JP3702200B2

JP3702200B2 - Optical semiconductor element storage package and optical semiconductor device

Info

Publication number: JP3702200B2
Application number: JP2001171532A
Authority: JP
Inventors: 和弘川畑; 信幸田中
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2001-06-06
Filing date: 2001-06-06
Publication date: 2005-10-05
Anticipated expiration: 2021-06-06
Also published as: JP2002368322A

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体レーザ（ＬＤ）、フォトダイオード（ＰＤ）等の光半導体素子を収容するための光半導体素子収納用パッケージ、およびその光半導体素子収納用パッケージを用いた光半導体装置に関する。
【０００２】
【従来の技術】
従来の光半導体素子収納用パッケージ（以下、光半導体パッケージという）を図６に平面図、図７に図６のＢ−Ｂ’の断面図、図８に図６のネジ取付部の部分拡大平面図で示す。これらの図において、１０１は基体、１０２は枠体、１０３は入出力端子、１０４は内部にレンズ等の透光性部材を有する筒状の光ファイバ固定部材（以下、固定部材という）、１０６は蓋体を示し、これら基体１０１，枠体１０２，入出力端子１０３，固定部材１０４，蓋体１０６とで、内部空間に光半導体素子１０５を収容する容器が基本的に構成される。
【０００３】
基体１０１は、銅（Ｃｕ）−タングステン（Ｗ）合金や鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の金属材料から成り、上面に光半導体素子１０５を載置する略四角形の載置部１０１ａを有するとともに、基体１０１の四隅に外側に延出して設けられた張出部に貫通穴または切欠きから成るネジ穴１０１ｃが設けられたネジ取付部１０１ｂを有する。この基体１０１は、光半導体素子１０５が載置部１０１ａに載置固定され作動した際に、光半導体素子１０５が発する熱を効率良く外部電気回路基板（図示せず）のヒートシンク部に伝達する、所謂熱伝達媒体として機能し、またネジ取付部１０１ｂのネジ穴１０１ｃにネジを挿入し外部電気回路基板にネジ止めして固定される。
【０００４】
基体１０１の上面には、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属材料から成り、側部に貫通開口または切欠き部から成る入出力端子取付部１０２ａを、他の側部に貫通孔から成る光ファイバ固定部材取付部（以下、固定部材取付部という）１０２ｂを有する枠体１０２が、載置部１０１ａを囲繞するように銀（Ａｇ）ロウ等のロウ材で接合される。
【０００５】
また、固定部材取付部１０２ｂの外側開口の周辺部またはその内周面には、光半導体素子１０５と光信号を入出力する光ファイバ（図示せず）が接続される筒状の固定部材１０４が取着される。また、入出力端子取付部１０２ａの内周面には、光半導体素子１０５と外部電気回路基板との高周波信号の入出力を行う入出力端子１０３が取着される。なお、入出力端子１０３には、高周波信号が伝送されるメタライズ層１０３ａが形成されている。
【０００６】
なお、図８に示すように、ネジ取付部１０１ｂのネジ穴１０１ｃの中心１０１ｃ−Ａは、基体１０１の隣接する二辺の延長線Ｌに挟まれる領域の外側に位置する。即ち、ネジ取付部１０１ｂの張出部は基体１０１の隅部で一辺側にのみつながるように形成されており、その張出部内にネジ穴１０１ｃが設けられている。
【０００７】
このような構成の光半導体パッケージに光半導体素子１０５を載置固定した後、光半導体素子１０５とメタライズ層１０３ａとをボンディングワイヤ（図示せず）で電気的に接続し、蓋体１０６により光半導体素子１０５を気密に封止することにより、製品としての光半導体装置となる。なお、光半導体素子１０５は、外部電気回路基板から入力される高周波信号、または光ファイバから入力される光信号により作動する。
【０００８】
【発明が解決しようとする課題】
しかしながら、ネジ取付部１０１ｂのネジ穴１０１ｃの中心１０１ｃ−Ａが、基体１０１の隣接する二辺の延長線Ｌに挟まれる領域の外側に位置するため、ネジ穴１０１ｃにネジを挿入して外部電気回路基板にネジ止め固定する際、入出力端子１０３等が取着されている枠体１０２と基体１０１とのわずかな熱膨張差による基体１０１の反りを平坦に矯正しようとする大きな応力が、中心１０１ｃ−Ａを起点としてネジ取付部１０１ｂから枠体１０２に伝わる。そのため、この応力が枠体１０２と入出力端子１０３とを接合した際に内在した応力に加わることとなり、枠体１０２と入出力端子１０３との間で剥がれが発生する場合があった。その結果、光半導体素子１０５の気密性が損なわれるという問題点があった。
【０００９】
また、中心１０１ｃ−Ａを起点としてネジ取付部１０１ｂから枠体１０２に伝わる大きな応力が固定部材１０４に伝わることにより固定部材１０４が変形し、光ファイバの光入出力端面が光半導体素子１０５の光入出力端面と位置ずれを起こし、それらの光の結合効率が劣化する。その結果、光半導体素子１０５の作動性が損なわれるという問題点があった。
【００１０】
従って、本発明は上記問題点に鑑み完成されたものであり、その目的は、ＬＤ，ＰＤ等の光半導体素子の気密性を確実なものとするとともに、光半導体素子と光ファイバとの光の結合効率を良好なものとすることにより、光半導体素子を長期にわたり正常かつ安定に作動させることである。
【００１１】
【課題を解決するための手段】
本発明の光半導体パッケージは、略四角形であり、上面に光半導体素子を載置する載置部が設けられているとともに四隅に外側に延出して設けられた張出部に円形の貫通穴または円弧状の切欠きが形成されて成るネジ取付部を有する基体と、該基体の上面に前記載置部を囲繞するように接合され、側部に貫通開口または切欠き部から成る入出力端子取付部を有する枠体と、前記入出力端子取付部に取着された入出力端子とを具備した光半導体素子収納用パッケージにおいて、前記ネジ取付部は、前記張出部が前記基体の隣接する二辺の延長線に挟まれるように設けられているとともに前記基体との間の継ぎ目部が幅方向両側を凹状と成すように括れており、前記円形の貫通穴または円弧状の切欠きの中心が前記延長線上または前記延長線に挟まれた内側に位置していることを特徴とする。
【００１２】
本発明は、上記の構成により、光半導体パッケージを外部電気回路基板にネジ止め固定した際に発生する大きな応力が、ネジ穴の中心からネジ取付部、枠体へと伝わり難くなり、枠体と入出力端子との間で剥がれを発生させない。その結果、光半導体素子の気密性を確実に保持できる。また、光ファイバの光入出力端面と光半導体素子の光入出力端面との位置ずれを有効に防止できる。そのため、光ファイバと光半導体素子との光の結合効率が十分なものとなり、光半導体素子の作動性が良好となる。
【００１３】
本発明において、好ましくは、前記ネジ取付部の継ぎ目部は円弧状に括れていることを特徴とする。
【００１４】
本発明は、上記の構成により、光半導体パッケージを外部電気回路基板にネジ止め固定した際に継ぎ目部が適度に変形するため、発生した応力を十分に吸収し緩和できる。そのため、光半導体素子の気密性，作動性を、より確実に良好なものとできる。
【００１５】
