JP3683370B2 - Electron beam exposure system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electron beam exposure apparatus, and more particularly to a block exposure or variable rectangular electron beam exposure apparatus that projects an electron beam on a wafer after shaping the electron beam into a rectangular shape through a slit assembly.
[0002]
At present, in block exposure electron beam exposure apparatuses, in order to cope with the miniaturization of LSI circuit patterns, the circuit patterns of LSIs can be drawn at higher speeds for higher accuracy and high productivity. There is a need to draw.
[0003]
[Prior art]
FIGS. 10A, 10B, and 11 show the first slit 10 disposed at the next stage of the electron gun in the conventional block exposure type electron beam exposure apparatus. The first slit 10 has a pedestal 12 fixed in a housing 11, and a stage 14 is supported on the pedestal 12 via a bearing 13 so as to be rotatable about a vertical axis 15. The solid 16 is fixed, and the worm gear mechanism 17 is provided for the stage 14. The slit assembly 16 has a structure in which four slit forming members 26 are combined in a four-column pattern, and a slit 25 of about 200 μm square is formed at the center. The slit forming member 26 is made of molybdenum having excellent heat resistance. The worm gear mechanism 17 includes a worm wheel 18 integrated with the stage 14 and a worm 19 supported on the pedestal 12. The worm 19 is rotated by a motor 20 outside the housing 11. The inside of the housing 11 is vacuumed through the exhaust port 21. The slit assembly 16 is covered with a cross-shaped cover 23 fixed to the base 12. The cover 23 has a hole 22 in the center.
[0004]
The electron beam radiated from the electron gun passes through the hole 22, and at the location of the slit assembly 16, the surrounding portion is shielded by the slit assembly 16 and passes through the slit 25, and the electron beam passing through the slit 25 has a cross section. It is shaped into a rectangle. The first slit 10 emits an electron beam whose cross section is shaped into a rectangle, and this electron beam is projected onto the wafer to draw an LSI circuit pattern.
[0005]
The stage 14 is rotated about the vertical axis 15 because the phase of the electron beam whose cross section is shaped into a rectangle by the first slit 10 and the second slit, which will be described later, are slightly rotated. This is because it is necessary to make adjustments corresponding to the above. The adjustment performed by rotating the stage 14 with respect to the vertical axis 15 is performed by appropriately driving the motor 20 and rotating the stage 14 within a range of several degrees via the worm gear mechanism 17 before exposure. Adjust so that the parallelism and perpendicularity to the side are within a predetermined range.
[0006]
[Problems to be solved by the invention]
A peripheral portion of the electron beam emitted from the electron gun irradiates the slit assembly 16, whereby the slit assembly 16 is heated. The heat of the slit assembly 16 is conducted from the stage 14 to the pedestal 12 to the housing 11 to be radiated.
[0007]
Here, the heat conduction path from the stage 14 to the pedestal 12 is limited to only the location of the bearing 13, as indicated by reference numeral 30, and the contact at the location of the bearing 13 has a narrow contact area, and , Easy to become unstable. Therefore, the heat resistance of the heat conduction path 30 is large, and the heat conduction of the heat of the slit assembly 16 to the pedestal 12 is not good. For this reason, the slit assembly 16 tends to become high temperature, and the slit assembly 16 tends to cause physical damage such as a defect. If the slit assembly 16 is physically damaged, the drawing accuracy of the circuit pattern is lowered.
[0008]
Further, since the slit assembly 16 is likely to become high temperature, it has been difficult to increase the current amount of the electron beam in order to increase the drawing speed of the circuit pattern.
In addition, when ozone is allowed to flow through the column in order to eliminate charge-up in the column of the electron beam exposure apparatus, the slit assembly 16 is hot, so that the slit assembly 16 can easily touch the ozone. It will oxidize. When the slit assembly 16 is oxidized, the knife edge becomes non-straight and the drawing accuracy of the circuit pattern is lowered.
[0009]
In addition, the influence of backlash that the worm gear mechanism 17 has is likely to appear as a slight positional fluctuation in the rotational direction of the stage 14. If the position of the stage 14 in the direction of rotation varies, the slit image projected on the wafer swings in the direction of rotation, and the circuit pattern drawing accuracy decreases.
[0010]
Therefore, an object of the present invention is to provide an electron beam exposure apparatus that solves the above-described problems.
