JP3689529B2

JP3689529B2 - Manufacturing method of liquid crystal element

Info

Publication number: JP3689529B2
Application number: JP12124697A
Authority: JP
Inventors: 博之徳永; 優神尾; 晴夫友野; 雄二松尾
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 1996-05-14
Filing date: 1997-05-12
Publication date: 2005-08-31
Anticipated expiration: 2017-05-12
Also published as: JPH1051082A

Abstract

PROBLEM TO BE SOLVED: To fill resin equally and with good flatness between metallic wires by removing the squeeze-out of resin. SOLUTION: A wiring board 15 is manufactured by forming a band-shaped projection 10 around the position 5mm or more apart from the outermost metallic wiring, and pressing the UV hardening resin injected between a glass substrate 6 and a mold board thereby spreading the UV hardening resin 7, and then, hardening it. Hereby, the squeeze-out of the UV hardening resin 7 from the edge of the glass board 6 is suppressed by the band-shaped projection 10 at the time of pressing, whereby the shortage region of the UV hardening resin 7 on the glass board 6 vanishes, and the UV hardening resin 7 is filled equally and besides with good flatness between the metallic wires.

Description

【０００１】
【発明の属する技術分野】
本発明は、液晶素子の製造方法に関する。
【０００２】
【従来の技術】
ＴＮ（Twisted Nematic ）やＳＴＮ（Super Twisted Nematic ）型等の液晶素子では、従来より、ガラス基板上に形成される透明電極にはＩＴＯ（Indium TinOxide ）膜などが一般に用いられている。
【０００３】
上述した従来の透明電極（ＩＴＯ膜）は抵抗率が大きいため、最近のように表示面積の大型化、高精細化に伴って印加される電圧波形の遅延が問題になってきた。特に、強誘電性液晶を用いた液晶素子では基板ギャップがより狭いため、電圧波形の遅延が顕著であった。また、透明電極を厚く形成することも考えられるが、膜厚を厚くすると成膜に時間、コストがかかる、透明性が悪くなる等の問題点があった。
【０００４】
このような問題点を解決するために、膜厚の薄い透明電極に併設して低抵抗率の金属配線を形成する構成の配線基板が提案されている（例えば、特開平２−６３０１９号公報）。この公報に開示されている配線基板は、金属配線を透明な絶縁物で埋め込み、ＩＴＯ膜等の透明電極を形成したものである。尚、この公報においては、該絶縁物にスルーホールを設けることによって、金属配線と透明電極とを電気的に接続している。
【０００５】
上述したような構成の配線基板を作製する場合、金属配線間を埋めて平坦化する絶縁物として透明な樹脂を用いる構成の配線基板が提案されている（例えば、特開平６−３４７８１０号公報）。
【０００６】
このような低抵抗率の金属配線を、透明電極を形成する下地のガラス基板に形成して配線基板を作製する場合、従来、例えば図２３乃至図２５に示すような製造方法によって行われていた。
【０００７】
先ず、平滑な型基板１００の表面上に、ＵＶ（紫外線）硬化樹脂１０１を定量液化治具（図示省略）で所定量滴下する（図２３（ａ）参照）。次に、ＵＶ硬化樹脂１０１が滴下された型基板１００上に、予め１μｍ程度の膜厚の金属配線１０３が施されたガラス基板１０４を、金属配線１０３を型基板１００に向けてＵＶ硬化樹脂１０１を挟むように接触させる（図２３（ｂ），（ｃ）参照）。
【０００８】
次に、型基板１００とガラス基板１０４とでＵＶ硬化樹脂１０１を挟んだ一体物をプレス機１０５内に入れ、加圧して型基板１００とガラス基板１０４を密着させる（図２４（ａ），（ｂ）参照）。この時、後の工程でＩＴＯ膜等の透明電極と金属配線１０３が接触して導通性を保つようにするため、ＵＶ硬化樹脂１０１を金属配線１０３の表面上から除去するか、又は該表面の一部に極薄く樹脂が残る程度になるように、型基板１００とガラス基板１０４とを強く、しかも基板全面に均一に密着させる。
【０００９】
次に、このＵＶ硬化樹脂１０１を硬化させるために、型基板１００とガラス基板１０４の一体物をプレス機１０５内から取り出し、ガラス基板１０４側からＵＶ光１０６を照射してＵＶ硬化樹脂１０１を硬化させる（図２５（ａ）参照）。その際、基板周囲をマスクして、周囲のＵＶ硬化樹脂１０１が硬化しないようにしてもよい（未硬化の樹脂は、型基板１００の剥離後に洗浄除去する）。
【００１０】
次に、離型治具（図示省略）により型基板１００からガラス基板１０４とＵＶ硬化樹脂１０１の一体物を剥離して、金属配線１０３間にＵＶ硬化樹脂１０１が埋め込まれた配線基板１０７を得ていた（図２５（ｂ），（ｃ）参照）。
【００１１】
【発明が解決しようとする課題】
ところで、上述した従来の配線基板の製造方法では、ＵＶ硬化樹脂１０１が滴下されている型基板１００とガラス基板１０４を加圧する工程（図２４（ａ），（ｂ）参照）において、加圧により型基板１００とガラス基板１０４間の端からＵＶ硬化樹脂１０１の一部１０１ａがはみ出してしまう。
【００１２】
このように、ＵＶ硬化樹脂１０１が滴下されている型基板１００とガラス基板１０４を加圧して密着させる時に、ＵＶ硬化樹脂１０１の一部１０１ａがはみ出してしまうと、プレス機１０５で型基板１００とガラス基板１０４をさらに加圧しても、ＵＶ硬化樹脂１０１の延伸が生じなくなる。このため、型基板１００とガラス基板１０４間の一部にＵＶ硬化樹脂１０１が均一に到達しない領域が発生して平坦性が悪くなり、後の工程でＩＴＯ膜等の透明電極との密着不良が生じる問題点があった。
【００１３】
また、型基板１００とガラス基板１０４間の端からはみ出したＵＶ硬化樹脂１０１の一部１０１ａが、プレス機１０５に付着して汚染して再使用の際に汚れとなって、製造歩留まりの低下につながるという問題点もあった。
【００１４】
そこで、本発明は、金属配線間に充填する樹脂の均一性と平坦性の向上、及び樹脂のはみ出しによる汚れを防止して製造歩留まりの向上を図ることが液晶素子の製造方法を提供することを目的とする。
【００１５】
【課題を解決するための手段】
