JP3697889B2 - Electronic component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate by vacuum suction using a nozzle.
[0002]
[Prior art]
In the electronic component mounting apparatus, the electronic component is vacuum-sucked and held at the lower end portion of the nozzle of the head portion, and is transported and mounted on a substrate such as a printed circuit board or a lead frame. A vacuum pump, an air supply unit that pumps air toward the nozzle in order to discharge dust accumulated in the air passage from the nozzle, and the like.
[0003]
FIG. 6 is a configuration diagram of a nozzle piping system of a conventional electronic component mounting apparatus, and FIG. 7 is a configuration diagram in the vicinity of the filter. In FIG. 6, 1 is a nozzle shaft, 2 is a nozzle at the lower end thereof, and 3 is a block for holding the nozzle shaft 1. A filter 5 is provided in the middle of the air passage 4 communicating with the nozzle 2. The air passage 4 is connected to a vacuum pump 7 and an air supply unit 8 via a valve 6. A regulator 9 adjusts the pressure sent from the air supply unit 8.
[0004]
Next, the operation will be described. The valve 6 is switched to the vacuum pump 7 side, and the air path 4 is vacuumed by the vacuum pump 7, whereby the electronic component W is vacuum-adsorbed to the lower end portion of the nozzle 2. When the vacuum-sucked electronic component W is mounted on the substrate, the valve 6 is switched to the air supply unit 8 side, and the vacuum suction state of the electronic component W is released by pumping air to the air passage 4. Is mounted on the substrate.
[0005]
When the air passage 4 is vacuumed by the vacuum pump 7, external dust is sucked from the lower end of the nozzle 2. The dust causes clogging of the nozzle, and if it enters the valve 6, it causes a failure of the valve 6. Therefore, a filter 5 is provided in the air passage 4 so that the sucked dust adheres to the filter 5. If the filter 5 becomes very dirty after a long operation, the filter 5 is removed and the filter is replaced.
[0006]
[Problems to be solved by the invention]
The filter 5 is formed of a sintered body such as metal in order to satisfy requirements such as durability, and has a considerable processing and forming error. Therefore, a considerable gap G is generated between the filter 5 and the outer wall of the storage chamber 10 (FIG. 7). This gap G is quite large, and in some cases it is 0.5 mm or more. For this reason, the dust sucked from the nozzle 2 enters the valve 6 through the gap G, causing problems such as causing a failure of the valve 6. In addition, the maintenance of the filter 5 contaminated with dust requires a lot of labor.
[0007]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting apparatus including a nozzle piping system capable of preventing dust sucked from a nozzle from entering an air passage. It is another object of the present invention to provide an electronic component mounting apparatus including a nozzle piping system that can easily and sufficiently clean the vacuum suction path.
[0008]
[Means for Solving the Problems]
The present invention is an electronic component mounting apparatus in which an electronic component of a parts feeder provided in an electronic component supply unit is vacuum-sucked and picked up by a lower end portion of a nozzle of a head unit, and is transported and mounted on a substrate. A valve body made of air-permeable filter material, which is installed above the nozzle of the head section and is housed in an air passage communicating with the nozzle , and a spring that elastically contacts the valve body with the valve seat on the valve body are arranged. In addition, the electronic component mounting apparatus includes a vacuum pump for vacuum-sucking the air path and an air supply unit for pressure-feeding the air to the air path.
[0009]
Preferably, a regulator for adjusting the magnitude of air pressure is provided between the air passage and the air supply unit, and when mounting an electronic component vacuum-adsorbed on the lower end of the nozzle on the substrate, weak air is provided. Air is sent to the air passage by pressure, and when cleaning the valve body, air is sent to the air passage by strong air pressure.
[0010]
In the above configuration, when the vacuum pump is driven to vacuum-suck the nozzle, external dust is sucked into the air passage from the nozzle and adheres to the valve body. In this case, the valve body having the filter function is pressed against the valve seat by the spring force of the spring material, so that no gap is generated, and therefore dust can be prevented from being sucked into the valve side.
[0011]
When an electronic component vacuum-adsorbed at the lower end of the nozzle is mounted on the substrate, air is sent from the air supply unit to the nozzle side with a weak air pressure. Then, the vacuum suction state of the electronic component is released, and the electronic component is mounted on the substrate.
[0012]
If air is sent to the nozzle side with a strong air pressure from the air supply unit, the valve body will move away from the valve seat against the spring force of the spring material, and dust adhering to the air passage and valve body will be discharged from the nozzle and cleaned. Is done.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a configuration diagram of a piping system of the nozzle, and FIGS. 3A and 3B are partially enlarged sectional views of the nozzle. 4 and 5 are configuration diagrams of the piping system of the nozzle.
[0014]
In FIG. 1, reference numeral 11 denotes a movable table, which consists of an X table 12 and a Y table 13 which are orthogonal to each other. A head unit 20 is mounted on the Y table 13. Reference numeral 14 denotes a conveyance path for the substrate 15, and an electronic component supply unit 16, a recognition unit 18, and a collection unit 19 are provided on the side thereof. The electronic component supply unit 16 includes a number of parts feeders 17.
[0015]
