JP3709038B2 - Mold for casting of metal containing Zn - Google Patents
Mold for casting of metal containing Zn Download PDFInfo
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- JP3709038B2 JP3709038B2 JP03525997A JP3525997A JP3709038B2 JP 3709038 B2 JP3709038 B2 JP 3709038B2 JP 03525997 A JP03525997 A JP 03525997A JP 3525997 A JP3525997 A JP 3525997A JP 3709038 B2 JP3709038 B2 JP 3709038B2
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- 238000005058 metal casting Methods 0.000 title 1
- 238000007747 plating Methods 0.000 claims description 155
- 239000002184 metal Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 229910045601 alloy Inorganic materials 0.000 claims description 30
- 239000000956 alloy Substances 0.000 claims description 30
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 23
- 238000005266 casting Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 230000005499 meniscus Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000010419 fine particle Substances 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 175
- 239000011701 zinc Substances 0.000 description 41
- 238000000034 method Methods 0.000 description 29
- 230000000694 effects Effects 0.000 description 21
- 229910052804 chromium Inorganic materials 0.000 description 15
- 239000011324 bead Substances 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 238000005480 shot peening Methods 0.000 description 11
- 230000008034 disappearance Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 230000009467 reduction Effects 0.000 description 10
- 238000007789 sealing Methods 0.000 description 9
- 230000006378 damage Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000002344 surface layer Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000005336 cracking Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229910000599 Cr alloy Inorganic materials 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- -1 and as a result Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000009749 continuous casting Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- PMVSDNDAUGGCCE-TYYBGVCCSA-L Ferrous fumarate Chemical group [Fe+2].[O-]C(=O)\C=C\C([O-])=O PMVSDNDAUGGCCE-TYYBGVCCSA-L 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000009291 secondary effect Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、Znを含有する金属の鋳造を行なう際に用いられる耐久性の改善された鋳型に関するものである。
【0002】
【従来の技術】
鋼などの連続鋳造に用いられる鋳型として現在最も汎用されているのは、熱伝導率が大きくて高い冷却効率の得られるCuあるいはCu合金製の鋳型である。そして連続鋳造に当たっては、凝固殻の形成および成長を効率よく進めるため、鋳型には間接的もしくは直接的な水冷構造が付設される。
【0003】
しかし、該連続鋳造用鋳型に注入される溶湯は非常に高温であるため、注入溶湯との接触面の損傷が激しく、短時間のうちに寿命限界に達する。そこで鋳型の長寿命化を図るための手段として、鋳型における溶湯との接触面に、耐溶損性および耐摩耗性に優れたCr系めっき層を形成する方法が採用されている。またCr系めっき層の形成においても、めっき構造を様々に工夫して内面強化を図る方法が提案されている。その代表的なものとしては、第1層としてNiやCo、Ni−Co合金めっき層を形成し、第2層としてPやBを含むNi系またはCo系の合金めっき層を形成し、更に第3層(最表層部)としてCr系めっきを施した3層構造の内面強化層を形成する方法(特公昭52−50734号公報)、前記第1層を省略した2層構造の内面強化層を形成する方法(特開昭57−85650号公報)、電解Niめっき層上に電解Crめっき層を連続成形して2層構造以上の内面保護層を形成する方法(特開平7−284881号公報)などが例示される。
【0004】
【発明が解決しようとする課題】
ところが、Znめっきされたスクラップ材を原料として使用する場合など、溶鋼中にZnが混入してくる場合は、前述の様なCr系めっきよりなる保護皮膜が形成されていたとしても、該Crめっき内に存在するクラックからZnが浸透、侵入し、下地めっき層や鋳型基体層を損傷する。溶鋼中に不純物として含まれる該Znがめっき皮膜を侵食し或は剥離させて鋳型寿命を著しく短縮させる現象はZnアタック現象と呼ばれ、大きな問題となっている。
【0005】
こうした問題は、Znが混入した溶鋼を鋳造する場合に限らず、Cu−Zn合金やAl−Zn合金等、即ちZnを含有する溶融金属を用いて鋳造を行なう場合に共通する問題であり、特に鋳型のメニスカス部においてZnアタックの問題が頻発する。
【0006】
他方、実用鋳型の特にメニスカス部は、溶湯との接触による急速加熱と冷却からなる厳しい熱サイクルに曝される。そして内面保護層としてCr系めっき層を形成したものでは(Cr層を2層以上の複層構造とした場合を含む)、めっき層形成時(使用前における下地層の硬化や密着性向上を目的として行なわれる熱処理工程)の熱影響によってめっき皮膜に強い引張応力が作用するので、めっきままの状態でも少なからず微細なクラックが生成しており、しかも使用時に受ける上記の様な過酷な熱サイクルを受けてクラックの生成と成長は更に進行する。そして表層部のCrめっき層にクラックが存在もしくは生成すると、前述の様なZnアタック現象が起こり、めっき皮膜の損傷や剥離が短時間のうちに進行するのである。
