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JP3681763B2 - Substrate delivery handling device - Google Patents
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JP3681763B2 - Substrate delivery handling device - Google Patents

Substrate delivery handling device Download PDF

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Publication number
JP3681763B2
JP3681763B2 JP16156693A JP16156693A JP3681763B2 JP 3681763 B2 JP3681763 B2 JP 3681763B2 JP 16156693 A JP16156693 A JP 16156693A JP 16156693 A JP16156693 A JP 16156693A JP 3681763 B2 JP3681763 B2 JP 3681763B2
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JP
Japan
Prior art keywords
substrate
main body
suction
contact
apparatus main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16156693A
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Japanese (ja)
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JPH0710314A (en
Inventor
均 佐藤
光浩 石原
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Filing date
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Priority to JP16156693A priority Critical patent/JP3681763B2/en
Publication of JPH0710314A publication Critical patent/JPH0710314A/en
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  • Liquid Crystal (AREA)
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Description

【0001】
【産業上の利用分野】
この発明はとくに液晶表示装置のガラス製の基板を受け渡すために用いられるハンドリング装置に関する。
【0002】
【従来の技術】
たとえば液晶表示装置の製造過程においては、ガラス製の基板に回路パタ−ンを形成するためなどに種々の工程があり、各工程間において上記基板を受け渡すためにロボットが用いられている。つまり、ロボットにはハンドリング装置が設けられ、このハンドリング装置によって所定の工程で所定の処理が行われた基板を保持して次工程へ受け渡すようにしている。
【0003】
ガラス製の基板に機械的な外力を加えると変形したり、カケなどの損傷が生じ易いため、上記ハンドリング装置では上記ガラス基板を機械的に挟持せず、吸引力によって吸着するということが行われている。
【0004】
図4に従来のハンドリング装置を示す。同図中1はハンドリング装置の装置本体である。この装置本体1は上面を吸着面1aとした平板状をなしていて、その長手方向一端面側には図示しない吸引ポンプに連通する吸引口体2が設けられている。この吸引口体2には吸引路3が形成され、この吸引路3は上記吸引口体2の通路2aに連通している。
【0005】
上記装置本体1には、その吸着面1aに一端を開口させた複数の吸引孔4が長手方向および幅方向に所定の間隔で形成されている。各吸引孔4の他端は上記吸引路3に連通している。したがって、上記吸引ポンプを作動させれば、上記吸引路3に連通した各吸引孔4に上記吸引口体2に接続された吸引ポンプの吸引力が作用するから、その吸引力によって上記吸着面1aに基板5が吸着保持されるようになっている。
【0006】
ところで、上記構成のハンドリング装置においては、上記基板5の裏面のほぼ全体が上記装置本体1の吸着面1aに接触した状態で吸着保持される。上記基板5の裏面が吸着面1aに面接触すれば、上記吸着面1aに付着していた微粒子が上記基板5の裏面に転移し易くなる。微粒子の転移は基板5の装置本体1に対する接触面積が大きくなる程、多くなり、しかも基板5のほぼ全面が吸着面1aに接触することで、そのデバイスエリアに微粒子が付着し、不良品の発生を招くということもある。
【0007】
【発明が解決しようとする課題】
このように、従来のハンドリング装置は、その装置本体に基板を面接触状態で吸着保持する構成であるため、その吸着される面に微粒子が付着し易いということがあった。
【0008】
この発明は上記事情に基づきなされたもので、その目的とするところは、装置本体に吸着される基板に微粒子が付着しずらいようにした基板受け渡し用ハンドリング装置を提供することにある。
【0009】
【課題を解決するための手段】
上記課題を解決するためにこの発明は、液晶表示装置の矩形状のガラス製の基板を吸着して受け渡すハンドリング装置において、
平板状の装置本体と、
この装置本体の長手方向一端部に幅方向に沿って設けられ上記基板のデバイスエリア外の一端部を吸着保持する吸着部と、
上記本体の上記長手方向一端部の一側を除く三側に設けられ上記基板の上記一端部以外の部分を点接触状態で支持する複数の接触ピンと
を具備したことを特徴とする。
【0010】
【作用】
上記構成によれば、基板を吸着保持される一端部だけが面接触し、他の部分は点接触であるから、基板と装置本体との接触面積が減少し、微粒子が装置本体から基板へ転移しずらく、しかも基板はデバイスエリア外の一端部が吸着保持されるため、吸着保持によって微粒子が転移しても、不良品の発生を招くことがない。
【0011】
【実施例】
以下、この発明の一実施例を図1乃至図3を参照して説明する。図1と図2に示すハンドリング装置は装置本体11を備えている。この装置本体11は矩形の平板状をなしていて、その長手方向一端部には吸引路12がT字状に形成されている。上記吸引路12は、図3に示すように上記装置本体11の下面11bに開放する溝13aと、この溝13aの開放面を閉塞した薄い帯状板13bとで形成されている。
【0012】
上記吸引路12の上記装置本体11の幅方向に沿う部分12aには複数、この実施例では3つの吸引孔14(図3に1つだけ示す)が一端を上記吸引路12に連通させ、他端を装置本体11の上面11aに形成された円形状の凹部15に連通させて所定の間隔で横一列に設けられている。上記凹部15には、吸着部を構成する円盤状のノズル板16が下面を気密に接合させて固定されている。このノズル板16には、その上面の中央部分に断面が円形状で、上面が平面からなる接触面17aで、その接触面17aが装置本体11の上面11aよりも上方へ突出した突起17が形成されている。この突起17の部分には上記吸引孔14に連通するノズル孔18が厚さ方向に貫通して形成されている。
【0013】
上記吸引路12の上記装置本体11の長手方向に沿う部分12bの末端は上記装置本体11の下面に開口した連通孔19に連通している。この連通孔19は、装置本体11の一端部が図2に鎖線で示すロボットのハンド21に取り付けられた状態において、そのハンド21に形成された連通路22を介して図示しない吸引ポンプに連通するようになっている。したがって、吸引ポンプが作動すれば、上記吸引路12および吸引孔14を介して上記ノズル孔18に吸引力が発生する。
【0014】
上記装置本体11の一端部を除く部分には、この装置本体を11を軽量化するための開口部23が形成されている。装置本体11の上記吸引路12側の一側を除く三側の上面には、上記開口部23の周囲に沿って複数の接触ピン24が所定の間隔で突設されている。この接触ピン24は、図1と図2に鎖線で示す液晶表示装置の矩形状のガラス製の基板25を、上記ノズル板16の接触面17aとで水平(同じ高さ)に支持するためのもので、上記基板25を傷付けることなく点接触状態で支持できるよう、その上面が半球形状などの凸曲面に形成されている。
【0015】
上記構成のハンドリング装置によれば、吸引ポンプを作動させてノズル孔18に吸引力を発生させることで、基板25は、その下面の長手方向一端部だけが突起17の接触面17aに接触して吸着保持され、他の部分は接触ピン24に点接触状態で支持される。
