JP3676471B2 - Polishing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing apparatus.
[0002]
[Prior art]
There is a lapping apparatus as an apparatus for polishing a polished surface of a workpiece such as a silicon wafer, and a polishing apparatus for polishing the polished surface of the workpiece to a mirror surface.
The wrapping device generally has a disk-shaped upper and lower surface plate, an outer side internal gear of these surface plates, a sun gear disposed on the inner peripheral side, and meshes with both to connect the internal gear to the sun gear. And a plurality of carriers arranged at equal intervals in the circumferential direction. According to this lapping apparatus, the workpiece held in the carrier holding hole is sandwiched between the upper and lower surface plates, and the carrier and the upper and lower surface plates are rotated. At this time, slurry is supplied between each surface plate and the workpiece. Then, polishing is performed. In order to prevent the danger that a finger, a hand, etc. are pinched | interposed into an internal gear and a carrier in that case, the danger prevention tool which covers the upper part of the clearance gap between an upper surface plate and an internal gear is fixed and provided.
[0003]
In addition, a polishing apparatus generally has a surface plate with a polishing cloth bonded to the upper surface, a rotating plate, a holding rod that can rotate and move up and down above the surface plate, and a lower surface of the holding rod that is coupled to the lower surface of the polishing plate. And a polishing plate to which the workpiece is adhered. According to this polishing apparatus, the surface plate and the workpiece are moved relative to each other, and at this time, the polishing liquid is supplied to perform polishing. At that time, in order to prevent the slurry from splashing to the outside due to the centrifugal force of the surface plate, it is provided around the outer periphery of the surface plate and provided with a scattering prevention cover that can be manually opened in a double door or sliding door method. There is.
[0004]
[Problems to be solved by the invention]
However, in the case of the above-described danger prevention device, it has to be removed when performing maintenance and management of the polishing surface or each drive mechanism, and the work is performed manually, and there is a problem that work efficiency is poor.
Also, in the case of the above-described anti-scattering cover, the opening and closing is performed by a double door or sliding door opening / closing mechanism, and the work is performed manually, so that the work efficiency is poor. In order to automatically open and close the anti-scatter cover, it is sufficient to use the power of the driving device, but in order to open the front and rear of the polishing part greatly, the sliding part of the opening / closing mechanism is located at substantially the same height as the polishing part. Will be set to. For this reason, the opening / closing mechanism is subject to wear due to the slurry scattered from the polishing section, is inferior in durability, and cannot sufficiently secure reliability for automation.
[0005]
Accordingly, an object of the present invention is to provide a cover that can suitably exhibit a risk prevention function, can suitably prevent scattering of polishing liquid generated during polishing processing, and can be automatically and suitably opened with high reliability such as durability. It is providing a polishing apparatus provided with.
[0006]
[Means for Solving the Problems]
The present invention has the following configuration to achieve the above object.
That is, the present invention provides a polishing apparatus that polishes a workpiece by clamping the workpiece between the upper member and the lower member, and relatively moving the upper member and the lower member, and the support member on which the upper member is suspended. An upper and lower guide provided on the support member, a side plate portion and a top plate portion, and a rear half of the polishing portion constituted by the upper member and the lower member, which is behind the support member. A rear cover that opens the rear half of the polishing portion when moved upward and is guided by the vertical guide so as to be movable up and down, and on the support member so that the operating portion is above the polishing portion. And a lift driving device for moving the rear cover in the vertical direction, and a side cover, an upper cover, and a front cover that cover a portion of the polishing portion that is in front of the support member in a box shape. A polishing portion that is provided so that the bar and the operating portion are located above the polishing portion, moves the front cover of the cover up and down, and moves forward when the front cover moves upward. And an elevating drive device that opens the door .
[0007]
Further, the present invention provides a polishing apparatus that polishes a workpiece by clamping the workpiece between the upper member and the lower member, and relatively moving the upper member and the lower member, and a support member on which the upper member is suspended. The upper and lower guides provided on the support member, a side plate portion, and a top plate portion are provided, and a rear half of the polishing portion constituted by the upper member and the lower member is provided behind the support member. In addition, when the guide is movably moved up and down by the upper and lower guides and moved upward, the rear cover that opens the rear half of the polishing unit, and the operation unit on the support member so that the operation unit is above the polishing unit. An elevating drive device that moves the rear cover in the vertical direction; and covers a portion of the polishing portion that is forward of the support member, has an arc-shaped side wall, and slides left and right along the arc The front of the polishing part Characterized by comprising a pair of covers that can be closed.
