JP3671626B2 - Adhesive resin composition, laminate and stretched film - Google Patents
Adhesive resin composition, laminate and stretched film Download PDFInfo
- Publication number
- JP3671626B2 JP3671626B2 JP29702597A JP29702597A JP3671626B2 JP 3671626 B2 JP3671626 B2 JP 3671626B2 JP 29702597 A JP29702597 A JP 29702597A JP 29702597 A JP29702597 A JP 29702597A JP 3671626 B2 JP3671626 B2 JP 3671626B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- component
- ethylene
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title claims description 34
- 239000004840 adhesive resin Substances 0.000 title claims description 15
- 229920006223 adhesive resin Polymers 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims description 73
- 239000011347 resin Substances 0.000 claims description 72
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 64
- -1 vinyl aromatic compound Chemical class 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 41
- 229920001400 block copolymer Polymers 0.000 claims description 30
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 19
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 17
- 229920005992 thermoplastic resin Polymers 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 15
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 12
- 239000005977 Ethylene Substances 0.000 claims description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 229920000573 polyethylene Polymers 0.000 claims description 11
- 229920006122 polyamide resin Polymers 0.000 claims description 10
- 229920005672 polyolefin resin Polymers 0.000 claims description 10
- 239000004645 polyester resin Substances 0.000 claims description 9
- 229920001225 polyester resin Polymers 0.000 claims description 9
- 239000000155 melt Substances 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 8
- 238000011282 treatment Methods 0.000 claims description 8
- 150000001735 carboxylic acids Chemical class 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- 238000007127 saponification reaction Methods 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 37
- 230000001070 adhesive effect Effects 0.000 description 34
- 239000000853 adhesive Substances 0.000 description 33
- 229920001577 copolymer Polymers 0.000 description 26
- 239000003208 petroleum Substances 0.000 description 18
- 229920003048 styrene butadiene rubber Polymers 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 125000002723 alicyclic group Chemical group 0.000 description 16
- 238000005984 hydrogenation reaction Methods 0.000 description 16
- 238000002156 mixing Methods 0.000 description 16
- 238000001125 extrusion Methods 0.000 description 15
- 230000005484 gravity Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- 239000004793 Polystyrene Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- 239000008188 pellet Substances 0.000 description 11
- 229920005604 random copolymer Polymers 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 239000004743 Polypropylene Substances 0.000 description 9
- 229920001684 low density polyethylene Polymers 0.000 description 9
- 239000004702 low-density polyethylene Substances 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 7
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 7
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 7
- 239000004711 α-olefin Substances 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229920005668 polycarbonate resin Polymers 0.000 description 6
- 239000004431 polycarbonate resin Substances 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 229920001903 high density polyethylene Polymers 0.000 description 5
- 239000004700 high-density polyethylene Substances 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 229920003355 Novatec® Polymers 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- RLAWWYSOJDYHDC-BZSNNMDCSA-N lisinopril Chemical compound C([C@H](N[C@@H](CCCCN)C(=O)N1[C@@H](CCC1)C(O)=O)C(O)=O)CC1=CC=CC=C1 RLAWWYSOJDYHDC-BZSNNMDCSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229920002239 polyacrylonitrile Polymers 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 150000001336 alkenes Chemical group 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 3
- 239000004835 fabric adhesive Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000012994 photoredox catalyst Substances 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical class CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920000571 Nylon 11 Polymers 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000003205 fragrance Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- BNIXVQGCZULYKV-UHFFFAOYSA-N pentachloroethane Chemical compound ClC(Cl)C(Cl)(Cl)Cl BNIXVQGCZULYKV-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- NLBJAOHLJABDAU-UHFFFAOYSA-N (3-methylbenzoyl) 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(=O)C=2C=C(C)C=CC=2)=C1 NLBJAOHLJABDAU-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- KIIBETRYVBIAOO-UHFFFAOYSA-N 1,2-diphenylethylbenzene Chemical compound C=1C=CC=CC=1CC(C=1C=CC=CC=1)C1=CC=CC=C1 KIIBETRYVBIAOO-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HBKBEZURJSNABK-MWJPAGEPSA-N 2,3-dihydroxypropyl (1r,4ar,4br,10ar)-1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylate Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(=O)OCC(O)CO HBKBEZURJSNABK-MWJPAGEPSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- JQXYBDVZAUEPDL-UHFFFAOYSA-N 2-methylidene-5-phenylpent-4-enoic acid Chemical compound OC(=O)C(=C)CC=CC1=CC=CC=C1 JQXYBDVZAUEPDL-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- OQEBBZSWEGYTPG-UHFFFAOYSA-N 3-aminobutanoic acid Chemical compound CC(N)CC(O)=O OQEBBZSWEGYTPG-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- KSMVBYPXNKCPAJ-UHFFFAOYSA-N 4-Methylcyclohexylamine Chemical compound CC1CCC(N)CC1 KSMVBYPXNKCPAJ-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920001824 Barex® Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000832 Cutin Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004420 Iupilon Substances 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000577 Nylon 6/66 Polymers 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- 229920006465 Styrenic thermoplastic elastomer Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229920010346 Very Low Density Polyethylene (VLDPE) Polymers 0.000 description 1
- 239000004708 Very-low-density polyethylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical group OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- UBAZGMLMVVQSCD-UHFFFAOYSA-N carbon dioxide;molecular oxygen Chemical compound O=O.O=C=O UBAZGMLMVVQSCD-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- IYKVBPXFMRUBAM-UHFFFAOYSA-N ethene;4-methylpent-1-ene Chemical compound C=C.CC(C)CC=C IYKVBPXFMRUBAM-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- 239000005003 food packaging material Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000120 polyethyl acrylate Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- MSFGZHUJTJBYFA-UHFFFAOYSA-M sodium dichloroisocyanurate Chemical compound [Na+].ClN1C(=O)[N-]C(=O)N(Cl)C1=O MSFGZHUJTJBYFA-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 238000004394 yellowing prevention Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、食品包装材料等種々の分野で幅広く必要とされているガスバリア性(酸素、炭酸ガス等)、耐内容物性(フレーバー性、保香性)、意匠性(表面光沢性、透明性)、機械的強度、収縮性等が改良された積層体を得る接着用樹脂組成物、積層体および該積層体を延伸してなる延伸フィルムに関する。
