JP3695664B2 - Lens resin composition and cured product thereof - Google Patents
Lens resin composition and cured product thereof Download PDFInfo
- Publication number
- JP3695664B2 JP3695664B2 JP09201095A JP9201095A JP3695664B2 JP 3695664 B2 JP3695664 B2 JP 3695664B2 JP 09201095 A JP09201095 A JP 09201095A JP 9201095 A JP9201095 A JP 9201095A JP 3695664 B2 JP3695664 B2 JP 3695664B2
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- meth
- resin composition
- bisphenol
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 29
- -1 polyethylene Polymers 0.000 description 17
- 239000000047 product Substances 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- UMLWXYJZDNNBTD-UHFFFAOYSA-N alpha-dimethylaminoacetophenone Natural products CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- POZQNORNRSITKW-UHFFFAOYSA-N (1,2,2-tribromo-2-phenoxyethyl) prop-2-enoate Chemical compound C=CC(=O)OC(Br)C(Br)(Br)OC1=CC=CC=C1 POZQNORNRSITKW-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- ZSVFYHKZQNDJEV-UHFFFAOYSA-N (2,3,4-tribromophenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(Br)C(Br)=C1Br ZSVFYHKZQNDJEV-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- CKGKXGQVRVAKEA-UHFFFAOYSA-N (2-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC=C1C(=O)C1=CC=CC=C1 CKGKXGQVRVAKEA-UHFFFAOYSA-N 0.000 description 1
- SZCWBURCISJFEZ-UHFFFAOYSA-N (3-hydroxy-2,2-dimethylpropyl) 3-hydroxy-2,2-dimethylpropanoate Chemical compound OCC(C)(C)COC(=O)C(C)(C)CO SZCWBURCISJFEZ-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- UEIPWOFSKAZYJO-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-[2-(2-ethenoxyethoxy)ethoxy]ethane Chemical compound C=COCCOCCOCCOCCOC=C UEIPWOFSKAZYJO-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- MOBNLCPBAMKACS-UHFFFAOYSA-N 2-(1-chloroethyl)oxirane Chemical compound CC(Cl)C1CO1 MOBNLCPBAMKACS-UHFFFAOYSA-N 0.000 description 1
- QFNYOIKHNYCFRG-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC1=CC=CC=C1 QFNYOIKHNYCFRG-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- OOHAMBODAKJXMR-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;n,n-diethylethanamine Chemical compound CCN(CC)CC.OCCN(CCO)CCO OOHAMBODAKJXMR-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- ZEERWUUHFUFJJT-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1.CC(C)(O)C(=O)C1=CC=CC=C1 ZEERWUUHFUFJJT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- CHNAGNJFDORFKC-UHFFFAOYSA-N