【0007】
そして前述した様な鋳型内面保護技術では、Cr系めっき皮膜自身の耐Zn性や耐クラック性の改善が目論まれるが、現実にはクラックを完全に無くすことができる訳ではなく、且つクラックに起因するZnアタック現象の防止対策までは配慮されておらず、そのことが、Cr系めっき等により内面保護された鋳型の寿命を十分に延長できない原因になっているものと考えられる。即ち、Znを含む溶湯の鋳造に用いられる鋳型の寿命延長を図るには、鋳型内面に形成される保護めっき層の耐摩耗性や耐熱性、皮膜そのものの耐Zn性などに加えて、使用前の熱処理工程で生じるクラックを可及的に低減すると共に、使用後の過酷な熱サイクルによる新たなクラックの生成と成長を抑制し、Znアタック現象も可及的に阻止し得る様な技術を確立する必要がある。
【0008】
本発明はこの様な事情に鑑みてなされたものであって、その目的は、耐熱性や耐摩耗性に優れる他、表面保護層として形成されるCr系めっき層の形成時に生じたクラックを可及的に封孔・消失、もしくは減少させると共に、使用時における特に鋳型メニスカス部で生じるクラックの新たな生成と成長も可及的に抑制し、Znアタック現象によるめっき皮膜の損傷や剥離を効果的に抑えることができ、その結果として鋳型寿命を大幅に延長することのできる技術を確立しようとするものである。
【0009】
【課題を解決するための手段】
上記課題を解決することのできた本発明の鋳造用鋳型は、CuまたはCu系合金よりなる鋳型基材における溶湯との接触面に、保護皮膜としてCr系めっき層が形成された鋳造用鋳型において、該鋳型の少なくともメニスカス部における上記Cr系めっき層は、350MPa以上の残留圧縮応力を有し、あるいは
CuまたはCu系合金よりなる鋳型基材における溶湯との接触面に、保護皮膜として少なくとも2層のCr系めっき層が形成された鋳造用鋳型であって、該鋳型の少なくともメニスカス部における上記Cr系めっき層の少なくとも1層は、350MPa以上の残留圧縮応力を有しているところに要旨がある。
【0010】
本発明の鋳型における上記Cr系めっき層と鋳型基材との間には、鋳型基材側に、Niおよび/またはFeを主成分とする合金めっき層からなる下地層を形成すると共に、Cr系めっき層側には、Feおよび/またはCoもしくはそれらを主成分とする合金からなる中間層を形成することによって、めっき層全体としての鋳型基材に対する密着性を高めると共に、熱影響を受けた時の熱膨張差によるめっき層の損傷や剥離を一層効果的に抑えることができ、鋳型寿命を一段と延長することができるので好ましい。更に、上記Cr系めっき層を少なくとも2層のCrまたはCr系合金層によって構成する場合、該CrまたはCr系合金層の間に、鉄族金属の少なくとも1種を主成分とする金属層または合金層を介在させれば、熱衝撃によって生じることのあるクラックの成長がめっき層内で中断もしくは分断され、鋳型基材にまで至るZnの侵入をより確実に抑えることが可能となり、その結果としてZnアタック現象が一層効果的に抑えられるので好ましい。
【0011】
また上記本発明において、350MPa以上の残留圧縮応力を有するCr系めっき層は、Cr系めっき層の形成後、微細粒子を吹付けて所定の残留圧縮応力を与えることにより容易に得ることができる。
【0012】
【発明の実施の形態】
まず本発明における前提的要件、即ち表層部をCr系めっき層(CrまたはCr合金層)で構成する理由は、Crまたはその合金の融点が高く且つ溶融Znに対する溶解度も小さくて耐摩耗性や耐熱性に優れたものであるからである。Cr系めっき層の形成法は特に制限がなく、例えば電気めっき法などの湿式めっき法、真空蒸着、イオンプレーティング、スパッタリング、CVDなどの気相めっき法などいずれも採用可能であるが、コスト的に最も一般的なのは電気めっき法である。
【0013】
該Cr系めっき層は、Cr系めっきの特徴である耐溶融金属付着性を確保するため、めっき厚さを0.3μm以上とすることが望ましい。しかしCr系めっき層は、厚くなればなるほど内部応力、特に引張応力が大きくなる傾向があり、その結果としてCr系めっき皮膜にクラックが生じ易くなり、且つクラックの伝播も起こり易くなる。従ってその厚さは100μm以下に抑えることが望ましく、経済性も考慮すると一般的な厚さは5μm以上、より好ましくは10μm以上、好ましい上限は70μm、より好ましくは30μmである。
【0014】
該表層部のCr系めっき層に残留圧縮応力を与えるのは、該めっき皮膜の耐クラック性を高めるためである。即ち本発明者らの検討結果によると、Cr自身は高融点で耐摩耗性や耐溶融Zn性に優れたものであるにも拘らず、満足な鋳型寿命が得られない理由は、
▲1▼前述の如くCr系めっき層形成時の熱影響(使用前における下地層の硬化や密着性向上を目的とする熱処理工程)によって微細なクラックが生成しており、且つ
▲2▼溶湯との接触による急速加熱と冷却の過激な熱サイクル下で、特にメニスカス部にクラックが新たに生成・成長するためであり、
Cr系めっきままの状態ではめっき層が引張応力を有していることから、熱影響によるクラックの生成ないし成長が避けられず、該クラックを通して鋳型基材であるCuやCu合金層にまで溶融Znが侵入し、めっき層の剥離や鋳型基材の損傷が短時間のうちに進行するものと思われる。
【0015】
ところがCr系めっき層に、後述する様な微細粒子吹付け処理やバニシング加工を施して350MPa以上の残留圧縮応力を与えると、該吹付け処理によって塑性流動が起こり、コーキング作用によりクラックの多くが封孔・消失(即ち全体的に見て大幅に減少)すると共に、使用時における過酷な熱サイクルによるクラックの生成、成長も著しく抑制され、ZnアタックによるCr系めっき層の剥離や損傷が著しく抑えられることを知った。
【0016】
即ち本発明者らは、使用前の熱処理によってクラックが発生したCr系めっき層に微細粒子吹付けやバニシング処理を行なうと、該処理によってクラックの多くが封孔されると共に、該Cr系めっき層に残留圧縮応力が付与されて使用時におけるクラックの生成および成長も抑えられるという基礎実験結果を基に、該残留圧縮応力の値がクラックの封孔・消失・減少に及ぼす影響、および使用時におけるクラックの生成に及ぼす影響を定量的に把握にすべく、後記実施例を含めた多くの実験データの中から、微細粒子吹付け処理によってCr系めっき層に与える残留圧縮応力とめっき層断面に生成したクラックの減少率の関係、および使用時に受ける熱影響による新たなクラックの生成率の関係を整理したところ、図1,2に示す様な結果を得た。
【0017】
まず図1は、微細粒子の吹付けによって与えられるCr系めっき層の残留圧縮応力がクラックの封孔・消失・減少に及ぼす影響を示した図であり、Cr系めっき層に与えられる残留圧縮応力が350MPa以上(図の圧縮応力では−350MPa以下)であれば、クラックのほぼ50%が封孔されて消失し、より好ましくは400MPa以上(図では−400MPa以下)、更に好ましくは500MPa以上(図では−500MPa以下)になると、クラックのほぼ80%以上、更にはほぼ100%が封孔されて消失し、鋳型寿命の大きな支配要因であるZnアタックが効果的に阻止されることが分かる。
【0018】
ところで原理上は、未封孔のクラックが少しでも残留しておれば、Znアタック自体は発生する。しかしながら実際に観測されるところによれば、クラック数が少なくなると、仮にZnアタックを生じてもクラック周辺の損傷部分が発展的に連結して皮膜が一気に剥離するという状況は極めて生じ難くなることが分かった。即ち封孔率が100%でなくとも、例えば50%程度以上となれば、実用面ではZnアタックの不具合は殆んど無視し得る程度に改善されるのである。
【0019】
また図2は、残留圧縮応力と断面クラック数の関係を示すグラフであり、試験にはガラスビーズ(#100)を用い、処理時間を0〜120秒の間で変化させた。図2によると、残留圧縮応力が圧縮側に大きい試料では、熱サイクル試験後もクラックが生じておらず、これは熱サイクルを受けてもクラックが開口せず、Znの侵入系路が断たれて実用面でのZnアタック現象を生じさせなかったものと考えられる。
【0020】
