JP3671886B2 - Substrate, electro-optical device, electronic apparatus, component mounting method, and electro-optical device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wiring board in which wiring is provided on a substrate, to an electro-optical device such as a liquid crystal device and an EL (Electro Luminescence) device, and to an electronic apparatus configured using the electro-optical device. The present invention relates to a mounting method for mounting a component such as an IC on a substrate, and further relates to a manufacturing method for manufacturing the electro-optical device.
[0002]
[Prior art]
A wiring substrate formed by mounting an IC chip on a substrate is conventionally known. In an electro-optical device such as a liquid crystal device or an EL device, a so-called COG (Chip On Glass) type electro-optical system in which an IC chip is directly mounted on a surface of a substrate supporting an electro-optical material such as a liquid crystal or an EL. Devices are also known from the prior art.
[0003]
As a method of mounting an IC chip on a substrate, a method of mounting an IC chip on a substrate using a conductive adhesive film such as an ACF (Anisotropic Conductive Film) is known. In this mounting method, a conductive adhesive film that is slightly larger than the outer shape of the IC chip is attached to a mounting target position on the substrate, for example, attached, and then the IC chip is placed on the mounting target position on the substrate from the conductive adhesive film. Further, so-called thermocompression bonding is performed by pressing the IC chip against the substrate while heating, thereby mounting the IC chip on the substrate.
[0004]
[Problems to be solved by the invention]
Conventionally, when manufacturing a wiring board, an electro-optical device or the like using a conductive adhesive film, when mounting the conductive adhesive film on the substrate, mounting of components such as an IC chip from the wiring formed on the board The target position was estimated by visual observation, and the conductive adhesive film was mounted on the substrate manually or by an automatic machine according to the estimated result.
[0005]
However, in this method, the conductive adhesive film is removed from the region where the wiring formed on the substrate and the terminal of the component such as an IC chip face each other, and therefore, the conductive connection between the wiring and the component terminal. There was a risk of failure. In order to avoid the occurrence of such a defect, the size of the conductive adhesive film with respect to the outer shape of the IC chip must be set with a large margin. However, in the case where the conductive adhesive film is formed with a large margin in this way, there has been a problem that the cost of parts related to the conductive adhesive film becomes very high.
[0006]
The present invention has been made in view of the above-described problems, and an object thereof is to make it possible to easily and accurately mount a conductive adhesive film having a minimum necessary size at a mounting target position. .
[0007]
[Means for Solving the Problems]
(1) In order to achieve the above object, a substrate according to the present invention is a substrate on which wiring is formed, and a component on which a component is mounted by a conductive adhesive film, wherein the mounting target position of the conductive adhesive film is There are at least two alignment marks for the conductive adhesive film provided in the vicinity of the peripheral edge with the conductive adhesive film interposed therebetween, and the alignment mark has a dimension corresponding to an attachment tolerance of the conductive adhesive film to the substrate. It is characterized by having.
[0012]
In this way, if the alignment mark is formed with a dimension corresponding to the allowable attachment error of the conductive adhesive film, it can be directly determined by the viewing angle whether the mounting position of the conductive adhesive film is within the allowable error or the deviation. Therefore, accurate determination can be performed in an extremely short time.
[0013]
(2) Next, in the substrate according to the present invention, the alignment mark may be any one of a square, a rectangle, an L shape, a triangle, and a circle. In the case of a square and a rectangle, adjacent sides can be used as length components in the two vertical and horizontal directions of the conductive adhesive film. Further, in the case of the L shape, each L-shaped branch portion can be used as a length component in two vertical and horizontal directions of the conductive adhesive film. In the case of a triangle, the base and the perpendicular can be used as length components in the two vertical and horizontal directions of the conductive adhesive film. In the case of a triangle, it is particularly desirable to use a right triangle. In this case, the adjacent sides sandwiching the right angle can be used as a length component in two vertical and horizontal directions of the conductive adhesive film. In the case of a circular shape, the vertical and horizontal diameters can be used as length components in the two vertical and horizontal directions of the conductive adhesive film. In addition, the shape of the alignment mark can be made into an appropriate shape other than the above as required.
[0014]
(3) Next, in the substrate according to the present invention, the alignment mark can be provided corresponding to each of the four corners of the conductive adhesive film. In this way, the position of the conductive adhesive film in two vertical and horizontal directions can be determined more accurately than when only one pair of the conductive adhesive films is provided in one diagonal direction. A positional deviation can also be determined.