【0002】
【従来の技術】
ポリプロピレン、ポリエチレン、エチレン−酢酸ビニル共重合体等のPO系樹脂は、各種分野で幅広く利用されているが、PO系樹脂は、成形性、機械強度、耐薬品性やヒートシール性に優れるが、ガスバリア性や保香性に劣り、成形手法や樹脂種によっては意匠性(表面光沢、透明性)が劣る等の欠点を有している。
【0003】
この欠点の改良手法として、ガスバリア性に優れたEVOHやPA系樹脂との積層、さらに耐内容物性や意匠性改良の為、PES系樹脂との積層等が提案されている。
しかし、PO系樹脂は極性を有しない為、EVOH、PA系樹脂およびPES系樹脂と直接積層しても、積層後の層間接着力が非常に低く実用に耐えない。
【0004】
そこで、種々接着剤を用い積層する手法が提案されている。
例えば、PO系樹脂とEVOHやPA系樹脂等の極性樹脂との接着に関しては、不飽和カルボン酸等で変性したポリオレフィン系接着性樹脂が提案されている。
また、PO系樹脂とEVOH、PA系樹脂以外の積層体、すなわちPO系樹脂とPES系樹脂、PC系樹脂、アクリル系樹脂またはPS系樹脂との積層体、およびPS系樹脂とEVOH、PA系樹脂、PES系樹脂等との積層体用としては、オレフィン系ポリマーと粘着付与剤として脂環族または芳香族の重合物との組成物を接着材として用い積層する方法(特開昭50−116536号公報)、エチレン−酢酸ビニル共重合体(以下EVAと称する)と粘着付与剤との組成物を接着材として用い積層する方法(特開昭53−147733号公報、特開昭54−10384号公報等)、EVAと変性ポリオレフィンおよび粘着付与剤として脂肪族石油樹脂との組成物を接着材として用い積層する方法(特開昭53−127546号公報)、変性低結晶性エチレン−α−オレフィンランダム共重合体と粘着付与剤との組成物を接着材として用い積層する方法(特開昭61−241144号公報)、低結晶性(低密度の)エチレン−α−オレフィンランダム共重合体と粘着付与剤および変性ポリエチレンとの組成物を接着材として用い積層する方法(特開昭61−162539号公報)、スチレン系熱可塑性エラストマーと粘着剤と低分子量ポリプロピレンおよびプロセスオイルの混合物よりなるホットメルト接着剤組成物(特開平1−144483号公報)を接着材として用い積層する方法、スチレン系熱可塑性エラストマーと脂環族系粘着剤および環状オレフィンランダム共重合体よりなるホットメルト型粘着剤組成物(特開平3−223381号公報)を接着材として用い積層する方法が提案されている。
【0005】
また、最近では各種包装材のさらなる性能向上の為、共押出成形品を延伸し、強度やガスバリア性の改良、さらには収縮包装分野への適用等が試みられ、延伸積層フィルムおよびその製造方法(特開昭52−146487号公報)、熱収縮性多層フィルムおよびその包装体(特開昭57−205147号公報、58−8644号公報)、熱収縮性多層フィルムおよびその製造法(特開昭59−152853号公報)、熱可塑性ポリエステル組成物の二軸延伸成形体(特開昭60−76325号公報)、二軸延伸積層体の製造方法(特開昭60−82324号公報)、熱収縮包装フィルム(特開昭61−94753号公報)等に於いて、無水マレイン酸変性ポリエチレン、無水マレイン酸変性ポリプロピレン、無水マレイン酸変性エチレン−酢酸ビニル共重合体、無水マレイン酸変性エチレン−1−ブテン共重合体とスチレン変性非晶性エチレン−プロピレン共重合体、無水マレイン酸変性スチレン−ブタジエン共重合体の水素添加物を適用することが提案されている。
【0006】
【発明が解決しようとする課題】
しかしながら、何れの手法を用いた共押出積層体でも、冷却固化後、再加熱し縦方向、横方向共に少なくとも1.5倍以上延伸成形すると、極端に接着強度が低下し実用領域に達していない。また常温では実用領域に到達できても、成形性が悪く、ホットフィル等の高温状態での接着強度が低い等用途上の問題が多いのが現状である。
かかる状況に鑑み、本発明は、EVOH、PA系樹脂、PO系樹脂、PS系樹脂、PES系樹脂、アクリル系樹脂、PC系樹脂等との延伸後の接着強度に優れ、且つフィルム、シート、ブロー等の押出成形適性にも優れた接着用樹脂組成物、これを用いた積層体および該積層体の延伸フィルムを提供することを目的とする。
【0007】
【課題を解決するための手段】
本発明者らはこれらの問題を解決し、加工性、接着性および熱安定性の向上を目的として鋭意検討した結果、以下の手段により性能が飛躍的に向上することを見い出し、本発明に到達した。
【0008】
すなわち本発明は、下記(a)成分および(b)成分を含有するとともに、下記(a)成分および(b)成分の合計量に対し、(a)成分が50〜99重量%および(b)成分が1〜50重量%である接着用樹脂組成物を提供するものである。
(a)成分:ビニル芳香族化合物と共役ジエン化合物とのブロック共重合体を水添してなる水添ブロック共重合体が不飽和カルボン酸またはその誘導体で変性され、且つ該不飽和カルボン酸またはその誘導体の含量が(a)成分中0.01〜20重量%である変性水添ブロック共重合体。
(b)成分:粘着付与剤。
【0009】
また本発明は、前記(a)成分50〜99重量%および(b)成分1〜50重量%からなる材料100重量部に対し、下記(c)成分を10〜1000重量部含有してなる前記の接着用樹脂組成物を提供するものである。
(c)成分:メルトフローレート0.05〜50g/10分および密度0.850〜0.950g/cm3であるエチレン系重合体。
【0010】
さらに本発明は、水添ブロック共重合体において、その共役ジエン化合物からなる重合体ブロックのオレフィン型二重結合の50%以上が水素添加されている前記の接着用樹脂組成物を提供するものである。
【0011】
さらにまた本発明は、エチレン含量が15〜65モル%であり、且つ鹸化度が90%以上のエチレン−酢酸ビニル共重合体鹸化物、ポリアミド系樹脂、ポリオレフィン系樹脂、スチレン系樹脂、ポリエステル系樹脂、アクリル系樹脂およびポリカーボネート系樹脂からなる群より選ばれた少なくとも1種以上の熱可塑性樹脂の層(A層)と、前記の接着用樹脂組成物からなる層(B層)とからなる積層体を提供するものである。
【0012】
また本発明は、前記の積層体を少なくとも一軸方向に面積比で1.5倍以上延伸処理を施して得られる延伸フィルムを提供するものである。
【0013】
さらにまた本発明は、前記の積層体を二軸方向に面積比で1.5倍以上延伸処理を施して得られる延伸フィルムを提供するものである。
【0014】
【発明の実施の形態】
(1)変性水添ブロック共重合体(a)
本発明で用いる変性水添ブロック共重合体(a)とは、ビニル芳香族化合物と共役ジエン化合物とのブロック共重合体を水添してなる水添ブロック共重合体が不飽和カルボン酸またはその誘導体で変性され、または、この変性物を未変性の水添ブロック共重合体で希釈したものであって、該不飽和カルボン酸またはその誘導体の含量が0.01〜20重量%のものである。さらに好ましい不飽和カルボン酸またはその誘導体の含量は0.05〜15重量%、とくに好ましくは0.1〜7重量%である。ブロック共重合体とは、ブロックAがビニル芳香族化合物、ブロックBが共役ジエン化合物であるときに、一般式A−B、A−B−A、B−A−B−A、A−B−A−B−A等で表されるブロック共重合体で、重合体ブロック部Aを構成するビニル芳香族化合物を主成分とする化合物としては、例えばスチレン、α−メチルスチレン、ビニルトルエン等のうちから1種以上が選ばれ、中でもスチレンが好ましい。
【0015】
また、重合体ブロック部Bを構成する共役ジエン化合物としては、例えばブタジエン、イソプレン、1,3ペンタジエン等のうちから1種以上が選ばれ、中でもブタジエン、イソプレンおよびこれらの組み合わせが好ましい。
Aブロックとなるビニル芳香族化合物を主体とする重合体ブロックの含量は好ましくは10〜80重量%、さらに好ましくは10〜70重量%がよい。本重合体ブロックの含量が、少な過ぎる場合、あるいは多過ぎる場合には、十分な接着強度が得られない。
共役ジエン化合物を主成分とする重合体ブロックの水添率は、一般的には50%以上、好ましくは80%以上、より好ましくは90%以上、とくに好ましくは95%以上であり、高いほど熱安定性が向上するので特に好ましい。
【0016】
水添ブロック共重合体の数平均分子量は、好ましくは10,000〜400,000程度、さらに好ましくは20,000〜300,000である。分子量は、大き過ぎても、小さ過ぎても接着強度の低下傾向となり、また、数平均分子量が大き過ぎるものは、本組成物の加工性が低下傾向となる。
また、水添ブロック共重合体の数平均分子量が400,000以下であっても、高めの場合は、プロセスオイル、液状ポリブタジエン、数平均分子量が6,000以下のオレフィン系ワックス等の中から選ばれた流動性改良剤を、水添ブロック共重合体に対し1〜40重量%程度添加することにより、接着強度および加工性の低下を抑えることが可能となり、有効な手段である。本発明における水添ブロック共重合体においては、A−B−A構造を有するブロック共重合体を含むことが好ましく、具体的に市販品としては、水添スチレン−ブタジエン系ブロックコポリマーとして“タフテック”Hタイプ(旭化成(株))、“クレイトン”G1600タイプ(シェル化学製)、水添スチレン−イソプレン系ブロックコポリマーとして“セプトン”2000タイプ((株)クラレ製)等が挙げられる。また、A−B構造を有する水添スチレン−イソプレン系ブロックコポリマー“セプトン”1000タイプ((株)クラレ製)、“クレイトン”G1700タイプ(シェル化学社製)等が挙げられる。
【0017】
さらに、上記水添ブロック共重合体は2種類以上混合して使用することも可能である。
次に、本発明における変性水添ブロック共重合体(a)とは、上記水添ブロック共重合体に不飽和カルボン酸またはその誘導体をグラフト重合したものである。
【0018】
グラフト重合して変性物を製造するには、従来より公知の種々の方法を採用することができる。例えば、上記のような水添ブロック共重合体、グラフトモノマー、ラジカル発生剤を事前に混合し押出機で溶融させグラフト共重合させる方法や、あるいは水添ブロック共重合体を溶媒に溶解させ、ラジカル発生剤とグラフトモノマーを添加してグラフト共重合させる方法等がある。
グラフト反応温度は通常80〜300℃で行うのが好ましい。
ラジカル発生剤の一般的な使用量は、水添ブロック共重合体100重量部に対して通常0.001〜8重量部の範囲が好ましい。
ラジカル発生剤としては有機過酸化物が一般的に用いられ、例えば2,5−ジメチルヘキサン−2,5−ジヒドロペルオキシド、2,5−ジメチル−2,5−ジ(t−ブチルペルオキシ)−3−ヘキシン、ジ−t−ブチルペルオキシド、t−ブチルクミルペルオキシド、2,5−ジメチル−2,5−ジ(t−ブチルペルオキシ)ヘキサン、ジクミルペルオキシド、t−ブチルペルオキシベンゾエート、t−ブチルペルオキシアセテート、t−ブチルペルオキシイソプロピルカーボネート、ベンゾイルペルオキシド、m−トルオイルペルオキシド等が好ましい。
【0019】
不飽和カルボン酸またはその誘導体としては、アクリル酸、マレイン酸、フマール酸、イタコン酸、シトラコン酸などの不飽和カルボン酸、またはその誘導体、例えば無水物、アミド、エステルなどであり、単独または2種以上が用いられる。これらの内では、不飽和ジカルボン酸またはその酸無水物が好適であり、特にマレイン酸またはその無水物が好適である。
そのグラフト量(測定法;赤外分光光度計)は、好ましくは0.01〜20重量%である。このグラフト量が少な過ぎると接着性が劣り、多過ぎるとグラフト共重合時に一部架橋を起こし成形性が劣ると同時に、フィシュアイ、ブツ等による製品外観が悪化し、且つ、接着性も低下する。
変性水添ブロック共重合体(a)には、変性手法によっては未反応のグラフトモノマーが残存することがあるが、接着性、食品容器の接着材として使用したときの衛生性等の観点より出来るだけ残存させない方が好ましい。従って、各種除去手法、例えば、アセトン等の貧溶媒による抽出、加熱乾燥処理による未反応グラフトモノマーの脱気等の後処理を必要に応じて行うことが好ましい。
【0020】
(2)粘着剤(b)
本発明で用いる粘着剤(b)とは、常温では固体の非晶性樹脂であり、中でも石油樹脂、ロジン系樹脂、テルペン系樹脂またはそれらの水添物が好ましく、市販のものから適宜選択して用いることができる。
石油樹脂としては、例えば、脂肪族系石油樹脂、芳香族系石油樹脂、またはそれらの共重合体、およびこれらの水添物などがあり、具体的には市販品としてトーホーハイレジン(東邦石油樹脂(株))、ピコペール(ピコ社)、アルコンPおよびM(荒川化学工業(株))、アドマープ(出光石油化学工業(株))、スーパースタータック(ライヒルホールド(株))、エスコレッツ(エッソ化学(株))、トーホーペトロレジン(東燃石油樹脂(株))、ハイレッツ(三井石油化学(株))、クイントン(日本ゼオン(株))などが挙げられる。
ロジン系樹脂として、天然ロジン、重合ロジンおよびそれらの誘導体例えば、ペンタエリストエステルロジン、グリセリンエステルロジンおよびそれらの水添物などであり、具体的には市販品としてガムロジン、ウッドロジン、エステルガムA、ペルセンA、ペンセンC(荒川化学工業(株))、ペンタリンA、ペンタリンC、フォーラル105(理化ハーキュレス(株))などが挙げられる。
テルペン系樹脂として、ポリテルペン系樹脂、テルペンフェノール系樹脂およびそれらの水添物が挙げられ、具体的には市販品としてピコライトS、およびA(ピコ社)、YSレジン、クリアロン(安原油脂(株))などが挙げられる。
【0021】
本発明においてはこれら粘着付与剤を用途により使い分けることができるが、これらの粘着付与剤の中でも、軟化点(環球法)が、好ましくは70〜150℃、とくに好ましくは90〜150℃のものが用いられる。軟化点が低過ぎると接着強度が劣ると同時に、水添ブロック共重合体やエチレン系重合体との溶融混練が難しい。また、本発明の接着性樹脂組成物の色相をできる限り自然色(白色または無色透明、黄色の着色防止)に近付けるためには、脂肪族系石油樹脂、芳香族系石油樹脂、またはそれらの共重合体が好ましく、とくにその水添物が好ましい。その水添率は好ましくは80%以上、より好ましくは90%以上である。
【0022】
(3)エチレン系重合体(c)