尚本発明において、350MPa以上の残留圧縮効力が与えられるCrめっき層は、その全面にわたって当該値の残留圧縮効力を与える必要はなく、熱衝撃とZnアタックを最も受け易いメニスカス部に上記の残留圧縮応力を与えればよく、例えば連続鋳造鋳型などでは該メニスカス部が上下50mm程度の範囲で変動するのが通常であるので、少なくともこの領域、より好ましくはメニスカス部の上下100mmの範囲に上記値の残留圧縮応力を与えておけば、本発明の目的は十分に果たすことができる。
【0021】
また、上記Crめっき層の残留圧縮応力は、使用時における溶融金属の温度や鋳造状況によって変わるので、使用中あるいは使用後の残留圧縮応力によって規定することは適当でなく、上記で規定する残留圧縮応力の値は、鋳造熱等の影響を受けておらない使用前の値を意味する。
【0022】
上記で定める残留圧縮応力は公知のX線応力測定法によって求めることができる。即ち、結晶質材料に応力が加わって変形すると、結晶の格子面間隔が無歪状態の値から変化してくる。X線応力測定法はこの現象を利用し、X線回折角の測定値から格子面間隔の変化量を求め、それから弾性力学的に残留圧縮応力を算出する方法であり、本発明で採用した算出手法は後述するが、測定誤差を極力少なくして再現性を高めるには、好ましくは4点以上の測定値の平均値として求めることが望ましい。但し、測定手法や測定条件などは必ずしも後述するものに限定されるものではなく、必要に応じて適宜変更することが可能である。なお別手法を採用した場合は、必要により比較・修正することが望まれる。
【0023】
Cr系めっき層に残留圧縮応力を与える為の手段は特に制限されないが、前述の如くこの処理では、同時に使用前のCr系めっき層に生じたクラックを封孔・消失・減少させることが必要であるので、ショットピーニング処理(ドライホーニング、液体ホーニング、サンドブラストなどを包含する、以下同じ)やローラバニシング処理の如く、表面のCr系めっき層に物理的な衝撃を与えることのできる方法を採用すべきであり、最も実用性の高いのはショットピーニング法の如く微細粒子を吹き付ける方法である。尚ショットピーニング処理に当たっては、Cr系めっき層の異常摩耗や劣化を起こさせることなく、クラックの封孔と十分な残留圧縮応力を与え得る様、ショットされる微細粒子の種類や粒径などに応じて、ショット圧力や処理時間等を適正に制御すれば良い。本発明者らが実験によって確認した好ましいショットピーニング条件を例示すると下記の通りである。
投射角度 :30〜90度
ビーズ種類:SUS、ガラスビーズ、ジルコニアビーズ
ビーズ径 :直径30〜300μm(#50〜#300程度)の略球形
空気圧 :2〜10kg/cm3 より好ましくは3〜7kg/cm3
投射距離 :5〜100mmより好ましくは5〜30mm
投射時間 :1〜120秒より好ましくは5〜100秒
【0024】
即ちショットピーニングに用いるビーズとしては、様々の市販品があり、Cr系めっき層の表面性状をいたずらに悪化させないものであればその種類の如何は問わないが、好ましくは、長寿命で錆びないステンレスビーズ、セラミックス(ジルコニア等)ビーズ、錆びることなくコスト的にも有利なガラスビーズ等が推奨される。また、ビーズ径が小さ過ぎる場合は満足のいくクラックの封孔・消失・減少効果や残留圧縮応力付与効果が得られ難く、逆に大き過ぎる場合はめっき層の表面性状を悪化させる傾向が生じてくる。
【0025】
空気圧も、めっき表面性状の悪化やめっき剥離などを起こすことなく十分なクラックの封孔・消失・減少効果や残留圧縮応力付与効果を得る為の好ましい範囲を選択している。投射距離は上記の範囲である限り全く問題ないが、距離が短か過ぎると投射面積が狭くなって処理効率が悪く、逆に長過ぎるとビーズの投射密度が低くなるばかりでなく、投射圧力の損失も大きくなって満足のいくクラック封孔・消失・減少効果や残留圧縮応力付与効果が得られ難くなる。投射時間は、1投射領域当たり1〜120秒程度で十分であり、過度に長くなるとめっき層の損傷、劣化、剥離を起こす恐れが出てくる。
【0026】
いずれにしても、Cr系めっき層に350MPa以上の残留圧縮応力を付与し得る様な条件で、ショットピーニング処理やバニシング処理を行なえば、Cr系めっき層表面に存在するクラックの多くが封孔・消失・減少すると共に、その後に過酷な熱サイクルを受けた時でもクラックの新たな生成や成長は起こらず、Znアタック現象による鋳型の劣化を可及的に抑えることが可能となる。但し、残留圧縮応力が過度に高くなる様な条件設定を行なうと、めっき層の表面劣化や剥離などを起こす恐れが生じてくるので、1,000MPa程度以下に抑えることが望ましい。Cr系めっき層に与えるより好ましい残留圧縮応力は450〜800MPaの範囲である。
【0027】
なおショットピーニング処理を行なえば、Cr系めっき層への残留圧縮応力の付与およびめっき表面のクラックの封孔・消失・減少に加えて、処理面の硬度も向上して耐摩耗性が一層高められるという副次的効果も得ることができる。またCr系めっき表面のクラックを封孔・消失・減少を無くすことによる副次的効果として、鋳型下方部での冷却水や腐食性物質の侵入が阻止されて鋳型の耐食性も高められるので、こうしたことも鋳型寿命の延長に寄与してくる。
【0028】
またCrめっき層を2層以上形成する場合、下層側のCrめっき層にショットピーニング処理を施して残留圧縮応力を付与した後、その上にCrめっき層を形成すれば、該ショットピーニング処理によって表面に微細な凹凸が与えられ、アンカー効果によって第2層の密着性が高められ、また該凹凸により第2層の結晶構造は第1層と異なって隣り合った結晶が入り込んだ構造となり、全体としてのめっき層を上から下まで貫通する様なクラックが形成され難くなるといった効果も得ることができる。
【0029】
尚本発明を実施する際においても、めっき層の硬度調整や密着性向上を期してめっき処理後に熱処理を行なうことが有効であるが、この工程では前述の如くCr系めっき層にクラックが発生するので、この熱処理は残留圧縮応力の付与前に行ない、その後で行なわれる残留圧縮応力付与と同時に、該クラックの封孔・消失・減少を行なうべきである。
【0030】
上記では、本発明の基本思想となる「表層Cr系めっき層のクラック封孔・消失・減少と残留圧縮応力付与」について説明したが、このCr系めっき層を少なくとも2層のCrまたはCr系合金層によって構成する場合は、そのうち少なくとも1層の残留圧縮応力を350MPa以上とすればよく、該CrまたはCr系合金層の間に鉄族金属の少なくとも1種を主成分とする金属層または合金層を形成すると、使用時におけるCr系めっき層のクラック発生を一層効果的に抑えることができるので好ましい。
【0031】
即ち、例えば電気めっき法等によって単層のめっき皮膜を形成する場合、該めっき皮膜による十分な耐溶湯付着性を確保するには、前述の如くめっき厚さを0.3μm程度以上にすることが望ましい。ところが、Cr系めっき層が厚くなるにつれてめっき層の内部応力は急増し、その結果としてめっき皮膜にクラックが生じ易くなるばかりでなく、クラックの伝播も進み易くなる傾向があり、こうした内部応力による障害を回避するための単層めっき層の厚さは、概ね50μm以下が目安となる。
【0032】
しかし本発明者らが種々研究を進めたところによると、上記Cr系めっき層を複層構造とし、少なくとも2層のCrまたはCr合金層によって構成すると共に、該めっき層の間に鉄族金属の少なくとも1種を主成分とする合金層を介在させることによって単位めっき層当りの厚さを薄くしてやれば、各単位めっき層内の内部応力を小さく抑えると共に、単位めっき層にクラックが発生したとしても該クラックの中断ないし分散が起こり、鋳型基材に至るまでのクラックの成長が起こらなくなり、その結果としてZnアタック現象が阻止されて鋳型寿命を更に延長することができるのである。
【0033】
ここで、CrまたはCr合金層の間に介在させる金属層として鉄族金属(Fe,Co,Ni)の少なくとも1種を主成分とする金属または合金を選択したのは、鉄族金属はCrとの親和性が高くて優れた層間密着性を得ることができる他、その膨張率がCrと近似しており、しかも高融点でZn侵食量も少なくてクラックを分断するための中間層素材として最も適当であることによる。鉄族金属の中でも特に好ましいのはCoである。
【0034】
