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JP3677348B2 - Optical transmission module - Google Patents
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JP3677348B2 - Optical transmission module - Google Patents

Optical transmission module Download PDF

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Publication number
JP3677348B2
JP3677348B2 JP13039496A JP13039496A JP3677348B2 JP 3677348 B2 JP3677348 B2 JP 3677348B2 JP 13039496 A JP13039496 A JP 13039496A JP 13039496 A JP13039496 A JP 13039496A JP 3677348 B2 JP3677348 B2 JP 3677348B2
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optical
optical fiber
transmission module
holding member
optical transmission
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JPH09318845A (en
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正良 加藤
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Ricoh Co Ltd
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Ricoh Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は光通信,光情報処理及び光インターコネクション等に用いられる光伝送モジュールに係り,特に,光ファイバと光路変換面及び光素子との位置合わせ精度を確保しつつ,生産性に優れ,且つ安価な小型の自己整合的な光伝送モジュールに関する。
【0002】
【従来の技術】
従来の光伝送モジュールの構成方法としては,例えば,図6に示すようなものがある。この第1従来例は,特開平5−303028号公報で開示された「光ファイバアレイ用光反射器」の構成であり,光ファイバ整列用V字溝602を設け,一方の端にこれら光ファイバ整列用V字溝602に直交する反射用V字溝601を設け,光ファイバ整列用V字溝602に整列された光ファイバ601からの出射光を,反射用V字溝603のV字にカットされた面により方向変更させるものであり,受光素子等の光素子との光学的結合を複雑な調整を必要とせずに実現している。
【0003】
また,図7には,1995年電子情報通信学会エレクトロニクスソサエティ大会,発表番号C−198で開示された「光受信アレイモジュール」の構成図を示す。この第2従来例では,第1従来例と同様に,反射用V字溝を結晶基板の異方性エッチングの手法で作製し,その反射面によりアレイファイバ703からの出射光の光路を変換させ,AuSnバンプ704を用いたセルフアライメントの手法により位置決めされたPDアレイ(受光素子)に投影することにより,光結合を実現している。
【0004】
【発明が解決しようとする課題】
しかしながら,上記第1従来例においては,光ファイバアレイ601と反射機構が簡単な構造となり,また同一の基板601上に形成が可能であり,モジュールの小型化等に有効であるが,依然として受光素子等の光素子と光ファイバアレイとの位置合わせのための調整作業が残る等,生産性に問題があった。
【0005】
また,第2従来例のように半田バンプによるフリップチップ実装を用いた場合,最終的な位置合わせはセルフアライメントの効果により簡略化できるが,半田バンプの作製工程が付加されることにより,製造工程の煩雑化によるコストアップ等,生産性に問題が残る。
【0006】
本発明は,上記従来の問題点に鑑みてなされたものであって,光ファイバと光路変換面及び光素子との位置合わせ精度を確保しつつ,生産性に優れ且つ安価な小型の自己整合的な光伝送モジュールを提供することを目的としている。
【0007】
【課題を解決するための手段】
上記課題を解決するために,本発明の請求項1に係る光伝送モジュールは,少なくとも1つ以上の光ファイバと,前記光ファイバのファイバ固定用溝と,前記ファイバ固定用溝と一体に形成され,前記光ファイバからの出射光の光路を変換する傾斜面とを備える光ファイバ保持部材と,光素子を複数個形成してなる光素子部材と,を具備する光伝送モジュールにおいて,前記光ファイバ保持部材は,表面の所望の位置に電極パターン若しくは半導体集積回路ベアチップを搭載して当該光伝送モジュールのベース部材として機能し,前記光素子部材は,前記光ファイバの出射光の投影領域に対し少なくとも2つ以上の光素子が含まれるように,光素子が形成されて,前記光ファイバ保持部材上の電極の一部と前記光素子部材の電極の一部とを電気的に接続させたものである。
【0008】
また,請求項2に係る光伝送モジュールは,請求項1記載の光伝送モジュールにおいて,前記光ファイバ保持部材は,所定の方位を有する結晶基板を材料とし,半導体加工プロセス及び異方性エッチングにより前記ファイバ固定用溝及び前記傾斜面が一体に作製され,前記光ファイバは,前記ファイバ固定用溝に配置される際に,前記光ファイバ保持部材の表面より当該光ファイバの外周の一部が突出するように設置され,前記光素子部材の一部が当該光ファイバの該突出部分に突き当たるように配置されるものである。
【0009】
また,請求項3に係る光伝送モジュールは,請求項1または2記載の光伝送モジュールにおいて,前記光ファイバ保持部材上に形成される電極の間隔は,前記光素子部材の電極間隔より大きいか,或いは前記光素子部材の電極の一部が不等間隔であるように変調されたピッチで形成されるものである。
【0010】
また,請求項4に係る光伝送モジュールは,請求項1,2または3記載の光伝送モジュールにおいて,前記光ファイバ保持部材は,当該光ファイバ保持部材上に形成された電極間に凸部を具備するものである。
【0011】
また,請求項5に係る光伝送モジュールは,請求項1,2,3または4記載の光伝送モジュールにおいて,前記光ファイバ保持部材は,化学エッチングに対し等方性を有する基板を材料とし,前記反射面は,選択的なエッチングにより球面若しくは非球面で形成されるものである。
【0012】
また,請求項6に係る光伝送モジュールは,請求項1,2,3,4または5記載の光伝送モジュールにおいて,前記光ファイバは,端面が球面若しくは非球面形状に加工されたものである。
【0013】
また,請求項7に係る光伝送モジュールは,請求項1,2,3,4,5または6記載の光伝送モジュールにおいて,前記光ファイバ固定用溝に略平行な方向に前記光素子部材の位置を概略規定するための位置決め部材を具備し,前記光素子部材は,光素子が複数個アレイ状に形成され,前記位置決め部材に所定の一部を配置し,ファイバ方向に対する位置決めにおいて,前記位置決め部材に前記光素子部材の一辺が接触するよう配置し,ファイバアレイ方向に対する位置決めにおいて,前記光ファイバの出射光の投影部分に位置する複数の前記受光素子の電極に光ファイバ保持部材の電極パターンがくるようにしたものである。
【0014】
また,請求項8に係る光伝送モジュールは,請求項1,2,3,4,5,6または7記載の光伝送モジュールにおいて,前記光ファイバ保持部材上の電極の一部と前記光素子部材の電極の一部とを電気的に接続させる際に,前記光ファイバ保持部材上の電極の一部に導電性粘着材を選択的に塗布するものである。
【0015】
【発明の実施の形態】