CC1=CC=2C(C3=CC=CC=C3SC2C(=C1)C)=O.C(C)C1=CC=2C(C3=CC=CC=C3SC2C(=C1)CC)=O Chemical compound CC1=CC=2C(C3=CC=CC=C3SC2C(=C1)C)=O.C(C)C1=CC=2C(C3=CC=CC=C3SC2C(=C1)CC)=O CHNAGNJFDORFKC-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- XMDXVPRGUJYPQK-UHFFFAOYSA-N bis[4-(2-hydroxyethoxy)phenyl]-phenylsulfanylsulfanium Chemical compound C1(=CC=CC=C1)S[S+](C1=CC=C(C=C1)OCCO)C1=CC=C(C=C1)OCCO XMDXVPRGUJYPQK-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
Description
【0001】
【産業上の利用分野】
本発明は、ビデオプリンター、プロジェクションテレビ、液晶ディスプレーなどに使用するフレネルレンズ、レンチキュラーレンズ、プリズムレンズなどのレンズ類に適している紫外線硬化性レンズ用樹脂組成物及びその硬化物に関する。
【0002】
【従来の技術】
従来、この種のレンズはプレス法、キャスト法等の方法により成形されていた。前者のプレス法は加熱、加圧、冷却のサイクルで製造するため生産性が悪かった。又、後者のキャスト法は金型にモノマーを流し込んで重合するため製作時間が長くかかるとともに金型が多数個必要なため、製造コストが上がるという問題があった。このような問題を解決するために、紫外線硬化型樹脂組成物を使用することについて種々提案がなされている。(例えば、特開昭61−177215、特開昭61−248707、特開昭61−248708、特開昭63−163330、特開昭63−167301、特開昭63−199302、特開昭64−6935等参照)
【0003】
【発明が解決しょうとする課題】
これら紫外線硬化性樹脂組成物を使用することによってレンズ類を製造する方法はある程度成功している。しかしながら基板(例えば、ポリエステルシート、ポリカーボネートシート、ポリアクリレートと他樹脂の混合物のシート、塩ビシート等)との密着性が不十分であり、場合によっては、基板にプライマー処理して使用しており問題である。
【0004】
【課題を解決するための手段】
上記の課題を解決するため、本発明者らが鋭意研究の結果、紫外線による硬化が速く、又その硬化物が離型性、密着性に優れ、軟質な樹脂組成物を見出し本発明を完成するに至った。
即ち、本発明は、
エチレン性不飽和基含有化合物(A)と光ラジカル重合開始剤(B)とカチオン重合性化合物(C)及び光カチオン重合開始剤(D)を含有することを特徴とするレンズ用樹脂組成物及びその硬化物に関する。
【0005】
本発明で使用するエチレン性不飽和基含有化合物(A)の具体例としては、例えば、ウレタン(メタ)アクリレート(例えば、エチレングリコール、1,4−ブタンジオール、ネオペンチルグリコール、ポリカプロラクトンジオール、ポリエチレングリコール、ポリエステルジオール、ビスフェノールAポリエトキシジオール、ビスフェノールFポリエトキシジオール、ポリカーボネートジオール、ポリテトラメチレングリコール等のポリオール類とヘキサメチレンジイソシアネート、イソホロンジイソシアネート、トリレンジイソシアネート、キシリレンジイソシアネート等の有機ポリイソシアネート類と2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、1,4−ブタンジオールモノ(メタ)アクリレート等の水酸基含有エチレン性不飽和化合物類の反応物を挙げることができる。)、エポキシ(メタ)アクリレート(例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールA、プロピレンオキサイド付加物の末端グリシジルエーテル等のエポキシ樹脂と(メタ)アクリル酸との反応物を挙げることができる。)、ポリエステルポリアクリレート等のオリゴマー類、N−ビニルカプロラクタム、アクリロイルモルフォリン、フェノキシエチル(メタ)アクリレート、フェノキシエチルオキシエチル(メタ)アクリレート、2−ヒドロキシ−3−フェニルオキシプロピル(メタ)アクリレート、o−フェニルフェニルオキシエチル(メタ)アクリレート、o−フェニルフェニルオキシエチルオキシエチル(メタ)アクリレート、o−フェニルフェノールポリエトキシ(メタ)アクリレート、トリブロモフェニル(メタ)アクリレート、トリブロモフェニルオキシエチル(メタ)アクリレート、トリブロモフェニルオキシエチル(メタ)アクリレート、トリブロモベンジル(メタ)アクリレート、テトラブロモビスフェノールAポリエトキシジ(メタ)アクリレート、ビスフェノールAジエトキシジ(メタ)アクリレート、ビスフェノールAジプロポキシジ(メタ)アクリレート、ビスフェノールAポリエトキシジ(メタ)アクリレート、ビスフェノールAポリプロポキシジ(メタ)アクリレート、ビスフェノールFポリエトキシジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、ノナンジオールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ヒドロキシピバリン酸ネオペンチルグリコールのε−カプロラクトン付加物のジ(メタ)アクリレート等の反応性単量体類等を挙げることができる。