上記のような問題を解決するために、互いに対向するように配置された一対の基板と、該基板間に挟持した液晶と、少なくとも一方の前記基板に設けた透明電極と該透明電極の背面と電気的に接する配線パターンされた金属配線と、該金属配線間に設けられた樹脂とを有する液晶素子の製造方法において、前記一方の基板の表面に、前記金属配線の配線パターンを形成する工程と、前記樹脂を型基板と前記基板との間に注入して前記型基板と前記基板とを密着、加圧して、前記樹脂を前記金属配線間に充填して硬化する工程と、を有し、予め前記型基板上の、前記基板の最外部の前記金属配線から５ｍｍ以上離れた位置に対応して帯状の凸部を形成して、前記基板と前記型基板間に前記樹脂を注入して加圧し、前記帯状の凸部内で前記樹脂を前記金属配線間に平坦に充填することを特徴としている。
【００１６】
また、前記帯状の凸部を、前記基板の前記最外部の金属配線から５ｍｍ以上離れた位置に対応して前記型基板上の全周に有することを特徴としている。
【００１７】
また、前記帯状の凸部を、前記基板の前記最外部の金属配線から５ｍｍ以上離れた位置に対応して前記型基板で前記樹脂を一軸方向に加圧する方向と平行な該型基板上の両側に形成することを特徴としている。
【００１８】
また、互いに対向するように配置された一対の基板と、該基板間に挟持した液晶と、少なくとも一方の前記基板に設けた透明電極と該透明電極の背面と電気的に接する配線パターンされた金属配線と、該金属配線間に設けられた樹脂とを有する液晶素子の製造方法において、前記一方の基板の表面に、前記金属配線の配線パターンを形成する工程と、前記樹脂を型基板と前記基板との間に注入して前記基板と前記型基板の両面の端部側から、前記金属配線の長手方向に沿って前記基板と前記型基板とを加圧して、前記樹脂を前記金属配線間に充填して硬化する工程と、を有することを特徴としている。
【００１９】
また、前記加圧をロールプレス機を用いて行うことを特徴としている。
【００２３】
（作用）
プレス成型で金属配線間に充填した樹脂を平坦化しようとする時、平坦化に必要な樹脂の量を正確に供給することは極めて困難で、ほとんどの場合、型基板と基板との間に挟まれた余分な樹脂が基板の縁からはみ出して、樹脂が均一に到達しない領域が発生する。このため、本発明では、基板または型基板上の、配線パターンの最外部の金属配線から５ｍｍ以上離れた位置に帯状の凸部を設けて基板の縁から樹脂のはみ出しを防止することにより、樹脂を金属配線間に均一に、且つ平坦性よく充填することができる。
【００２４】
【発明の実施の形態】
以下、図面に基づいて本発明の実施の形態を説明する。
【００２５】
図１は、本発明の実施の形態に係る配線基板を備えた液晶素子の一例を示す概略断面図である。この液晶素子１は、偏光板２ａ，２ｂの間に対向して配置された一対の配線基板である電極基板３ａ，３ｂを備えており、電極基板３ａ，３ｂ間には強誘電性液晶等の液晶４が充填されている。液晶４が充填されている電極基板３ａ，３ｂ間には、この基板ギャップを保持するために球状のスペーサ５が配置されている。
【００２６】
電極基板３ａ，３ｂは、ガラス基板６ａ，６ｂと、ガラス基板６ａ，６ｂ上にＵＶ硬化樹脂からなる絶縁膜７ａ，７ｂ、及び低抵抗の金属、例えばCr、Al、Ag、Cu等からなる金属配線８ａ，８ｂと、金属配線８ａ，８ｂと電気的に接しているＩＴＯ膜からなる透明電極９ａ，９ｂとでそれぞれ構成されている。
【００２７】
透明電極９ａ，９ｂはストライプ状にそれぞれ形成され、互いに９０゜の角度で交差したマトリクス電極となっている。また、透明電極９ａ，９ｂ上には、配向膜１１ａ，１１ｂ等がそれぞれ形成されている。
【００２８】
上述した液晶素子１の電極基板３ａ，３ｂに適用される配線基板は、その製造工程において図２（ａ），（ｂ）に示すように、ガラス基板６上にストライプ状に配線パターンされた金属配線８が形成され、ガラス基板６の周縁の全周には金属配線８とほぼ同じ厚さの帯状の凸部１０が形成されている。尚、本実施の形態ではこの帯状の凸部１０は、液晶素子１を製造する際のスクライブ工程において切り落とされるので、帯状の凸部１０はこの液晶素子１には残らない。
【００２９】
帯状の凸部１０は、金属配線８と同一の材料を用いて同一プロセスで形成するのが好ましいが、レジスト等の物質で金属配線８と別個に形成してもよい。また、凸部１０の厚みは金属配線８と同程度か、ガラス基板６に歪みが生じない程度とし、凸部１０の幅は一般的には１〜２０ｍｍ程度、好ましくは３〜１５ｍｍ、最適には５〜１０ｍｍにする。尚、凸部１０の幅は２０ｍｍ以上とすることも可能ではあるが、ガラス基板６上でのスペースが大きくなり、１ｍｍ以下では充填されるＵＶ硬化樹脂（図示省略）の乗り越えによってはみ出しが生じる可能性が高くなる。また、凸部１０の一部に空気抜き用の隙間を形成してもよい。その際、かかる隙間は、凸部１０のうち、金属配線８と平行でない部分に設けるのが好ましい。
【００３０】
また、ＵＶ硬化樹脂の加圧方法が一定の方向性があるローラーを用いる場合には、ＵＶ硬化樹脂のはみ出しが加圧方向に平行な辺で生じ易く樹脂不足が発生するので、図３（ａ），（ｂ）に示すように、ＵＶ硬化樹脂（図示省略）の加圧方向（矢印Ａ方向）に平行なガラス基板６の両辺の周縁上のみに帯状の凸部１０ｃ，１０ｄをそれぞれ形成するのが好ましい。
【００３１】
また、図４（ａ），（ｂ）に示すように、上述したガラス基板６の周縁上に帯状の凸部１０を形成する代わりに、ＵＶ硬化樹脂（図示省略）を延伸するための型基板１２の周縁上の全周に帯状の凸部１０ｅを形成してもよい。また、図５に示すように、ＵＶ硬化樹脂（図示省略）の加圧方向（矢印Ａ方向）に平行な型基板１２の両辺の周縁上に帯状の凸部１０ｆ，１０ｇをそれぞれ形成してもよい。
尚、ガラス基板６と型基板１２のどちらに帯状の凸部を設ける場合においても、金属配線８の外側と凸部の間には、外にはみ出さずに余ったＵＶ硬化樹脂が溜めておけるようにある程度のスペースが必要で、一般には５ｍｍ以上、好ましくは８ｍｍ以上、最適には１０ｍｍ以上の間隔をパターン設計時に考慮しておくことが好ましい。
【００３２】
このように、ガラス基板６上に形成した帯状の凸部１０によってＵＶ硬化樹脂がガラス基板６の縁から外にはみ出すことが防止されることにより、ガラス基板６上でＵＶ硬化樹脂の不足領域が生じることはなく、金属配線８をＵＶ硬化樹脂で均一に、且つ平坦性よく埋め込むことができる。
【００３３】
次に、図１に示した本発明に係る液晶素子１の電極基板３ａ，３ｂに適用される配線基板の製造方法を図６乃至図９を参照して説明する。
【００３４】
先ず、ガラス基板６上に金属配線８と、金属配線８を囲むようにしてガラス基板６の周縁の全周に帯状の凸部１０を同一のプロセスで形成し、このガラス基板６の金属配線８側を型基板１２に向けて金属配線８間に滴下したＵＶ硬化樹脂７を挟むように接触させる（図６（ａ），（ｂ）参照）。
【００３５】
金属配線８と帯状の凸部１０は、例えばスパッタリング法でガラス基板６上に金属膜層を形成した後、フォトリソ法によりパターンニングして形成することができる。また、型基板１２としては金属、ガラス、セラミック、合成樹脂等を用いることができ、ＵＶ硬化樹脂７としてはエポキシ系、アクリル系等のＵＶ硬化樹脂を用いることができる。尚、ＵＶ硬化樹脂７は、ガラス基板６、あるいは型基板１２のどちらに滴下させてもよい。
【００３６】
次に、ＵＶ硬化樹脂７を挟んだガラス基板６と型基板１２をプレス機１３で上下から圧力を加え全面にわたって密着させる（図７参照）。尚、金属配線８の表面は、平坦化されたＵＶ硬化樹脂７から露出しているか、表面の一部に極薄く樹脂が残る程度である。その後、プレス機１３から取り外したガラス基板６と型基板１２に対し、型基板１２側からＵＶ光１４を照射してＵＶ硬化樹脂７を硬化させ、型基板１２を剥離することによって配線基板１５を作製する（図８、図９（ａ），（ｂ）参照）。
【００３７】
尚、ＵＶ光１４は型基板１２側から照射してもガラス基板６側から照射してもよく、また、両方から同時に照射してもよい。
【００３８】
そして、ＵＶ硬化樹脂７上に金属配線８と電気的に接するようにＩＴＯ膜からなる透明電極（図示省略）をスパッタ形成・パターニングすることにより、図１に示した電極基板３ａ，３ｂが得られる。
