JP3676607B2 - Electronic component suction nozzle and electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component suction nozzle and an electronic component mounting apparatus for holding an electronic component by vacuum suction and mounting the electronic component on a printed circuit board.
[0002]
[Prior art]
A technique in which an electronic component is taken out by a suction nozzle and mounted on a printed circuit board is disclosed in, for example, Japanese Patent Application Laid-Open No. 10-270894.
[0003]
[Problems to be solved by the invention]
However, there are various shapes of electronic components to be picked up. For example, there is a picked surface that can be picked up at a lower position such as a connection terminal, and interference that becomes an obstacle above the picked up surface. Some have parts. Even if such an electronic component is to be picked up by a normal suction nozzle and lowered from above, the upper surface of the interference portion cannot be picked up, and the surface to be picked up cannot be picked up because of the interference portion.
[0004]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to make it possible to suck and hold an electronic component having an interference portion above a sucked surface.
[0005]
[Means for Solving the Problems]
Therefore, the present invention provides an electronic component suction nozzle that holds an electronic component by vacuum suction and mounts it on a printed circuit board, and is formed by extending a shaft portion extending in the vertical direction and projecting laterally from the shaft portion. An overhanging projection with an opening for suction is provided.
[0006]
By doing so, the protruding protrusion can enter between the attracted surface of the electronic component and the interference portion and attract the attracted surface.
[0007]
Further, the present invention vacuum sucks an electronic component by a suction nozzle having a shaft portion extending in the vertical direction and a projecting projection that is formed to project from the shaft portion in the lateral direction and has a vacuum suction hole opened at a lower end surface thereof. In an electronic component mounting apparatus that holds and mounts on a printed circuit board, when sucking an electronic component having an interference portion above the surface to be sucked, the protruding protrusion is moved downward and horizontally while avoiding the interference portion of the component. Control means for controlling the movement of the suction nozzle is provided so as to move and be positioned above the suction surface.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0009]
This electronic component mounting apparatus is a so-called multi-functional chip mounter, and is configured to be able to mount various electronic components 46 such as surface mount components such as chip capacitors and chip resistors, and multi-lead components such as flat pack ICs. . FIG. 2 is a plan view of the electronic component mounting apparatus. As shown in FIG. 2, the electronic component mounting apparatus 1 includes a device main body 2 for mounting the supplied electronic component 46 on the substrate 7, and a surface on the device main body 2. A first component supply device 3 that supplies a small electronic component 46 such as a mounted component and a second component supply device 4 that supplies a large electronic component 46 such as a multi-lead component to the apparatus main body 2 are provided.
[0010]
The apparatus main body 2 includes a machine base 5, a board transport mechanism 6 that transports the printed circuit board 7 to the center of the machine base 5, a head unit 8 that includes two mounting heads 9 and a board recognition camera 10, and a head unit. And an XY stage 11 for moving 8 in the XY direction. That is, a component mounting mechanism is configured by the head unit 8 and the XY stage 11. By the operation of the XY stage 11, the mounting head 9 faces the first component supply device 3 or the second component supply device 4 and picks up the electronic component 46, and the electronic component 46 is further mounted on the substrate 7 set on the set table. To do. When this operation is repeated and the mounting of the electronic component 46 on the substrate 7 is completed, the substrate 7 is sent out on the transport path 12 by the substrate transport mechanism 6, and a new substrate 7 is replaced with the machine base 5 instead. Introduced above.
[0011]
The first component supply device 3 has a large number of cassette-type tape feeders 13 arranged side by side so that the tip on the component supply side faces one side of the machine base 5 parallel to the transport path 12. That is, it is arranged so as to face the pickup area S of the mounting head 9. Each tape feeder 13 accommodates electronic components 46 in a state of being loaded on a carrier tape (not shown), and the electronic components 46 are supplied one by one from the tip of the tape feeder 13.
[0012]
The second component supply device 4 is disposed on the other one side that intersects the one side of the machine base 5 facing the first component supply device 3 at a right angle. In the second component supply device 4, a large number of electronic components 46 are arranged on the electronic component storage tray T, and one or more trays T are mounted on the pallet P. The electronic component 46 is supplied to the apparatus main body 2 by facing the pickup area S between the component supply device 3 and the substrate 7.
[0013]
On the other hand, the suction nozzle 14 that sucks the electronic component 46 is detachably attached to the lower end of each mounting head 9. A plurality of types of suction nozzles 14 are prepared and can be appropriately replaced in accordance with the planar shape and weight of the electronic component 46. In this case, the suction nozzle 14 for replacement is accommodated in a nozzle stocker 15 disposed on the upper surface of the machine base 5. In the nozzle stocker 15, a plurality of types of suction nozzles 14 to be used are set side by side.
[0014]
As shown in FIG. 1, the suction nozzle 14 is provided with a protruding protrusion 18 that protrudes in the horizontal direction, that is, in the horizontal direction in FIG. 1, at the lower end of the shaft portion 17 that extends vertically. A vacuum suction hole (not shown) is opened at the lower end surface of the protrusion 18 so that the suction surface of the component 46 can be adsorbed by the lower end surface.