本発明の光半導体装置は、上記本発明の光半導体素子収納用パッケージと、前記載置部に載置固定され前記入出力端子に電気的に接続された光半導体素子と、前記枠体の上面に接合された蓋体とを具備したことを特徴とする。
【００１６】
本発明は、上記の構成により、光半導体素子に誤作動や酸化腐食等を発生させず、光半導体素子を長期にわたり正常かつ安定に作動させることができる。従って、信頼性の高い光半導体装置となる。
【００１７】
【発明の実施の形態】
本発明の光半導体パッケージについて以下に詳細に説明する。図１に本発明の光半導体パッケージについて実施の形態の一例を示す平面図を、図２に図１のＡ−Ａ’線の断面図を、図３に図１の要部の部分拡大平面図を示す。これらの図において、１は略四角形の基体、２は枠体、３は入出力端子、４は固定部材、６は蓋体を示し、これら基体1，枠体２，入出力端子３，固定部材４，蓋体６とで、内部空間に光半導体素子５を収容する容器が基本的に構成される。
【００１８】
本発明の基体１は、Ｃｕ−Ｗ合金やＦｅ−Ｎｉ−Ｃｏ合金等の金属材料から成り、上面に光半導体素子５を載置する載置部１ａが設けられているとともに四隅に外側に延出して設けられた張出部に円形の貫通穴または円弧状の切欠き（ネジ穴１ｃ）が形成されて成るネジ取付部１ｂを有する。この基体１は、光半導体素子５が載置部１ａの上面に載置固定され作動した際に、光半導体素子５が発する熱を効率良く外部電気回路基板のヒートシンク部に伝達する、所謂熱伝達媒体として機能し、またネジ取付部１ｂのネジ穴１ｃにネジを挿入し外部電気回路基板にネジ止めして固定される。
【００１９】
また、基体１は、例えばＦｅ−Ｎｉ−Ｃｏ合金から成る場合、この合金のインゴットに圧延加工やプレス加工等の金属加工を施すことにより所定の形状に作製される。また、その表面には酸化腐食の防止や光半導体素子５の載置固定を良好なものとするために、厚さ０．５〜９μｍのＮｉ層や厚さ０．５〜５μｍの金（Ａｕ）層等の金属層をメッキ法により被着させておくと良い。
【００２０】
本発明において、図３に示すように、ネジ取付部１ｂは張出部が基体１の隣接する二辺の延長線に挟まれるように設けられており、ネジ取付部１ｂのネジ穴１ｃは、円形の貫通穴または円弧状の切欠きの中心１ｃ−Ａが延長線上または延長線に挟まれた内側に位置している。図３の場合、円形の貫通穴から成るネジ穴１ｃの中心１ｃ−Ａは略四角形の基体１の略対角線の延長線上に位置する。
【００２１】
ネジ穴１ｃの中心１ｃ−Ａをこのような位置に設けているため、光半導体パッケージを外部電気回路基板にネジ止め固定した際に発生する大きな応力が、ネジ穴１ｃの中心１ｃ−Ａからネジ取付部１ｂ、枠体２へと伝わり難くなり、枠体２と入出力端子３との間で剥がれを発生させない。そのため、光半導体素子５の気密性を確実に保持できる。さらには、中心１ｃ−Ａを起点としてネジ取付部１ｂから枠体２に伝わる応力が固定部材４にも伝わり難くなり、光ファイバの光入出力端面と光半導体素子５の光入出力端面との位置ずれを有効に防止できる。その結果、光ファイバと光半導体素子５との光の結合効率が非常に良好なものとなる。
【００２２】
また、ネジ穴１ｃの中心１ｃ−Ａを基体１の隅部から略対角線上で適度な距離でもって離すことにより、光半導体パッケージをネジ止め固定した際に発生する応力を小さくできる。即ち、この応力は、載置部１ａ直下部の反りを略平坦に矯正させ得る程度の大きさであり、枠体２，固定部材４まで大きな強度で伝わることはなくなる。
【００２３】
また、中心１ｃ−Ａは、基体１の隅部の角から２〜１０ｍｍ離れていることが良く、２ｍｍ未満の場合、ネジ止め固定した際に中心１ｃ−Ａから枠体２，固定部材４に大きな応力が伝わり、枠体２と入出力端子３との間の剥がれや、光ファイバの光入出力端面と光半導体素子５の光入出力端面との位置ずれを発生させ易い。一方、１０ｍｍを超えると、光半導体パッケージ自体が大型化して近時の小型化から外れるとともに、載置部１ａ直下の面の反りを平坦に矯正することが全くできなくなり、光半導体素子５が作動時に発する熱を効率良く外部電気回路基板のヒートシンク部に伝達させ難くなる。
【００２４】
なお、ネジ穴１ｃの中心１ｃ−Ａは、ネジ取付部１ｂの略中央部に位置する必要はなく、例えば図４（ａ）に示すように、ネジ取付部１ｂの一方の延長線側にあっても良い。この場合にも、ネジ止め固定した際に発生する応力は、載置部１ａ直下の面の反りをほぼ平坦に矯正し得る程度のものであり、枠体２と入出力端子３との間の剥がれや、光ファイバの光入出力端面と光半導体素子５の光入出力端面との位置ずれが発生する程度に大きくなることはない。
【００２５】
また、ネジ取付部１ｂの外周縁とネジ穴１ｃの内周面との距離は０．５〜５ｍｍであれば良く、この範囲内であれば図４（ｂ）に示すようにネジ取付部１ｂの外周縁の近傍にネジ穴１ｃの内周面全面が位置するように設けても良い。
【００２６】
中心１ｃ−Ａの内周面とネジ取付部１ｂの外周縁との距離が０．５ｍｍ未満の場合、この距離が非常に短いため、ネジ止め固定した際に中心１ｃ−Ａを起点としてネジ取付部１ｂから枠体２、固定部材４に大きな応力が伝わり易い。そのため、光半導体素子５の気密性や、光ファイバと光半導体素子５との光の結合効率が損なわれ、光半導体素子５に誤作動や酸化腐食等を発生させることとなる。一方、距離が５ｍｍを超える場合、光半導体パッケージ自体が大型化し近時の小型化から外れるとともに、載置部１ａ直下の面の反りを平坦に矯正することが全くできなくなり、光半導体素子５が作動時に発する熱を効率良く外部電気回路基板のヒートシンク部に伝達させ難くなる。
【００２７】
なお、ネジ穴１ｃは上述のような貫通穴に限らず、図５（ａ）〜（ｄ）に示すような円弧状の切欠きであっても良く、この場合仮想円（仮想貫通穴）の中心が中心１ｃ−Ａとなる。
【００２８】
この場合においても、ネジ穴１ｃの中心１ｃ−Ａが基体１の隣接する二辺の延長線上または延長線に挟まれた内側に位置するように構成しており、これにより、光半導体パッケージを外部電気回路基板にネジ止め固定した際に発生する応力が、ネジ穴１ｃの中心１ｃ−Ａからネジ取付部１ｂ、枠体２へと伝わり難くなり、枠体２と入出力端子３との間で剥がれを発生させず光半導体素子５の気密性を確実に保持できる。さらには、応力が枠体２に伝わり難いため固定部材４にはほとんど伝わらない。そのため、光ファイバの光入出力端面と光半導体素子５の光入出力端面との位置ずれが発生せず、それらの光の結合効率が良好に保持される。その結果、光半導体素子５の作動性が非常に良好なものとなる。
【００２９】
また、図５（ａ）は、中心１ｃ−Ａが略四角形の張出部で基体１の角から遠い方の隣接した二辺の延長線の交点上にある構成である。図５（ｂ）は、中心１ｃ−Ａが略四角形の張出部で基体１の角から遠い方の隣接した二辺の延長線の交点よりも基体１の角側（内側）にある構成である。図５（ｃ）は、中心１ｃ−Ａが略四角形の張出部で基体１の角から遠い方の隣接した二辺の延長線の交点よりも外側にある構成である。このように、中心１ｃ−Ａは、略四角形の張出部で基体１の角から遠い方の隣接した二辺の延長線の交点上、交点の内側、交点の外側のいずれに位置してもよい。
【００３０】
また、図５（ｄ）は、中心１ｃ−Ａが、略四角形の張出部で基体１の角に近い方の一辺と隣接した遠い方の一辺の延長線の交点よりも、遠い方の一辺上で張出部の最外角側にある構成である。この場合、中心１ｃ−Ａは、基体１の辺の延長線のうち近い方との距離が０ｍｍを超え７ｍｍ以下であれば良い。この距離が７ｍｍを超える場合は、光半導体パッケージ自体が大型化し近時の小型化から外れるものとなり易い。
【００３１】
上記実施の形態では、ネジ取付部１ｂの張出部は略四角形であるが、正方形，長方形等の四角形に限らず、菱形，平行四辺形，円形，楕円形等種々の形状とし得る。
