JP3714730B2 - Coating device - Google Patents
Coating device Download PDFInfo
- Publication number
- JP3714730B2 JP3714730B2 JP18872596A JP18872596A JP3714730B2 JP 3714730 B2 JP3714730 B2 JP 3714730B2 JP 18872596 A JP18872596 A JP 18872596A JP 18872596 A JP18872596 A JP 18872596A JP 3714730 B2 JP3714730 B2 JP 3714730B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- coated
- nozzle
- nozzle body
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Coating Apparatus (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、高粘度の塗布液を吐出して薄膜の塗膜を形成する塗布装置に関するものである。
【0002】
【従来の技術】
半導体素子を放熱部材の冷却構体に取付ける際、半導体素子と冷却構体との接触熱抵抗を低減するため、前記冷却構体の表面に熱良伝導材を塗布して半導体素子を取付けている。従来の冷却構体への熱良伝導材の塗布は、図6に示すようなチューブ20に熱良伝導材の塗布液が封入されており、このチューブ20から塗布液を押し出して冷却構体に棒状に塗布していた。
【0003】
【発明が解決しようとする課題】
ところが、冷却構体に熱良伝導材を棒状に塗布しているため、半導体素子を冷却構体にねじ締め固定したとき、厚い塗膜が支点となり、半導体素子が反って半導体素子内の絶縁層が破壊するという問題があった。
そこで、本発明は、膜厚を均一の厚さで平坦に塗布できる塗布装置および塗布用ノズルを提供することを目的とする。
【0004】
【課題を解決するための手段】
上記問題点を解決するために、本発明は、直方体に構成されたノズル本体と、前記ノズル本体の側面に設けた注入口と、この注入口に直角に配置し前記ノズル本体の長手方向に設けた筒状の等圧室と、この等圧室に連通し前記ノズル本体の長手方向に沿って開口する排出口と、ノズル本体の前記排出口の少なくとも被塗布材の進行方向と反対側の先端部を平坦に構成した馴らし面とを有し、前記排出口を上向きにして配置する塗布用ノズルと、前記塗布用ノズルの傍らに配置されるとともに前記機枠に設けられ、被塗布材を塗布面を下にして上部より載置する載置面と、前記塗布用ノズルの両側に排出口と直角に配置して機枠に取付けたガイドレールと、前記ガイドレールに載置した被塗布材をガイドレールに沿って移動させる駆動装置と、前記機枠に設け前記被塗布材を検出し前記駆動装置を始動する検出センサと、前記被塗布材の塗布面を検出し塗布用ノズルから塗布液を吐出させる検出センサとを設けた塗布装置を構成するようにしたものである。
【0005】
【発明の実施の形態】
以下、本発明を図に示す実施例に基づいて説明する。
図1は、本発明の実施例を示す塗布用ノズルの断面図、図2は本発明の実施例を示す塗布用ノズルの側断面図、図3は本発明の実施例を示す塗布用ノズルを取付けた塗布装置の斜視図、図4、5は本発明の実施例を示す塗布装置の動作説明図である。
図において、1は直方体のノズル本体で、一方側の側面に注入口2が設けられ、他方側の側面に直方体の長手方向に沿って開口する排出口3が設けられている。4は等圧室で、前記注入口2と排出口3との間に直方体の長手方向に沿って筒状に形成してある。5は排出口3の両側に平坦に形成した馴らし面である。6は塗布装置で、ノズル本体1の両側に前記ノズル本体の排出口3と直角に配置したガイドレール9が機枠7に取付けられている。前記ノズル本体1は、排出口3を上方に向けて機枠7に取付け、図示しない塗料貯留槽にノズル本体1の注入口2を接続してある。13は機枠7に設けた被塗布材8の載置面で、この載置面13にガイドレール9を連設している。10は電動シリンダーで、一端を前記機枠7に固定し、他端に載置面13に突出させた作動体10aが設けられている。11は機枠7に取付けた検出センサで、載置面13の被塗布材8を検出し電動シリンダー10を始動するようにしてある。12は載置面13に設けた検出センサで、被塗布材8の塗布面を検出し、図示しない塗料貯留糟のバルブを開いてノズル本体1の排出口3より塗布液を吐出するようにしてある。
いま、被塗布材8を塗布装置6の機枠7の載置面13に載置すると、図3に示すように検出センサ11が被塗布材8を検出する。この検出センサ11の検出により電動シリンダー10が始動する。この電動シリンダー10が始動すると、載置面13に突出する作動体10aが載置面上の被塗布材8を摺動させながら移動する。載置面上を被塗布材8が移動し、被塗布材の塗布面が検出センサ12上に達すると検出センサ12が被塗布材の塗布面を検出する。前記検出センサ12が被塗布材の塗布面を検出すると、塗料貯留槽のバルブを開いてノズル本体1に塗布液を送出する。ノズル本体1に送られた塗布液は等圧室4で塗布液の圧力が緩和されて排出口全域から均一の塗布液量を被塗布材8に吐出し、ノズル本体1の馴らし面5で平坦に馴らされる。このように被塗布材8に塗布液が平坦に馴らされながら被塗布材8がガイドレール9上を図4に示すように移動して被塗布材に塗布する。前記被塗布材8の塗布が完了すると作動体10aは図5に示すように原位置に復帰して、つぎの被塗布材8への塗布を待機する。
本実施例では馴らし面を塗布用ノズルの排出口両側に設けたが、馴らし面を被塗布材の進行方向と反対側の塗布用ノズルの排出口片側の面に設けてもよく、被塗布材を電動シリンダーでガイドレール上を移動させるようにしたが、空気圧を利用した駆動装置を用いてもよい。
【0006】
【発明の効果】
以上述べたように、本発明によれば、ノズル本体に等圧室を設け排出口全域から均一の塗布液量を被塗布材に吐出し、かつ、被塗布材を自動的に移動させるので、被塗布材に均一の厚さで平坦な塗膜を簡単に形成することができる効果がある。
【図面の簡単な説明】
【図1】本発明の実施例を示す塗布用ノズルの断面図である。
【図2】本発明の実施例を示す塗布用ノズルの側断面図である。
【図3】本発明の実施例を示す塗布用ノズルを取付けた塗布装置の斜視図である。
【図4】本発明の実施例を示す塗布装置の動作説明図である。
【図5】本発明の実施例を示す塗布装置の動作説明図である。
【図6】従来例を示すチューブの斜視図である。
【符号の説明】
1 ノズル本体、 2 注入口、 3 排出口、 4 等圧室、
5 馴らし面、 6 塗布装置、 7 機枠、 8 被塗布材、
9 ガイドレール、 10 電動シリンダー、 10a 作動体
11 検出センサ、 12 検出センサ、 13 載置面[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating apparatus that forms a thin film by discharging a highly viscous coating solution.