【００３９】
このように、本発明に係る配線基板１５では、製造時にプレス機１３による加圧により金属配線８間に押し広げられ平坦化されたＵＶ硬化樹脂７の先端側は、帯状の凸部１０と金属配線８の間の隙間に溜ることにより、ガラス基板６の縁からはみ出すことはない。
【００４０】
また、ＵＶ硬化樹脂７は帯状の凸部１０によりブロックされてガラス基板６の縁からはみ出すことがないので、ガラス基板６上でＵＶ硬化樹脂７の不足領域が生じることはなく、金属配線８間にＵＶ硬化樹脂７が均一に、且つ平坦性よく充填される。
【００４１】
更に、製造時にプレス機１３による加圧により延伸されたＵＶ硬化樹脂７は、帯状の凸部１０によってブロックされることにより、ガラス基板６の外にはみ出してプレス機１３等の治具を汚すことが防止されるので、プレス機１３等をそのまま再使用してもＵＶ硬化樹脂７の付着に起因する製造歩留まりの低下を防止することができる。
【００４２】
尚、上述した実施の形態では、ガラス基板６の帯状の凸部１０は、液晶素子１を製造する際のスクライブ工程で切り落とすが、図１０に示すように、ガラス基板６ａ，６ｂの周縁の全周あるいは向かい合った２辺に帯状の凸部１０ａ，１０ｂをそれぞれ残した液晶素子１ａを製造することも可能である。
【００４３】
【実施例】
次に、実施例を挙げて上述した配線基板の製造方法について具体的に説明する。
【００４４】
（実施例１）
図１１乃至図１５は、本発明の実施例１に係る配線基板の製造工程を模式的に示したものである。
【００４５】
本実施例では、厚さ１ｍｍ、１００ｍｍ×１００ｍｍのガラス基板２０上に、幅１０μｍで膜厚２μｍのCr（クロム）膜からなる金属配線２１を１００μｍピッチでストライプ状に形成すると同時に、この金属配線２１から１０ｍｍ離して、幅５ｍｍで膜厚２μｍの帯状の凸部２２をガラス基板２０の周縁の全周に形成した（図１１参照）。金属配線２１と帯状の凸部２２は、スパッタリング法でガラス基板２０上にCr薄膜層を形成した後、フォトリソ法によりパターンニングして形成した。
【００４６】
そして、このガラス基板２０にＵＶ照射オゾン処理を５分間行った後、シランカップリング剤（日本ユニカー（株）社製：Ａ−１７４）とエチルアルコールを１：４の比に混合したものをスピンコートし、１００℃で２０分熱処理を行い密着処理を施した。
【００４７】
次に、ガラス基板２０の金属配線２１上にディスペンサー２３を用いてアクリル系のＵＶ硬化樹脂（ペンタエリストールトリアクリレート：ネオペンチルグリコールジアクリレート：１−ヒドロキシシクロヘキシルフェニルケトン＝５０：５０：２）２４を４０ｍｇ滴下し、ガラス材からなる型基板２５で挟んで密着して、プレス機２６で加圧（２０kg /cm² の圧力）を３分間程度加えた（図１２（ａ），（ｂ），（ｃ）、図１３参照）。この時、延伸されるＵＶ硬化樹脂２４の先端側は、帯状の凸部２２によってブロックされた。
【００４８】
次に、プレス機２６からガラス基板２０と型基板２５の一体物を取り外し、型基板２５側からＵＶ光（中心波長３６５ｎｍ、紫外線強度２００ mJ ／cm² ）２７を照射し、ＵＶ硬化樹脂２４を硬化した（図１４参照）。
【００４９】
次に、離型装置（図示省略）を用いてガラス基板２０から型基板２５を離型し、イソプロパノール溶液中で超音波洗浄して未硬化のＵＶ硬化樹脂２４を除去することによって、配線基板２８を作製した（図１５（ａ），（ｂ）参照）。
【００５０】
このように本実施例では、帯状の凸部２２によってＵＶ硬化樹脂２４がガラス基板２０の縁から外にはみ出すことが防止されて、金属配線２１間をＵＶ硬化樹脂２４で均一に、且つ平坦性よく埋め込むことができた。
【００５１】
（比較例）
図１６（ａ），（ｂ）は、上述した実施例との比較用の製造工程を示したものである。
【００５２】
この比較例では、ガラス基板２０上に上述した実施例と同様のプロセスで金属配線２１を形成した。ガラス基板２０の周縁上には上述した帯状の凸部は形成していない。そして、上述した実施例と同様のシランカップリング処理を施した後、実施例１同様のＵＶ硬化樹脂２４を滴下して型基板（図示省略）で挟んで密着して、プレス機（図示省略）で加圧してＵＶ硬化樹脂２４を延伸し、ＵＶ光で硬化して配線基板２９を作製した。
【００５３】
このように、比較例の配線基板２９は、上述した実施例のようにガラス基板２０の周縁に帯状の凸部が形成されていないので、加圧時にＵＶ硬化樹脂２４の一部２４ａがガラス基板２０の外にはみ出すことにより、はみ出した部分に隣接した領域では樹脂不足が生じて、金属配線２１間に埋め込むＵＶ硬化樹脂２４の均一性と平坦性が低下した。
【００５４】
また、プレス機でＵＶ硬化樹脂２４を延伸する時に、ガラス基板２０の外にはみ出したＵＶ硬化樹脂２４でプレス機が汚染され、再使用の前にこの汚れを洗浄する必要があった。
【００５５】
（実施例２）
図１７乃至図１９は、本発明の実施例２に係る配線基板の製造工程を模式的に示したものである。
【００５６】
本実施例では、厚さ１ｍｍ、１００ｍｍ×１００ｍｍのガラス基板２０上に、実施例１と同様のプロセスで幅１０μｍで膜厚２μｍのCr（クロム）膜からなる金属配線２１を形成すると同時に、ガラス基板２０の両辺の周縁上にこの金属配線２１から１０ｍｍ離して、幅５ｍｍで膜厚２μｍの帯状の凸部２２ａ，２２ｂを形成した。帯状の凸部２２ａ，２２ｂは、ストライプ状に配線された金属配線２１の配線方向と平行なガラス基板１０の両側のみに形成した。
【００５７】
次に、実施例１と同様のシランカップリング処理を施した後、ガラス基板２０の金属配線２１上にディスペンサー（図示省略）を用いて実施例１同様のＵＶ硬化樹脂２４を滴下した。この時、ＵＶ硬化樹脂２４は、ストライプ状に配線された金属配線２１の一端側で、金属配線２１の配線方向（矢印Ａ方向）に対して垂直方向に分布するようにして滴下した（図１７（ａ），（ｂ）参照）。
【００５８】
次に、型基板２５をＵＶ硬化樹脂２４を滴下したガラス基板２０に張り合わせて、ロールプレス機２６ａにガラス基板２０のＵＶ硬化樹脂２４を滴下した端面側から挿入し（図１８（ａ），（ｂ）参照）、加圧（３kgw の圧力）しながらガラス基板２０と型基板２５の一体物を一定速度で矢印Ｂ方向（金属配線２１の長手方向）に送り、ＵＶ硬化樹脂２４をガラス基板２０全面に延伸し、ＵＶ光で硬化して配線基板３０を作製した（図１９（ａ），（ｂ）参照）。
【００５９】
このように本実施例においても、帯状の凸部２２ａ，２２ｂによってＵＶ硬化樹脂２４がガラス基板２０の外にはみ出すことが防止されて、金属配線２１間をＵＶ硬化樹脂２４で均一に、且つ平坦性よく埋め込むことができた。
【００６０】
また、本実施例のように、ＵＶ硬化樹脂２４の加圧を一定の方向性があるロールプレス機２６ａで行う場合には、ＵＶ硬化樹脂２４のはみ出しが加圧方向に平行な辺で生じ易く樹脂不足が発生するので、ＵＶ硬化樹脂２４の加圧方向（矢印Ａ方向）に平行なガラス基板２０の周縁上だけに帯状の凸部２２ａ，２２ｂを形成するだけでよい。
【００６１】
（実施例３）
本実施例では、厚さ１ｍｍ、１００ｍｍ×１００ｍｍのガラス基板上に、実施例１と同様のプロセスで幅１０μｍで膜厚２μｍのCr膜からなる金属配線を１００μｍピッチで形成すると同時に、この金属配線から８ｍｍ離して幅１０ｍｍで膜厚３μｍの帯状の凸部をガラス基板の周縁上（全周）に形成した。他の構成は実施例１と同様とした。
【００６２】
このように、実施例１に対して金属配線と帯状の凸部間の隙間の幅を変え、更に帯状の凸部の幅と膜厚を変えた場合でも、延伸されるＵＶ硬化樹脂は、帯状の凸部によってブロックされてガラス基板の外にはみ出すことはなく、金属配線間をＵＶ硬化樹脂で均一に、且つ平坦性よく埋め込むことができた。
【００６３】
（実施例４）
図２０乃至図２１は本発明の実施例４に係る配線基板の製造工程を模式的に示したものである。