Further, the lower end of the rear cover is fitted into the groove portion of the base on which the polishing portion is located when the rear cover is lowered to the lowermost position.
[0008]
Further, the present invention provides a polishing apparatus that polishes a workpiece by clamping the workpiece between the upper member and the lower member, and relatively moving the upper member and the lower member, and a support member on which the upper member is suspended. A rear portion of the polishing portion, which includes a first upper and lower guide provided on the support member, a side plate portion and a top plate portion, and is configured by the upper member and the lower member, which is rearward of the support member Covers half and is guided by the vertical guide so as to be movable up and down, and when moved upward, the rear cover that opens the rear half of the polishing unit and the support so that the operating unit is above the polishing unit A lifting / lowering drive device that is provided on a member and moves the rear cover in a vertical direction; a second vertical guide provided on the support member; a side plate portion and a top plate portion; Before the polishing part consisting of parts A cover that covers the front half that is forward of the support member and that can be moved up and down by the second upper and lower guides, and that moves upward, has a cover that opens the front half of the polishing unit, and an operating unit. A polishing apparatus comprising: an elevating drive device provided on the support member so as to be above the polishing unit and moving the cover in the vertical direction. Further, the lower end of the rear cover is fitted into the groove portion of the base on which the polishing portion is located when the rear cover is lowered to the lowermost position.
[0009]
Further, a cap-shaped airflow prevention cover is provided above the rear cover and the cover so that the downdraft does not directly hit the polishing portion.
Further, the rear cover covers a rear half of the polishing portion that is rearward of the support member without covering the support member, and the cover has a portion of the polishing portion that is forward of the support member. The support member is covered without being covered.
[0010]
Furthermore, the present invention provides a polishing apparatus that polishes a workpiece by clamping the workpiece between the upper member and the lower member, and relatively moving the upper member and the lower member, and a support member on which the upper member is suspended. A cover made of a side cover, an upper cover, and a rear cover that covers a rear half of the polishing portion constituted by the upper member and the lower member in a box shape behind the support member, and an operating portion is the polishing portion An elevating drive device that is provided so as to be further upward, moves the rear cover of the cover up and down, and opens the polishing part that is rearward of the support member when the rear cover moves upward, and the polishing part A cover made up of a side cover, an upper cover, and a front cover that covers the front part of the support member in a box shape, and an operating part located above the polishing part. It is, moved up and down the front cover of said cover, the front cover is in when moving upward, characterized by comprising an elevating drive device for releasing the abrasive portion thereof in the forward than the support member.
The both covers may cover the polishing portion without covering the support member.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a side view showing a lapping apparatus as an embodiment of a polishing apparatus according to the present invention, FIG. 2 is a front view, and FIG. 3 is a plan view.
The lapping apparatus in FIG. 1 is an apparatus for polishing a silicon wafer that is a raw material of a semiconductor chip. In other words, this lapping apparatus clamps a silicon wafer, which is a workpiece, between an upper surface plate, which is an upper member, and a lower surface plate, which is a lower member, and the upper and lower surface plates are relative to each other as described in the prior art section. It is an apparatus that polishes by moving in a moving manner. The lower surface plate is rotatably fixed to the base 10. The upper surface plate is suspended from the gate-shaped support member 12, and the pressing force is adjusted in the direction of the lower surface plate by the vertical movement cylinder 14, so that the silicon wafer can be clamped between the lower surface plate. A portion where the wafer is polished by the upper surface plate and the lower surface plate is a polishing portion 16.
[0012]
Reference numeral 18 denotes a vertical guide between the upper extending plate 20 extending horizontally on the vertical moving cylinder 14 and the lower extending plate 22 extending horizontally from the upper portion of the support member 12. It is the rod-shaped member arrange | positioned by the up-down direction. As shown in FIG. 2, two upper and lower guides 18 are arranged in parallel.