本発明において必要に応じて用いるエチレン系重合体(c)とは、メルトフローレート0.05〜50g/10分、密度0.850〜0.950g/cm3のエチレン単独重合体またはエチレン−α−オレフィン共重合体である。エチレン−α−オレフィン共重合体を構成するα−オレフィンは、通常炭素数3〜20の環状分子を含まないα−オレフィン、例えばプロピレン、1−ブテン、1−ヘキセン、4−メチル−1−ペンテン、1−オクテン、1−デセン、1−テトラデセン、1−オクタデセン等であり、それぞれ単独あるいは2種以上の混合物からなる。またビニルエステル(酢酸ビニル等)、不飽和カルボン酸またはそのエステル(アクリル酸、メタクリル酸、アクリル酸メチル、メタクリル酸メチル、アクリル酸エチル等)等を使用してもよい。さらに、エチレン系重合体(c)は2種類以上混合して使用することも可能である。
【0023】
具体例としては、低密度ポリエチレン(LDPE)、高密度ポリエチレン(HDPE)、中密度ポリエチレン(MDPE)、直鎖状低密度ポリエチレン(LLDPE)、超低密度ポリエチレン(VLDPE)、低結晶性エチレン−ブテン−1ランダム共重合体(EBM)、エチレン−プロピレン共重合体、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸共重合体、エチレン−アクリル酸エステル共重合体等であり、中でもLDPEとVLDPEが好ましい。 なお、ここでいうメルトフローレート(MFR)とは、JIS K7210に準拠し、温度190℃、荷重2.16kg、10分の条件で測定した値を意味する。
【0024】
(4)組成物の配合割合
上記各成分の配合割合は、(a)成分および(b)成分の合計量に対し、変性水添ブロック共重合体(a)50〜99重量%、好ましくは50〜98重量%、とくに好ましくは50〜95重量%、および粘着付与剤(b)1〜50重量%、好ましくは2〜50重量%、とくに好ましくは5〜50重量%であり、また、この成分(a)と成分(b)との合計100重量部に対してエチレン系重合体(c)10〜1000重量部、好ましくは13〜950重量部、とくに好ましくは15〜900重量部である。
(i)粘着付与剤(b)が1重量%未満では各被着材への接着性が低下するため好ましくなく、一方50重量%を超えると流動性が高くなりすぎ成形性が悪化する傾向にあるので好ましくない。
(ii)エチレン系重合体(c)を、10重量部以上添加することによって成形性、取り扱いが極めて改良でき、1000重量部を超えて添加すると接着力が極端に低下傾向にあり好ましくない。
【0025】
(5)組成物の製造方法
本発明の接着性樹脂組成物は、種々公知の手法、例えばタンブラーブレンダー、Vブレンダー、リボンブレンダー、ヘンシェルミキサー等を用いて混合し、混合後、単軸押出機、二軸押出機、バンバリーミキサー、ニーダー等で溶融混練し、造粒あるいは粉砕する手法により調製することができる。
なお、組成物には前記成分に加えて、耐熱安定剤、耐候安定剤、ブロッキング防止剤、スリップ剤、帯電防止剤、難燃剤、触媒残渣の中和剤、顔料、染料、無機および/または有機フィラー等一般的に用いられている添加剤を本発明の目的を損なわない範囲で配合することができる。
本発明の樹脂組成物は、後述する種々の熱可塑性樹脂との接着力に優れるので、該熱可塑性樹脂との積層体および該積層体を延伸して得られる延伸フィルムとして利用できる。
【0026】
(6)熱可塑性樹脂の層(A層)
本発明では、接着用樹脂組成物からなる層(B層)と積層される熱可塑性樹脂の層(A層)として、エチレン−酢酸ビニル共重合体鹸化物、ポリアミド系樹脂、ポリオレフィン系樹脂、スチレン系樹脂、ポリエステル系樹脂、アクリル系樹脂およびポリカーボネート樹脂等の熱可塑性樹脂が用いられる。前記熱可塑性樹脂としては、具体的にはエチレン含量が15〜65モル%であり、且つ鹸化度が90%以上のエチレン−酢酸ビニル共重合体鹸化物(EVOH);ポリエチレンテレフタレート(PET)、共重合PET、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリシクロヘキシレンテレフタレート等のポリエステル系樹脂(PES系樹脂);6−ナイロン、6,6−ナイロン、6−6,6−ナイロン、12−ナイロン、キシリレン基含有ポリアミド樹脂等のポリアミド系樹脂(PA系樹脂);ポリプロピレン系樹脂、ポリエチレン系樹脂、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸共重合体、エチレン−アクリル酸エステル共重合体、4−メチル−1−ペンテン樹脂等のポリオレフィン系樹脂(PO系樹脂);一般用ポリスチレン、耐衝撃性ポリスチレン、スチレン−メタクリル酸共重合体等のスチレン系樹脂(PS系樹脂);ポリアクリロニトリル、ポリメチルメタクリレート、アクリロニトリル−メチルアクリレート−ブタジエン共重合体等のアクリル系樹脂;およびポリカーボネート樹脂(PC系樹脂);さらに、前記樹脂と板状フィラー等の充填材との混合物より選ばれた1種以上の材料が挙げられる。
【0027】
熱可塑性樹脂の層(A層)に用いるエチレン−酢酸ビニル共重合体鹸化物としては、エチレン含有量が好ましくは15〜65モル%、さらに好ましくは25〜50モル%のエチレン−酢酸ビニル共重合体を、その鹸化度が好ましくは50%以上、さらに好ましくは90%以上になるように鹸化したものが用いられる。エチレン含有量が少な過ぎる場合には、熱分解し易く、溶融成形が困難で、また延伸性にも劣り、かつ吸水し膨潤し易く耐水性が劣る。一方エチレン含有量が多過ぎる場合には、耐ガス透過性が低下する傾向がある。また、鹸化度が低過ぎる場合には、耐ガス透過性が低下する傾向がある。
【0028】
熱可塑性樹脂の層(A層)に用いるポリアミド系樹脂としてはヘキサメチレンジアミン、デカメチレンジアミン、ドデカメチレンジアミン、2,2,4−または2,4,4−トリメチルヘキサメチレンジアミン、1,3−または1,4−ビス(アミノメチル)シクロヘキサン、ビス(p−アミノシクロヘキシルメタン)、m−またはp−キシリレンジアミンなどの脂肪族、脂環族、芳香族などのジアミンとアジピン酸、スベリン酸、セバシン酸、シクロヘキサンジカルボン酸、テレフタル酸、イソフタル酸などの脂肪族、脂環族、芳香族などのジカルボン酸との重縮合によって得られるポリアミド、ε−アミノカプロン酸、11−アミノウンデカンカルボン酸などのアミノカルボン酸の縮合によって得られるポリアミド、ε−カプロラクタム、ω−ラウロラクタムなどのラクタムから得られるポリアミドあるいはこれらの成分からなる共重合ポリアミドの混合物などが例示される。具体的にはナイロン6、ナイロン66、ナイロン610、ナイロン9、ナイロン11、ナイロン12、ナイロン6/66、ナイロン66/610、ナイロン6/11などが挙げられる。これらの中では、融点、剛性などが優れるナイロン6、ナイロン66が好ましい。また分子量もとくに限定はされないが、通常相対粘度ηr(JIS K6810、98%硫酸中で測定)が0.5以上のポリアミドが用いられるが、中でも2.0以上のものが好ましい。
【0029】
熱可塑性樹脂の層(A層)に用いるポリオレフィン系樹脂とは、炭素数2〜4のα−オレフィンであるエチレン、プロピレン、1−ブテン等の単独あるいはこれらを主成分とする結晶性の重合体である。これらポリオレフィン系樹脂としては具体的にはポリエチレン、ポリプロピレンおよびポリ−1−ブテンが挙げられるが、これらはいずれも単独重合体に限らず、それらオレフィンを主成分とする限り、他の炭素数2〜20のα−オレフィンあるいは酢酸ビニル、塩化ビニル、アクリル酸、メタクリル酸、スチレン等のビニル化合物との共重合体をも含むものであり、また無水マレイン酸、マレイン酸、アクリル酸等の不飽和カルボン酸あるいはその誘導体でグラフト変性されたグラフト共重合体でもよい。さらにこれらのポリオレフィンは混合物であってもよい。
【0030】
前記ポリエチレンの具体例としては、たとえば高圧法低密度ポリエチレン(LDPE)、エチレン−プロピレン共重合体、エチレン−1−ブテン共重合体、エチレン−4−メチル−1−ペンテン重合体、エチレン−1−ヘキセン共重合体、高密度ポリエチレン(HDPE)、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸共重合体、エチレン−アクリル酸エステル共重合体などが挙げられる。これらの中では、LDPE、エチレン−α−オレフィンランダム共重合体、エチレン−酢酸ビニル共重合体などが透明性、低温ヒートシール性に優れるので好ましく、とりわけ密度が0.910〜0.960g/cm3および融点が100〜135℃の範囲のものが好ましい。なお、ポリエチレンのメルトフローレートはとくに限定はされないが、成形性の点から通常0.01〜30g/10分さらには0.1〜10g/10分の範囲のものが好ましい。
【0031】
前記ポリプロピレンの具体例としては、例えばポリプロピレン(プロピレンホモポリマー)、プロピレン−エチレンランダム共重合体、プロピレン−エチレン−1−ブテンランダム共重合体およびプロピレン−1−ブテンランダム共重合体などのプロピレンランダムコポリマー(プロピレン含有量が通常90モル%以上、好ましくは95%モル以上)、プロピレン−エチレンブロック共重合体(エチレン含有量が通常5〜30モル%)などが挙げられる。これらの中ではホモポリマー、ランダムコポリマーが透明性で優れるので好ましく、特に融点が130〜140℃のランダムコポリマーがヒートシール性に優れるので好ましい。なお、プロピレンのメルトフローレートは特に限定はされないが、成形性の点から通常0.5〜30g/10分、さらには0.5〜10g/10分の範囲のものが好ましい。
【0032】
前記ポリ−1−ブテンの具体例としては、例えば1−ブテン単独重合体、1−ブテン−エチレン共重合体、1−ブテン−プロピレン共重合体、1−ブテン−4−メチル−1−ペンテン共重合体が挙げられる。なお、ポリ−1−ブテンのメルトフローレートはとくに限定されないが、成形性の点から通常0.01〜100g/10分さらには0.03〜30g/10分の範囲のものが好ましい。
【0033】
熱可塑性樹脂の層(A層)に用いるスチレン系樹脂とはスチレンの単独重合体、スチレンとアクリロニトリル、メチル(メタ)アクリレートなどの共重合体あるいはそれらのゴム変性物等のスチレンを主体とした樹脂であり、具体的にはポリスチレン、耐衝撃性ポリスチレン(ゴム配合ポリスチレン)、AS樹脂(SAN)、ABS、SMA(スチレン−無水マレイン酸重合体)などと呼称されている熱可塑性樹脂が用いられる。ポリスチレンは、通常メルトフローレートが0.1〜50g/10分、好ましくは1〜20g/10分の範囲のものである。MFRが上記範囲外のものは成形性が低下する傾向にある。
【0034】
熱可塑性樹脂の層(A層)に用いるポリエステル系樹脂とは、テレフタル酸、イソフタル酸、ジフェニルエーテル−4,4−ジカルボン酸、ナフタレン−1,4−または2,6−ジカルボン酸などの芳香族ジカルボン酸、シュウ酸、コハク酸、アジピン酸、セバシン酸、ウンデカジカルボン酸などの脂肪族ジカルボン酸、ヘキサヒドロテレフテル酸などの脂環族ジカルボン酸などのジカルボン酸の酸成分と、エチレングリコール、プロピレングリコール、1,4−ブタンジオール、ネオペンチルグリコールなどの脂環族グリコール、シクロヘキサンジメタノールなどの脂環族グリコール、ビスフェノールAなどの芳香族ジヒドロキシ化合物などのグリコール成分とからなるものであり、ポリエチレンテレフタレート(PET)、共重合体PET、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリシクロヘキシンテレフタレート等が挙げられる。
この中でとくに好ましいのは、ポリエチレンテレフタレート(PET)であり、通常ジカルボン酸成分の80モル%以上がテレフタル酸であり、グリコール成分の80モル%以上がエチレングリコールである熱可塑性ポリエステル樹脂である。さらに、共重合体PETでもPETと他のポリエステルとの混合物であってもよい。
【0035】
熱可塑性樹脂の層(A層)に用いるアクリル系樹脂とは、ポリアクリル酸メチル、ポリアクリル酸エチル、ポリアクリル酸ブチル、ポリアクリル酸−2−エチルヘキシル、ポリメタクリル酸メチル、ポリアクリロニトリル、ポリメタクリロニトリル、メタクリル酸メチル−アクリロニトリル共重合体、メタクリル酸メチル−α−メチルスチレン共重合体等を例示することができる。さらに、スチレン−アクリロニトリル共重合体、スチレン−アクリロニトリル−ブタジエン共重合体、スチレン−メタクリル酸メチル共重合体等であってもよい。中でもポリアクリロニトリルおよびスチレン−アクリロニトリル−ブタジエン共重合体が好ましい。
これらのアクリル系樹脂は、市販品の中から適宜選んで用いることができ、また本発明の効果を損ねない範囲で、各種可塑剤、安定剤、無機フィラー、帯電防止剤や顔料等の添加剤を配合したものであってもよい。
【0036】
熱可塑性樹脂の層(A層)に用いるポリカーボネート樹脂とは、ジヒドロキシ化合物とホスゲンまたはジフェニルカーボネートとを公知の方法で反応させて得られる種々のポリカーボネートである。ジヒドロキシ化合物としては、ハイドロキノン、レゾルシノール、4,4’−ジヒドロキシジフェニルメタン、4,4’−ジヒドロキシジフェニルエタン、4,4’−ジヒドロキシジフェニル−n−ブタン、4,4’−ジヒドロキシジフェニルヘプタン、4,4’−ジヒドロキシジフェニルメタン、4,4’−ジヒドロキシジフェニル−2,2−プロパン(ビスフェノールA)、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニル−2,2−プロパン、4,4’−ジヒドロキシ−3,3’−ジフェニルジフェニル−2,2−プロパン、4,4’−ジヒドロキシジクロロジフェニル−2,2−プロパン、4,4’−ジヒドロキシジフェニル−1,1−シクロペンタン、4,4’−ジヒドロキシジフェニル−1,1−シクロヘキサン、4,4’−ジヒドロキシ−ジフェニルメチルフェニルメタン、4,4’−ジヒドロキシジフェニルエチルフェニルメタン、4,4’−ジヒドロキシジフェニル−2,2,2−トリクロロ−1,1−エタン、2,2’−ジヒドロキシジフェニル、2,6−ジヒドロキシナフタレン、4,4’−ジヒドロキシジフェニルエーテル、4,4’−ジヒドロキシ−3,3’−ジクロロジフェニルエーテル及び4,4’−ジヒドロキシ−2,5−ジエトキシフェニルエーテル等が用いられる。このうち4,4’−ジヒドロキシ−ジフェニル−2,2−プロパン(ビスフェノールA)を用いたポリカーボネートが機械的性能、透明性に優れているので好ましい。
【0037】
(7)積層体の製造方法
本発明の積層体を製造する方法としては、従来より公知の種々手法を採用する事が出来る。
例えば、押出機で溶融させた、個々の溶融樹脂を多層ダイスに供給し、ダイスの中で積層する共押出し手法によるインフレーションフィルム、T−ダイフィルム、シート、パイプや、溶融した個々の樹脂を同一金型内にタイムラグを付けインジェクションする、共インジェクション成形により未延伸状態試験管状のパリソン等の共押出積層を行うものである。
【0038】
(8)延伸フィルムの製造
本発明の延伸フィルムを製造する方法としては、従来より公知の種々の方法を採用することができる。
例えば、上記(7)から得られた未延伸の(多層)積層体を冷却固化後、各成形品をインライン、またはアウトラインで60〜160℃の延伸温度まで再加熱し、テンター、プラグおよび圧縮空気等を用い一軸方向、あるいは二軸方向に少なくとも面積比で1.5倍以上延伸を行い、一軸または二軸延伸成形したフィルム、カップ、ボトル等の成形体を得る方法が挙げられる。
インフレフィルムの場合、インフレ同時二軸延伸法、Tダイフィルムの場合テンター同時二軸延伸法、ロールおよびテンターに因る逐次二軸延伸法等、カップの場合、金型内で圧縮空気等のみによる圧空成形、プラグと圧縮空気を併用するSPPF成形等、ボトルの場合、積層パイプを縦に延伸後、金型内で圧縮空気等で横に延伸するパイプ延伸法、インジェクション成形により試験管状の有底パリソンを成形し、有底パリソンを金型内でロッドにより縦方向に延伸後、圧縮空気等により横方向に延伸する有底パリソン延伸法等が一般的に用いられる。