【0016】
つまり、基板25は、その長手方向一端部の、突起17の接触面17aに対応するわずかな部分だけが面接触状態で支持され、他の部分は接触ピン24によって点接触状態で支持される。そのため、上記基板25は従来に比べて装置本体11との接触面積を大幅に減少させて吸着保持することができるから、この基板25の裏面に装置本体11に付着している微粒子が移転するのをほとんどなくすことができる。
【0017】
上記接触ピン24は基板25の裏面に点接触しているから、その接触部分から基板25へ微粒子が転移するということはほとんどなく、上記突起17の接触面17aに吸着保持される基板25の長手方向一端部は上記基板25に形成されるデバイスのエリア外となるため、たとえ上記接触面17aから基板25へ微粒子が転移しても、不良品の発生を招くようなことがない。さらに、上記接触ピン24の上面は凸曲面に形成されているから、基板25の裏面との接触によってこの基板25に傷を付けるようなことがなくなる。
【0018】
【発明の効果】
以上述べたようにこの発明は、ハンドリング装置の装置本体に、上記基板のデバイスエリア外となる一端部を吸着保持する吸着部と、上記基板の一端部以外の部分を点接触状態で支持する複数の接触ピンとを設けるようにした。
【0019】
そのため、装置本体に吸着保持される基板は、その一端部だけが上記装置本体に面接触し、他の部分は点接触であるため、従来に比べて装置本体との接触面が大幅に減少するから、上記装置本体から上記基板への微粒子の転移を減少させることができる。基板はデバイスエリア外の一端部が面接触によって吸着保持されるため、たとえ面接触によって微粒子が基板へ転移しても、不良品の発生を招くのを防止することができる。
【図面の簡単な説明】
【図1】この発明の一実施例の全体構成を示す平面図。
【図2】同じく図1のA−A線に沿う断面図。
【図3】同じく装置本体に設けられるノズル板の部分の拡大断面図。
【図4】従来のハンドリング装置の断面図。
【符号の説明】
11…基板、16…ノズル板(吸着部)、17…突起(吸着部)、17a…接触面(吸着部)、18…ノズル孔(吸着部)、24…接触ピン、25…基板。
[0001]
[Industrial application fields]
The present invention particularly relates to a handling device used for delivering a glass substrate of a liquid crystal display device.
[0002]
[Prior art]
For example, in the manufacturing process of a liquid crystal display device, there are various processes for forming a circuit pattern on a glass substrate, and a robot is used to deliver the substrate between the processes. That is, a handling device is provided in the robot, and a substrate that has been subjected to a predetermined process in a predetermined process is held by this handling device and transferred to the next step.
[0003]
When a mechanical external force is applied to a glass substrate, the glass substrate is likely to be deformed or damaged, such as chipping. Therefore, in the handling device, the glass substrate is not mechanically held and is adsorbed by suction force. ing.
[0004]
FIG. 4 shows a conventional handling device. In the figure, reference numeral 1 denotes a device body of the handling device. The apparatus main body 1 has a flat plate shape with an upper surface as an adsorption surface 1a, and a suction port body 2 communicating with a suction pump (not shown) is provided on one end surface side in the longitudinal direction. A suction path 3 is formed in the suction port body 2, and the suction path 3 communicates with the passage 2 a of the suction port body 2.
[0005]
The apparatus body 1 is formed with a plurality of suction holes 4 having one end opened on the suction surface 1a at predetermined intervals in the longitudinal direction and the width direction. The other end of each suction hole 4 communicates with the suction path 3. Therefore, if the suction pump is operated, the suction force of the suction pump connected to the suction port body 2 acts on each suction hole 4 communicating with the suction path 3, so that the suction surface 1 a is affected by the suction force. The substrate 5 is held by suction.
[0006]
By the way, in the handling apparatus having the above-described configuration, substantially the entire back surface of the substrate 5 is sucked and held in a state of being in contact with the suction surface 1a of the apparatus body 1. If the back surface of the substrate 5 comes into surface contact with the suction surface 1a, the fine particles adhering to the suction surface 1a are easily transferred to the back surface of the substrate 5. The transfer of fine particles increases as the contact area of the substrate 5 with the apparatus main body 1 increases, and the entire surface of the substrate 5 comes into contact with the adsorption surface 1a, so that fine particles adhere to the device area, and defective products are generated. May be invited.
[0007]
[Problems to be solved by the invention]
As described above, since the conventional handling apparatus is configured to adsorb and hold the substrate in a surface contact state with the apparatus main body, there are cases in which fine particles are likely to adhere to the adsorbed surface.
