JP3697135B2 - Glazed insulating substrate, collective insulating substrate, manufacturing method thereof, chip-type fuse and fuse resistor - Google Patents
Glazed insulating substrate, collective insulating substrate, manufacturing method thereof, chip-type fuse and fuse resistor Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は、小型のチップ型電子部品等に使用され、レーザー光照射による基板の分割溝刻設を可能にすると共に、グレーズ層における平滑性を確保したグレーズド絶縁基板、該グレーズド絶縁基板を製造するための集合絶縁基板、その製造方法及び該グレーズド絶縁基板を備えたチップ型ヒューズ又はヒューズ抵抗器に関する。
【０００２】
【従来の技術】
従来、チップ型ヒューズ又はヒューズ抵抗器等の表面実装型の電子部品においては、ヒューズ膜やヒューズ抵抗膜等の機能を十分確保するために、セラミック等の絶縁基板の表面上に特定な物性値を有するガラスペーストを印刷・乾燥及び焼成した透明なグレーズ層を形成することが提案され、実施されている(特開平８−３１３００号公報等)。
このグレーズ層は、絶縁基板の表面の粗さを平滑にし、ヒューズ膜やヒューズ抵抗膜の形成厚さを均一化することを容易にすると共に、使用時におけるこれらの膜に対する熱等による影響を抑制し、電気的信頼性を確保するため等に作用する。
一方、電子部品に使用されるセラミック基板は、通常、多数の絶縁基板の単位を有する一枚の絶縁板に、個々の基板単位に分割するための縦横分割溝を形成する工程が行なわれる。
このような分割溝は、通常、ダイヤモンドブレードによる回転刃によって形成されている。しかし、この方法では、分割溝の仕上がり形状のばらつき抑制や、分割精度を十分に確保するために複雑な作業や管理が必要である。
そこで、最近、レーザー光照射による分割溝の形成が提案されている(特開平８−１０７２５５号)。また、レーザー光照射適性を確保するために、基板表面を黒色化することも提案されている(特開昭５３−７６３７３号公報、特開昭５４−１２０４９８号公報)。
しかし、実際の工業的レベルにおいては、グレーズ層が形成されたセラミック基板におけるレーザー光照射によって分割溝を形成する技術は確立されておらず、ダイヤモンドブレード等の従来技術により実施されているのが実状である。
【０００３】
【発明が解決しようとする課題】
レーザー光照射適性を確保するために透明なグレーズ層を黒色化することは、例えば、黒色顔料等をグレーズ層に含有させることにより可能である。しかし、レーザー光照射適性を確保する程度に黒色顔料を含有させた場合、通常、グレーズ層の平滑性が確保できず、グレーズ層の機能が得られない。逆に、グレーズ層の平滑性を確保する程度に黒色顔料の含有割合を低減すると、通常、レーザー光照射適性が得られない。例えば、特開平５−１４８０６５号公報において、セラミック基板の検査を目的とした、透明なグレーズ層を着色したグレーズドセラミック基板が提案されており、着色成分として、Ｃｅ、Ｔｉ、Ｆｅ、Ｎｉ、Ｖ、Ｍｎ、Ｃｒ、Ｃｏ、Ｃｕの単体又は酸化物の少なくとも１種を、グレーズ層中のガラス質１００重量％に対して０．１〜０．５重量％添加することが記載されている。しかし、このような着色成分の添加量では、セラミック基板の検査は可能であっても、レーザー光照射適性は全く得られない。
ところで、グレーズ層を有する集合絶縁基板に縦横分割溝を形成するに際しては、例えば、絶縁板にグレーズ層を形成する前に該絶縁板の一方の面に予め縦横分割溝を形成し、次いで、他方の面にグレーズ層を形成する方法も提案されている。しかし、このような方法では、グレーズ層形成時における焼成によって、絶縁板自体が湾曲し、グレーズ層の膜厚を均一化することが困難となる。しかも、形成された分割溝に沿って分割作業を行なう際に、分割溝を有していないグレーズ層が、所定箇所で分割せず、破損する可能性が高くなる。