以下,本発明の光伝送モジュールの概要について,並びに,本発明の光伝送モジュールの実施例について,〔実施例1〕,〔実施例2〕,〔実施例3〕,〔実施例4〕の順に図面を参照して詳細に説明する。
【0016】
〔本発明の光伝送モジュールの概要〕
本発明の請求項1に係る光伝送モジュールでは,図1に示す如く,少なくとも1つ以上の光ファイバ103と,ファイバ固定用溝104と,ファイバ固定用溝104と一体に形成され,光ファイバ103からの出射光の光路を変換する傾斜面105とを備える光ファイバ保持部材101と,光素子110を複数個形成してなる光素子部材102と,を具備して構成し,光ファイバ保持部材101は,表面の所望の位置に電極パターン106若しくは半導体集積回路ベアチップを搭載して当該光伝送モジュールのベース部材として機能し,光素子部材102を,光ファイバ103からの出射光の投影領域に対し少なくとも2つ以上の光素子110が含まれるように構成し,光ファイバ保持部材101上の電極106の一部と光素子部材102の電極111の一部とを電気的に接続させている。
【0017】
従って,光ファイバ103と光路変換面である傾斜面105及び光素子110との位置合わせ精度を確保しつつ,生産性に優れ且つ小型の光伝送モジュールを実現できる。
【0018】
また,請求項2に係る光伝送モジュールでは,図1及び図2に示す如く,光ファイバ保持部材101の材料として,所定の方位を有する結晶基板を用い,半導体加工プロセス及び異方性エッチングによりファイバ固定用溝104及び傾斜面105を一体に作製し,光ファイバ103をファイバ固定用溝104に配置する際に,光ファイバ保持部材101の表面より当該光ファイバ103の外周の一部が突出するように設置し,光素子部材102の一部が光ファイバ103の該突出部分に突き当たるように配置している。
【0019】
従って,半導体プロセスを利用して光伝送モジュールを作製することができ,簡易に高精度な位置決め機構を備えた光伝送モジュールを実現できる。
【0020】
また,請求項3に係る光伝送モジュールでは,図1及び図3に示す如く,光ファイバ保持部材101上に形成される電極106の間隔は,光素子部材102の電極111の間隔より大きいか,或いは光素子部材102の電極の一部111'が不等間隔であるように変調されたピッチで形成されている。
【0021】
これにより,隣接チャンネルの電気的接触を効率よく回避することができ,また不必要な光素子110の接続による当該光伝送モジュールの性能劣化や配線の電気的特性が制御可能で,且つ,歩留まりよく生産が可能な光伝送モジュールを実現できる。
【0022】
また,請求項4に係る光伝送モジュールでは,図4に示す如く,光ファイバ保持部材101に,当該光ファイバ保持部材101上に形成された電極106間に凸部425を具備している。これにより,隣接チャンネルの電気的接触を効率よく回避することができ,歩留まりよく生産が可能な光伝送モジュールを実現できる。
【0023】
また,請求項5に係る光伝送モジュールでは,図5に示す如く,光ファイバ保持部材101の材料として,化学エッチングに対し等方性を有する基板を用い,反射面105'を,選択的なエッチングにより球面若しくは非球面で形成している。これにより,反射機能部の光学的性能を向上することが可能で,半導体プロセスを利用することができ,簡易に高精度な位置決め機構を備えた光伝送モジュールを実現できると共に,高効率な光結合系が実現される。
【0024】
また,請求項6に係る光伝送モジュールでは,図5に示す如く,光ファイバ103'の端面を,球面若しくは非球面形状に加工している。これにより,光ファイバ103'からの出射光の拡散を抑制することが可能で,光素子110の小型化により高速性を確保できると共に,高効率な光結合系を実現できる。
【0025】
また,請求項7に係る光伝送モジュールでは,光ファイバ固定用溝104に略平行な方向に光素子部材102の位置を概略規定するための位置決め部材107を具備し,光素子部材102は,光素子110を複数個アレイ状に形成し,該位置決め部材107に所定の一部を配置し,ファイバ光軸方向の位置決めについて,光素子部材102の一辺が接触するよう配置させ,ファイバアレイ方向の位置決めについて,光素子部材102を配置した際に,光ファイバ103からの出射光の投影部分200に位置する複数の受光素子の電極111に,光ファイバ保持部材101上の電極パターン106がくるように配置することで,精度よく位置決めがなされた光伝送モジュールを実現できる。
【0026】
また,請求項8に係る光伝送モジュールでは,光ファイバ保持部材101上の電極106の一部に導電性接着剤を選択的に塗布してメサ形状の凸部107を形成し,この凸部107と受光素子の電極111とを接触させ硬化させることにより接続を行うことで,位置決め機構として用いることにより,精度良く位置決めがなされた光伝送モジュールを実現できる。
【0027】
〔実施例1〕
図1は本発明の実施例1に係る光伝送モジュールの構造説明図である。図1(a)は,光ファイバ保持部材101及び光素子部材102を接続する前の光伝送モジュールの斜視図,図1(b)は方向Bから見た光結合部分の断面図,図1(c)は光素子部材102の斜視図である。
【0028】
本実施例の光伝送モジュールでは,少なくとも1つ以上の光ファイバ103と,ファイバ固定用溝104と,ファイバ固定用溝104と一体に形成され,光フアイバ103からの出射光の光路を変換するため反射面(傾斜面)105とを,同一部材である光ファイバ保持部材101上に形成する。
【0029】
例えば光ファイバ保持部材101の材料として,所定の方位(この場合<100面>)を有するシリコン結晶基板を用いた場合には,通常のフォトリソグラフィ等の半導体加工プロセス及び異方性エッチングの手法により,ファイバ固定用溝104を同一基板101上に一体に作製する。
【0030】
この時,ファイバ固定用溝104の光ファイバ103に対向する傾斜面105を,光路変換機能素子である反射面として用いることにより,反射面105をファイバ固定用溝104と一体化されたものとして扱うことができる。更にこの場合,反射率を向上させるために,反射面105に金属薄膜と透明絶縁膜や誘電体多層膜を形成してもよい。
【0031】
また,光素子部材102の位置決め機構としては,ファイバ固定用溝104に沿った光ファイバ保持部材101の両サイドの所定の位置に薄膜を形成後,フォトリソグラフィの手法によるパターニングとエッチングの手法により形成した凸部107を設けて,該凸部107を位置決め機構として用いるか,或いは,ファイバ固定用溝104の幅を,光ファイバ103が配置された際に,光ファイバ103の外周の一部が光ファイバ保持部材101の表面より所定量だけ突出するよう設定して,光ファイバ103の一部を位置決め機構として用いる。
【0032】
そして,次段の電気回路への接続やICのベアチップ実装のための電気配線106を,図1(b)に示す如く,光ファイバ保持部材101の絶縁体薄膜112上に形成する。
【0033】
次に光素子部材102においては,本実施例では受光素子が光素子110として形成されているが,例えば,1[μm]以下の波長による光伝送システムを考えた場合,光素子部材(受光素子基板)102としてシリコン基板を用い,フォトダイオード(例えば,pin層から構成されるpin−PD)を受光素子110として,所定間隔を保つアレイ状に作製する。
【0034】
また光素子部材102においては,図2に示す平面図の如く,光伝送モジュールを構成する際に,光ファイバ103からの出射光の投影領域200に対して,少なくとも2つ以上の受光素子110が含まれるように,受光素子110を複数個アレイ状に形成し,電極111も該受光素子110と共に形成されている。
【0035】
本実施例による光伝送モジュールでは,光ファイバ保持部材101の位置決め部材である凸部(本実施例では,ファイバ外周部の一部)107に,受光素子部材102の一辺が接触するよう配置させることにより,受光素子部材102のファイバ光軸方向についての位置決めが行われる。
【0036】
更に,受光素子部材102のファイバアレイ方向についての位置決めは,受光素子部材102を配置した際に,光ファイバ103からの出射光の投影部分200に位置する複数の受光素子の電極111に,光ファイバ保持部材101上の電極パターン106がくるようにすることにより行われる。