[0008]
The present invention has been made based on the above circumstances, and an object of the present invention is to provide a substrate transfer handling device that makes it difficult for fine particles to adhere to a substrate adsorbed on the apparatus main body.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a handling device that sucks and delivers a rectangular glass substrate of a liquid crystal display device .
A flat device body;
A suction portion provided along the width direction at one end portion in the longitudinal direction of the apparatus main body, and sucking and holding one end portion outside the device area of the substrate;
And a plurality of contact pins provided on three sides of the main body excluding one side of the one end in the longitudinal direction and supporting a portion other than the one end of the substrate in a point contact state.
[0010]
[Action]
According to the above configuration, only one end where the substrate is sucked and held is in surface contact and the other portion is in point contact, so the contact area between the substrate and the apparatus main body is reduced, and the fine particles are transferred from the apparatus main body to the substrate. However , since one end portion outside the device area is sucked and held by the substrate, even if the fine particles are transferred by sucking and holding, a defective product is not generated.
[0011]
【Example】
An embodiment of the present invention will be described below with reference to FIGS. The handling apparatus shown in FIGS. 1 and 2 includes an apparatus main body 11. The apparatus main body 11 has a rectangular flat plate shape, and a suction path 12 is formed in a T shape at one end in the longitudinal direction. As shown in FIG. 3, the suction path 12 is formed by a groove 13a that opens to the lower surface 11b of the apparatus main body 11, and a thin strip 13b that closes the open surface of the groove 13a.
[0012]
A plurality of, in this embodiment, three suction holes 14 (only one is shown in FIG. 3) are connected to one end of the suction path 12 along the width direction of the apparatus main body 11, and one end communicates with the suction path 12. The ends communicate with a circular recess 15 formed on the upper surface 11a of the apparatus main body 11, and are provided in a horizontal row at a predetermined interval. A disc-shaped nozzle plate 16 constituting the suction portion is fixed to the recess 15 with its lower surface airtightly joined. The nozzle plate 16 has a contact surface 17a having a circular cross section at the center of the upper surface and a flat upper surface, and a protrusion 17 having the contact surface 17a protruding upward from the upper surface 11a of the apparatus main body 11. Has been. A nozzle hole 18 communicating with the suction hole 14 is formed through the protrusion 17 in the thickness direction.
[0013]
The end of a portion 12b of the suction path 12 along the longitudinal direction of the apparatus main body 11 communicates with a communication hole 19 opened on the lower surface of the apparatus main body 11. The communication hole 19 communicates with a suction pump (not shown) through a communication path 22 formed in the hand 21 in a state where one end of the apparatus main body 11 is attached to a robot hand 21 indicated by a chain line in FIG. It is like that. Therefore, when the suction pump is operated, a suction force is generated in the nozzle hole 18 through the suction path 12 and the suction hole 14.
[0014]