該鉄族金属層の好ましい厚さは0.3μm以上、より好ましくは3〜20μmであり、その理由は、該鉄族金属層が薄過ぎると、Crめっき層間に設ける中間層として十分な密着性が得られにくくなるばかりでなく、クラック分断効果も不十分となり、逆に厚くし過ぎることは経済的に好ましくないからである。該鉄族金属層を介して形成される各CrまたはCr合金層の好ましい厚さは、前述の如く0.3μm以上とすべきであるが、クラック分断効果や表層部の耐溶湯付着性、耐摩耗性および経済性等を総合的に考慮した好ましい下限は2μm、より好ましくは5μm、好ましい上限は50μm、より好ましくは30μmである。また、鉄族金属層を含めた全体としてのめっき層数は、少なくとも3層以上であればよいが、めっき層数を悪戯に多くすることはめっき作業性や経済性にマイナスとなるので、5層ないし7層までに抑えるのが良く、通常は3層構造までで目的を十分に果たすことができる。
【0035】
更に本発明においては、前記複層構造のCr系めっき層あるいは単層構造のCr系めっき層と、基材となるCuまたはCu合金製鋳型基材との密着性を高めるため、これらCr系めっき層と鋳型基材との間に、鋳型基材側に、Niおよび/またはFeを主成分とする合金めっき層からなる下地層を形成すると共に、Cr系めっき層側には、Feおよび/またはCoもしくはそれらを主成分とする合金からなる中間層を形成すると、鋳型寿命を更に延長することができるので好ましい。
【0036】
ここで、下地層としてNiおよび/またはFeを主成分とする合金めっきを選択した理由は、これらがCuまたはCu合金鋳型基材に対して高い密着性向上効果を有しているばかりでなく、該鋳型基材およびその上に中間層として形成されるFeおよび/またはCoもしくはそれらを主成分とする合金と接触した状態で相互に熱拡散を起こし易く、めっき層全体としての密着性や鋳型基材との一体性が高められ、鋳型内面被覆としての耐摩耗性を著しく高めるからである。こうした作用を有効に発揮させる意味から、該下地層の好ましい厚さは20μm以上、より好ましくは50μm以上であるが、あまり厚くすることは経済的に不利であるので200μm程度以下に抑えるのが一般的である。
【0037】
上記下地層を構成するNiおよび/またはFe系合金めっき中に含まれる好ましい元素としては、C,P,B,W,Mn,Cu,Mo,Cr等が挙げられ、これらは単独もしくは2種以上を含み得る。
【0038】
また、上記下地層の上側で且つCr系めっき層の下側に形成される中間層として、Feおよび/またはCoもしくはそれらを主成分とする合金を選択した理由は、これらがCrとCuの中間の熱膨張率を有しており、熱サイクルを受けた時の熱膨張差に伴う内部応力によってめっき剥離を起こすのを防止する上で最も好ましく、しかも高融点でZn侵食量が少なくてクラックの分断にも適しており、更にはこれらの金属は、加熱条件下でCrやNi等と相互に固溶し易く、表層側のCr系めっき層および下地層との間で相互に拡散接合して層間接合力の向上に有効に作用し、めっき層全体としての耐久性を高める作用を発揮するからである。こうした作用を有効に発揮させる意味から、該中間層の好ましい厚さは0.3μm以上、より好ましくは2μm程度以上であるが、あまり厚くすることは経済的に不利であるので望ましくは50μm程度以下に抑えるのがよく、最も一般的な中間層の厚さは3〜20μmの範囲である。
【0039】
尚、前記Cr系めっき層や下地層、中間めっき層等の形成法には一切制限がなく、たとえば電気めっき法や真空蒸着法、イオンプレーティング法、スパッタリング法、CVD法等の気相めっき法、溶射法などを任意に選択して採用することができる。
【0040】
【実施例】
以下、実施例を挙げて本発明を具体的に説明するが、本発明はもとより下記実施例によって制限を受けるものではなく、前・後記の趣旨を逸脱しない範囲で変更を加えて実施することも勿論可能であり、それらは全て本発明の技術範囲に包含される。
【0041】
実施例
脱酸銅よりなる角棒(6mm角×80mm)に、電気めっき法によって表3,4に示す各種のめっき層を形成した後、300〜500℃で30〜300分の熱処理を施し、その一部についてはショットピーニング処理またはロールバニシング加工を行なって、Cr系めっき層に所定の残留圧縮応力を付与すると共に、クラックを封孔・消失させた。代表的なめっき条件を表1に、またショットピーニング処理条件を表2に示す。得られた各めっき層形成材について、下記の方法で試験を行ない、各めっき層のクラック数や損傷率を調べた。結果を表3,4に示す。
【0042】
[耐Znアタック性評価試験]
各試料を、450℃の溶融Znに30分間浸漬してから取り出し、めっき層を含めた任意の縦断面10箇所を顕微鏡観察し、表層部のCr系めっき層が消失している部分の長さの割合によってめっき損傷率を評価した。
【0043】
[耐クラック性評価試験]
各試料について、450℃⇔室温の熱サイクルを10回繰り返した後、めっき層を含めた縦断面10mmの長さを顕微鏡観察し、鋳型基材まで到達しているクラックの数を調べた。また、銅合金基材(20mm角×10mm)に、上記と同じ各種のめっき層を形成し、ショットピーニング法により条件を種々変化させて残留圧縮応力を変化させた試料を作製し、上記と同じ熱サイクルを付加した後のクラック数を同様にして調べた。
【0044】
[残留圧縮応力の測定法]
下記のX線残留応力測定条件によって測定した。
X線管球 :Cr−Kα
フィルター:V
管電圧 :40kV
管電流 :30mA
照射面積 :2mm×2mm
回折面 :Cr(211),ASTM6−0694
回折角 :2θ=153.0°
入射角 :ψ=0,15,30,45°
応力定数 :−249.33MPa/deg
【0045】
【表1】
【0046】
【表2】
【0047】
【表3】
【0048】
【表4】
【0049】
表3,4からも明らかである様に、本発明の規定要件を全て満足する実施例では、いずれも溶融Znに浸漬処理したときの損傷率が少なく優れた耐溶融Zn性を有しており、また熱サイクルを与えた時のクラック数も少なく、特にCr系めっき層の下地層としてFe系もしくはNi系の合金めっき層を形成し、中間層としてFe系もしくはCo系めっき層を形成したもの、あるいはCr系めっき層を複層構造とし、Cr系めっき層の間に鉄族系めっき層を介装させたものでは、耐溶融Zn性および耐クラック性において非常に優れたものであることが分かる。
【0050】
これらに対し、表層部にCr系めっき層を形成し、あるいは更にCo系やNi系の下地めっき層を形成したものであっても、いずれのCr系めっき層にも残留圧縮応力が与えられておらず引張応力が作用している比較例では、耐溶融Zn性(損傷率)が非常に悪く、耐クラック性も劣悪であることが分かる。
【0051】
【発明の効果】
本発明は以上の様に構成されており、Zn含有溶湯を用いる鋳造用鋳型の溶湯との接触面における少なくともメニスカス部に形成されるCr系めっき層に残留圧縮応力を与えることによって、従来の引張応力を有するCr系めっき層に比べて格段に優れた耐溶融Zn性と耐クラック性を得ることができ、Cr系めっき層の有する優れた耐熱性や耐溶融亜鉛性とも相まって、鋳型寿命を大幅に延長し得ることになった。
【0052】
また請求項3,4の発明によれば、鋳型基材と前記Cr系めっき層との間にNiおよび/またはFeを主成分とする合金めっき層を下地層として形成し、且つその上にFeまたはCo系の中間層を形成してCrめっき層の密着性等を高め、あるいはCr系めっき層を多層構造としCr系めっき層の間に鉄族系金属もしくは合金めっき層を介在させ、鋳型基材とCr系めっき層の密着性を高めると共に層間の熱膨張差を緩和すれば、めっき層の層間剥離を一段と抑制しつつ耐熱摩耗性を高めることができ、鋳型の一層の寿命延長を図ることができる。
【0053】
更に請求項5の発明によれば、Cr層への微細粒子の吹き付けによって、該Cr層に存在する微細なクラックを埋めると共に、当該Cr層に簡単に残留圧縮応力を与えることができ、耐Znアタック性をより効果的に高めることができる。
【図面の簡単な説明】
【図1】Cr系めっき層の残留圧縮応力とクラック数の関係を示すグラフである。
【図2】熱サイクル試験前後におけるCr系めっき層の残留圧縮応力とクラック数の関係を示すグラフである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mold having improved durability used when casting a metal containing Zn.