[0015]
A component recognition camera 16 that recognizes the position of the electronic component 46 sucked by the suction nozzle 14 is disposed in the vicinity of the nozzle stocker 15. Prior to mounting on the substrate 7, the electronic component 46 sucked by the suction nozzle 14 is displaced by the component recognition camera 16 in the X, Y, and θ directions (rotation angles in the horizontal plane) with respect to the axis of the suction nozzle 14. The amount is detected. Based on this detection result, the displacement in the θ direction is corrected by the rotation of the suction nozzle 14, and the displacement in the X and Y directions is corrected by the XY stage 11.
[0016]
Next, the second component supply device 4 will be described in detail with reference to FIGS. 2 and 3. The second component supply device 4 stocks a large number of pallets P, and conveys the pallets P in a vertical direction to a predetermined level position. The pallet P is moved to the elevator mechanism 21. And a pallet introduction mechanism (pallet introduction means) 22 that conveys in the horizontal direction from the pickup area S of the apparatus main body 2. Note that the pickup area S in this embodiment is extended to the immediate vicinity of the elevator mechanism 21.
[0017]
The elevator mechanism 21 includes a pallet stocker 31 that accommodates a large number of pallets P in the vertical direction, and an elevating mechanism 32 that lifts and lowers each pallet P via the pallet stocker 31. The pallet stocker 31 is configured by arranging a plurality of shelf members 33 on which the pallet P is placed in the vertical direction. The right side of the pallet stocker 31 in the figure is wide open, and the pallet P is drawn out from this portion to the apparatus main body 2 side.
[0018]
The elevating mechanism 32 has a frame (not shown) that holds the pallet stocker 31, a ball screw 34 that is screwed into a part of the frame and moves it up and down, and is arranged on both sides of the ball screw 34 to guide the elevating movement of the frame A pair of left and right guide rails 35 and 35, and a lifting motor 36 connected to the base end of the ball screw 34 and rotating it. As the ball screw 34 rotates forward and backward via the lift motor 36, the frame is guided by the guide rails 35 and 35 and moves up and down. When the frame moves up and down, the pallet stocker 31 held by the frame moves up and down while the pallet P is accommodated.
[0019]
In the elevator mechanism 21 configured as described above, the lifting motor 36 of the lifting mechanism 32 is connected to the controller 23, and the lifting operation is controlled by the controller 23. In the lifting / lowering operation, the level position of the desired shelf member 33 of the pallet stocker 31 and the level position of the drawer path 41 of the pallet introduction mechanism 22 described later are matched. In a normal raising / lowering operation, the empty shelf member 33 is placed on standby at this level position to receive a used pallet P, and a new pallet P is moved to this level position and delivered to the pallet introduction mechanism 22.
[0020]
On the other hand, the pallet introducing mechanism 22 includes a drawer path 41 disposed on the machine base 5 of the apparatus main body 2, a locking arm 42 that advances and retreats along the drawer path 41, and a driving mechanism 43 that advances and retracts the locking arm 42. It consists of A hook 44 that engages with and disengages from the pallet P is provided at the front end of the locking arm 42, and the locking arm 42 is advanced by the drive mechanism 43, and the front end of the pallet P accommodated in the elevator mechanism 21. Next, the locking arm 42 is retracted, and the pallet P is introduced into the pickup area S along the drawing path 41.
[0021]
The drive mechanism 43 is also connected to the controller 23 and interlocks with the elevator mechanism 21. In addition, a component mounting mechanism including the head unit 8 and the XY stage 11 is connected to the controller 23 so that the pallet introduction mechanism 22 and the component mounting mechanism cooperate with each other. That is, the pickup area S is extended to the immediate vicinity of the elevator mechanism 21, and the pallet introduction mechanism 22 is configured to be able to introduce the pallet P to an arbitrary position of the drawer path 41 in the pickup area S, and this introduced pallet The mounting head 9 of the component mounting mechanism is configured to be able to pick up the P electronic component 46.
[0022]
Further, as shown in FIG. 4, the controller 23 comprises a central control CPU 24, a ROM 25 for storing control programs and various data, a RAM 26 for storing programs, an interface 27 and a drive circuit 28. The X-axis motor 49 and the Y-axis motor 50 that move the XY stage 11 in the XY direction (horizontal direction) and the head lifting motor 51 that moves the mounting head 9 up and down from the XY stage 11 are controlled.
[0023]
Next, the operation will be described.
[0024]
When the electronic component 46 is to be supplied from the tray T on which the electronic component 46 is placed, the pallet stocker 31 is moved up and down by the lifting mechanism 32 and the pallet P on which the tray T is placed is positioned on the drawer path 41. .
[0025]
Next, the hook 44 driven by the drive mechanism 43 controlled by the controller 23 pulls out the pallet P and stops it at a predetermined position in the pickup area S.