従って、グレーズ層を有する集合絶縁基板に縦横分割溝を形成する場合には、絶縁板にグレーズ層を形成した後に、該グレーズ層が形成された面側に分割溝を形成することが望ましく、このような分割溝の形成を容易に実施しうる、レーザー光照射適性を有し、且つ平滑性に優れたグレーズ層を有する絶縁基板の開発が望まれている。
【０００４】
本発明の目的は、レーザー光照射適性を備え、かつグレーズ層としての平滑性が確保されたグレーズ層を有する集合絶縁基板を提供することにある。
本発明の別の目的は、グレーズ層を有する集合絶縁基板のグレーズ層側に、容易に縦横分割溝が形成でき、グレーズド絶縁基板の大量生産に有効な集合絶縁基板の製造方法を提供することにある。
本発明の他の目的は、チップ型ヒューズやヒューズ抵抗器等の表面実装型の電子部品に有効なグレーズド絶縁基板を提供することにある。
本発明の更に別の目的は、ヒューズ膜やヒューズ抵抗膜の特性が十分に引出されうるチップ型ヒューズ又はヒューズ抵抗器を提供することにある。
【０００５】
【課題を解決するための手段】
本発明者らは、上記課題を解決するため鋭意検討を重ねた結果、特定の黒色無機顔料の組合せ、並びにその特定の配合割合を制御することにより、従来達成されていない、レーザー光照射適性を確保すると共に、グレーズ層としての平滑特性をも確保しうることを見出し本発明を完成した。更に、グレーズ層を形成するガラスとして、グレーズ層の物性値が特定なものとなるように制御しうるガラスと黒色無機顔料とを選択することにより、また、特定の黒色無機顔料同士の配合割合を制御することにより、優れたレーザー光照射適性を確保すると共に、グレーズ層としての平滑特性をも確保し、更に、ヒューズ又はヒューズ抵抗器における、安定な溶断特性機能や電気的信頼性が確保しうることを見出し本発明を完成した。
【０００６】
すなわち、本発明によれば、絶縁基板と、該絶縁基板表面に形成されるグレーズ層とを備え、該グレーズ層がガラス及びスピネル構造を有する黒色無機顔料を含み、グレーズ層中の該黒色無機顔料の含有割合が、ガラス１００質量部に対して７．５〜１２．５質量部の割合であり、かつ該黒色無機顔料がＦｅ2Ｏ3、Ｃｒ2Ｏ3及びＣｏＯから実質的になることを特徴とするグレーズド絶縁基板が提供される。
また本発明によれば、絶縁基板と、該絶縁基板表面に形成されるグレーズ層とを備えるグレーズド絶縁基板からなり、該グレーズド絶縁基板のグレーズ層が設けられた面上に、縦横分割溝を形成した集合絶縁基板であって、該グレーズ層がガラス及びスピネル構造を有する黒色無機顔料を含み、グレーズ層中の該黒色無機顔料の含有割合が、ガラス１００質量部に対して７．５〜１２．５質量部の割合であり、該黒色無機顔料がＦｅ 2 Ｏ 3 、Ｃｒ 2 Ｏ 3 及びＣｏＯから実質的になり、且つ前記分割溝が、前記グレーズ層から前記絶縁基板にまで達していることを特徴とする集合絶縁基板が提供される。
更に本発明によれば、上記集合絶縁基板の製造方法であって、絶縁板の表面にグレーズ層を形成する工程と、形成されたグレーズ層にレーザー光を照射して、格子状の縦横分割溝を形成する工程とを含み、該グレーズ層がガラス及びスピネル構造を有する黒色無機顔料を含み、グレーズ層中の該黒色無機顔料の含有割合が、ガラス１００質量部に対して７．５〜１２．５質量部の範囲であり、かつ該黒色無機顔料がＦｅ2Ｏ3、Ｃｒ2Ｏ3及びＣｏＯから実質的になることを特徴とする集合絶縁基板の製造方法が提供される。
更にまた本発明によれば、上記グレーズド絶縁基板を備えるチップ型ヒューズ又はヒューズ抵抗器が提供される。
【０００７】
【発明の実施の形態】
以下本発明を更に詳細に説明する。
本発明のグレーズド絶縁基板は、絶縁基板と、該絶縁基板表面に形成されるグレーズ層とを備える。
前記絶縁基板としては、例えば、純度約９６％等のアルミナセラミック基板、ＭｇＯ・ＳｉＯ2を主成分とするステアタイトセラミック基板、２ＭｇＯ・ＳｉＯ2を主成分とするフォルステライトセラミック基板、ＢｅＯを主成分とするベリリアセラミック基板等が挙げられる。
【０００８】
前記グレーズ層は、ガラス及びスピネル構造を有する黒色無機顔料を含むが、本発明の目的が達成されるものであれば、他の成分が含まれていても良い。
