JP3673965B2 - Polishing equipment - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to a polishing apparatus that has an upper surface plate and a lower surface plate to perform double-side polishing processing, and can perform single-side polishing processing and precision single-side polishing processing.
[0002]
[Prior art]
Japanese Patent Application Laid-Open No. 10-264012 discloses a double-side polishing apparatus having an upper surface plate and a lower surface plate, and having a pressure control mechanism that can linearly depressurize the lower surface plate of the upper surface plate. Japanese Patent Laid-Open No. 2000-033559 discloses a sun gear and an internal gear, an external gear-shaped work holding carrier that meshes with both gears and moves around the sun gear, and is held by each carrier. A flat polishing apparatus having upper and lower surface plates for polishing both surfaces of a workpiece is disclosed.
[0003]
[Problems to be solved by the invention]
However, the polishing equipment as described above can handle only one type of polishing, and when various types of polishing are required, such as for research and creation of prototypes, each type of polishing is supported. This causes a problem that a prepared device must be prepared.
[0004]
For this reason, this invention is providing the polishing apparatus which can respond to several types of polishing processes.
[0005]
[Means for Solving the Problems]
Therefore, the present invention provides a rotating shaft that is rotated by the first driving means, a sun gear that is provided around the rotating shaft and rotates together with the rotating shaft, and that is provided around the sun gear and is rotated by the second driving means. And a lower surface plate comprising at least an internal gear provided around the lower polishing plate, and an upper surface plate for rotatably holding an upper polishing plate that meshes with the rotating shaft and rotates. And an upper surface plate support mechanism for moving the upper surface plate up and down relative to the lower surface plate, a thrust bearing that holds the rotating shaft in the axial direction, and a predetermined position near the outside of the lower surface plate a swing arm base provided on a third driving means arranged on the swing arm base near a plurality of arm attachment portion disposed at a predetermined position outside the vicinity of the lower surface plate And detachable from the swing arm base A swing arm that swings by the third drive means, a carrier holding arm that is detachable to the arm mounting portion, a single-side polishing carrier that is detachable to the carrier holding arm, and a detachable to the upper end of the rotary shaft. A circular polishing plate .
[0006]
In the present invention, at least one of the double-side polishing carriers on which the work is mounted is mounted so as to mesh with the sun gear and the internal gear, and the upper surface plate is lowered with respect to the lower surface plate. Then, the double-side polishing carrier is sandwiched and the first and second driving means are driven to perform double-side polishing.
[0007]
Further, the carrier holding arm is attached to at least one of the arm attachment portions, and a cylindrical single-side polishing carrier on which a work is mounted by the carrier holding arm is held on the lower polishing plate, and the second polishing plate One-side polishing is performed by driving the driving means. The carrier holding arm is fixed to the arm mounting portion and extends on the lower polishing plate, and has an extending arm portion having a mounting portion on which a single-side polishing carrier to which a workpiece is mounted is disposed. The fixed arm portion is fixed to the output arm portion and holds the single-side polishing carrier. Furthermore, a plurality of rollers for freely rotating the single-side polishing carrier are disposed on the extending arm portion and the fixed arm portion. The cylindrical single-side polishing carrier preferably meshes with at least one of the sun gear and the internal gear.
[0008]
Furthermore, the circular polishing plate is mounted on the rotating shaft, the swing arm is mounted on the swing arm base, and a swing carrier having a work mounted on the tip of the swing arm is fixed. The first and third driving means are driven to perform precision single-side polishing. This precision single-side polishing process is a so-called Oscar type polishing process. At this time, since the rotary shaft is held in the axial direction by the thrust bearing, the accuracy of the vertical position of the circular polishing plate can be improved.
[0009]
The swing arm is connected to a swing fulcrum fixed as a fulcrum to the arm base and a third driving means that rotates, and swings at a predetermined angle about the drive fulcrum. And a carrier holding arm extending from the swing point to the circular polishing plate side.
[0010]
The first, second and third driving means are preferably electric motors, and are preferably rotary shafts connected to the electric motor via gears or the like.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0012]
As shown in FIGS. 1 and 2, the polishing apparatus 1 according to the present invention includes a main body case 2, a lower surface plate 3 provided on the upper surface of the main body case 2, and on the main body case 2 in the vicinity of the lower surface plate 3. A support column 4 standing upright, a rotation support arm 5 rotatably mounted on the support column 4, an upper surface plate support mechanism 6 provided at the tip of the rotation support arm 5, and the upper surface plate support An upper surface plate 7 suspended by a mechanism 6, and a swing arm base 8 provided in the vicinity of the lower surface plate 3 is provided on the upper surface of the main body case 2. In the vicinity of the arm base 8 and on the opposite side of the lower surface plate 3, a rotating shaft (third driving means) 9 for driving the swing arm is provided. In addition, arm attachment portions 10 are provided around the lower surface plate 3 at a predetermined interval. 2 denotes a control panel that controls the polishing apparatus 1.
