JP3681957B2 - IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC socket on which an IC such as a ROM is mounted and attached to a substrate, and more particularly to an IC socket in which a chip capacitor can be directly attached to each contact connected to each lead pin of the IC.
[0002]
[Prior art]
In an IC socket for mounting an IC such as a ROM on a substrate, a chip capacitor is connected to a contact connected to each lead pin of the IC, and the chip capacitor is connected to be groundable as a noise countermeasure in the device. .
[0003]
Some chip capacitors are provided on the substrate itself, but the lead wire to the chip capacitor on the substrate becomes long, and the frequency characteristics deteriorate due to the influence of the inductance of the lead wire.
[0004]
Therefore, it is desirable to directly attach the chip capacitor to each contact of the IC socket. As such an IC socket integrated with a chip capacitor, one proposed in Japanese Utility Model Laid-Open No. 5-8945 is known. In this IC socket, individual external terminals communicating with each contact are arranged above the outer periphery of the base housing, and further, a strip-shaped common external terminal that can be connected to the substrate is provided below the outer periphery of the base housing. A chip capacitor is fixed by soldering between an external terminal and the common external terminal.
[0005]
[Problems to be solved by the invention]
However, the conventional example in which the chip capacitor is attached to the outer periphery of the base housing requires the work of soldering the chip capacitor for each contact, so that it takes time to install the chip capacitor.
[0006]
SUMMARY OF THE INVENTION An object of the present invention is to provide an IC socket in which a chip capacitor can be easily attached to a base housing.
[0007]
[Means for Solving the Problems]
The IC socket according to claim 1, which solves the above-described problem, is an IC socket attached to a substrate, and is held along an outer periphery of the base housing made of an insulating material, and the IC lead wire and the substrate. A plurality of contacts that can be electrically connected to each other and a chip capacitor for the contacts, and the base housing is provided on a side surface of the insertion hole for the contact and outside the insertion hole. A holding space for holding the chip capacitor, which communicates with the hole and opens at the outer side and the lower side, is arranged, and a cover made of a conductive material is fitted on the outer periphery of the base housing so as to face the contact of the cover. the flexibility of the elastic piece toward the contact portion is provided, wherein the resilient piece includes a first elastic piece which is a stopper, electrical The second elastic pieces that are pressed for connection are formed in order from the bottom, which is the insertion direction of the chip capacitor, and the direction of the first elastic pieces is an orientation that allows the chip capacitor to be inserted from below. The second elastic piece has a structure opposite to the direction and can hold the chip capacitor in an inserted state from below between the contact and the elastic piece.
[0008]
According to the first aspect, when a chip capacitor is inserted between the elastic piece and the contact, it is grounded to the substrate via the chip capacitor and a cover made of a conductive material. Since the chip capacitor is attached simply by inserting it between the elastic piece and the contact, the selective insertion of inserting the chip capacitor into the contact that requires the chip capacitor can be made freely.
Further, when the inserted chip capacitor passes through the first elastic piece, it is prevented from coming off, and the second elastic piece makes the chip capacitor electrically connected to both the contact and the cover made of a conductive material.
[0009]
An IC socket according to a second aspect is the first aspect, wherein the degree of bending of the first elastic piece toward the contact side is greater than the degree of bending of the second elastic piece toward the contact side .
[0011]
An IC socket according to a third aspect is the IC socket according to the first or second aspect, wherein the chip capacitor is selectively inserted into the holding space .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the electrical connector of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of components before assembly of an IC socket according to the present invention, FIG. 2 is a perspective view including a cross section of the assembled IC socket, and FIG. 3 is an enlarged cross section of a contact portion. FIG.
[0014]
In FIG. 1, an IC socket 1 is composed of a base housing 11, a cover 12, a contact 13, and a chip capacitor 14 inserted as necessary.
[0015]
The base housing 11 is manufactured by molding an insulating material such as resin, and the whole is a hollow rectangular parallelepiped. Insertion holes 21 for the contacts 13 are arranged on both side surfaces of the base housing 11 in the longitudinal direction. Further, holding spaces 22 communicating with the respective insertion holes 21 are opened on both side surfaces in the longitudinal direction of the base housing 11. The holding space 22 is a space for holding the inserted chip capacitor 14.