[0002]
[Prior art]
Currently, the most widely used mold for continuous casting of steel or the like is a mold made of Cu or Cu alloy having a high thermal conductivity and high cooling efficiency. In continuous casting, an indirect or direct water cooling structure is attached to the mold in order to efficiently promote formation and growth of the solidified shell.
[0003]
However, since the molten metal poured into the continuous casting mold is very hot, the contact surface with the molten molten metal is severely damaged, and the life limit is reached in a short time. Therefore, as a means for extending the life of the mold, a method of forming a Cr-based plating layer excellent in resistance to melting and abrasion on the contact surface of the mold with the molten metal is employed. Also in the formation of the Cr-based plating layer, a method for strengthening the inner surface by variously improving the plating structure has been proposed. As a typical example, a Ni, Co, or Ni—Co alloy plating layer is formed as the first layer, a Ni or Co alloy plating layer containing P or B is formed as the second layer, and A method of forming an inner surface reinforcing layer having a three-layer structure with Cr-based plating as the three layers (outermost layer portion) (Japanese Patent Publication No. 52-50734), and an inner surface reinforcing layer having a two-layer structure in which the first layer is omitted A forming method (Japanese Patent Laid-Open No. 57-85650), and a method of continuously forming an electrolytic Cr plating layer on an electrolytic Ni plating layer to form an inner surface protective layer having a two-layer structure or more (Japanese Patent Laid-Open No. 7-284881) Etc. are exemplified.
[0004]
[Problems to be solved by the invention]
However, when using Zn-plated scrap material as a raw material, when Zn is mixed in molten steel, even if the protective film made of Cr-based plating as described above is formed, the Cr plating Zn penetrates and penetrates from the cracks existing inside, and the underlying plating layer and the mold base layer are damaged. A phenomenon in which the Zn contained as an impurity in molten steel erodes or peels the plating film and significantly shortens the mold life is called a Zn attack phenomenon, which is a serious problem.
[0005]
Such a problem is not limited to casting molten steel mixed with Zn, but is a common problem when casting using a Cu-Zn alloy, an Al-Zn alloy, or the like, that is, using a molten metal containing Zn. The problem of Zn attack frequently occurs at the meniscus portion of the mold.
[0006]
On the other hand, particularly the meniscus portion of the practical mold is exposed to a severe thermal cycle consisting of rapid heating and cooling by contact with the molten metal. And in the case where a Cr-based plating layer is formed as an inner surface protective layer (including the case where the Cr layer has a multilayer structure of two or more layers), when the plating layer is formed (for the purpose of hardening the base layer and improving adhesion before use) As a result of the thermal effect of the heat treatment process), a strong tensile stress acts on the plating film, so there are not a few fine cracks even in the as-plated state, and the severe thermal cycle as described above that occurs during use. In response, the generation and growth of cracks proceeds further. When cracks are present or generated in the Cr plating layer in the surface layer portion, the above-described Zn attack phenomenon occurs, and the plating film is damaged or peeled off in a short time.
[0007]
And with the mold inner surface protection technology as described above, improvement of the Zn resistance and crack resistance of the Cr-based plating film itself is intended, but in reality, the crack cannot be completely eliminated, and the crack No measures have been taken to prevent the Zn attack phenomenon due to the above, and this is considered to be the reason that the life of the mold whose inner surface is protected by Cr plating cannot be sufficiently extended. That is, in order to extend the life of a mold used for casting molten metal containing Zn, in addition to the wear resistance and heat resistance of the protective plating layer formed on the inner surface of the mold, the Zn resistance of the coating itself, etc., before use. Established a technology that can reduce the cracks that occur in the heat treatment process of steel as much as possible, suppress the generation and growth of new cracks due to severe thermal cycles after use, and prevent the Zn attack phenomenon as much as possible. There is a need to.
[0008]
The present invention has been made in view of such circumstances, and its purpose is excellent in heat resistance and wear resistance, as well as cracks generated during the formation of a Cr-based plating layer formed as a surface protective layer. In addition to reducing or eliminating or reducing as much as possible, it also suppresses new generation and growth of cracks that occur especially at the mold meniscus, and effectively prevents damage and peeling of the plating film due to the Zn attack phenomenon. As a result, the present invention intends to establish a technique capable of greatly extending the mold life.
[0009]
[Means for Solving the Problems]
The casting mold of the present invention that has solved the above problems is a casting mold in which a Cr-based plating layer is formed as a protective film on a contact surface with a molten metal in a mold base material made of Cu or a Cu-based alloy. The Cr-based plating layer at least at the meniscus portion of the mold has a residual compressive stress of 350 MPa or more, or
A casting mold in which at least two Cr-based plating layers are formed as a protective film on a contact surface with a molten metal in a mold substrate made of Cu or a Cu-based alloy, and the Cr-based at least in the meniscus portion of the mold There is a gist in that at least one of the plating layers has a residual compressive stress of 350 MPa or more.
[0010]
Between the Cr-based plating layer and the mold base material in the mold of the present invention, a base layer made of an alloy plating layer mainly composed of Ni and / or Fe is formed on the mold base side, and Cr-based By forming an intermediate layer made of Fe and / or Co or an alloy containing them as the main component on the plating layer side, the adhesion to the mold substrate as a whole of the plating layer is improved and when it is affected by heat. It is preferable because damage and peeling of the plating layer due to the difference in thermal expansion can be more effectively suppressed, and the mold life can be further extended. Furthermore, when the Cr-based plating layer is composed of at least two Cr or Cr-based alloy layers, a metal layer or alloy containing at least one iron group metal as a main component between the Cr or Cr-based alloy layers. By interposing the layer, the growth of cracks that may be caused by thermal shock is interrupted or divided in the plating layer, and it is possible to more reliably suppress the intrusion of Zn to the mold substrate, and as a result, Zn This is preferable because the attack phenomenon can be more effectively suppressed.
[0011]
In the present invention, a Cr-based plating layer having a residual compressive stress of 350 MPa or more can be easily obtained by spraying fine particles and applying a predetermined residual compressive stress after the formation of the Cr-based plated layer.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
First of all, the precondition in the present invention, that is, the reason why the surface layer portion is composed of a Cr-based plating layer (Cr or Cr alloy layer) is that the melting point of Cr or its alloy is high and the solubility with respect to molten Zn is low, and wear resistance and heat resistance It is because it is excellent in property. The method for forming the Cr-based plating layer is not particularly limited. For example, wet plating methods such as electroplating methods, vapor deposition methods such as vacuum deposition, ion plating, sputtering, and CVD can be used. The most common is electroplating.
