JP3733244B2 - Component mounting apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus and method for mounting a component such as an electronic component, an optical component, or a mechanical component on a member on which a component such as a circuit board is to be mounted, and more specifically, image recognition optics used in the component mounting device or method. The present invention relates to an improvement in the calibration of the position of a component and a circuit board based on the deviation of the optical axis of the system.
[0002]
[Prior art]
Hereinafter, an example of a conventional electronic component mounting apparatus will be described with reference to FIGS. In FIG. 12, reference numeral 921 denotes an electronic component that is housed in a tray 922. Reference numeral 923 denotes a head for sucking and conveying the electronic component 921. Reference numeral 924 denotes a circuit board which is held by suction on the bonding stage 925. The bonding stage 925 and the tray 922 are fixed on the slide base 926. Reference numeral 927 denotes an image recognition optical system that performs position recognition of the circuit board 924 and the electronic component 921. The head 923 is configured to be movable in the X direction, the slide base 926 is movable in the Y direction, and the image recognition optical system 927 is movable in both the X and Y directions.
[0003]
In FIG. 13, reference numeral 928 denotes a CCD camera of the image recognition optical system 927, to which a magnifying lens 929 is coupled. A prism frame 930 has a prism 931 fixed thereto, and a magnifying lens 929 is coupled to the prism frame 930. An image of the electronic component 921 sucked and held by the head 923 or the circuit board 924 sucked and held by the bonding stage 925 is picked up by the CCD camera 928 via the prism 931 and the magnifying lens 929. The image recognition optical system 927 images either the electronic component 921 or the circuit board 924 by switching the field of view.
[0004]
The operation of the electronic component mounting apparatus configured as described above will be described below. First, after the head 923 and the slide base 926 move to a predetermined position, the head 923 descends and picks up the electronic component 921 on the tray 922. Next, the head 923 and the slide base 926 move again to perform rough positioning for mounting the electronic component 921 on the circuit board 924. Next, in order to recognize the position of the circuit board 924, the image recognition optical system 927 moves to a position where the feature point on the circuit board 924 falls within the field of view, and performs image recognition of the feature point. Next, in order to recognize the position of the electronic component 921, the image recognition optical system 927 moves to a position where the feature point on the electronic component 921 falls within the field of view, and performs image recognition of the feature point. Then, between the image recognition result of the circuit board 924 and the electronic component 921 and the visual field e on the electronic component image recognition side and the visual field f on the circuit board image recognition side of the image recognition optical system 927 previously measured and input as a fixed value. After correcting the position between the circuit board 924 and the electronic component 21 based on the offset amount (optical axis deviation amount), the head 923 descends and the electronic component 921 is mounted on the circuit board 924.
[0005]
[Problems to be solved by the invention]
However, in the configuration as described above, when the imaging positions of the electronic component 921 and the circuit board 924 change due to an error in handling by the head, or due to a change in room temperature or heat generation in the apparatus, the holding unit of the image recognition optical system 927 Even when the imaging positions of the electronic component 921 and the circuit board 924 are changed due to distortion and the change in the tilt of the optical axis, it is simply determined that the position of the electronic component 921 or the circuit board 924 has changed, and position correction is performed. As a result, there has been a problem that the mounting position of the electronic component 921 is shifted due to the influence of the change in the tilt of the optical axis.
[0006]
In the present invention, in view of the above-described conventional problems, even if the amount of offset between the visual field on the electronic component image recognition side and the circuit board image recognition side changes due to a change in room temperature or an internal heat generation or handling error, etc. An object of the present invention is to provide an electronic component mounting method and apparatus in which the mounting position of the electronic component is not shifted.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention is configured as follows.
According to the first aspect of the present invention, a component suction transport device that holds and transports components and mounts them on a circuit board;
A circuit board holding device for holding the circuit board;
An image recognition optical system for recognizing positions of the component and the circuit board in different fields of view;
Recognized by the above image recognition optical system Mounted on a calibration stage that can move with the circuit board holding device and a position where one jig that can transmit light and recognize the same mark in the upper and lower field of view is held by the component suction transfer device In the state of holding the above jig Between position Of 2 The amount of optical axis deviation in one field of view Using the above jig A controller that obtains a plurality of times and obtains an optical axis deviation amount for calibration based on the obtained results,
Provided is a component mounting apparatus in which the image recognition optical system is calibrated based on the calibration optical axis deviation obtained by the control unit, and the component is mounted on the circuit board.
[0008]
According to the second aspect of the present invention, the control unit obtains the amount of deviation of the optical axis between the two fields of view of the image recognition optical system at least three times, and determines the upper limit deviation from the obtained amount of deviation. When there are a plurality of remaining deviation amounts excluding the amount and the lower limit deviation amount, an average value of them is obtained as the calibration optical axis deviation amount, while the upper limit deviation amount and the lower limit deviation amount are determined. If only one remaining shift amount remains, the shift amount is set as the calibration optical axis shift amount, and the calibration of the image recognition optical system is performed based on the calculated calibration optical axis shift amount. Provided is a component mounting apparatus according to a first aspect in which the calibration is performed.
According to the third aspect of the present invention, the control unit obtains the deviation amount of the optical axis between the two fields of view of the image recognition optical system three times or more, and a certain deviation amount is different from any other deviation amount. If the difference exceeds a certain threshold, an average value of the remaining deviation amounts excluding the deviation amount is obtained as the calibration optical axis deviation amount, and the obtained calibration optical axis deviation amount is calculated. A component mounting apparatus according to a first aspect is provided which originally performs the calibration of the image recognition optical system.