前記ガラスとしては、通常、グレーズ層に使用されるガラスであれば特に限定されないが、例えば、ヒューズ又はヒューズ抵抗器を目的とする場合等において、安定な溶断特性機能や他の電気的特性における信頼性を向上させ、過負荷通電時における熱放散及び蓄熱バランス等好適なものとするために、後述する黒色無機顔料との組合せにおいて得られるグレーズ層の物性値が、ガラス軟化点が９１５〜９３５℃、ガラス転移点が７５０〜７８０℃、熱膨張係数が６２×１０-7〜６８×１０-7となるようなガラスを選択して使用することが好ましく、特に、これらの物性を有し、且つ熱伝導率が２×１０-3ｃａｌ／ｃｍ・ｓｅｃ・℃となるようなグレーズ層を形成しうるガラスを選択して使用することが好ましい。
【０００９】
前記スピネル構造を有する黒色無機顔料は、Ｆｅ2Ｏ3、Ｃｒ2Ｏ3及びＣｏＯから実質的になり、また、所望に応じてＮｉＯ等を含んでいても良い。前記必須３成分のうち１成分が含有されない場合は、レーザー光照射適性と、グレーズ層としての平滑特性とがバランス良く得られず、本発明の目的が達成できない。これら３成分の好ましい配合割合は、黒色無機顔料中のＦｅ2Ｏ3の含有割合が４３〜４８質量％、Ｃｒ2Ｏ3の含有割合が２６〜３０質量％及びＣｏＯの含有割合が２４〜２８質量％である。
また、これら黒色無機顔料のグレーズ層中の含有割合は、ガラス１００質量部に対して７．５〜１２．５質量部の割合とする必要がある。７．５質量部未満では、所望のレーザー光照射適性が得られず、また、基板にうねりが生じる場合がある。一方、１２．５質量部を超える場合には、グレーズ層にポーラスが発生し所望の平滑性が得られ難い。
【００１０】
本発明の集合絶縁基板は、グレーズド絶縁基板が縦横に多数一体的に形成された、上記グレーズド絶縁基板を製造するためのものであって、絶縁板上に少なくとも上記本発明のグレーズド絶縁基板において説明したグレーズ層を有する。そして、各々のグレーズド絶縁基板を分割するための分割溝が、グレーズ層が設けられた面上に縦横に備えられている。この集合絶縁基板は、公知の方法により形成された分割溝に沿って分割することにより、上述の本発明のグレーズド絶縁基板を得ることができる。
【００１１】
本発明の集合絶縁基板の製造方法では、まず、絶縁板の表面にグレーズ層を形成する工程を行なう。絶縁板の材料としては、前述の絶縁基板において例示した基板の材料等が挙げられる。
絶縁板にグレーズ層を形成するには、上記黒色無機顔料及びガラスを含むガラスペーストを、常法に従い、スクリーン印刷等により所定位置に印刷し、乾燥、焼成することにより実施できる。この際、印刷、乾燥及び焼成は、得られるグレーズ層の膜厚が、５０〜８０μｍになるように行なうことが望ましい。また、焼成は、絶縁板の変形等が生じないように、１２００〜１３００℃で約３０分間程度の条件が好ましい。
更に、本発明においては、このグレーズ層形成前に分割溝が形成されていないので、昇温及び降温時間等を適宜設定することにより容易に絶縁板の変形等を抑制することができる。例えば、グレーズ層を焼成するために、まず１０００℃まで毎分２０℃の割合で温度上昇させ、次いで、１３００℃に達するまで毎分５℃の割合で温度上昇させ、１３００℃で３０分間程度焼成した後、常温まで毎分２０℃程度で降温させる条件等が挙げられる。
【００１２】
本発明の集合絶縁基板の製造方法では、前記形成されたグレーズ層にレーザー光を照射して、格子状の縦横分割溝を形成する工程を行なう。
レーザー光としては、例えば、８Ｗ以上、好ましくは８〜１０Ｗの出力を有するＹＡＧレーザー光等が使用できる。レーザー光照射は、所望の分割が可能となるように、格子状の縦横分割溝の深さや幅を適宜選択し、所望の条件を設定して実施すれば良い。前述のとおり、レーザー光を照射するグレーズ層は、レーザー光照射適性を有するように形成されているので、この条件の設定は容易に適宜選択できる。
本発明の集合絶縁基板の製造方法では、上記工程が含まれておれば、通常、目的とする基板の種類等に応じて行なう他の工程を含んでいても良い。また、得られた集合絶縁基板は、常法により分割して本発明のグレーズド絶縁基板とすることができる。
【００１３】
本発明のチップ型ヒューズ又はヒューズ抵抗器は、本発明のグレーズド絶縁基板に、ヒューズ膜又はヒューズ抵抗膜が形成されたものであれば良く、電極、保護コート膜等の他の構成要件における、材料の種類、形態等は特に限定されず、所望の性能を得るために適宜選択することができる。
本発明のチップ型ヒューズ又はヒューズ抵抗器は、良好な平滑性及び熱安定性等を有するグレーズ層が形成された基板を用いているので、各膜の特性を十分発揮させることができる。
【００１４】
【実施例】