[0013]
The upper surface plate support mechanism 6 that supports the upper surface plate 7 is constituted by two independent cylinders 61 and 62, and the position and load adjustment with respect to the lower surface plate 3 of the upper surface plate 7 are performed by the two cylinders 61 and 62. Is something that can be done. Further, an upper polishing plate (not shown) is rotatably held on the upper surface plate 7, engages with a rotation shaft 11 extending from the center of the lower surface plate 7, and rotates by the rotation of the rotation shaft 11.
[0014]
As shown in FIG. 3, in the lower surface plate 3, a sun gear 12 is provided on the outer peripheral surface of the rotating shaft 11, and a lower polishing plate 13 is provided outside the sun gear 12. Further, an internal gear 14 is provided outside the lower polishing plate 13, and a cover 15 is provided around the internal gear 14 so as to stand in an annular shape. A mounting hole 11a for mounting a disk polishing plate 70 described below is formed on the upper end surface of the rotary shaft 11, and at least one of the upper end outer peripheral surface meshes with the inner peripheral side surface of the upper polishing plate. A meshing groove 11b is formed.
[0015]
As shown in FIG. 4, the rotating shaft 11 and the sun gear 12 rotate via a driving gear (first driving means) 16 that is rotated by a driving device such as a motor (not shown). The rotary shaft 11 is supported in the axial direction by a thrust bearing 17 and the position is fixed in the axial direction. Further, a rotating cylinder 18 that is rotatably held by the support member 20 is provided around the rotating shaft 11, and a driving gear (second driving means) 19 that is rotated by the driving device described above or another driving device. Then, the lower polishing plate 13 and the internal gear 14 are rotated.
[0016]
In the polishing apparatus 1 having the above configuration, as shown in FIG. 5, a carrier 30 having a work mounted on a mounting portion 31 is arranged so as to mesh with the sun gear 12 and the internal gear 14, and an upper surface plate 7 is lowered to sandwich the carrier 30 with the lower surface plate 3, and the drive gears 16 and 19 are rotated so that the carrier 30 revolves while rotating between the lower polishing plate 13 and an upper polishing plate (not shown). The workpiece mounted on the carrier 30 can be polished on both sides. At this time, the abrasive is supplied to the polishing surface as needed via the pipe 21 provided on the upper surface plate 7. The type and amount of the abrasive, the rotational speed of the drive gears 16 and 19 and the load on the upper surface plate 7 are determined by the type of workpiece and the required polishing accuracy. It should be noted that a plurality of the carriers 30 can be arranged, and the shape of the work mounting portion 31 is not particularly limited to a circle.
[0017]
In the polishing apparatus 1, the rotary support arm 5 is rotated to move the upper surface plate 7 from above the lower surface plate 3, and the single-side polishing carrier holding arm 40 is fixed to the arm mounting portion 10. . The carrier holding arm 40 is fixed to the arm mounting portion 10 and extends to the lower polishing plate 13, and has an extending arm portion 41 having a mounting portion 41 on which a single-side polishing carrier 50 on which a workpiece is mounted is disposed. The fixed arm portion 42 is fixed to the extending arm portion 41 and holds the single-side polishing carrier 50. The extending arm portion 41 and the fixed arm portion 42 are provided with a plurality of rollers 43 that freely rotate the single-side polishing carrier 50.
[0018]
The single-side polishing carrier 50 is shown in FIG. 7, has a cylindrical shape, and has a workpiece mounting portion 51 formed therein. Further, an external gear 52 that can mesh with the sun gear 12 is formed at one end in the axial direction of the single-side polishing carrier 50. Thus, when it is desired to rotate the single-side polishing carrier 50 freely with respect to the lower polishing plate 13, the single-side polishing carrier 50 is disposed so that the external gear 52 of the single-side polishing carrier 50 is located on the upper side. When it is desired to forcibly rotate 50, the single-side polishing carrier 50 can be rotated by meshing the external gear 52 with the sun gear 12. Thus, the single-side polishing can be performed by rotating the lower polishing plate 13.
[0019]
Further, in the polishing apparatus 1, the rotary support arm 5 is rotated to move the upper surface plate 7 from above the lower surface plate 3, and a circular polishing plate 70 for precision polishing is provided on the upper surface of the rotating shaft 11. Mounting. Further, as shown in FIG. 8, the swing arm 60 is mounted on the swing arm base 8, and the swing arm 60 has a swing fulcrum 61 fixed on the swing arm base 8. The swinging point 62 is swingable at a predetermined distance from the swinging fulcrum 61, and the swinging point 62 is provided on the rotating shaft 9 via the drive arm 63 to rotate the rotating shaft. It is connected with the eccentric shaft 64 which rotates with it. A carrier holding arm 66 extending on the circular polishing plate 70 is fixed to the rod 65 mounted in parallel to the rocking point 62 and the rocking fulcrum 61, and is attached to the tip of the carrier holding arm 66. Is provided with a holding rod 68 for holding a swing carrier 67 on which a workpiece is mounted.