【００６４】
本実施例では、厚さ１ｍｍ、１００ｍｍ×１００ｍｍのガラス基板２０上に、実施例１と同様のプロセスで幅１０μｍで膜厚２μｍのAl膜からなる金属配線２１を１００μｍピッチで形成し、一方、ガラスからなる型基板２５の周縁の全周に幅１０ｍｍで膜厚３μｍのAl膜からなる帯状の凸部２２ｃを形成して、このガラス基板２０上にＵＶ硬化樹脂２４を滴下して型基板２５を張り合わせた（図２０（ａ），（ｂ）参照）。
【００６５】
帯状の凸部２２ｃは、型基板２５をガラス基板２０に張り合せた時に金属配線２１との間には１０ｍｍ程度の隙間を有する位置に形成されている。そして、実施例１と同様に型基板２５とガラス基板２０の一体物ものをプレス機（図示省略）で加圧して、実施例１同様のＵＶ硬化樹脂２４をガラス基板２０全面に延伸し、型基板２５側からＵＶ光を照射することにより硬化して配線基板３１を作製した（図２１（ａ），（ｂ）参照）。
【００６６】
このように、型基板２５側に帯状の凸部２２ｃを形成した場合でも、延伸されるＵＶ硬化樹脂２４は、帯状の凸部２２ｃによってブロックされてガラス基板２０の縁から外にはみ出すことはなく、金属配線２１間をＵＶ硬化樹脂２４で均一に、且つ平坦性よく埋め込むことができた。
【００６７】
（実施例５）
本実施例では、図２２に示すように厚さ１ｍｍ、１００ｍｍ×１００ｍｍのガラス基板２０上に、実施例１と同様のプロセスで幅１０μｍで膜厚２μｍのAl膜からなる金属配線２１を１００μｍピッチで形成し、一方、ステンレス製からなる型基板２５の周縁の全周に幅１０ｍｍで厚さ３μｍの帯状の凸部２５ａを切削法によって一体に形成し、このガラス基板２０上に実施例１同様のＵＶ硬化樹脂２４を滴下して型基板２５を張り合せた。
【００６８】
帯状の凸部２５ａは、型基板２５をガラス基板２０に張り合せた時に金属配線２１との間には１０ｍｍ程度の隙間を有する位置に形成されている。そして、実施例１と同様に型基板２５とガラス基板２０の一体物ものをプレス機で加圧して、ＵＶ硬化樹脂２４をガラス基板２０全面に延伸し、ガラス基板２０側からＵＶ光を照射することにより硬化して配線基板を作製した。
【００６９】
このように、型基板２５側に帯状の凸部２５ａを一体に形成した場合でも、延伸されるＵＶ硬化樹脂２４は、帯状の凸部２５ａによってブロックされてガラス基板２０の縁から外にはみ出すことはなく、金属配線２１間をＵＶ硬化樹脂２４で均一に、且つ平坦性よく埋め込むことができた。
【００７０】
【発明の効果】
以上説明したように、本発明によれば、基板上の最外部の金属配線から５ｍｍ以上離れた位置に有する帯状の凸部により、金属配線間に充填される樹脂が基板の縁から外にはみ出すのが防止されて、金属配線間に樹脂が均一に、且つ平坦性よく充填された配線基板を提供することができる。
【００７１】
また、本発明に係る配線基板の製造方法によれば、基板上または型基板上の最外部の金属配線から５ｍｍ以上離れた位置に形成した帯状の凸部により、加圧されて延伸される樹脂が基板の縁から外にはみ出すことなく基板全体に一様に広がり、金属配線間に樹脂を均一に、且つ平坦性よく充填することができる。更に、延伸される樹脂が基板の縁から外にはみ出すことが防止されるので、加圧時にプレス機等の治具が樹脂によって汚れることがなくなり、製造歩留まりの向上を図ることができる。
【００７２】
また、本発明に係る配線基板を備えた液晶素子及びその製造方法によれば、その製造工程において、基板上または型基板上の最外部の金属配線から５ｍｍ以上離れた位置に形成した帯状の凸部により、金属配線間に充填される樹脂が基板の縁から外にはみ出すのが防止されて、基板上の金属配線間に樹脂が均一に、且つ平坦性よく充填される。更に、ＵＶ硬化樹脂が平坦性よく充填されることにより、透明電極との密着性もよくなる。
【図面の簡単な説明】
【図１】本発明に係る配線基板を備えた液晶素子を示す概略断面図。
【図２】（ａ）は本発明の実施の形態に係る配線基板にＵＶ硬化樹脂を充填する前の状態を示す平面図、（ｂ）はそのＩ−Ｉ線断面図。
【図３】（ａ）は本発明の他の実施の形態に係る配線基板にＵＶ硬化樹脂を充填する前の状態を示す平面図、（ｂ）はそのII−II線断面図。
【図４】（ａ）は本発明の実施の形態に係る配線基板と型基板間にＵＶ硬化樹脂を充填する前の状態を示す平面図、（ｂ）は型基板を示す平面図。
【図５】本発明の他の実施の形態に係る配線基板の型基板を示す平面図。
【図６】（ａ）は本発明の実施の形態に係る配線基板と型基板間にＵＶ硬化樹脂を滴下した状態を示す概略断面図、（ｂ）は配線基板と型基板を密着した状態を示す概略断面図。
【図７】ＵＶ硬化樹脂をプレス機で加圧している状態を示す概略断面図。
【図８】ＵＶ硬化樹脂にＵＶ光を照射している状態を示す概略断面図。
【図９】（ａ）は作製された配線基板を示す平面図、（ｂ）はそのIII −III 線断面図。
【図１０】本発明の実施の形態の変形例に係る配線基板を備えた液晶素子を示す概略断面図。
【図１１】本発明の実施例１に係る配線基板にＵＶ硬化樹脂を充填する前の状態を示す概略断面図。
【図１２】（ａ）はＵＶ硬化樹脂を金属配線間に滴下した状態を示す概略断面図、（ｂ）は型基板でＵＶ硬化樹脂を挟む前の状態を示す概略断面図、（ｃ）は配線基板と型基板を密着した状態を示す概略断面図。
【図１３】ＵＶ硬化樹脂をプレス機で加圧している状態を示す概略断面図。
【図１４】ＵＶ硬化樹脂にＵＶ光を照射している状態を示す概略断面図。
【図１５】（ａ）は作製された配線基板を示す平面図、（ｂ）はそのIV−IV線断面図。
【図１６】（ａ）は比較例に係る配線基板にＵＶ硬化樹脂を充填する前の状態を示す概略断面図、（ｂ）は比較例に係る配線基板を示す概略断面図。
【図１７】（ａ）は本発明の実施例２に係る配線基板にＵＶ硬化樹脂を滴下した状態を示す平面図、（ｂ）はそのＶ−Ｖ線断面図。
【図１８】（ａ）は本発明の実施例３に係る配線基板に滴下したＵＶ硬化樹脂を型基板で挟む前の状態を示す概略断面図、（ｂ）はＵＶ硬化樹脂をロールプレス機で加圧している状態を示す概略断面図。
【図１９】（ａ）は作製された配線基板を示す平面図、（ｂ）はそのVI−VI線断面図。
【図２０】（ａ）は本発明の実施例４に係る型基板と配線基板間にＵＶ硬化樹脂を滴下した状態を示す概略断面図、（ｂ）は、配線基板と型基板を密着して加圧した状態を示す概略断面図。
【図２１】（ａ）は作製された配線基板を示す平面図、（ｂ）はそのVII −VII 線断面図。
【図２２】本発明の実施例５に係る型基板と配線基板間にＵＶ硬化樹脂を滴下した状態を示す概略断面図。
【図２３】（ａ）は従来例に係る配線基板の製造方法において、型基板上にＵＶ硬化樹脂を滴下した状態を示す概略断面図、（ｂ）は配線基板にＵＶ硬化樹脂を密着させる前の状態を示す概略断面図、（ｃ）は配線基板と型基板を密着した状態を示す概略断面図。
【図２４】（ａ）は従来例に係る配線基板の製造方法において、ＵＶ硬化樹脂をプレス機で加圧する前の状態を示す概略断面図、（ｂ）はＵＶ硬化樹脂をプレス機で加圧している状態を示す概略断面図。
【図２５】（ａ）は従来例に係る配線基板の製造方法において、ＵＶ硬化樹脂にＵＶ光を照射している状態を示す概略断面図、（ｂ）は型基板を剥離している状態を示す概略断面図、（ｃ）は作製された配線基板を示す概略断面図。
【符号の説明】
１、１ａ液晶素子
３ａ，３ｂ電極基板
４液晶
６、６ａ，６ｂ、２０ガラス基板（基板）
７、７ａ，７ｂ、２４ＵＶ硬化樹脂（樹脂）
８、８ａ，８ｂ、２１金属配線
９ａ，９ｂ透明電極
１０、１０ａ〜１０ｇ、２２、２２ａ〜２２ｃ、２５ａ帯状の凸部
１２、２５型基板
１３、２６プレス機
２６ａロールプレス機
１４、２７ＵＶ光
１５、２８、２９、３０、３１配線基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a liquid crystal element.