【００３２】
本発明では、このようにネジ取付部１ｂは、その張出部が基体１の隣接する二辺の延長線に挟まれるように設けられ、ネジ穴１ｃの中心１ｃ−Ａが延長線上または延長線に挟まれた内側に位置していることにより、光半導体パッケージを外部電気回路基板にネジ止め固定した際に発生する応力は、載置部１ａ直下の面の反りをほぼ平坦に矯正し得る程度のものとなり、枠体２と入出力端子３との間の剥がれや、光ファイバの光入出力端面と光半導体素子５の光入出力端面との位置ずれを発生させる程度には大きくならない。その結果、光半導体素子５の気密性，作動性を非常に良好なものとできる。
【００３３】
また、本発明において、ネジ取付部１ｂの基体１との継ぎ目部が括れており、その継ぎ目部は曲率半径が０．５〜３ｍｍの円弧状に括れていることが好ましい。この構成により、光半導体パッケージを外部電気回路基板にネジ止め固定した際に括れ部が適度に変形して、発生した応力を十分に吸収し緩和できる。即ち、ネジ取付部１ｂが括れ部を有することにより、ネジ止め固定した際の応力が、載置部１ａ直下の面の反りのみをほぼ平坦に矯正できる程度となるように、より確実に小さくできる。その結果、この応力は、枠体２と入出力端子３との間の剥がれや、光ファイバと光半導体素子５との光の結合効率が損なわれる程度に大きくはならない。
【００３４】
継ぎ目部の曲率半径が０．５ｍｍ未満の場合、ネジ止め固定した際の応力が枠体２や固定部材４まで伝わり、枠体２と入出力端子３との間の剥がれや、光ファイバと光半導体素子５との光の結合効率が損なわれる場合がある。一方、５ｍｍを超えると、ネジ止め固定した際の応力を継ぎ目部が大きく変形することで十分すぎる程度に吸収し緩和してしまい、載置部１ａ直下の面の反りを平坦に矯正できなくなる。そのため、光半導体素子５が作動時に発する熱を外部電気回路基板に効率良く伝え難くなり、光半導体素子５が誤作動を起こす場合がある。
【００３５】
また、継ぎ目部の最小幅は１〜５ｍｍ程度がよく、１ｍｍ未満の場合、ネジ止め固定した際の応力を継ぎ目部が大きく変形することで十分すぎる程度に吸収し緩和してしまい、載置部１ａ直下の面の反りを平坦に矯正できなくなる。５ｍｍを超えると、ネジ止め固定した際の応力が枠体２や固定部材４まで伝わり易くなり、枠体２と入出力端子３との間の剥がれや、光ファイバと光半導体素子５との光の結合効率が損なわれる場合がある。
【００３６】
このようなネジ取付部１ｂを有する基体１の上面には、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属材料から成り、側部に貫通開口または切欠き部から成る入出力端子取付部２ａを有し、他の側部に貫通孔から成る固定部材取付部２ｂを有する枠体２が、載置部１ａを囲繞するようにＡｇロウ等のロウ材で接合される。この枠体２は、例えばＦｅ−Ｎｉ−Ｃｏ合金から成る場合、基体１と同様に、合金のインゴットに圧延加工やプレス加工等の金属加工を施すことにより所定の形状に作製される。また、その表面には酸化腐食を有効に防止するために、厚さ０．５〜９μｍのＮｉ層や厚さ０．５〜５μｍのＡｕ層等の金属層をメッキ法により被着させておくと良い。
【００３７】
また、固定部材取付部２ｂの枠体２の外側開口の周辺部またはその内周面には、光半導体素子５と光信号を入出力する光ファイバが接続される、筒状の固定部材４がＡｇロウ等のロウ材で取着される。また、入出力端子取付部２ａの内周面には、光半導体素子５と外部電気回路基板との高周波信号の入出力を行う入出力端子３がＡｇロウ等のロウ材で取着される。なお、入出力端子３には、高周波信号が伝送されるメタライズ層３ａが形成される。
【００３８】
固定部材４は、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属材料から成り、例えばＦｅ−Ｎｉ−Ｃｏ合金から成る場合、基体１や枠体２と同様に、合金のインゴットに圧延加工やプレス加工等の金属加工を施すことにより所定の形状に作製される。また、その表面には酸化腐食を有効に防止するために、厚さ０．５〜９μｍのＮｉ層や厚さ０．５〜５μｍのＡｕ層等の金属層をメッキ法により被着させておくと良い。なお、光ファイバを固定部材４に固定するために、光ファイバを支持しているホルダーが固定部材４の端部にＹＡＧレーザ溶接等で接合される。
【００３９】
なお、固定部材４の内周面には、集光レンズとして機能するとともに光半導体パッケージの内部を塞ぐ非晶質ガラス等から成る透光性部材７が、その接合部の表面に形成されたメタライズ層を介して、２００〜４００℃の融点を有するＡｕ−Ｓｎ合金等の低融点ロウ材で接合される。
【００４０】
透光性部材７は、熱膨張係数が４〜１２ｐｐｍ／℃（室温〜４００℃）のサファイア（単結晶アルミナ）や非晶質ガラス等から成り、球状，半球状，凸レンズ状，ロッドレンズ状等の形状である。そして、光ファイバを伝わってきた外部のレーザ光等の光を光半導体素子５に入力させる、または光半導体素子５で出力したレーザ光等の光を光ファイバに入力させるための集光用部材として用いられる。透光性部材７が、例えば結晶軸の存在しない非晶質ガラスの場合、酸化珪素（ＳｉＯ₂），酸化鉛（ＰｂＯ）を主成分とする鉛系、またはホウ酸やケイ砂を主成分とするホウケイ酸系のものを用いる。
【００４１】
また、透光性部材７は、その熱膨張係数が枠体２のそれと異なっていても、固定部材４が熱膨張差による応力を吸収し緩和するので、結晶軸が応力のためにある方向に揃うことにより光の屈折率の変化を起こすようなことは発生し難い。従って、このような透光性部材７を用いることにより、光半導体素子５と光ファイバとの間の光の結合効率を高くできる。
【００４２】
また、入出力端子取付部２ａには、その内周面に入出力端子３がＡｇロウ等のロウ材を介して嵌着されている。入出力端子３は、絶縁性のセラミック基板に導電性のメタライズ層３ａが被着されたものであり、光半導体パッケージ内部の気密性を保持する機能を有するとともに、光半導体パッケージと外部電気回路基板との高周波信号の入出力を行う機能を有する。なお、セラミック基板の材料は、誘電率や熱膨張係数等の特性に応じて、アルミナ（Ａｌ₂Ｏ₃）セラミックスや窒化アルミニウム（ＡｌＮ）セラミックス等のセラミックス材料から選定される。
【００４３】
入出力端子３は、メタライズ層３ａとなるタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ）等の粉末に有機溶剤，溶媒を添加混合して得た金属ペーストを、セラミック基板となる原料粉末に適当な有機バインダや溶剤等を添加混合しペースト状と成すとともに、このペーストをドクターブレード法やカレンダーロール法によって形成されたセラミックグリーンシートに、予め従来周知のスクリーン印刷法により所望の形状に印刷塗布し、約１６００℃の高温で焼結することにより作製される。
【００４４】
また、メタライズ層３ａの枠体２外側の上面には、入出力端子３との接合を強固なものとするために、熱膨張係数が入出力端子３のセラミック基板に近似した材料から成るリード端子（図示せず）がＡｇロウ等のロウ材で接合される。例えば入出力端子３のセラミック基板がＡｌ₂Ｏ₃セラミックスから成る場合、リード端子はＦｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金から成る。
【００４５】
入出力端子３や固定部材４が取着される枠体２の上面には、Ｆｅ−Ｎｉ−Ｃｏ合金等から成る金属製の蓋体６、またはＡｌ₂Ｏ₃セラミックス，ＡｌＮセラミックス等から成るセラミックス製の蓋体６が接合され、この蓋体６により光半導体素子５を光半導体パッケージ内部に気密に封止する。
【００４６】
