JP3690907B2 - Plasma display panel and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plasma display panel (PDP) having a partition in a display region and a manufacturing method thereof, and more particularly to a PDP and a manufacturing method thereof for reducing the manufacturing cost.
[0002]
[Prior art]
PDPs are attracting attention as display panels (thin display devices) with excellent visibility, and high definition screens and large screens are being promoted in order to expand applications in fields called high vision in Japan.
[0003]
A PDP is a self-luminous display panel in which a pair of substrates (usually a glass substrate) are arranged to face each other with a minute gap and a discharge space is formed inside by sealing the periphery.
[0004]
In general, the PDP is provided with strip-shaped and / or grid-shaped barriers for partitioning the discharge space. For example, as a typical matrix display system, an AC drive type PDP for color display is taken as an example, and the configuration is as shown in FIG.
[0005]
In this figure, reference numeral 10 denotes an AC drive type PDP for color display. On the inner surface of the front substrate 11 made of glass, a pair of sustain electrodes X and Y are arranged for each line L of the matrix display. Each of the sustain electrodes X and Y includes a transparent electrode 12 and a metal electrode 13, and is covered with a dielectric layer 17, and the dielectric layer 17 is covered with a protective film 18 made of magnesium oxide (MgO).
[0006]
On the inner surface of the back side substrate 21 made of glass, a base layer 22, an address electrode A, and an insulating layer 24 are sequentially formed, and then a strip-shaped partition wall 29 is formed so as to sandwich the address electrode A. Three color (R, G, B) phosphors 28R, 28G, and 28B are formed on the inner surface (bottom surface and side surface) of the elongated inter-bulk groove portion (discharge cell) defined by the strip-shaped barrier rib 29.
[0007]
Thus, in the AC drive type PDP for color display, for example, the strip-shaped partition walls 29 having a height of about 100 to 200 μm are provided along the address electrode A line at equal intervals. The partition walls 29 prevent discharge interference and color crosstalk.
[0008]
Various methods are used as a method of forming this partition wall. Typical examples include layer printing by screen printing, sand blasting by cutting with abrasives, lift-off using dry film (additive method), photolithography method for patterning photosensitive barrier rib paste, etc. After the partition is formed on the back side substrate by such a method, it is combined with the front side substrate, the periphery of both substrates is heat sealed with a sealing material such as low melting glass, and the discharge gas is sealed in the panel to produce a panel. .
[0009]
After the panel is manufactured, the panel and the printed wiring board on which the circuit is mounted are coupled using a flexible electrode to complete a PDP display device.
[0010]
[Problems to be solved by the invention]
However, various methods as described above are used for the formation of the partition walls, and in any method, useless indirect material generated in the manufacturing process other than the direct material that finally becomes the partition walls and the printing plate The cost ratio of consumables such as these is high, which is an obstacle to cost reduction.
[0011]
As a method of saving material costs, a mass-produced flat glass substrate is used, and this is directly cut by a sandblasting method to form partition walls (the substrate manufactured by this method is referred to as a “direct-cut substrate for partition walls”) Alternatively, there is a method in which the partition wall and the glass substrate are integrally formed by a mold press or the like (a substrate manufactured by this method is referred to as “integrated substrate of the partition wall and the substrate”). When forming the electrode, it becomes extremely difficult to form an electrode in the inter-partition groove between the partition walls.
[0012]
Further, when a vacuum technique such as sputtering is used for forming the electrode wiring pattern, the maintenance cost of the manufacturing apparatus is increased. In addition, on the mounting surface, a flexible cable is used for joining with a printed wiring board on which a circuit is mounted after the panel is completed, and thus there are problems such as floating resistance, contact resistance, and labor.
[0013]
The present invention has been made in view of such circumstances, and after the front side substrate and the sheet-like partition substrate are heat sealed with a sealing material, the back-side substrate is joined to the sheet-like partition substrate. Therefore, it is intended to provide a plasma display panel and a method for manufacturing the same, in which the back side substrate can be easily manufactured and the cost can be reduced.