【0037】
つまり,ファイバ固定用溝104の延長上の光ファイバ保持部材106表面に設けた電極106を,受光素子部材102上の所定の電極に接触させることにより,自動的に光が入射した複数の受光素子110が電気的に接続され,対応する光ファイバ103にアライメントされた1つの受光素子として機能することにより,特に光素子部材102の微調整をする必要なく,光伝送モジュールの組付けを行うことが可能になる。
【0038】
上記方法により,受光素子部材102は,ファイバアレイ方向とファイバ光軸方向について,機械的な機構とアライメントフリーな素子構成により精度良く位置決めがなされる。
【0039】
尚,受光素子部材102上の電極111と光ファイバ保持部材101上の電極106との電気的接続には,例えば,光ファイバ保持部材101上の電極106の一部に導電性接着剤を選択的に塗布してメサ形状の凸部107を形成し,この凸部107と受光素子の電極111とを接触させ硬化させることにより接続を行う。
【0040】
〔実施例2〕
次に,本発明の実施例2に係る光伝送モジュールについて説明する。図3は,本実施例の光伝送モジュールにおける光ファイバ保持部材101及び光素子部材102の接続を説明する平面図である。
【0041】
実施例1では,図2に示すように,光ファイバ保持部材101上に形成される電極106の間隔が,受光素子部材102上の電極111のピッチよりも大きくなるように形成されている。
【0042】
これに対して実施例2では,図3に示すように,受光素子部材102上の電極111の一部が不等間隔であるように変調されたピッチで形成されている。
【0043】
これらの方法により,実施例1及び実施例2では,光ファイバ保持部材101上の電極106の一部に導電性接着剤を選択的に塗布してメサ形状の凸部107を形成する際に,その塗布量の制御を緩和することができ,光伝送モジュール構成時に,凸部107の変形による不要な隣接チャンネル間の電気的接触を防止することができる。
【0044】
また,特に実施例2(図3)においては,更に,必要以上の受光素子の電気的結合によって受光素子の容量が増加することによる応答速度の低下を防止することも可能となる。
【0045】
〔実施例3〕
次に,本発明の実施例3に係る光伝送モジュールについて説明する。図4は,本実施例の光伝送モジュールにおける光ファイバ保持部材101及び光素子部材102の接続を説明する説明図であり,図4(a)は平面図,図4(b)は断面図である。
【0046】
本実施例では,光ファイバ保持部材101表面の電極111間に,例えば,フォトリソグラフィ及びパターニングの手法等により,凸部425を所定の場所に形成後,光ファイバ保持部材101上の電極106の一部に導電性接着剤を選択的に塗布してメサ形状の凸部107を形成している。これにより,光素子部材102を配置の際に,接着剤(107)の変形による不要な隣接チャンネル間の電気的接触を防止することができる。
【0047】
〔実施例4〕
次に,本発明の実施例4に係る光伝送モジュールについて説明する。図5は,本実施例の光伝送モジュールの断面図である。
【0048】
図5(a)では,光ファイバ保持部材101として,化学エッチングに対し等方性を有する基板,例えばガラス基板等を用い,選択的なエッチングにより反射面105が球面若しくは非球面形状となるように加工して金属反射膜を形成後,絶縁膜を形成するか,或いは誘電体多層膜を形成して,光路変換機能を実現している。
【0049】
図5(a)の如く,反射面105を球面若しくは非球面形状とすることにより,光ファイバ103からの出射光の発散を抑制でき,また効率よく受光素子に集光させることができ,更に,より少ない受光素子110により受光素子部材102を構成させることにより,実質的な受光面積を小さくでき,受光素子110の応答速度を向上させることができる。
【0050】
また図5(b)のように,光ファイバ103'として,光ファイバ103'の端面が球面若しくは非球面形状に加工されたものを用いることによっても,光ファイバ103からの発散光の発散角を抑制でき,図5(a)と同様な効果が期待できる。
【0051】
本発明は上記実施例1から実施例4までの実施形態に限定されることなく,その他この精神に逸脱することなく種々の変形が可能である。例えば,光素子110の表面に機能薄膜を形成したり,光素子110として面発光タイプのLEDまたはLDを用いることも可能であり,また,波長帯も1[μm]以下に限られることなく,他の波長帯,例えば1.3/1.5[μm]帯の伝送システムに用いるデバイスにも応用可能であり,更に,光ファイバ保持部材101として,前記半導体プロセス及び異方性エッチングの手法により作製した基板をもとに,電鋳法による金型作製とそれを型に樹脂等で射出成形や複製した樹脂部材を用いても良い。
【0052】
【発明の効果】
以上説明したように,本発明の請求項1に係る光伝送モジュールによれば,少なくとも1つ以上の光ファイバと,ファイバ固定用溝と,ファイバ固定用溝と一体に形成され,光ファイバからの出射光の光路を変換する傾斜面とを備える光ファイバ保持部材と,光素子を複数個形成してなる光素子部材とを具備して構成し,光ファイバ保持部材は,表面の所望の位置に電極パターン若しくは半導体集積回路ベアチップを搭載して当該光伝送モジュールのベース部材として機能し,光素子部材を,光ファイバの出射光の投影領域に対し少なくとも2つ以上の光素子が含まれるように,光素子を形成して構成し,光ファイバ保持部材上の電極の一部と光素子部材の電極の一部とを電気的に接続させることとしたので,光ファイバと光路変換面である傾斜面及び光素子との位置合わせについて,微調整しなくとも,精度を確保しつつ,生産性に優れ且つ小型の光伝送モジュールを提供することができる。
【0053】
また,請求項2に係る光伝送モジュールによれば,光ファイバ保持部材の材料として,所定の方位を有する結晶基板を用い,半導体加工プロセス及び異方性エッチングによりファイバ固定用溝及び傾斜面を一体に作製し,光ファイバをファイバ固定用溝に配置する際に,光ファイバ保持部材の表面より当該光ファイバの外周の一部が突出するように設置し,光素子部材の一部が光ファイバの該突出部分に突き当たるように配置したので,半導体プロセスを利用して光伝送モジュールを作製することができ,簡易に高精度な位置決め機構を備えた光伝送モジュールを提供することができる。
【0054】
また,請求項3に係る光伝送モジュールによれば,光ファイバ保持部材上に形成される電極の間隔は,光素子部材の電極の間隔より大きいか,或いは光素子部材の電極の一部が不等間隔であるように変調されたピッチで形成されることとしたので,隣接チャンネルの電気的接触を効率よく回避することができ,また不必要な光素子の接続による当該光伝送モジュールの性能劣化や配線の電気的特性が制御可能で,且つ,歩留まりよく生産が可能な光伝送モジュールを提供することができる。
【0055】
また,請求項4に係る光伝送モジュールによれば,光ファイバ保持部材に,当該光ファイバ保持部材上に形成された電極間に凸部を具備しているので,隣接チャンネルの電気的接触を効率よく回避することができ,歩留まりよく生産が可能な光伝送モジュールを提供することができる。
【0056】
また,請求項5に係る光伝送モジュールによれば,光ファイバ保持部材の材料として,化学エッチングに対し等方性を有する基板を用い,反射面を,選択的なエッチングにより球面若しくは非球面で形成したので,反射機能部の光学的性能を向上することが可能で,半導体プロセスを利用することができ,簡易に高精度な位置決め機構を備えた光伝送モジュールを提供することができると共に,高効率な光結合系を実現し得る光伝送モジュールを提供することができる。
【0057】
また,請求項6に係る光伝送モジュールによれば,光ファイバの端面を,球面若しくは非球面形状に加工したので,光ファイバからの出射光の拡散を抑制することが可能で,光素子の小型化により高速性を確保できると共に,高効率な光結合系を実現し得る光伝送モジュールを提供することができる。
【0058】