[0002]
[Prior art]
In a liquid crystal element such as a TN (Twisted Nematic) or STN (Super Twisted Nematic) type, an ITO (Indium Tin Oxide) film or the like is generally used as a transparent electrode formed on a glass substrate.
[0003]
Since the above-described conventional transparent electrode (ITO film) has a high resistivity, the delay of the voltage waveform to be applied has become a problem as the display area becomes larger and the definition becomes higher as recently. In particular, in the liquid crystal element using ferroelectric liquid crystal, the delay of the voltage waveform is remarkable because the substrate gap is narrower. Although it is conceivable to form a thick transparent electrode, there are problems such as a thick film having a long time and cost, and poor transparency.
[0004]
In order to solve such a problem, a wiring board having a structure in which a low-resistivity metal wiring is formed in parallel with a thin transparent electrode has been proposed (for example, JP-A-2-63019). . The wiring board disclosed in this publication is formed by embedding metal wiring with a transparent insulator to form a transparent electrode such as an ITO film. In this publication, the metal wiring and the transparent electrode are electrically connected by providing a through hole in the insulator.
[0005]
In the case of manufacturing a wiring board having the above-described structure, a wiring board having a structure in which a transparent resin is used as an insulator for filling and flattening between metal wirings has been proposed (for example, JP-A-6-347810). .
[0006]
When a wiring substrate is manufactured by forming such a low resistivity metal wiring on an underlying glass substrate on which a transparent electrode is to be formed, conventionally, for example, a manufacturing method as shown in FIGS. .
[0007]
First, a predetermined amount of UV (ultraviolet) cured resin 101 is dropped on the surface of a smooth mold substrate 100 with a quantitative liquefaction jig (not shown) (see FIG. 23A). Next, on the mold substrate 100 onto which the UV curable resin 101 has been dropped, the glass substrate 104 on which the metal wiring 103 having a thickness of about 1 μm has been applied in advance is placed with the metal wiring 103 facing the mold substrate 100, and the UV curable resin 101. In contact with each other (see FIGS. 23B and 23C).
[0008]
Next, an integrated product in which the UV curable resin 101 is sandwiched between the mold substrate 100 and the glass substrate 104 is placed in a press machine 105 and pressed to bring the mold substrate 100 and the glass substrate 104 into close contact (FIG. 24A, ( b)). At this time, the UV curable resin 101 is removed from the surface of the metal wiring 103 or the surface of the metal wiring 103 is removed so that the transparent electrode such as the ITO film and the metal wiring 103 are kept in contact with each other in a later step. The mold substrate 100 and the glass substrate 104 are strongly and evenly adhered to the entire surface of the substrate so that the resin remains extremely thin in part.
[0009]
Next, in order to cure the UV curable resin 101, the integrated body of the mold substrate 100 and the glass substrate 104 is taken out from the press machine 105, and the UV light 106 is irradiated from the glass substrate 104 side to cure the UV curable resin 101. (See FIG. 25A). At that time, the periphery of the substrate may be masked so that the surrounding UV curable resin 101 is not cured (uncured resin is removed by washing after the mold substrate 100 is peeled off).
[0010]
Next, the integrated substrate of the glass substrate 104 and the UV curable resin 101 is peeled off from the mold substrate 100 by a mold release tool (not shown) to obtain a wiring substrate 107 in which the UV curable resin 101 is embedded between the metal wirings 103. (See FIGS. 25B and 25C).
[0011]
[Problems to be solved by the invention]
By the way, in the conventional method for manufacturing a wiring board described above, in the step of pressurizing the mold substrate 100 and the glass substrate 104 onto which the UV curable resin 101 is dropped (see FIGS. 24A and 24B), the pressurization is performed. A part 101 a of the UV curable resin 101 protrudes from the end between the mold substrate 100 and the glass substrate 104.
[0012]
Thus, when part 101a of the UV curable resin 101 protrudes when the mold substrate 100 onto which the UV curable resin 101 is dropped and the glass substrate 104 are brought into close contact with each other, the press machine 105 Even if the glass substrate 104 is further pressurized, the UV curable resin 101 does not stretch. For this reason, a region where the UV curable resin 101 does not reach uniformly is generated in a part between the mold substrate 100 and the glass substrate 104, resulting in poor flatness, and inadequate adhesion with a transparent electrode such as an ITO film in a later step. There was a problem that occurred.
[0013]
Further, a part 101a of the UV curable resin 101 protruding from the end between the mold substrate 100 and the glass substrate 104 adheres to the press machine 105 and becomes contaminated and becomes dirty when reused, resulting in a decrease in manufacturing yield. There was also the problem of being connected.
[0014]
Accordingly, the present invention provides a method for manufacturing a liquid crystal device, which improves the uniformity and flatness of a resin filled between metal wirings and prevents the contamination due to the protrusion of the resin to improve the manufacturing yield. Objective.
[0015]
[Means for Solving the Problems]
To solve the above problems, A pair of substrates disposed so as to face each other; a liquid crystal sandwiched between the substrates; a transparent electrode provided on at least one of the substrates; and a wiring pattern of metal wiring that is in electrical contact with the back surface of the transparent electrode; In the method of manufacturing a liquid crystal element having a resin provided between the metal wirings, a step of forming a wiring pattern of the metal wirings on the surface of the one substrate, and the resin between the mold substrate and the substrate Injecting the mold substrate and the substrate so that the mold substrate and the substrate are in close contact with each other and pressurizing, and filling and curing the resin between the metal wirings. A band-shaped convex part is formed corresponding to a position 5 mm or more away from the external metal wiring, the resin is injected between the substrate and the mold substrate, and the resin is injected into the band-shaped convex part. Fill between the metal wiring flatly It is characterized by that.
[0016]
Also, The strip-shaped convex portion is provided on the entire circumference on the mold substrate corresponding to a position separated by 5 mm or more from the outermost metal wiring of the substrate. It is characterized by that.
[0017]
Also, The band-shaped convex portions are formed on both sides of the mold substrate parallel to the direction in which the resin is uniaxially pressed with the mold substrate corresponding to a position at least 5 mm away from the outermost metal wiring of the substrate. Do It is characterized by that.
[0018]
Also, A pair of substrates disposed so as to face each other; a liquid crystal sandwiched between the substrates; a transparent electrode provided on at least one of the substrates; and a wiring pattern of metal wiring that is in electrical contact with the back surface of the transparent electrode; In the method of manufacturing a liquid crystal element having a resin provided between the metal wirings, a step of forming a wiring pattern of the metal wirings on the surface of the one substrate, and the resin between the mold substrate and the substrate The resin is filled between the metal wirings by injecting them and pressurizing the substrate and the mold substrate along the longitudinal direction of the metal wiring from the end sides of both surfaces of the substrate and the mold substrate. And curing step It is characterized by that.
[0019]
Also, The pressurization is performed using a roll press. It is characterized by that.
[0023]
(Function)
When trying to flatten the resin filled between metal wiring by press molding, it is extremely difficult to accurately supply the amount of resin necessary for flattening, and in most cases, it is sandwiched between the mold substrate and the substrate. The excess resin protrudes from the edge of the substrate, and a region where the resin does not reach uniformly occurs. For this reason, in the present invention, by providing a belt-like convex portion at a position 5 mm or more away from the outermost metal wiring of the wiring pattern on the substrate or the mold substrate, the resin is prevented from protruding from the edge of the substrate. Can be filled uniformly between metal wirings with good flatness.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0025]
FIG. 1 is a schematic cross-sectional view showing an example of a liquid crystal element provided with a wiring board according to an embodiment of the present invention. The liquid crystal element 1 includes electrode substrates 3a and 3b, which are a pair of wiring substrates disposed opposite to each other between polarizing plates 2a and 2b, and a ferroelectric liquid crystal or the like is provided between the electrode substrates 3a and 3b. Liquid crystal 4 is filled. A spherical spacer 5 is disposed between the electrode substrates 3a and 3b filled with the liquid crystal 4 in order to maintain this substrate gap.