[0014]
[Means for Solving the Problems]
In the production of a plasma display panel, a front side substrate and a sheet-like partition substrate in which a partition is formed on an insulating substrate significantly thinner than the substrate are separated from each other with a sealing material around the partition side. A method for manufacturing a plasma display panel, comprising: heat sealing hermetically and then bonding a back substrate to a sheet-like partition substrate.
[0015]
According to this invention, after the front side substrate and the sheet-like partition wall substrate are heat-sealed hermetically with the sealing material, the back-side substrate is joined to the sheet-like partition wall substrate. At the time of bonding with the side substrate, the bonding surface and the back side substrate are not affected by heat generated during heat sealing.
[0016]
Therefore, for example, when the sealing material is a low-melting glass, the heat sealing temperature is usually about 450 ° C., but the sheet-shaped partition wall substrate and the back-side substrate are bonded without considering heat resistance to that temperature. Therefore, instead of the conventionally used glass substrate having a high heat resistance temperature, a substrate having a low heat resistance temperature of 450 ° C. or lower can be used as the back side substrate. In addition, a wiring pattern or the like can be printed on the back side substrate, and an acrylic printed wiring board or the like can be used as the back side substrate on which such a wiring pattern is formed. Thereby, the production of the back side substrate can be facilitated, and the cost of the back side substrate can be reduced as compared with the conventional case.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, if the front substrate is, for example, an AC drive type PDP, a pair of sustain electrodes are arranged on the inner surface for each line of the matrix display, and the sustain electrodes are covered with a dielectric layer. A glass substrate used in a conventionally known PDP in which the layer is covered with a protective film can be applied.
[0018]
As the insulating substrate significantly thinner than the front substrate, a conventionally known glass substrate such as a low-melting glass can be applied. Significantly thinner than the front substrate means a thickness that cannot maintain the strength of a normal PDP by itself.
[0019]
The partition wall formed on the insulating substrate may be formed by any conventionally known method such as the following lamination printing method, sand blasting method, lift-off method, photolithography method, and integral molding method. Good.
[0020]
The lamination printing method is a method in which glass paste, which is a partition wall material, is stacked at a predetermined height by screen printing and then fired to form partition walls.
[0021]
In the sand blasting method, first, the partition wall material is formed as a solid film on the entire surface of the substrate and then dried, a sand blast resistant mask is formed on a desired portion, and an abrasive is sprayed from the top by sand blasting to remove portions other than the mask. In this method, the partition walls are formed by cutting and, after completion of the cutting, removing the mask and firing.
[0022]
The lift-off method is also called “embedding method”. First, a pattern that becomes a negative image of the partition wall is formed at a desired position on the substrate by a photosensitive resist (generally using a dry film), and then the pattern and In this method, the barrier rib material is embedded in the gap between the patterns using a screen printing method or the like, and then only the pattern of the photosensitive resist is peeled off, and the barrier ribs are formed through a baking process.
[0023]
The photolithographic method is a method in which a photosensitive barrier rib paste in which a photosensitive resin is mixed into a barrier rib material is applied and formed on the entire surface of the substrate, dried, exposed to a pattern of the barrier ribs, and developed to form barrier ribs.
[0024]
The integral molding method is a method in which a flat glass substrate is heated and integrally molded by a mold press or the like.
[0025]
The sheet-like partition substrate in which the partition is formed on the insulating substrate is preferably a plate in which a partition having a height of about 100 to 200 μm is formed on a plate glass having a thickness of 60 μm or less.
[0026]
As a sealing material used for heat sealing around the front substrate and the sheet-like partition substrate, low melting glass can be used.
[0027]
In joining the back side substrate to the sheet-like partition substrate, various joining methods such as fusion joining using a low melting point glass, anodic joining, or joining using an adhesive can be applied. Which of these various bonding methods is used is determined comprehensively based on the presence or absence of a thermal process, the allowed material cost, and the yield of the method. When joining using an adhesive, conventionally well-known various adhesives, such as an organic adhesive, can be used as an adhesive.