また,請求項7に係る光伝送モジュールによれば,光ファイバ固定用溝に略平行な方向に光素子部材の位置を概略規定するための位置決め部材を具備し,前記光素子部材は,光素子が複数個アレイ状に形成され,前記位置決め部材に所定の一部を配置し,ファイバ方向に対する位置決めについて,前記位置決め部材に一辺が接触するよう配置し,ファイバアレイ方向に対する位置決めについて,光ファイバの出射光の投影部分に位置する複数の受光素子の電極に光ファイバ保持部材の電極パターンがくるように配置することで,精度良く位置決めがなされた光伝送モジュールを実現できる。
【0059】
また,請求項8に係る光伝送モジュールによれば,光ファイバ保持部材の電極の一部に導電性接着剤を選択的に塗布してメサ形状の凸部を形成し,この凸部と受光素子の電極とを接触させ,位置決め機構として用いることにより,精度良く位置決めがなされた光伝送モジュールを実現できる。
【図面の簡単な説明】
【図1】 本発明の実施例1に係る光伝送モジュールの構造説明図であり,図1(a)は光ファイバ保持部材及び光素子部材を接続する前の光伝送モジュールの斜視図,図1(b)は方向Bから見た光結合部分の断面図,図1(c)は光素子部材の斜視図である。
【図2】 実施例1の光伝送モジュールにおける光ファイバ保持部材及び光素子部材の接続を説明する平面図である。
【図3】 実施例2の光伝送モジュールにおける光ファイバ保持部材及び光素子部材の接続を説明する平面図である。
【図4】 実施例3の光伝送モジュールにおける光ファイバ保持部材及び光素子部材の接続を説明する説明図であり,図4(a)は平面図,図4(b)は断面図である。
【図5】 実施例4の光伝送モジュールの断面図である。
【図6】 第1従来例の光ファイバアレイ用光反射器の構造説明図である。
【図7】 第2従来例の光受信アレイモジュールの構造説明図である。
【符号の説明】
101 光ファイバ保持部材
102 光素子部材
103,103' 光ファイバ
104 ファイバ固定用溝
105,105' 傾斜面(反射面)
106,111,111' 電極パターン(電極)
107 固定及び電気接触のための凸部(導電性接着剤)
110 光素子
200,300 出射光の投影領域
425 凸部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical transmission module used for optical communication, optical information processing, optical interconnection, and the like, and in particular, has excellent productivity while ensuring alignment accuracy between an optical fiber, an optical path conversion surface, and an optical element, and The present invention relates to an inexpensive and small self-aligning optical transmission module.
[0002]
[Prior art]
As a conventional method of configuring an optical transmission module, for example, there is a method as shown in FIG. This first conventional example is a configuration of an “optical reflector for an optical fiber array” disclosed in Japanese Patent Laid-Open No. 5-303028. An optical fiber alignment V-shaped groove 602 is provided, and these optical fibers are provided at one end. A reflection V-shaped groove 601 orthogonal to the alignment V-shaped groove 602 is provided, and light emitted from the optical fiber 601 aligned with the optical fiber alignment V-shaped groove 602 is cut into a V-shape of the reflective V-shaped groove 603. The direction is changed depending on the surface thus formed, and optical coupling with an optical element such as a light receiving element is realized without requiring complicated adjustment.
[0003]
FIG. 7 shows a block diagram of the “light receiving array module” disclosed in the Electronics Society Conference of the Institute of Electronics, Information and Communication Engineers 1995, presentation number C-198. In the second conventional example, as in the first conventional example, a reflective V-shaped groove is produced by a method of anisotropic etching of the crystal substrate, and the optical path of the outgoing light from the array fiber 703 is converted by the reflection surface. , Optical coupling is realized by projecting onto a PD array (light receiving element) positioned by a self-alignment method using AuSn bumps 704.
[0004]
[Problems to be solved by the invention]
However, in the first conventional example, the optical fiber array 601 and the reflection mechanism have a simple structure and can be formed on the same substrate 601, which is effective for downsizing the module. There was a problem in productivity, such as adjustment work for alignment between the optical element and the optical fiber array.
[0005]
In addition, when flip chip mounting using solder bumps is used as in the second conventional example, the final alignment can be simplified by the effect of self-alignment. Problems remain in productivity, such as increased costs due to complications.