[0013]
A rear cover 24 is provided so as to be movable up and down along the upper and lower guides 18, 18. The rear cover 24 covers the rear half of the polishing unit 16 when positioned downward, and covers the rear portion of the polishing unit 16 when moved upward. A semi-cylindrical side plate portion 24a is provided so as to open the rear half. The rear cover 24 includes a top plate portion 24b, and the upper and lower guides 18 and 18 are connected to the top plate portion 24b via a slide bearing or the like. Thereby, the rear cover 24 is guided to be movable up and down. Further, the lower end of the rear cover 24 is formed so as to be fitted into the groove portion 10a of the base 10 where the polishing portion 16 is located when the rear cover 24 is lowered to the lowermost position. Thereby, the polishing part 16 can be suitably covered with the rear cover 24.
The rear cover 24 is provided to be larger than the outer periphery of the internal gear so as to cover the rear half of the polishing portion 16, and is provided with an outer diameter that can be positioned between the left and right support columns 12a of the gate-shaped support member 12. It has been.
[0014]
Further, the inner wall of the side plate portion 24a of the rear cover 24 is sprayed to an appropriate height position in the rear half of the polishing portion 16 so that ultrapure water can be discharged in order to prevent the silicon wafer as a workpiece from drying. A mechanism 25 is fixed. Since the injection mechanism 25 moves as the rear cover 24 moves up and down, it does not hinder the work for inserting and removing the workpiece, the carrier, or the correction carrier.
[0015]
Reference numeral 26 denotes a rodless cylinder, which is disposed as an example of an elevating drive device for elevating the rear cover 24 between the upper extension plate 20 and the lower extension member 22 in the vertical direction, similar to the upper and lower guides 18 and 18. Has been. The drive slider of the rodless cylinder 26 is fixed to the rear cover 24, and the rear cover 24 is raised and lowered by the operation of the drive slider. As apparent from FIG. 1, the rodless cylinder 26 has an operating portion provided above the polishing portion 16. Therefore, the splashed slurry is less likely to be applied to the operating portion, can prevent wear of members that are in sliding contact with the operating portion, and can improve durability and reliability.
[0016]
Reference numeral 28 denotes a front cover, which is formed in a rectangular flat plate shape, and is arranged in front of the gate-shaped support member 12 so that the left and right sides are guided in the vertical direction so as to be movable up and down. Side covers 30, 30 are fixed to the front side surface of the gate-type support member 12, and an upper cover 35 is fixed to the front ceiling surface of the gate-type support member 12. When the front cover 28 is positioned below, the front cover 28, the side covers 30, 30 and the upper cover 35 are formed into a box-shaped cover that covers the front side of the polishing portion.
[0017]
Reference numeral 32 denotes a vertically moving cylinder, and the distal end of the telescopic rod 32a is fixed to the upper portion of the front cover 28 via attachment pieces 34, 34. The front cover 28 can be moved up and down by the power of the vertical movement cylinders 32 and 32. As described above, since the operating parts of the vertical movement cylinders 32 and 32 are located outside the polishing part 16, they are not easily affected by scattered slurry or accumulated foreign matter, and the durability and reliability can be improved.
[0018]
As described above, by arranging the front cover 28 and the rear cover 24 that can be opened and closed with respect to the polishing unit 16 at two positions before and after the support member 12, the polishing unit 16 can be covered without covering the support member 12. Therefore, it is not necessary to increase the size of the cover covering the polishing unit 16 more than necessary.
Further, when the front cover 28 is opened, a silicon wafer as a workpiece can be taken in and out, and when the rear cover 24 is opened, a correction carrier and / or a surface plate can be taken in and out. Accordingly, it is possible to suitably cope with the usage mode of the polishing apparatus, and it is possible to realize suitable automation (automation of the entire system) in relation to other apparatuses. Reference numeral 60 denotes an operation panel.
[0019]
Next, another embodiment will be described with reference to FIG.