[0015]
(4) Next, in the substrate according to the present invention, the length component L1 along the width direction of the conductive adhesive film of the alignment mark is the length along the length direction of the conductive adhesive film of the alignment mark. It can be made smaller than the component L2. As a result, it is possible to directly determine whether the mounting position of the conductive adhesive film is within an allowable error or not based on the viewing angle, so that accurate determination can be performed in an extremely short time.
(5) Further, the length component L1 is set to be equal to a plus or minus one-side value of the pasting accuracy in the width direction of the conductive insulating film, and the length component L2 is pasted in the length direction of the conductive insulating film. The same effect can be obtained even if the precision is set equal to twice the plus / minus one-sided value.
[0018]
(6) Next, an electro-optical device according to the present invention is an electro-optical device in which an electro-optical material is supported by a substrate on which wiring is formed. The substrate includes a component mounted by a conductive adhesive film, Near the periphery of the mounting target position of the conductive adhesive film, and having at least two alignment marks for the conductive adhesive film provided across the conductive adhesive film,
The alignment mark has a size corresponding to a tolerance of attachment of the conductive adhesive film to the substrate.
[0019]
According to the electro-optical device having this configuration, in manufacturing the substrate which is the component, the conductive adhesive film for mounting the component on the substrate can be mounted in an accurate position in a short time. The optical device can be manufactured in a short time, and the reliability related to the built-in wiring board can be improved.
[0020]
As the electro-optical device, a liquid crystal device using a liquid crystal as an electro-optical material, an EL device using an EL material as an electro-optical material, and the like are conceivable.
[0025]
(7) Next, an electro-optical device according to the present invention includes: a first substrate that supports an electro-optical material; and a substrate that is connected to the first substrate and on which wiring is formed. The substrate on which the wiring is formed has at least two parts of the conductive adhesive film provided by sandwiching the conductive adhesive film between the component mounted by the conductive adhesive film and the periphery of the mounting target position of the conductive adhesive film The alignment mark has a size corresponding to an attachment tolerance of the conductive adhesive film to the substrate on which the wiring is formed.
[0026]
According to the electro-optical device of this configuration, when manufacturing the wiring board that is the component, the conductive adhesive film for mounting the component on the substrate can be mounted in an accurate position in a short time. The electro-optical device can be manufactured in a short time, and the reliability of the built-in wiring board can be improved.
[0031]
(8) Next, an electronic apparatus according to the present invention is an electronic apparatus having an electro-optical device that displays an image and a housing that supports the electro-optical device, and the electro-optical device has the configuration described above. The electro-optical device is configured by any one of the electro-optical devices.
[0032]
(9) Next, a component mounting method according to the present invention is a component mounting method in which a component is mounted on a substrate on which a wiring is formed using a conductive adhesive film, in the vicinity of the periphery of the mounting target position of the conductive adhesive film. , At least two alignment marks for the conductive adhesive film provided across the conductive adhesive film, and having a dimension corresponding to an attachment tolerance of the conductive adhesive film to the substrate on which the wiring is formed. The alignment mark comprises a step of attaching the conductive adhesive film on the substrate and a step of fixing the component to the conductive adhesive film attached on the substrate, the alignment mark comprising the conductive mark It has a size corresponding to an attachment tolerance of the adhesive film to the substrate.
[0033]
According to the component mounting method of this configuration, it is determined whether or not the position of the conductive adhesive film attached on the substrate is normal with reference to the alignment mark, so that the conductive adhesion is based on the wiring on the substrate as in the past. Compared with the case of estimating the mounting position of the film, the conductive adhesive film can be mounted at an accurate position in a short time. When mounting the conductive adhesive film using an automatic bonding device, if the mounting position of the conductive adhesive film can be accurately determined in a short time, the conditions for the automatic bonding device can be determined, that is, the device can be adjusted. It can be completed in a short time.
[0040]
(10) Next, an electro-optical device manufacturing method according to the present invention includes an electro-optical panel forming process in which an electro-optical material is supported by a substrate on which wiring is formed, and
Mounting a component on the board,
The step of mounting the component is realized by the component mounting method according to claim 9.
[0041]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
FIG. 1 shows an embodiment of a wiring board according to the present invention in an exploded state. The wiring substrate 1 shown here is formed by mounting an IC chip 4 as a component on the surface of a substrate 2 with an ACF 3 as a conductive adhesive film.
