JP3687600B2 - Manufacturing method of film carrier tape for mounting electronic components - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is a method of manufacturing a film carrier tape for mounting electronic components such as CSP (Chip Size Package), BGA (Ball Grid Array), etc., and has a curl shape that is warp deformation that is deformation in the width direction and deformation in the longitudinal direction. The present invention relates to a method for efficiently producing a film carrier tape for mounting electronic components in which all deformations are uniformly reduced.
[0002]
TECHNICAL BACKGROUND OF THE INVENTION
A film carrier tape for mounting electronic components such as CSP and BGA generally forms a conductive metal layer made of a metal such as copper or aluminum on at least one surface of an insulating film made of a flexible insulating resin, The conductive metal layer is formed, for example, by exposing the conductive metal layer to a photoresist or the like developed in a desired pattern as a masking material to form a desired wiring pattern made of a conductive metal. The terminal portion of the wiring pattern thus formed needs to be exposed to be connected to a semiconductor chip or the like, but the other wiring pattern portion is often protected by applying a solder resist. Further, when forming a wiring pattern, a conductive metal foil such as a copper foil or an aluminum foil is disposed on the surface of the insulating film, and this conductive metal foil is etched to form a desired wiring pattern. The conductive metal foil is attached to the insulating film using a thermosetting adhesive.
[0003]
In such a film carrier tape for mounting electronic parts, the solder resist and the thermosetting adhesive have a property of shrinking with curing. Therefore, a film carrier tape for mounting electronic components in which such a thermosetting adhesive and a solder resist are applied to one surface of an insulating film has a surface coated with these (usually a surface on which a wiring pattern is formed). Warping deformation curved in the width direction with the inside facing.
[0004]
The warp deformation that occurs in the width direction of the film carrier tape for mounting electronic components can be corrected by various methods, for example, by applying a solder resist and curing, and then correcting it while applying reverse warp in the width direction under heating. It is known to be possible. Note that such warp deformation in the width direction tends to become larger as the insulating film becomes thinner and the finer pitch of the formed wiring pattern progresses as the electronic equipment becomes smaller and lighter.
[0005]
By the way, when a semiconductor chip (IC) or the like is mounted on the film carrier tape for mounting electronic parts as described above, about 5 to 10 semiconductor chips are cut in series to make the film carrier tape into a strip shape. It is often supplied to a chip mounting apparatus. In the film carrier tape cut into strips in this way, when the warp deformation in the width direction is corrected by applying reverse warp as described above, the stress changes the direction and the longitudinal direction of the film carrier tape cut into strips May develop as a curled deformation. If the strip-shaped film carrier tape is curled in the longitudinal direction in this way, not only will it adversely affect workability during transport, but it may also cause misalignment and damage of the semiconductor chip during mounting. There is.
[0006]
As a method for correcting the curl-like deformation that occurs in the longitudinal direction of the film carrier tape in this way, the present inventor has already filed a method for winding the film carrier tape on a reel and holding it under heating for a predetermined time (special feature). (See application 2001-250660). As described in this specification, the film carrier tape is preferably wound around a reel together with a flat spacer and held under heat to produce the film carrier tape in the longitudinal direction of the film carrier tape as viewed from the whole film carrier tape. Although the curled deformation is reduced, it has been found that the degree of correction of the curled deformation varies depending on the position of the film carrier tape. That is, on the reel core side, a large correction force is applied by the film carrier tape, and the curled deformation is well corrected, but the degree of correction of the curled deformation becomes small on the winding outer side.
[0007]
Therefore, when mounting electronic components on a film carrier cut out in a strip shape from a film carrier tape wound on the same reel, the curled deformation differs for each strip-shaped film carrier, Workability tends to be unstable.
[0008]
OBJECT OF THE INVENTION
The present invention is a method of manufacturing a film carrier tape for mounting electronic components that is used after being cut into strips, and is for mounting electronic components in which both warp deformation in the width direction and curl deformation in the longitudinal direction are corrected. The object is to provide a method for producing a film carrier tape.
[0009]
More specifically, the present invention relates to a method of manufacturing a film carrier tape for mounting electronic components that is used by cutting a film carrier tape wound around a reel into a strip shape, and includes warping deformation in the width direction and curling in the longitudinal direction. Film carrier tape for electronic component mounting, in which any deformation of the shape is corrected and the degree of correction of the deformation is uniform regardless of the position of the film carrier tape on the tape wound around the same reel It aims to provide a method of manufacturing.