This embodiment is also a wrapping apparatus, and a front cover 50 and a rear cover 52 are provided on the front and rear sides with a support member (gate-type arm 54) as a boundary. The front cover 50 includes a pair of members that have arc-shaped side walls and slide left and right along the arc to open and close the front surface of the polishing unit. Further, the rear cover 52 is formed substantially the same as the embodiment of FIG. 1, and its opening / closing mechanism is also formed substantially the same. The same components as those in the embodiment of FIG. Note that an injection mechanism 25 is fixedly provided on the side wall portion of the rear cover 52 at an appropriate height position in the rear half of the polishing portion 16 in order to prevent the silicon wafer as a workpiece from drying. Since the ejection mechanism 25 moves as the rear cover 24 moves up and down, it does not hinder the work of inserting / removing the workpiece, the carrier or the correction carrier.
Also in this embodiment, since the front cover 50 and the rear cover 52 are suitably provided, it is possible to reliably prevent a finger or a hand from being pinched by the gap between the internal gear and the carrier during polishing and surface plate correction. And can work safely.
[0020]
Further, a cap-shaped airflow prevention cover 58 is provided above the front cover 50 and the rear cover 52 so that the downward airflow does not directly hit the polishing portion 56. Accordingly, the downflow does not directly hit the upper surface plate, and deformation due to a local temperature change of the upper surface plate can be prevented, so that the polishing accuracy of the silicon wafer can be suitably maintained.
[0021]
In the above embodiments, the lapping apparatus has been described. In the case where the polishing surface is maintained and managed, the polishing liquid and the cleaning water can be prevented from being scattered during the polishing process even if the cover is similarly provided in the polishing apparatus. By opening the cover, it is possible to efficiently replace the cloth and clean the surface plate. Furthermore, since the cover is divided into at least two parts and can be automatically opened and closed, work attachment / detachment work and maintenance management can be performed efficiently in parallel. And since the operating part of the elevating drive device is provided above, it is less affected by scattered slurry or accumulated foreign matter, etc., and the sliding part of its opening / closing mechanism can improve durability, and reliability for automation Can be improved.
[0022]
In the above embodiment, the case where the cylinder device is used as the lifting device has been described. However, the cover is slid up and down or horizontally by a driving machine using a motor as a driving source with a rack and a pinion. You may do it. At this time, if the rack and the pinion are provided above, the durability and reliability can be improved without being affected by the scattered slurry or the like.
[0023]
Further, a semi-cylindrical cover similar to the rear cover 24 of the embodiment of FIG. 1 may be used as the front cover, and both the rear cover and the front cover may be semi-cylindrical covers. Further, a flat cover similar to the front cover 28 of the embodiment of FIG. 1 may be used as the rear cover, and both the rear cover and the front cover may be flat cover, and the cover form is selected according to the use conditions. Of course you can.
[0024]
In the above embodiment, an example in which the upper and lower guides and the elevating drive device are attached to the gate-shaped support member to raise and lower the cover has been described. However, the present invention is not limited thereto, and the support member is an inverted L-shaped Etc. may be used. However, the portal-type support member can withstand a high load, and has an advantage that it can function as a support and a movement guide for the cover when the cover is divided into front and rear.
As described above, the present invention has been variously described with reference to preferred embodiments. However, the present invention is not limited to these embodiments, and it is needless to say that many modifications can be made without departing from the spirit of the invention. That is.
[0025]
【The invention's effect】
According to the present invention, the cover that covers the polishing unit can be moved up and down by the elevating drive device in which the operation unit is provided above the polishing unit. For this reason, the risk prevention function can be suitably exhibited, the scattering of the polishing liquid generated during the polishing process can be suitably prevented, and the operating part of the lifting and lowering drive device is not easily affected by the scattered slurry, so the cover is durable. It is highly reliable and can be opened and closed automatically. In particular, if a cover that can be opened and closed with respect to the polishing unit is disposed at two positions before and after the support member without covering the support member, the size of the cover that covers the polishing unit becomes larger than necessary. There is an effect that it is unnecessary.
[Brief description of the drawings]
FIG. 1 is a side view showing an embodiment of the present invention.
FIG. 2 is a front view of the embodiment of FIG.
FIG. 3 is a plan view of the embodiment of FIG.