【0006】
好ましいエチレン性不飽和基含有化合物(A)としては、フェノキシエチルアクリレート、フェノキシエチルオキシエチルアクリレート、2−ヒドロキシ−3−フェニルオキシプロピルアクリレート、トリブロモフェニルメタクリレート、トリブロモフェニルオキシエチルアクリレート、o−フェニルフェニルオキシエチルアクリレート、o−フェニルフェノールポリエトキシアクリレート、ビスフェノールAポリエトキシジアクリレート、ビスフェノールAポリプロポオキシジアクリレート、ビスフェノールFポリエトキシジアクリレート、ウレタンジアクリレート、ビスフェノールA型エポキシアクリレート等を挙げることができる。
光ラジカル重合開始剤(B)としては、例えば、
【0007】
【化1】
【0008】
【化2】
【0009】
【化3】
【0010】
【化4】
【0011】
等の共重合性光ラジカル重合開始剤やベンゾイン、ベンゾインメチルエーテル、ベンゾインイソプロピルエーテル、アセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、2,2−ジエトキシ−2−フェニルアセトフェノン、1,1−ジクロロアセトフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、2−メチル−1−〔4−(メチルチオ)フェニル)−2−モルフォリノープロパン−1−オン、N,N−ジメチルアミノアセトフェノン、2−メチルアントラキノン、2−エチルアントラキノン、2−tert−ブチルアントラキノン、1−クロロアントラキノン、2−アミルアントラキノン、2−アミノアントラキノン、2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2,4−ジイソプロピルチオキサントン、アセトフェノンジメチルケタール、ベンゾフェノン、メチルベンゾフェノン、4,4′−ジクロロベンゾフェノン、4,4′−ビスジエチルアミノベンゾフェノン、ミヒラーズケトン等を挙げることができる。これらは、単独或は2種以上を組合せて用いることができる。
更に、このような光ラジカル重合開始剤(B)と共にN,N−ジメチルアミノ安息香酸エチルエステル、N,N−ジメチルアミノ安息香酸イソアミルエステル、トリエタノールアミン−トリエチルアミンの様な公知慣用の光増感剤を単独或は2種以上を組合せて用いることができる。
カチオン重合性化合物(C)の具体例としては、例えば、1分子中に少なくとも1個以上のエポキシ基を有するエポキシ化合物〔例えば、ビスフェノール型エポキシ樹脂(例えば、ビスフェノールA、ビスフェノールF、ビスフェノールSおよびテトラビスフェノールAなどのビスフェノール類とエピクロルヒドリンおよび/またはメチルエピクロルヒドリンとを反応させて得られるものや、ビスフェノールAジグリシジルエーテルや、ビスフェノールFジグリシジルエーテルと前記ビスフェノール類の縮合物とエピクロルヒドリンとを反応させ得られるもの等)、ノボラック型エポキシ樹脂(例えば、フェノール、クレゾール、ハロゲン化フェノール、およびアルキルフェノールなどのフェノール類とホルムアルデヒドとを酸性触媒下で反応し得られるノボラック類とエピクロルヒドリンとを反応して得られるもの等)、トリフェノールメタン型エポキシ樹脂(例えば、トリスフェノールメタン、トリスクレゾールメタン等とエピクールヒドリンを反応させて得られるもの等)、脂環式エポキシ樹脂(例えば、3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート、ビス(3,4−エポキシシクロヘキシル)アジペート、ビニルシクロヘキセンジオキサイド、ポリブタジエンエポキシ変性物等。市販品としては、例えば、ダイセル化学工業(株)製、セロキサイド3000、セロキサイドEHPE−3150、日本曹達(株)製、EPB−13、EPB−27等。)共重合型エポキシ樹脂(例えば、グリシジルメタクリレートとスチレンの共重合体、グリシジルメタクリレートとスチレンとメチルメタクリレートの共重合体等。日本油脂(株)製、CP−50M、CP−50S等。)脂肪族エポキシ樹脂(例えば、トリメチロールプロパントリグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテル、ビスフェノールAジプロポキシジグリシジルエーテル、2,2−ジブロモネオペンチルグリコールジグリシジルエーテル等)等を挙げることができる。あるいは、テトラエチレングリコールジビニルエーテル等のビニルエーテル化合物等を挙げることができる。
次に、本発明で使用する光カチオン重合開始剤(D)の具体例としては、例えば、トリフェニルスルホニウム6フッ化アンチモネート、トリフェニルスルホニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロアンチモネート、ジフェニル−4−チオフェノキシフェニルスルホニウムヘキサフルオロアンチモネート、4,4′−ビス〔ビス(p−2−ヒドロキシエトキシフェニル)スルホニオ〕フェニルスルフィドビスヘキサフルオロアンチモネート(旭電化工業(株)製、アデカオプトマーSP−170、プロピレンカーボネート50%希釈品)等を挙げることかできる。
【0012】