According to the fourth aspect of the present invention, when the control unit obtains the deviation amount of the optical axis, the controller recognizes the image in each field of view being imaged by the image recognition optical system a plurality of times, and recognizes the plurality of times. The result obtained by calculating the amount of deviation of the optical axis between the position of the component recognized by the image recognition optical system in each field of view and the position of the circuit board from the results, and repeating this multiple times The component mounting apparatus according to the first aspect, wherein the calibration optical axis deviation amount is obtained based on the calibration, and the calibration of the image recognition optical system is performed based on the obtained calibration optical axis deviation amount. provide.
[0009]
According to the fifth aspect of the present invention, a component holding and conveying device for holding and conveying a component and mounting it on a circuit board;
A circuit board holding device for holding the circuit board;
One that can transmit light and recognize the same mark in the upper and lower fields of view Jig In the above component adsorption transfer device While being held, the position of the mark of the jig is recognized a plurality of times from a single visual field, and the circuit board holding device is Movable with An image recognition optical system that recognizes the position of the mark of the jig a plurality of times in a field of view different from the field of view while holding the jig on the calibration stage;
The optical axis deviation amount between the mark positions of the jig is determined based on the recognition result performed a plurality of times between the two fields of view of the image recognition optical system, and the average value of the obtained optical axis deviation amounts is obtained. And a control unit that sets the calculated average value as the optical axis deviation amount for calibration of the two visual fields of the image recognition optical system,
A component mounting apparatus is provided in which the component is mounted on the circuit board after the image recognition optical system is calibrated based on the calibration optical axis deviation obtained by the control unit.
[0010]
According to the sixth aspect of the present invention, when the image recognition optical system recognizes the position of the mark of the jig in the two states a plurality of times, the image recognition optical system is held in the component holding and conveying device. After the position of the mark of the jig and the position of the mark of the jig held on the calibration stage are recognized once by the image recognition optical system, similarly, A component mounting apparatus according to a fifth aspect is provided in which the recognition of the position of the mark of the jig is repeated.
According to the seventh aspect of the present invention, when the image recognition optical system recognizes the position of the mark of the jig in the two states a plurality of times, the image recognition optical system is in a state of being held by the component holding and conveying device. The image recognition optical system recognizes the position of the mark on the jig multiple times, and the image recognition optical system recognizes the position of the mark on the jig while being held on the calibration stage multiple times. A component mounting apparatus according to the fifth aspect is provided.
According to the eighth aspect of the present invention, the image recognition optical system includes each of the jig held by the component holding and conveying apparatus and the jig held by the calibration stage. The control unit recognizes the position of the mark three times or more, and the control unit determines an upper limit deviation amount and a lower limit among the deviation amounts of the optical axes of the two or more two visual fields obtained based on the recognized result. When there are a plurality of remaining shift amounts excluding the shift amount, the average value of them is obtained and used as the calibration optical axis shift amount, while the remaining upper limit shift amount and the lower limit shift amount are excluded. The component mounting apparatus according to any one of the fifth to seventh aspects, in which when only one deviation amount remains, the deviation amount is set as the calibration optical axis deviation amount instead of obtaining the average value. I will provide a.
[0011]
According to the ninth aspect of the present invention, the image recognition optical system includes the jig held by the component holding and conveying apparatus and the jig held by the calibration stage. The position of the mark is obtained three times or more, and the control unit, when a certain deviation amount exceeds a certain threshold even if it takes a difference from any other deviation amount, averages the remaining deviation amounts excluding the deviation amount. The component mounting apparatus according to any one of the fifth to seventh aspects, in which a value is obtained and used as the calibration optical axis deviation amount.
According to the tenth aspect of the present invention, in the component holding and conveying apparatus for holding and conveying the component and mounting it on the circuit board. One that can transmit light and recognize the same mark in the upper and lower fields of view While holding the jig, the position of the mark on the jig is recognized multiple times by the image recognition optical system,
Circuit board holding device for holding the circuit board Movable with With the jig held on the calibration stage, the position of the mark on the jig is recognized multiple times by the image recognition optical system,
Image recognition optical system Calibration that can be moved together with the circuit board holding device and the position of one jig held in the component suction and transfer device that can transmit light and recognize the same mark in the upper and lower fields of view. Between the position where the jig placed on the stage is held Find the amount of deviation between the positions of the marks on the jig between the two fields of view,
The average value of the obtained optical axis deviation amounts is calculated as the optical axis deviation amounts of the two fields of view of the image recognition optical system. After performing calibration based on the optical axis deviation amounts, the above components are Provided is a component mounting method for mounting on the circuit board.
[0012]
According to the eleventh aspect of the present invention, when the position of the mark of the jig in the two states is recognized a plurality of times by the image recognition optical system, the jig is held by the component holding and conveying device. After the position of the mark of the jig and the position of the mark of the jig held on the calibration stage are recognized once by the image recognition optical system, similarly, the position of the jig in the respective state The component mounting method according to the tenth aspect is provided in which the recognition of the position of the mark on the jig is repeated.
According to the twelfth aspect of the present invention, when the position of the mark of the jig in the two states is recognized a plurality of times by the image recognition optical system, the jig is held by the component holding and conveying device. The image recognition optical system recognizes the position of the mark on the jig multiple times, and the image recognition optical system recognizes the position of the mark on the jig while being held on the calibration stage multiple times. The component mounting method according to the tenth aspect is provided.
[0013]
According to the thirteenth aspect of the present invention, the positions of the marks of the jig held by the component holding and conveying apparatus and the jig held by the calibration stage are set three times. When there are a plurality of remaining shift amounts excluding the upper limit shift amount and the lower limit shift amount among the three or more optical field shift amounts of the two visual fields obtained based on the recognized results. In the case where the average value thereof is obtained and used as the calibration optical axis deviation amount, while only one remaining deviation amount excluding the upper limit deviation amount and the lower limit deviation amount is left. In the tenth to twelfth aspects, the deviation amount is used as the calibration optical axis deviation amount instead of obtaining the average value, and the calibration is performed based on the obtained calibration optical axis deviation amount. Provides a component mounting method according to any misalignment.