[0010]
SUMMARY OF THE INVENTION
The manufacturing method of the film carrier tape for electronic component mounting of the present invention, Made of polyimide Manufacture of a film carrier tape for mounting electronic components, comprising a step of forming a wiring pattern made of a conductive metal on at least one surface of an insulating film, and a step of applying and curing a solder resist leaving a terminal portion of the wiring pattern In the method, after the step of applying and curing the solder resist, before the electronic component is mounted on the terminal portion exposed from the solder resist of the film carrier tape for electronic component mounting, the tape is formed in the width direction of the film carrier tape. After correcting the warping deformation caused by bending, the film carrier tape is placed so that the formed wiring pattern is located outside, wound around the first take-up reel and held under heating, As shown in FIG. The outer side of the film carrier tape wound around the first take-up reel is the winding core side. And arrange so that the wiring pattern on which the film carrier tape is formed is located outside. By rewinding to the second take-up reel and holding the film carrier tape wound around the second take-up reel under heating, The side where the wiring pattern is formed is curled inward in the longitudinal direction. It has a step of correcting a curled deformation caused by bending.
[0011]
By eliminating the warp deformation that occurs in the width direction of the film carrier tape as described above, the stress that caused the warp deformation in the width direction curls the end in the longitudinal direction of the film carrier tape toward the wiring pattern formation side. Causing curled deformation. In particular, in CSP and BGA, the film carrier tape is often cut into strips to mount electronic components. In such a case, if a curled deformation occurs near the end in the longitudinal direction of the film carrier tape, the electronic components are accurately It becomes difficult to be mounted on.
[0012]
After removing the warp deformation generated in the width direction of the film carrier tape by applying the reverse warp, the film carrier tape in which the curl-shaped deformation has occurred in the longitudinal direction is preferably removed through the first take-up reel via a flat spacer. By curling the film carrier tape together with the first take-up reel while heating, the curl-shaped deformation occurring in the film carrier tape on the core side of the first take-up reel is corrected, The degree of correction of curled deformation occurring in the film carrier tape is smaller than that of the film carrier tape on the winding core side.
[0013]
Therefore, in the present invention, the film carrier tape wound around the first take-up reel and held under heating as described above is re-wound to the second take-up reel, and the film carrier tape is transferred to the second take-up reel. And kept under heating for a predetermined time. When rewinding to the second take-up reel, the second take-up reel is re-wound so that the outer film carrier tape is positioned on the winding core side of the second take-up reel. Thus, the film carrier tape that has been wound around the second take-up reel in this way is held together with the second take-up reel under heating for a predetermined time, whereby a film carrier tape that is uniform throughout can be manufactured.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, the manufacturing method of the film carrier tape for electronic component mounting of this invention is demonstrated concretely.
In the method for manufacturing a film carrier tape for mounting electronic components according to the present invention, a wiring pattern is formed on one surface of a flexible insulating film.
[0015]
Since the insulating film that can be used in the present invention comes into contact with an acid or the like during etching, it has chemical resistance that is not affected by such chemicals and heat resistance that does not change even when heated during bonding. doing. This insulation film As this, a film made of polyimide is used. Such polyimide has excellent heat resistance and chemical resistance compared to other resins, and in these respects, it has superior properties that cannot be compared with other resins. ing.
[0016]
Examples of this polyimide resin include wholly aromatic polyimide synthesized from pyromellitic dianhydride and aromatic diamine, and wholly aromatic having biphenyl skeleton synthesized from biphenyltetracarboxylic dianhydride and aromatic diamine. Group polyimide can be mentioned. In particular, in the present invention, a wholly aromatic polyimide having a biphenyl skeleton (for example, trade name: Upilex S, manufactured by Ube Industries, Ltd.) is preferably used. The wholly aromatic polyimide having a biphenyl skeleton has a lower water absorption rate than other wholly aromatic polyimides. The thickness of the insulating film that can be used in the present invention is usually in the range of 25 to 125 μm, preferably 25 to 75 μm. In particular, in the present invention, the warp deformation in the width direction increases as the thickness of the insulating film decreases, and when the warp deformation is applied in the width direction of the film carrier tape in order to correct the warp deformation, the warp deformation in the width direction occurs. The stress that has formed the shape changes in the direction of curl in the longitudinal direction. Such a tendency becomes more prominent as the thickness of the insulating film becomes thinner, and it tends to be particularly noticeable when the thickness of the insulating film is 50 μm or less. Therefore, the method of the present invention is particularly useful when a thin polyimide film such as 25 to 50 μm is used as the insulating film.