延伸フィルムは所望に応じて、本発明の接着性樹脂組成物を介在させて2層以上の多層にすることができる。
【0039】
また、本発明の延伸フィルムは必要に応じて、さらに延伸後再加熱、すなわちヒートセットを行うことにより耐熱性を向上する(収縮性はやや低下する)ことができる。
【0040】
【実施例】
以下、本発明を実施例により具体的に説明する。
(1)積層体の製造は以下のAまたはB法にて実施した。
▲1▼A法:2種3層共押出水冷インフレーションフィルム成形法
層構成は内層から外層に向かって、各種被着材/接着材/各種被着材とした。各層の厚さはいずれも100μmとした。
押出機のダイス幅は内層から外層に向かって40mmφ/35mmφ/ 40mmφ とした。
被着材別成形条件を以下に示す。
共押出温度
ポリエステル系樹脂=275℃
ポリアミド系樹脂=250℃
エチレン−酢酸ビニル共重合体鹸化物=230℃
アクリル系樹脂=220℃
スチレン系樹脂=220℃
ポリカーボネート樹脂=275℃
ポリオレフィン系樹脂=230℃
成形速度は5m/分に設定した。
▲2▼B法:3種5層共押出シート成形法
層構成は内層から外層に向かって、各種被着材/接着材/ガスバリア性樹脂/接着材/各種被着材とし、それぞれの厚さは、220μm/40μm/50μm/40μm/220μmとした。
押出機のダイス幅は65mmφ/45mmφ/45mmφ/45mmφ/65mmφとした。
被着材別成形条件を以下に示す。
共押出温度
ポリエステル系樹脂=235℃
ポリアミド系樹脂=250℃
エチレン−酢酸ビニル共重合体鹸化物=230℃
アクリル系樹脂=220℃
スチレン系樹脂=220℃
ポリカーボネート樹脂=275℃
ポリオレフィン系樹脂=200℃
成形速度は5m/分に設定した。
【0041】
(2)積層体の延伸は以下の方法にて実施した。
テンター法
標準型二軸延伸機:T.M.Long社製
延伸最大倍率:7.2×7.2倍
延伸速度:7.6〜3000cm/分
加熱方式:熱風循環(室温〜350℃)
延伸ヘッド駆動:油圧シリンダー
延伸可能試料厚み:0.08〜2mm
延伸倍率:3.3×3.3倍
【0042】
なお、実施例および比較例の評価項目は以下の手法にて評価した。
(3)積層体の接着強度(kg/10mm)は、JIS K−6854に準拠して下記条件で測定した。
剥離幅:10mm
剥離状態:Tピール剥離
剥離速度:50mm/分
温度:23℃および60℃
【0043】
(4)ボイル処理
A法およびB法で作成した本発明の積層体を3.3×3.3倍に延伸して得られたフィルムを用いて行った。
PE袋に延伸フィルムを入れヒートシールで封入し、90℃の熱水中で30分間処理し、その後熱水より取り出し、23℃の水中で冷却(約30分)しサンプルを得た。
【0044】
(実施例1)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン比:30重量%、水添率:98%)90重量%、および粘着付与剤(脂環族系石油樹脂、数平均分子量:860、比重:0.999、軟化点140℃)10重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0045】
(実施例2)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン重量比:30%、水添率:98%)20重量%、粘着付与剤(脂環族系石油樹脂、数平均分子量:710、比重:0.998、軟化点115℃)30重量%およびスチレン−ブタジエン共重合体水添物(スチレン比:30重量%、MFR−200℃5kg:3.5g/10分)50重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0046】
(実施例3)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン比:30重量%、水添率:98%)30重量%、粘着付与剤(脂環族系石油樹脂、数平均分子量:710、比重:0.998、軟化点115℃)20重量%およびエチレン−ブテン共重合体(密度:0.900g/cm3、融点:88℃、MFR−190℃2.16kg:5g/10分)50重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0047】
(実施例4)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン重量比:30%、水添率:98%)10重量%、粘着付与剤(脂環族系石油樹脂、数平均分子量:860、比重:0.999、軟化点140℃)20重量%、スチレン−ブタジエン共重合体水添物(スチレン比:20重量%、MFR−200℃5kg:0.3g/10分、水添率:97%)35重量%およびエチレン−ブテン共重合体(密度:0.88g/cm3、融点:72℃、MFR−190℃2.16kg:4g/10分)35重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0048】
(実施例5)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン比:30重量%、水添率:98%)5重量%、粘着付与剤(脂環族系石油樹脂、数平均分子量:700、比重:0.995、軟化点100℃)20重量%、スチレン−ブタジエン共重合体水添物(スチレン比:13重量%、MFR−200℃5kg:8g/10分、水添率:98%)30重量%および低密度ポリエチレン(密度:0.918g/cm3、融点:106℃、MFR−190℃2.16kg:14g/10分)45重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0049】
(実施例6)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン比:30重量%、水添率:98%)5重量%、粘着付与剤(脂環族系石油樹脂、数平均分子量:700、比重:0.995、軟化点100℃)30重量%、スチレン−ブタジエン共重合体水添物(スチレン比:40重量%、MFR−200℃5kg:0.7g/10分、水添率:98%)30重量%および低密度ポリエチレン(密度:0.918g/cm3、融点:106℃、MFR−190℃2.16kg:14g/10分)35重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0050】
(実施例7)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン比:30重量%、水添率:98%)20重量%、粘着付与剤(βピネン−テルペン系樹脂、数平均分子量:820、軟化点112℃)10重量%、スチレン−プロピレン共重合体水添物(スチレン比:30重量%、MFR−200℃5kg:4g/10分、水添率:98%)30重量%および直鎖状低密度ポリエチレン(密度:0.918g/cm3、融点:106℃、MFR−190℃2.16kg:14g/10分)40重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0051】
(比較例1)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、MFR−200℃5kg:22g/10分、スチレン比:30重量%、水添率:98%)10重量%、スチレン−ブタジエン共重合体水添物(スチレン比20重量%、MFR−200℃5kg:0.3g/10分)30重量%およびエチレン−ブテン共重合体(密度:0.900g/cm3、融点:88℃、MFR−190℃2.16kg:5g/10分)70重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0052】
(比較例2)
無水マレイン酸グラフト変性スチレン−ブタジエン共重合体水添物(グラフト率:2重量%、密度:0.91g/cm3、スチレン比:30重量%、水添率:98%)40重量%および粘着付与剤(脂環族系石油樹脂、数平均分子量:860、比重:0.999、軟化点140℃)60重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練しようとしたがベタツキがひどくペレットにできなかった。成形評価不可能であった。
【0053】
(比較例3)
スチレン−ブタジエン共重合体水添物(スチレン比:30重量%、MFR−200℃5kg:10g/10分、水添率:98%)30重量%、粘着付与剤(脂環族系石油樹脂、数平均分子量:710、比重:0.998)20重量%および低密度ポリエチレン(密度:0.919g/cm3、融点:109℃、MFR−190℃2.16kg:14g/10分)50重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/Hrで溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0054】
(比較例4)
粘着付与剤(脂環族系石油樹脂、数平均分子量:860、比重:0.999)30重量%およびエチレン−ブテン共重合体(密度:0.900g/cm3、融点:88℃、MFR−190℃2.16kg:5g/10分)70重量%の配合割合で事前に50リッターのV型ブレンダーで5分間混合し、二軸押出機PCM30(D=30mmφ、L/D=32、池貝鉄工(株)製)を用い、温度180℃、スクリュー回転数180rpm、押し出し量11kg/時で溶融混練し、紐状に押し出し、冷却後カッティングし、ペレットを得た。
【0055】
上記実施例1〜7および比較例1〜4で得られたペレットを用い、A法の接着手法にて、被着材としてポリエステル系樹脂 ダイヤナイトPA500(比重:1.34、固有粘度:0.76dl/g、三菱レーヨン(株)製)、エチレン−酢酸ビニル共重合体鹸化物 エバールEP−F101(密度:1.19g/cm3、メルトインデックス:1.3、エチレン共重合含量:32モル%(株)クラレ製)、ポリアミド系樹脂 ノバテック1020CA2(融点:224℃、三菱化学(株)製)、スチレン系樹脂 デンカスチロールHI−E−4(比重:1.04、メルトインデックス:3.5、電気化学工業(株)製)、ポリオレフィン系樹脂 ノバテックHD HY340(密度0.953g/cm3、メルトフローレート:1.5g/10分、日本ポリケム(株)製)、ノバテックPP FY6H(密度0.90g/cm3、メルトフローレート:1.9g/10分、日本ポリケム(株)製)、アクリル系樹脂 バレックス2090(比重:1.15、メルトインデックス:3g/10分、三井東圧化学(株)製)、ポリカーボネート ユーピロンE−2000(比重:1.2、三菱瓦斯化学(株)製)の各々の2種3層フィルムを得、冷却固化後、原反接着力として23℃、耐熱接着力として60℃雰囲気下での接着力を測定し、テンターにて70℃雰囲気下で縦方向および横方向に3.3×3.3倍に延伸したときの接着力、さらに、ボイル(90℃、30分)処理後の23℃雰囲気下での接着強度を測定した。結果を表1に示す。なお表1で、PS、PC、PAN、PP、HDPEの欄の23℃とあるのは、原反接着力のデータである。
【0056】
(実施例8〜10)
上記実施例4〜6で得られたペレットを用い、B法の接着手法にて、被着材としてポリオレフィン系樹脂LE425(密度:0.923g/cm3、MFR:2、三菱化学(株)製)を用い、ガスバリヤ性樹脂としてポリエステル系樹脂 PET−G 6763(比重:1.27、固有粘度:0.75dl/g、イーストマンコダック製)、ポリアミド系樹脂 ノバッテック1020CA2(融点:224℃、三菱化学(株)製)、エチレン−酢酸ビニル共重合体鹸化物 エバールEP−E151B(密度:1.14g/cm3、メルトインデックス:5.5、エチレン共重合含量:44モル%、(株)クラレ製)を用い、各々の3種5層フィルムを得、冷却固化後、原反接着力として23℃、耐熱接着力として60℃雰囲気下での接着力を測定し、テンターにて90℃雰囲気下で縦方向におよび横方向に3.3×3.3倍に延伸した時の接着力、さらに、ボイル(90℃、30分)処理後の23℃雰囲気下での接着強度を測定した。結果を表2に示す。
【0057】
【表1】
【0058】
【表2】
【0059】
【発明の効果】
本発明の接着性樹脂組成物は、各種材料との延伸後の接着力が常用温度から高温状態まで、広範囲で優れた接着性を有しているので、耐熱性、ガスバリア性、防湿性、透明性、強度に優れた食品用、医薬品用等のフィルム包装材、熱成形カップ、ブロー瓶、インジェクション瓶、さらには、繊維分野や工業分野における不織布や金属との積層用フィルムなどに好適に用いることができる。[0001]
BACKGROUND OF THE INVENTION
The present invention has gas barrier properties (oxygen, carbon dioxide, etc.), content resistance properties (flavor properties, fragrance retention properties), and design properties (surface glossiness, transparency) that are widely required in various fields such as food packaging materials. The present invention relates to an adhesive resin composition for obtaining a laminate having improved mechanical strength, shrinkage, and the like, a laminate, and a stretched film obtained by stretching the laminate.
[0002]
[Prior art]
PO-based resins such as polypropylene, polyethylene, and ethylene-vinyl acetate copolymer are widely used in various fields, but PO-based resins are excellent in moldability, mechanical strength, chemical resistance, and heat sealability. It has disadvantages such as poor gas barrier properties and fragrance retention properties, and poor design properties (surface gloss and transparency) depending on the molding technique and resin type.
[0003]
As a method for improving this defect, lamination with EVOH or PA-based resin having excellent gas barrier properties, and lamination with PES-based resin for improving content resistance and design properties have been proposed.