以下本発明を実施例及び比較例により更に詳細に説明するが、本発明はこれらに限定されるものではない。
実施例１〜３、比較例１〜３
ＳｉＯ2５５質量％、Ａｌ2Ｏ3２３質量％、ＣａＯ１６質量％及びＭｇＯ６質量％からなるガラス質成分１００質量部に対して、表１に示す黒色無機顔料を６．０〜１４．０質量部配合し、常法により溶剤及び有機質ビヒクルを添加混合してそれぞれガラスグレーズペーストを調製した。
得られた各々のガラスグレーズペーストを、厚さ０．３２ｍｍ、純度約９６％のアルミナセラミック板上に、常法によりスクリーン印刷し、乾燥し、１３００℃で３０分間焼成することによって、膜厚約７０μｍのグレーズ層を有する集合絶縁基板を作製した。なお、それぞれのグレーズ層は、焼成により、ガラス質と黒色無機材料とが略原料の配合割合で含まれるものであった。更に、得られたそれぞれのグレーズ層のガラス軟化点は９１５〜９３５℃、ガラス転移点は７５０〜７８０℃、熱膨張係数は６２×１０-7〜６８×１０-7の範囲のものであった。
次いで、日本電気社製ＹＡＧレーザ発振器ＳＬ１１６Ｅを備えたＳＬ４１１Ｂのレーザースクライパー装置を用いて、出力８Ｗ、周波数１４ＫＨｚ、スピード２５ｍｍ／ｓｅｃで、それぞれの集合絶縁基板に対し、グレーズ膜上に同一条件で３回スキャンを行ない格子状の縦横分割溝を形成した。
【００１５】
得られた分割溝を有する集合絶縁基板に対して以下に示す評価を行なった。結果を表１に示す。
＜グレーズ層の表面粗さ及びうねり評価＞
(株)東京精密製の表面粗さ計(サーフコム２０２Ｂ)を用いて測定した。表面粗さの評価は、グレーズ層の表面粗さが０．０３μｍ以下であったものを◯、１μｍを超えるものを×とした。うねり評価は、グレーズ層表面うねりが、０．２ｍｍ／４５ｍｍ以下のものを◯、０．３ｍｍ／４５ｍｍを超えるものを×とした。
＜グレーズ層の熱伝導率測定>
真空理工(株)製のタイプＴＣ−３０００を用いてグレーズ層の熱伝導率を測定した。評価は、２×１０-3ｃａｌ／ｃｍ・ｓｅｃ・℃が確保されたものを◯、確保されなかったものを×とした。
＜分割溝及び分割適性評価＞
分割溝評価は、グレーズ層面に形成された分割溝の平均深さが０．１ｍｍ以上に達したものを◯、達していないものを×とした。また、分割適性評価は、分割溝に沿った機械的押圧によって分割面の仕上がり状態を目視で観察し、良好なものを◯、良好でないものを×とした。
【００１６】
【表１】
【発明の効果】
本発明の集合絶縁基板は、グレーズ層中に特定な組合せの黒色無機材料を特定量含むので、レーザー光照射適性と、グレーズ層としての平滑性とが確保され、しかもこのグレーズ層に分割溝を有するので、精度良く、グレーズド絶縁基板を得ることができる。
本発明の集合絶縁基板の製造方法では、前記レーザー光照射適性と、グレーズ層としての平滑性とが確保されたグレーズ層を容易に得ることができると共に、レーザー光により所望の分割溝を容易に形成でき、グレーズド絶縁基板の大量生産に有効な集合絶縁基板が得られる。
本発明のグレーズド絶縁基板は、上記グレーズ層を備えるので、チップ型ヒューズやヒューズ抵抗器等の表面実装型の電子部品に有用である。更にこの基板を用いた本発明のチップ型ヒューズ又はヒューズ抵抗器は、所望のヒューズ膜やヒューズ抵抗膜の特性を十分引出すことができる。[0001]
BACKGROUND OF THE INVENTION
INDUSTRIAL APPLICABILITY The present invention is used for a small chip-type electronic component or the like, and enables to divide a substrate into grooves by irradiating a laser beam, and to ensure a smoothness in a glazed layer, and to manufacture the glazed insulating substrate. The present invention relates to a collective insulating substrate, a manufacturing method thereof, and a chip-type fuse or fuse resistor including the glazed insulating substrate.