[0017]
When manufacturing a film carrier tape for mounting an electronic component according to the method of the present invention, first, sprocket holes (perforations) are formed by punching on both edges of the insulating film as described above, and at the same time, if necessary, slits, Solder ball holes, via holes, positioning holes and the like can be formed by punching.
In the present invention, a conductive metal is adhered to at least one surface of the insulating film in which the necessary punched holes are formed as described above. Examples of the conductive metal used here include an aluminum foil and a copper foil. As such a conductive metal foil, a metal foil usually in the range of 3 to 35 μm, preferably 9 to 25 μm can be used. In particular, a conductive metal foil having a thickness of, for example, 25 μm or less, particularly recently 18 μm or less has been increasingly used, and as the thickness of the conductive metal foil becomes thinner as described above, for example. , Warpage deformation and curl deformation tend to increase.
[0018]
It is preferable to use a copper foil as the conductive metal foil used in the present invention. The copper foil usable here includes an electrolytic copper foil and a rolled copper foil. Considering it, it is preferable to use an electrolytic copper foil.
In addition, although the conductive metal foil that forms the wiring pattern is usually laminated on one surface of the insulating film, this conductive metal foil can also be laminated on the surface of the insulating film via an adhesive layer, It is also possible to laminate without using such an adhesive layer.
[0019]
Moreover, although the above has shown the aspect by which the adhesive bond layer is formed on the surface of an insulating film, the adhesive bond layer may be formed in one surface of electroconductive metal foil.
By laminating a conductive metal foil on one surface of the insulating film in this way, then applying a photoresist to the surface of the conductive metal foil, and exposing and developing the same pattern as the wiring pattern to be formed on this photoresist Then, the conductive metal foil is etched using the pattern formed by the photoresist as a masking material to form a desired wiring pattern.
[0020]
After the wiring pattern is formed in this way, the solder resist is applied while leaving the lead portion electrically connected to the electronic component, and the solder resist is cured by heating. This solder resist tends to cure and shrink when it is cured by heating.
After the solder resist is applied and cured in this way, the wiring pattern exposed from the solder resist is plated. For this plating process, gold plating, nickel gold plating, tin plating, etc. can be adopted, but in BGA and CSP, electronic components and gold wires are often used for electrical connection, so gold plating or nickel Gold plating is preferable. The thickness of such plating is usually 0.02 to 12 μm, preferably 0.02 to 3 μm.
[0021]
When the solder resist 16 is applied to the electronic component mounting film carrier tape 1 and then cured, as shown in FIG. 1, the electronic component mounting film carrier tape 1 is formed with a wiring pattern 14 for mounting the electronic components. The surface is deformed to be concave. As described above, the warp deformation in the width direction generated in the electronic component mounting film carrier tape 1 is such that the concavely deformed surface (surface on which the wiring pattern 14 is formed and the solder resist layer 16 is formed) becomes convex. That is, warping deformation generated in the width direction can be corrected by giving deformation to the film carrier tape 1 so that warping deformation occurs in a direction opposite to the generated warping. In FIG. 1, 10 is an insulating film, 12 is an adhesive layer, and 18 is a sprocket hole.
[0022]
More specifically, BGA and CSP will be described as examples. In such an electronic component mounting film carrier tape 1, for example, as shown in FIG. 2, an insulating film 10 having through holes such as via holes 19 is formed. A wiring pattern 14 is formed on the surface by etching the conductive metal foil attached via the adhesive layer 12. The wiring pattern 14 and the electronic component (chip) 35 are formed by connecting a bump electrode formed on the chip 35 and an end (lead) of the wiring pattern 14 with a conductor metal wire 36 such as a gold wire. The electronic component 35 can be mounted. The lead is a wiring pattern 14 extending outside the solder resist 16, and the surface thereof is plated for the purpose of ensuring appropriate bonding with the conductive metal wire 36 and protecting the surface of the conductive metal foil. A layer 37 is formed. A plating layer 37 is also formed on the surface of the wiring pattern 14 exposed in the via hole 19. The electronic component 35 can be mounted by electrically connecting the electronic component 35 and the lead (end portion of the wiring pattern 14) when mounting the electronic component 35 as described above by the conductive metal wire 36. it can. When such an electronic component is accurately mounted, the mountability on the jig and the transportability are very important. Therefore, the deformation of the electronic component mounting film carrier tape 1 needs to be corrected as much as possible before mounting the electronic component.