本発明に使用される各成分の使用割合は、(A)成分は10〜90重量%が好ましく、特に好ましくは30〜70重量%である。(B)成分は、0.1〜10重量%が好ましく、特に好ましくは1〜5重量%である。(C)成分は、10〜90重量%が好ましく、特に好ましくは30〜70重量%である。(D)成分は、0.05〜5重量%が好ましく、特に好ましくは、0.5〜3重量%である。
【0013】
本発明の樹脂組成物は、前記成分以外に離型剤、消泡剤、レベリング剤、光安定剤(例えば、ビンダードアミン等)、酸化防止剤、重合禁止剤、帯電防止剤等を併用することができる。
本発明の樹脂組成物は各成分を混合、溶解することにより得ることができる。本発明の樹脂組成物はフレネルレンズ、レンチキュラーレンズ等の透過スクリーン用として特に有用であるが、その他に各種コーティング剤、ポッティング剤、接着剤等に有用でけある。
【0014】
本発明の樹脂組成物の硬化物は常法に従い本樹脂組成物に紫外線を照射することにより得ることができる。具体的には、本発明の樹脂組成物を、例えは、フレネルレンズ又はレンチキュラーレンズの形状を有するスタンパー上に塗布し、該樹脂組成物の層を設け、その層の上に硬質透明基板(例えば、ポリ塩化ビニル、ポリスチレン、ポリカーボネート、ポリ(メタ)アクリレート、ポリエステル或は、これらポリマーのブレンド品等からなる透明基板等)を接着させ、次いでその状態で該硬質透明基板側から高圧水銀灯やメタルハライドランプ等により、紫外線を照射して該樹脂組成物を硬化させて後、該スタンパーから剥離する。この様にして通常屈折率(23℃)が1.53以上、好ましい条件下では1.55以上を有する軟質なフレネルレンズ或はレンチキュラーレンズ等の透過スクリーンが得られる。
【0015】
【実施例】
次に、実施例により本発明をさらに具体的に説明する。実施例中の評価は次の方法で行った。
なお、合成例中の部は重量部を示す。
(1)離型性:硬化した樹脂を金型より離型させる時の難易
○・・・・金型からの離型性が良好
△・・・・離型がやや困難
×・・・・離型が困難或は型のこりがある
(2)型再現性:硬化した樹脂層の表面形状と金型の表面形状を観察した。
○・・・・再現性良好
×・・・・再現性が不良
【0016】
(3)復元性:樹脂組成物を用いて製造したフレネルレンズに直径10mmの金属丸棒を強く押しつけた後、レンズについた丸棒の跡が完全に消失するまでの時間を測定した。
◎・・・・瞬時に消失する
○・・・・60秒以内に消失した
△・・・・60秒から60分の間に消失した
×・・・・消失しない
【0017】
(4)耐擦傷性:樹脂組成物を用いて製造したフレネルレンズにアクリル板(幅15mm、長さ100mm、厚さ2mm)を垂直に強く押しつけながら長さ100mmの間隔を1往復1秒のスピードで10往復させた後、レンズ表面についた傷を観察する。
◎・・・・傷がまったく認められない
○・・・・スジ状の傷が数本認められる
△・・・・部分的に帯状の傷が認められる
×・・・・全面的に帯状の傷が認められる
【0018】
(5)密着性:硬質透明基板上に樹脂組成物をコートする(幅20mm、長さ150mm、膜厚200μm)次に高圧水銀灯(80W/cm、オゾンレス)で500mJ/cm2照射を行い硬化を行った。次いで引張試験機で硬質透明基板上で硬化した樹脂の90度剥離強度を測定した。(剥離スピード、100mm/分)
◎・・・・剥離強度 2kg/cm 以上
○・・・・剥離強度 1〜2kg/cm
△・・・・剥離強度 0.5〜1kg/cm
×・・・・剥離強度 0.5kg/cm 以下
(6)屈折率(23℃):樹脂組成物及びその硬化物の屈折率(23℃)を測定した。
【0019】
ウレタン(メタ)アクリレート(A)の合成例
合成例1
ポリエステルジオール(3−メチル−1,5−ペンタンジオールとテレフタル酸のポリエステルジオール、分子量1000、OH価、112.2)500部、トリレンジイソシアネート174部を仕込み、昇温後80℃で10時間反応させ、次いで2−ヒドロキシエチルアクリレート121部、メトキノン0.4部を仕込み、80℃で10時間反応を行いウレタンアクリレートを得た。屈折率(23℃)は1.5551であった。
【0020】
合成例2
ビスフェノールAのエチレンオキサイド付加物(分子量668、OH価168)668部、トリレンジイソシアネート348部を仕込み、昇温後80℃で10時間反応させ、次いで2−ヒドロキシエチルアクリレート243.6部、メトキノン0.6部を仕込み、80℃で10時間反応を行いウレタンアクリレートを得た。屈折率(23℃)は1.5535であった。
【0021】
実施例1〜2、参考例1〜2、比較例1〜2
表1に示すような組成(数値は重量部を示す。)の樹脂組成物をフレネルレンズ金型と厚さ2.5mmのポリスチレン含有ポリメタクリル樹脂板との間に注入し、常法により紫外線を照射して硬化させフレネルレンズを得た。
【0022】
【表1】
表1
実施例 参考例 比較例
1 2 1 2 1 2
(A)成分
合成例1で得たウレタンアクリレート 10
合成例2で得たウレタンアクリレート 5 5
KAYARAD R−310 *1 10 15 10
フェノキシエチルアクリレート 20 20 20 20 20
KAYARAD R−128H *2 30 35 30 30 30
(B)成分
イルガキュアー184 *3 3 3 3 3 3
(C)成分
ビスフェノールAジグリシジルエーテル 35 20 35 40 40
ビス(3,4−エポキシシクロヘキシル)
アジペート 10 5 10 10
(D)成分