[0002]
[Prior art]
Conventionally, in surface-mounted electronic components such as chip-type fuses or fuse resistors, a specific physical property value is set on the surface of an insulating substrate such as a ceramic in order to sufficiently ensure the functions of a fuse film and a fuse resistance film. It has been proposed and practiced to form a transparent glaze layer obtained by printing, drying and firing a glass paste having a glass paste (JP-A-8-31300, etc.).
This glaze layer smoothes the surface roughness of the insulating substrate, makes it easy to uniformize the thickness of the fuse film and fuse resistance film, and suppresses the effects of heat on these films during use. And acts to ensure electrical reliability.
On the other hand, a ceramic substrate used for an electronic component is usually subjected to a process of forming vertical and horizontal dividing grooves for dividing each substrate into a single insulating plate having a number of insulating substrate units.
Such divided grooves are usually formed by a rotary blade using a diamond blade. However, this method requires complicated operations and management in order to suppress variation in the finished shape of the dividing grooves and to ensure sufficient division accuracy.
Therefore, recently, formation of a dividing groove by laser light irradiation has been proposed (Japanese Patent Laid-Open No. 8-107255). In order to ensure the suitability of laser beam irradiation, it has also been proposed to blacken the substrate surface (Japanese Patent Laid-Open Nos. 53-76373 and 54-120498).
However, at the actual industrial level, the technology for forming the dividing grooves by laser light irradiation on the ceramic substrate on which the glaze layer is formed has not been established, and the actual situation is that it is implemented by conventional techniques such as diamond blades. It is.
[0003]
[Problems to be solved by the invention]
In order to ensure laser beam irradiation suitability, the transparent glaze layer can be blackened by, for example, incorporating a black pigment or the like into the glaze layer. However, when a black pigment is contained to such an extent that laser beam irradiation suitability is ensured, normally the smoothness of the glaze layer cannot be ensured and the function of the glaze layer cannot be obtained. On the other hand, if the black pigment content is reduced to such an extent that the smoothness of the glaze layer is ensured, laser beam irradiation suitability cannot usually be obtained. For example, in Japanese Patent Laid-Open No. 5-148065, a glazed ceramic substrate in which a transparent glaze layer is colored for the purpose of inspecting a ceramic substrate is proposed, and Ce, Ti, Fe, Ni, V, It describes that at least one of Mn, Cr, Co, Cu alone or an oxide is added in an amount of 0.1 to 0.5% by weight with respect to 100% by weight of glass in the glaze layer. However, with such an added amount of the coloring component, even though the ceramic substrate can be inspected, suitability for laser light irradiation cannot be obtained at all.
By the way, when forming the vertical and horizontal division grooves on the collective insulating substrate having the glaze layer, for example, before forming the glaze layer on the insulating plate, the vertical and horizontal division grooves are formed in advance on one surface of the insulating plate, and then the other A method of forming a glaze layer on the surface has also been proposed. However, in such a method, the insulating plate itself is curved by baking at the time of forming the glaze layer, and it becomes difficult to make the film thickness of the glaze layer uniform. Moreover, when performing the dividing operation along the formed dividing grooves, the glaze layer that does not have the dividing grooves is not divided at a predetermined location, and the possibility of breakage increases.
Therefore, when forming the vertical and horizontal division grooves on the collective insulating substrate having the glaze layer, it is desirable to form the division grooves on the surface side on which the glaze layer is formed after forming the glaze layer on the insulating plate. It is desired to develop an insulating substrate having a glaze layer that can easily form such dividing grooves and that is suitable for laser light irradiation and has excellent smoothness.
[0004]
An object of the present invention is to provide a collective insulating substrate having a glaze layer that is suitable for laser light irradiation and has a smoothness as a glaze layer.
Another object of the present invention is to provide a method for manufacturing a collective insulating substrate that can easily form vertical and horizontal dividing grooves on the glaze layer side of the collective insulating substrate having a glaze layer, and is effective for mass production of a glazed insulating substrate. is there.
Another object of the present invention is to provide a glazed insulating substrate that is effective for surface-mount type electronic components such as chip-type fuses and fuse resistors.
Still another object of the present invention is to provide a chip-type fuse or a fuse resistor in which the characteristics of the fuse film and the fuse resistance film can be sufficiently extracted.