[0026]
Next, the mounting head 9 rotates the motors 49 and 50 under the control of the controller 23 and moves onto the electronic component 46 to be picked up placed in the storage recess 47 in the tray T. However, the electronic component 46 is positioned at a position where it does not overlap with any of the overhanging protrusion 18 and the shaft portion 17 when viewed from above.
[0027]
Next, the mounting head 9 descends under the control of the controller 23 and stops at a height position where the protruding protrusion 18 can enter the space 55 between the interference portion 53 of the component 46 and the mounting surface 54.
[0028]
Next, the XY stage 11 is controlled to move, the overhanging projection 18 moves in the overhanging direction (the direction of the horizontal arrow in FIGS. 1 and 5), and the overhanging projection 18 enters the space 55, not shown. The vacuum suction hole is positioned at a position where the attracted surface 54 can be attracted and stopped. It should be noted that the direction in which the overhanging protrusion 18 enters the space 55 may not be the overhanging direction of the overhanging protrusion 18 but may be a direction perpendicular thereto. In this case, the position when it first descends is shown in FIG. The position needs to be away from the component 46 in a direction orthogonal to the horizontal arrow.
[0029]
Next, the mounting head 9 is lowered, the attracted surface 54 is sucked by vacuum suction from a vacuum suction hole (not shown), and the mounting head 9 is lifted to take out the electronic component 46 from the storage recess 47 of the tray T. .
[0030]
Next, the mounting head 9 is moved to the mounting position indicated by the data (not shown) of the printed circuit board 7 through the recognition of the recognition camera 10 by the movement of the XY stage 11.
[0031]
The electronic component 46 positioned at a desired horizontal position at a desired angular position is mounted on the printed circuit board 7 by the lowering of the mounting head 9. At this time, the nozzle 14 needs to exist at a position where the adjacent component 46 and the nozzle 14 do not come into contact with each other. However, when the component 46 is sucked, the nozzle 14 needs to be controlled to suck from such a direction. There is.
[0032]
Next, as shown by the arrow in FIG. 6, the mounting head 9 that has been evacuated is slightly lifted, moved to a position that does not interfere with the component 46 in the horizontal direction, and then lifted to pick up the next component 46. In order to do so, it moves to a desired component supply device.
[0033]
In order for the suction nozzle 14 having the overhanging projection 18 to enter the space 55 in order to take out the component 46 from the tray T, the head 9 may be lowered and horizontally moved partially or entirely in parallel. Alternatively, when moving away from the component 46 after being mounted on the substrate 7 and when retreating from the space 55, the horizontal movement and the rising movement may be performed in parallel.
[0034]
If the overhanging projection 18 is positioned on the suction surface 54 and can be vacuum-sucked without being lowered, the head 9 may be lifted by vacuum suction without being lowered.
Further, since the suction nozzle 14 can be rotated around the vertical line (the aforementioned θ direction) in order to change the angular position of the part to be sucked, the protruding protrusion 18 is moved into the space by rotating the suction nozzle 14. You may make it approach or evacuate.
[0035]
【The invention's effect】
As described above, according to the present invention, the protruding protrusion can enter between the attracted surface and the interference portion of the electronic component and attract the attracted surface, so that the interference portion is disposed above the attracted surface. Even electronic components can be stably held.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a state in which a suction nozzle according to the present invention sucks an electronic component.
FIG. 2 is a plan view of the electronic component mounting apparatus.
FIG. 3 is a side view of the electronic component mounting apparatus.
FIG. 4 is a block diagram for controlling movement of a mounting head of the electronic component mounting apparatus.
FIG. 5 is a side view showing a state where the suction nozzle according to the present invention sucks an electronic component.
FIG. 6 is a side view showing a state where the suction nozzle according to the present invention mounts an electronic component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 9 Mounting head 14 Suction nozzle 17 Shaft part 18 Overhang | projection protrusion 23 Controller (control means)
46 Electronic component 49 X-axis drive motor 50 Y-axis drive motor 51 Head lift motor 53 Interference portion 54 Mounted surface

Claims (2)

In the electronic component suction nozzle that holds the electronic component by vacuum suction and mounts it on the printed circuit board,
An electronic component suction nozzle, comprising: a shaft portion extending in a vertical direction; and a projecting projection formed by projecting in a lateral direction from the shaft portion and having a vacuum suction hole opened at a lower end surface thereof. An electronic component is vacuum-sucked and held on a printed circuit board by a suction nozzle having a shaft portion extending in the vertical direction and a projecting projection formed in a lateral direction extending from the shaft portion and having a vacuum suction hole opened at a lower end surface thereof. In the electronic component mounting device to be mounted ,
When sucking an electronic component having an interference portion above the suction surface, the projecting protrusion is moved downward and horizontally to avoid the interference portion of the component so as to be positioned above the suction surface. An electronic component mounting apparatus comprising a control means for controlling the movement of the suction nozzle.

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