[0006]
The present invention has been made in view of the above-described conventional problems, and is small, self-aligning that is excellent in productivity and inexpensive while ensuring alignment accuracy between an optical fiber, an optical path conversion surface, and an optical element. An object of the present invention is to provide a simple optical transmission module.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, an optical transmission module according to claim 1 of the present invention is formed integrally with at least one or more optical fibers, a fiber fixing groove of the optical fiber, and the fiber fixing groove. An optical transmission module comprising: an optical fiber holding member provided with an inclined surface for converting an optical path of light emitted from the optical fiber; and an optical element member formed with a plurality of optical elements. The member functions as a base member of the optical transmission module by mounting an electrode pattern or a semiconductor integrated circuit bare chip at a desired position on the surface, and the optical element member is at least with respect to a projection region of the emitted light for each optical fiber. An optical element is formed so that two or more optical elements are included, and a part of the electrode on the optical fiber holding member and a part of the electrode of the optical element member are Is obtained by the gas-connected.
[0008]
The optical transmission module according to claim 2 is the optical transmission module according to claim 1, wherein the optical fiber holding member is made of a crystal substrate having a predetermined orientation, and is formed by a semiconductor processing process and anisotropic etching. fixing grooves and the inclined surface fibers are produced in one piece, before Symbol optical fiber when disposed on the fiber fixing groove, a portion of the outer periphery of the optical fiber from the surface of the optical fiber holding member protrudes And a part of the optical element member is disposed so as to abut against the protruding portion of the optical fiber.
[0009]
The optical transmission module according to claim 3 is the optical transmission module according to claim 1 or 2, wherein an interval between the electrodes formed on the optical fiber holding member is larger than an electrode interval of the optical element member, Alternatively, a part of the electrodes of the optical element member is formed at a pitch that is modulated so as to be unequal.
[0010]
The optical transmission module according to claim 4 is the optical transmission module according to claim 1, 2 or 3, wherein the optical fiber holding member has a convex portion between the electrodes formed on the optical fiber holding member. To do.
[0011]
The optical transmission module according to claim 5 is the optical transmission module according to claim 1, 2, 3 or 4, wherein the optical fiber holding member is made of a substrate having isotropic property against chemical etching, The reflecting surface is formed as a spherical surface or an aspherical surface by selective etching.
[0012]
An optical transmission module according to a sixth aspect is the optical transmission module according to the first, second, third, fourth or fifth aspect, wherein the end face of the optical fiber is processed into a spherical or aspherical shape.
[0013]
An optical transmission module according to claim 7 is the optical transmission module according to claim 1, 2, 3, 4, 5 or 6, wherein the position of the optical element member is substantially parallel to the optical fiber fixing groove. The optical element member includes a plurality of optical elements formed in an array, and a predetermined part of the optical element is disposed on the positioning member to position the optical element in the fiber direction. In the positioning with respect to the fiber array direction, an electrode pattern of the optical fiber holding member is formed on the electrodes of the plurality of light receiving elements positioned in the projected portion of the emitted light for each optical fiber. It is something that is made to come.
[0014]
An optical transmission module according to claim 8 is the optical transmission module according to claim 1, 2, 3, 4, 5, 6 or 7, wherein a part of the electrode on the optical fiber holding member and the optical element member When electrically connecting a part of the electrode, a conductive adhesive is selectively applied to a part of the electrode on the optical fiber holding member.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the outline of the optical transmission module of the present invention and the embodiments of the optical transmission module of the present invention will be described in the order of [Example 1], [Example 2], [Example 3], and [Example 4]. This will be described in detail with reference to the drawings.
[0016]
[Outline of Optical Transmission Module of the Present Invention]
In the optical transmission module according to claim 1 of the present invention, as shown in FIG. 1, at least one optical fiber 103, a fiber fixing groove 104, and a fiber fixing groove 104 are integrally formed. And an optical fiber holding member 101 having an inclined surface 105 for converting the optical path of the light emitted from the optical device, and an optical element member 102 formed with a plurality of optical elements 110. The electrode pattern 106 or the semiconductor integrated circuit bare chip is mounted at a desired position on the surface and functions as a base member of the optical transmission module, and the optical element member 102 is at least with respect to the projection region of the emitted light from the optical fiber 103. configured to contain two or more light elements 110, the portion of the electrode 106 on the optical fiber holding member 101 and the optical element member 102 It is electrically connected to a portion of the electrode 111.
[0017]
Therefore, it is possible to realize a small-sized optical transmission module that is excellent in productivity while ensuring the alignment accuracy between the optical fiber 103 and the inclined surface 105 that is the optical path conversion surface and the optical element 110.
[0018]
Further, in the optical transmission module according to claim 2, as shown in FIGS. 1 and 2, a crystal substrate having a predetermined orientation is used as the material of the optical fiber holding member 101, and the fiber is formed by a semiconductor processing process and anisotropic etching. When the fixing groove 104 and the inclined surface 105 are integrally formed and the optical fiber 103 is arranged in the fiber fixing groove 104, a part of the outer periphery of the optical fiber 103 protrudes from the surface of the optical fiber holding member 101. The optical element member 102 is disposed so that a part of the optical element member 102 abuts against the protruding portion of the optical fiber 103.
[0019]
Therefore, an optical transmission module can be manufactured using a semiconductor process, and an optical transmission module having a highly accurate positioning mechanism can be realized easily.
[0020]
Further, in the optical transmission module according to claim 3, as shown in FIGS. 1 and 3, the interval between the electrodes 106 formed on the optical fiber holding member 101 is larger than the interval between the electrodes 111 of the optical element member 102, Alternatively, a part of the electrodes 111 ′ of the optical element member 102 is formed at a pitch that is modulated so as to be unequal.
[0021]
As a result, electrical contact between adjacent channels can be efficiently avoided, performance deterioration of the optical transmission module due to unnecessary connection of the optical element 110 and electrical characteristics of the wiring can be controlled, and the yield can be improved. An optical transmission module that can be produced can be realized.
[0022]
Further, in the optical transmission module according to claim 4, as shown in FIG. 4, the optical fiber holding member 101 is provided with a convex portion 425 between the electrodes 106 formed on the optical fiber holding member 101. As a result, it is possible to efficiently avoid electrical contact between adjacent channels and realize an optical transmission module that can be produced with high yield.
[0023]
Further, in the optical transmission module according to claim 5, as shown in FIG. 5, a substrate having isotropic property against chemical etching is used as the material of the optical fiber holding member 101, and the reflective surface 105 ′ is selectively etched. Is formed as a spherical surface or an aspherical surface. As a result, it is possible to improve the optical performance of the reflection function section, to use a semiconductor process, to easily realize an optical transmission module with a high-precision positioning mechanism, and to achieve high-efficiency optical coupling. The system is realized.
[0024]
In the optical transmission module according to the sixth aspect, as shown in FIG. 5, the end face of the optical fiber 103 ′ is processed into a spherical or aspherical shape. Thereby, it is possible to suppress the diffusion of the outgoing light from the optical fiber 103 ′, and it is possible to secure high speed by downsizing the optical element 110 and to realize a highly efficient optical coupling system.