[0005]
[Means for Solving the Problems]
As a result of intensive studies to solve the above-mentioned problems, the present inventors have controlled the combination of specific black inorganic pigments, and the specific blending ratio thereof, thereby improving the laser beam irradiation aptitude that has not been achieved conventionally. The present invention has been completed by finding out that the smoothing characteristic as the glaze layer can be secured as well as securing. Furthermore, as the glass forming the glaze layer, by selecting a glass and black inorganic pigment that can be controlled so that the physical properties of the glaze layer are specific, the blending ratio between specific black inorganic pigments By controlling, it ensures excellent laser beam irradiation suitability, as well as smoothing characteristics as a glaze layer, and can also ensure stable fusing characteristics and electrical reliability in fuses or fuse resistors As a result, the present invention has been completed.
[0006]
That is, according to the present invention, the black inorganic pigment is provided with an insulating substrate and a glaze layer formed on the surface of the insulating substrate, the glaze layer including a black inorganic pigment having a glass and spinel structure, and the black inorganic pigment in the glaze layer Is contained in a ratio of 7.5 to 12.5 parts by mass with respect to 100 parts by mass of glass, and the black inorganic pigment is substantially composed of Fe 2 O 3 , Cr 2 O 3 and CoO. A featured glazed insulating substrate is provided.
Further, according to the present invention, the insulating substrate and a glaze insulating substrate comprising a glaze layer formed on the surface of the insulating substrate are formed, and vertical and horizontal dividing grooves are formed on the surface of the glaze insulating substrate provided with the glaze layer. The glaze layer includes a glass and a black inorganic pigment having a spinel structure, and the content ratio of the black inorganic pigment in the glaze layer is 7.5 to 12% with respect to 100 parts by mass of the glass. 5 mass parts, the black inorganic pigment is substantially composed of Fe 2 O 3 , Cr 2 O 3 and CoO, and the dividing groove reaches from the glaze layer to the insulating substrate. A featured aggregate insulating substrate is provided.
Furthermore, according to the present invention, there is provided a method for manufacturing the collective insulating substrate, comprising: forming a glaze layer on the surface of the insulating plate; and irradiating the formed glaze layer with laser light to form a lattice-like vertical and horizontal dividing groove The glaze layer includes a glass and a black inorganic pigment having a spinel structure, and the content ratio of the black inorganic pigment in the glaze layer is 7.5 to 12% with respect to 100 parts by mass of the glass. There is provided a method for producing a collective insulating substrate which is in the range of 5 parts by mass and wherein the black inorganic pigment is substantially composed of Fe 2 O 3 , Cr 2 O 3 and CoO.
Furthermore, according to the present invention, there is provided a chip-type fuse or a fuse resistor comprising the above glazed insulating substrate.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described in detail below.
The glazed insulating substrate of the present invention includes an insulating substrate and a glaze layer formed on the surface of the insulating substrate.
Wherein the insulating substrate is, for example, forsterite ceramic substrate for an alumina ceramic substrate of about 96%, etc. purity, steatite ceramic substrate composed mainly of MgO · SiO 2, the 2MgO · SiO 2 as a main component, the main component of the BeO And a beryllia ceramic substrate.
[0008]
Although the said glaze layer contains the black inorganic pigment which has glass and a spinel structure, if the objective of this invention is achieved, the other component may be contained.
The glass is not particularly limited as long as it is usually used for a glaze layer. For example, in the case where a fuse or a fuse resistor is used, a stable fusing characteristic function and reliability in other electrical characteristics are used. The properties of the glaze layer obtained in combination with a black inorganic pigment to be described later have a glass softening point of 915 to 935 ° C. It is preferable to select and use a glass having a glass transition point of 750 to 780 ° C. and a thermal expansion coefficient of 62 × 10 −7 to 68 × 10 −7, and in particular, has these physical properties, and It is preferable to select and use a glass capable of forming a glaze layer having a thermal conductivity of 2 × 10 −3 cal / cm · sec · ° C.
[0009]
The black inorganic pigment having a spinel structure is substantially composed of Fe 2 O 3 , Cr 2 O 3 and CoO, and may contain NiO or the like as desired. When one of the essential three components is not contained, the suitability for laser beam irradiation and the smoothing properties as the glaze layer cannot be obtained in a good balance, and the object of the present invention cannot be achieved. The preferable blending ratio of these three components is that the content ratio of Fe 2 O 3 in the black inorganic pigment is 43 to 48 mass%, the content ratio of Cr 2 O 3 is 26 to 30 mass%, and the content ratio of CoO is 24 to 28. % By mass.
