JP3722604B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for performing predetermined processing on a semiconductor substrate, a glass substrate for a liquid crystal display, a glass substrate for a photomask, a substrate for an optical disk (hereinafter simply referred to as a substrate), The present invention relates to a technique for processing a substrate without exposing it to an external atmosphere using a shielding container that shields a substrate container that can accommodate a plurality of substrates from the external atmosphere and accommodates the substrate inside.
[0002]
[Prior art]
An example of such a conventional apparatus is shown in FIG.
In this apparatus, as shown in FIG. 6A, a substrate container 100 for stacking and storing substrates W is accommodated in a shielding container 101, and the substrate W in the substrate container 100 is placed in an external atmosphere (atmosphere in a clean room). 6B, as shown in FIG. 6B, the placement unit 201 of the substrate carry-in / out device 200 also exposes the shielding container 101 so as to be exposed only to the atmosphere IF in the substrate carry-in / out device 200. The lid 102 is removed and the substrate W is taken out and stored from the transfer port 202 communicating with the opening 103, and the other periphery of the substrate container 100 is covered with the shielding container 101 so that the substrate W is not exposed to the external atmosphere OF. It is configured as follows.
[0003]
By adopting the above-described configuration (also referred to as FOUP: Front Open Unified Pod), only the interior of the substrate processing apparatus including the substrate loading / unloading apparatus 200 needs to be maintained in a high clean atmosphere. Costs can be reduced compared to increasing the cleanliness of the overall atmosphere.
[0004]
[Problems to be solved by the invention]
However, the conventional example having such a configuration has the following problems.
That is, the substrate carry-in / out device 200 transports the substrate W to a substrate processing unit (for example, a substrate cleaning unit) (not shown) and performs a predetermined process, but when the processing atmosphere from the substrate processing unit leaks into the internal atmosphere IF. There is a problem that the processing atmosphere enters the inside of the shielding container 101 placed on the placement unit 201 with the lid 102 removed, and the substrate W is contaminated.
[0005]
The present invention has been made in view of such circumstances, and a substrate processing apparatus capable of preventing contamination of a substrate due to the atmosphere inside the apparatus by blocking the atmosphere of the shielding container from the atmosphere inside the apparatus. The purpose is to provide.
[0006]
[Means for Solving the Problems]
In order to achieve such an object, the present invention has the following configuration.
In other words, the substrate processing apparatus according to claim 1 has an opening for carrying a substrate to the inside of the apparatus, and shields a substrate container capable of accommodating a plurality of substrates from the external atmosphere. And an opening / closing member that can open and close the opening, and an opening / closing control mechanism that opens and closes the opening / closing member, and the substrate is transferred from the substrate container to the inside of the apparatus via a transfer port communicating with the opening of the shielding container. A substrate processing apparatus that carries in a predetermined process on a substrate and prevents the atmosphere from inside the apparatus from flowing into the shielding container when the opening / closing member is opened by the opening / closing control mechanism a holding means, and with an internal air flow forming means for forming a downward current in the apparatus, when the opening and closing control mechanism opens the closing member, the weak intensity of the air flow by the internal air flow forming means It is characterized in that it has a so that.
[0007]
The substrate processing apparatus according to claim 2 is the substrate processing apparatus according to claim 1, wherein the atmosphere holding means is disposed near the upper portion of the transfer port and supplies airflow downward. And a suction means that is disposed near the lower portion of the transport port and sucks an airflow.
[0008]
The substrate processing apparatus according to claim 3 is the substrate processing apparatus according to claim 1 or 2, wherein the opening / closing control mechanism is made of a corrosion-resistant material. is there.
[0010]
[Action]
The operation of the first aspect of the invention is as follows.
Even if the processing atmosphere leaks into the apparatus from the substrate processing section, when the opening / closing member of the shielding container that stores the substrate container is opened by the opening / closing control mechanism, the opening is controlled by the atmosphere holding means from the opening. Since the atmosphere inside the apparatus can be prevented from flowing in, the substrate inside the shielding container can be prevented from being exposed to the processing atmosphere of the substrate processing unit.
In addition, when the open / close control mechanism opens the open / close member of the shielding container, the downdraft of the internal airflow forming means may enter the processing atmosphere through the opening, but when the open / close member is opened, the downdraft Entrainment of the processing atmosphere can be prevented by reducing the strength.