According to the fourteenth aspect of the present invention, the positions of the marks of the jig held by the component holding and conveying apparatus and the jig held by the calibration stage are set three times. When a certain amount of deviation exceeds a certain threshold even if a difference from any other amount of deviation is obtained as described above, an average value of the remaining deviation amounts excluding the amount of deviation is obtained to obtain the calibration optical axis deviation amount. And providing the component mounting method according to any one of the tenth to twelfth aspects, wherein the calibration is performed based on the obtained optical axis deviation amount for calibration.
[0014]
According to a fifteenth aspect of the present invention, the control unit is configured to perform the two operations between the position of the component recognized by the image recognition optical system a plurality of times at predetermined time intervals and the position of the circuit board. The component mounting apparatus according to the first aspect, in which the optical axis deviation amount in one field of view is obtained and the calibration optical axis deviation amount is obtained based on the obtained result.
According to a sixteenth aspect of the present invention, there is provided the component mounting method according to the tenth aspect, wherein when the image recognition optical system performs the recognition a plurality of times, the recognition is performed a plurality of times with a predetermined time interval.
According to the seventeenth aspect of the present invention, a component holding and conveying device for holding and conveying a component and mounting it on a circuit board;
A circuit board holding device for holding the circuit board;
One that can transmit light and recognize the same mark in the upper and lower fields of view Jig In the above component adsorption transfer device While being held, the position of the mark of the jig is recognized from a certain visual field, and the circuit board holding device Movable with An image recognition optical system for recognizing the position of the mark of the jig in a field of view different from the field of view while holding the jig on the calibration stage;
Image recognition optical system The position in the state where the jig is held in the component suction conveyance device and the position in the state where the jig placed on the calibration stage movable together with the circuit board holding device is recognized. Between Between fields of view of A controller that sets the amount of optical axis deviation between the mark positions of the jig based on the recognition result as the amount of optical axis deviation for calibration of the two visual fields of the image recognition optical system;
A component mounting apparatus is provided in which the component is mounted on the circuit board after the image recognition optical system is calibrated based on the calibration optical axis deviation obtained by the control unit.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electronic component mounting apparatus and method as an example of a component mounting apparatus and method according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of an electronic component mounting apparatus that performs an electronic component mounting method according to an embodiment of the present invention, and FIG. 2 is a perspective view of a calibration stage of an image recognition optical system.
In FIG. 1, reference numeral 13 denotes an electronic component as an example of a component to be mounted, and is housed in a tray 14. Reference numeral 15 denotes a bonding head as an example of an electronic component holding and conveying apparatus, which has a function of moving in the X direction and a function of moving up and down in the Z direction perpendicular to the X direction and the Y direction. Vacuum suction and handling. Reference numeral 16 denotes a circuit board as an example of a member on which the electronic component 13 is mounted, and is attracted and held on a bonding stage as an example of a circuit board holding device 17. The bonding stage 17 and the tray 14 are fixed on a slide base 18 having a function of moving in the Y direction. Reference numeral 19 denotes an image recognition optical system, which recognizes the position of the circuit board 16 positioned below the image recognition optical system 19 and the electronic component 13 adsorbed by the bonding head 15 above the image recognition optical system 19 by switching the upper and lower visual fields. Is possible. The image recognition optical system 19 is configured to be movable in both the X and Y directions. Reference numeral 20 denotes a calibration stage, which is fixed on the slide base 18.
[0016]
In FIG. 2, a glass jig (jig) 21 for optical system calibration is adsorbed and held on the upper surface of the calibration stage 20 by a pair of position restricting claws 20a and 20a. A mark 22 for image recognition is marked at the center of the tool 21.
FIG. 6 shows details of the image recognition optical system 19. Reference numeral 19a denotes a CCD camera, to which a magnifying lens 19b is coupled. A prism frame 19c is fixed to the prism 19d, and the magnifying lens 19b is coupled to the prism frame 19c. The image of the electronic component 13 sucked and held by the head 15 or the circuit board 16 sucked and held by the bonding stage 17 is picked up by the CCD camera 19a through the prism 19d and the magnifying lens 19b. Then, the image recognition optical system 19 images either the electronic component 13 or the circuit board 16 by switching the field of view.
In FIG. 6, reference numeral 419 denotes an upper / lower shutter for switching the upper and lower visual fields driven by the shutter driving unit 105. When switching to the upper visual field, the lower shutter 419 is moved to the position 420 in the figure to move the lower side. The image recognition optical system 19 recognizes only the upper field of view, while moving the upper shutter 419 to the position 420 in the figure to cover the upper field of view. The image recognition optical system 19 recognizes only the hidden and lower visual field. The driving of these two shutters 419 is controlled by the main controller 101. The operation of the electronic component mounting apparatus configured as described above will be described below.
[0017]
In mounting the electronic component 13 on the circuit board 16, first, an optical system calibration operation is performed. The operation is described below. In this embodiment, two types of calibration operations will be described. FIG. 4 is a flowchart of the high-precision calibration operation of the image recognition optical system 19, and FIG. 8 is simpler than FIG. 5 is a flowchart of the calibration operation of the image recognition optical system 19.
In the calibration operation, first, the image recognition optical system 19 is moved in the X direction or the image recognition optical system 19 so that the mark 22 of the jig 21 on the calibration stage 20 fixed to the slide base 18 can be recognized. Move in the Y direction. Next, the field of view of the image recognition optical system 19 is switched from the upper side to the lower side, and the position of the mark 22 of the jig 21 mounted on the calibration stage 20 is recognized (step S1 in FIG. 4 and step S21 in FIG. 8). ).