このように、本発明の光半導体パッケージは、略四角形であり、上面に光半導体素子５を載置する載置部１ａが設けられているとともに四隅に外側に延出して設けられた張出部に円形の貫通穴または円弧状の切欠きが形成されて成るネジ取付部１ｂを有する基体１と、基体１の上面に載置部１ｂを囲繞するように接合され、側部に貫通開口または切欠き部から成る入出力端子取付部２ａを有するとともに他の側部に貫通孔から成る光ファイバ固定部材取付部２ｂを有する枠体２と、入出力端子取付部２ａに取着された入出力端子３と、光ファイバ固定部材取付部２ｂに取着された筒状の光ファイバ固定部材４とを具備し、ネジ取付部１ｂは、張出部が基体１の隣接する二辺の延長線に挟まれるように設けられているとともに基体１との継ぎ目部が括れており、円形の貫通穴または円弧状の切欠きの中心が延長線上または延長線に挟まれた内側に位置している。
【００４７】
また、上記本発明の光半導体パッケージと、載置部１ｂに載置固定され入出力端子３に電気的に接続された光半導体素子５と、枠体２の上面に接合された蓋体６とを具備したことにより、製品としての光半導体装置となる。なお、固定部材４に端部が挿着される光ファイバは、一般に光半導体装置の使用時に設けられるが、単品としての光半導体装置に付加されていてもよく、または光半導体装置が外部電気回路基板に固定されて使用される際に取り付けるようにしてもよい。
【００４８】
具体的には、載置部１ａの上面に光半導体素子５をガラス，樹脂，ロウ材等の接着剤を介して接着固定するとともに光半導体素子５の電極をボンディングワイヤを介して所定のメタライズ層３ａに電気的に接続させ、しかる後、枠体２の上面に蓋体６をガラス，樹脂，ロウ材，シーム溶接等により接合することにより、基体１，枠体２，入出力端子３，固定部材４，透光性部材５から成る光半導体パッケージの内部に光半導体素子５を収容した製品としての光半導体装置となる。
【００４９】
このような光半導体装置は、例えば外部電気回路基板から供給される高周波信号により光半導体素子５を光励起させ、励起したレーザ光等の光を透光性部材７を通して光ファイバに授受させるとともに光ファイバ内を伝送させることにより、大容量の情報を高速に伝送できる光電変換装置として機能し、光通信分野等に多く用いることができる。
【００５０】
なお、本発明は上記実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行うことは何等支障ない。例えば、光半導体装置は、内部または外部に、または枠体２外側の光ファイバの途中に、戻り光防止用の光アイソレータを設けてもよい。この場合、光半導体素子５と光ファイバとの光の結合効率がさらに良好になる。
【００５１】
【発明の効果】
本発明は、略四角形であり、四隅に外側に延出して設けられた張出部に円形の貫通穴または円弧状の切欠きが形成されて成るネジ取付部を有する基体のそのネジ取付部は、張出部が基体の隣接する二辺の延長線に挟まれるように設けられているとともに基体との間の継ぎ目部が幅方向両側を凹状と成すように括れており、円形の貫通穴または円弧状の切欠きの中心が延長線上または延長線に挟まれた内側に位置していることにより、光半導体パッケージを外部電気回路基板にネジ止め固定した際に発生する大きな応力が、ネジ穴の中心からネジ取付部、枠体へと伝わり難くなり、枠体と入出力端子との間で剥がれを発生させない。その結果、光半導体素子の気密性を確実に保持できる。また、光ファイバの光入出力端面と光半導体素子の光入出力端面との位置ずれを有効に防止できる。そのため、光ファイバと光半導体素子との光の結合効率が十分なものとなり、光半導体素子の作動性が良好となる。
【００５２】
本発明は、好ましくはネジ取付部の継ぎ目部は円弧状に括れていることにより、光半導体パッケージを外部電気回路基板にネジ止め固定した際に継ぎ目部が適度に変形するため、発生した応力を十分に吸収し緩和できる。そのため、光半導体素子の気密性および作動性をより確実に良好なものとできる。
【００５３】
本発明の光半導体装置は、上記本発明の光半導体素子収納用パッケージと、載置部に載置固定され入出力端子に電気的に接続された光半導体素子と、枠体の上面に接合された蓋体とを具備したことにより、光半導体素子に誤作動や酸化腐食等を発生させず、光半導体素子を長期にわたり正常かつ安定に作動させることができる。従って、信頼性の高い光半導体装置となる。
【図面の簡単な説明】
【図１】本発明の光半導体パッケージについて実施の形態の一例を示す平面図である。
【図２】図１の光半導体パッケージのＡ−Ａ’線における断面図である。
【図３】図１の光半導体パッケージの要部の部分拡大平面図である。
【図４】（ａ），（ｂ）は本発明の光半導体パッケージについて実施の形態の他の例を示し、それぞれ要部の部分拡大平面図である。
【図５】（ａ）〜（ｄ）は本発明の光半導体パッケージについて実施の形態の他の例を示し、それぞれ要部の部分拡大平面図である。
【図６】従来の光半導体パッケージの平面図である。
【図７】図６の光半導体パッケージのＢ−Ｂ’線における断面図である。
【図８】図６の光半導体パッケージのネジ取付部の部分拡大平面図である。
【符号の説明】
１：基体
１ａ：載置部
１ｂ：ネジ取付部
１ｃ：ネジ穴
１ｃ−Ａ：ネジ穴の中心
２：枠体
２ａ：入出力端子取付部
２ｂ：光ファイバ固定部材取付部
３：入出力端子
４：光ファイバ固定部材
５：光半導体素子
６：蓋体[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element such as a semiconductor laser (LD) or a photodiode (PD), and an optical semiconductor device using the optical semiconductor element housing package.
[0002]
[Prior art]
FIG. 6 is a plan view of a conventional optical semiconductor element storage package (hereinafter referred to as an optical semiconductor package), FIG. 7 is a sectional view taken along line BB ′ of FIG. 6, and FIG. 8 is a partially enlarged plan view of the screw mounting portion of FIG. Shown in the figure. In these drawings, 101 is a base body, 102 is a frame body, 103 is an input / output terminal, 104 is a cylindrical optical fiber fixing member (hereinafter referred to as a fixing member) having a translucent member such as a lens, and 106 is A cover body is shown, and the base body 101, the frame body 102, the input / output terminal 103, the fixing member 104, and the cover body 106 basically constitute a container for housing the optical semiconductor element 105 in the internal space.