[0042]
The substrate 2 is formed by forming wirings 7 on the base layer 6 and forming input side terminals 8 a, output side terminals 8 b, and mounting side terminals 9 at the tips of the wirings 7. Reference numeral 11 denotes a circuit unit, and a chip component 23 such as a chip capacitor or a chip resistor is mounted on the circuit unit 11 by, for example, soldering.
[0043]
On the wiring 7, for example, a cover lay is formed of polyimide or a resist is formed. However, in FIG. 1, the illustration of the cover lay and the resist is omitted. In addition, the wiring 7 may be formed on the back surface of the base layer 6, and in that case, a conductive through hole is provided in order to establish conduction between the wiring 7 on the front surface side and the wiring 7 on the back surface side. Sometimes.
[0044]
The base layer 6 is formed to have flexibility by, for example, polyimide. The wiring 7 is formed by, for example, subjecting Cu (copper) to photoetching. Each terminal 8a, 8b, 9 is formed by laminating a gold layer on a Ni (nickel) layer, for example.
[0045]
In FIG. 1, an IC chip 4 is formed in a substantially rectangular parallelepiped shape, and a plurality of terminals, that is, bumps 12 are formed on its active surface. These bumps 12 are arranged in a ring shape slightly inward from the outer shape of the IC chip 4. These bumps 12 are formed so as to slightly protrude from the active surface 4a of the IC chip 4 as shown in FIG.
[0046]
The ACF 3 is a conductive material used to electrically connect the opposing terminals together while providing anisotropy between a pair of opposing terminals, ie, without conducting between non-opposing terminals. For example, the polymer film is formed by dispersing a large number of conductive particles 14 in a thermoplastic or thermosetting resin film 13. By applying pressure to the substrate 2 while heating the IC chip 4 with the ACF 3 interposed therebetween, that is, by thermocompression bonding, electrical conductivity in a single direction can be obtained between the bumps 12 of the IC chip 4 and the terminals 9 on the substrate 2. Realize the connection you have.
[0047]
In FIG. 1, four alignment marks 16 are provided in the vicinity of the periphery of the mounting target position P of the ACF 3 and the mounting target position Q of the IC chip 4 corresponding to the four corners of the ACF 3 and the IC chip 4. Four other alignment marks 17 are provided outside the alignment mark 16. These alignment marks 16 and 17 can be formed simultaneously with the patterning of the wiring 7, the terminal 9, and the like, for example.
[0048]
The inner alignment mark 16 is an alignment mark for inspecting the mounting position of the ACF 3, and the outer alignment mark 17 is an alignment mark for confirming the mounting position of the IC chip 4. The alignment mark 17 for the IC chip 4 can be formed inside the alignment mark 16 for the ACF 3, but is preferably provided outside the alignment mark 16. This is to prevent the alignment mark 17 from being hidden by the ACF 3.
[0049]
In the present embodiment, as shown in FIG. 3, the four alignment marks 16 are provided so as to sandwich the ACF 3 in two, two in each of the two diagonal directions of the ACF 3. Only two may be provided in one diagonal direction.
[0050]
Further, the alignment mark 16 of the present embodiment is formed in a rectangular shape, but instead of this, a square shape as shown in FIG. 4A, an L-shape as shown in FIG. A triangular shape as shown in FIG. 4C, particularly a right triangle, or a circular shape as shown in FIG. In any shape, the alignment mark 16 includes a length component L1 in the vertical direction (that is, the Y direction) of the mounting target position P of the ACF 3 and a length component L2 in the horizontal direction (that is, the X direction). Have. Then, the length components L1 and L2 of each direction of the alignment mark 16 are determined in association with an allowable error regarding each direction from the mounting target position P of the ACF3. When the ACF 3 is pasted by an automatic machine, the pasting accuracy of the automatic machine is an allowable error regarding the pasting position of the ACF 3.
[0051]
Since the wiring board 1 according to the present embodiment is configured as described above, when the wiring board 1 is viewed from the direction of arrow A in FIG. 1, the ACF 3 is mounted within the mounting target position P and its allowable error range. As a result, no part of the ACF 3 is moved outside the area defined by the outer edge of the alignment mark 16, so that it is very easy, quick and accurate to visually confirm that the ACF 3 mounting position is normal. Can be determined. Thereby, when the bump 12 of the IC chip 4 and the terminal 9 on the substrate 2 are conductively connected by the ACF 3, it is possible to reliably prevent the occurrence of a conductive failure due to the positional deviation of the ACF 3.