[0018]
Next, after the image recognition optical system 19 is retracted backward with respect to the slide base 18, that is, diagonally to the upper right in the Y direction in FIG. 1, the bonding head 15 is lowered to pick up the jig 21 on the calibration stage 20. (Step S2 in FIG. 4 and Step S22 in FIG. 8).
Next, the field of view of the image recognition optical system 19 is switched to the upper side, the image recognition optical system 19 is moved to the front side, that is, the diagonally lower left side in the Y direction in FIG. 1, and the position of the mark 22 of the jig 21 is recognized again. (Step S3 in FIG. 4 and Step S23 in FIG. 8). Since the jig 21 is made of glass and can transmit light, the same mark 22 can be recognized in the upper and lower fields of view.
Next, after the image recognition optical system 19 is retracted backward, the bonding head 15 is lowered and the jig 21 is mounted on the calibration stage 20 (step S4 in FIG. 4, step S24 in FIG. 8). Then, based on the respective recognition results, an optical axis shift amount (offset amount) between the upper and lower visual fields of the image recognition optical system 19 is obtained (step S5 in FIG. 4 and step S25 in FIG. 8). The details will be described using.
[0019]
FIG. 3 shows the position of the mark 22 on the jig 21 imaged by the image recognition optical system 19, and 23 is the position of the mark when the mark 22 is first recognized in the lower visual field. , 24 are mark positions when the mark 22 is image-recognized in the visual field above the image recognition optical system 19. At this time, the distance between the marks 23 and 24, X1 and Y1, represent the amount of deviation of the optical axis between the lower visual field and the upper visual field of the image recognition optical system 19. The amount of deviation of the optical axis of the visual field changes slightly due to the distortion of the image recognition optical system 19 and the like due to the influence of the temperature change in the environment around the electronic component mounting apparatus, and the visual field stored in the electronic component mounting apparatus If the optical axis deviation amount is not corrected, a mounting position deviation corresponding to a temperature change occurs. Therefore, in order to prevent the mounting position shift, in the simple calibration operation of FIG. 8, the optical axis of the field of view stored in the electronic component mounting apparatus based on the optical axis shift amount obtained in step S25 of FIG. The deviation amount is updated (step S26 in FIG. 8).
However, in the simple calibration operation of FIG. 8, the amount of deviation of the optical axis between the lower visual field and the upper visual field of the image recognition optical system 19 is measured by one handling of the jig 21. There is a case that the optical axis deviation amount cannot be obtained with high accuracy because of being greatly affected by the handling accuracy.
Therefore, in the highly accurate calibration operation of FIG. 4, the degree of influence of the handling accuracy of the jig 21 is suppressed, and the optical axis shift between the lower visual field and the upper visual field of the image recognition optical system 19 is performed with high accuracy. In order to obtain the amount and suppress the component mounting position deviation, the optical axis deviation amount measurement of the visual field is performed a plurality of times (step S6 in FIG. 4), and the average value of the optical axis deviation amount of the visual field is obtained (FIG. 4). Step S7). Then, in order to prevent the mounting position shift, when the optical axis shift amount of the visual field stored in the electronic component mounting apparatus is updated, it is updated with the calibration optical axis shift amount obtained as the average value (FIG. 4). Step S8).
Here, the following methods (1) to (3) exist as methods for measuring with higher calibration accuracy.
[0020]
(1) In order to suppress the influence of the handling accuracy of the jig 21, the optical axis deviation amount is measured three times or more in step S 6 of FIG. 4, and the upper limit measurement value and the lower limit measurement value are measured in step S 7 of FIG. The average value is obtained by removing and the average value is used as the calibration result, that is, the calibration optical axis deviation amount in step S8 of FIG. However, when there is only one remaining measurement value excluding the upper limit measurement value and the lower limit measurement value, the measurement value is used as the calibration optical axis deviation amount.
(2) In order to suppress the influence of the handling accuracy of the jig 21, the optical axis deviation is measured at least three times in step S 6 of FIG. 4, and if the measured value is any other value in step S 7 of FIG. When a difference from the measured value exceeds a certain threshold value, the measured value is excluded, and an average value is obtained in step S7 in FIG. 4, and the average value is obtained in step S8 in FIG. Used as optical axis deviation amount.
(3) When measuring the position of the mark 22 of the jig 21 being imaged in each of the upper and lower fields of view in order to increase the recognition accuracy, the mark 22 is image-recognized a plurality of times (one point at steps S1 and S3 in FIG. 4). In step S5 in FIG. 4, the position of the mark 22 is obtained based on the plurality of recognition results.
In particular, by adopting the methods {circle around (1)} and {circle around (2)}, it is possible to eliminate the influence of a sudden large deviation of the jig 21 when handling the jig 21 that occurs very rarely.
Here, the configuration and flow of the control unit 200 of the part related to the calibration operation of the image recognition optical system 19 will be described in more detail with reference to FIGS.
[0021]
First, the configuration of the control unit 200 provided in the electronic component mounting apparatus will be described.
In FIG. 5, reference numeral 101 denotes a main controller of the control unit 200 that controls the entire electronic component mounting apparatus, which issues operation commands and calculation commands based on a series of control sequences, and inputs and outputs data from the memory. Reference numerals 102, 103, and 104 denote motor drivers, respectively, a motor for moving the image recognition optical system 19 in the X direction, a motor for moving the image recognition optical system 19 in the Y direction, and a movement of the bonding head 15 in the Z (vertical) direction. Compatible with motors for Drivers corresponding to other motors are omitted in this figure. Reference numeral 105 denotes a shutter drive unit that drives a shutter that switches the upper and lower visual fields of the image recognition optical system 19. Reference numeral 106 denotes a nozzle suction drive unit that switches the suction of the suction nozzle 15a of the bonding head 15 on and off. An image recognition unit 107 captures the mark 22 of the calibration jig 21 as image data by the image recognition optical system 19. The captured image data is stored in the memory 108. An image processing unit 109 obtains the position of the object, that is, the mark 22 from the image data stored in the memory 108. Then, the position data of the mark 22 is stored in the memory 110. Reference numeral 111 denotes a calculation unit, which calculates an optical axis shift amount (offset amount) from the position of the mark 22 of the jig 21 stored in the memory 110. The amount of deviation of the optical axis is stored in the memory 110. The memory 112 stores data of target coordinates when each motor drive shaft moves. The memory 113 stores production conditions for producing the circuit board 16 on which the electronic component 13 is mounted.