[0003]
The base 101 is made of a metal material such as a copper (Cu) -tungsten (W) alloy or iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and has a substantially rectangular shape on which the optical semiconductor element 105 is placed. In addition to having the mounting portion 101a, there is a screw mounting portion 101b provided with a screw hole 101c formed of a through hole or a notch in an overhanging portion provided to extend outward at the four corners of the base 101. The base 101 efficiently transfers heat generated by the optical semiconductor element 105 to the heat sink part of an external electric circuit board (not shown) when the optical semiconductor element 105 is mounted and fixed on the mounting part 101a. It functions as a so-called heat transfer medium, and a screw is inserted into the screw hole 101c of the screw mounting portion 101b and fixed to the external electric circuit board by screwing.
[0004]
The upper surface of the base 101 is made of a metal material such as Fe-Ni-Co alloy or Fe-Ni alloy, and the input / output terminal mounting portion 102a having a through opening or a notch portion on the side portion is penetrated to the other side portion. A frame body 102 having an optical fiber fixing member mounting portion (hereinafter referred to as a fixing member mounting portion) 102b made of a hole is joined with a brazing material such as silver (Ag) brazing so as to surround the mounting portion 101a.
[0005]
A cylindrical fixing member 104 to which an optical fiber (not shown) for inputting / outputting an optical signal to / from the optical semiconductor element 105 is connected to a peripheral portion or an inner peripheral surface of the outer opening of the fixing member attaching portion 102b. To be attached. An input / output terminal 103 for inputting / outputting a high-frequency signal between the optical semiconductor element 105 and the external electric circuit board is attached to the inner peripheral surface of the input / output terminal mounting portion 102a. The input / output terminal 103 is formed with a metallized layer 103a through which a high-frequency signal is transmitted.
[0006]
As shown in FIG. 8, the center 101c-A of the screw hole 101c of the screw attachment portion 101b is located outside the region sandwiched between the extension lines L on the two adjacent sides of the base 101. That is, the protruding portion of the screw mounting portion 101b is formed so as to be connected only to one side at the corner of the base 101, and a screw hole 101c is provided in the protruding portion.
[0007]
After the optical semiconductor element 105 is mounted and fixed on the optical semiconductor package having such a configuration, the optical semiconductor element 105 and the metallized layer 103a are electrically connected by a bonding wire (not shown), and the optical semiconductor is formed by the lid 106. By sealing the element 105 hermetically, an optical semiconductor device as a product is obtained. The optical semiconductor element 105 is operated by a high-frequency signal input from an external electric circuit board or an optical signal input from an optical fiber.
[0008]
[Problems to be solved by the invention]
However, since the center 101c-A of the screw hole 101c of the screw attachment portion 101b is located outside the region sandwiched between the extension lines L of the two adjacent sides of the base 101, the screw is inserted into the screw hole 101c to external electric power. When screwing and fixing to the circuit board, a large stress that tries to flatten the warpage of the base 101 due to a slight difference in thermal expansion between the base body 101 and the frame body 102 to which the input / output terminals 103 and the like are attached is centered. 101c-A is transmitted from the screw mounting portion 101b to the frame body 102 as a starting point. For this reason, this stress is added to the stress inherent when the frame body 102 and the input / output terminal 103 are joined, and peeling may occur between the frame body 102 and the input / output terminal 103. As a result, there is a problem that the airtightness of the optical semiconductor element 105 is impaired.
[0009]
Further, a large stress transmitted from the screw mounting portion 101b to the frame body 102 from the center 101c-A is transmitted to the fixing member 104, whereby the fixing member 104 is deformed, and the light input / output end face of the optical fiber is the light of the optical semiconductor element 105. A positional shift occurs between the input and output end faces, and the coupling efficiency of these lights deteriorates. As a result, there is a problem that the operability of the optical semiconductor element 105 is impaired.
[0010]
Accordingly, the present invention has been completed in view of the above problems, and its object is to ensure the airtightness of an optical semiconductor element such as an LD or PD and to ensure the light transmission between the optical semiconductor element and the optical fiber. By making the coupling efficiency good, the optical semiconductor element is operated normally and stably over a long period of time.
[0011]
[Means for Solving the Problems]
The optical semiconductor package of the present invention has a substantially square shape, a mounting portion for mounting the optical semiconductor element is provided on the upper surface, and a circular through hole or a protruding portion provided to extend outward at the four corners. A base having a screw mounting portion formed with an arc-shaped notch, and an input / output terminal mounting that is joined to the upper surface of the base so as to surround the mounting portion and includes a through opening or a notch on the side portion In the optical semiconductor element housing package comprising a frame having a portion and an input / output terminal attached to the input / output terminal mounting portion, the screw mounting portion has two protruding portions adjacent to the base. It is provided so as to be sandwiched between the extension lines of the sides, and the seam between the base and the base is constricted so as to form a concave shape on both sides in the width direction, and the center of the circular through-hole or arc-shaped notch is On or between the extension lines Characterized in that the are located inside.
[0012]
The present invention makes it difficult for the large stress generated when the optical semiconductor package is screwed and fixed to the external electric circuit board to be transmitted from the center of the screw hole to the screw mounting portion and the frame body. Do not cause peeling between the input and output terminals. As a result, the hermeticity of the optical semiconductor element can be reliably maintained. Further, it is possible to effectively prevent the positional deviation between the light input / output end face of the optical fiber and the light input / output end face of the optical semiconductor element. Therefore, the coupling efficiency of light between the optical fiber and the optical semiconductor element is sufficient, and the operability of the optical semiconductor element is improved.
[0013]
In the present invention, preferably, the joint portion of the screw attachment portion is constricted in an arc shape.
[0014]
According to the present invention, since the joint portion is appropriately deformed when the optical semiconductor package is screwed and fixed to the external electric circuit board, the generated stress can be sufficiently absorbed and relaxed. Therefore, the hermeticity and operability of the optical semiconductor element can be made better and better.
[0015]
An optical semiconductor device according to the present invention includes an optical semiconductor element housing package according to the present invention, an optical semiconductor element placed and fixed on the mounting portion and electrically connected to the input / output terminal, and an upper surface of the frame body. And a lid joined to each other.
[0016]
According to the present invention, the optical semiconductor element can be operated normally and stably over a long period of time without causing malfunction or oxidative corrosion or the like in the optical semiconductor element. Therefore, the optical semiconductor device has high reliability.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
The optical semiconductor package of the present invention will be described in detail below. FIG. 1 is a plan view showing an example of an embodiment of the optical semiconductor package of the present invention, FIG. 2 is a cross-sectional view taken along the line AA 'of FIG. 1, and FIG. 3 is a partially enlarged plan view of the main part of FIG. Indicates. In these drawings, 1 is a substantially rectangular base, 2 is a frame, 3 is an input / output terminal, 4 is a fixing member, 6 is a lid, and the base 1, frame 2, input / output terminal 3, and fixing member are shown. 4 and the lid body 6 basically constitute a container for accommodating the optical semiconductor element 5 in the internal space.
[0018]
The substrate 1 of the present invention is made of a metal material such as a Cu—W alloy or an Fe—Ni—Co alloy, and is provided with a mounting portion 1a for mounting the optical semiconductor element 5 on the upper surface and extending outward at the four corners. It has a screw mounting portion 1b formed by forming a circular through hole or an arc-shaped notch (screw hole 1c) on the protruding portion provided. This base 1 is a so-called heat transfer that efficiently transfers heat generated by the optical semiconductor element 5 to the heat sink part of the external electric circuit board when the optical semiconductor element 5 is mounted and fixed on the upper surface of the mounting portion 1a. It functions as a medium, and a screw is inserted into the screw hole 1c of the screw mounting portion 1b and fixed to the external electric circuit board by screwing.