[0011]
Further, according to the invention described in claim 2, since the air current is supplied from the supply means arranged at the upper part of the transport port, and this air current is sucked by the suction means arranged at the lower part of the transport port, A film formed by an air current is formed at the transport port communicating with the opening of the shielding container. Therefore, this film can prevent the atmosphere inside the apparatus from entering the shielding container and can prevent the substrate from coming into contact with the processing atmosphere.
[0012]
Further, according to the invention described in claim 3, since the opening / closing control mechanism for opening / closing the opening / closing member of the shielding container is made of a corrosion-resistant material, even if the processing atmosphere leaks into the atmosphere inside the apparatus, It is possible to prevent troubles such as failures due to corrosion from occurring in the switching control mechanism.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
1 is a longitudinal sectional view showing a schematic configuration of a substrate processing apparatus according to an embodiment, FIG. 2 is a longitudinal sectional view showing an example of a locking mechanism of a lid of the substrate container, and FIG. 3 is a substrate container. It is a longitudinal cross-sectional view which shows an example of the opening / closing control mechanism structure of this.
[0015]
The substrate container 1 accommodates a plurality of substrates W stacked in a horizontal posture, and is accommodated in the shielding container 3 in this state. The shielding container 3 is configured so that the inside is sealed by attaching a lid 3b (opening / closing member) that can be freely opened and closed to an opening 3a formed on one side surface, and the substrate W is not exposed to the external atmosphere OF. ing.
[0016]
The lid 3b can be opened and closed with respect to the shielding container 3 by, for example, a lock mechanism 5 shown in FIG. In other words, the rack formed at the base end portion of the pair of lock members 5a embedded in the lid 3b is engaged with the pinion 5b that is rotatably arranged, and the lock member 5a is rotated by rotating the pinion 5b. Project in opposite directions (arrow directions in the figure). By this operation, the state of the lid 3b is switched between the locked state and the released state. The pinion 5b is rotated by inserting and rotating a connecting member (13a) of an opening / closing control mechanism (11) described later in a hole 5c formed on one side surface thereof.
[0017]
For example, the shielding container 3 in which the substrate W is stored together with the substrate container 1 and the lid 3b is locked is placed on the mounting table so that the opening 3a side of the shielding container 3 is in close contact with the enclosure 7 of the substrate processing apparatus. 9 is placed. The shielding container 3 is removed from the shielding state by the opening / closing control mechanism 11 through the transport port 7a formed in the outer enclosure 7 to release the shielding state, and is again brought into the shielding state. It should be noted that the transport port 7a is closed by the shutter member 11a of the opening / closing control mechanism 11 at a normal time other than when the substrate W is taken out and stored in the shielding container 3, and the internal atmosphere IF of the substrate processing apparatus is It is shielded from the external atmosphere OF.
[0018]
The opening / closing control mechanism 11 includes a shutter member 11a, an elevating drive unit 11b that elevates and lowers the shutter member 11a, a horizontal drive unit 11c that moves the shutter member 11a in the horizontal direction (left and right direction in FIG. 1) together with the elevating drive unit 11b, and the like. It consists of
[0019]
As shown in FIG. 3, the shutter member 11 a incorporates a lock / release mechanism 13 that locks the lid 3 b with respect to the shielding container 3 and releases the lock. The lock / release mechanism 13 is configured such that the two connecting members 13a formed in a pin shape are fitted into the two holes 5c formed in the pinion 5b (see FIG. 2) of the lid 3b. This is done by driving a motor 13b that rotates 13a. The opening / closing control mechanism 11 is coated with a corrosion-resistant material, for example, a fluororesin such as PTFE, PCTFE, or PVDF.
[0020]
A supply nozzle 17 (supply means) for injecting a gas (for example, an inert gas such as nitrogen gas) downward is disposed at the top of the transport port 7a, and below the transport port 7a, A suction nozzle 19 (suction means) is provided. The supply nozzle 17 and the suction nozzle 19 corresponding to the atmosphere holding means of the present invention are formed with slit-shaped openings as shown in FIG. 4, and when the elevating drive unit 11b lowers the shutter member 11a together with the lid 3b. The air flow J (arrows hatched with vertical lines) is supplied from the supply nozzle 17 to form a gas film at the transport port 7a, so that the inside of the shielding container 3 is not directly exposed to the internal atmosphere IF of the apparatus. Do it. The supply nozzle 17 and the suction nozzle 19 correspond to the supply unit and the suction unit of the present invention.