[0022]
Next, the flow of control will be described. First, the X and Y coordinates that the image recognition optical system 19 should move to recognize the mark 22 of the jig 21 on the calibration stage 20 stored in the memory 112 are moved from the memory 112. Reading and instructing the drivers 102 and 103 to move the image recognition optical system 19 to the X and Y coordinates, and the image recognition optical system 19 moves to the X and Y coordinates. Next, the main controller 101 instructs the shutter drive unit 105 to switch the field of view of the image recognition optical system 19 downward, and switches the shutter downward. Next, the main controller 101 issues an image capture command to the image recognition unit 107, captures an image of the mark 22 of the jig 21 on the calibration stage 20 by the image recognition optical system 19, and captures the captured image data. Store in the memory 108. Next, the main controller 101 issues an image processing command to the image processing unit 109, and the image processing unit 109 calculates the position 22-1 of the mark 22 of the jig 21 from the image data stored in the memory 110. And stored in the memory 110. The operation up to this point is the operation in step S1 in FIG. 4 or step S21 in FIG.
[0023]
Next, in order for the image recognition optical system 19 to retreat to the rear X and Y coordinates stored in the memory 112, the main controller 101 stores the X and Y coordinates that the image recognition optical system 19 should move backward from the memory 112. Reading and instructing the drivers 102 and 103 to move backward to the X and Y coordinates, the image recognition optical system 19 moves backward to the X and Y coordinates.
Next, the main controller 101 reads out the Z coordinate stored in the memory 112 from which the bonding head 15 should be lowered in order to pick up the jig 21 on the calibration stage 20, and the driver 104. The bonding head 15 is instructed to move to the Z coordinate, and the bonding head 15 is lowered. Next, the main controller 101 instructs the nozzle suction driving unit 106 to turn on the suction of the jig 21 by the nozzle 15 a, and sucks the jig 21 by the nozzle 15 a of the bonding head 15. Next, the main controller 101 instructs the driver 104 to move to the coordinate origin, and the nozzle 15a of the bonding head 15 is raised. The operation up to this point is the operation in step S2 in FIG. 4 or step S22 in FIG.
[0024]
Next, the main controller 101 instructs the shutter drive unit 105 to switch the field of view of the image recognition optical system 19 upward, and switches the shutter from the lower side to the upper side. Next, the main controller 101 issues an image capture command to the image recognition unit 107, captures an image of the mark 22 of the jig 21 adsorbed by the nozzle 15a of the bonding head 15 by the image recognition optical system 19, and stores the image data. Is stored in the memory 108. Next, the main controller 101 issues an image processing command to the image processing unit 109, and the image processing unit 109 calculates the position 22-2 of the mark 22 of the jig 21 from the image data stored in the memory 108. And stored in the memory 110. This is the operation in step S3 in FIG. 4 or step S23 in FIG.
Next, the main controller 101 issues a command to the calculation unit 111 so as to obtain a shift amount, that is, an offset amount, of the optical axes of the two upper and lower visual fields of the image recognition optical system 19. Calculation is performed from the position 22-1 of the mark 22 of the tool 21 and the position 22-2 of the mark 22 of the jig 21 to calculate the optical axis deviation amount, and the optical axis deviation amount is stored in the memory 110. This operation is an optical axis deviation amount calculating operation in step S5 or step S25 in FIG. The operation of step S5 or step S25 may be performed after the operation of returning the jig 21 of step S4 or step S24 to the calibration stage 20 as shown in FIG. 4 or FIG. As described here, it may be performed before the operation of step S4 or step S24. Alternatively, steps S4 and S5 or steps S24 and S25 may be performed simultaneously.
[0025]
Next, the main controller 101 reads out the X and Y coordinates to be moved by the image recognition optical system 19 in order to save backward in the memory 112, and instructs the drivers 102 and 103 to move to the coordinates. The image recognition optical system 19 moves to the coordinates.
Next, the main controller 101 reads from the memory 112 the Z coordinate to which the nozzle 15a of the bonding head 15 is to be lowered in order to release the jig 21 on the calibration stage 20 stored in the memory 112, and sends it to the driver 110. A command is issued to move the nozzle 15a of the bonding head 15 to the Z coordinate, and the nozzle 15a of the bonding head 15 is lowered to the Z coordinate. Next, the main controller 101 instructs the nozzle suction drive unit 106 to turn off the suction of the jig 21 by the nozzle 15a, stops the suction of the jig 21 at the nozzle 15a of the bonding head 15, and removes the jig 21 from the nozzle 15a. Return to the calibration stage 20. Next, the main controller 101 instructs the driver 104 to raise the nozzle 15a of the bonding head 15 to the coordinate origin, and the nozzle 15a of the bonding head 15 rises to the coordinate origin. The operation up to this point is the operation in step S4 in FIG. 4 or step S24 in FIG.