[0011]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided an electron beam exposure apparatus for projecting an electron beam from an electron beam source onto a sample as an electron beam having a predetermined cross-sectional shape through a first slit. The slit apparatus includes a pedestal and a pedestal. The stage is rotated and adjusted in order to correct the rotation error of the image of the first slit on the second slit having the predetermined cross-sectional shape and the stage that is rotatably supported through the bearing. A stage rotation adjustment mechanism, a slit assembly fixed to the stage and configured to convert the electron beam from the electron beam source into an electron beam having a predetermined cross-sectional shape; and between the stage and the pedestal. The stage rotation adjustment mechanism enables rotation of the stage, and includes a heat conduction path means for conducting the heat of the stage and releasing it to the pedestal. That.
[0012]
According to a second aspect of the present invention, there is provided an electron beam exposure apparatus for projecting an electron beam from an electron beam source onto a sample as an electron beam having a predetermined cross-sectional shape through a first slit. The slit apparatus includes a pedestal and a pedestal. The stage is rotated and adjusted in order to correct the rotation error of the image of the first slit on the second slit having the predetermined cross-sectional shape and the stage that is rotatably supported through the bearing. A stage rotation adjustment mechanism and a slit assembly fixed to the stage and using the electron beam from the electron beam source as the electron beam having the predetermined cross-sectional shape. The stage is fixed to the slit assembly. The stage main body, the flange portion outside the stage main body, and the stage main body and the flange portion exist between the stage main body and the stage main body. A structure that includes a spring portion that is rotatable within a range of a small angle with respect to the flange portion and that conducts heat of the stage body to the flange portion, and the flange portion is fixed to the pedestal. It is a thing.
[0013]
According to a third aspect of the present invention, there is provided a plurality of curved spring pieces, wherein the spring portions are equally divided in the circumferential direction, one end is connected to the stage body, and the other end is connected to the flange portion. It is what became the composition which becomes.
According to a fourth aspect of the present invention, the spring portion is formed of a single helical spring piece that makes a round, has one end connected to the stage body, and the other end connected to the flange portion. Is.
[0014]
According to a fifth aspect of the present invention, the curved spring piece has a plate shape.
According to a sixth aspect of the present invention, the single helical spring piece has a plate shape.
[0015]
According to a seventh aspect of the present invention, the slit device is configured such that electron beam exposure is performed in a state where the spring portion is elastically deformed.
The invention of claim 8 is configured to expose a sample using the electron beam exposure apparatus according to any one of claims 1 to 7.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 2 shows a block exposure type electron beam exposure apparatus 40 according to an embodiment of the present invention. The electron beam exposure apparatus 40 has an electron gun 41 as an electron beam source at the top of a column (not shown), and an electron lens L5 at the bottom, and in the order from the top, the electron lens L1a and the first lens. Slit 42, electron lens L1b, slit deflector 43, first deflector 44, electron lens L2a, second deflector 44, second slit 47 moved by mask stage 46, electron lens L2b, third A deflector 48, a blanking 49, a fourth deflector 50, an electron lens L3 for magnification and rotation, an aperture 51, an electron lens L4, an electromagnetic main deflector 52, and an electrostatic sub deflector 53 are arranged. This is the configuration that was established.
[0017]
The electron beam 55 emitted from the electron gun 41 is made into a parallel electron beam by the electron lens L1a, passes through the first slit 42, and is shaped into a rectangular cross section. The electron beam 55 a having a rectangular cross-section is appropriately deflected through the electron lens L 1 b, the slit deflector 43, the first deflector 44, the electron lens L 2 a, and the second deflector 44, and then into the second slit 47. Of the plurality of formed openings, the section faces a predetermined opening 47a, passes through the opening 47a, and is shaped into the same shape as the opening 47a.
[0018]
The shaped electron beam 55b passes through the electron lens L2b, the third deflector 48, the blanking 49, the fourth deflector 50, the electron lens L3, the aperture 51, the electron lens L4, and the electron lens L5, and enters the stage. The sample is focused on the upper surface of a wafer 61 as a sample held on 60. The electron beam 55b is deflected by the main deflector 52 and the sub deflector 53, scans the wafer 61, and the resist film on the surface of the wafer 61 is exposed by the electron beam.
[0019]
Next, the 1st slit 42 which makes the principal part of this invention is demonstrated with reference to FIG.1, FIG.3, FIG.4 and FIG.