Moreover, it is necessary to make the content rate in the glaze layer of these black inorganic pigments into the ratio of 7.5-12.5 mass parts with respect to 100 mass parts of glass. If the amount is less than 7.5 parts by mass, desired laser beam irradiation suitability cannot be obtained, and the substrate may be swelled. On the other hand, when it exceeds 12.5 parts by mass, a porous layer is generated in the glaze layer, and it is difficult to obtain desired smoothness.
[0010]
The collective insulating substrate of the present invention is for manufacturing the above-mentioned glazed insulating substrate in which a large number of glazed insulating substrates are integrally formed vertically and horizontally, and is described on at least the above-mentioned glazed insulating substrate of the present invention on the insulating plate. With a glaze layer. Dividing grooves for dividing each of the glazed insulating substrates are provided vertically and horizontally on the surface on which the glaze layer is provided. This aggregated insulating substrate can be divided along the dividing grooves formed by a known method to obtain the above-described glazed insulating substrate of the present invention.
[0011]
In the method for manufacturing a collective insulating substrate of the present invention, first, a step of forming a glaze layer on the surface of the insulating plate is performed. Examples of the material of the insulating plate include the material of the substrate exemplified in the above-described insulating substrate.
In order to form the glaze layer on the insulating plate, the glass paste containing the black inorganic pigment and glass can be printed at a predetermined position by screen printing or the like, dried and baked according to a conventional method. At this time, it is desirable to perform printing, drying and baking so that the thickness of the resulting glaze layer is 50 to 80 μm. The firing is preferably performed at 1200 to 1300 ° C. for about 30 minutes so that the insulating plate is not deformed.
Furthermore, in the present invention, since the dividing groove is not formed before the glaze layer is formed, deformation of the insulating plate can be easily suppressed by appropriately setting the temperature rise and temperature drop time. For example, in order to fire the glaze layer, the temperature is first increased to 1000 ° C. at a rate of 20 ° C. per minute, then the temperature is increased at a rate of 5 ° C. per minute until reaching 1300 ° C., and the firing is performed at 1300 ° C. for about 30 minutes. Then, the condition of lowering the temperature to about 20 ° C. per minute to room temperature can be mentioned.
[0012]
In the method for manufacturing a collective insulating substrate according to the present invention, a step of irradiating the formed glaze layer with a laser beam to form a grid-like vertical and horizontal dividing groove is performed.
As the laser light, for example, YAG laser light having an output of 8 W or more, preferably 8 to 10 W can be used. Laser light irradiation may be performed by appropriately selecting the depth and width of the grid-like vertical and horizontal dividing grooves and setting desired conditions so that the desired division is possible. As described above, since the glaze layer that irradiates laser light is formed so as to have suitability for laser light irradiation, the setting of this condition can be easily selected as appropriate.
In the method for manufacturing a collective insulating substrate of the present invention, as long as the above-described steps are included, other steps usually performed according to the type of the target substrate may be included. Further, the obtained collective insulating substrate can be divided by a conventional method to obtain the glazed insulating substrate of the present invention.
[0013]
The chip-type fuse or fuse resistor of the present invention may be any material as long as the fuse film or fuse resistance film is formed on the glazed insulating substrate of the present invention. There are no particular restrictions on the type, form, etc., and they can be selected as appropriate in order to obtain the desired performance.
Since the chip-type fuse or fuse resistor of the present invention uses a substrate on which a glaze layer having good smoothness and thermal stability is formed, the characteristics of each film can be sufficiently exhibited.
[0014]
【Example】
EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited to these.
Examples 1-3, Comparative Examples 1-3
The black inorganic pigment shown in Table 1 is 6.0 to 14.0 parts by mass with respect to 100 parts by mass of the vitreous component composed of 55% by mass of SiO 2, 23% by mass of Al 2 O 3 , 16% by mass of CaO and 6% by mass of MgO. A glass glaze paste was prepared by mixing and adding a solvent and an organic vehicle in a conventional manner.
Each of the obtained glass glaze pastes was screen-printed on an alumina ceramic plate having a thickness of 0.32 mm and a purity of about 96% by a conventional method, dried, and baked at 1300 ° C. for 30 minutes. A collective insulating substrate having a 70 μm glaze layer was produced. Each glaze layer contained a vitreous material and a black inorganic material in an approximately raw material mixing ratio by firing. Furthermore, each obtained glaze layer had a glass softening point of 915 to 935 ° C., a glass transition point of 750 to 780 ° C., and a thermal expansion coefficient of 62 × 10 −7 to 68 × 10 −7 . .