[0019]
In addition, when the base 1 is made of, for example, an Fe—Ni—Co alloy, the base 1 is made into a predetermined shape by performing metal processing such as rolling or pressing on the ingot of the alloy. Further, in order to prevent oxidative corrosion and mount and fix the optical semiconductor element 5 on the surface, a 0.5 to 9 μm thick Ni layer or a 0.5 to 5 μm thick gold (Au It is preferable to deposit a metal layer such as a) layer by a plating method.
[0020]
In the present invention, as shown in FIG. 3, the screw attachment portion 1b is provided so that the overhanging portion is sandwiched between the extension lines of two adjacent sides of the base 1, and the screw hole 1c of the screw attachment portion 1b is The center 1c-A of the circular through hole or the arc-shaped notch is located on the extension line or inside the extension line. In the case of FIG. 3, the center 1 c -A of the screw hole 1 c formed of a circular through hole is located on an extension line of a substantially diagonal line of the substantially rectangular base 1.
[0021]
Since the center 1c-A of the screw hole 1c is provided at such a position, a large stress generated when the optical semiconductor package is screwed and fixed to the external electric circuit board is screwed from the center 1c-A of the screw hole 1c. It becomes difficult to be transmitted to the mounting portion 1 b and the frame body 2, and no peeling occurs between the frame body 2 and the input / output terminal 3. Therefore, the airtightness of the optical semiconductor element 5 can be reliably maintained. Furthermore, the stress transmitted from the screw mounting portion 1b to the frame 2 starting from the center 1c-A becomes difficult to be transmitted to the fixing member 4, and the optical input / output end surface of the optical fiber and the optical input / output end surface of the optical semiconductor element 5 are Misalignment can be effectively prevented. As a result, the light coupling efficiency between the optical fiber and the optical semiconductor element 5 is very good.
[0022]
Further, by separating the center 1c-A of the screw hole 1c from the corner of the base body 1 by an appropriate distance on a substantially diagonal line, the stress generated when the optical semiconductor package is fixed with screws can be reduced. That is, this stress is large enough to correct the warp immediately below the mounting portion 1 a to be substantially flat, and is not transmitted to the frame body 2 and the fixing member 4 with great strength.
[0023]
Further, the center 1c-A is preferably 2 to 10 mm away from the corner of the base 1, and if it is less than 2 mm, the center 1c-A is fixed to the frame 2 and the fixing member 4 when fixed with screws. A large stress is transmitted, and peeling between the frame 2 and the input / output terminal 3 and a positional shift between the light input / output end face of the optical fiber and the light input / output end face of the optical semiconductor element 5 are likely to occur. On the other hand, if it exceeds 10 mm, the optical semiconductor package itself becomes large and deviates from the recent miniaturization, and the warpage of the surface immediately below the mounting portion 1a cannot be corrected flatly, and the optical semiconductor element 5 operates. It becomes difficult to efficiently transmit the heat generated sometimes to the heat sink portion of the external electric circuit board.
[0024]
Note that the center 1c-A of the screw hole 1c does not have to be positioned at the substantially central portion of the screw mounting portion 1b. For example, as shown in FIG. 4A, the center 1c-A is located on one extension line side of the screw mounting portion 1b. May be. Also in this case, the stress generated when screwing and fixing is such that the warp of the surface immediately below the mounting portion 1a can be corrected almost flatly, and between the frame 2 and the input / output terminal 3 It does not become so large that peeling or misalignment between the optical input / output end face of the optical fiber and the optical input / output end face of the optical semiconductor element 5 occurs.
[0025]
Further, the distance between the outer peripheral edge of the screw mounting portion 1b and the inner peripheral surface of the screw hole 1c may be 0.5 to 5 mm. If it is within this range, the screw mounting portion 1b as shown in FIG. You may provide so that the whole inner peripheral surface of the screw hole 1c may be located in the vicinity of the outer periphery.
[0026]
When the distance between the inner peripheral surface of the center 1c-A and the outer peripheral edge of the screw mounting portion 1b is less than 0.5 mm, this distance is very short. Therefore, when the screw is fixed, the screw mounting starts from the center 1c-A. Large stress is easily transmitted from the portion 1b to the frame 2 and the fixing member 4. Therefore, the airtightness of the optical semiconductor element 5 and the light coupling efficiency between the optical fiber and the optical semiconductor element 5 are impaired, and the optical semiconductor element 5 is caused to malfunction or oxidize corrosion. On the other hand, when the distance exceeds 5 mm, the optical semiconductor package itself becomes large and deviates from the recent miniaturization, and the warpage of the surface immediately below the mounting portion 1a cannot be corrected flatly, so that the optical semiconductor element 5 is formed. It becomes difficult to efficiently transmit heat generated during operation to the heat sink portion of the external electric circuit board.
[0027]
The screw hole 1c is not limited to the above-described through hole, but may be an arc-shaped notch as shown in FIGS. 5A to 5D. In this case, a virtual circle (virtual through hole) is formed. The center is the center 1c-A.
[0028]
Also in this case, the center 1c-A of the screw hole 1c is configured to be located on the extension line of two adjacent sides of the base body 1 or on the inner side between the extension lines. The stress generated when screwing and fixing to the electric circuit board is difficult to be transmitted from the center 1c-A of the screw hole 1c to the screw mounting portion 1b and the frame body 2, and between the frame body 2 and the input / output terminal 3 It is possible to reliably maintain the hermeticity of the optical semiconductor element 5 without causing peeling. Furthermore, since stress is hardly transmitted to the frame body 2, the stress is hardly transmitted to the fixing member 4. For this reason, the positional deviation between the light input / output end face of the optical fiber and the light input / output end face of the optical semiconductor element 5 does not occur, and the coupling efficiency of these lights is maintained well. As a result, the operability of the optical semiconductor element 5 is very good.
[0029]
FIG. 5A shows a configuration in which the center 1c-A is a substantially quadrilateral overhanging portion on the intersection of two adjacent extended lines farther from the corner of the base 1. FIG. 5B shows a configuration in which the center 1c-A is located on the corner side (inner side) of the base body 1 from the intersection of the extension lines of two adjacent sides far from the corner of the base body 1 at a substantially quadrangular protruding portion. is there. FIG. 5C shows a configuration in which the center 1c-A is outside the intersection of the extension lines of two adjacent sides far from the corner of the base body 1 in a substantially quadrangular protruding portion. As described above, the center 1c-A is located on the intersection of the extension lines of the adjacent two sides far from the corner of the base body 1 at the substantially rectangular projecting portion, on the inner side of the intersection point, or on the outer side of the intersection point. Good.
[0030]
Further, FIG. 5D shows that the center 1c-A is one side farther than the intersection of the extension lines of the far side adjacent to the side closer to the corner of the base body 1 at the substantially rectangular protruding portion. It is the structure which exists in the outermost angle side of the overhang | projection part above. In this case, the distance between the center 1c-A and the nearer one of the extended lines of the sides of the substrate 1 may be more than 0 mm and not more than 7 mm. When this distance exceeds 7 mm, the optical semiconductor package itself becomes large and tends to deviate from the recent miniaturization.
[0031]
In the above embodiment, the projecting portion of the screw mounting portion 1b is substantially square, but is not limited to a square such as a square or a rectangle, but may be various shapes such as a rhombus, a parallelogram, a circle, and an ellipse.