The first slit 42 is substantially the same as the first slit 10 in FIGS. 10 and 11 except for the structure of the stage 70, and corresponding portions are denoted by the same reference numerals. As shown in FIGS. 3A and 3B, the first slit 42 has a housing 11. A copper base 12 is fixed in the housing 11, and a motor 20 is attached to the outside of the housing 11. The inside of the housing 11 is vacuumed through the exhaust port 21.
[0020]
A stage 70 is supported on the base 12 via a bearing 13 so as to be rotatable with respect to the vertical shaft 15. A slit assembly 16 </ b> A is fixed on the stage 70. A worm gear mechanism 17 is provided for the stage 70. The worm gear mechanism 17 and the motor 20 constitute a stage rotation adjusting mechanism.
[0021]
As shown in FIGS. 4 and 5, the stage 70 is made of beryllium copper and has a cylindrical stage body 70a having a recess 70b on the upper surface and a through hole 70c in the center, and an annular shape on the upper side of the stage body 70a. It consists of a flange part 70d and an annular spring part 70e between the stage main body 70a and the flange part 70d. The spring portion 70e is composed of eight substantially S-shaped spring pieces 70f that are equally arranged in the circumferential direction. One end of each spring piece 70f is connected to the stage main body 70a, is arranged so as to draw an S-shape in the circumferential direction, and the other end is connected to the inner periphery of the flange portion 70d. The portion of each spring piece 70f connected to the stage main body 70a and the flange portion 70d is not bent, and protrudes in the diameter direction of the stage 70 from the stage main body 70a and the flange portion 70c. The spring portion 70d is formed by cutting out the inner peripheral portion of the flange portion having a thickness t1 of about 5 mm protruding from the stage main body 70a by electric discharge machining or the like, and leaving a portion corresponding to the spring piece 70Af.
[0022]
The bearing 13 is a ring screwed to a plurality of steel balls 71, an inner race 72 composed of a V groove 70g on the outer periphery of the stage main body 70a of the stage 70, a chamfered portion 12b of the hole 12a of the pedestal 12, and a lower surface of the pedestal 12. The outer race 74 includes a chamfered portion 73 a of 73.
[0023]
In the stage 70, the stage body 70 a passes through the hole 12 a of the pedestal 12 and is rotatably supported by the bearing 13. As shown in FIG. 4, the flange portion 70 d is pressed against the upper surface of the pedestal 12 by a screw 75 and fixed. And attached to the base 12.
[0024]
As shown in FIG. 6A, each spring piece 70f is elastically deformed so that the S-shape is extended, so that the stage main body 70a is positioned relative to the flange portion 70d as shown in FIG. 6B. Can be rotated within a range of several degrees in the clockwise direction (C direction). Further, as shown in FIG. 6C, each spring piece 70f is compressed and elastically deformed so that the S-shape becomes flat, whereby the stage main body 70a is deformed relative to the flange portion 70d. It can be rotated in the range of several degrees counterclockwise (CC direction) from the position shown in (B).
[0025]
Here, since each spring piece 70f bends uniformly, even if the stage main body 70a rotates, the position of the center O of the stage main body 70a does not change. Therefore, even if the stage main body 70a rotates, the radial force does not act on the bearing 13, so that it does not come into contact with each other, and the bearing 13 is not adversely affected. Further, the spring piece 70f which is elastically deformed is rotated by the spring force to return to the natural state shown in FIG. 6B to the rotated stage body 70a to return to the position shown in FIG. 6B. The dynamic return force F is acting.
[0026]
As will be described later, the spring portion 70e (eight spring pieces 70f) functions as a heat conduction path.
The worm wheel 18 is fixed to the lower end of the stage main body 70a. The worm 19 is supported on a bearing 76 fixed to the lower surface of the pedestal 12 and provided on the lower surface side of the pedestal 12. The worm 19 is engaged with the worm wheel 18. The worm 19 is rotated by a motor 20 outside the housing 11. The worm 19 and the worm wheel 18 constitute a worm gear mechanism 17.
[0027]
The slit assembly 16A is fitted into a recess 70b on the upper surface of the stage main body 70a and fixed by screwing. As shown in FIG. 5, the slit assembly 16 </ b> A is obtained by fixing four slit forming members 81 in a cross pattern on a Mo or W disk 80 having a central hole. 81 knife edge portions 81a are formed with slits 25 of about 200 μm square. Each slit forming member 81 is made of W, for example. The reason why the material of the slit forming member 81 is W is sufficient because the heat dissipation of the slit assembly 16A is improved as will be described later.