However, since PO-based resins have no polarity, even if they are directly laminated with EVOH, PA-based resins and PES-based resins, the interlayer adhesive strength after lamination is very low and cannot be put into practical use.
[0004]
Therefore, a method of laminating using various adhesives has been proposed.
For example, a polyolefin adhesive resin modified with an unsaturated carboxylic acid or the like has been proposed for bonding a PO resin and a polar resin such as EVOH or PA resin.
Also, a laminate other than PO resin and EVOH, PA resin, that is, a laminate of PO resin and PES resin, PC resin, acrylic resin or PS resin, and PS resin and EVOH, PA system. For laminates of resins, PES resins and the like, a method of laminating using an olefin polymer and a composition of an alicyclic or aromatic polymer as a tackifier as an adhesive (Japanese Patent Laid-Open No. 50-116536) And a method of laminating using a composition of an ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) and a tackifier as an adhesive (Japanese Patent Laid-Open Nos. 53-147733 and 54-10384). Etc.), a method of laminating using a composition of EVA, a modified polyolefin and an aliphatic petroleum resin as a tackifier as an adhesive (Japanese Patent Laid-Open No. 53-127546), A method of laminating using a composition of a low crystalline ethylene-α-olefin random copolymer and a tackifier as an adhesive (Japanese Patent Laid-Open No. 61-241144), low crystalline (low density) ethylene-α -Lamination method using composition of olefin random copolymer, tackifier and modified polyethylene as adhesive (Japanese Patent Laid-Open No. 61-162539), styrenic thermoplastic elastomer, adhesive, low molecular weight polypropylene and process A method of laminating using a hot melt adhesive composition (Japanese Patent Laid-Open No. 1-144483) comprising a mixture of oil as an adhesive, comprising a styrene thermoplastic elastomer, an alicyclic pressure-sensitive adhesive, and a cyclic olefin random copolymer Lamination is performed using a hot-melt pressure-sensitive adhesive composition (Japanese Patent Laid-Open No. 3-223281) as an adhesive. The law has been proposed.
[0005]
Recently, in order to further improve the performance of various packaging materials, the co-extruded product is stretched to improve the strength and gas barrier property, and further applied to the shrink wrapping field. JP-A-52-146487), heat-shrinkable multilayer film and its package (JP-A-57-205147, 58-8644), heat-shrinkable multilayer film and its production method (JP-A-59) No. 152853), biaxially stretched molded article of thermoplastic polyester composition (Japanese Patent Laid-Open No. 60-76325), production method of biaxially stretched laminate (Japanese Patent Laid-Open No. 60-82324), heat shrink packaging In films (Japanese Patent Laid-Open No. 61-94753) and the like, maleic anhydride-modified polyethylene, maleic anhydride-modified polypropylene, maleic anhydride-modified ethylene-vinegar Proposed to apply hydrogenated products of vinyl copolymer, maleic anhydride modified ethylene-1-butene copolymer and styrene modified amorphous ethylene-propylene copolymer, maleic anhydride modified styrene-butadiene copolymer Has been.
[0006]
[Problems to be solved by the invention]
However, even if the co-extrusion laminate using any method is cooled and solidified and reheated and stretch-molded at least 1.5 times or more in both the longitudinal and transverse directions, the adhesive strength is extremely lowered and has not reached the practical range. . Moreover, even if it can reach the practical range at room temperature, there are many problems in use such as poor moldability and low adhesive strength at high temperature such as hot fill.
In view of such a situation, the present invention is excellent in adhesive strength after stretching with EVOH, PA resin, PO resin, PS resin, PES resin, acrylic resin, PC resin, etc., and a film, sheet, It aims at providing the resin composition for adhesion excellent also in extrusion molding aptitudes, such as blow, a layered product using this, and a stretched film of the layered product.
[0007]
[Means for Solving the Problems]
As a result of diligent investigations aimed at improving processability, adhesiveness and thermal stability, the present inventors have found that the performance is dramatically improved by the following means, and reached the present invention. did.
[0008]
That is, the present invention contains the following component (a) and component (b), and (a) component is 50 to 99% by weight and (b) based on the total amount of component (a) and component (b) below. An adhesive resin composition having a component content of 1 to 50% by weight is provided.
Component (a) : A hydrogenated block copolymer obtained by hydrogenating a block copolymer of a vinyl aromatic compound and a conjugated diene compound is modified with an unsaturated carboxylic acid or a derivative thereof, and the unsaturated carboxylic acid or A modified hydrogenated block copolymer having a derivative content of 0.01 to 20% by weight in component (a) .
(B) Component : Tackifier.
[0009]
Moreover, this invention contains 10-1000 weight part of following (c) component with respect to 100 weight part of materials which consist of said (a) component 50-99 weight% and (b) component 1-50 weight%. An adhesive resin composition is provided.
(C) Component : An ethylene polymer having a melt flow rate of 0.05 to 50 g / 10 min and a density of 0.850 to 0.950 g / cm 3 .
[0010]
Furthermore, the present invention provides the above adhesive resin composition, wherein in the hydrogenated block copolymer, 50% or more of the olefinic double bond of the polymer block comprising the conjugated diene compound is hydrogenated. is there.
[0011]
Furthermore, the present invention provides an ethylene-vinyl acetate copolymer saponified product having an ethylene content of 15 to 65 mol% and a saponification degree of 90% or more, a polyamide resin, a polyolefin resin, a styrene resin, and a polyester resin. , A laminate comprising at least one thermoplastic resin layer (A layer) selected from the group consisting of acrylic resins and polycarbonate resins, and a layer (B layer) made of the adhesive resin composition. Is to provide.
[0012]
The present invention also provides a stretched film obtained by subjecting the laminate to a stretching treatment at least uniaxially in an area ratio of 1.5 times or more.
[0013]
Furthermore, the present invention provides a stretched film obtained by subjecting the laminate to a stretching process of 1.5 times or more in the area ratio in the biaxial direction.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
(1) Modified hydrogenated block copolymer (a)
The modified hydrogenated block copolymer (a) used in the present invention is a hydrogenated block copolymer obtained by hydrogenating a block copolymer of a vinyl aromatic compound and a conjugated diene compound. Modified with a derivative or diluted with an unmodified hydrogenated block copolymer, the content of the unsaturated carboxylic acid or derivative thereof being 0.01 to 20% by weight . The content of the unsaturated carboxylic acid or its derivative is more preferably 0.05 to 15% by weight, particularly preferably 0.1 to 7% by weight. The block copolymer means that when the block A is a vinyl aromatic compound and the block B is a conjugated diene compound, the general formulas AB, ABA, BABA, AB- Examples of the block copolymer represented by A-B-A and the like, which is mainly composed of a vinyl aromatic compound constituting the polymer block part A, include styrene, α-methylstyrene, vinyltoluene, and the like. 1 or more types are selected from among them, and styrene is particularly preferable.
[0015]
Moreover, as a conjugated diene compound which comprises the polymer block part B, 1 or more types is chosen from butadiene, isoprene, 1,3 pentadiene etc., for example, Butadiene, isoprene, and these combination are especially preferable.
The content of the polymer block mainly composed of the vinyl aromatic compound to be the A block is preferably 10 to 80% by weight, more preferably 10 to 70% by weight. If the content of the polymer block is too low or too high, sufficient adhesive strength cannot be obtained.
The hydrogenation rate of a polymer block containing a conjugated diene compound as a main component is generally 50% or more, preferably 80% or more, more preferably 90% or more, and particularly preferably 95% or more. Since stability improves, it is especially preferable.
[0016]
The number average molecular weight of the hydrogenated block copolymer is preferably about 10,000 to 400,000, more preferably 20,000 to 300,000. If the molecular weight is too large or too small, the adhesive strength tends to decrease, and if the number average molecular weight is too large, the processability of the composition tends to decrease.
Even if the number average molecular weight of the hydrogenated block copolymer is 400,000 or less, if it is higher, it is selected from process oil, liquid polybutadiene, olefin wax having a number average molecular weight of 6,000 or less, and the like. By adding about 1 to 40% by weight of the fluidity improver added to the hydrogenated block copolymer, it is possible to suppress a decrease in adhesive strength and workability, which is an effective means. The hydrogenated block copolymer in the present invention preferably contains a block copolymer having an ABA structure. Specifically, as a commercially available product, “Tuftec” is a hydrogenated styrene-butadiene block copolymer. Examples include H type (Asahi Kasei Co., Ltd.), “Clayton” G1600 type (manufactured by Shell Chemical), and “Septon” 2000 type (manufactured by Kuraray Co., Ltd.) as a hydrogenated styrene-isoprene block copolymer. Moreover, the hydrogenated styrene-isoprene block copolymer “Septon” 1000 type (manufactured by Kuraray Co., Ltd.), “Kuraton” G1700 type (manufactured by Shell Chemical Co., Ltd.) and the like having an AB structure are exemplified.
[0017]
Further, two or more kinds of the above hydrogenated block copolymers can be mixed and used.
Next, the modified hydrogenated block copolymer (a) in the present invention is obtained by graft polymerization of an unsaturated carboxylic acid or a derivative thereof to the hydrogenated block copolymer.
[0018]
In order to produce a modified product by graft polymerization, various conventionally known methods can be employed. For example, a method in which the above hydrogenated block copolymer, graft monomer, radical generator is mixed in advance and melted in an extruder and graft copolymerized, or the hydrogenated block copolymer is dissolved in a solvent, There is a method of graft copolymerization by adding a generator and a graft monomer.
The grafting reaction temperature is usually preferably 80 to 300 ° C.
The general amount of the radical generator used is usually preferably in the range of 0.001 to 8 parts by weight per 100 parts by weight of the hydrogenated block copolymer.
As the radical generator, an organic peroxide is generally used. For example, 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-di (t-butylperoxy) -3. -Hexyne, di-t-butyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, dicumyl peroxide, t-butylperoxybenzoate, t-butylperoxy Acetate, t-butylperoxyisopropyl carbonate, benzoyl peroxide, m-toluoyl peroxide and the like are preferable.
[0019]
Examples of unsaturated carboxylic acids or derivatives thereof include unsaturated carboxylic acids such as acrylic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid, or derivatives thereof such as anhydrides, amides, esters, and the like. The above is used. Of these, unsaturated dicarboxylic acids or their anhydrides are preferred, and maleic acid or its anhydride is particularly preferred.
The graft amount (measurement method; infrared spectrophotometer) is preferably 0.01 to 20% by weight. If the amount of grafting is too small, the adhesiveness is inferior, and if it is too large, some cross-linking is caused at the time of graft copolymerization and the moldability is inferior. .
In the modified hydrogenated block copolymer (a), an unreacted graft monomer may remain depending on the modification method, but this can be done from the viewpoint of adhesiveness and hygiene when used as an adhesive for food containers. It is preferable not to leave them alone. Therefore, it is preferable to carry out various post-treatments such as extraction with a poor solvent such as acetone, and post-treatment such as degassing of unreacted graft monomer by heat drying treatment as necessary.
[0020]
(2) Adhesive (b)
The pressure-sensitive adhesive (b) used in the present invention is an amorphous resin that is solid at room temperature, and among them, a petroleum resin, a rosin resin, a terpene resin, or a hydrogenated product thereof is preferable, and is appropriately selected from commercially available products. Can be used.
Examples of petroleum resins include aliphatic petroleum resins, aromatic petroleum resins, copolymers thereof, and hydrogenated products thereof. Specifically, Toho High Resin (Toho Petroleum Resin) is commercially available. Co., Ltd.), Pico Pale (Pico), Alcon P and M (Arakawa Chemical Co., Ltd.), Admarp (Idemitsu Petrochemical Co., Ltd.), Super Star Tack (Raihill Hold Co., Ltd.), Escorez (Esso) Chemical Co., Ltd.), Toho Petro Resin (Tonen Petroleum Resin Co., Ltd.), Highlets (Mitsui Petrochemical Co., Ltd.), Quinton (Nippon Zeon Co., Ltd.), and the like.
Examples of rosin-based resins include natural rosin, polymerized rosin and derivatives thereof such as pentaerythrester rosin, glycerin ester rosin and hydrogenated products thereof. Specifically, commercially available gum rosin, wood rosin, ester gum A, Examples include Persen A, Pensen C (Arakawa Chemical Co., Ltd.), Pentaline A, Pentaline C, Foral 105 (Rika Hercules Co., Ltd.), and the like.
Examples of the terpene resins include polyterpene resins, terpene phenol resins, and hydrogenated products thereof. Specifically, picolite S, A (Pico), YS resin, and clearon (an crude oil and fat Co., Ltd.) are commercially available. ) And the like.