[0026]
The electrode substrates 3a and 3b are made of glass substrates 6a and 6b, insulating films 7a and 7b made of UV curable resin on the glass substrates 6a and 6b, and metals made of low resistance metals such as Cr, Al, Ag, and Cu. Wirings 8a and 8b and transparent electrodes 9a and 9b made of an ITO film that are in electrical contact with the metal wirings 8a and 8b are respectively configured.
[0027]
The transparent electrodes 9a and 9b are formed in a stripe shape, and are matrix electrodes that intersect each other at an angle of 90 °. In addition, alignment films 11a and 11b are formed on the transparent electrodes 9a and 9b, respectively.
[0028]
The wiring substrate applied to the electrode substrates 3a and 3b of the liquid crystal element 1 described above is a metal whose wiring pattern is formed in a stripe pattern on the glass substrate 6 as shown in FIGS. 2A and 2B in the manufacturing process. Wiring 8 is formed, and a belt-like convex portion 10 having substantially the same thickness as the metal wiring 8 is formed on the entire periphery of the peripheral edge of the glass substrate 6. In the present embodiment, the strip-shaped convex portion 10 is cut off in a scribing process when manufacturing the liquid crystal element 1, and thus the strip-shaped convex portion 10 does not remain on the liquid crystal element 1.
[0029]
The belt-like convex portion 10 is preferably formed by the same process using the same material as the metal wiring 8, but may be formed separately from the metal wiring 8 by a substance such as a resist. The thickness of the convex portion 10 is about the same as that of the metal wiring 8 or the glass substrate 6 is not distorted. The width of the convex portion 10 is generally about 1 to 20 mm, preferably 3 to 15 mm, optimally. Is 5 to 10 mm. In addition, although the width of the convex part 10 can be 20 mm or more, the space on the glass substrate 6 becomes large, and if it is 1 mm or less, protrusion may occur due to overcoming of the UV curable resin (not shown) to be filled. Increases nature. Further, an air vent gap may be formed in a part of the convex portion 10. At this time, such a gap is preferably provided in a portion of the convex portion 10 that is not parallel to the metal wiring 8.
[0030]
Further, in the case where a roller having a certain directionality is used as the method for pressurizing the UV curable resin, the UV curable resin is likely to protrude from the side parallel to the pressurizing direction, resulting in insufficient resin. ), (B), band-shaped convex portions 10c, 10d are formed only on the peripheral edges of both sides of the glass substrate 6 parallel to the pressurizing direction (arrow A direction) of UV curable resin (not shown), respectively. Is preferred.
[0031]
Also, as shown in FIGS. 4A and 4B, a mold substrate for extending a UV curable resin (not shown) instead of forming the belt-like convex portion 10 on the periphery of the glass substrate 6 described above. You may form the strip | belt-shaped convex part 10e in the perimeter on 12 periphery. Moreover, as shown in FIG. 5, even if the belt-like convex portions 10f and 10g are respectively formed on the peripheral edges of both sides of the mold substrate 12 parallel to the pressurizing direction (arrow A direction) of the UV curable resin (not shown). Good.
In either case where the belt-like convex portions are provided on either the glass substrate 6 or the mold substrate 12, the remaining UV curable resin can be accumulated between the outer side and the convex portion of the metal wiring 8 without protruding outside. Thus, a certain amount of space is required, and it is generally preferable to consider an interval of 5 mm or more, preferably 8 mm or more, and optimally 10 mm or more when designing a pattern.
[0032]
As described above, the band-shaped convex portion 10 formed on the glass substrate 6 prevents the UV curable resin from protruding from the edge of the glass substrate 6, so that an insufficient region of the UV curable resin is formed on the glass substrate 6. It does not occur, and the metal wiring 8 can be embedded with UV curable resin uniformly and with good flatness.
[0033]
Next, a method of manufacturing a wiring board applied to the electrode substrates 3a and 3b of the liquid crystal element 1 according to the present invention shown in FIG. 1 will be described with reference to FIGS.
[0034]
First, the metal wiring 8 is formed on the glass substrate 6 and the belt-like convex portion 10 is formed on the entire periphery of the glass substrate 6 so as to surround the metal wiring 8 by the same process. The UV curable resin 7 dropped between the metal wirings 8 is brought into contact with the mold substrate 12 so as to be sandwiched therebetween (see FIGS. 6A and 6B).
[0035]
The metal wiring 8 and the strip-shaped convex portion 10 can be formed by forming a metal film layer on the glass substrate 6 by sputtering, for example, and then patterning by photolithography. The mold substrate 12 may be made of metal, glass, ceramic, synthetic resin, or the like, and the UV curable resin 7 may be an epoxy or acrylic UV curable resin. The UV curable resin 7 may be dropped on either the glass substrate 6 or the mold substrate 12.
[0036]
Next, the glass substrate 6 and the mold substrate 12 sandwiching the UV curable resin 7 are brought into close contact with each other by applying pressure from above and below with a press 13 (see FIG. 7). Note that the surface of the metal wiring 8 is exposed from the flattened UV curable resin 7 or the resin is extremely thin on a part of the surface. Thereafter, the glass substrate 6 and the mold substrate 12 removed from the press machine 13 are irradiated with UV light 14 from the mold substrate 12 side to cure the UV curable resin 7, and the mold substrate 12 is peeled to remove the wiring substrate 15. It is produced (see FIGS. 8, 9A and 9B).
[0037]
The UV light 14 may be irradiated from the mold substrate 12 side or from the glass substrate 6 side, or may be irradiated from both simultaneously.
[0038]
Then, by forming and patterning a transparent electrode (not shown) made of an ITO film so as to be in electrical contact with the metal wiring 8 on the UV curable resin 7, the electrode substrates 3a and 3b shown in FIG. 1 are obtained. .
[0039]
As described above, in the wiring board 15 according to the present invention, the front end side of the UV curable resin 7 that is spread and flattened between the metal wirings 8 by pressurization by the press machine 13 at the time of manufacture has the belt-like convex portions 10 and the metal. By collecting in the gaps between the wirings 8, they do not protrude from the edge of the glass substrate 6.
[0040]
In addition, since the UV curable resin 7 is blocked by the belt-shaped convex portion 10 and does not protrude from the edge of the glass substrate 6, there is no shortage of the UV curable resin 7 on the glass substrate 6, and the metal wiring 8 The UV curable resin 7 is uniformly filled with good flatness.
[0041]
Further, the UV curable resin 7 stretched by pressurization by the press 13 at the time of manufacture is blocked by the belt-like convex portion 10 so as to protrude out of the glass substrate 6 and contaminate the jig such as the press 13. Therefore, even if the press machine 13 or the like is reused as it is, it is possible to prevent a decrease in manufacturing yield due to adhesion of the UV curable resin 7.
[0042]
In the embodiment described above, the strip-shaped convex portion 10 of the glass substrate 6 is cut off in the scribing process when the liquid crystal element 1 is manufactured. However, as shown in FIG. A belt-like shape around two sides Convex It is also possible to manufacture the liquid crystal element 1a leaving the portions 10a and 10b.
[0043]
【Example】
Next, the method for manufacturing the wiring board described above will be specifically described with reference to examples.
[0044]
(Example 1)
11 to 15 schematically show the manufacturing process of the wiring board according to the first embodiment of the present invention.
[0045]
In this embodiment, a metal wiring 21 made of a Cr (chromium) film having a width of 10 μm and a thickness of 2 μm is formed in a stripe shape at a pitch of 100 μm on a glass substrate 20 having a thickness of 1 mm and 100 mm × 100 mm. A belt-like convex portion 22 having a width of 5 mm and a film thickness of 2 μm was formed on the entire circumference of the glass substrate 20 at a distance of 10 mm from the surface 21 (see FIG. 11). The metal wiring 21 and the strip-shaped convex portion 22 were formed by forming a Cr thin film layer on the glass substrate 20 by a sputtering method and then patterning by a photolithography method.
[0046]
And after performing UV irradiation ozone treatment to this glass substrate 20 for 5 minutes, it spins what mixed silane coupling agent (Nihon Unicar Co., Ltd. product: A-174) and ethyl alcohol in the ratio of 1: 4. Coated and heat-treated at 100 ° C. for 20 minutes for adhesion treatment.
[0047]
Next, an acrylic UV curable resin (pentaerythritol triacrylate: neopentylglycol diacrylate: 1-hydroxycyclohexyl phenyl ketone = 50: 50: 2) 24 using a dispenser 23 on the metal wiring 21 of the glass substrate 20. 40 mg of the solution is dropped, and is put in close contact with a mold substrate 25 made of a glass material. ² The pressure was applied for about 3 minutes (see FIGS. 12A, 12B, 12C, and 13). At this time, the front end side of the stretched UV curable resin 24 was blocked by the belt-like convex portion 22.