[0028]
The slit assembly 16A is covered with a cross-shaped cover 23A fixed to the pedestal 12. The cover 23A has a hole 22A in the center.
Next, the operation and characteristics of the first slit 42 configured as described above will be described.
The electron beam radiated from the electron gun passes through the hole 22A, and at the location of the slit assembly 16A, the surrounding portion is shielded by the knife edge portion 81a of the slit forming member 81, passes through the slit 25, and passes through the slit 25. The beam is shaped into a rectangular cross section. From the first slit 42, an electron beam whose cross section is shaped into a rectangle is emitted, and this electron beam is projected onto the wafer to draw an LSI circuit pattern.
[0029]
As in the conventional case, for example, before exposure, the motor 20 is appropriately driven, and the stage main body 70a (slit assembly 16A) of the stage 70 is rotated within a range of several degrees via the worm gear mechanism 17 to obtain a predetermined value. In other words, the side of the image of the first slit 42 and the side of the opening of the second slit 47 so as to cause a rotation error with the image of the first slit 42 on the second slit 47 having a cross-sectional shape. Fine adjustments are made so that the parallelism and perpendicularity with each other fall within a predetermined range. As shown in FIGS. 6A and 6B, the stage main body 70a of the stage 70 is rotated by elastically deforming the spring portion 70e (eight spring pieces 70f) in the thickness t1 direction.
[0030]
The portion around the electron beam radiated from the electron gun irradiates the portion of the slit forming member 81 facing the slit 25, whereby the slit forming member 81, particularly the knife edge portion 81 a of the slit forming member 81 is heated. As shown in FIG. 1, the heat of the slit forming member 81 is conducted in the order of the disk 80 → the stage 70 → the pedestal 12, spreads in the pedestal 12, and is radiated.
[0031]
Here, the heat conduction path from the stage 70 to the pedestal 12 will be considered. As for the heat conduction path, in addition to the existing heat conduction path 30 passing through the location of the bearing 13, a new heat conduction path 90 as a heat conduction path means is formed via the spring piece 70f and the flange portion 70d. Yes.
[0032]
Therefore, since the heat of the slit forming member 81 is released through the two heat conduction paths 30 and 90 in parallel, the heat conduction path is released better than the conventional heat conduction path 30 alone. .
Further, the new heat conduction path 90 is configured to pass through the spring piece 70f and the flange portion 70d, and the spring piece 70f has a plate shape instead of a linear shape, as shown in the aa cross section in FIG. In addition, since the height direction is the width, the width w corresponds to the thickness t1 of the flange portion 70d, and the cross-sectional area S is relatively large, the thermal resistance of the heat conduction path 90 is the same as that of the steel ball 71. It is much lower than the thermal resistance of the existing heat conduction path 30 including the contact portion with the inner race 72 and the outer race 74. Also by this, the heat of the slit forming member 81 is released more favorably than in the past.
[0033]
Since a new heat conduction path 90 is formed and the thermal resistance of the heat conduction path 90 is low, the maximum temperature of the slit forming member 81 can be kept lower than the maximum temperature in the conventional case, and thus the slit forming member. It is suppressed that the 81 knife edge part 81a causes physical damage, such as a defect | deletion. Since the physical damage of the knife edge portion 81a of the slit forming member 81 is suppressed, the circuit pattern drawing accuracy is maintained at a high level.
[0034]
Further, since the maximum temperature of the slit forming member 81 can be suppressed lower than that in the conventional case, when the slit forming member 81 is made of, for example, molybdenum, the current amount of the electron beam emitted by the electron gun 41 is increased as compared with the conventional case. Thus, the circuit pattern drawing speed can be increased as compared with the conventional case, and thus the throughput of the LSI can be increased.
[0035]
Further, ozone is allowed to flow through the column in order to eliminate dust in the column (not shown) of the electron beam exposure apparatus 40, but the temperature of the slit forming member 81 is kept lower than in the conventional case. The slit forming member 81 is not easily oxidized. Therefore, the drawing accuracy of the circuit pattern is not lowered, and the drawing accuracy of the circuit pattern is maintained at a high level.