[0026]
In the case of the simple calibration operation described above, the main controller 101 stores the calculated optical axis deviation amount in the memory 110 as the calibration optical axis deviation amount (step S26 in FIG. 8). On the other hand, in the case of a calibration operation with higher accuracy, the main controller 101 determines the optical axis from step S1 to step S5 in FIG. 4 until the number of measurements of the optical axis deviation stored in the memory 113 is reached. The measurement of the deviation amount is repeated (step S6 in FIG. 4).
Then, based on the measured optical axis deviation amount stored in the memory 108, as shown in step S7 of FIG. 4, the average value of the optical axis deviation amounts used for calibration is calculated as follows. Calculated in part 111.
If the optical axis deviation is measured three times or more and the memory 113 is set to exclude the upper and lower measurement values, the upper measurement value and the lower measurement value are invalidated and the remaining measurement is performed. The average value of the optical axis deviation amount is obtained from the value, and the average value is stored in the memory 110 as the calibration result, that is, the calibration optical axis deviation amount. In the case of three measurements, if only one measurement value remains except for the upper limit measurement value and the lower limit measurement value, the measurement value is used for calibration as an optical axis deviation amount for calibration. .
Alternatively, when a threshold value for variation in optical axis deviation is set in the memory 113, a difference between measured values is obtained, and a certain measured value exceeds the threshold value even if it takes a difference from any other measured value. In this case, the average value is obtained by removing the measured value, and the average value is stored in the memory 110 as the calibration optical axis deviation amount.
[0027]
If there is no setting to exclude the upper and lower measured values, and no threshold is set, the average value of the optical axis deviation is obtained from the measured values of all optical axis deviations, and the average value is calibrated. Stored in the memory 110 as an optical axis deviation amount for the operation.
Further, when the number of times of recognition is set in the memory 113, when the image of the mark 22 of the jig 21 is captured, the image is captured continuously for the set number of times as indicated by the dashed lines in steps S1 and S3 of FIG. The average values of the positions of the marks 22 of the plurality of jigs 21 obtained from the plurality of image data are respectively obtained, and the average values are stored in the memory 110 as the positions 22-1 and 22-2 of the marks 22 of the jig 21. This is used to calculate the amount of deviation of the optical axis between the fields of view.
When the calibration operation is thus completed, the bonding operation of the electronic component 13 to the circuit board 16 is performed next. The operation is described below.
[0028]
First, the slide base 18 and the image recognition optical system 19 are controlled by the main controller 101 so that the position of the circuit board 16 on the bonding stage 17 mounted on the slide base 18 can be confirmed by the image recognition optical system 19. Move to. Here, a feature point for position confirmation is written on the circuit board 16.
Next, under the control of the main controller 101, the field of view of the image recognition optical system 19 is switched from the upper side to the lower side, and the position of the circuit board 16 mounted on the bonding stage 17 is recognized.
Next, after the slide base 18 and the image recognition optical system 19 are moved to predetermined positions, the position of the electronic component 13 on the tray 14 is recognized by the image recognition optical system 19.
Next, after the bonding head 15 and the slide base 18 are moved based on the recognition result, the bonding head 15 is lowered and sucks and picks up the electronic component 13 on the tray 14.
Next, the bonding head 15 and the image recognition optical system 19 are moved to a predetermined position, the field of view of the image recognition optical system 19 is switched to the upper side, and the position of the electronic component 13 sucked by the bonding head 15 is recognized. Then, the position recognition between the circuit board 16 and the electronic component 13 is performed in consideration of the image recognition result of the circuit board 16 and the electronic component 13 and the calibration result of the image recognition optical system 19, that is, the calibration optical axis deviation amount. After that, the bonding head 15 is lowered and the electronic component 13 is mounted on the circuit board 16.
[0029]
As described above, according to the present embodiment, in the simple calibration operation of FIG. 8, the optical axis shift amount (offset amount) between the fields of view of the image recognition optical system 19 during the calibration operation using the jig 21. ) Is measured at least once, and the measured value is used as the optical axis deviation amount for calibration, so that the optical axes of the lower visual field and the upper visual field of the image recognition optical system 19 can be obtained with better accuracy. The displacement amount of the electronic component 13 with respect to the circuit board 16 can be suppressed.
Further, in the highly accurate calibration operation of FIG. 4, during the calibration operation, the optical axis shift amount (offset amount) between the fields of view of the image recognition optical system 19 is measured a plurality of times, and the measured value measured a plurality of times. By using the measurement value selected from the above or the average value of the measurement values as the calibration optical axis deviation amount, the degree of influence of the handling accuracy of the jig 21 is suppressed, and the image recognition optical system is highly accurate. The amount of deviation of the optical axis between the lower visual field 19 and the upper visual field can be obtained, and the mounting position deviation of the electronic component 13 with respect to the circuit board 16 can be suppressed.
In the above embodiment, after performing the position recognition operation of the mark 22 of the jig 21 on the calibration stage 20 in step S1 of FIG. 4 or step S21 of FIG. 8, steps S2, S3 of FIG. In steps S22 and S23, the position recognition operation of the mark 22 of the jig 21 adsorbed by the nozzle 15a of the bonding head 15 is performed. Conversely, the operations in steps S2 and S3 in FIG. 4 are performed. After that, the operation of step S1 may be performed, or the operation of step S21 may be performed after the operations of steps S22 and S23 in FIG. 8 are performed.
[0030]
Furthermore, in the above-described embodiment, the measurement of the amount of deviation of the optical axis at least once or a plurality of times, for example, is performed only once before starting the mounting operation, due to a change in room temperature during the mounting operation or heat generation in the apparatus. In some cases, distortion occurs in the holding unit of the image recognition optical system and the like, and the inclination of the optical axis changes, so that the mounting position of the component shifts. Therefore, in order to prevent this, after measuring the amount of deviation of the optical axis once, measure again in a similar manner after a predetermined time, for example, two hours later, and update the offset of the amount of deviation of the optical axis based on the measurement result Is preferably performed.