アデカオプトマー SP−170 *4 1 1 1 1 1
その他
LA−82 *5 0.5 0.5 0.5 0.5 0.5
離型性 ○ ○ ○ ○ × ○
型再現性 ○ ○ ○ ○ ○ ○
復元性 ◎ ◎ ◎ ◎ ○ ×
密着性 ◎ ◎ ◎ ◎ ○ ×
耐擦傷性 ◎ ◎ ◎ ◎ × ○
硬化物の屈折率(25℃) 1.560 1.550 1.562 1.571 1.545 1.575
【0023】
【0024】
表1から明らかなように、本発明の樹脂組成物の硬化物は、離型性、型再現性、耐擦傷性、密着性、復元性等に優れ、屈折率(25℃)は1.55以上の高屈折率であった。
【0025】
【発明の効果】
本発明の樹脂組成物の硬化物は、高屈折率で離型性、型再現性、耐擦傷性、密着性、復元性等に優れ、特にフレネルレンズ、レンチキュラーレンズ及びプリズムレンズに適している。[0001]
[Industrial application fields]
The present invention relates to an ultraviolet curable lens resin composition suitable for lenses such as a Fresnel lens, a lenticular lens, and a prism lens used in a video printer, a projection television, a liquid crystal display, and the like, and a cured product thereof.
[0002]
[Prior art]
Conventionally, this type of lens has been molded by a method such as a press method or a cast method. The former pressing method was poor in productivity because it was manufactured by heating, pressurizing and cooling cycles. In addition, the latter casting method has a problem that it takes a long time to produce a monomer and polymerizes it in a mold, and a large number of molds are required, resulting in an increase in manufacturing cost. In order to solve such problems, various proposals have been made for using an ultraviolet curable resin composition. (For example, JP 61-177215, JP 61-248707, JP 61-248708, JP 63-163330, JP 63-167301, JP 63-199302, JP 64-99 6935 etc.)
[0003]
[Problems to be solved by the invention]
The method for producing lenses by using these ultraviolet curable resin compositions has been somewhat successful. However, the adhesion to the substrate (for example, polyester sheet, polycarbonate sheet, polyacrylate and other resin mixture sheet, vinyl chloride sheet, etc.) is insufficient, and in some cases, the substrate is used after being primed. It is.
[0004]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present inventors have intensively researched and found that a cured resin is fast and the cured product is excellent in releasability and adhesion, and a soft resin composition is found to complete the present invention. It came to.
That is, the present invention
A lens resin composition comprising an ethylenically unsaturated group-containing compound (A), a radical photopolymerization initiator (B), a cationic polymerizable compound (C), and a cationic photopolymerization initiator (D), and It relates to the cured product.