Next, using the SL411B laser scraper device equipped with YAG laser oscillator SL116E manufactured by NEC Corporation, the same conditions on the glaze film for each collective insulating substrate at an output of 8 W, a frequency of 14 KHz, and a speed of 25 mm / sec. Then, scanning was performed three times to form grid-like vertical and horizontal dividing grooves.
[0015]
The following evaluation was performed with respect to the collective insulating substrate having the obtained divided grooves. The results are shown in Table 1.
<Evaluation of surface roughness and waviness of glaze layer>
It was measured using a surface roughness meter (Surfcom 202B) manufactured by Tokyo Seimitsu Co., Ltd. For the evaluation of the surface roughness, the case where the surface roughness of the glaze layer was 0.03 μm or less was evaluated as ◯, and the case where the surface roughness exceeded 1 μm was evaluated as x. In the evaluation of waviness, the glaze layer surface waviness was evaluated as “◯” when the waviness was 0.2 mm / 45 mm or less, and “x” when the glaze layer surface exceeded 0.3 mm / 45 mm.
<Measurement of thermal conductivity of glaze layer>
The thermal conductivity of the glaze layer was measured using a type TC-3000 manufactured by Vacuum Riko Co., Ltd. In the evaluation, ◯ indicates that 2 × 10 −3 cal / cm · sec · ° C. was ensured, and x indicates that it was not ensured.
<Division groove and division suitability evaluation>
In the evaluation of the dividing groove, the case where the average depth of the dividing grooves formed on the glaze layer surface reached 0.1 mm or more was evaluated as ◯, and the case where the average depth was not reached was evaluated as x. In addition, the evaluation of split suitability was made by visually observing the finished state of the split surface by mechanical pressing along the split grooves.
[0016]
[Table 1]
【The invention's effect】
Since the aggregate insulating substrate of the present invention contains a specific amount of a specific combination of black inorganic materials in the glaze layer, the laser beam irradiation suitability and the smoothness as the glaze layer are ensured, and a split groove is formed in the glaze layer. Therefore, a glazed insulating substrate can be obtained with high accuracy.
According to the method for manufacturing a collective insulating substrate of the present invention, a glaze layer having the above laser beam irradiation suitability and smoothness as a glaze layer can be easily obtained, and a desired dividing groove can be easily formed by laser light. A collective insulating substrate that can be formed and is effective for mass production of a glazed insulating substrate is obtained.
Since the glazed insulating substrate of the present invention includes the glazed layer, it is useful for surface-mount electronic components such as chip-type fuses and fuse resistors. Furthermore, the chip-type fuse or fuse resistor of the present invention using this substrate can sufficiently bring out the desired characteristics of the fuse film or fuse resistance film.
Claims (8)
絶縁板の表面にグレーズ層を形成する工程と、形成されたグレーズ層にレーザー光を照射して、格子状の縦横分割溝を形成する工程とを含み、
該グレーズ層がガラス及びスピネル構造を有する黒色無機顔料を含み、グレーズ層中の該黒色無機顔料の含有割合が、ガラス１００質量部に対して７．５〜１２．５質量部の範囲であり、かつ該黒色無機顔料がＦｅ2Ｏ3、Ｃｒ2Ｏ3及びＣｏＯから実質的になることを特徴とする集合絶縁基板の製造方法。It is a manufacturing method of the collective insulation board according to claim 4,
Including a step of forming a glaze layer on the surface of the insulating plate, and a step of irradiating the formed glaze layer with laser light to form lattice-like vertical and horizontal division grooves,
The glaze layer contains glass and a black inorganic pigment having a spinel structure, and the content ratio of the black inorganic pigment in the glaze layer is in the range of 7.5 to 12.5 parts by mass with respect to 100 parts by mass of the glass, and method for producing set insulating substrate said black inorganic pigment is characterized by consisting essentially of Fe 2 O 3, Cr 2 O 3 , and CoO.
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| JP2000074292A JP3697135B2 (en) | 2000-03-16 | 2000-03-16 | Glazed insulating substrate, collective insulating substrate, manufacturing method thereof, chip-type fuse and fuse resistor |
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| JP2000074292A JP3697135B2 (en) | 2000-03-16 | 2000-03-16 | Glazed insulating substrate, collective insulating substrate, manufacturing method thereof, chip-type fuse and fuse resistor |
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| JP2010146907A (en) * | 2008-12-19 | 2010-07-01 | Kamaya Denki Kk | Glazed insulating board, assembly insulating board, manufacturing method therefor, and fuse resistor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010146907A (en) * | 2008-12-19 | 2010-07-01 | Kamaya Denki Kk | Glazed insulating board, assembly insulating board, manufacturing method therefor, and fuse resistor |
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