[0002]
[Prior art]
When the semiconductor element is attached to the cooling structure of the heat radiating member, the semiconductor element is attached by applying a heat conductive material to the surface of the cooling structure in order to reduce the contact thermal resistance between the semiconductor element and the cooling structure. In the conventional application of the heat conductive material to the cooling structure, a heat conductive material coating liquid is sealed in a
[0003]
[Problems to be solved by the invention]
However, since the thermal conductive material is applied in a rod shape to the cooling structure, when the semiconductor element is screwed and fixed to the cooling structure, the thick coating becomes a fulcrum, and the semiconductor element warps and the insulating layer in the semiconductor element is destroyed. There was a problem to do.
Then, an object of this invention is to provide the coating device and coating nozzle which can apply | coat uniformly with a uniform film thickness.
[0004]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a nozzle body configured in a rectangular parallelepiped, an injection port provided on a side surface of the nozzle body, and disposed at a right angle to the injection port and provided in the longitudinal direction of the nozzle body. A cylindrical isobaric chamber, a discharge port that communicates with the constant pressure chamber and opens along the longitudinal direction of the nozzle body, and a tip of the discharge port of the nozzle body that is at least opposite to the traveling direction of the material to be coated A coating nozzle having a conditioned surface with a flat part and disposed with the discharge port facing upward, and disposed on the side of the coating nozzle and provided on the machine frame, and applies a material to be coated. A mounting surface that is placed from the top with the surface down, a guide rail that is arranged at right angles to the discharge port on both sides of the coating nozzle and attached to the machine frame, and a material to be coated placed on the guide rail A drive unit that moves along the guide rail; A coating apparatus provided in a recording frame and provided with a detection sensor for detecting the material to be coated and starting the driving device, and a detection sensor for detecting a coating surface of the material to be coated and discharging a coating liquid from a coating nozzle. It is configured.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
1 is a sectional view of a coating nozzle showing an embodiment of the present invention, FIG. 2 is a side sectional view of the coating nozzle showing an embodiment of the present invention, and FIG. 3 is a coating nozzle showing an embodiment of the present invention. FIG. 4 and FIG. 5 are operation explanatory views of the coating apparatus showing an embodiment of the present invention.
In the figure,
Now, when the material to be coated 8 is placed on the placement surface 13 of the machine casing 7 of the coating device 6, the detection sensor 11 detects the material to be coated 8 as shown in FIG. The
In this embodiment, the conditioned surface is provided on both sides of the discharge port of the coating nozzle. However, the conditioned surface may be provided on the surface on one side of the discharge port of the coating nozzle opposite to the traveling direction of the coated material. Is moved on the guide rail by an electric cylinder, but a drive device using air pressure may be used.
[0006]
【The invention's effect】
As described above, according to the present invention, an equal pressure chamber is provided in the nozzle body, a uniform amount of coating liquid is discharged from the entire discharge port to the material to be coated, and the material to be coated is automatically moved. There is an effect that a flat coating film having a uniform thickness can be easily formed on the material to be coated.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a coating nozzle showing an embodiment of the present invention.
FIG. 2 is a side sectional view of a coating nozzle showing an embodiment of the present invention.
FIG. 3 is a perspective view of a coating apparatus equipped with a coating nozzle according to an embodiment of the present invention.
FIG. 4 is an operation explanatory view of a coating apparatus showing an embodiment of the present invention.
FIG. 5 is an operation explanatory view of a coating apparatus showing an embodiment of the present invention.
FIG. 6 is a perspective view of a tube showing a conventional example.
[Explanation of symbols]
1 nozzle body, 2 inlet, 3 outlet, 4 isobaric chamber,
5 conditioned surface, 6 coating device, 7 machine frame, 8 material to be coated,
9 Guide rail, 10 Electric cylinder, 10a Actuator 11 Detection sensor, 12 Detection sensor, 13 Mounting surface
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18872596A JP3714730B2 (en) | 1996-06-28 | 1996-06-28 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18872596A JP3714730B2 (en) | 1996-06-28 | 1996-06-28 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1015459A JPH1015459A (en) | 1998-01-20 |
| JP3714730B2 true JP3714730B2 (en) | 2005-11-09 |
Family
ID=16228695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18872596A Expired - Lifetime JP3714730B2 (en) | 1996-06-28 | 1996-06-28 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3714730B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3443103B2 (en) | 2001-03-23 | 2003-09-02 | 山一電機株式会社 | Card connector |
-
1996
- 1996-06-28 JP JP18872596A patent/JP3714730B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1015459A (en) | 1998-01-20 |
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