[0021]
In the present invention, these tackifiers can be properly used depending on the use, but among these tackifiers, those having a softening point (ring and ball method) of preferably 70 to 150 ° C, particularly preferably 90 to 150 ° C. Used. If the softening point is too low, the adhesive strength is inferior, and at the same time, melt kneading with a hydrogenated block copolymer or an ethylene polymer is difficult. In addition, in order to make the hue of the adhesive resin composition of the present invention as close as possible to the natural color (white or colorless and transparent, yellowing prevention), the aliphatic petroleum resin, the aromatic petroleum resin, or a combination thereof. A polymer is preferred, and its hydrogenated product is particularly preferred. The hydrogenation rate is preferably 80% or more, more preferably 90% or more.
[0022]
(3) Ethylene polymer (c)
The ethylene polymer (c) used as necessary in the present invention is an ethylene homopolymer or ethylene-α having a melt flow rate of 0.05 to 50 g / 10 min and a density of 0.850 to 0.950 g / cm 3. -Olefin copolymer. The α-olefin constituting the ethylene-α-olefin copolymer is usually an α-olefin not containing a cyclic molecule having 3 to 20 carbon atoms, such as propylene, 1-butene, 1-hexene, 4-methyl-1-pentene. 1-octene, 1-decene, 1-tetradecene, 1-octadecene, etc., each consisting of a single compound or a mixture of two or more. Further, vinyl esters (such as vinyl acetate), unsaturated carboxylic acids or esters thereof (such as acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate) may be used. Furthermore, two or more kinds of ethylene-based polymers (c) can be mixed and used.
[0023]
Specific examples include low density polyethylene (LDPE), high density polyethylene (HDPE), medium density polyethylene (MDPE), linear low density polyethylene (LLDPE), very low density polyethylene (VLDPE), low crystalline ethylene-butene. -1 random copolymer (EBM), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, etc., among which LDPE and VLDPE are preferable. The melt flow rate (MFR) here means a value measured under conditions of a temperature of 190 ° C., a load of 2.16 kg, and 10 minutes in accordance with JIS K7210.
[0024]
(4) Blending ratio of composition The blending ratio of each of the above components is 50 to 99% by weight, preferably 50 , of the modified hydrogenated block copolymer (a) with respect to the total amount of the component (a) and the component (b). -98% by weight, particularly preferably 50-95% by weight, and tackifier (b) 1-50% by weight, preferably 2-50% by weight, particularly preferably 5-50% by weight. The ethylene polymer (c) is 10 to 1000 parts by weight, preferably 13 to 950 parts by weight, particularly preferably 15 to 900 parts by weight, based on 100 parts by weight of the total of (a) and component (b).
(I) If the tackifier (b) is less than 1% by weight, the adhesion to each adherend is reduced, which is not preferable. On the other hand, if it exceeds 50% by weight, the fluidity becomes too high and the moldability tends to deteriorate. This is not preferable.
(Ii) By adding 10 parts by weight or more of the ethylene-based polymer (c), the moldability and handling can be remarkably improved, and adding more than 1000 parts by weight is not preferable because the adhesive force tends to extremely decrease.
[0025]
(5) Production method of composition The adhesive resin composition of the present invention is mixed using various known methods such as a tumbler blender, a V blender, a ribbon blender, a Henschel mixer, etc., and after mixing, a single screw extruder, It can be prepared by a technique of melt-kneading with a twin-screw extruder, Banbury mixer, kneader or the like, and granulating or grinding.
In addition to the above components, the composition includes a heat stabilizer, a weather stabilizer, an anti-blocking agent, a slip agent, an antistatic agent, a flame retardant, a catalyst residue neutralizer, a pigment, a dye, an inorganic and / or organic Additives generally used such as fillers can be blended within a range that does not impair the object of the present invention.
Since the resin composition of the present invention is excellent in adhesive strength with various thermoplastic resins described later, it can be used as a laminate with the thermoplastic resin and a stretched film obtained by stretching the laminate.
[0026]
(6) Thermoplastic resin layer (A layer)
In the present invention, as a thermoplastic resin layer (A layer) laminated with a layer (B layer) made of an adhesive resin composition, saponified ethylene-vinyl acetate copolymer, polyamide resin, polyolefin resin, styrene Thermoplastic resins such as resin, polyester resin, acrylic resin and polycarbonate resin are used. Specific examples of the thermoplastic resin include ethylene-vinyl acetate copolymer saponified product (EVOH) having an ethylene content of 15 to 65 mol% and a saponification degree of 90% or more; polyethylene terephthalate (PET), Polyester resins such as polymerized PET, polybutylene terephthalate, polyethylene naphthalate, polycyclohexylene terephthalate (PES resin); 6-nylon, 6,6-nylon, 6-6,6-nylon, 12-nylon, xylylene groups Polyamide resin (PA resin) such as containing polyamide resin; polypropylene resin, polyethylene resin, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, 4-methyl -1-Polyolefin resin such as pentene resin (PO resin) Styrene resin (PS resin) such as general-purpose polystyrene, impact-resistant polystyrene, styrene-methacrylic acid copolymer; acrylic resin such as polyacrylonitrile, polymethyl methacrylate, acrylonitrile-methyl acrylate-butadiene copolymer; And polycarbonate resin (PC resin); and one or more materials selected from a mixture of the resin and a filler such as a plate-like filler.
[0027]
The saponified ethylene-vinyl acetate copolymer used for the thermoplastic resin layer (A layer) is preferably an ethylene-vinyl acetate copolymer having an ethylene content of preferably 15 to 65 mol%, more preferably 25 to 50 mol%. A saponified product is used so that the degree of saponification is preferably 50% or more, more preferably 90% or more. When the ethylene content is too small, it is easy to be thermally decomposed, difficult to be melt-molded, inferior in stretchability, and easy to absorb water and swell, resulting in poor water resistance. On the other hand, when the ethylene content is too large, the gas permeation resistance tends to decrease. Moreover, when the degree of saponification is too low, the gas permeation resistance tends to decrease.
[0028]
Polyamide resins used for the thermoplastic resin layer (A layer) include hexamethylenediamine, decamethylenediamine, dodecamethylenediamine, 2,2,4- or 2,4,4-trimethylhexamethylenediamine, 1,3- Or 1,4-bis (aminomethyl) cyclohexane, bis (p-aminocyclohexylmethane), diamine such as m- or p-xylylenediamine, alicyclic, aromatic and the like diamine and adipic acid, suberic acid, Polyamides obtained by polycondensation with aliphatic, alicyclic and aromatic dicarboxylic acids such as sebacic acid, cyclohexanedicarboxylic acid, terephthalic acid and isophthalic acid, and amino such as ε-aminocaproic acid and 11-aminoundecanecarboxylic acid Polyamides obtained by condensation of carboxylic acids, ε-caprolactam, Examples thereof include polyamides obtained from lactams such as ω-laurolactam, and mixtures of copolymerized polyamides composed of these components. Specific examples include nylon 6, nylon 66, nylon 610, nylon 9, nylon 11, nylon 12, nylon 6/66, nylon 66/610, nylon 6/11, and the like. Among these, nylon 6 and nylon 66, which are excellent in melting point and rigidity, are preferable. Although the molecular weight is not particularly limited, a polyamide having a relative viscosity ηr (measured in JIS K6810, 98% sulfuric acid) of 0.5 or more is usually used.
[0029]
The polyolefin-based resin used for the thermoplastic resin layer (A layer) is a crystalline polymer containing ethylene, propylene, 1-butene or the like, which is an α-olefin having 2 to 4 carbon atoms, alone or the main component thereof. It is. Specific examples of these polyolefin-based resins include polyethylene, polypropylene, and poly-1-butene. However, these are not limited to homopolymers, and as long as these olefins are the main component, other carbon numbers of 2 to 20 α-olefins or copolymers with vinyl compounds such as vinyl acetate, vinyl chloride, acrylic acid, methacrylic acid and styrene, and unsaturated carboxylic acids such as maleic anhydride, maleic acid and acrylic acid. A graft copolymer graft-modified with an acid or a derivative thereof may also be used. Furthermore, these polyolefins may be a mixture.
[0030]
Specific examples of the polyethylene include, for example, high pressure method low density polyethylene (LDPE), ethylene-propylene copolymer, ethylene-1-butene copolymer, ethylene-4-methyl-1-pentene polymer, ethylene-1- Examples include hexene copolymers, high-density polyethylene (HDPE), ethylene-vinyl acetate copolymers, ethylene-acrylic acid copolymers, and ethylene-acrylic acid ester copolymers. Among these, LDPE, ethylene-α-olefin random copolymer, ethylene-vinyl acetate copolymer, and the like are preferable because they are excellent in transparency and low-temperature heat sealability, and in particular, the density is 0.910 to 0.960 g / cm. 3 and a melting point in the range of 100 to 135 ° C are preferred. In addition, although the melt flow rate of polyethylene is not specifically limited, the thing of the range of 0.01-30 g / 10min further normally 0.1-30 g / 10min from the point of a moldability is preferable.
[0031]
Specific examples of the polypropylene include propylene random copolymers such as polypropylene (propylene homopolymer), propylene-ethylene random copolymer, propylene-ethylene-1-butene random copolymer, and propylene-1-butene random copolymer. (Propylene content is usually 90 mol% or more, preferably 95% mol or more), propylene-ethylene block copolymer (ethylene content is usually 5 to 30 mol%), and the like. Among these, homopolymers and random copolymers are preferable because they are excellent in transparency, and random copolymers having a melting point of 130 to 140 ° C. are particularly preferable because they are excellent in heat sealability. The melt flow rate of propylene is not particularly limited, but is preferably from 0.5 to 30 g / 10 minutes, more preferably from 0.5 to 10 g / 10 minutes from the viewpoint of moldability.
[0032]
Specific examples of the poly-1-butene include a 1-butene homopolymer, a 1-butene-ethylene copolymer, a 1-butene-propylene copolymer, and a 1-butene-4-methyl-1-pentene copolymer. A polymer is mentioned. In addition, the melt flow rate of poly-1-butene is not particularly limited, but is preferably 0.01 to 100 g / 10 minutes, more preferably 0.03 to 30 g / 10 minutes from the viewpoint of moldability.
[0033]
The styrene resin used for the thermoplastic resin layer (A layer) is a styrene homopolymer, a copolymer of styrene and acrylonitrile, methyl (meth) acrylate or the like, or a resin mainly composed of styrene such as a rubber-modified product thereof. Specifically, a thermoplastic resin called polystyrene, impact-resistant polystyrene (rubber-containing polystyrene), AS resin (SAN), ABS, SMA (styrene-maleic anhydride polymer), or the like is used. Polystyrene usually has a melt flow rate in the range of 0.1 to 50 g / 10 min, preferably 1 to 20 g / 10 min. When the MFR is out of the above range, the moldability tends to decrease.
[0034]
The polyester resin used for the thermoplastic resin layer (A layer) is an aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid, diphenyl ether-4,4-dicarboxylic acid, naphthalene-1,4- or 2,6-dicarboxylic acid. Acid components of dicarboxylic acid such as aliphatic dicarboxylic acid such as acid, oxalic acid, succinic acid, adipic acid, sebacic acid, undecadicarboxylic acid, and alicyclic dicarboxylic acid such as hexahydroterephthalic acid, ethylene glycol, propylene Polyethylene terephthalate comprising glycol components such as glycol, 1,4-butanediol, alicyclic glycol such as neopentyl glycol, alicyclic glycol such as cyclohexanedimethanol, and aromatic dihydroxy compounds such as bisphenol A. (PET), copolymer PE , Polybutylene terephthalate, polyethylene naphthalate, polycyclohexylene thin terephthalate, and the like.
Of these, polyethylene terephthalate (PET) is particularly preferable, and a thermoplastic polyester resin in which 80 mol% or more of the dicarboxylic acid component is usually terephthalic acid and 80 mol% or more of the glycol component is ethylene glycol. Further, it may be a copolymer PET or a mixture of PET and another polyester.
[0035]
The acrylic resin used for the thermoplastic resin layer (A layer) is polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, polymethyl methacrylate, polyacrylonitrile, polymethacrylic acid. Examples include rhonitrile, methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-α-methylstyrene copolymer, and the like. Furthermore, a styrene-acrylonitrile copolymer, a styrene-acrylonitrile-butadiene copolymer, a styrene-methyl methacrylate copolymer, or the like may be used. Of these, polyacrylonitrile and styrene-acrylonitrile-butadiene copolymer are preferred.