[0032]
In the present invention, the screw attachment portion 1b is thus provided such that the overhanging portion is sandwiched between the extension lines on the two adjacent sides of the base 1, and the center 1c-A of the screw hole 1c is on the extension line or the extension line. The stress generated when the optical semiconductor package is screwed and fixed to the external electric circuit board can be corrected to a level where the warpage of the surface immediately below the mounting portion 1a can be corrected almost flatly. It does not increase to such an extent that peeling between the frame 2 and the input / output terminal 3 or a positional shift between the light input / output end face of the optical fiber and the light input / output end face of the optical semiconductor element 5 occurs. As a result, the hermeticity and operability of the optical semiconductor element 5 can be made very good.
[0033]
Moreover, in this invention, it is preferable that the joint part with the base | substrate 1 of the screw attachment part 1b is constricted, and the joint part is constricted in circular arc shape whose curvature radius is 0.5-3 mm. With this configuration, the constricted portion is appropriately deformed when the optical semiconductor package is fixed to the external electric circuit board with screws, and the generated stress can be sufficiently absorbed and relaxed. In other words, since the screw mounting portion 1b has the constricted portion, the stress when screwed and fixed can be more reliably reduced so that only the warp of the surface immediately below the mounting portion 1a can be corrected almost flatly. . As a result, this stress does not increase to such an extent that peeling between the frame 2 and the input / output terminal 3 and the light coupling efficiency between the optical fiber and the optical semiconductor element 5 are impaired.
[0034]
When the radius of curvature of the joint is less than 0.5 mm, the stress when screwed and fixed is transmitted to the frame 2 and the fixing member 4, peeling between the frame 2 and the input / output terminal 3, and the optical fiber and optical fiber The light coupling efficiency with the semiconductor element 5 may be impaired. On the other hand, if it exceeds 5 mm, the stress at the time of screwing and fixing is absorbed and relaxed to a sufficient extent by the large deformation of the joint portion, and the warping of the surface immediately below the mounting portion 1a cannot be corrected flatly. Therefore, it becomes difficult to efficiently transfer heat generated when the optical semiconductor element 5 operates to the external electric circuit board, and the optical semiconductor element 5 may malfunction.
[0035]
Further, the minimum width of the seam portion is preferably about 1 to 5 mm, and if it is less than 1 mm, the stress at the time of screwing and fixing is absorbed and relaxed to a sufficient extent by the large deformation of the seam portion, and the mounting portion The warp of the surface immediately below 1a cannot be corrected flatly. If it exceeds 5 mm, the stress at the time of screwing and fixing is easily transmitted to the frame 2 and the fixing member 4, peeling between the frame 2 and the input / output terminal 3, and the light between the optical fiber and the optical semiconductor element 5. The coupling efficiency may be impaired.
[0036]
On the upper surface of the base body 1 having such a screw mounting portion 1b, an input / output terminal mounting portion made of a metal material such as an Fe-Ni-Co alloy or an Fe-Ni alloy and having a through-opening or a notch on the side portion. A frame 2 having 2a and having a fixing member mounting portion 2b formed of a through hole on the other side is joined with a brazing material such as Ag brazing so as to surround the mounting portion 1a. When the frame body 2 is made of, for example, an Fe—Ni—Co alloy, the frame body 2 is made into a predetermined shape by subjecting the alloy ingot to metal processing such as rolling or pressing as in the case of the substrate 1. Further, in order to effectively prevent oxidative corrosion, a metal layer such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm is deposited on the surface by a plating method. And good.
[0037]
Further, a cylindrical fixing member 4 to which an optical fiber for inputting / outputting optical signals to / from the optical semiconductor element 5 is connected to a peripheral portion of the outer opening of the frame 2 of the fixing member attaching portion 2b or an inner peripheral surface thereof. It is attached with a brazing material such as Ag brazing. An input / output terminal 3 for inputting / outputting a high-frequency signal between the optical semiconductor element 5 and the external electric circuit board is attached to the inner peripheral surface of the input / output terminal mounting portion 2a with a brazing material such as Ag brazing. The input / output terminal 3 is formed with a metallized layer 3a through which a high frequency signal is transmitted.
[0038]
The fixing member 4 is made of a metal material such as an Fe—Ni—Co alloy or an Fe—Ni alloy. For example, when the fixing member 4 is made of an Fe—Ni—Co alloy, it is rolled into an alloy ingot in the same manner as the base 1 and the frame 2. It is produced in a predetermined shape by performing metal working such as press working. Further, in order to effectively prevent oxidative corrosion, a metal layer such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm is deposited on the surface by a plating method. And good. In order to fix the optical fiber to the fixing member 4, a holder supporting the optical fiber is joined to the end of the fixing member 4 by YAG laser welding or the like.
[0039]
On the inner peripheral surface of the fixing member 4, a translucent member 7 made of amorphous glass or the like that functions as a condenser lens and closes the inside of the optical semiconductor package is formed on the surface of the joint. The layers are joined by a low melting point brazing material such as an Au—Sn alloy having a melting point of 200 to 400 ° C.
[0040]
The translucent member 7 is made of sapphire (single crystal alumina) or amorphous glass having a thermal expansion coefficient of 4 to 12 ppm / ° C. (room temperature to 400 ° C.), and is spherical, hemispherical, convex lens shape, rod lens shape, etc. It is the shape. As a condensing member for inputting light such as external laser light transmitted through the optical fiber to the optical semiconductor element 5 or inputting light such as laser light output from the optical semiconductor element 5 to the optical fiber. Used. When the translucent member 7 is, for example, amorphous glass having no crystal axis, silicon oxide (SiO 2 ₂ ), Lead based on lead oxide (PbO), or borosilicate based on boric acid or silica sand.
[0041]
Further, even if the thermal expansion coefficient of the translucent member 7 is different from that of the frame 2, the fixing member 4 absorbs and relaxes the stress due to the thermal expansion difference, so that the crystal axis is in a direction due to the stress. It is difficult to cause a change in the refractive index of light due to the alignment. Therefore, by using such a translucent member 7, the light coupling efficiency between the optical semiconductor element 5 and the optical fiber can be increased.
[0042]
Further, the input / output terminal 3 is fitted on the inner peripheral surface of the input / output terminal mounting portion 2a via a brazing material such as Ag brazing. The input / output terminal 3 is formed by attaching an electrically conductive metallized layer 3a to an insulating ceramic substrate, and has a function of maintaining the hermeticity inside the optical semiconductor package, as well as the optical semiconductor package and the external electric circuit substrate. And a function of inputting and outputting a high frequency signal. The material of the ceramic substrate is alumina (Al) according to the characteristics such as dielectric constant and thermal expansion coefficient. ₂ O _Three ) Selected from ceramic materials such as ceramics and aluminum nitride (AlN) ceramics.
[0043]
The input / output terminal 3 is a raw material powder that becomes a ceramic substrate using a metal paste obtained by adding an organic solvent and a solvent to a powder of tungsten (W), molybdenum (Mo), manganese (Mn), or the like that becomes the metallization layer 3a. A suitable organic binder, solvent, etc. are added and mixed to form a paste, and this paste is printed on a ceramic green sheet formed by a doctor blade method or a calendar roll method in a desired shape by a conventionally well-known screen printing method. It is produced by coating and sintering at a high temperature of about 1600 ° C.
