170834A (en) * 2017-06-30 2017-09-15 上海天马微电子有限公司 Thin film transistor, array substrate and display device
CN107170834B (en) * 2017-06-30 2019-11-26 上海天马微电子有限公司 Thin film transistors, array substrates, display devices

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