[0052]
(Second Embodiment)
FIG. 5 is a process diagram showing an embodiment of a component mounting method according to the present invention. In the mounting method of the present embodiment, the wiring board 1 shown in FIG. 1 is manufactured. In the mounting method of the present embodiment, first, the ACF 3 is mounted at the mounting target position P on the substrate 2 in FIG. 1 in step P1, and then the IC chip 4 in FIG. 1 is mounted from the ACF 3 on the mounting target position in step P2. Mount by thermocompression bonding to Q.
[0053]
The ACF sticking process P1 of FIG. 5 is performed as shown in FIG. 6, for example. In FIG. 6, the substrate 2 is placed on a support base 18. At a position facing the support base 18, an ACF 21 with a mount that is pulled out from the reel 29 is disposed. The ACF 21 with the mount is formed by attaching an ACF 3 material having a predetermined width W to the surface of the mount 22.
[0054]
In the present embodiment, the ACF 21 with mount is processed by an automatic sticking device. Although this automatic sticking apparatus does not show the detailed structure in FIG. 6, functionally,
(1) intermittently transporting the ACF 21 with a mount in the longitudinal direction with a length L0 of one ACF 3 as indicated by an arrow B;
{Circle around (2)} Before the ACF 3 comes to a position facing the substrate 2, the long ACF material that adheres to the mount 22 is cut into a single sheet of ACF 3 without cutting the mount 22;
(3) Move the ACF 21 with mount as shown by arrow C to bring the ACF material into contact with the surface of the substrate 2;
{Circle around (4)} ACF 21 with a mount contacting the surface of substrate 2 is pressed against substrate 2 with an appropriate pressure from the side of mount 22 as indicated by arrow E to adhere ACF 3 to substrate 2;
{Circle around (4)} Functions such as moving the ACF 21 with a mount away from the surface of the substrate 2 as indicated by an arrow D are provided.
[0055]
In the automatic pasting apparatus for ACF3 used in this embodiment, the pasting accuracy δy in the vertical direction (Y direction: that is, the direction perpendicular to the ACF transport direction B) in FIG. 3 is ± 0.2 mm as the pasting accuracy of ACF3. The apparatus is such that the sticking accuracy δx in the lateral direction (X direction: ACF conveying direction B) is ± 0.25 mm.
[0056]
When this apparatus is used, with respect to the alignment mark 16 provided on the substrate 2, the inner peripheral edge 16x in the horizontal direction (X direction) coincides with the outer shape line of the mounting target position of the IC chip 4, and the vertical direction (Y direction). Is aligned with the width W of the mounting target position of the ACF 3.
[0057]
The length component L1 along the width direction (Y direction) of the ACF 3 with respect to the alignment mark 16 is set to 0.2 mm, which is equal to the plus / minus one-side value of the pasting accuracy δy in the same direction of the automatic pasting apparatus. On the other hand, the length component L2 along the length direction (X direction) of the ACF 3 with respect to the alignment mark 16 is equal to twice the plus / minus one-side value of the pasting accuracy δx in the same direction of the automatic pasting device to 0.5 mm. Set. As described above, the difference in the length component of the alignment mark 16 between the width direction and the length direction of the ACF 3 is that the width W of the ACF 3 is set to a predetermined value in advance, while the length L 0 of the ACF 3 is set. This is because it is determined by cutting every pasting process by an automatic machine in FIG.
[0058]
Under the above conditions, in FIG. 6, when one ACF 3 portion of the ACF 21 with the mount is transported before the mounting target position P on the substrate 2, the transport of the ACF 21 with the mount in the B direction is stopped. The Next, the ACF 21 with the mount is translated in the direction of arrow C so that one ACF 3 comes into contact with the mounting target position P, and the ACF 3 is pressed with an appropriate force as indicated by arrow E. It is adhered to the mounting target position P.
[0059]
Thereafter, when the ACF 21 with the mount is separated from the substrate 2 as indicated by the arrow D, the ACF 21 remains on the substrate 2 and only the mount 22 is separated from the substrate 2. Thereby, one ACF 3 is mounted at a predetermined position on one substrate 2, and the ACF attaching step P1 in FIG. 5 is completed.