[0023]
The warp deformation generated in the width direction of the electronic component mounting film carrier tape 1 is, for example, by heating the film carrier tape in a reverse direction (giving reverse warp) to the generated warp deformation. Can be resolved. Furthermore, it can also be solved by giving the film carrier tape 1 a reverse warp using a barrel-shaped roller. Also, the warp caused in the width direction of the film carrier tape by passing the film carrier tape while meandering up and down while heating between a plurality of rollers arranged up and down without applying a reverse warp as described above. Deformation can be eliminated. Furthermore, immediately after the film carrier tape warped and deformed in the width direction is heated to a predetermined temperature, the warp deformation generated in the width direction of the film carrier tape is also eliminated by applying a reverse warp and rapidly cooling to near room temperature. It is possible.
[0024]
That is, in order to eliminate the warp deformation generated in the width direction of the film carrier tape for mounting electronic components, the film carrier tape is usually heated to about 80 to 200 ° C., preferably about 150 to 200 ° C., while being relatively short. It is necessary to apply stress that resists warping deformation in the width direction, such as time (usually within 5 minutes, preferably within 2 minutes), and reverse warping of the film carrier tape. By applying stress against the stress that caused warping deformation in the width direction under heating in this way, the direction in which the warping deformation stress in the width direction is expressed changes, and the warping deformation in the width direction is almost eliminated. The The correction of the deformation generated in the width direction of the film carrier tape mainly softens the adhesive and solder resist used to adhere the electrolytic copper foil to an insulating film such as polyimide during warping. It is thought that this is due to solidification in the state of reverse warping.
[0025]
However, when the warp deformation in the width direction is eliminated in this way, the stress that has formed the warp deformation changes its direction and acts in the longitudinal direction of the film carrier tape, as shown in FIG. The vicinity of the end in the longitudinal direction of the tape 1 is deformed so as to curl with the side on which the wiring pattern 14 of the film carrier 15 is formed inside. Such deformation that occurs in the vicinity of the end of the film carrier tape 1 in the longitudinal direction is called curl deformation. Such curled deformation tends to increase as the insulating film becomes thinner. In particular, in CSP, BGA, etc., the film carrier tape may be cut into strips of about 200 mm (in the embodiment of the present invention, an example of being cut into 190 mm) to mount electronic components. In addition, when curled deformation occurs in the vicinity of the end in the longitudinal direction of the film carrier tape cut into strips, it becomes difficult to place the strip-shaped film carrier tape on a jig for mounting electronic components. Or troubles in transportation, which hinders the mounting of electronic components.
[0026]
The curl-like deformation that occurs in the vicinity of the end of the film carrier tape in the longitudinal direction is particularly a problem when mounting electronic components in CSP, BGA, etc., where the film carrier tape is cut into strips to mount electronic components. become.
That is, the film carrier tape cut into strips as described above is fixed to a jig for mounting the electronic component, and the electronic component is mounted on the film carrier tape thus fixed, and the bump electrode formed on the electronic component. And the film carrier tape are placed so that they are in place and are electrically connected to each other. (1) If the film carrier tape is warped or curled, it is cut into strips. (2) When the film carrier tape cut into a strip shape is deformed in a curl shape in the longitudinal direction, it becomes difficult to accurately align the end of the strip tape. (3) When the tape with the electronic components mounted is removed from the bonding jig, the film carrier tape with the electronic components mounted is warped or deformed. When curled shape deformation such as may be subjected to bent or damaged, such as a metal wire that implement electronic component failure occurs.
[0027]
Therefore, in the present invention, first by correcting the warp deformation generated in the width direction of the film carrier tape by correcting the warp deformation generated in the width direction of the film carrier tape, For example, as shown in FIG. 4, the film carrier tape 1 is wound around the first take-up reel 22, heated for a predetermined time, and the film carrier tape 1 is wound around the first take-up reel 22 to eliminate the problem. At this time, the film carrier tape is arranged and wound around the first take-up reel 22 so that the surface on which the wiring pattern 14 of the film-like carrier 15 is formed is located outside. The film carrier tape 1 is preferably wound around a first take-up reel 22 via a flat spacer 20. Thus, by winding the film carrier tape 1 through the flat spacer 20, the wiring pattern 14 of the film carrier 15 formed on the surface of the insulating film 10, or more precisely, the solder resist 16 is wound repeatedly. Since there is no direct contact with the back surface of the insulating film 10 of the next round, the positional deviation of the insulating film 10 due to heat shrinkage does not directly affect the solder resist 16, and the uncured resin remaining in the solder resist 16 Thus, it is possible to prevent the solder resist 16 and the insulating film 10 in the next round from adhering to each other.