[0021]
At a position adjacent to the opening / closing control mechanism 11, a substrate transfer mechanism 21 including a horizontal movement mechanism 21a, an elevating mechanism 21b, and an advance / retreat mechanism 21c is provided. The substrate transport mechanism 21 moves the support arm 21d disposed in the advance / retreat mechanism 21c in the direction perpendicular to the paper surface by the horizontal movement mechanism 21a, and moves the support arm 21d in the vertical direction in FIG. 1 by the elevating mechanism 21b. Thus, it is moved in the left-right direction in FIG. Then, in a state where the shielding state of the shielding container 3 is released by the opening / closing control mechanism 11, the support arm 21a is entered from the transfer port 7a, and the shielding container 3 and the substrate processing unit 23 (for example, the substrate is washed with a chemical solution). The substrate W is transported to and from the substrate cleaning unit).
[0022]
Further, above the opening / closing control mechanism 11 and the substrate transport mechanism 21, a fan 25 corresponding to the internal airflow forming means of the present invention is provided together with the filter 27, and by forming an airflow JA from above to below, Particles generated from a mechanism having a sliding member such as the opening / closing control mechanism 11 and the substrate transport mechanism 21 are prevented from rising and contaminating the substrate W.
[0023]
The rotation speed of the fan 25 is controlled by the controller 29. When the cover 3b is removed by the opening / closing control mechanism 11 and the shielding state is released, the air flow JA during normal operation is used. Is also controlled to be a weak airflow JB (see FIG. 5). Also, the controller 29 controls the opening / closing control mechanism 11, the substrate transport mechanism 21, the supply nozzle 17 and the suction nozzle 19 described above.
[0024]
Next, the operation of the substrate processing apparatus configured as described above will be described. In the initial state, the normal airflow JA is formed by the fan 25.
[0025]
When the shielding container 3 is placed on the placing table 9, the transport port 7a is closed by the shutter member 11a as shown in FIG. When the shielding container 3 is placed on the placing table 9, the controller 29 activates the opening / closing control mechanism 11. Then, the lid 3b is removed from the shielding container 3 by the shutter member 11a of the opening / closing control mechanism 11, and the lid 3b is moved downward as shown in FIG. At the same time, the controller 29 starts the supply of the airflow J (arrows hatched with vertical lines in FIGS. 4 and 5) from the supply nozzle 17, starts the suction from the suction nozzle 19, and causes the airflow J to flow into the transport port 7a. A film is formed so that the inside of the shielding container 3 is not directly exposed to the internal atmosphere IF of the apparatus. Therefore, even if the processing atmosphere containing the chemical solution mist leaks from the substrate processing unit 23 to the internal atmosphere IF, the processing atmosphere enters the shielding container 3 through the transfer port 7a and the opening 3a. Therefore, the contamination of the substrate W can be prevented.
[0026]
In addition, as described above, the opening / closing control mechanism 11 is not corroded even if the processing atmosphere leaks into the internal atmosphere IF because the corrosion-resistant material is applied to the surface thereof. Therefore, troubles such as a failure occurring in the opening / closing control mechanism 11 due to the processing atmosphere containing chemical mist and the like can be prevented, and the labor involved in maintenance of the apparatus can be reduced by improving the reliability of the apparatus. As a result, an improvement in the operating rate of the substrate processing apparatus can be expected.
[0027]
While the supply of the airflow J is started, the controller 29 further reduces the rotational speed of the fan 25 to make the airflow JB weaker than the normal airflow JA (solid arrow in FIG. 5). Accordingly, it is possible to prevent such an inconvenience that the air current JA enters from the transfer port 7a and the opening 3a together with the mist containing the chemical solution in the internal atmosphere IF and contaminates the substrate W.
[0028]
Then, as shown in FIG. 5, after the lid 3 b is moved downward by the elevating drive unit 11 b, the controller 29 controls the substrate transport mechanism 21 to be stacked and stored in the substrate container 1 in the shielding container 3. The substrate W is transferred to the substrate processing unit 23 and processed. At this time, the support arm 21d of the substrate transport mechanism 21 enters the shielding container 3 from the internal atmosphere IF. Even if the mist of the chemical liquid moves so as to be caught therein, the chemical liquid is generated by the air flow J from the supply nozzle 17. Since the mist and the like are pushed downward, contamination of the substrate W due to the advance / retreat of the support arm 21d can be prevented.