These acrylic resins can be used by appropriately selecting from commercially available products, and various plasticizers, stabilizers, inorganic fillers, antistatic agents, pigments and other additives within the range not impairing the effects of the present invention. May be blended.
[0036]
The polycarbonate resin used for the layer (A layer) of a thermoplastic resin is various polycarbonates obtained by making a dihydroxy compound, phosgene, or diphenyl carbonate react by a well-known method. Examples of the dihydroxy compound include hydroquinone, resorcinol, 4,4′-dihydroxydiphenylmethane, 4,4′-dihydroxydiphenylethane, 4,4′-dihydroxydiphenyl-n-butane, 4,4′-dihydroxydiphenylheptane, 4,4 '-Dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl-2,2-propane (bisphenol A), 4,4'-dihydroxy-3,3'-dimethyldiphenyl-2,2-propane, 4,4'-dihydroxy -3,3'-diphenyldiphenyl-2,2-propane, 4,4'-dihydroxydichlorodiphenyl-2,2-propane, 4,4'-dihydroxydiphenyl-1,1-cyclopentane, 4,4'- Dihydroxydiphenyl-1,1-cyclohexane, 4,4'-dihydroxy Diphenylmethylphenylmethane, 4,4′-dihydroxydiphenylethylphenylmethane, 4,4′-dihydroxydiphenyl-2,2,2-trichloro-1,1-ethane, 2,2′-dihydroxydiphenyl, 2,6- Dihydroxynaphthalene, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxy-3,3′-dichlorodiphenyl ether, 4,4′-dihydroxy-2,5-diethoxyphenyl ether and the like are used. Of these, polycarbonate using 4,4′-dihydroxy-diphenyl-2,2-propane (bisphenol A) is preferred because of its excellent mechanical performance and transparency.
[0037]
(7) Manufacturing method of a laminated body As a method of manufacturing the laminated body of this invention, conventionally well-known various methods are employable.
For example, an inflation film, a T-die film, a sheet, a pipe, and a molten individual resin that are melted by an extruder are supplied to a multilayer die and laminated in the die. A co-extrusion lamination of an unstretched test tubular parison or the like is performed by co-injection molding in which a time lag is injected into a mold.
[0038]
(8) Production of stretched film As a method for producing the stretched film of the present invention, various conventionally known methods can be employed.
For example, after cooling and solidifying the unstretched (multilayer) laminate obtained from (7) above, each molded product is reheated to a stretching temperature of 60 to 160 ° C. inline or outline, and a tenter, plug, and compressed air And a method of obtaining a molded body such as a film, a cup, or a bottle that has been uniaxially or biaxially stretched by at least an area ratio of 1.5 times or more in a uniaxial direction or a biaxial direction.
In the case of inflation film, inflation simultaneous biaxial stretching method, in the case of T-die film, tenter simultaneous biaxial stretching method, sequential biaxial stretching method due to roll and tenter, etc., in the case of cup, only by compressed air etc. in the mold In the case of bottles, such as compressed air molding, SPPF molding that uses a plug and compressed air together, the laminated pipe is stretched vertically, then the pipe is stretched horizontally with compressed air, etc. in the mold, and the bottom of the test tube is formed by injection molding A bottomed parison stretching method in which a parison is formed, the bottomed parison is stretched in the longitudinal direction with a rod in a mold, and then stretched in the lateral direction with compressed air or the like is generally used.
If desired, the stretched film can be formed into two or more layers by interposing the adhesive resin composition of the present invention.
[0039]
In addition, the stretched film of the present invention can improve heat resistance (shrinkage is slightly reduced) by performing reheating after stretching, that is, heat setting, as necessary.
[0040]
【Example】
Hereinafter, the present invention will be specifically described by way of examples.
(1) Manufacture of a laminated body was implemented with the following A or B method.
(1) Method A: 2 types, 3 layers co-extrusion water-cooled blown film forming method The layer structure was various adhering materials / adhesive materials / various adhering materials from the inner layer to the outer layer. The thickness of each layer was 100 μm.
The die width of the extruder was 40 mmφ / 35 mmφ / 40 mmφ from the inner layer toward the outer layer.
The molding conditions for each adherend are shown below.
Coextrusion temperature polyester resin = 275 ° C
Polyamide resin = 250 ° C
Saponified ethylene-vinyl acetate copolymer = 230 ° C.
Acrylic resin = 220 ° C
Styrene resin = 220 ° C
Polycarbonate resin = 275 ° C
Polyolefin resin = 230 ° C
The molding speed was set to 5 m / min.
(2) Method B: Three-kind five-layer coextrusion sheet forming method The layer structure is composed of various adhering materials / adhesive materials / gas barrier resins / adhesive materials / various adhering materials from the inner layer to the outer layer, and the respective thicknesses. Was 220 μm / 40 μm / 50 μm / 40 μm / 220 μm.
The die width of the extruder was 65 mmφ / 45 mmφ / 45 mmφ / 45 mmφ / 65 mmφ.
The molding conditions for each adherend are shown below.
Coextrusion temperature polyester resin = 235 ° C
Polyamide resin = 250 ° C
Saponified ethylene-vinyl acetate copolymer = 230 ° C.
Acrylic resin = 220 ° C
Styrene resin = 220 ° C
Polycarbonate resin = 275 ° C
Polyolefin resin = 200 ° C
The molding speed was set to 5 m / min.
[0041]
(2) The laminate was stretched by the following method.
Tenter method standard type biaxial stretching machine: T.W. M.M. Long drawing maximum magnification: 7.2 × 7.2 times Drawing speed: 7.6 to 3000 cm / min Heating method: Hot air circulation (room temperature to 350 ° C.)
Stretching head drive: Hydraulic cylinder stretching possible Sample thickness: 0.08-2mm
Stretch ratio: 3.3 × 3.3 times
In addition, the evaluation item of an Example and a comparative example was evaluated with the following method.
(3) The adhesive strength (kg / 10 mm) of the laminate was measured under the following conditions based on JIS K-6854.
Peel width: 10mm
Peeling state: T peel peeling peeling speed: 50 mm / min Temperature: 23 ° C. and 60 ° C.
[0043]
(4) Boil treatment It was carried out using a film obtained by stretching the laminate of the present invention prepared by the method A and the method B by 3.3 × 3.3 times.
A stretched film was placed in a PE bag, sealed by heat sealing, treated in hot water at 90 ° C. for 30 minutes, then taken out from the hot water and cooled in water at 23 ° C. (about 30 minutes) to obtain a sample.
[0044]
(Example 1)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2% by weight, MFR-200 ° C. 5 kg: 22 g / 10 minutes, styrene ratio: 30% by weight, hydrogenation rate: 98%) 90% by weight , And a tackifier (alicyclic petroleum resin, number average molecular weight: 860, specific gravity: 0.999, softening point 140 ° C.) mixed at a blending ratio of 10% by weight in advance with a 50 liter V-type blender for 5 minutes. Using a twin-screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.), melt-kneaded at a temperature of 180 ° C., a screw rotation speed of 180 rpm, and an extrusion rate of 11 kg / hour, and extruded into a string shape. After cooling, cutting was performed to obtain a pellet.
[0045]
(Example 2)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2% by weight, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene weight ratio: 30%, hydrogenation rate: 98%) 20% by weight , 30% by weight of tackifier (alicyclic petroleum resin, number average molecular weight: 710, specific gravity: 0.998, softening point 115 ° C.) and hydrogenated styrene-butadiene copolymer (styrene ratio: 30% by weight, MFR-200 ° C. 5 kg: 3.5 g / 10 min) Mixing ratio of 50% by weight in advance with 50 liter V-type blender for 5 minutes, twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, Ikekai Tekko Co., Ltd.) was used, melted and kneaded at a temperature of 180 ° C., a screw rotation speed of 180 rpm, and an extrusion rate of 11 kg / hour, extruded into a string shape, cooled and cut to obtain pellets.
[0046]
(Example 3)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2 wt%, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene ratio: 30 wt%, hydrogenation rate: 98%) 30 wt% , Tackifier (alicyclic petroleum resin, number average molecular weight: 710, specific gravity: 0.998, softening point 115 ° C.) 20% by weight and ethylene-butene copolymer (density: 0.900 g / cm 3 , melting point) : 88 ° C., MFR-190 ° C. 2.16 kg: 5 g / 10 min.) Mixing for 5 minutes in a 50 liter V-type blender at a blending ratio of 50% by weight in advance, twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.), melt kneaded at a temperature of 180 ° C., a screw rotation speed of 180 rpm, and an extrusion rate of 11 kg / hour, extruded into a string, cut after cooling, pelleted Obtained.
[0047]
(Example 4)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated (graft rate: 2% by weight, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene weight ratio: 30%, hydrogenation rate: 98%) 10% by weight , Tackifier (alicyclic petroleum resin, number average molecular weight: 860, specific gravity: 0.999, softening point 140 ° C.) 20% by weight, styrene-butadiene copolymer hydrogenated product (styrene ratio: 20% by weight, MFR-200 ° C. 5 kg: 0.3 g / 10 min, hydrogenation rate: 97% 35% by weight and ethylene-butene copolymer (density: 0.88 g / cm 3 , melting point: 72 ° C., MFR-190 ° C. 2 .16kg: 4g / 10min) Mixing ratio of 35% by weight with 50 liter V-type blender for 5 minutes in advance, twin screw extruder PCM30 (D = 30mmφ, L / D = 32, Ikekai Tekko Co., Ltd.) Made) Temperature 180 ° C., screw speed of 180 rpm, and melt-kneaded when extrusion rate 11 kg /, extruded into a string-like, was cut after cooling to obtain pellets.
[0048]
(Example 5)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2 wt%, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene ratio: 30 wt%, hydrogenation rate: 98%) 5 wt% , Tackifier (alicyclic petroleum resin, number average molecular weight: 700, specific gravity: 0.995, softening point 100 ° C.) 20% by weight, styrene-butadiene copolymer hydrogenated product (styrene ratio: 13% by weight, MFR-200 ° C. 5 kg: 8 g / 10 min, hydrogenation rate: 98%) and low density polyethylene (density: 0.918 g / cm 3 , melting point: 106 ° C., MFR-190 ° C. 2.16 kg: 14 g / 10 minutes) In a blending ratio of 45% by weight in advance with a 50 liter V-type blender for 5 minutes, using a twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.) temperature 80 ° C., screw speed of 180 rpm, and melt-kneaded when extrusion rate 11 kg /, extruded into a string-like, was cut after cooling to obtain pellets.
[0049]
(Example 6)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2 wt%, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene ratio: 30 wt%, hydrogenation rate: 98%) 5 wt% , Tackifier (alicyclic petroleum resin, number average molecular weight: 700, specific gravity: 0.995, softening point 100 ° C.) 30% by weight, styrene-butadiene copolymer hydrogenated product (styrene ratio: 40% by weight, MFR-200 ° C. 5 kg: 0.7 g / 10 min, hydrogenation rate: 98% 30% by weight and low density polyethylene (density: 0.918 g / cm 3 , melting point: 106 ° C., MFR-190 ° C. 2.16 kg: 14 g / 10 minutes) In a blending ratio of 35% by weight, the mixture is mixed in advance for 5 minutes with a 50 liter V-type blender, and a twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.) Use Degrees 180 ° C., screw speed of 180 rpm, and melt-kneaded when extrusion rate 11 kg /, extruded into a string-like, was cut after cooling to obtain pellets.
[0050]
(Example 7)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2 wt%, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene ratio: 30 wt%, hydrogenation rate: 98%) 20 wt% , Tackifier (β-pinene-terpene resin, number average molecular weight: 820, softening point 112 ° C.) 10% by weight, styrene-propylene copolymer hydrogenated product (styrene ratio: 30% by weight, MFR-200 ° C. 5 kg: 4 g / 10 min, hydrogenation rate: 98%) 30% by weight and linear low density polyethylene (density: 0.918 g / cm 3 , melting point: 106 ° C., MFR-190 ° C. 2.16 kg: 14 g / 10 min) Mixing for 5 minutes in a 50 liter V-type blender at a blending ratio of 40% by weight in advance, using a twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.), temperature 18 The mixture was melt-kneaded at 0 ° C., a screw rotation speed of 180 rpm, and an extrusion rate of 11 kg / hour, extruded into a string, cut after cooling, and pellets were obtained.