When the movable table 11 is driven, the head unit 20 moves horizontally in the X direction and the Y direction, and the electronic component W provided in the parts feeder 17 is vacuum-sucked to the lower end portion of the nozzle 21 and picked up. Next, the head unit 20 moves above the recognition unit 18, recognizes the electronic component W vacuum-sucked on the lower end of the nozzle 21, and then mounts the electronic component W at a predetermined coordinate position on the substrate 15. Further, the electronic component W having a bad recognition result is discarded and collected in the collecting unit 19. There are various types of electronic component mounting apparatuses, and the nozzle piping system of the present invention described below can be applied to other types of electronic component mounting apparatuses.
[0016]
Next, the nozzle piping system will be described with reference to FIGS. 2 and 3, the nozzle 21 is detachably attached to the lower end portion of the nozzle shaft 22 by a clamper 23. A spherical valve body 25 is accommodated in the air passage 24 above the nozzle 21. As the valve body 25, a conical one can also be used. The valve body 25 is a sintered body such as metal and has air permeability. The valve body 25 is elastically contacted by a spring member 26 and a valve seat 27 thereon.
[0017]
In FIG. 2, the air passage 24 is connected to a first valve 31 via a tube 30, and the first valve 31 is connected to a second valve 32 via a tube 33. The first valve 31 and the second valve 32 are electromagnetic valves and have flow paths a, b, c, d and closed points a ′, b ′, c ′, d ′, respectively. A vacuum pump 34 is connected to the first valve 31, and an air supply unit 37 is connected to the second valve 32 via a first regulator 35 and a second regulator 36 that are pressure regulators. Yes. The set pressure of the first regulator 35 is large and the set pressure of the second regulator 36 is small, and air is pumped to the nozzle 21 side with a strong air pressure P1 and a weak air pressure P2, respectively.
[0018]
Next, the operation will be described. When picking up the electronic component W of the parts feeder 17, the flow path a of the first valve 31 is switched to the vacuum pump 34 side as shown in FIG. At this time, the tube 33 connected to the second valve 32 is connected to the closing point a ′. Then, the inside of the nozzle 21 is vacuum-sucked, and the electronic component W is vacuum-sucked and picked up at its lower end.
[0019]
Next, the head unit 20 moves above the substrate 15 to mount the electronic component W on the substrate 15. At this time, as shown in FIG. 4, the vacuum pump 34 is connected to the closing point b ′, and the second regulator 36 is connected to the flow path c of the second valve 32. Is pumped to the nozzle 21. Accordingly, the vacuum suction state of the nozzle 21 is released and air is sent from the air feeding unit 37 with a weak air pressure, so that the electronic component W is quickly separated from the lower end portion of the nozzle 21 and mounted on the substrate 15. . By repeating the above operation, the electronic components W are successively mounted on the substrate 15.
[0020]
Now, during the operation for a long time, considerable dust adheres to the inner wall of the valve body 25 and the air passage 24, resulting in clogging. Therefore, garbage is cleaned as follows. That is, the flow path d of the second valve 32 is connected to the first regulator 35 as shown in FIG. Then, air is pumped from the air feeding unit 37 to the nozzle 21 side with a strong air pressure P1. Due to this strong air pressure P1, as shown in FIG. 3 (b), the valve body 25 moves away from the valve seat 27 against the spring force of the spring material 26, and air is expelled from the nozzle 21 vigorously. Dust adhering to the inner wall of the air passage 24 and the valve body 25 is also discharged from the nozzle 21 and cleaned. The broken line arrows in FIG. 3B indicate the air flow at this time. When the cleaning is completed, the first valve 31 and the second valve 32 are returned to the state shown in FIG. 2, and the mounting of the electronic component W is resumed.
[0021]
【The invention's effect】
As described above, according to the present invention, the air passage can be sufficiently blocked by the valve body, so that dust sucked from the nozzle can be sufficiently prevented from entering the valve side. Also, dust adhering to the inner wall of the air passage and the valve body can be easily cleaned.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a configuration diagram of a nozzle piping system of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a partially enlarged sectional view of a nozzle of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a partial enlarged sectional view of a nozzle of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 5 is a configuration diagram of a nozzle piping system of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 5 is a configuration diagram of a nozzle piping system of an electronic component mounting apparatus according to an embodiment of the present invention. Schematic diagram of the nozzle piping system [Fig. 7] Schematic diagram of the vicinity of the filter of the nozzle piping system of the conventional electronic component mounting apparatus [Explanation of symbols]
15 Substrate 16 Electronic component supply unit 17 Parts feeder 20 Head unit 21 Nozzle 24 Air passage 25 Valve body 26 Spring material 27 Valve seat 31 First valve 32 Second valve 34 Vacuum pump 35 First regulator 36 Second regulator 37 Air supply unit

Claims (2)

An electronic component mounting apparatus in which an electronic component of a parts feeder provided in an electronic component supply unit is picked up by vacuum suction to a lower end portion of a nozzle of a head unit, and is transferred and mounted on a substrate, the nozzle of the head unit A valve body made of a filter material having air permeability and housed in an air passage communicating with the nozzle , and a spring for elastically contacting the valve body with a valve seat above the valve body, An electronic component mounting apparatus comprising: a vacuum pump that vacuum-sucks an air path; and an air supply unit that pumps air into the air path. A regulator that adjusts the magnitude of air pressure is provided between the air passage and the air supply unit. When an electronic component vacuum-adsorbed at the lower end of the nozzle is mounted on the substrate, air is supplied with a weak air pressure. 2. The electronic component mounting apparatus according to claim 1, wherein air is sent to the air passage with a strong air pressure when the air is sent to the air passage and the valve body is cleaned.

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