[0048]
Next, the integrated body of the glass substrate 20 and the mold substrate 25 is removed from the press machine 26, and UV light (center wavelength: 365 nm, ultraviolet intensity: 200 mJ / cm 2) from the mold substrate 25 side. ² ) 27 was irradiated to cure the UV curable resin 24 (see FIG. 14).
[0049]
Next, the mold substrate 25 is released from the glass substrate 20 by using a mold release device (not shown), and ultrasonic cleaning is performed in an isopropanol solution to remove the uncured UV curable resin 24, whereby the wiring substrate 28 is removed. (See FIGS. 15A and 15B).
[0050]
As described above, in this embodiment, the UV-cured resin 24 is prevented from protruding from the edge of the glass substrate 20 by the belt-shaped convex portions 22, and the space between the metal wirings 21 is uniformly and flat with the UV-cured resin 24. I was able to embed well.
[0051]
(Comparative example)
FIGS. 16A and 16B show a manufacturing process for comparison with the above-described embodiment.
[0052]
In this comparative example, the metal wiring 21 was formed on the glass substrate 20 by the same process as the above-described example. On the periphery of the glass substrate 20, the above-described belt-like convex portions are not formed. Then, after performing the same silane coupling treatment as in the above-described embodiment, a UV curable resin 24 similar to that in Embodiment 1 is dropped, and is sandwiched and closely adhered by a mold substrate (not shown), and a press machine (not shown). Then, the UV curable resin 24 was stretched by applying pressure and cured with UV light to produce a wiring board 29.
[0053]
As described above, the wiring substrate 29 of the comparative example does not have the belt-like convex portions formed on the periphery of the glass substrate 20 as in the above-described embodiment. By protruding outside 20, the resin shortage occurred in the region adjacent to the protruding portion, and the uniformity and flatness of the UV curable resin 24 embedded between the metal wirings 21 were lowered.
[0054]
Further, when the UV curable resin 24 is stretched by the press machine, the press machine is contaminated by the UV curable resin 24 protruding outside the glass substrate 20, and it is necessary to clean this dirt before reuse.
[0055]
(Example 2)
17 to 19 schematically show a manufacturing process of a wiring board according to the second embodiment of the present invention.
[0056]
In this embodiment, a metal wiring 21 made of a Cr (chromium) film having a width of 10 μm and a thickness of 2 μm is formed on a glass substrate 20 having a thickness of 1 mm and 100 mm × 100 mm by the same process as in the first embodiment. On the periphery of both sides of the substrate 20, strip-shaped convex portions 22 a and 22 b having a width of 5 mm and a film thickness of 2 μm were formed 10 mm away from the metal wiring 21. The strip-shaped protrusions 22a and 22b were formed only on both sides of the glass substrate 10 parallel to the wiring direction of the metal wiring 21 wired in a stripe shape.
[0057]
Next, after performing the silane coupling process similar to Example 1, UV curable resin 24 similar to Example 1 was dripped on the metal wiring 21 of the glass substrate 20 using a dispenser (not shown). At this time, the UV curable resin 24 is dropped on one end side of the metal wiring 21 arranged in a stripe shape so as to be distributed in a direction perpendicular to the wiring direction (arrow A direction) of the metal wiring 21 (FIG. 17). (See (a) and (b)).
[0058]
Next, the mold substrate 25 is bonded to the glass substrate 20 to which the UV curable resin 24 is dropped, and is inserted into the roll press machine 26a from the end face side on which the UV curable resin 24 of the glass substrate 20 is dropped (FIG. 18A, ( b)), while applying pressure (pressure of 3 kgw), the glass substrate 20 and the mold substrate 25 are integrally fed at a constant speed in the direction of arrow B (longitudinal direction of the metal wiring 21), and the UV curable resin 24 is fed to the glass substrate 20 The entire surface was stretched and cured with UV light to produce a wiring board 30 (see FIGS. 19A and 19B).
[0059]
As described above, also in this embodiment, the UV-cured resin 24 is prevented from protruding out of the glass substrate 20 by the belt-like convex portions 22a and 22b, and the space between the metal wirings 21 is uniformly and flat with the UV-cured resin 24. I was able to embed well.
[0060]
Further, as in this embodiment, when the pressure of the UV curable resin 24 is applied by a roll press machine 26a having a certain direction, the protrusion of the UV curable resin 24 is likely to occur on a side parallel to the pressure direction. Since resin shortage occurs, it is only necessary to form the strip-shaped convex portions 22a and 22b only on the peripheral edge of the glass substrate 20 parallel to the pressurizing direction (arrow A direction) of the UV curable resin 24.
[0061]
(Example 3)
In the present embodiment, a metal wiring composed of a Cr film having a width of 10 μm and a thickness of 2 μm is formed on a glass substrate having a thickness of 1 mm and 100 mm × 100 mm by a process similar to that of the first embodiment. A strip-shaped convex part having a width of 10 mm and a film thickness of 3 μm was formed on the periphery (entire circumference) of the glass substrate. Other configurations were the same as those in Example 1.
[0062]
Thus, even when the width of the gap between the metal wiring and the belt-like convex portion is changed with respect to Example 1 and the width and film thickness of the belt-like convex portion are changed, the stretched UV curable resin is strip-like. It was blocked by the convex portions of the glass substrate and did not protrude outside the glass substrate, and the space between the metal wirings could be embedded uniformly and with good flatness with a UV curable resin.
[0063]
(Example 4)
20 to 21 schematically show a manufacturing process of a wiring board according to the fourth embodiment of the present invention.
[0064]
In this example, a metal wiring 21 made of an Al film having a width of 10 μm and a thickness of 2 μm is formed on a glass substrate 20 having a thickness of 1 mm and 100 mm × 100 mm by a process similar to that of Example 1, with a pitch of 100 μm. A belt-like convex portion 22 c made of an Al film having a width of 10 mm and a film thickness of 3 μm is formed on the entire circumference of the periphery of the mold substrate 25 made of glass, and a UV curable resin 24 is dropped on the glass substrate 20 to mold the mold substrate 25. (See FIGS. 20A and 20B).
[0065]
The strip-shaped convex portion 22 c is formed at a position having a gap of about 10 mm between the mold substrate 25 and the metal wiring 21 when the mold substrate 25 is bonded to the glass substrate 20. Then, as in Example 1, the integrated product of the mold substrate 25 and the glass substrate 20 is pressed by a press (not shown), and the UV curable resin 24 similar to that in Example 1 is stretched over the entire surface of the glass substrate 20 to form the mold. The substrate 25 was cured by being irradiated with UV light to produce a wiring substrate 31 (see FIGS. 21A and 21B).
[0066]
As described above, even when the belt-like convex portion 22 c is formed on the mold substrate 25 side, the stretched UV curable resin 24 is not blocked by the belt-like convex portion 22 c and protrudes from the edge of the glass substrate 20. The space between the metal wirings 21 could be filled with the UV curable resin 24 uniformly and with good flatness.
[0067]
(Example 5)
In this embodiment, as shown in FIG. 22, a metal wiring 21 made of an Al film having a width of 10 μm and a thickness of 2 μm is formed on a glass substrate 20 having a thickness of 1 mm and 100 mm × 100 mm by a process similar to that of the first embodiment. On the other hand, a belt-like convex portion 25a having a width of 10 mm and a thickness of 3 μm is integrally formed on the entire circumference of the periphery of the mold substrate 25 made of stainless steel by a cutting method. The UV curable resin 24 was dropped and the mold substrate 25 was bonded.
[0068]
The belt-like convex portion 25 a is formed at a position having a gap of about 10 mm between the metal substrate 21 and the mold substrate 25 when the mold substrate 25 is bonded to the glass substrate 20. Then, in the same manner as in Example 1, a unitary product of the mold substrate 25 and the glass substrate 20 is pressurized with a press, the UV curable resin 24 is stretched over the entire surface of the glass substrate 20, and UV light is irradiated from the glass substrate 20 side. The wiring board was produced by curing.
[0069]
As described above, even when the belt-like convex portion 25a is integrally formed on the mold substrate 25 side, the stretched UV curable resin 24 is blocked by the belt-like convex portion 25a and protrudes from the edge of the glass substrate 20. However, the space between the metal wirings 21 could be embedded uniformly and with good flatness with the UV curable resin 24.