[0005]
Specific examples of the ethylenically unsaturated group-containing compound (A) used in the present invention include, for example, urethane (meth) acrylate (for example, ethylene glycol, 1,4-butanediol, neopentyl glycol, polycaprolactone diol, polyethylene Polyols such as glycol, polyester diol, bisphenol A polyethoxydiol, bisphenol F polyethoxydiol, polycarbonate diol, and polytetramethylene glycol; and organic polyisocyanates such as hexamethylene diisocyanate, isophorone diisocyanate, tolylene diisocyanate, and xylylene diisocyanate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 1,4-butanediol mono (meth) And a reaction product of a hydroxyl group-containing ethylenically unsaturated compound such as acrylate.), Epoxy (meth) acrylate (for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol A, propylene oxide adduct And a reaction product of epoxy resin such as terminal glycidyl ether and (meth) acrylic acid.), Oligomers such as polyester polyacrylate, N-vinylcaprolactam, acryloylmorpholine, phenoxyethyl (meth) acrylate, phenoxy Ethyloxyethyl (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, o-phenylphenyloxyethyl (meth) acrylate, o-phenylphenyloxyethyl oxy Ethyl (meth) acrylate, o-phenylphenol polyethoxy (meth) acrylate, tribromophenyl (meth) acrylate, tribromophenyloxyethyl (meth) acrylate, tribromophenyloxyethyl (meth) acrylate, tribromobenzyl (meth) ) Acrylate, tetrabromobisphenol A polyethoxydi (meth) acrylate, bisphenol A diethoxydi (meth) acrylate, bisphenol A dipropoxydi (meth) acrylate, bisphenol A polyethoxydi (meth) acrylate, bisphenol A polypropoxydi (meth) acrylate, bisphenol F polyethoxydi (Meth) acrylate, diethylene glycol di (meth) acrylate, ethylene glycol di (meth) a Addition of ε-caprolactone to acrylate, 1,6-hexanediol di (meth) acrylate, nonanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and neopentyl glycol hydroxypivalate And reactive monomers such as di (meth) acrylate of the product.
[0006]
Preferred ethylenically unsaturated group-containing compounds (A) include phenoxyethyl acrylate, phenoxyethyloxyethyl acrylate, 2-hydroxy-3-phenyloxypropyl acrylate, tribromophenyl methacrylate, tribromophenyloxyethyl acrylate, o-phenyl. Examples include phenyloxyethyl acrylate, o-phenylphenol polyethoxy acrylate, bisphenol A polyethoxy diacrylate, bisphenol A polypropoxy diacrylate, bisphenol F polyethoxy diacrylate, urethane diacrylate, and bisphenol A type epoxy acrylate. .
As the radical photopolymerization initiator (B), for example,
[0007]
[Chemical 1]
[0008]
[Chemical formula 2]
[0009]
[Chemical 3]
[0010]
[Formula 4]
[0011]
Copolymerizable photo radical polymerization initiators such as benzoin, benzoin methyl ether, benzoin isopropyl ether, acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloro Acetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-methyl-1- [4- (methylthio) phenyl) -2-morpholinopropan-1-one N, N-dimethylaminoacetophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, 2-aminoanthraquinone, 2,4-dimethylthioxanthone 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, acetophenone dimethyl ketal, benzophenone, methylbenzophenone, 4,4'-dichlorobenzophenone, 4,4'-bisdiethylaminobenzophenone, Michler's ketone and the like. These can be used alone or in combination of two or more.
Further, known photosensitization such as N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, and triethanolamine-triethylamine together with such photo radical polymerization initiator (B). The agents can be used alone or in combination of two or more.
Specific examples of the cationically polymerizable compound (C) include, for example, an epoxy compound having at least one epoxy group in one molecule [for example, bisphenol type epoxy resin (for example, bisphenol A, bisphenol F, bisphenol S and tetra It can be obtained by reacting bisphenols such as bisphenol A with epichlorohydrin and / or methyl epichlorohydrin, or obtained by reacting bisphenol A diglycidyl ether, bisphenol F diglycidyl ether and a condensate of the above bisphenols with epichlorohydrin. Etc.), novolac-type epoxy resins (eg phenol, cresol, halogenated phenol, alkylphenol, etc.) Obtained by reacting novolaks obtained with epichlorohydrin), triphenolmethane type epoxy resins (for example, those obtained by reacting trisphenolmethane, tris-resolemethane, etc. with epicoolhydrin), Alicyclic epoxy resins (for example, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, bis (3,4-epoxycyclohexyl) adipate, vinylcyclohexene dioxide, polybutadiene epoxy modified products, etc.) For example, Daicel Chemical Industries, Ltd., Celoxide 3000, Celoxide EHPE-3150, Nippon Soda Co., Ltd., EPB-13, EPB-27, etc.) Copolymerization type epoxy resin (for example, glycidyl methacrylate and styrene) Polymers, copolymers of glycidyl methacrylate, styrene and methyl methacrylate, etc., manufactured by NOF Corporation, CP-50M, CP-50S, etc.) Aliphatic epoxy resins (eg, trimethylolpropane triglycidyl ether, neopentyl glycol) Diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, bisphenol A dipropoxy diglycidyl ether, 2,2-dibromoneopentyl glycol diglycidyl ether, and the like. Alternatively, vinyl ether compounds such as tetraethylene glycol divinyl ether can be used.