[0051]
(Comparative Example 1)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2 wt%, MFR-200 ° C. 5 kg: 22 g / 10 min, styrene ratio: 30 wt%, hydrogenation rate: 98%) 10 wt% Styrene-butadiene copolymer hydrogenated (styrene ratio 20% by weight, MFR-200 ° C. 5 kg: 0.3 g / 10 min) 30% by weight and ethylene-butene copolymer (density: 0.900 g / cm 3) Melting point: 88 ° C., MFR-190 ° C. 2.16 kg: 5 g / 10 min) Mixing ratio of 70% by weight in advance with 50 liter V-type blender for 5 minutes, twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.), melt kneaded at a temperature of 180 ° C., a screw rotation speed of 180 rpm, and an extrusion rate of 11 kg / hour, extruded into a string, and after cooling, cutin To obtain a pellet.
[0052]
(Comparative Example 2)
Maleic anhydride graft-modified styrene-butadiene copolymer hydrogenated product (graft rate: 2% by weight, density: 0.91 g / cm 3 , styrene ratio: 30% by weight, hydrogenation rate: 98%) 40% by weight and adhesion Additive (alicyclic petroleum resin, number average molecular weight: 860, specific gravity: 0.999, softening point 140 ° C.) 60% by weight in advance in a 50 liter V-type blender for 5 minutes, biaxial Using an extruder PCM30 (D = 30mmφ, L / D = 32, manufactured by Ikegai Iron Works Co., Ltd.), I tried to melt and knead it at a temperature of 180 ° C, a screw rotation speed of 180rpm, and an extrusion rate of 11kg / hour. could not. Molding evaluation was impossible.
[0053]
(Comparative Example 3)
Styrene-butadiene copolymer hydrogenated product (styrene ratio: 30% by weight, MFR-200 ° C. 5 kg: 10 g / 10 minutes, hydrogenation rate: 98%), 30% by weight, tackifier (alicyclic petroleum resin, Number average molecular weight: 710, specific gravity: 0.998) 20% by weight and low density polyethylene (density: 0.919 g / cm 3 , melting point: 109 ° C., MFR-190 ° C. 2.16 kg: 14 g / 10 min) 50% by weight Mixing for 5 minutes in advance with a 50 liter V-type blender at a blending ratio of 2 ° C., using a twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, manufactured by Ikekai Tekko Co., Ltd.), temperature 180 ° C., screw rotation It was melt-kneaded at several 180 rpm and an extrusion amount of 11 kg / Hr, extruded into a string shape, cooled and cut to obtain pellets.
[0054]
(Comparative Example 4)
Tackifier (alicyclic petroleum resin, number average molecular weight: 860, specific gravity: 0.999) 30% by weight and ethylene-butene copolymer (density: 0.900 g / cm 3 , melting point: 88 ° C., MFR- 190 ° C. 2.16 kg: 5 g / 10 minutes) Mixing ratio of 70% by weight in advance with a 50 liter V-type blender for 5 minutes, twin screw extruder PCM30 (D = 30 mmφ, L / D = 32, Ikekai Tekko Was used, melted and kneaded at a temperature of 180 ° C., a screw rotation speed of 180 rpm, and an extrusion rate of 11 kg / hour, extruded into a string, and cut after cooling to obtain pellets.
[0055]
Using the pellets obtained in Examples 1 to 7 and Comparative Examples 1 to 4 above, the polyester resin Diamondite PA500 (specific gravity: 1.34, intrinsic viscosity: 0. 76 dl / g, manufactured by Mitsubishi Rayon Co., Ltd., saponified ethylene-vinyl acetate copolymer EVAL EP-F101 (density: 1.19 g / cm 3 , melt index: 1.3, ethylene copolymerization content: 32 mol% (Manufactured by Kuraray Co., Ltd.), polyamide resin Novatec 1020CA2 (melting point: 224 ° C., manufactured by Mitsubishi Chemical Corporation), styrene resin Denkastyrol HI-E-4 (specific gravity: 1.04, melt index: 3.5, Denki Kagaku Kogyo Co., Ltd.), a polyolefin resin Novatec HD HY340 (density 0.953 g / cm 3, melt flow rate: 1.5 g / 10 min, This Polychem Corp.), Novatec PP FY6H (density 0.90 g / cm 3, melt flow rate: 1.9 g / 10 min, Nippon Polychem Co., Ltd.), an acrylic resin Barex 2090 (specific gravity: 1.15 , Melt index: 3 g / 10 min, manufactured by Mitsui Toatsu Chemical Co., Ltd.), polycarbonate Iupilon E-2000 (specific gravity: 1.2, manufactured by Mitsubishi Gas Chemical Co., Ltd.) After cooling and solidification, the adhesive strength at 23 ° C. as the original fabric adhesive strength and 60 ° C. atmosphere as the heat resistant adhesive strength was measured, and 3.3 × 3.3 times in the vertical and horizontal directions in the 70 ° C. atmosphere with a tenter. Further, the adhesive strength when stretched in the same manner and the adhesive strength in a 23 ° C. atmosphere after the boiling (90 ° C., 30 minutes) treatment were measured. The results are shown in Table 1. In Table 1, 23 ° C. in the columns of PS, PC, PAN, PP, and HDPE is data on the original fabric adhesive strength.
[0056]
(Examples 8 to 10)
Using the pellets obtained in Examples 4 to 6 above, the polyolefin resin LE425 (density: 0.923 g / cm 3 , MFR: 2, manufactured by Mitsubishi Chemical Corporation) as an adherend by the adhesion method B method ), And a polyester resin PET-G 6763 (specific gravity: 1.27, intrinsic viscosity: 0.75 dl / g, manufactured by Eastman Kodak) as a gas barrier resin, polyamide resin Novatec 1020CA2 (melting point: 224 ° C., Mitsubishi Chemical) Saponified ethylene-vinyl acetate copolymer EVAL EP-E151B (density: 1.14 g / cm 3 , melt index: 5.5, ethylene copolymerization content: 44 mol%, manufactured by Kuraray Co., Ltd.) ) To obtain each of the three types of five-layer films, and after cooling and solidifying, measure the adhesive strength in an atmosphere at 23 ° C. as the original fabric adhesive strength and 60 ° C. as the heat resistant adhesive strength. Adhesive strength when stretched 3.3 × 3.3 times in the vertical and horizontal directions in a 90 ° C. atmosphere with a tenter, and further in a 23 ° C. atmosphere after boiling (90 ° C., 30 minutes) treatment The adhesive strength was measured. The results are shown in Table 2.
[0057]
[Table 1]
[0058]
[Table 2]
[0059]
【The invention's effect】
The adhesive resin composition of the present invention has excellent adhesive properties in a wide range from normal temperature to high temperature after stretching with various materials, so heat resistance, gas barrier properties, moisture resistance, transparent Suitable for film packaging materials for foods and pharmaceuticals with excellent properties and strength, thermoforming cups, blow bottles, injection bottles, and non-woven fabric and metal laminate films in the textile and industrial fields. Can do.
Claims (6)
(a)成分:ビニル芳香族化合物と共役ジエン化合物とのブロック共重合体を水添してなる水添ブロック共重合体が不飽和カルボン酸またはその誘導体で変性され、且つ該不飽和カルボン酸またはその誘導体の含量が(a)成分中0.01〜20重量%である変性水添ブロック共重合体。
(b)成分:粘着付与剤。 While containing the following (a) component and (b) component, with respect to the total amount of the following (a) component and (b) component, (a) component is 50-99 weight%, and (b) component is 1-50. The resin composition for adhesion | attachment which is weight%.
Component (a) : A hydrogenated block copolymer obtained by hydrogenating a block copolymer of a vinyl aromatic compound and a conjugated diene compound is modified with an unsaturated carboxylic acid or a derivative thereof, and the unsaturated carboxylic acid or A modified hydrogenated block copolymer having a derivative content of 0.01 to 20% by weight in component (a) .
(B) Component : Tackifier.
(c)成分:メルトフローレート0.05〜50g/10分および密度0.850〜0.950g/cm3であるエチレン系重合体。 2. The component according to claim 1, comprising 10 to 1000 parts by weight of the following component (c) with respect to 100 parts by weight of the material comprising 50 to 99% by weight of the component (a) and 1 to 50% by weight of the component (b). Adhesive resin composition.
(C) Component : An ethylene polymer having a melt flow rate of 0.05 to 50 g / 10 min and a density of 0.850 to 0.950 g / cm 3 .
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29702597A JP3671626B2 (en) | 1997-02-10 | 1997-10-29 | Adhesive resin composition, laminate and stretched film |
| AU53027/98A AU736947B2 (en) | 1997-02-10 | 1998-02-09 | Adhesive resin compositions, laminates, production method thereof and oriented films |
| US09/020,537 US6214476B1 (en) | 1997-02-10 | 1998-02-09 | Adhesive resin compositions, laminates, production method thereof and oriented films |
| EP19980102276 EP0857758B1 (en) | 1997-02-10 | 1998-02-10 | Adhesive resin compositions, laminates, production method thereof and oriented films |
| DE1998615903 DE69815903T2 (en) | 1997-02-10 | 1998-02-10 | Adhesive compositions, laminates, stretched films and processes for their manufacture |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-26728 | 1997-02-10 | ||
| JP2672897 | 1997-02-10 | ||
| JP29702597A JP3671626B2 (en) | 1997-02-10 | 1997-10-29 | Adhesive resin composition, laminate and stretched film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10279774A JPH10279774A (en) | 1998-10-20 |
| JP3671626B2 true JP3671626B2 (en) | 2005-07-13 |
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| JP29702597A Expired - Lifetime JP3671626B2 (en) | 1997-02-10 | 1997-10-29 | Adhesive resin composition, laminate and stretched film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3671625B2 (en) * | 1997-10-29 | 2005-07-13 | 三菱化学株式会社 | Adhesive resin composition, laminate and stretched film |
| EP1597006A2 (en) * | 2003-02-21 | 2005-11-23 | General Electric Company | Weatherable multilayer articles and method for their preparation |
| PL1752285T3 (en) * | 2004-06-03 | 2012-09-28 | Mitsubishi Chem Corp | Heat shrink laminate film, molding utilizing the film, heat shrink label and container |
| US20060014036A1 (en) * | 2004-07-15 | 2006-01-19 | Kendig Terrance D | Composition comprising ethylene copolymers and polyolefins |
| JP5092288B2 (en) | 2005-09-02 | 2012-12-05 | 三菱化学株式会社 | Adhesive resin composition and laminate |
| JP2008163121A (en) * | 2006-12-27 | 2008-07-17 | Nippon Shiima Kk | Resin composition |
| EP2559747B1 (en) | 2010-04-16 | 2015-09-16 | Kaneka Corporation | Adhesive resin composition and molded products |
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| JP5921946B2 (en) * | 2012-04-26 | 2016-05-24 | ヘンケルジャパン株式会社 | Hot melt adhesive |
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| JP5925094B2 (en) | 2012-09-27 | 2016-05-25 | ヘンケルジャパン株式会社 | Hot melt adhesive for labels |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513719A (en) * | 1978-07-14 | 1980-01-30 | Asahi Chem Ind Co Ltd | Novel adhesive resin composition |
| JPS56104978A (en) * | 1980-01-28 | 1981-08-21 | Asahi Chem Ind Co Ltd | Adhesive composition |
| US5070143A (en) * | 1989-03-09 | 1991-12-03 | Morton International, Inc. | Adhesive blend of polyolefins and grafted block copolymer of polystyrene |
| JP2909169B2 (en) * | 1990-08-10 | 1999-06-23 | 三井化学株式会社 | Adhesive resin composition and laminate using the same |
| JPH06322346A (en) * | 1993-05-11 | 1994-11-22 | Sekisui Chem Co Ltd | Production of synthetic resin-lining pipe and hot-melt adhesive |
| JP3671625B2 (en) * | 1997-10-29 | 2005-07-13 | 三菱化学株式会社 | Adhesive resin composition, laminate and stretched film |
| JP4034857B2 (en) * | 1997-02-12 | 2008-01-16 | 三菱化学株式会社 | Manufacturing method of laminate |
| JPH10265751A (en) * | 1997-03-26 | 1998-10-06 | Mitsubishi Chem Corp | Adhesive resin composition, laminate and multilayer stretch molded article |
| JP3669105B2 (en) * | 1997-03-26 | 2005-07-06 | 三菱化学株式会社 | Multi-layer stretch molding |
-
1997
- 1997-10-29 JP JP29702597A patent/JP3671626B2/en not_active Expired - Lifetime
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| Publication number | Publication date |
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| JPH10279774A (en) | 1998-10-20 |
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