[0036]
Further, in the first slit 42, when the stage main body 70a (slit assembly 16A) of the stage 70 is adjusted, the spring portion 70e is slightly deformed from the natural state shown in FIG. ) Or the state shown in FIG. 6C. In the state shown in FIG. 6 (A) or 6 (C), a rotational return force F that attempts to return to the position shown in FIG. 6 (B) acts on the stage main body 70a. The rotational restoring force F of the stage main body 70a brings the worm wheel 18 in one direction and absorbs the backlash that the worm gear mechanism 17 has, and the influence of the backlash appears as a slight positional fluctuation in the rotational direction of the stage 14. There is no such thing. Therefore, the slit image projected on the wafer is stable without being shaken in the rotation direction, and the circuit pattern drawing accuracy is maintained well.
[0037]
Next, a modified example of the stage 70, in particular, the spring portion 70e will be described.
FIG. 7 shows a stage 70A according to a first modification. The spring portion 70Ae of the annular portion between the main body 70Aa and the flange portion 70Ad has a configuration in which four substantially inverted L-shaped spring pieces 70Af are equally arranged in the circumferential direction. The spring portion 70Ae is formed by cutting out the inner peripheral portion of the flange portion by electric discharge machining or the like and leaving the portion corresponding to the spring piece 70Af.
[0038]
FIG. 8 shows a stage 70B according to a second modification. The spring portion 70Be of the annular portion between the main body 70Ba and the flange portion 70Bd has a configuration in which one spiral spring piece 70Af makes one round. The spring portion 70Be is formed by cutting out the inner peripheral side portion of the flange portion by electric discharge machining or the like and leaving the portion corresponding to the spring piece 70Bf.
[0039]
FIG. 9 shows a stage 70C according to a third modification. The annular spring portion 70Ce between the main body 70Ca and the flange portion 70Cd has a configuration in which eight zigzag spring pieces 70Cf are evenly arranged in the circumferential direction. The spring portion 70Ce is formed by cutting out the inner peripheral portion of the flange portion by electric discharge machining or the like and leaving the portion corresponding to the spring piece 70Cf.
[0040]
In each of the stages 70A, 70B, and 70C, the spring portions 70Ae, 70Be, and 70Ce function in the same manner as the spring portion 70e of the stage 70 described above.
[0041]
【The invention's effect】
As described above, according to the first aspect of the present invention, the heat conduction path means for enabling a slight rotation of the stage between the stage and the pedestal and for conducting the heat of the stage to escape to the pedestal. Therefore, it is possible to quickly release the heat of the slit assembly irradiated and heated from the electron beam source from the electron beam source to the pedestal, and thus the slit during the electron beam exposure operation. The temperature of the assembly can be kept lower than the temperature in the conventional case. Therefore, physical damage and oxidation of the slit assembly can be suppressed, and thus it is possible to prevent the drawing accuracy of the circuit pattern from being unnecessarily lowered.
[0042]
In addition, since the temperature rise of the slit assembly can be suppressed, the portion using the heat resistant material can be reduced, and the manufacturing cost of the electron beam exposure apparatus can be reduced accordingly.
In addition, when using a slit assembly made of a material with excellent heat resistance, the temperature rise of the slit assembly can be suppressed, so the amount of current of the electron beam emitted by the electron source can be increased, As a result, the drawing speed of the circuit pattern can be increased, and thus the throughput of the LSI can be increased.
[0043]
According to the invention of claim 2, the stage is elastically deformed between the stage main body and the flange portion so that the stage main body can be rotated within a range of a slight angle with respect to the flange portion, and the heat of the stage main body. Since the flange portion is fixed to the pedestal, the slit is heated by being irradiated with the portion around the electron beam from the electron beam source. The heat of the assembly can be quickly released to the pedestal through the spring portion, and the same effect as the effect of the invention of claim 1 is obtained.
[0044]
Further, since the spring portion is a part of the stage, it can be realized without adding any parts. According to the third and fourth aspects of the present invention, since each spring piece is bent evenly, the position of the center of the stage main body does not change even if the stage main body is rotated. It is possible to prevent the bearing from being adversely affected.
[0045]
According to the invention of claim 5 and claim 6, since each spring piece is plate-shaped, the cross-sectional area can be increased as compared with a general linear shape, and thus the resistance to heat conduction can be reduced, The heat of the slit assembly can be quickly released to the base through the spring portion.