Specifically, an operation for mounting the electronic component 13 will be described. First, after the head 15 and the slide base 18 are moved to a predetermined position, the head 15 is lowered and the electronic component 13 on the tray 14 is picked up. Next, the head 15 and the slide base 18 are moved again to perform rough positioning for mounting the electronic component 13 on the circuit board 16. Next, in order to confirm the position of the circuit board 16, the image recognition optical system 19 moves to a position where a feature point on the circuit board 16, for example, a recognition mark, falls within the field of view. Recognition is performed at least once or multiple times. Next, in order to confirm the position of the electronic component 13, the image recognition optical system 19 moves to a position where a feature point on the electronic component 13, for example, a recognition mark, falls within the field of view. Recognition is performed at least once or multiple times. After the position correction between the circuit board 16 and the electronic component 13 is performed based on the recognition result of the circuit board 16 and the electronic component 13 stored in the memory 113 and the latest calibration result of the image recognition optical system 19. The head 15 is lowered and the electronic component 13 is mounted on the circuit board 4.
[0031]
As described above, according to the present embodiment, in the position correction at the time of electronic component mounting, the electronic component image recognition side that is measured and updated in the memory 113 at regular time intervals, for example, every two hour intervals. By correcting the amount of offset between the visual fields on the circuit board image recognition side, distortion occurs in the holding part of the image recognition optical system due to a change in room temperature or heat generation inside the apparatus, and even if the inclination of the optical axis changes, The electronic component mounting position does not shift. In this case, if each measurement is performed a plurality of times as described above, handling errors can be prevented.
According to such a configuration, the amount of offset between the visual field of the image recognition optical system is measured at regular intervals, and the measurement result is corrected with respect to the image recognition result of the electronic component and the circuit board. Position correction when mounting an electronic component that is not affected by the distortion of the holding part of the optical system is possible, and the electronic component can be mounted with high accuracy even when the room temperature changes or heat is generated inside the apparatus.
[0032]
【The invention's effect】
As described above, the present invention measures the optical axis deviation amount (offset amount) between the fields of view of the image recognition optical system at least once during the calibration operation using the jig, and calibrates the measured values. The amount of optical axis deviation between the lower field of view and the upper field of view of the image recognition optical system can be determined with better accuracy, and the mounting position of the component on the circuit board Deviation can be suppressed.
Further, as described above, the present invention obtains the optical axis deviation amount (offset amount) between the fields of view of the image recognition optical system a plurality of times, and averages them based on the optical axis deviation amount obtained a plurality of times. To obtain the calibration optical axis misalignment amount, etc. to reduce the degree of influence of the jig handling accuracy for obtaining the calibration optical axis misalignment amount. It is possible to obtain an offset amount (shift amount of the optical axis) between the side field of view and the upper side field of view, and to suppress a component mounting position shift with respect to a member on which the component is to be mounted.
Further, when measuring the amount of offset (offset amount) of the optical axis between the visual fields of the image recognition optical system a plurality of times, the offset amount between the visual fields of the image recognition optical system is measured at least once every fixed time, In addition, by correcting the measurement result for the image recognition result of the electronic component and the circuit board, it becomes possible to correct the position when mounting the electronic component without being affected by the distortion of the holding part of the image recognition optical system. Even if there is a change in temperature or heat generation inside the apparatus, electronic components can be mounted with high accuracy. In this case, if each measurement is performed a plurality of times as described above, handling errors can be prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an overall configuration of an electronic component mounting apparatus according to an embodiment of the present invention.
2 is a perspective view of a calibration stage in a state where a jig is placed in the electronic component mounting apparatus of FIG. 1. FIG.
3 is a diagram showing the positions of images of jigs imaged in the upper and lower fields of view of the image recognition optical system of the electronic component mounting apparatus of FIG. 1;
4 is a flowchart of a calibration operation of the electronic component mounting apparatus of FIG.
FIG. 5 is a block diagram illustrating a configuration of a control unit of the electronic component mounting apparatus of FIG. 1;
FIG. 6 is a longitudinal sectional side view of the image recognition optical system in the embodiment.
FIG. 7 is a perspective view showing a calibration operation in the embodiment.
8 is a flowchart of a calibration operation of the electronic component mounting apparatus of FIG.
FIG. 9 is a perspective view showing an overall configuration of a conventional electronic component mounting apparatus.
FIG. 10 is a longitudinal sectional side view of an image recognition optical system in a conventional example.