[0028]
In the manufacturing method of the present invention, if the manufacturing method of the present invention is applied to an AC drive type PDP of a counter three-electrode surface discharge type, the back side substrate bonded to the sheet-like partition substrate is used for display. A printed circuit board provided with an electrode and a drive circuit for driving the electrode can be applied. Alternatively, the address electrode may be formed on the sheet-like partition board before the back side substrate is bonded to the sheet-like partition board.
[0029]
The present invention is also the plasma display panel manufactured by the manufacturing method of the present invention, wherein the back side substrate is a substrate having a heat resistant temperature lower than the melting temperature of the sealing material.
[0030]
The present invention will be described in detail below based on the embodiments shown in the drawings. However, this does not limit the present invention. In the following description, an AC-driven PDP for color display will be described as an example of the plasma display panel.
[0031]
[Example 1]
FIG. 1 is an explanatory view showing a manufacturing process of Example 1 of an AC drive type PDP for color display. In this figure, since a conventionally known substrate is used for the front side substrate, it is not shown and only the manufacturing process of the back side substrate is shown.
[0032]
The AC display type PDP for color display of the present invention is basically the same as the manufacturing process of the conventional PDP shown in FIG. 9, but the difference from the manufacturing process of the conventional PDP is that of the back side substrate. It is a manufacturing process.
[0033]
In the present invention, as a manufacturing process of the back side substrate, first, a sheet-shaped partition substrate (hereinafter referred to as “sheet-shaped partition wall”) in which a partition wall having a height of about 100 to 200 μm is formed at a predetermined position on a thin plate glass having a thickness of 60 μm or less. (Referred to as “substrate” or “rib sheet”) 1 (see FIG. 1A).
[0034]
The partition walls 29 of the sheet-shaped partition substrate 1 are formed by various conventionally known methods such as a lamination printing method, a sand blast method, a lift-off method, a photolithography method, and an integral molding method.
[0035]
On the other hand, a reinforcing substrate 3 made of an arbitrary material such as tempered glass or acrylic having an appropriate strength and thickness is produced, and an address electrode A is formed on the surface of the reinforcing substrate 3 (see FIG. 1B). The address electrode A is formed using a conventionally known patterning method.
[0036]
Then, by joining the sheet-like partition substrate 1 and the reinforcing substrate 3, a partition substrate 4 with electrodes is manufactured (see FIG. 1C), and this is used as the back side substrate of the PDP. As a method for joining the sheet-like partition substrate 1 and the reinforcing substrate 3, a method using fusion of low melting glass, a method using anodic bonding, a method using an adhesive, or the like can be used.
[0037]
The reason why a glass substrate having a thickness of 60 μm or less is used as the sheet-like partition substrate 1 is that the address electrode A installed on the lower surface of the sheet-like partition substrate 1 and the counter electrode (not shown) of the front side substrate are effectively used. This is for electrostatic coupling.
[0038]
Even if the sheet-shaped partition wall substrate 1 is thick, it is electrostatically coupled in principle, but the efficiency is lowered. The efficiency of this electrostatic coupling depends on the material of the plate glass, and the thinner it is, the better. However, it is desirable to have this thickness for work reasons.
[0039]
According to this embodiment, the formation of the address electrode A becomes extremely simple. In other words, when forming the address electrode on a “partition wall direct digging substrate” or “partition-substrate integrated substrate” that forms the partition wall at low cost, it is extremely difficult to form the electrode in the groove between the partition walls. In the example, the electrodes may be formed on the surface of the reinforcing substrate 3 (corresponding to the back surface of the sheet-like partition substrate 1), so that the formation of the address electrode A becomes extremely simple.
[0040]
[Example 2]
FIG. 2 is an explanatory view showing the manufacturing process of the second embodiment.
In this embodiment, first, a sheet-like partition substrate 1 is prepared in the same manner as in the embodiment 1, and then a conventionally known front side substrate 11 is joined to the partition-forming side of the sheet-like partition substrate 1 to obtain a sheet-like partition substrate. 1 and the front substrate 11 are heat-sealed at a temperature of about 450 ° C. with a sealing material 5 made of low-melting glass, and the internal discharge space is hermetically sealed (see FIG. 2A).