[0013]
The Cr plating layer preferably has a plating thickness of 0.3 μm or more in order to ensure the resistance to molten metal adhesion, which is a feature of Cr plating. However, as the Cr plating layer becomes thicker, the internal stress, particularly the tensile stress, tends to increase, and as a result, cracks are likely to occur in the Cr plating film, and crack propagation is also likely to occur. Therefore, it is desirable to suppress the thickness to 100 μm or less, and considering the economy, the general thickness is 5 μm or more, more preferably 10 μm or more, and the preferable upper limit is 70 μm, more preferably 30 μm.
[0014]
The reason why the residual compressive stress is applied to the Cr-based plating layer of the surface layer portion is to increase the crack resistance of the plating film. That is, according to the study results of the present inventors, the reason why a satisfactory mold life cannot be obtained despite the fact that Cr itself has a high melting point and is excellent in wear resistance and fusion Zn resistance,
(1) As described above, fine cracks are generated due to the heat effect during the formation of the Cr-based plating layer (a heat treatment step for the purpose of curing the base layer and improving adhesion before use), and
(2) Under the extreme thermal cycle of rapid heating and cooling due to contact with the molten metal, cracks are newly generated and grown especially in the meniscus area.
Since the plating layer has a tensile stress in the state of Cr-based plating, the generation or growth of cracks due to thermal effects is inevitable, and molten Zn reaches the Cu or Cu alloy layer as the mold substrate through the cracks. It is considered that peeling of the plating layer and damage to the mold substrate proceed in a short time.
[0015]
However, if a Cr-based plating layer is subjected to a fine particle spraying process or burnishing process as described later to give a residual compressive stress of 350 MPa or more, the spraying process causes plastic flow and many cracks are sealed by the coking action. Holes and disappearances (that is, drastically reduced overall), crack generation and growth due to severe thermal cycling during use are significantly suppressed, and peeling and damage of the Cr-based plating layer due to Zn attack are significantly suppressed I knew that.
[0016]
That is, when the present inventors performed fine particle spraying or burnishing treatment on a Cr-based plating layer in which cracks were generated by heat treatment before use, many of the cracks were sealed by the treatment, and the Cr-based plating layer Based on the basic experiment results that the generation and growth of cracks during use are suppressed by applying residual compressive stress to the cracks, the effect of the residual compressive stress value on the sealing, disappearance, and reduction of cracks and during use In order to quantitatively understand the effect on crack generation, the residual compressive stress applied to the Cr-based plating layer and the cross section of the plating layer are generated from a lot of experimental data including the examples described later by the fine particle spraying process. Fig. 1 and Fig. 2 show the relationship between the reduction rate of cracks and the relationship between the generation rate of new cracks due to the heat effect during use. It was.
[0017]
First, FIG. 1 is a diagram showing the effect of residual compressive stress of a Cr-based plating layer applied by spraying fine particles on the sealing / disappearance / reduction of cracks. Is 350 MPa or more (in the figure, compressive stress is −350 MPa or less), almost 50% of the cracks are sealed and disappeared, more preferably 400 MPa or more (in the figure, −400 MPa or less), and even more preferably 500 MPa or more (see FIG. In the case of -500 MPa or less), it can be seen that approximately 80% or more and further 100% of the cracks are sealed and disappeared, and Zn attack, which is a major dominating factor of the mold life, is effectively prevented.
[0018]
By the way, in principle, if an unsealed crack remains even a little, Zn attack itself occurs. However, according to actual observations, when the number of cracks decreases, even if a Zn attack occurs, the situation where the damaged portions around the cracks are progressively connected and the film peels off at a stretch can hardly occur. Do you get it. That is, even if the sealing rate is not 100%, for example, if it is about 50% or more, the defect of Zn attack is improved to a level that can be almost ignored.
[0019]
FIG. 2 is a graph showing the relationship between the residual compressive stress and the number of cross-sectional cracks. Glass beads (# 100) were used for the test, and the treatment time was varied between 0 and 120 seconds. According to FIG. 2, in the sample having a large residual compressive stress on the compression side, no crack was generated after the thermal cycle test, and this crack did not open even after the thermal cycle, and the Zn intrusion system was cut off. It is considered that the Zn attack phenomenon in practical use was not caused.
[0020]
In the present invention, the Cr plating layer to which the residual compression effect of 350 MPa or more is given need not give the residual compression effect of the value over the entire surface, and the above-mentioned residual compression is applied to the meniscus portion that is most susceptible to thermal shock and Zn attack. For example, in a continuous casting mold, the meniscus portion usually fluctuates in the range of about 50 mm above and below, so that the above value remains at least in this region, more preferably in the range of 100 mm above and below the meniscus portion. If compressive stress is given, the object of the present invention can be sufficiently achieved.
[0021]
Further, since the residual compressive stress of the Cr plating layer varies depending on the temperature of the molten metal at the time of use and the casting condition, it is not appropriate to define it by the residual compressive stress during or after use, and the residual compressive stress defined above. The value of stress means a value before use which is not affected by casting heat or the like.
[0022]
The residual compressive stress determined above can be obtained by a known X-ray stress measurement method. That is, when a stress is applied to the crystalline material and the crystal material is deformed, the lattice spacing of the crystal changes from the value in the unstrained state. The X-ray stress measurement method uses this phenomenon to calculate the amount of change in the lattice spacing from the measurement value of the X-ray diffraction angle, and then to calculate the residual compressive stress elastodynamically. The calculation employed in the present invention Although the method will be described later, in order to reduce the measurement error as much as possible and improve the reproducibility, it is preferable to obtain an average value of four or more measured values. However, the measurement method, measurement conditions, and the like are not necessarily limited to those described below, and can be appropriately changed as necessary. If another method is adopted, it is desirable to make a comparison / correction if necessary.
[0023]
The means for applying the residual compressive stress to the Cr-based plating layer is not particularly limited, but as described above, in this treatment, it is necessary to simultaneously seal, eliminate, or reduce cracks generated in the Cr-based plating layer before use. Therefore, a method that can physically impact the Cr-based plating layer on the surface, such as shot peening (including dry honing, liquid honing, sandblasting, etc.) and roller burnishing should be adopted. The most practical method is a method of spraying fine particles such as a shot peening method. In the shot peening process, depending on the type and particle size of the fine particles to be shot so as to provide crack sealing and sufficient residual compressive stress without causing abnormal wear or deterioration of the Cr plating layer. Thus, the shot pressure, processing time, etc. may be controlled appropriately. Examples of preferable shot peening conditions confirmed by the present inventors through experiments are as follows.
Projection angle: 30 to 90 degrees
Bead type: SUS, glass beads, zirconia beads
Bead diameter: substantially spherical shape with a diameter of 30 to 300 μm (about # 50 to # 300)
Air pressure: 2-10 kg / cmThree More preferably 3-7 kg / cmThree
Projection distance: 5 to 100 mm, more preferably 5 to 30 mm
Projection time: 1 to 120 seconds, more preferably 5 to 100 seconds
[0024]
That is, as the beads used for shot peening, there are various commercially available products, and any kind of beads can be used as long as they do not deteriorate the surface properties of the Cr-based plating layer. Beads, ceramics (zirconia, etc.) beads, glass beads that do not rust and are advantageous in terms of cost are recommended. Also, if the bead diameter is too small, it is difficult to obtain satisfactory crack sealing / disappearance / reduction effect and residual compressive stress imparting effect, and conversely, if it is too large, the surface property of the plating layer tends to deteriorate. come.