[0060]
Thereafter, in the IC chip mounting step P2 of FIG. 1, the IC chip 4 is placed on the substrate 2 from the top of the ACF 3 on the basis of another alignment mark 17 shown in FIG. 3, and the heated head is replaced with the IC chip. The IC chip 4 is heated and pressed, that is, thermocompression-bonded, by being pressed against the upper surface of 4. By this thermocompression bonding, as shown in FIG. 2, the body portion of the IC chip 4 is mechanically bonded to the substrate 2 by the resin film 13, while the bumps 12 of the IC chip 4 and the terminals 9 on the substrate 2 are electrically conductive. Conductive connection is made by particles 14.
[0061]
Thereafter, in the process P3 of FIG. 5, an inspection process is performed. Specifically, in FIG. 1, whether the ACF 3 is attached to the determined position by visually observing the wiring board 1 formed by mounting the ACF 3 and mounting the IC chip 4 from the direction of the arrow A. Inspect whether. In FIG. 3, if all four corners of the ACF 3 are inside the outer edge of the alignment mark 16, it is determined that the ACF 3 is mounted in a normal position, and at least any of the four corners of the ACF 3 If one of them is out of the outer edge of the alignment mark 16, it is determined that the ACF 3 mounting position is defective.
[0062]
If it is determined that the position of the ACF 3 is defective in this inspection, it is determined as “NO” in step P4 of FIG. 5, and the process returns to step P1 to reset the conditions of the ACF automatic pasting apparatus, The ACF 3 attachment position is adjusted based on the inspection result of step 3. At this time, the vertical and horizontal length components L1 and L2 of the alignment mark 16 are determined in accordance with the application accuracy of the automatic application device, that is, the application tolerance of the ACF3. Determination can be made automatically and quantitatively, and therefore the conditions of the automatic sticking apparatus can be reset accurately in a very short time.
[0063]
(Third embodiment)
FIG. 7 shows a liquid crystal device which is an example of an electro-optical device according to the present invention, and illustrates a case where the present invention is applied to a reflective COG (Chip On Glass) liquid crystal device. In the liquid crystal device 31 shown here, a liquid crystal driving IC 36 as a component is mounted using a ACF 3 on a liquid crystal panel 34 formed by bonding a first substrate 32a and a second substrate 32b with an annular sealing material 33. Formed by. In addition, an opening 38 for liquid crystal injection is formed in a part of the sealing material 33.
[0064]
As shown in FIG. 8, a gap, so-called cell gap, is formed between the first substrate 32a and the second substrate 32b, and the liquid crystal LC injected through the opening 38 (see FIG. 7) is enclosed in the cell gap. Is done.
[0065]
The first substrate 32a has a base material 37a, a reflective film 39 is formed on the liquid crystal side surface of the base material 37a, a plurality of first electrodes 41a are formed thereon, and an alignment film 42a is formed thereon. The A polarizing plate 43a is formed on the outer surface of the substrate 37a. The second substrate 32b facing the first substrate 32a has a base material 37b, a color filter 44 is formed on the liquid crystal side surface of the base material 37b, a plurality of second electrodes 41b are formed thereon, and a top thereof. The alignment film 42b is formed. A polarizing plate 43b is formed on the outer surface of the substrate 37b.
[0066]
The base materials 37a and 37b are formed of, for example, glass or plastic. The reflective film 39 is made of, for example, Al (aluminum). The electrodes 41a and 41b are made of, for example, ITO (Indium Tin Oxide). The alignment films 42a and 42b are made of, for example, polyimide, and an alignment process such as a rubbing process is performed thereon.
[0067]
Between the first substrate 32a and the second substrate 32b, a large number of spacers 46 dispersed on either one of the substrates are interposed, and the cell gap is maintained at a constant size by these spacers 46. In addition, a conductive material 47 is mixed in the seal material 33.
[0068]
The first substrate 32a has a portion 32c that projects outward from the first substrate 32b. As shown in FIG. 7, the ACF 3 is mounted on the mounting target position P on the surface of the protruding portion 32c, and the mounting target position Q is further reached. A liquid crystal driving IC 36 is mounted. The plurality of first electrodes 41a provided on the first substrate 32a are arranged in parallel to each other and formed in a stripe shape as a whole, and the plurality of second electrodes 41b provided on the second substrate 32b are the first electrodes 41a. As a whole, the stripes are arranged in a stripe shape so as to extend in a perpendicular direction.