[0016]
The cover 12 is made by press-molding a metal made of a conductive material such as stainless steel, and has a rectangular frame that fits on the outer periphery of the base housing 11 as a whole. In a portion corresponding to the holding space 22 on the long side of the square frame, a flexible first elastic piece 25 and a flexible second elastic piece 26, which are generally called lances, are cut inward. The cover 12 is provided integrally. A projection 27 that serves both as attachment to the substrate and grounding is also provided integrally with the lower portion of the square frame. A bent portion 28 is formed at the upper portion of the square frame so as to contact the base housing 11 for positioning.
[0017]
The contact 13 is made by press-molding a conductive metal, and has an inwardly bent portion 31, a wide portion 32, and a lead portion 33. The chip capacitor 14 has a rectangular parallelepiped shape in which brazing portions 37 are integrally provided on both sides of the main body 36.
[0018]
The holding structure of the contact 13 with respect to the base housing 11 and the fitting structure of the cover 12 with respect to the base housing 11 are shown in FIGS.
[0019]
The bent portion 31 of the contact 13 is positioned in the upper portion of the insertion hole 21, and has a structure capable of receiving an IC lead wire (not shown) between the inner wall of the insertion hole 21 and the bent portion 31. The wide portion 32 of the contact 13 is located below the insertion hole 21 and faces the holding space 22. The lead portion 33 of the contact 13 protrudes from the lower surface of the base housing 11.
[0020]
The first lance or first elastic piece 25 of the cover 12 is located below the holding space 22, and the second lance or second elastic piece 26 of the cover 12 is located above the holding space 22. The degree of bending of the first elastic piece 25 toward the contact 13 is greater than the degree of bending of the second elastic piece 26 toward the contact 13. The direction of the first elastic piece 25 is an orientation that allows the chip capacitor 14 to be inserted from below, and the second elastic piece 26 is opposite to the above direction. As clearly shown in FIG. 3, the chip capacitor 14 inserted from the direction of the arrow A is retained by the first elastic piece 25 and is pressed against the wide portion 32 of the contact 13 by the second elastic piece 26.
[0021]
4 and 5 show details of the insertion hole 21 and the holding space 22 of the base housing 11. In FIG. 4, when the insertion hole 21 is viewed from above, the insertion hole 21 has a substantially T shape in which a wide slit portion 42 communicates with the central portion 41, and chamfering is provided around the entrance. The wide portion 32 of the contact 13 in FIG. 1 passes through the slit portion 42, and the tip of the bent portion 31 of the contact 13 in FIG. 1 comes into contact with the step 43 provided on both sides of the central portion 41.
[0022]
In FIG. 5, when the insertion hole 21 is viewed from below, the wide slit portion 42 communicates with the central portion 41 and the holding space 22 communicates. The insertion hole 21 and the holding space 22 are chamfered around. The wide portion 32 of the contact 13 in FIG. 1 passes through the slit portion 42 and faces the holding space 22.
[0023]
An assembly procedure of the IC socket 1 having the above-described structure will be described with reference to FIG. The contacts 13 are inserted from above the insertion holes 21 of the base housing 11 so that a large number of contacts 13 are held by the base housing 11. Next, when the cover 12 is inserted from above the base housing 11, the IC socket 1 is assembled.
[0024]
The chip capacitor 14 can be inserted when the IC socket 1 is assembled, or can be inserted immediately before the IC socket 1 is attached to the substrate. As shown in FIG. 3, when the chip capacitor 14 is pushed from below the holding space 22, the flexible first elastic piece 25 is deformed, and when the chip capacitor 14 advances to the position shown in the figure, the chip capacitor 14 is The flexible first elastic piece 25 prevents it from coming off, and the flexible second elastic piece 26 presses it toward the contact 13, so that the electrical connection to the contact 13 is maintained.
[0025]
An example of assembly of the IC socket 1 on the substrate will be described with reference to FIG. The IC socket 1 is attached to the substrate 2 by inserting the lead portion 33 of the contact 13 into a hole (not shown) of the substrate 2. At this time, the protrusion 27 of the cover 12 is grounded with respect to the substrate 2. Next, an IC 3 such as a ROM is mounted on the IC socket 1 by inserting the lead wire 3 a while pushing and bending a bent portion of a contact (not shown) in the insertion hole 21.
[0026]
A lead wire 3a of an IC 3 such as a ROM is electrically connected to the lead portion 33 of the contact 13, and at the same time, is grounded to the substrate 2 via a chip capacitor 14 (not shown). As a result, noise countermeasures can be implemented for devices that are susceptible to noise.