An opening 23 for reducing the weight of the apparatus main body 11 is formed in a portion excluding one end of the apparatus main body 11. A plurality of contact pins 24 project from the upper surface of the three sides of the apparatus main body 11 excluding one side on the suction path 12 side along the periphery of the opening 23 at a predetermined interval. This contact pin 24 is used to horizontally support (same height) the rectangular glass substrate 25 of the liquid crystal display device indicated by the chain line in FIGS. 1 and 2 with the contact surface 17a of the nozzle plate 16. Therefore, the upper surface is formed in a convex curved surface such as a hemispherical shape so that the substrate 25 can be supported in a point contact state without being damaged.
[0015]
According to the handling apparatus having the above configuration, the suction pump is operated to generate a suction force in the nozzle hole 18, so that only one longitudinal end portion of the lower surface of the substrate 25 comes into contact with the contact surface 17 a of the protrusion 17. The other part is supported by the contact pin 24 in a point contact state.
[0016]
That is, the substrate 25 is supported in a surface contact state only at a small portion corresponding to the contact surface 17 a of the protrusion 17 at one end portion in the longitudinal direction, and the other portion is supported in a point contact state by the contact pin 24. Therefore, the substrate 25 can be attracted and held by greatly reducing the contact area with the apparatus main body 11 as compared with the prior art, so that the fine particles adhering to the apparatus main body 11 are transferred to the back surface of the substrate 25. Can be almost eliminated.
[0017]
Since the contact pin 24 is in point contact with the back surface of the substrate 25, the fine particles are hardly transferred from the contact portion to the substrate 25, and the length of the substrate 25 that is adsorbed and held on the contact surface 17 a of the protrusion 17. Since one end portion in the direction is outside the area of the device formed on the substrate 25, even if fine particles are transferred from the contact surface 17a to the substrate 25, there is no possibility of causing defective products. Furthermore, since the upper surface of the contact pin 24 is formed in a convex curved surface, the substrate 25 is not damaged by contact with the back surface of the substrate 25.
[0018]
【The invention's effect】
As described above, according to the present invention, the apparatus main body of the handling apparatus is provided with a suction portion that sucks and holds one end portion outside the device area of the substrate, and a plurality of portions that support a portion other than the one end portion of the substrate in a point contact state. The contact pin was provided.
[0019]
For this reason, only one end of the substrate held by suction on the apparatus main body is in surface contact with the apparatus main body, and the other part is in point contact, so the contact surface with the apparatus main body is greatly reduced compared to the conventional case. Therefore, the transfer of fine particles from the apparatus main body to the substrate can be reduced. Since one end of the substrate outside the device area is adsorbed and held by surface contact, even if fine particles are transferred to the substrate by surface contact, it is possible to prevent the occurrence of defective products.
[Brief description of the drawings]
FIG. 1 is a plan view showing the overall configuration of an embodiment of the present invention.
2 is a cross-sectional view taken along the line AA in FIG.
FIG. 3 is an enlarged cross-sectional view of a nozzle plate portion that is also provided in the apparatus main body.
FIG. 4 is a cross-sectional view of a conventional handling device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 ... Board | substrate, 16 ... Nozzle plate (adsorption part), 17 ... Protrusion (adsorption part), 17a ... Contact surface (adsorption part), 18 ... Nozzle hole (adsorption part), 24 ... Contact pin, 25 ... Substrate.