[0069]
On the surface of the first substrate 32a, a wiring 48 connecting the terminal 49 and the first electrode 41a formed inside the mounting target position Q of the liquid crystal driving IC 36 is formed through the sealing material 33. In addition, a wiring 52 is formed to connect the terminal 51 formed at the side edge of the overhang portion 32c and the terminal 49 formed inside the mounting target position Q. Furthermore, a wiring 53 is formed that extends from a terminal 49 formed on a side portion inside the mounting target position Q, passes through the sealing material 33, and extends slightly inside the sealing material 33. The wirings 48, 52, and 53 are all formed of the same material as the first electrode 41a, that is, ITO by the same process.
[0070]
On the surface of the second substrate 32b, the wiring 54 extending from the second electrode 41b to the side edge of the second substrate 32b is formed by the same material, that is, ITO, in the same process. When the first substrate 32 a and the second substrate 32 b are bonded together by the sealing material 33, the conductive material 47 in which the wiring 53 on the first substrate 32 a and the wiring 54 on the second substrate are mixed inside the sealing material 33. (See FIG. 8).
[0071]
In the substrate overhanging portion 32c, a total of four alignment marks 16 are provided, one in the vicinity of the periphery of the four corners of the mounting target position P of the ACF3. Further, another alignment mark 17 is provided on the outside of each alignment mark 16, one each. The alignment mark 16 is for confirming the position of the ACF 3, and the other alignment mark 17 is for confirming the position of the liquid crystal driving IC 36.
[0072]
The shapes, the formation positions, and the like of the alignment marks 16 and 17 can be the same as those in the previous embodiment shown in FIG. However, in the case of the embodiment shown in FIG. 1, the alignment marks 16 and 17 are made of the same Cu as the wiring 7. However, in this embodiment shown in FIG. 7, the alignment marks 16 and 17 are made of the same ITO as the first electrode 41a. Yes.
[0073]
In the present embodiment, the ACF 3 is mounted at the mounting target position P on the substrate extension 32c, and the liquid crystal driving IC 36 is mounted at the mounting target position Q by thermocompression bonding. Then, the liquid crystal drive IC 36 after mounting is observed from the direction of the arrow F, and in FIG. 3, by comparing the positions of the alignment mark 16 and the four corners of the ACF 3, the ACF 3 is mounted at a normal position. It can be determined visually whether or not.
[0074]
In FIG. 7, the process for attaching the liquid crystal driving IC 36 to the predetermined position of the substrate overhanging portion 32c of the liquid crystal panel 34 using the ACF 3 can be performed according to the mounting method shown in FIG. Can also be performed according to the method shown in FIG. Also, the shape of the alignment mark 16 can be modified to various shapes shown in FIGS. 4 (a) to 4 (d).
[0075]
(Fourth embodiment)
FIG. 9 shows an embodiment in which the wiring pattern on the substrate extension 32c and the method of forming the alignment marks 16 and 17 are modified in the liquid crystal device 31 shown in FIG.
[0076]
In the embodiment shown in FIG. 7, the alignment mark 16 for the ACF 3 is formed as a dedicated alignment mark. In contrast, in the present embodiment shown in FIG. 9, the alignment mark 16a on the side close to the second substrate 32b is formed as a dedicated alignment mark, while the remaining alignment mark 16b is a wiring formed on the substrate overhanging portion 32c. 56 is used.
[0077]
Specifically, these alignment marks 16b are formed by forming a rectangular cutout and a rectangular opening in a part of the wiring 56, thereby causing the length component L1 in the vertical direction Y of the ACF3, that is, the width W direction. And a length component L2 in the lateral direction X of ACF3, that is, in the length direction X, that is, in the transport direction of ACF3.
[0078]
According to this embodiment, by comparing the alignment marks 16a and 16b with the four corners of the ACF 3 by visual observation, it is easy to determine whether the ACF 3 is normally mounted at a desired position in a short time and accurately. Can be determined. Further, the alignment mark 16 can be provided even when the wiring is patterned with high density.