[0041]
On the other hand, similarly to Example 1, a reinforcing substrate 3 having an address electrode A formed on the surface thereof was produced (see FIG. 2B), and this reinforcing substrate 3 was integrated with a front substrate 11 as a sheet-like partition wall. The PDP 10 is obtained by bonding the substrate 1 with an organic adhesive (see FIG. 2C). As the method for joining the reinforcing substrate 3 to the sheet-like partition substrate 1, various methods can be used in the same manner as in the first embodiment.
[0042]
According to the present embodiment, the sheet-like partition substrate 1 and the reinforcing substrate 3 are joined after the heat sealing step between the front-side substrate 11 and the sheet-like partition substrate 1, so that the reinforcing substrate serving as the back-side substrate is used. Thirdly, a low-cost material having a low heat-resistant temperature that could not be used conventionally can be used.
[0043]
Further, since an adhesive having a low heat-resistant temperature can be used as the adhesive used when joining the sheet-shaped partition wall substrate 1 and the reinforcing substrate 3, the range of selection of the adhesive when joining can be widened.
[0044]
[Example 3]
FIG. 3 is an explanatory view showing the manufacturing process of the third embodiment.
The present embodiment is an application example of the second embodiment, and differs from the second embodiment in that a printed wiring board 6 is used instead of the reinforcing board 3.
[0045]
That is, as in Example 1, the front substrate 11 and the sheet-like partition substrate 1 are heat-sealed by the sealing material 5 (see FIG. 3A).
On the other hand, an address electrode A is formed on the surface of the printed wiring board 6 using the printed wiring board 6 (see FIG. 3B). And the printed wiring board 6 is joined to the sheet-like partition board | substrate 1 integrated with the front side board | substrate 11 (refer FIG.3 (c)), and PDP10 is obtained.
[0046]
According to the present embodiment, since the sheet-like partition board 1 and the printed wiring board 6 are joined after the heat sealing step of the front-side board 11 and the sheet-like partition board 1, the back-side board is conventionally used. A printed wiring board 6 having a low heat-resistant temperature that could not be used can be used. As a result, the printed wiring board 6 that has been conventionally bonded to the back surface of the glass back-side substrate can be directly bonded to the sheet-like partition wall substrate 1 as the back-side substrate itself after the manufacture of the PDP. The glass substrate on the back side that has been used becomes unnecessary, and the manufacturing cost can be reduced.
[0047]
Moreover, since the thing with a low heat-resistant temperature can be used for the adhesive agent used when joining the sheet-like partition board | substrate 1 and the printed wiring board 6 similarly to Example 1, the selection of the adhesive agent in the case of joining is possible. The width can be increased.
[0048]
[Example 4]
FIG. 4 is an explanatory view showing the manufacturing process of the fourth embodiment.
The present embodiment is an application example of the third embodiment, and is different from the third embodiment in that a circuit mounted printed wiring board 7 on which a circuit 8 such as a PDP driving circuit is mounted is applied as the printed wiring board 6. That is. In the figure, reference numeral 9 denotes a wiring connecting the circuit 8 and the address electrode A.
[0049]
According to the present embodiment, since the circuit 8 is directly coupled to the address electrode A by the wiring 9, the connection by the conventional flexible electrode becomes unnecessary and the stray capacitance can be reduced.
[0050]
[Example 5]
FIG. 5 is an explanatory view showing the manufacturing process of the fifth embodiment.
The present embodiment is an application example of the fourth embodiment, and is different from the fourth embodiment in that the solder bumps 31 are provided on the circuit-mounted printed wiring board 7 and the reflow soldering is performed so that the sustain electrodes X, Y can be connected.
[0051]
As a result, the sustain electrodes X and Y of the front substrate 11 that is the counter substrate can be connected to the circuit 8 by using the solder bumps 31. The sustain electrodes X and Y of the front substrate 11 and the circuit 8 are automatically connected when a panel is formed.
[0052]
According to the present embodiment, since there is no connection by the conventional flexible electrode, there is a great possibility that the floating resistance is reduced and the limit of the electrode pitch determined by the withstand voltage of the flexible electrode is exceeded. This is an extremely effective method for circuit mounting.