[0025]
As for the air pressure, a preferable range for obtaining sufficient crack sealing / disappearance / reduction effect and residual compressive stress imparting effect without causing deterioration of the plating surface properties or peeling of the plating is selected. The projection distance is not a problem as long as it is in the above range, but if the distance is too short, the projection area becomes narrow and the processing efficiency is bad, and conversely if it is too long, not only the projection density of the beads is lowered, but also the projection pressure is reduced. Loss also increases, making it difficult to obtain satisfactory crack sealing / disappearance / reduction effects and residual compressive stress imparting effects. The projection time is about 1 to 120 seconds per projection area. If the projection time is excessively long, the plating layer may be damaged, deteriorated, or peeled off.
[0026]
In any case, if shot peening treatment or burnishing treatment is performed under the condition that a residual compressive stress of 350 MPa or more can be applied to the Cr plating layer, many cracks existing on the surface of the Cr plating layer are sealed. In addition to disappearance and reduction, new crack generation and growth do not occur even when subjected to severe thermal cycles thereafter, and it is possible to suppress deterioration of the mold due to the Zn attack phenomenon as much as possible. However, if conditions are set such that the residual compressive stress becomes excessively high, the surface of the plating layer may be deteriorated or peeled off. Therefore, it is desirable to suppress the pressure to about 1,000 MPa or less. A more preferable residual compressive stress applied to the Cr-based plating layer is in the range of 450 to 800 MPa.
[0027]
If shot peening is performed, in addition to applying residual compressive stress to the Cr plating layer and sealing / disappearance / reduction of cracks on the plating surface, the hardness of the treated surface is also improved and wear resistance is further enhanced. A secondary effect can also be obtained. In addition, as a secondary effect of eliminating cracking, disappearance, and reduction of cracks on the Cr-based plating surface, the penetration of cooling water and corrosive substances at the lower part of the mold is prevented, and the corrosion resistance of the mold can be improved. This also contributes to the extension of the mold life.
[0028]
Further, when two or more Cr plating layers are formed, after applying a shot peening process to the lower Cr plating layer to give a residual compressive stress, a Cr plating layer is formed on the Cr plating layer. Are provided with fine irregularities, the adhesion of the second layer is enhanced by the anchor effect, and the crystal structure of the second layer is different from the first layer due to the irregularities, so that adjacent crystals enter, It is also possible to obtain an effect that it is difficult to form a crack that penetrates the plating layer from top to bottom.
[0029]
In carrying out the present invention, it is effective to perform a heat treatment after the plating treatment in order to adjust the hardness of the plating layer and improve adhesion, but in this step, cracks occur in the Cr-based plating layer as described above. Therefore, this heat treatment should be performed before the application of the residual compressive stress, and simultaneously with the application of the residual compressive stress thereafter, the cracks should be sealed, eliminated, or reduced.
[0030]
In the above description, the “crack sealing / disappearance / reduction and application of residual compressive stress of the surface Cr-based plating layer”, which is the basic idea of the present invention, has been described. This Cr-based plating layer is composed of at least two Cr or Cr-based alloys. When constituted by layers, the residual compressive stress of at least one layer may be 350 MPa or more, and a metal layer or alloy layer mainly comprising at least one iron group metal between the Cr or Cr-based alloy layers It is preferable to form the cracks because cracks in the Cr-based plating layer during use can be more effectively suppressed.
[0031]
That is, when a single-layer plating film is formed by, for example, an electroplating method, the plating thickness should be about 0.3 μm or more as described above in order to ensure sufficient molten metal adhesion by the plating film. desirable. However, as the Cr plating layer becomes thicker, the internal stress of the plating layer increases rapidly, and as a result, cracks tend to occur in the plating film, and the propagation of cracks tends to progress easily. As a guideline, the thickness of the single-layer plating layer for avoiding the above is approximately 50 μm or less.
[0032]
However, according to various studies conducted by the present inventors, the Cr-based plating layer has a multi-layer structure and is composed of at least two Cr or Cr alloy layers, and an iron group metal is interposed between the plating layers. If the thickness per unit plating layer is reduced by interposing an alloy layer containing at least one kind as a main component, the internal stress in each unit plating layer can be kept small, and cracks may occur in the unit plating layer. The cracks are interrupted or dispersed, and crack growth up to the mold base material does not occur. As a result, the Zn attack phenomenon is prevented and the mold life can be further extended.
[0033]
Here, as the metal layer interposed between the Cr or Cr alloy layers, the metal or alloy mainly containing at least one of the iron group metals (Fe, Co, Ni) is selected. In addition to being able to obtain excellent interlaminar adhesion, the expansion coefficient is close to that of Cr, and it is the highest intermediate layer material for cracking with high melting point and low Zn erosion. By being appropriate. Of the iron group metals, Co is particularly preferable.
[0034]
The preferable thickness of the iron group metal layer is 0.3 μm or more, more preferably 3 to 20 μm because, if the iron group metal layer is too thin, sufficient adhesion as an intermediate layer provided between the Cr plating layers This is because not only is cracking difficult to obtain, but the effect of cracking is insufficient, and conversely, it is economically undesirable to make the film too thick. The preferable thickness of each Cr or Cr alloy layer formed through the iron group metal layer should be 0.3 μm or more as described above. However, the effect of crack division, adhesion of molten metal to the surface layer, A preferable lower limit in consideration of wearability and economic efficiency is 2 μm, more preferably 5 μm, and a preferable upper limit is 50 μm, more preferably 30 μm. In addition, the total number of plating layers including the iron group metal layer may be at least three or more, but increasing the number of plating layers mischievously results in negative plating workability and economy. It is preferable to limit the number of layers to seven or seven, and usually the purpose can be sufficiently achieved with a three-layer structure.
[0035]
Furthermore, in the present invention, in order to improve the adhesion between the multilayered Cr-based plating layer or the single-layered Cr-based plating layer and the Cu or Cu alloy mold base material as the base material, An underlayer made of an alloy plating layer mainly composed of Ni and / or Fe is formed on the mold substrate side between the layer and the mold substrate, and Fe and / or on the Cr-based plating layer side. It is preferable to form an intermediate layer made of Co or an alloy containing them as a main component because the mold life can be further extended.
[0036]
Here, the reason for selecting the alloy plating mainly composed of Ni and / or Fe as the underlayer is not only that they have a high adhesion improving effect on the Cu or Cu alloy mold base material, It is easy to cause mutual thermal diffusion in contact with Fe and / or Co or an alloy containing them as a main component formed on the mold substrate and an intermediate layer thereon, and adhesion and mold base as a whole plating layer This is because the integrity with the material is enhanced, and the wear resistance as the inner surface of the mold is remarkably enhanced. From the viewpoint of effectively exerting such an action, the preferable thickness of the underlayer is 20 μm or more, more preferably 50 μm or more. However, it is generally disadvantageous to make it too thick, so it is generally suppressed to about 200 μm or less. Is.
[0037]
Preferable elements contained in the Ni and / or Fe-based alloy plating constituting the underlayer include C, P, B, W, Mn, Cu, Mo, Cr, etc., and these may be used alone or in combination of two or more. Can be included.