[0079]
(Fifth embodiment)
In the embodiment shown in FIG. 7, the first substrate 32a constituting the liquid crystal device 31 is considered as a wiring substrate, and a liquid crystal driving IC 36 is directly mounted on the first substrate 32a by the ACF 3 so-called COG type liquid crystal. I thought of the device. However, the present invention is not limited to such a COG type liquid crystal device, but can be applied to a liquid crystal device having the following configuration.
[0080]
That is, in the liquid crystal panel 34 of FIG. 7, the liquid crystal driving IC 36 is not mounted on the substrate extension portion 32c, but only the terminals 51 are formed and these terminals 51 are connected to the wirings 48 on the substrate extension portion 32c. On the other hand, a liquid crystal driving IC is mounted on the substrate 2 as the IC chip 4 in the wiring substrate 1 shown in FIG. Then, the output side terminal 8b of the wiring board 2 formed as described above is connected to the terminal 51 of the liquid crystal panel 34 formed as described above by thermocompression bonding using, for example, ACF, so that the liquid crystal device is obtained. Can be configured. In the liquid crystal device having such a structure, the present invention can be applied when the wiring board 1 is configured.
[0081]
(Sixth embodiment)
FIG. 10 shows an embodiment of a mobile phone which is an example of an electronic apparatus according to the invention. A cellular phone 90 shown here is configured by storing various components such as an antenna 91, a speaker 92, a liquid crystal device 100, a key switch 93, a microphone 94, and the like in an exterior case 96 as a casing. In addition, a control circuit board 97 on which a control circuit for controlling the operation of each component described above is provided inside the exterior case 96.
[0082]
The liquid crystal device 100 is configured by, for example, the liquid crystal device 31 illustrated in FIG. Instead of the liquid crystal device 100, another liquid crystal device according to the present invention, or an electro-optical device other than the liquid crystal device, for example, an EL (Electro Luminescence) device can be used.
[0083]
In the cellular phone 90, a signal input through the key switch 93 and the microphone 94, reception data received by the antenna 91, and the like are input to the control circuit on the control circuit board 97. Then, the control circuit displays an image such as a number, a character, and a pattern on the display surface of the liquid crystal device 1 based on various input data, and further transmits transmission data via the antenna 91.
[0084]
(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
[0085]
For example, the wiring board according to the present invention is not limited to the shape shown in FIG. Further, the shape of the IC chip 4 and the ACF 3 is not limited to a rectangle, but may be any other shape. In addition, when a conductive adhesive film other than ACF can be used, the case where the conductive adhesive film is used is also included in the technical scope of the present invention.
[0086]
The liquid crystal device shown in FIG. 7 is a simple matrix type liquid crystal device that does not use a switching element, but an active matrix type liquid crystal device having a structure using a two-terminal type switching element such as a TFD (Thin Film Diode) as an active element. The present invention can also be applied to a liquid crystal device and an active matrix liquid crystal device having a structure using a three-terminal switching element such as a TFT (Thin Film Transistor) as an active element.
[0087]
The electro-optical device according to the invention is not limited to a liquid crystal device. The present invention can also be applied to other electro-optical devices, for example, EL devices that use EL as an electro-optical material.
[0088]
The electronic device according to the present invention is not limited to a mobile phone, and may be a portable information terminal, a video camera, or any other device that needs to display information such as characters, numbers, and figures.
[0089]
【The invention's effect】
As described above, according to the present invention, the quality of the mounting position of the conductive adhesive film such as ACF is determined on the basis of the alignment mark, so that the conductive adhesive film can be formed based on the wiring on the substrate as in the past. Compared to the case where the mounting position is estimated, the conductive adhesive film can be mounted at an accurate position in a short time.
[0090]
In addition, when performing the mounting of the conductive adhesive film using an automatic sticking device, the determination of the mounting position of the conductive adhesive film can be accurately performed in a short time as described above, thereby obtaining the conditions for the automatic sticking device, That is, the adjustment of the apparatus can be completed accurately in a short time.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a wiring board according to the present invention in an exploded state.
2 is a cross-sectional view showing a mounted state of an IC chip according to the line II-II in FIG.
3 is a plan view showing the vicinity of the IC chip and the alignment mark from the direction of arrow A in FIG. 1. FIG.
FIG. 4 is a diagram showing a modification of the alignment mark.
FIG. 5 is a process diagram showing an embodiment of a component mounting method according to the present invention.
6 is a perspective view showing one process in the process chart of FIG. 5. FIG.
FIG. 7 is a perspective view showing one embodiment of a liquid crystal device as an example of an electro-optical device according to the invention in an exploded state.