[0025]
The optical transmission module according to claim 7 further includes a positioning member 107 for roughly defining the position of the optical element member 102 in a direction substantially parallel to the optical fiber fixing groove 104. A plurality of elements 110 are formed in an array, a predetermined part is arranged on the positioning member 107, and positioning in the fiber optical axis direction is performed so that one side of the optical element member 102 is in contact with the positioning in the fiber array direction. When the optical element member 102 is arranged, the electrode pattern 106 on the optical fiber holding member 101 is placed on the electrodes 111 of the plurality of light receiving elements located in the projection portion 200 of the light emitted from the optical fiber 103. By doing so, it is possible to realize an optical transmission module that is accurately positioned.
[0026]
In the optical transmission module according to claim 8, a mesa-shaped convex portion 107 is formed by selectively applying a conductive adhesive to a part of the electrode 106 on the optical fiber holding member 101. By connecting them by bringing them into contact with the electrodes 111 of the light receiving element and curing them, it is possible to realize an optical transmission module that is positioned with high accuracy by using as a positioning mechanism.
[0027]
[Example 1]
FIG. 1 is a diagram illustrating the structure of an optical transmission module according to Embodiment 1 of the present invention. 1A is a perspective view of the optical transmission module before connecting the optical fiber holding member 101 and the optical element member 102, FIG. 1B is a cross-sectional view of the optical coupling portion viewed from the direction B, and FIG. c) is a perspective view of the optical element member 102. FIG.
[0028]
In the optical transmission module of the present embodiment, at least one or more optical fibers 103, a fiber fixing groove 104, and a fiber fixing groove 104 are formed integrally with each other to convert the optical path of light emitted from the optical fiber 103. The reflection surface (inclined surface) 105 is formed on the optical fiber holding member 101 which is the same member.
[0029]
For example, when a silicon crystal substrate having a predetermined orientation (in this case, <100 plane>) is used as the material of the optical fiber holding member 101, the semiconductor processing process such as normal photolithography and anisotropic etching techniques are used. The fiber fixing groove 104 is integrally formed on the same substrate 101.
[0030]
At this time, the inclined surface 105 of the fiber fixing groove 104 facing the optical fiber 103 is used as a reflecting surface that is an optical path conversion function element, so that the reflecting surface 105 is treated as being integrated with the fiber fixing groove 104. be able to. Further, in this case, in order to improve the reflectance, a metal thin film and a transparent insulating film or a dielectric multilayer film may be formed on the reflecting surface 105.
[0031]
Further, as a positioning mechanism for the optical element member 102, a thin film is formed at predetermined positions on both sides of the optical fiber holding member 101 along the fiber fixing groove 104, and then formed by patterning and etching techniques using a photolithography technique. The convex portion 107 is used as a positioning mechanism, or the width of the fiber fixing groove 104 is set so that when the optical fiber 103 is arranged, a part of the outer periphery of the optical fiber 103 is light-transmitted. A part of the optical fiber 103 is used as a positioning mechanism so as to protrude by a predetermined amount from the surface of the fiber holding member 101.
[0032]
Then, an electrical wiring 106 for connection to an electrical circuit in the next stage and mounting of an IC bare chip is formed on the insulator thin film 112 of the optical fiber holding member 101 as shown in FIG.
[0033]
Next, in the optical element member 102, the light receiving element is formed as the optical element 110 in this embodiment. For example, when an optical transmission system with a wavelength of 1 [μm] or less is considered, the optical element member (light receiving element) A silicon substrate is used as the substrate 102, and photodiodes (for example, pin-PDs composed of pin layers) are used as the light receiving elements 110, and are manufactured in an array shape with a predetermined interval.
[0034]
In the optical element member 102, as shown in the plan view of FIG. 2, when the optical transmission module is configured, at least two or more light receiving elements 110 are provided for the projection region 200 of the emitted light from the optical fiber 103. As included, a plurality of light receiving elements 110 are formed in an array, and the electrodes 111 are also formed together with the light receiving elements 110.
[0035]
In the optical transmission module according to the present embodiment, the light receiving element member 102 is arranged so that one side of the convex portion (a part of the outer peripheral portion of the fiber in this embodiment) 107 which is a positioning member of the optical fiber holding member 101 is in contact with it. Thus, the light receiving element member 102 is positioned in the fiber optical axis direction.
[0036]
Further, the positioning of the light receiving element member 102 in the fiber array direction is such that when the light receiving element member 102 is disposed, the electrodes 111 of the plurality of light receiving elements positioned at the projected portion 200 of the light emitted from the optical fiber 103 are connected to the optical fiber. This is performed by causing the electrode pattern 106 on the holding member 101 to come.
[0037]
That is, a plurality of light receiving elements to which light is automatically incident by bringing the electrode 106 provided on the surface of the optical fiber holding member 106 on the extension of the fiber fixing groove 104 into contact with a predetermined electrode on the light receiving element member 102. 110 is electrically connected and functions as one light receiving element aligned with the corresponding optical fiber 103, so that the optical transmission module can be assembled without the need for fine adjustment of the optical element member 102 in particular. It becomes possible.
[0038]
By the above method, the light receiving element member 102 is accurately positioned in the fiber array direction and the fiber optical axis direction by a mechanical mechanism and an alignment-free element configuration.
[0039]
For electrical connection between the electrode 111 on the light receiving element member 102 and the electrode 106 on the optical fiber holding member 101, for example, a conductive adhesive is selectively applied to a part of the electrode 106 on the optical fiber holding member 101. A mesa-shaped convex portion 107 is formed by coating, and the convex portion 107 and the electrode 111 of the light receiving element are brought into contact with each other to be cured.
[0040]
[Example 2]
Next, an optical transmission module according to Embodiment 2 of the present invention will be described. FIG. 3 is a plan view for explaining the connection between the optical fiber holding member 101 and the optical element member 102 in the optical transmission module of this embodiment.
[0041]
In the first embodiment, as shown in FIG. 2, the interval between the electrodes 106 formed on the optical fiber holding member 101 is formed to be larger than the pitch of the electrodes 111 on the light receiving element member 102.
[0042]
On the other hand, in the second embodiment, as shown in FIG. 3, a part of the electrodes 111 on the light receiving element member 102 is formed at a pitch that is modulated so as to have unequal intervals.
[0043]
According to these methods, in Example 1 and Example 2, when the mesa-shaped convex portion 107 is formed by selectively applying a conductive adhesive to a part of the electrode 106 on the optical fiber holding member 101, Control of the coating amount can be relaxed, and unnecessary electrical contact between adjacent channels due to deformation of the convex portion 107 can be prevented when the optical transmission module is configured.
[0044]
In particular, in the second embodiment (FIG. 3), it is also possible to prevent a decrease in response speed due to an increase in the capacity of the light receiving element due to an unnecessary electrical coupling of the light receiving elements.