[0029]
In the above embodiment, the atmosphere holding means is configured by the supply nozzle 17 and the suction nozzle 19. However, instead of such a configuration, for example, the shielding container 3 mounted on the mounting table 9 You may make it comprise with a pressurization mechanism which supplies an inert gas with a pressure higher than internal atmosphere IF inside. Even with such a configuration, the internal atmosphere IF including the leaked processing atmosphere can be prevented from entering the shielding container 3, and the same effect as described above can be expected.
[0030]
In the above substrate processing apparatus, when the shielding of the shielding container 3 is released, the rotational speed of the fan 25, which is an internal airflow forming means, is adjusted to weaken the airflow. However, the airflow is not adjusted. You may make it hold | maintain constant.
[0031]
【The invention's effect】
As is apparent from the above description, according to the first aspect of the invention, the atmosphere inside the apparatus can be prevented from flowing in by blocking the atmosphere of the shielding container from the atmosphere inside the apparatus with the atmosphere holding means. The substrate inside the shielding container can be prevented from being exposed to the processing atmosphere of the substrate processing unit. Therefore, it is possible to prevent the substrate from being contaminated by the atmosphere inside the apparatus including the processing atmosphere leaked from the substrate processing unit.
Moreover, since the atmosphere inside the apparatus can be prevented from being caught in the shielding container by reducing the strength of the downdraft when opening the opening / closing member, a further anti-contamination effect can be expected.
[0032]
According to the second aspect of the present invention, since the atmosphere inside the apparatus is prevented from entering the inside of the shielding container by forming a film by the air flow at the transport port, the substrate is prevented from touching the processing atmosphere. it can.
[0033]
Further, according to the invention described in claim 3, since the opening / closing control mechanism is made of a corrosion-resistant material and troubles such as failures due to corrosion can be prevented, the reliability of the device is improved and the maintenance of the device is concerned. Time and effort can be reduced, and an improvement in operating rate can be expected.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a schematic configuration of a substrate processing apparatus according to an embodiment.
FIG. 2 is a longitudinal sectional view showing an example of a lock mechanism for a lid of a substrate container.
FIG. 3 is a longitudinal sectional view showing an example of a shielding control mechanism structure of a substrate container.
FIG. 4 is a perspective view illustrating the configuration of a supply nozzle and a suction nozzle.
FIG. 5 is a diagram for explaining an operation of the substrate processing apparatus.
FIG. 6 is a diagram for explaining the prior art.
[Explanation of symbols]
W ... Substrate 1 ... Substrate container 3 ... Shielding container 3a ... Opening 3b ... Lid (opening / closing member)
DESCRIPTION OF SYMBOLS 5 ... Lock mechanism 7 ... Outer enclosure 7a ... Conveying port 11 ... Opening / closing control mechanism 13 ... Lock / release mechanism 17 ... Supply nozzle (supply means, atmosphere holding means)
19 ... Suction nozzle (suction means, atmosphere holding means)
21 ... Substrate transport mechanism 23 ... Substrate processing unit 25 ... Fan (internal airflow forming means)

Claims (3)

A shielding container having an opening for transporting the substrate to the inside of the apparatus, and shielding a substrate container capable of accommodating a plurality of substrates from the external atmosphere; an opening / closing member capable of opening and closing the opening; An opening / closing control mechanism for opening and closing the opening / closing member, and a substrate process for carrying out a predetermined process on the substrate by carrying the substrate from the substrate container into the apparatus via a transfer port communicating with the opening of the shielding container. A device,
An atmosphere holding means for preventing an atmosphere from inside the apparatus from flowing into the shielding container in a state where the opening / closing member is opened by the opening / closing control mechanism ,
And an internal airflow forming means for forming a downdraft inside the apparatus, and when the opening / closing control mechanism opens the opening / closing member, the strength of the airflow by the internal airflow forming means is weakened. Substrate processing apparatus.   The substrate processing apparatus according to claim 1, wherein the atmosphere holding unit is disposed in the vicinity of the upper part of the transfer port, and is provided in the vicinity of a lower part of the transfer port and a supply unit that supplies an airflow downward. A substrate processing apparatus comprising: suction means for sucking airflow.   3. The substrate processing apparatus according to claim 1, wherein the opening / closing control mechanism is made of a corrosion-resistant material.

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