[0046]
According to the invention of claim 7, since the electron beam exposure is performed in a state where the spring portion is elastically deformed, the stage body is subjected to a force to return to the original position, and the direction in which this force acts. Therefore, even when there is play such as backlash in the stage rotation adjustment mechanism, it is possible to prevent the stage main body from rattling, and thus it is possible to improve the drawing accuracy of the circuit pattern as compared with the conventional art.
[0047]
According to the invention of claim 8, it is possible to draw a circuit pattern with high accuracy and to draw at a higher speed.
[Brief description of the drawings]
FIG. 1 is an enlarged cross-sectional view around a stage along the line II in FIG.
FIG. 2 is a diagram showing a block exposure type electron beam exposure apparatus according to an embodiment of the present invention.
FIG. 3 is a view showing a first slit in FIG. 2;
4 is a perspective view of a stage portion in FIG. 3. FIG.
FIG. 5 is an exploded perspective view of a stage portion in FIG. 3;
FIG. 6 is a diagram illustrating rotation of a stage body.
FIG. 7 is a plan view of a first modification of the stage.
FIG. 8 is a plan view of a second modification of the stage.
FIG. 9 is a plan view of a third modification of the stage.
FIG. 10 is a diagram showing a conventional first slit.
FIG. 11 is an enlarged view showing the periphery of the stage in FIG. 10 (B).
[Explanation of symbols]
12 Pedestal 13 Bearing 16A Slit assembly 17 Worm gear mechanism 18 Worm wheel 19 Worm 25 Slit 30 Heat conduction path 40 Block exposure type electron beam exposure apparatus 41 Electron gun 42 First slit 47 Second slit 55 Electron beams 70, 70A, 70B, 70C Stage 70a, 70Aa, 70Ba, 70Ca Stage body 70d, 70Ad, 70Bd, 70Cd Flange 70e, 70Ae, 70Be, 70Ce Spring 70f, 70Af, 70Bf, 70Cf Spring piece 75 Screw 80 Disc 81 Slit forming member 90 Heat Conduction path

Claims (8)

In an electron beam exposure apparatus that projects an electron beam from an electron beam source onto a sample as an electron beam having a predetermined cross-sectional shape through a first slit,
The first slit is
A pedestal,
A stage rotatably supported by the pedestal via a bearing;
A stage rotation adjustment mechanism that rotates and adjusts the stage to correct a rotation error of the image of the first slit on the second slit having the predetermined cross-sectional shape;
A slit assembly that is fixed to the stage and that converts the electron beam from the electron beam source into an electron beam having the predetermined cross-sectional shape;
A heat conduction path means that exists between the stage and the pedestal, allows the stage to be turned by the stage turning adjustment mechanism, and conducts heat of the stage to escape to the pedestal; An electron beam exposure apparatus characterized by comprising: In an electron beam exposure apparatus that projects an electron beam from an electron beam source onto a sample as an electron beam having a predetermined cross-sectional shape through a first slit,
The first slit is
A pedestal,
A stage rotatably supported by the pedestal via a bearing;
A stage rotation adjustment mechanism that rotates and adjusts the stage to correct a rotation error of the image of the first slit on the second slit having the predetermined cross-sectional shape;
The slit assembly is fixed to the stage, and the electron beam from the electron beam source is an electron beam having a predetermined cross-sectional shape,
The stage exists between a stage main body to which the slit assembly is fixed, a flange portion outside the stage main body, and the stage main body and the flange portion. A structure that includes a spring part that is rotatable within a range of a small angle with respect to the flange part and that conducts heat of the stage body to the flange part, and the flange part is fixed to the pedestal. An electron beam exposure apparatus. The spring part is arranged in a circumferentially equal manner, and has one end connected to the stage main body and the other end connected to the flange part, and is composed of a plurality of curved spring pieces. The electron beam exposure apparatus according to claim 2. The said spring part is made into the structure which consists of a single helical spring piece which is making a round, has one end connected with the said stage main body, and the other end connected with the said flange part. 3. The electron beam exposure apparatus according to 2. 4. The electron beam exposure apparatus according to claim 3, wherein the curved spring piece has a plate shape. 5. The electron beam exposure apparatus according to claim 4, wherein the single helical spring piece has a plate shape. 3. The electron beam exposure apparatus according to claim 2, wherein the slit device is configured to perform electron beam exposure in a state where the spring portion is elastically deformed. An electron beam exposure method comprising exposing a sample using the electron beam exposure apparatus according to claim 1.

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