[0045]
Example 3
Next, an optical transmission module according to Embodiment 3 of the present invention will be described. 4A and 4B are explanatory diagrams for explaining the connection between the optical fiber holding member 101 and the optical element member 102 in the optical transmission module of the present embodiment. FIG. 4A is a plan view and FIG. 4B is a cross-sectional view. is there.
[0046]
In the present embodiment, a convex portion 425 is formed at a predetermined location between the electrodes 111 on the surface of the optical fiber holding member 101 by, for example, photolithography and patterning techniques, and then one electrode 106 on the optical fiber holding member 101 is formed. A mesa-shaped convex portion 107 is formed by selectively applying a conductive adhesive to the portion. Thereby, when the optical element member 102 is disposed, unnecessary electrical contact between adjacent channels due to deformation of the adhesive (107) can be prevented.
[0047]
Example 4
Next, an optical transmission module according to Embodiment 4 of the present invention will be described. FIG. 5 is a cross-sectional view of the optical transmission module of the present embodiment.
[0048]
In FIG. 5A, a substrate having isotropicity with respect to chemical etching, such as a glass substrate, is used as the optical fiber holding member 101, and the reflective surface 105 is made spherical or aspherical by selective etching. After processing to form a metal reflective film, an insulating film is formed, or a dielectric multilayer film is formed to realize an optical path conversion function.
[0049]
As shown in FIG. 5A, by making the reflecting surface 105 spherical or aspherical, the divergence of the emitted light from the optical fiber 103 can be suppressed, and the light can be efficiently condensed on the light receiving element. By configuring the light receiving element member 102 with fewer light receiving elements 110, the substantial light receiving area can be reduced, and the response speed of the light receiving element 110 can be improved.
[0050]
Further, as shown in FIG. 5B, the divergence angle of the diverging light from the optical fiber 103 can also be increased by using an optical fiber 103 ′ whose end face is processed into a spherical or aspherical shape. It can be suppressed, and the same effect as in FIG.
[0051]
The present invention is not limited to the embodiments from the first embodiment to the fourth embodiment, and various modifications can be made without departing from this spirit. For example, it is possible to form a functional thin film on the surface of the optical element 110, or to use a surface-emitting type LED or LD as the optical element 110, and the wavelength band is not limited to 1 [μm] or less. The present invention can also be applied to devices used in transmission systems of other wavelength bands, for example, 1.3 / 1.5 [μm] band, and further, as the optical fiber holding member 101, by the semiconductor process and the anisotropic etching technique. Based on the produced substrate, a mold produced by electroforming and a resin member obtained by injection molding or duplicating the mold with a resin or the like may be used.
[0052]
【The invention's effect】
As described above, according to the optical transmission module according to claim 1 of the present invention, at least one optical fiber, a fiber fixing groove, and a fiber fixing groove are integrally formed. An optical fiber holding member having an inclined surface for converting the optical path of the emitted light, and an optical element member formed by forming a plurality of optical elements. The optical fiber holding member is placed at a desired position on the surface. An electrode pattern or a semiconductor integrated circuit bare chip is mounted and functions as a base member of the optical transmission module, and the optical element member includes at least two or more optical elements with respect to the projection area of the emitted light for each optical fiber. Since the optical element is formed and part of the electrode on the optical fiber holding member is electrically connected to the part of the electrode of the optical element member, the optical fiber and the optical path conversion surface The alignment of the inclined surface and the light element, without fine adjustment, while ensuring precision and excellent productivity and it is possible to provide a compact optical transmission module.
[0053]
In the optical transmission module according to claim 2, a crystal substrate having a predetermined orientation is used as the material of the optical fiber holding member, and the fiber fixing groove and the inclined surface are integrated by a semiconductor processing process and anisotropic etching. When the optical fiber is placed in the fiber fixing groove, it is installed so that a part of the outer periphery of the optical fiber protrudes from the surface of the optical fiber holding member. Since the optical transmission module is disposed so as to abut against the protruding portion, an optical transmission module can be manufactured using a semiconductor process, and an optical transmission module having a highly accurate positioning mechanism can be provided easily.
[0054]
In the optical transmission module according to claim 3, the interval between the electrodes formed on the optical fiber holding member is larger than the interval between the electrodes of the optical element member, or a part of the electrodes of the optical element member is not. Since it is formed at a pitch that is modulated so as to be equally spaced, electrical contact between adjacent channels can be efficiently avoided, and performance degradation of the optical transmission module due to unnecessary connection of optical elements. In addition, it is possible to provide an optical transmission module that can control electrical characteristics of wiring and wiring and can be produced with high yield.
[0055]
In the optical transmission module according to claim 4, since the optical fiber holding member is provided with the convex portion between the electrodes formed on the optical fiber holding member, the electrical contact between the adjacent channels is made efficient. It is possible to provide an optical transmission module that can be avoided well and can be produced with high yield.
[0056]
According to another aspect of the optical transmission module of the present invention, a substrate having isotropy to chemical etching is used as a material for the optical fiber holding member, and the reflective surface is formed as a spherical surface or an aspherical surface by selective etching. As a result, the optical performance of the reflection function unit can be improved, a semiconductor process can be used, and an optical transmission module equipped with a highly accurate positioning mechanism can be provided easily and with high efficiency. An optical transmission module capable of realizing a simple optical coupling system can be provided.
[0057]
According to the optical transmission module of the sixth aspect, since the end face of the optical fiber is processed into a spherical or aspherical shape, it is possible to suppress the diffusion of light emitted from the optical fiber, and the optical element can be made compact. Thus, it is possible to provide an optical transmission module that can secure high speed and realize a highly efficient optical coupling system.
[0058]
According to a seventh aspect of the present invention, the optical transmission module further comprises a positioning member for roughly defining the position of the optical element member in a direction substantially parallel to the optical fiber fixing groove. There are formed a plurality array, placing a portion of a predetermined in the positioning member for positioning with respect to the fiber direction, and arranged so that one side is in contact with the positioning member, the positioning relative to the fiber array direction, of each optical fiber By arranging the electrode pattern of the optical fiber holding member on the electrodes of the plurality of light receiving elements positioned at the projected portion of the emitted light, it is possible to realize an optical transmission module that is positioned with high accuracy.
[0059]
According to the optical transmission module of claim 8, a mesa-shaped convex portion is formed by selectively applying a conductive adhesive to a part of the electrode of the optical fiber holding member, and the convex portion and the light receiving element. An optical transmission module that is positioned with high accuracy can be realized by using this as a positioning mechanism.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of the structure of an optical transmission module according to a first embodiment of the present invention, in which FIG. 1 (a) is a perspective view of the optical transmission module before connecting an optical fiber holding member and an optical element member; (B) is sectional drawing of the optical coupling part seen from the direction B, FIG.1 (c) is a perspective view of an optical element member.