[0027]
The effect of the IC socket 1 having the above-described embodiment will be described below. When the base housing 11, the cover 12, and the contact 13 are assembled, the chip capacitor 14 can be selectively inserted at any time or any place. Therefore, when assembling the base housing 11, the cover 12 and the contacts 13, a chip capacitor 14 having a predetermined specification can be inserted. Further, after the base housing 11, the cover 12 and the contact 13 are assembled, an appropriate chip capacitor 14 can be inserted into the appropriate contact 13. It is also possible to select and insert a chip capacitor 14 having a capacity suitable for each contact 13 corresponding to the IC. Furthermore, it is possible to select not to insert the chip capacitor 14 into the contact 13 that does not require the chip capacitor 14.
[0028]
Further, the first elastic piece 25 for retaining and the second elastic piece 26 for pressing formed on the cover 12 ensure electrical continuity between the contact 13 and the cover 12 without the chip capacitor 14 falling off. .
[0029]
In addition, since the entire cover 12 is formed of a conductive metal and is grounded to the substrate by the projection 27 of the cover 12, the ground from each chip capacitor 14 to the ground can be neglected.
[0030]
The present invention is not limited to the above-described embodiment, and various design changes can be made.
(1) The cover 12 is not limited to a rectangular frame, but may be a three-sided frame body, or may be one in which separate objects are attached to two long sides. When the rectangular frame is not used, a concave-shaped and convex-shaped engaging portion can be provided at the end so that it can be inserted into the base housing 11.
[0031]
(2) The elastic piece of the cover 12 is not limited to the first elastic piece 25 for retaining and the second elastic piece 26 for pressing, but can be one elastic piece for both retaining and pressing. . In this case, it is possible to adopt a shape in which a step portion is provided on one elastic piece, and when it is climbed over at this step portion, it is prevented from coming off and pressed at the step portion after getting over.
[0032]
(3) Although the chip capacitor 14 has been described as adopting a standard product having brazed portions at both ends, a chip capacitor 14 having no brazed portion can be used.
[0033]
【The invention's effect】
As described above, according to the first aspect, since the chip capacitor can be attached to the required contact simply by inserting it between the contact and the cover, the chip capacitor can be easily and quickly attached. Further, since there is no special fixing means such as soldering, there is an effect that a chip capacitor can be selectively attached to an arbitrary contact during the assembly or the like.
In addition, there is an effect that both mechanical holding and electrical conduction of the inserted chip capacitor are ensured.
[Brief description of the drawings]
FIG. 1 is a perspective view of each part before assembly of an IC socket according to the present invention.
FIG. 2 is a perspective view including a cross-section of an assembled IC socket.
FIG. 3 is an enlarged view of a cross section of a contact portion.
FIG. 4 is a top view of the base housing.
FIG. 5 is a bottom view of the base housing.
FIG. 6 is a perspective view of an IC socket in an assembled state.
[Explanation of symbols]
1 IC socket 2 Board 3 IC
3a Lead wire 11 Base housing 12 Cover 13 Contact 14 Chip capacitor 21 Insertion hole 22 Holding space 25 First elastic piece 26 Second elastic piece 27 Projection

Claims (3)

An IC socket attached to a substrate,
A base housing made of an insulating material, a plurality of contacts that are held along the outer periphery of the base housing and can be electrically connected to an IC lead wire and the substrate, and a chip capacitor for the contacts ;
The base housing has, on its side surface, an insertion hole for the contact and a holding space that is provided outside the insertion hole and that communicates with the insertion hole and that opens outside and below, and holds the chip capacitor. Lined up
A conductive material cover is fitted on the outer periphery of the base housing, and a flexible elastic piece facing the contact is provided on a portion of the cover facing the contact,
The elastic piece is formed by sequentially arranging a first elastic piece that serves as a retainer and a second elastic piece that is pressed for electrical connection from the bottom in which the chip capacitor is inserted,
The orientation of the first elastic piece is an orientation that allows the chip capacitor to be inserted from below, and the second elastic piece is opposite to the orientation,
An IC socket configured to hold a chip capacitor inserted from below between the contact and the elastic piece. 2. The IC socket according to claim 1 , wherein a degree of bending of the first elastic piece toward the contact side is greater than a degree of bending of the second elastic piece toward the contact side . The IC socket according to claim 1 , wherein the chip capacitor is selectively inserted into the holding space .

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