[0070]
【The invention's effect】
As described above, according to the present invention, the resin filled between the metal wirings protrudes from the edge of the substrate by the strip-shaped convex portion having a position 5 mm or more away from the outermost metal wiring on the substrate. Therefore, it is possible to provide a wiring board in which the resin is uniformly filled with good flatness between the metal wirings.
[0071]
In addition, according to the method for manufacturing a wiring board according to the present invention, the resin that is pressed and stretched by the belt-like convex portion formed at a position 5 mm or more away from the outermost metal wiring on the substrate or the mold substrate. Can spread uniformly over the entire substrate without protruding from the edge of the substrate, and the resin can be uniformly and evenly filled between the metal wirings. Furthermore, since the stretched resin is prevented from protruding from the edge of the substrate, a jig such as a press machine is not contaminated by the resin during pressurization, and the production yield can be improved.
[0072]
In addition, according to the liquid crystal element including the wiring substrate and the manufacturing method thereof according to the present invention, in the manufacturing process, the strip-shaped protrusion formed at a position 5 mm or more away from the outermost metal wiring on the substrate or the mold substrate. The portion prevents the resin filled between the metal wirings from protruding from the edge of the substrate, and the resin is uniformly and evenly filled between the metal wirings on the substrate. Furthermore, the adhesiveness with the transparent electrode is improved by filling the UV curable resin with good flatness.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing a liquid crystal element including a wiring board according to the present invention.
FIG. 2A is a plan view showing a state before a wiring board according to an embodiment of the present invention is filled with a UV curable resin, and FIG. 2B is a cross-sectional view taken along the line II.
3A is a plan view showing a state before a UV curable resin is filled in a wiring board according to another embodiment of the present invention, and FIG. 3B is a sectional view taken along the line II-II.
4A is a plan view showing a state before the UV curable resin is filled between the wiring board and the mold substrate according to the embodiment of the present invention, and FIG. 4B is a plan view showing the mold substrate.
FIG. 5 is a plan view showing a mold substrate of a wiring substrate according to another embodiment of the present invention.
6A is a schematic cross-sectional view illustrating a state in which a UV curable resin is dropped between the wiring board and the mold substrate according to the embodiment of the present invention, and FIG. 6B is a diagram illustrating a state in which the wiring substrate and the mold substrate are in close contact with each other. FIG.
FIG. 7 is a schematic cross-sectional view showing a state in which UV curable resin is being pressed by a press.
FIG. 8 is a schematic cross-sectional view showing a state in which UV light is irradiated to a UV curable resin.
9A is a plan view showing a manufactured wiring board, and FIG. 9B is a cross-sectional view taken along the line III-III.
FIG. 10 is a schematic sectional view showing a liquid crystal element including a wiring board according to a modification of the embodiment of the present invention.
FIG. 11 is a schematic cross-sectional view showing a state before the UV curable resin is filled in the wiring board according to the first embodiment of the present invention.
12A is a schematic cross-sectional view showing a state in which a UV curable resin is dropped between metal wirings, FIG. 12B is a schematic cross-sectional view showing a state before the UV curable resin is sandwiched between mold substrates, and FIG. The schematic sectional drawing which shows the state which contacted the wiring board and the type | mold board | substrate.
FIG. 13 is a schematic cross-sectional view showing a state in which UV curable resin is being pressed by a press.
FIG. 14 is a schematic cross-sectional view showing a state in which UV light is irradiated to the UV curable resin.
15A is a plan view showing a manufactured wiring board, and FIG. 15B is a sectional view taken along the line IV-IV.
16A is a schematic cross-sectional view showing a state before a UV curable resin is filled in a wiring board according to a comparative example, and FIG. 16B is a schematic cross-sectional view showing the wiring board according to the comparative example.
17A is a plan view showing a state in which a UV curable resin is dropped on a wiring board according to Embodiment 2 of the present invention, and FIG. 17B is a cross-sectional view taken along line VV.
18A is a schematic cross-sectional view showing a state before the UV curable resin dropped on the wiring board according to Example 3 of the present invention is sandwiched between mold substrates, and FIG. The schematic sectional drawing which shows the state which has pressurized.
19A is a plan view showing a manufactured wiring board, and FIG. 19B is a cross-sectional view taken along the line VI-VI.
20A is a schematic cross-sectional view showing a state in which a UV curable resin is dropped between the mold substrate and the wiring substrate according to Example 4 of the present invention, and FIG. 20B is a diagram showing the wiring substrate and the mold substrate in close contact with each other. The schematic sectional drawing which shows the state which pressurized.
21A is a plan view showing a manufactured wiring board, and FIG. 21B is a cross-sectional view taken along the line VII-VII.
FIG. 22 is a schematic cross-sectional view showing a state in which a UV curable resin is dropped between a mold substrate and a wiring substrate according to Example 5 of the present invention.
23A is a schematic cross-sectional view showing a state in which a UV curable resin is dropped on a mold substrate in a method for manufacturing a wiring substrate according to a conventional example, and FIG. 23B is a diagram before the UV curable resin is brought into close contact with the wiring substrate. The schematic sectional drawing which shows the state of (2), (c) is a schematic sectional drawing which shows the state which contact | adhered the wiring board and the type | mold board | substrate.
24A is a schematic cross-sectional view showing a state before pressurizing a UV curable resin with a press in a method of manufacturing a wiring board according to a conventional example, and FIG. FIG.
25A is a schematic cross-sectional view showing a state in which UV light is irradiated to a UV curable resin in a method for manufacturing a wiring board according to a conventional example, and FIG. 25B is a state in which a mold substrate is peeled off. The schematic sectional drawing shown, (c) is a schematic sectional drawing which shows the produced wiring board.
[Explanation of symbols]
1, 1a Liquid crystal element
3a, 3b electrode substrate
4 Liquid crystal
6, 6a, 6b, 20 Glass substrate (substrate)
7, 7a, 7b, 24 UV curable resin (resin)
8, 8a, 8b, 21 Metal wiring
9a, 9b Transparent electrode
10, 10a-10g, 22, 22a-22c, 25a Band-shaped convex part
12, 25 type substrate
13, 26 Press machine
26a roll press machine
14, 27 UV light
15, 28, 29, 30, 31 Wiring board

Claims

A pair of substrates disposed so as to face each other; a liquid crystal sandwiched between the substrates; a transparent electrode provided on at least one of the substrates; and a metal pattern with a wiring pattern in electrical contact with the back surface of the transparent electrode; In a method of manufacturing a liquid crystal element having a resin provided between the metal wirings,
Forming a wiring pattern of the metal wiring on the surface of the one substrate;
Injecting the resin between a mold substrate and the substrate, closely contacting and pressurizing the mold substrate and the substrate, filling the resin between the metal wiring and curing, and
A strip-shaped convex portion is formed in advance on the mold substrate corresponding to a position 5 mm or more away from the outermost metal wiring on the substrate, and the resin is injected between the substrate and the mold substrate. Pressing and filling the resin between the metal wirings flatly in the belt-like convex portion,
A method for producing a liquid crystal element.

The strip-shaped convex portion is provided on the entire circumference on the mold substrate corresponding to a position separated by 5 mm or more from the outermost metal wiring of the substrate.
The manufacturing method of the liquid crystal element of Claim 1 .

The belt-like convex portions are formed on both sides of the mold substrate parallel to the direction in which the resin is uniaxially pressed with the mold substrate corresponding to a position at least 5 mm away from the outermost metal wiring of the substrate. To
The manufacturing method of the liquid crystal element of Claim 1 .

A pair of substrates disposed so as to face each other; a liquid crystal sandwiched between the substrates; a transparent electrode provided on at least one of the substrates; and a metal pattern with a wiring pattern in electrical contact with the back surface of the transparent electrode; In a method of manufacturing a liquid crystal element having a resin provided between the metal wirings,
Forming a wiring pattern of the metal wiring on the surface of the one substrate;
Injecting the resin between the mold substrate and the substrate, pressurizing the substrate and the mold substrate along the longitudinal direction of the metal wiring from the end portions of both sides of the substrate and the mold substrate, Filling and curing the resin between the metal wirings,
A method for producing a liquid crystal element.

The pressurization is performed using a roll press machine.
The manufacturing method of the liquid crystal element of Claim 4 .