Claims (1)

液晶表示装置の矩形状のガラス製の基板を吸着して受け渡すハンドリング装置において、
平板状の装置本体と、
この装置本体の長手方向一端部に幅方向に沿って設けられ上記基板のデバイスエリア外の一端部を吸着保持する吸着部と、
上記本体の上記長手方向一端部の一側を除く三側に設けられ上記基板の上記一端部以外の部分を点接触状態で支持する複数の接触ピンと
を具備したことを特徴とする基板受け渡し用ハンドリング装置。
In the handling device that sucks and delivers the rectangular glass substrate of the liquid crystal display device ,
A flat device body;
An adsorption portion provided along the width direction at one longitudinal end of the apparatus main body and adsorbing and holding one end outside the device area of the substrate;
A substrate transfer handling comprising: a plurality of contact pins provided on three sides excluding one side of the one longitudinal end of the main body and supporting a portion other than the one end of the substrate in a point contact state. apparatus.
JP16156693A 1993-06-30 1993-06-30 Substrate delivery handling device Expired - Fee Related JP3681763B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16156693A JP3681763B2 (en) 1993-06-30 1993-06-30 Substrate delivery handling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16156693A JP3681763B2 (en) 1993-06-30 1993-06-30 Substrate delivery handling device

Publications (2)

Publication Number Publication Date
JPH0710314A JPH0710314A (en) 1995-01-13
JP3681763B2 true JP3681763B2 (en) 2005-08-10

Family

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Application Number Title Priority Date Filing Date
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Country Status (1)

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* Cited by examiner, † Cited by third party
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CN114107959A (en) * 2021-11-30 2022-03-01 重庆忽米网络科技有限公司 Wafer conveying method for CVD equipment

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