Next, specific examples of the photocationic polymerization initiator (D) used in the present invention include, for example, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, and diphenyl-4. -Thiophenoxyphenylsulfonium hexafluoroantimonate, 4,4'-bis [bis (p-2-hydroxyethoxyphenyl) sulfonio] phenyl sulfide bishexafluoroantimonate (Adeka optomer SP-, manufactured by Asahi Denka Kogyo Co., Ltd.) 170, 50% propylene carbonate diluted product).
[0012]
The proportion of each component used in the present invention is preferably 10 to 90% by weight, particularly preferably 30 to 70% by weight, as the component (A). The component (B) is preferably 0.1 to 10% by weight, particularly preferably 1 to 5% by weight. The component (C) is preferably 10 to 90% by weight, particularly preferably 30 to 70% by weight. The component (D) is preferably 0.05 to 5% by weight, particularly preferably 0.5 to 3% by weight.
[0013]
In the resin composition of the present invention, a release agent, an antifoaming agent, a leveling agent, a light stabilizer (for example, a binder amine), an antioxidant, a polymerization inhibitor, an antistatic agent, and the like are used in addition to the above components. be able to.
The resin composition of the present invention can be obtained by mixing and dissolving each component. The resin composition of the present invention is particularly useful for transmission screens such as Fresnel lenses and lenticular lenses, but is also useful for various coating agents, potting agents, adhesives and the like.
[0014]
The cured product of the resin composition of the present invention can be obtained by irradiating the resin composition with ultraviolet rays according to a conventional method. Specifically, for example, the resin composition of the present invention is applied onto a stamper having the shape of a Fresnel lens or a lenticular lens, a layer of the resin composition is provided, and a hard transparent substrate (for example, , Polyvinyl chloride, polystyrene, polycarbonate, poly (meth) acrylate, polyester, or a transparent substrate made of a blend of these polymers, etc.), and in that state, from the side of the rigid transparent substrate, a high-pressure mercury lamp or metal halide lamp The resin composition is cured by irradiating ultraviolet rays, etc., and then peeled off from the stamper. In this way, a transmission screen such as a soft Fresnel lens or a lenticular lens having a normal refractive index (23 ° C.) of 1.53 or more, and preferably 1.55 or more under preferable conditions is obtained.
[0015]
【Example】
Next, the present invention will be described more specifically with reference to examples. Evaluation in the examples was performed by the following method.
In addition, the part in a synthesis example shows a weight part.
(1) Release property: Difficulty when releasing the cured resin from the mold ○ ························································· (2) Mold reproducibility: The surface shape of the cured resin layer and the surface shape of the mold were observed.
○ ... Good reproducibility × ... Poor reproducibility [0016]
(3) Restorability: After a metal round bar having a diameter of 10 mm was strongly pressed against a Fresnel lens manufactured using the resin composition, the time until the trace of the round bar on the lens completely disappeared was measured.
◎ ... disappears instantaneously ...... disappears within 60 seconds? ... disappears between 60 seconds and 60 minutes.
(4) Scratch resistance: A speed of one reciprocation 1 second with an interval of 100 mm in length while pressing an acrylic plate (width 15 mm, length 100 mm, thickness 2 mm) vertically against a Fresnel lens manufactured using a resin composition. After 10 reciprocations, the scratches on the lens surface are observed.
◎ ・ ・ ・ ・ No scratches are recognized ○ ・ ・ ・ ・ Several stripe-like scratches are observed Δ ・ ・ ・ ・ Strip-like scratches are partially recognized × ・ ・ ・ ・ Fully strip-like scratches [0018]
(5) Adhesion: A resin composition is coated on a hard transparent substrate (width 20 mm, length 150 mm, film thickness 200 μm), and then cured by irradiation with a high-pressure mercury lamp (80 W / cm, ozone-less) at 500 mJ / cm 2. went. Next, the 90-degree peel strength of the resin cured on the hard transparent substrate was measured with a tensile tester. (Peeling speed, 100mm / min)
◎ ・ ・ ・ ・ Peel strength 2kg / cm or more ○ ・ ・ ・ ・ Peel strength 1-2kg / cm
△ ・ ・ ・ ・ Peel strength 0.5 ~ 1kg / cm
× ··· Peel strength 0.5 kg / cm or less (6) Refractive index (23 ° C.): The refractive index (23 ° C.) of the resin composition and its cured product was measured.