[0044]
A lead terminal made of a material whose thermal expansion coefficient approximates that of the ceramic substrate of the input / output terminal 3 is provided on the upper surface of the metallized layer 3a on the outer side of the frame 2 in order to strengthen the connection with the input / output terminal 3. (Not shown) are joined with a brazing material such as Ag brazing. For example, the ceramic substrate of the input / output terminal 3 is Al. ₂ O _Three In the case of ceramics, the lead terminals are made of Fe—Ni—Co alloy or Fe—Ni alloy.
[0045]
On the upper surface of the frame 2 to which the input / output terminals 3 and the fixing member 4 are attached, a metal lid 6 made of Fe—Ni—Co alloy or the like, or Al ₂ O _Three A ceramic lid 6 made of ceramic, AlN ceramic or the like is joined, and the optical semiconductor element 5 is hermetically sealed inside the optical semiconductor package by the lid 6.
[0046]
As described above, the optical semiconductor package of the present invention has a substantially quadrangular shape, the mounting portion 1a for mounting the optical semiconductor element 5 is provided on the upper surface, and the projecting portions provided to extend outward at the four corners. A base 1 having a screw mounting portion 1b formed with a circular through hole or an arc-shaped notch is joined to an upper surface of the base 1 so as to surround the mounting portion 1b, and a through opening or a cut is formed on a side portion. A frame 2 having an input / output terminal mounting portion 2a composed of a notch and having an optical fiber fixing member mounting portion 2b composed of a through hole on the other side, and an input / output terminal attached to the input / output terminal mounting portion 2a 3 and a cylindrical optical fiber fixing member 4 attached to the optical fiber fixing member mounting portion 2b. The screw mounting portion 1b is sandwiched between extension lines of two adjacent sides of the base body 1. And a joint with the base 1 Has constricted, it is located inside a circular through-hole or an arc-shaped cutout center is sandwiched extension or on an extension.
[0047]
Also, the optical semiconductor package of the present invention, the optical semiconductor element 5 placed and fixed on the placement portion 1 b and electrically connected to the input / output terminal 3, and the lid body 6 joined to the upper surface of the frame body 2 By providing the optical semiconductor device as a product. The optical fiber whose end is inserted into the fixing member 4 is generally provided when the optical semiconductor device is used, but may be added to the optical semiconductor device as a single product, or the optical semiconductor device may be an external electric circuit. You may make it attach when using it being fixed to a board | substrate.
[0048]
Specifically, the optical semiconductor element 5 is bonded and fixed to the upper surface of the mounting portion 1a via an adhesive such as glass, resin, brazing material, and the electrode of the optical semiconductor element 5 is bonded to a predetermined metallization layer via a bonding wire. 3a is electrically connected, and then the base body 1, the frame body 2, the input / output terminal 3, and the fixed body 6 are joined to the upper surface of the frame body 2 by glass, resin, brazing material, seam welding or the like. An optical semiconductor device as a product in which the optical semiconductor element 5 is accommodated in the optical semiconductor package including the member 4 and the translucent member 5 is obtained.
[0049]
Such an optical semiconductor device, for example, optically excites the optical semiconductor element 5 with a high-frequency signal supplied from an external electric circuit board, and transmits and receives the excited light such as laser light to the optical fiber through the translucent member 7. By transmitting the inside, it functions as a photoelectric conversion device capable of transmitting a large amount of information at high speed, and can be used in many fields such as the optical communication field.
[0050]
In addition, this invention is not limited to the said embodiment, It does not have any trouble in making various changes within the range which does not deviate from the summary of this invention. For example, the optical semiconductor device may be provided with an optical isolator for preventing return light inside or outside, or in the middle of the optical fiber outside the frame 2. In this case, the light coupling efficiency between the optical semiconductor element 5 and the optical fiber is further improved.
[0051]
【The invention's effect】
The present invention is substantially rectangular, and the screw mounting portion of the base having a screw mounting portion in which a circular through hole or an arc-shaped notch is formed in an overhanging portion provided to extend outward at four corners, The overhanging portion is provided so as to be sandwiched between the extension lines of two adjacent sides of the base body, and the joint portion between the base body is constricted so as to form a concave shape on both sides in the width direction. Because the center of the arc-shaped notch is located on the extension line or inside the extension line, the large stress generated when the optical semiconductor package is screwed to the external electric circuit board is It becomes difficult to transmit from the center to the screw mounting portion and the frame, and no peeling occurs between the frame and the input / output terminal. As a result, the hermeticity of the optical semiconductor element can be reliably maintained. Further, it is possible to effectively prevent the positional deviation between the light input / output end face of the optical fiber and the light input / output end face of the optical semiconductor element. Therefore, the coupling efficiency of light between the optical fiber and the optical semiconductor element is sufficient, and the operability of the optical semiconductor element is improved.
[0052]
In the present invention, since the joint portion of the screw mounting portion is preferably constricted in an arc shape, the joint portion is appropriately deformed when the optical semiconductor package is screwed and fixed to the external electric circuit board. Can absorb and relax enough. Therefore, the hermeticity and operability of the optical semiconductor element can be made more reliable.
[0053]
An optical semiconductor device of the present invention is bonded to the optical semiconductor element storage package of the present invention, an optical semiconductor element mounted and fixed on a mounting portion and electrically connected to an input / output terminal, and an upper surface of a frame. The optical semiconductor element can be operated normally and stably over a long period of time without causing malfunction or oxidative corrosion or the like in the optical semiconductor element. Therefore, the optical semiconductor device has high reliability.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of an embodiment of an optical semiconductor package of the present invention.
2 is a cross-sectional view taken along the line AA ′ of the optical semiconductor package of FIG. 1. FIG.
3 is a partially enlarged plan view of a main part of the optical semiconductor package of FIG. 1. FIG.
FIGS. 4A and 4B show another example of the embodiment of the optical semiconductor package of the present invention, and are partially enlarged plan views of main parts, respectively. FIGS.
FIGS. 5A to 5D show other examples of the embodiment of the optical semiconductor package of the present invention, and are partially enlarged plan views of main parts, respectively.
FIG. 6 is a plan view of a conventional optical semiconductor package.
7 is a cross-sectional view taken along line BB ′ of the optical semiconductor package of FIG. 6. FIG.
8 is a partially enlarged plan view of a screw mounting portion of the optical semiconductor package of FIG. 6. FIG.
[Explanation of symbols]
1: Substrate
1a: Placement part
1b: Screw mounting part
1c: Screw hole
1c-A: Center of screw hole
2: Frame
2a: Input / output terminal mounting part
2b: Optical fiber fixing member mounting portion
3: Input / output terminal
4: Optical fiber fixing member
5: Optical semiconductor element
6: Lid

Claims

It has a substantially quadrangular shape, and a mounting portion for mounting the optical semiconductor element is provided on the upper surface, and a circular through hole or an arc-shaped notch is formed in the overhanging portion that extends outward at the four corners. a substrate having a threaded mounting portion composed of Te, are joined so as to surround the placing part to the upper surface of the base body, a frame body that having a output terminal mounting portion consisting of through openings or notches on the side in the optical semiconductor device package for housing provided with the input and output terminals that are attached to the output terminal mounting portion, the screw attachment portion sandwiched extension of two sides the protruding portion is adjacent the base And the seam between the base and the base is formed to be concave on both sides in the width direction, and the center of the circular through-hole or arc-shaped notch is on the extension line or the extension. It is located inside the line An optical semiconductor device package for housing the symptoms.

Joint portions optical semiconductor element storage package according to claim 1, characterized in that constricted to a circle arc of the screw mounting portion.

The optical semiconductor element storage package according to claim 1, an optical semiconductor element placed and fixed on the mounting portion and electrically connected to the input / output terminal, and an upper surface of the frame body. An optical semiconductor device comprising a lid.