[0053]
[Example 6]
FIG. 6 is an explanatory view showing the manufacturing process of the sixth embodiment.
In this embodiment, the partition substrate 4 with the same electrodes as in the embodiment 1 shown in FIG. 1C is manufactured. At this time, the partition walls are formed by a mold press. About the material to apply, it is the same as that of Example 1.
[0054]
That is, in the present embodiment, the reinforcing substrate 3 having the address electrode A formed on the surface is bonded to a flat thin glass plate 1a having a thickness of about 60 to 80 μm (see FIG. 6B), and the bonded thin film is bonded. The partition glass 29 is formed by press-molding the plate glass 1a with a mold 32 (see FIG. 6A) to form the partition wall substrate 4 with the same electrodes as in Example 1 (see FIG. 6C).
[0055]
According to the present embodiment, since the partition walls are formed by mold pressing, the relative position between the pattern of the address electrode A and the partition walls 28 can be determined strictly.
[0056]
[Example 7]
FIG. 7 is an explanatory view showing the manufacturing process of the seventh embodiment.
In this example, the partition substrate 4 with electrodes is manufactured by the method of Example 6, and then the PDP is manufactured by the method of Example 2.
[0057]
That is, first, the partition substrate 4 with electrodes is manufactured by the method of Example 6. When the reinforcing substrate 3 is bonded to the flat thin glass sheet 1a, these are temporarily bonded (FIG. 7B). )), The thin plate glass 1a after the temporary bonding is mold-pressed with a mold die 32 (see FIG. 7A) to form the partition walls 29, thereby obtaining the same partition substrate 4 with electrodes as in Example 6 ( (Refer FIG.7 (c)).
[0058]
Thereafter, the sheet-like partition substrate 1 is once peeled off from the reinforcing substrate 3, and the front side substrate 11 and the sheet-like partition substrate 1 are heat-sealed in the same manner as in Example 2 (see FIG. 7 (d)). The sheet-like partition substrate 1 integrated with the side substrate 11 is again joined to the reinforcing substrate 3 to obtain a PDP (see FIG. 7E).
[0059]
According to the present embodiment, the pattern of the address electrode A and the relative position of the partition wall 28 can be determined strictly, and the selection range of the adhesive when joining the sheet-shaped partition wall substrate 1 and the reinforcing substrate 3 can be increased. Can be spread.
[0060]
[Example 8]
FIG. 8 is an explanatory view showing the manufacturing process of the eighth embodiment.
This embodiment can be said to be a modification of the first embodiment, and differs from the first embodiment in that the address electrodes A are formed on the back surface of the sheet-like partition wall substrate 1. That is, in Example 1, the address electrode A was formed on the opposite substrate to which the sheet-like partition substrate 1 was joined, such as the reinforcing substrate 3, the printed wiring substrate 6, or the circuit mounting printed wiring substrate 7. In this embodiment, the address electrode A is formed on the back surface of the sheet-like partition substrate 1.
[0061]
According to the present embodiment, although there are some problems in handling, there is an advantage that alignment between the sheet-shaped partition wall substrate 1 and the reinforcing substrate 3 is not necessary.
[0062]
Note that the method of forming the address electrode A on the back surface of the sheet-like partition substrate 1 can be applied to any of the above-described Examples 2 to 7, but the Examples 2 to 5 are applicable. In the case of application, if the address electrode A is formed before heat sealing the front substrate 11 and the sheet-like partition wall substrate 1, the address electrode A may be affected by heat at the time of heat sealing. It is desirable to form the electrode A after heat sealing.
[0063]
Thus, when the PDP is manufactured, it is necessary to form an electrode in the groove between the barrier ribs even when the address electrode is formed on the low-cost “direct-cutting substrate of the barrier rib” or “integrated substrate of the barrier rib and the substrate”. In addition, since it is only necessary to form electrodes on the surface of the substrate, the formation of the address electrodes becomes very simple, and this makes it possible to use the low-cost substrate with a partition wall as described above, thereby reducing the manufacturing cost of the PDP. Can be reduced.