[0020]
Accordingly, by rotating the rotary shaft 9, the swing point 62 swings, and accordingly, the carrier holding arm 66 swings, and the swing carrier 67 is moved to the rotary shaft 11. It is made to swing with respect to the circular polishing plate 70 that rotates with the rotation. Further, since the rotary shaft 9 is held in the axial direction by the thrust bearing 17, it is possible to suppress the axial shake of the circular polishing plate 50, thereby enabling precise polishing.
[0021]
【The invention's effect】
As described above, according to the polishing apparatus of the present invention, at least one double-side polishing carrier on which a workpiece is mounted is mounted so as to mesh with the sun gear and the internal gear, and the upper surface is fixed. A board is lowered with respect to the lower surface plate to sandwich the double-side polishing carrier, the first and second driving means are driven to perform double-side polishing, and at least one of the arm mounting portions The carrier holding arm is attached, a cylindrical single-side polishing carrier on which a workpiece is mounted by the carrier holding arm is held on the lower polishing plate, and the second driving means is driven to perform single-side polishing processing. Furthermore, the circular polishing plate is mounted on the rotating shaft, the swing arm is mounted on the swing arm base, and a work is mounted on the tip of the swing arm. The dynamic carrier is fixed, the first and third by driving the driving means, it is possible to perform precise single side polishing, and is capable of corresponding to a plurality of polishing a simple structure.
[Brief description of the drawings]
FIG. 1 is a side view of a polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view of a polishing apparatus according to an embodiment of the present invention.
FIG. 3 is a schematic configuration diagram of a lower surface plate.
FIG. 4 is a schematic cross-sectional view showing an example of first and second driving means.
FIG. 5 is an explanatory diagram for explaining a state in which double-side polishing is performed.
FIG. 6 is an explanatory diagram for explaining a state in which single-side polishing is performed.
7A is a side view of a single-side polishing carrier, and FIG. 7B is a plan view thereof.
FIG. 8 is an explanatory diagram for explaining a state in which precision single-side polishing is performed.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polishing apparatus 2 Main body case 3 Lower surface plate 4 Support pillar 5 Rotation support arm 6 Upper surface plate support mechanism 7 Upper surface plate 8 Swing arm base 9 Rotating shaft (3rd drive means)
DESCRIPTION OF SYMBOLS 10 Arm attachment part 11 Rotating shaft 12 Sun gear 13 Lower polishing plate 14 Internal gear 40 Carrier holding arm 50 Single-side polishing carrier 60 Oscillating arm 70 Circular polishing plate

Claims (5)

A rotating shaft rotated by the first driving means, a sun gear provided around the rotating shaft and rotated together with the rotating shaft, and an annular lower polishing plate provided around the sun gear and rotated by the second driving means And a lower surface plate comprising at least internal gears provided around the lower polishing plate, an upper surface plate that rotatably holds an upper polishing plate that meshes with and rotates with the rotating shaft, and the upper surface plate In a polishing apparatus having an upper platen support mechanism that moves the plate up and down with respect to the lower platen,
A thrust bearing for holding the rotating shaft in the axial direction;
A swing arm base provided at a predetermined position near the outside of the lower surface plate,
A third drive means disposed on the base near the swing arm,
A plurality of arm mounting portions arranged at predetermined positions near the outside of the lower surface plate;
A swing arm that is detachable from the swing arm base and swings by the third driving means;
A carrier holding arm detachably attached to the arm mounting portion;
A single-side polishing carrier detachably attached to the carrier holding arm;
A polishing apparatus comprising: a circular polishing plate that is detachable at an upper end of the rotating shaft. At least one double-side polishing carrier on which a workpiece is mounted is mounted so as to mesh with the sun gear and the internal gear, and the upper surface plate is lowered with respect to the lower surface plate, thereby the double-side polishing carrier. The polishing apparatus according to claim 1, wherein the first and second driving means are driven to perform double-side polishing. The polishing apparatus according to claim 2, wherein the single-side polishing carrier meshes with at least one of the sun gear and the internal gear. The carrier holding arm is attached to at least one of the arm attaching portions, and the single-side polishing carrier on which a work is mounted is held on the lower polishing plate by the carrier holding arm, and the second driving means is driven. The polishing apparatus according to claim 1, wherein the single-side polishing process is performed. The circular polishing plate is mounted on the rotating shaft, the swing arm is mounted on the swing arm base, and a swing carrier having a work mounted on the tip of the swing arm is fixed. The polishing apparatus according to claim 1, wherein the third driving unit is driven to perform precision single-side polishing.

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