[0028]
The flat spacer 20 used here is preferably formed of a material having heat resistance that does not cause thermal deformation by heating to correct the curled deformation that may occur in the longitudinal direction. PET (polyethylene terephthalate) ), Flexible films formed from polyester resins such as PEN (polyethylene naphthalate), plastics (resins) such as polyimide and polyamide, and metal foils such as aluminum foil and copper foil. When such a flat spacer 20 is used, the thickness of the flat spacer is not particularly limited, but stable workability is ensured by using a flat spacer having a thickness of 25 to 125 μm, preferably 50 to 125 μm. Is done.
[0029]
In addition, the flat spacer used in the present invention only needs to have at least the width in which the wiring pattern is formed. Therefore, it is possible to form the same width as that of the insulating film, and to form a sprocket hole if necessary. It can also be used without forming a sprocket hole with a width substantially the same as the width of the metal foil.
In order to correct the curled deformation as described above, the film carrier tape for mounting an electronic component wound on the first take-up reel, preferably with a flat spacer as described above, is usually 160 ° C. or less, preferably Is heated to a temperature of 60 to 160 ° C., and is usually maintained for 30 minutes or more, preferably 1 to 20 hours, more preferably 1 to 10 hours. As described above, the first take-up reel is preferably wound together with the flat spacer 20 and kept under heating, so that the solder resist is mainly softened to some extent and the curled deformation is corrected.
[0030]
However, as described above, the film carrier tape, which is preferably wound around the first take-up reel 22 with a flat spacer and held under heating at a predetermined temperature, is closely examined for the degree of correction of curl deformation occurring in the longitudinal direction. As a result, it was found that the curl deformation of the film carrier tape was corrected relatively well on the core side of the first take-up reel 22, but the degree of correction of the curl deformation was reduced on the outside of the winding. .
[0031]
For example, as shown in FIG. 6, when a film carrier tape having a length of 50 meters, which has been warped and deformed, is wound around a first take-up reel and held under heating for a predetermined time, the curl shape that has occurred in the film carrier tape The deformation is almost corrected on the winding core side, but the degree of correction of the curled deformation decreases as the winding core moves from the winding side. That is, the curled deformation is almost completely corrected on the winding core side, but the correction degree of the curled deformation is reduced in proportion to the distance from the winding core (the curled deformation is increased), and the curled deformation is increased on the outer side of the winding core. It has been found that the effect of correcting the curled deformation is reduced by winding it on one take-up reel and holding it under heating.
[0032]
Therefore, in the present invention, the film carrier tape wound on the first take-up reel 22 and held under heating as described above is re-wound onto the second take-up reel 33 and heated as shown in FIG. Hold again. At this time, the film carrier tape 1 that has been on the outer side of the first take-up reel 22 is wound around the second take-up reel 33 so that it is on the core side of the second take-up reel 33. When the film carrier tape 1 is wound around the second take-up reel 33, it is preferably wound through a spacer. The spacer used here is a material having heat resistance to such an extent that the film carrier tape 1 is rewinded from the first take-up reel 22 to the second take-up reel 33 and then is not thermally deformed by heating to correct the curled deformation. It is preferably formed from polyester film such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), flexible film formed from plastic (resin) such as polyimide and polyamide, aluminum foil, A metal foil such as a copper foil can be mentioned. The spacer is not particularly limited as long as it can hold the rewinded film carrier tape 1, and in the present invention, it is preferable to use a flat spacer having a smooth surface. In addition, the spacer 30 used in the second take-up reel 33 is formed of a different material even if it is formed of the same material as the spacer 20 used in the first take-up reel. Also good. The thickness of the flat spacer 30 suitably used in the second take-up reel 33 is not particularly limited, but the thickness can be stabilized by using a flat spacer having a thickness of 25 to 125 μm, preferably 50 to 125 μm. Workability is ensured.