FIG. 2 is a plan view for explaining the connection between the optical fiber holding member and the optical element member in the optical transmission module according to the first embodiment.
FIG. 3 is a plan view for explaining connection of an optical fiber holding member and an optical element member in the optical transmission module according to the second embodiment.
4A and 4B are explanatory views for explaining connection of an optical fiber holding member and an optical element member in an optical transmission module according to Embodiment 3, in which FIG. 4A is a plan view and FIG. 4B is a cross-sectional view.
5 is a sectional view of an optical transmission module according to Embodiment 4. FIG.
FIG. 6 is an explanatory diagram of the structure of a first conventional optical fiber array optical reflector.
FIG. 7 is an explanatory diagram of the structure of a second conventional optical receiving array module.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 Optical fiber holding member 102 Optical element member 103,103 'Optical fiber 104 Fiber fixing groove 105,105' Inclined surface (reflection surface)
106, 111, 111 'electrode pattern (electrode)
107 Convex part for fixing and electrical contact (conductive adhesive)
110 Optical element 200,300 Projection area of emitted light 425 Projection

Claims (8)

少なくとも1つ以上の光ファイバと,前記光ファイバのファイバ固定用溝と,前記ファイバ固定用溝と一体に形成され,前記光ファイバからの出射光の光路を変換する傾斜面とを備える光ファイバ保持部材と,光素子を複数個形成してなる光素子部材と,を有する光伝送モジュールにおいて,
前記光ファイバ保持部材は,表面の所望の位置に電極パターン若しくは半導体集積回路ベアチップを搭載して当該光伝送モジュールのベース部材として機能し,
前記光素子部材は,前記光ファイバの出射光の投影領域に対し少なくとも2つ以上の光素子が含まれるように,光素子が形成され,
前記光ファイバ保持部材上の電極の一部と前記光素子部材の電極の一部とを電気的に接続する接続手段を備えることを特徴とする光伝送モジュール。
An optical fiber holder comprising at least one or more optical fibers, a fiber fixing groove of the optical fiber, and an inclined surface formed integrally with the fiber fixing groove and converting an optical path of light emitted from the optical fiber In an optical transmission module having a member and an optical element member formed with a plurality of optical elements,
The optical fiber holding member functions as a base member of the optical transmission module by mounting an electrode pattern or a semiconductor integrated circuit bare chip at a desired position on the surface,
The optical element member is formed with an optical element so that at least two or more optical elements are included in the projection area of the emitted light for each optical fiber,
An optical transmission module comprising connection means for electrically connecting a part of the electrode on the optical fiber holding member and a part of the electrode of the optical element member.
前記光ファイバ保持部材は,所定の方位を有する結晶基板を材料とし,半導体加工プロセス及び異方性エッチングにより前記ファイバ固定用溝及び前記傾斜面が一体に作製され
前記光ファイバは,前記ファイバ固定用溝に配置される際に,前記光ファイバ保持部材の表面より当該光ファイバの外周の一部が突出するように設置され,前記光素子部材の一部が当該光ファイバの該突出部分に突き当たるように配置されることを特徴とする請求項1記載の光伝送モジュール。
The optical fiber holding member is made of a crystal substrate having a predetermined orientation, and the fiber fixing groove and the inclined surface are integrally manufactured by a semiconductor processing process and anisotropic etching ,
The optical fiber is installed so that a part of the outer periphery of the optical fiber protrudes from the surface of the optical fiber holding member when the optical fiber is disposed in the fiber fixing groove, and a part of the optical element member is The optical transmission module according to claim 1, wherein the optical transmission module is disposed so as to abut against the protruding portion of the optical fiber.
前記光ファイバ保持部材上に形成される電極の間隔は,前記光素子部材の電極間隔より大きいか,或いは前記光素子部材の電極の一部が不等間隔であるように変調されたピッチで形成されることを特徴とする請求項1または2記載の光伝送モジュール。  The interval between the electrodes formed on the optical fiber holding member is larger than the electrode interval of the optical element member, or is formed at a pitch that is modulated so that a part of the electrodes of the optical element member is unevenly spaced. The optical transmission module according to claim 1, wherein the optical transmission module is provided. 前記光ファイバ保持部材は,当該光ファイバ保持部材上に形成された電極間に凸部を有することを特徴とする請求項1,2または3記載の光伝送モジュール。  4. The optical transmission module according to claim 1, wherein the optical fiber holding member has a convex portion between electrodes formed on the optical fiber holding member. 前記光ファイバ保持部材は,化学エッチングに対し等方性を有する基板を材料とし,前記反射面は,選択的なエッチングにより球面若しくは非球面で形成されることを特徴とする請求項1,2,3または4記載の光伝送モジュール。  The optical fiber holding member is made of a substrate that is isotropic with respect to chemical etching, and the reflecting surface is formed as a spherical surface or an aspherical surface by selective etching. 5. The optical transmission module according to 3 or 4. 前記光ファイバは,端面が球面若しくは非球面形状に加工されたものであることを特徴とする請求項1,2,3,4または5記載の光伝送モジュール。  6. The optical transmission module according to claim 1, wherein the end face of the optical fiber is processed into a spherical or aspherical shape. 前記光ファイバ保持部材は,前記光ファイバ固定用溝に略平行な方向に前記光素子部材の位置を概略規定するための位置決め部材を有し,
前記光素子部材は,光素子が複数個アレイ状に形成され,前記位置決め部材に所定の一部を配置し,ファイバ方向に対する位置決めにおいて,前記位置決め部材に一辺が接触するよう配置され,また,ファイバアレイ方向に対する位置決めにおいて,前記光ファイバの出射光の投影部分に位置する複数の前記光素子の電極に前記光ファイバ保持部材の電極パターンがくるように配置されることを特徴とする請求項1,2,3,4,5または6記載の光伝送モジュール。
The optical fiber holding member has a positioning member for roughly defining the position of the optical element member in a direction substantially parallel to the optical fiber fixing groove;
The optical element member includes a plurality of optical elements formed in an array, a predetermined part is disposed on the positioning member, and one side is in contact with the positioning member in positioning in the fiber direction. 2. The positioning with respect to the array direction is arranged such that the electrode pattern of the optical fiber holding member comes to the electrodes of the plurality of optical elements located at the projected portion of the emitted light for each optical fiber. , 2, 3, 4, 5 or 6.
前記接続手段において,前記光ファイバ保持部材上の電極の一部に導電性粘着材を選択的に塗布される接続手段を備えることを特徴とする請求項1,2,3,4,5,6または7記載の光伝送モジュール。The connection means further comprises connection means for selectively applying a conductive adhesive material to a part of the electrode on the optical fiber holding member. Or the optical transmission module of 7.
JP13039496A 1996-05-24 1996-05-24 Optical transmission module Expired - Fee Related JP3677348B2 (en)

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