FIG. 4 is a side view showing another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Base 12 Support member 14 Vertical motion cylinder 16 Polishing part 18 Vertical guide 24 Rear cover 25 Injection mechanism 26 Rodless cylinder 28 Front cover 32 Vertical motion cylinder 58 Airflow prevention cover

Claims (8)

In a polishing apparatus that sandwiches a workpiece by sandwiching a workpiece between an upper member and a lower member, and relatively moving the upper member and the lower member,
A support member on which the upper member is suspended;
An upper and lower guide provided on the support member;
A polishing plate comprising a side plate portion and a top plate portion, comprising the upper member and the lower member, covers the rear half behind the support member, and is guided by the vertical guide so as to be movable up and down. When moved upward, a rear cover that opens the rear half of the polishing portion;
An elevating drive device that is provided on the support member so that the operating unit is above the polishing unit, and moves the rear cover in the vertical direction;
Covering the portion of the polishing portion that is forward of the support member in a box shape, a cover made of a side cover, an upper cover, and a front cover;
The operating part is provided to be above the polishing part, and the front cover of the cover is moved up and down, and when the front cover moves upward, the polishing part in front of the support member is opened. A polishing apparatus comprising an elevating drive device . In a polishing apparatus for sandwiching a workpiece by sandwiching a workpiece between an upper member and a lower member and moving the upper member and the lower member relatively,
A support member on which the upper member is suspended;
An upper and lower guide provided on the support member;
A polishing plate comprising a side plate portion and a top plate portion, comprising the upper member and the lower member, covers the rear half behind the support member, and is guided by the vertical guide so as to be movable up and down. When moved upward, a rear cover that opens the rear half of the polishing part;
An elevating drive device that is provided on the support member so that the operating unit is above the polishing unit, and moves the rear cover in the vertical direction;
The polishing unit includes a pair of covers that cover a portion of the polishing unit that is in front of the support member, have an arc-shaped side wall, and slide left and right along the arc to open and close the front surface of the polishing unit. A polishing apparatus characterized by that. The polishing apparatus according to claim 1 or 2, wherein a lower end of the rear cover is fitted into a groove portion of a base on which the polishing portion is located when the rear cover is lowered to the lowermost position. In a polishing apparatus for sandwiching a workpiece by sandwiching a workpiece between an upper member and a lower member and moving the upper member and the lower member relatively,
A support member on which the upper member is suspended;
A first vertical guide provided on the support member;
A polishing plate comprising a side plate portion and a top plate portion, comprising the upper member and the lower member, covers the rear half behind the support member, and is guided by the vertical guide so as to be movable up and down. When moved upward, a rear cover that opens the rear half of the polishing part;
An elevating drive device that is provided on the support member so that the operating unit is above the polishing unit, and moves the rear cover in the vertical direction;
A second vertical guide provided on the support member;
A side plate portion and a top plate portion are provided, and a polishing portion constituted by the upper member and the lower member covers a front half that is forward of the support member, and is movable up and down by the second vertical guide. When guided and moved upward, a cover that opens the front half of the polishing part;
A polishing apparatus, comprising: an elevating drive device that is provided on the support member so that the operating section is above the polishing section and moves the cover in the vertical direction. 5. The polishing apparatus according to claim 1 , wherein a cap-shaped airflow prevention cover is provided above the rear cover and the cover so that a downdraft does not directly hit the polishing portion. . The rear cover is located behind the support member of the polishing unit without covering the support member. Cover the rear half of the
The polishing apparatus according to claim 1, wherein the cover covers a portion of the polishing portion that is in front of the support member without covering the support member. In a polishing apparatus for sandwiching a workpiece by sandwiching a workpiece between an upper member and a lower member and moving the upper member and the lower member relatively,
A support member on which the upper member is suspended;
A cover made of a side cover, an upper cover, and a rear cover, which covers the rear half of the polishing portion constituted by the upper member and the lower member in a box shape behind the support member,
Lifting drive is provided so that the operating part is located above the polishing part, and the rear cover of the cover is moved up and down, and when the rear cover moves upward, the polishing part located behind the support member is opened. Equipment,
Covering the front portion of the polishing portion with respect to the support member in a box shape, a cover consisting of a side cover, an upper cover, and a front cover;
The operating part is provided to be above the polishing part, and the front cover of the cover is moved up and down, and when the front cover moves upward, the polishing part in front of the support member is opened. A polishing apparatus comprising an elevating drive device. The polishing apparatus according to claim 7, wherein the polishing section is covered by the both covers without covering the support member.

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