[0033]
Further, when the film carrier tape 1 unwound from the first take-up reel is taken up by the second take-up reel 33, the spacer wound together with the film carrier tape 1 in the first take-up reel is used as it is. Although the film carrier tape 1 can be wound around the second take-up reel, the flat spacer 20 unwound from the first take-up reel 22 is taken up onto the spacer take-up reel 24 as shown in FIG. At the same time, a new flat spacer 30 is unwound from the spacer take-up reel 34 to the second take-up reel 33, and is wound around the second take-up reel 33 together with the film carrier tape 1 unwound from the first take-up reel 22. It is preferable to rotate.
[0034]
When the film carrier tape 1 unwound from the first take-up reel 22 as described above is wound again around the second take-up reel 33, preferably with the flat spacer 30, the first take-up reel 22 will be outside the winding. The film carrier tape is wound on the winding side of the second winding reel 33 where the curl deformation correction force is large, and the winding side film on which the curl deformation is almost corrected on the first winding reel 22. The carrier tape is wound around the second take-up reel 33 so as to be positioned on the outer side where the curl-like deformation correcting force is small.
[0035]
The film carrier tape 1 thus wound around the second take-up reel 33 is usually at a temperature of 160 ° C. or lower, preferably 60 to 160 ° C., usually 30 minutes or more, preferably 1 to 20 hours. More preferably, hold for 1 to 10 hours.
By holding the film carrier tape wound on the second take-up reel 33 in this way for a predetermined time under heating, the degree of correction of curled deformation of the film carrier tape on the winding core side having a small radius increases, The one-winding reel 22 is on the outer side of the winding, and the curl-like deformation occurring in the film carrier tape, which is not necessarily sufficient for correcting the curl-like deformation, is corrected very well. On the other hand, on the outer side of the second take-up reel 33, the film carrier tape whose curl-shaped deformation has been sufficiently corrected by the first take-up reel 22 is located on the outer side of the second take-up reel 33. Although the curl-like deformation of the film carrier tape is corrected somewhat, it does not change so much. Therefore, the film carrier tape wound around the second take-up reel 33 and held under heating as described above is uniformly free from curled deformation as a whole.
[0036]
In addition, after eliminating the warp deformation generated in the width direction of the tape as described above, the tape is wound around the first take-up reel 22 and held for a predetermined time under heating, and then wound around the second take-up reel 33 and heated. The film carrier tape obtained by holding for a predetermined time below is corrected to the same extent as curl deformation as a whole, and warpage deformation is applied to the first take-up reel 22 and the second take-up reel as described above. It hardly changes depending on winding and heat treatment.
[0037]
In the present invention, the apparatus for correcting the curled deformation by holding the film carrier wound on the first take-up reel and the second take-up reel 33 as described above for a predetermined time under heating is the winding device. Any apparatus capable of heating the formed film carrier tape can be used without particular limitation.
After being held for a predetermined time while being heated to a predetermined temperature as described above, an electronic component is bonded to the film carrier tape according to a normal method. For example, an electronic component can be mounted by cutting into a strip shape of about 20 cm, placing the strip-shaped film carrier tape on a bonding jig, and bonding using a bonding tool.
[0038]
According to the present invention, it is possible to manufacture a film carrier tape for mounting electronic components with little deformation, and in particular, it improves transportability and reduces damage and displacement due to tape deformation and improves mountability of electronic components. be able to.
[0039]
【The invention's effect】
According to the method for manufacturing a film carrier tape for mounting an electronic component of the present invention, it is possible to eliminate both warp deformation in the width direction of the film carrier tape and curl deformation that occurs near the end in the longitudinal direction. In particular, according to the present invention, there is provided a film carrier tape for mounting electronic components that has high uniformity as a whole without causing the amount of curled deformation occurring in the longitudinal direction of the film carrier tape to vary depending on the position of the film carrier tape. Can be manufactured. Therefore, for example, when mounting electronic components by cutting into strips such as CSP, BGA, etc., the film carrier tape cut into strips can be transported without problems and when mounting electronic components. It can be easily mounted on a jig used for mounting, and electronic components can be mounted well.
[0040]
【Example】
EXAMPLES Next, although an Example is shown about this invention and this invention is demonstrated still in detail, this invention is not limited by these.
[0041]
[Example 1]
Necessary punching holes such as sprocket holes are formed at both edges in the width direction of a polyimide film having a length of 50 m, a width of 48 mm, and a thickness of 50 μm, and an electrolytic copper foil with a thickness of 25 μm is used between the sprocket holes with an adhesive. Stuck.