8 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device according to the line VIII-VIII in FIG.
FIG. 9 is a plan view showing a main part of another embodiment of a liquid crystal device which is an example of an electro-optical device according to the invention.
FIG. 10 is a perspective view showing an embodiment of a mobile phone which is an example of an electronic apparatus according to the invention.
[Explanation of symbols]
1 Wiring board
2 Substrate
3 ACF (conductive adhesive film)
4 IC chip (parts)
6 Base layer
7 Wiring
9 terminals
11 Circuit part
12 Bump
16 Alignment mark
16a, 16b Alignment mark
17 Alignment mark
21 ACF with mount
22 Mount
31 Liquid crystal device (electro-optical device)
32a, 32b substrate
32c Substrate overhang
34 LCD panel
36 Liquid crystal drive ICs (parts)
41a, 41b electrode
48, 52, 53, 54, 56 Wiring
49 terminals
90 Mobile phone (electronic equipment)
100 Liquid crystal device (electro-optical device)
LC liquid crystal
L0 ACF length
L1, L2 Length component of alignment mark
Mounting position of PACF
Q IC chip mounting target position

Claims (10)

In a substrate on which wiring is formed, and a component is mounted by a conductive adhesive film,
At least two alignment marks for the conductive adhesive film provided near the periphery of the mounting target position of the conductive adhesive film with the conductive adhesive film interposed therebetween,
The substrate is characterized in that the alignment mark has a dimension corresponding to an attachment tolerance of the conductive adhesive film to the substrate. The substrate of claim 1,
The alignment mark for the conductive adhesive film is any one of a square, a rectangle, an L shape, a triangle, and a circle. The substrate according to claim 1 or 2, wherein
An alignment mark for the conductive adhesive film is provided corresponding to each of the four corners of the conductive adhesive film. A substrate according to any one of claims 1 to 3,
The length component L1 along the width direction of the conductive adhesive film of the alignment mark is smaller than the length component L2 along the length direction of the conductive adhesive film of the alignment mark. A substrate according to claim 4, wherein
The length component L1 is set equal to a plus / minus one-side value of the pasting accuracy in the width direction of the conductive insulating film,
The length component L2 is set equal to twice the plus / minus one-side value of the sticking accuracy in the length direction of the conductive insulating film. In an electro-optical device that supports an electro-optical material by a substrate on which wiring is formed,
The substrate is a component mounted by a conductive adhesive film,
Near the periphery of the mounting target position of the conductive adhesive film, having at least two alignment marks for the conductive adhesive film provided across the conductive adhesive film,
2. The electro-optical device according to claim 1, wherein the alignment mark has a size corresponding to an attachment tolerance of the conductive adhesive film to the substrate. An electro-optical device having a first substrate that supports an electro-optical material and a substrate that is connected to the first substrate and on which wiring is formed.
The substrate on which the wiring is formed is a component mounted by a conductive adhesive film,
Near the periphery of the mounting target position of the conductive adhesive film, having at least two alignment marks for the conductive adhesive film provided across the conductive adhesive film,
2. The electro-optical device according to claim 1, wherein the alignment mark has a size corresponding to a tolerance of attachment of the conductive adhesive film to the substrate on which the wiring is formed.   An electronic apparatus having an electro-optical device that displays an image and a housing that supports the electro-optical device, wherein the electro-optical device includes the electro-optical device according to claim 6 or 7. Electronics. In a component mounting method in which a component is mounted by a conductive adhesive film on a substrate on which wiring is formed.
At least two alignment marks for the conductive adhesive film provided in the vicinity of the periphery of the mounting target position of the conductive adhesive film with the conductive adhesive film interposed therebetween, and the substrate on which the wiring of the conductive adhesive film is formed A step of depositing the conductive adhesive film on the substrate with reference to an alignment mark having a dimension corresponding to a mounting tolerance with respect to
Fixing the component to the conductive adhesive film attached on the substrate,
The component mounting method according to claim 1, wherein the alignment mark has a dimension corresponding to a tolerance of attachment of the conductive adhesive film to the substrate. An electro-optical panel forming process in which an electro-optical material is supported by a substrate on which wiring is formed;
Mounting a component on the board,
The method of manufacturing an electro-optical device according to claim 9, wherein the component mounting step is realized by the component mounting method according to claim 9.

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