[0064]
In addition, since the partition walls can be formed by integral molding such as a mold press, it is possible to easily manufacture a PDP having a partition top surface with excellent flatness and a partition wall having a high aspect with a high yield. It becomes.
[0065]
Furthermore, after the heat sealing step between the front side substrate and the sheet-like partition board, the sheet-like partition board is joined to the back side substrate such as a reinforcing board, a printed wiring board, or a circuit mounting printed wiring board. As the side substrate, a low-cost material having a low heat-resistant temperature that could not be used conventionally can be used.
[0066]
And since an adhesive having a low heat-resistant temperature can be used as an adhesive used when bonding a reinforcing substrate, a printed wiring board, or a circuit-mounted printed wiring board to a sheet-shaped partition board, the adhesive at the time of bonding The range of selection can be expanded as compared with the prior art.
[0067]
In addition, the conventional flexible electrode is not required for mounting the drive circuit for driving the PDP, and surface mounting is possible.
[0068]
In all the embodiments described above, any method can be applied to the sheet-like partition board produced by any method. That is, as long as the sheet-like partition substrate is on a thin plate glass having a thickness of 60 μm or less, the partition is formed by a lamination printing method, a sand blast method, a lift-off method, a photolithography method, an integral molding method, or any other known partition formation method. It may be.
[0069]
【The invention's effect】
According to the present invention, when selecting the material for the back side substrate, it is not necessary to consider the heat resistance at the time of heat sealing with the sealing material, so that the selectivity of the material for the back side substrate can be made wider than before. In addition, as the back side substrate, a material having a low heat-resistant temperature, which has been impossible in the past, can be used. Therefore, since it is not necessary to use a glass substrate for the back side substrate as in the prior art, the production of the back side substrate can be facilitated, and the cost of the back side substrate can be reduced as compared with the conventional case.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an explanatory diagram illustrating manufacturing steps of a first embodiment of an AC drive type PDP for color display according to the present invention.
2 is an explanatory view showing a manufacturing process of Example 2. FIG.
3 is an explanatory diagram showing a manufacturing process of Example 3. FIG.
4 is an explanatory diagram showing a manufacturing process of Example 4. FIG.
5 is an explanatory diagram showing a manufacturing process of Example 5. FIG.
6 is an explanatory diagram showing a manufacturing process of Example 6. FIG.
7 is an explanatory diagram showing a manufacturing process of Example 7. FIG.
8 is an explanatory diagram showing a manufacturing process of Example 8. FIG.
FIG. 9 is an explanatory diagram showing a configuration of a conventional AC-driven PDP for color display.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Sheet-like partition board | substrate 1a Planar thin plate glass 3 Reinforcement board 4 Partition board 5 with an electrode 5 Sealing material 6 Printed wiring board 7 Circuit mounting printed wiring board 8 Circuit 9 Wiring 10 PDP
11 Front side substrate 29 Bulkhead 31 Solder bump 32 Mold type A Address electrode X, Y Sustain electrode

Claims (5)

When manufacturing a plasma display panel, a front substrate and a sheet-like partition substrate in which a partition is formed on an insulating substrate that is significantly thinner than the substrate are sealed with a sealant around the partition wall as an inner surface and heat-sealed. A method of manufacturing a plasma display panel, comprising attaching a back side substrate to a sheet-like partition substrate. 2. The method for producing a plasma display panel according to claim 1, wherein the sheet-like partition substrate is obtained by forming a partition having a height of about 100 to 200 [mu] m on a plate glass having a thickness of 60 [mu] m or less. 2. The method of manufacturing a plasma display panel according to claim 1, wherein the back substrate bonded to the sheet-shaped partition substrate is a printed circuit board provided with display electrodes and a drive circuit for driving the display electrodes. 2. The method of manufacturing a plasma display panel according to claim 1, wherein an address electrode is formed on the sheet-shaped partition board substrate before the back-side substrate is bonded to the sheet-shaped partition board substrate. The plasma display panel manufactured by the manufacturing method according to claim 1, wherein the back side substrate is a substrate having a heat resistant temperature lower than a melting temperature of the sealing material.

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