A photosensitive resin was applied onto the adhered electrolytic copper foil, and the photosensitive resin was exposed and developed to form a predetermined pattern. Next, using the pattern made of the photosensitive resin as a masking material, the electrolytic copper foil was etched to form a wiring pattern made of the electrolytic copper foil.
[0042]
Next, a solder resist was applied to the surface of the wiring pattern, except for the terminal portion, and it was wound around a reel together with an embossed spacer whose edge was embossed and cured.
After forming the solder resist layer in this way, a nickel gold plating layer having a thickness of 1 μm was formed on the surface of the wiring pattern exposed from the solder resist layer.
[0043]
The thus formed electronic component mounting film carrier tape was warped and curved in the width direction so that the surface on which the wiring pattern was formed became a recess in the width direction of the tape. The amount of warping at this time was about 18 mm or more. At this stage, the electronic component mounting film carrier tape was cut out to a length of 190 mm, but the curled deformation in the vicinity of the end of the strip-shaped electronic component mounting film carrier tape thus cut out was , Almost 0 mm, and almost no curl-like deformation occurs from the whole length.
[0044]
The film carrier tape for mounting electronic components manufactured as described above is inserted into the heating furnace heated to 190 to 200 ° C. so that the surface on which the wiring pattern is formed is curved in a convex shape. The film carrier tape for mounting electronic components wound on the unwinding reel was sent to the heating furnace using a heating furnace having a length of 3 m provided with a guide, and this was performed while applying a reverse warp to the heating furnace. After passing through a heating furnace, warping was performed and the film was wound on a take-up reel. By removing the warp in this way, the amount of warp in the width direction of the tape was reduced to 6.0 mm on average.
[0045]
After removing the warp in the width direction, the film carrier tape for mounting electronic components was cut out to 190 mm in the same manner as described above, and this strip-shaped film carrier tape was curled and deformed near both ends. The amount of curled deformation was 19 mm on average.
Next, this film carrier tape for mounting electronic parts was wound around an aluminum reel (first take-up reel) together with a flat spacer made of polyimide having a thickness of 75 μm. The first take-up reel was wound with a flat spacer so that the surface on which the wiring pattern of the electronic component mounting film carrier tape was formed was directed outward.
[0046]
The film carrier tape for mounting an electronic component wound around the first take-up reel was placed in an oven whose internal temperature was adjusted to 90 ° C. together with the first take-up reel and left for 10 hours.
For a film carrier tape for mounting electronic components prepared in the same manner as described above, a strip-like film carrier tape having a length of 190 mm was cut out every 10 m from the winding core side, and the amount of warp deformation and curl deformation was measured. As shown in FIG. As is apparent from FIG. 7, the curled deformation on the winding core side is corrected to about 2 mm, whereas the curled deformation amount on the winding outer side is about 9 mm or more, which is greater on the winding outer side than on the winding core side. It was found that the curled deformation was not corrected. In addition, the warp deformation generated in the film carrier tape hardly changed in this step.
[0047]
Subsequently, the electronic component mounting film carrier tape wound around the first take-up reel as described above and held under heating was unwound from the first take-up reel and re-wound to the second take-up reel.
At the time of rewinding to the second take-up reel, the flat spacer wound with the film carrier tape on the first take-up reel is taken up and collected on the spacer take-up reel, and also on the second take-up reel. A new flat spacer made of polyimide having a thickness of 75 μm was supplied from the spacer take-up reel and wound around the second take-up reel together with the new flat spacer.
[0048]
Then wind around this second take-up reel Change The obtained film carrier tape for mounting electronic parts was placed in an oven whose internal temperature was adjusted to 90 ° C. together with the second take-up reel and left for 10 hours. After heating for 10 hours as described above, the temperature of the second take-up reel and the film carrier tape wound thereon is returned to room temperature, and then the electronic component mounting film carrier tape is cut into a strip shape of 190 mm. For the strip-shaped film carrier tape collected at regular intervals from the winding core side to the winding outside, the amount of warpage in the width direction and the amount of curl deformation in the vicinity of the edge in the longitudinal direction of the strip-shaped film carrier tape were measured. The results are shown in FIG. As is clear from FIG. 8, the film carrier tape wound on the second take-up reel and held for a predetermined time under heating is substantially constant from the winding core side to the winding outer side, and the amount of curl change is an average. In addition to being reduced to about 2 mm, it was made uniform.