[0038]
The reason why Fe and / or Co or an alloy containing them as a main component is selected as an intermediate layer formed on the upper side of the underlayer and on the lower side of the Cr-based plating layer is that these are intermediate between Cr and Cu. It is most preferable to prevent plating peeling due to internal stress due to the difference in thermal expansion when subjected to a thermal cycle, and has a high melting point and a small amount of Zn erosion, so It is also suitable for cutting, and these metals are easy to dissolve with Cr, Ni, etc. under heating conditions, and are diffused and bonded to each other between the Cr-based plating layer and the underlayer on the surface layer side. This is because it effectively acts to improve the interlaminar bonding force and enhances the durability of the entire plating layer. From the viewpoint of effectively exerting such an action, the preferable thickness of the intermediate layer is 0.3 μm or more, more preferably about 2 μm or more, but it is economically disadvantageous to make it too thick, and preferably about 50 μm or less. The most common intermediate layer thickness is in the range of 3-20 μm.
[0039]
In addition, there is no restriction | limiting in the formation method of the said Cr system plating layer, a base layer, an intermediate | middle plating layer, for example, vapor phase plating methods, such as an electroplating method, a vacuum evaporation method, an ion plating method, sputtering method, CVD method The thermal spraying method can be arbitrarily selected and employed.
[0040]
【Example】
Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited by the following examples, and may be implemented with modifications without departing from the gist of the preceding and following descriptions. Of course, they are possible and all fall within the scope of the present invention.
[0041]
Example
After forming various plating layers shown in Tables 3 and 4 on a square bar (6 mm square x 80 mm) made of deoxidized copper by electroplating, heat treatment is performed at 300 to 500 ° C. for 30 to 300 minutes. The part was subjected to shot peening treatment or roll burnishing to give a predetermined residual compressive stress to the Cr-based plating layer and to seal and eliminate the crack. Typical plating conditions are shown in Table 1, and shot peening treatment conditions are shown in Table 2. About each obtained plating layer forming material, the test was done by the following method and the crack number and damage rate of each plating layer were investigated. The results are shown in Tables 3 and 4.
[0042]
[Zn attack resistance evaluation test]
Each sample is taken out after being immersed in molten Zn at 450 ° C. for 30 minutes, and is subjected to microscopic observation at 10 arbitrary longitudinal sections including the plating layer, and the length of the portion where the Cr-based plating layer in the surface layer portion has disappeared The plating damage rate was evaluated by the ratio of.
[0043]
[Crack resistance evaluation test]
For each sample, the thermal cycle from 450 ° C. to room temperature was repeated 10 times, and then the length of 10 mm in longitudinal section including the plating layer was observed with a microscope to examine the number of cracks reaching the mold substrate. In addition, the same various plating layers as described above were formed on a copper alloy base material (20 mm square × 10 mm), and a sample in which the residual compressive stress was changed by variously changing the conditions by the shot peening method was prepared. The number of cracks after applying the thermal cycle was examined in the same manner.
[0044]
[Measurement method of residual compressive stress]
The measurement was performed under the following X-ray residual stress measurement conditions.
X-ray tube: Cr-Kα
Filter: V
Tube voltage: 40 kV
Tube current: 30 mA
Irradiation area: 2mm x 2mm
Diffraction surface: Cr (211), ASTM 6-0694
Diffraction angle: 2θ = 153.0 °
Incident angle: ψ = 0, 15, 30, 45 °
Stress constant: -249.33 MPa / deg
[0045]
[Table 1]
[0046]
[Table 2]
[0047]
[Table 3]
[0048]
[Table 4]
[0049]
As is clear from Tables 3 and 4, the examples satisfying all the requirements of the present invention all have excellent molten Zn resistance with low damage rate when immersed in molten Zn. In addition, the number of cracks when heat cycle is applied is small, especially Fe-based or Ni-based alloy plating layer is formed as the underlying layer of Cr-based plating layer, and Fe-based or Co-based plating layer is formed as the intermediate layer Alternatively, a Cr-based plating layer having a multilayer structure and an iron group-based plating layer interposed between Cr-based plating layers may be extremely excellent in resistance to fusion Zn and cracking. I understand.
[0050]
On the other hand, even if a Cr-based plating layer is formed on the surface layer portion or a Co-based or Ni-based base plating layer is formed, residual compressive stress is applied to any Cr-based plating layer. It can be seen that in the comparative example in which tensile stress is applied, the molten Zn resistance (damage rate) is very poor and the crack resistance is also poor.
[0051]
【The invention's effect】
The present invention is configured as described above, and by applying a residual compressive stress to the Cr-based plating layer formed at least on the meniscus portion in the contact surface with the molten metal of the casting mold using the Zn-containing molten metal, Compared to Cr-based plating layer with stress, it can provide much better resistance to molten Zn and crack, and combined with the excellent heat resistance and resistance to hot-dip zinc of Cr-based plating layer, greatly increases the mold life. Could be extended.
[0052]
According to the third and fourth aspects of the present invention, an alloy plating layer containing Ni and / or Fe as a main component is formed as a base layer between the mold base and the Cr-based plating layer, and Fe is formed thereon. Alternatively, a Co-based intermediate layer is formed to improve the adhesion of the Cr plating layer, or the Cr-based plating layer has a multilayer structure, and an iron group metal or alloy plating layer is interposed between the Cr-based plating layers. If the adhesion between the material and the Cr-based plating layer is increased and the thermal expansion difference between the layers is reduced, the delamination of the plating layer can be further suppressed and the heat-resistant wear resistance can be improved, thereby further extending the life of the mold. Can do.
[0053]
Further, according to the invention of claim 5, by spraying fine particles on the Cr layer, it is possible to fill in the fine cracks existing in the Cr layer, and to easily apply a residual compressive stress to the Cr layer. Attack property can be improved more effectively.
[Brief description of the drawings]
FIG. 1 is a graph showing the relationship between the residual compressive stress and the number of cracks in a Cr-based plating layer.
FIG. 2 is a graph showing the relationship between the residual compressive stress and the number of cracks in the Cr-based plating layer before and after the thermal cycle test.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03525997A JP3709038B2 (en) | 1996-03-21 | 1997-02-19 | Mold for casting of metal containing Zn |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6478896 | 1996-03-21 | ||
| JP6478796 | 1996-03-21 | ||
| JP26105096 | 1996-10-01 | ||
| JP8-261050 | 1996-10-01 | ||
| JP8-64788 | 1996-10-01 | ||
| JP8-64787 | 1996-10-01 | ||
| JP03525997A JP3709038B2 (en) | 1996-03-21 | 1997-02-19 | Mold for casting of metal containing Zn |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10156490A JPH10156490A (en) | 1998-06-16 |
| JP3709038B2 true JP3709038B2 (en) | 2005-10-19 |
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| JP03525997A Expired - Lifetime JP3709038B2 (en) | 1996-03-21 | 1997-02-19 | Mold for casting of metal containing Zn |
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| USRE40386E1 (en) * | 1998-11-06 | 2008-06-17 | Hitachi Ltd. | Chrome plated parts and chrome plating method |
| JP4845697B2 (en) * | 2006-12-05 | 2011-12-28 | 三島光産株式会社 | Continuous casting mold |
| JP4784779B2 (en) * | 2008-04-14 | 2011-10-05 | 日立オートモティブシステムズ株式会社 | Chrome plated parts |
| JP2011237816A (en) * | 2011-07-05 | 2011-11-24 | Canon Inc | Method for producing toner fine particle and mechanical pulverizing machine |
| JP7419983B2 (en) * | 2020-06-11 | 2024-01-23 | 株式会社デンソー | Mold surface treatment method |
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