[0019]
Synthesis example of urethane (meth) acrylate (A) Synthesis example 1
500 parts of polyester diol (polyester diol of 3-methyl-1,5-pentanediol and terephthalic acid, molecular weight 1000, OH number, 112.2) and 174 parts of tolylene diisocyanate were charged and reacted at 80 ° C. for 10 hours after temperature rise. Then, 121 parts of 2-hydroxyethyl acrylate and 0.4 part of methoquinone were added and reacted at 80 ° C. for 10 hours to obtain urethane acrylate. The refractive index (23 ° C.) was 1.5551.
[0020]
Synthesis example 2
668 parts of ethylene oxide adduct of bisphenol A (molecular weight: 668, OH number: 168) and 348 parts of tolylene diisocyanate were charged, reacted at 80 ° C. for 10 hours after temperature rising, and then 243.6 parts of 2-hydroxyethyl acrylate, methoquinone 0 .6 parts were charged and reacted at 80 ° C. for 10 hours to obtain urethane acrylate. The refractive index (23 ° C.) was 1.5535.
[0021]
Examples 1-2, Reference Examples 1-2, Comparative Examples 1-2
A resin composition having a composition as shown in Table 1 (the numerical value indicates parts by weight) is injected between a Fresnel lens mold and a polystyrene-containing polymethacrylic resin plate having a thickness of 2.5 mm, and ultraviolet rays are emitted in a conventional manner. It was irradiated and cured to obtain a Fresnel lens.
[0022]
[Table 1]
Table 1
Examples Reference examples Comparative examples
1 2 1 2 1 2
(A) Urethane acrylate obtained in Component Synthesis Example 1 10
Urethane acrylate obtained in Synthesis Example 2 5 5
KAYARAD R-310 * 1 10 15 10
Phenoxyethyl acrylate 20 20 20 20 20
KAYARAD R-128H * 2 30 35 30 30 30
(B) Component Irgacure 184 * 3 3 3 3 3 3
(C) Component bisphenol A diglycidyl ether 35 20 35 40 40
Bis (3,4-epoxycyclohexyl)
Adipate 10 5 10 10
(D) Component Adekaoptomer SP-170 * 4 1 1 1 1 1
Other LA-82 * 5 0.5 0.5 0.5 0.5 0.5
Releasability ○ ○ ○ ○ × ○
Mold reproducibility ○ ○ ○ ○ ○ ○
Restorability ◎ ◎ ◎ ◎ ○ ×
Adhesion ◎ ◎ ◎ ◎ ○ ×
Scratch resistance ◎ ◎ ◎ ◎ × ○
Refractive index of cured product (25 ° C) 1.560 1.550 1.562 1.571 1.545 1.575
[0023]
[0024]
As is apparent from Table 1, the cured product of the resin composition of the present invention is excellent in releasability, mold reproducibility, scratch resistance, adhesion, restoration, etc., and the refractive index (25 ° C.) is 1.55. It was the above high refractive index.
[0025]
【The invention's effect】
The cured product of the resin composition of the present invention has a high refractive index and is excellent in releasability, mold reproducibility, scratch resistance, adhesion, resilience and the like, and is particularly suitable for Fresnel lenses, lenticular lenses and prism lenses.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09201095A JP3695664B2 (en) | 1995-03-27 | 1995-03-27 | Lens resin composition and cured product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09201095A JP3695664B2 (en) | 1995-03-27 | 1995-03-27 | Lens resin composition and cured product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08259649A JPH08259649A (en) | 1996-10-08 |
| JP3695664B2 true JP3695664B2 (en) | 2005-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09201095A Expired - Fee Related JP3695664B2 (en) | 1995-03-27 | 1995-03-27 | Lens resin composition and cured product thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4635756B2 (en) * | 2005-07-14 | 2011-02-23 | Jsr株式会社 | Method for forming optical member |
| JP2008007694A (en) * | 2006-06-30 | 2008-01-17 | Sanyo Chem Ind Ltd | Photosensitive composition for adhesive agent |
| JP5088945B2 (en) * | 2007-08-31 | 2012-12-05 | 日本化薬株式会社 | Optical energy ray curable resin composition and cured product thereof |
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| Publication number | Publication date |
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| JPH08259649A (en) | 1996-10-08 |
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