[0049]
As is clear from the above results, when the warp is removed to reduce the amount of warpage in the width direction, the amount of curl deformation in the vicinity of the end in the longitudinal direction increases. The mounting film carrier tape is wound on the first take-up reel and held under heating for a predetermined time, and then the winding outside of the first take-up reel is positioned on the core side of the second take-up reel. By rewinding to the second take-up reel and holding it again under heating for a predetermined time, the curl-like change that has occurred in the electronic component mounting film carrier tape is uniformly corrected as a whole, and a highly uniform film carrier Tapes can be manufactured. In addition, other characteristics such as warp deformation of the film carrier tape were not changed by processing to correct the curled deformation in this way.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a cross section of a film carrier tape for mounting electronic components manufactured by the method of the present invention.
FIG. 2 is a cross-sectional view schematically showing an example of mounting electronic components on a film carrier tape for mounting electronic components.
FIG. 3 is a diagram showing an example of a film carrier tape for mounting electronic components that has been cut into strips and has undergone curled deformation.
FIG. 4 is a view showing an example of a film carrier tape for mounting electronic components wound around a reel in order to take a curled deformation.
FIG. 5 is a diagram showing an example of a state of rewinding a film carrier tape for mounting electronic components when curling deformation is corrected by the method of the present invention.
FIG. 6 is a diagram showing an example of a correction state of curled deformation when a film carrier tape for mounting electronic components is wound around a reel and processed once under heating.
FIG. 7 is a view showing an example of a deformed state of the tape when the electronic component mounting film carrier tape is wound around the first take-up reel and heat-treated.
FIG. 8 is an example of a corrected state of deformation of a film carrier tape for mounting an electronic component that is wound around a first take-up reel and processed under heat, and then wound around a second take-up reel. FIG.
[Explanation of symbols]
1 ... Film carrier tape for mounting electronic components
10 ... Insulating film
12 ... Adhesive layer
14 ... Wiring pattern
15 ... Film carrier
16 ... Solder resist (layer)
18 ... Sprocket hole
19 ... Beer Hall
20 ... Flat spacer
22 ... First take-up reel
24 ... Spacer take-up reel
30 ... Flat spacer
33 ... 2nd take-up reel
34 ... Spacer reel
35 ... Electronic components
36 ... Conductive metal wire
37 ... Plating layer

Claims (5)

A film carrier for mounting electronic components, comprising: a step of forming a wiring pattern made of a conductive metal on at least one surface of an insulating film made of polyimide ; and a step of applying and curing a solder resist leaving a terminal portion of the wiring pattern In the tape manufacturing method, after the step of applying and curing the solder resist, before mounting the electronic component on the terminal portion exposed from the solder resist of the electronic component mounting film carrier tape, in the width direction of the film carrier tape After correcting the warp deformation caused by the tape being bent, the film carrier tape is placed so that the wiring pattern formed on the outside is positioned and wound around the first take-up reel and held under heating, Next, the outer side of the film carrier tape wound around the first take-up reel is on the winding core side. Ri, the film wiring pattern of the carrier tape are formed, instead around the arrangement to the second take-up reel so as to be positioned on the outer side, to hold the film carrier tape wound on the second take-up reel under heating Thus, a method of manufacturing a film carrier tape for mounting electronic components, comprising a step of correcting a curled deformation generated by curving so that a side on which a wiring pattern is formed is curled inward in a longitudinal direction . 2. The film carrier tape for mounting electronic components according to claim 1, wherein the warp deformation occurring in the width direction of the tape is corrected by heating while warping the tape in the direction opposite to the warp deformation. Method. After winding the electronic component mounting film carrier tape around the first take-up reel so that the surface on which the wiring pattern is formed is located outside, and holding the film carrier tape at a temperature of 160 ° C. or lower for 30 minutes or more The film carrier tape is rewinded to the second take-up reel so that the outer side of the film carrier is on the core side of the second take-up reel, and the film carrier tape is held at a temperature of 160 ° C. or lower for 30 minutes or longer. 2. The method of manufacturing a film carrier tape for mounting electronic parts according to claim 1, wherein the curled deformation caused by curving is corrected. 4. The method of manufacturing a film carrier tape for mounting electronic parts according to claim 1, wherein the film carrier tape for mounting electronic parts is wound around a reel together with a spacer and heated. 5. The method for producing a film carrier tape for mounting electronic components according to claim 4, wherein the spacer is a flat spacer.

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