[Explanation of symbols]
13. Electronic parts
14 ... Circuit board
15 ... Bonding head
15a ... Nozzle
16 ... Circuit board
17 ... Bonding stage
18 ... Slide base
19. Image recognition optical system
20 ... Calibration stage
21 ... Jig
22 ... mark
22-1, 22-2, 23, 24 ... Position of the mark on the jig
101 ... Main controller
102. X-coordinate moving driver of image recognition optical system
103 ... Driver for Y-coordinate movement of image recognition optical system
104: Bonding head moving driver
105. Shutter drive unit
106: Nozzle suction drive unit
107: Image recognition unit
108: Memory for storing image data
109: Image processing unit
110... Memory for storing the mark position (optical axis deviation amount) of the jig
111 ... Calculation unit
112 ... Memory for storing coordinate data
113 ... Memory for storing production conditions
200 ... control unit

Claims (22)

A component suction and transfer device (15) for holding and transporting the component (13) and mounting it on the circuit board (16);
A circuit board holding device (17) for holding the circuit board;
An image recognition optical system (19) for recognizing the positions of the component and the circuit board in different fields of view;
The position in the state where one jig (21) recognized by the image recognition optical system and capable of transmitting light and capable of recognizing the same mark in the upper and lower fields of view is held in the component suction conveyance device and the circuit board A plurality of optical axis deviation amounts in two fields of view with respect to a position where the jig placed on a calibration stage movable with the holding device (17) is held can be obtained using the jig. A control unit (200) for obtaining a calibration optical axis deviation amount based on the obtained result,
A component mounting apparatus that calibrates the image recognition optical system based on the calibration optical axis deviation obtained by the control unit and mounts the component on the circuit board.   The control unit obtains the deviation amount of the optical axis between the two fields of view of the image recognition optical system three times or more, and removes the upper limit deviation amount and the lower limit deviation amount from the obtained deviation amounts. In the case where there are a plurality of deviation amounts, the average value of them is obtained and used as the calibration optical axis deviation amount, while the remaining deviation amount excluding the upper limit deviation amount and the lower limit deviation amount is only one. The amount of deviation is set as the optical axis deviation amount for calibration when it does not remain, and the calibration of the image recognition optical system is performed based on the obtained optical axis deviation amount for calibration. The component mounting apparatus according to 1.   The control unit obtains the amount of deviation of the optical axis between the two fields of view of the image recognition optical system at least three times, and a certain amount of deviation exceeds a certain threshold even if it takes a difference from any other amount of deviation. In this case, an average value of the remaining deviation amounts excluding the deviation amount is obtained as the calibration optical axis deviation amount, and the calibration of the image recognition optical system is performed based on the obtained calibration optical axis deviation amount. The component mounting apparatus according to claim 1, wherein the component mounting apparatus performs the operation.   When determining the amount of deviation of the optical axis, the control unit recognizes the image in each field of view being imaged by the image recognition optical system a plurality of times, and the image in each field of view from a plurality of recognition results. Recognized by the recognition optical system in a state where the jig is held on the component suction conveyance device and a state where the jig placed on the calibration stage movable with the circuit board holding device is held. Obtain the amount of optical axis deviation from the position, and repeat this multiple times to obtain the amount of optical axis deviation for calibration.Based on the obtained amount of optical axis deviation for calibration, The component mounting apparatus according to claim 1, wherein the calibration of the image recognition optical system is performed. A component holding and conveying device (15) for holding, conveying and mounting the component (13) on the circuit board (16);
A circuit board holding device (17) for holding the circuit board;
With one jig (21) capable of transmitting light and recognizing the same mark in the upper and lower fields of view being held in the component suction / conveying device, the position of the jig mark (22) is set to a certain one. The position of the mark (22) of the jig is determined in a state where the jig is held on a calibration stage (20) movable with the circuit board holding device (17) while recognizing a plurality of times by the visual field. An image recognition optical system (19) for recognizing a plurality of times in a field of view different from the field of view;
The optical axis deviation amount between the mark positions of the jig is determined based on the recognition result performed a plurality of times between the two fields of view of the image recognition optical system, and the average value of the obtained optical axis deviation amounts is obtained. And a control unit (200) that sets the calculated average value as the optical axis deviation amount for calibration of the two fields of view of the image recognition optical system,
A component mounting apparatus configured to mount the component on the circuit board after calibrating the image recognition optical system based on the calibration optical axis deviation amount obtained by the control unit.   When the image recognition optical system recognizes the position of the mark of the jig in the two states a plurality of times, the position of the mark of the jig in the state of being held by the component holding and conveying device, and After the position of the mark of the jig held by the calibration stage is recognized once by the image recognition optical system, the position of the mark of the jig in each state is similarly recognized. The component mounting apparatus according to claim 5, wherein the process is repeated.   When the image recognition optical system recognizes the position of the mark of the jig in the two states a plurality of times, the image recognition optical system determines the position of the mark of the jig in the state held by the component holding and conveying device. 6. The image recognition optical system according to claim 5, wherein the image recognition optical system recognizes a plurality of times, and the image recognition optical system recognizes the position of the mark of the jig while being held on the calibration stage a plurality of times. Component mounting device.   The image recognition optical system recognizes the positions of the marks of the jig held by the component holding and conveying device and the jig held by the calibration stage at least three times. Then, the control unit determines the remaining shift amount excluding the upper limit shift amount and the lower limit shift amount among the shift amounts of the optical axes of the two or more two visual fields obtained based on the recognized result. When there are a plurality of cases, the average value of them is obtained and used as the calibration optical axis deviation amount, while only one remaining deviation amount except for the upper deviation amount and the lower deviation amount remains. The component mounting apparatus according to claim 5, wherein instead of obtaining the average value, the deviation amount is set as the calibration optical axis deviation amount.   The image recognition optical system obtains the positions of the marks of the jig held by the component holding and conveying device and the jig held by the calibration stage three times or more, When a certain deviation amount exceeds a certain threshold even if a difference from any other deviation amount is obtained, the control unit obtains an average value of the remaining deviation amounts excluding the deviation amount and calculates the calibration optical axis. The component mounting apparatus according to any one of claims 5 to 7, wherein a shift amount is set. One jig (21) that can transmit light to the component holding and conveying device (15) that holds and conveys the component (13) and mounts it on the circuit board (16) and recognizes the same mark in the upper and lower visual fields. In the held state, the position of the mark (22) of the jig is recognized a plurality of times by the image recognition optical system (19),
With the jig held on a calibration stage (20) movable together with the circuit board holding device (17) for holding the circuit board, the position of the mark (22) on the jig is determined by an image recognition optical system ( 19)
The position in the state where one jig (21) recognized by the image recognition optical system and capable of transmitting light and capable of recognizing the same mark in the upper and lower fields of view is held in the component suction conveyance device and the circuit board The amount of deviation between the positions of the marks of the jig between the two fields of view between the holding position of the jig mounted on the calibration stage movable with the holding device (17). Seeking
The average value of the obtained optical axis deviation amounts is calculated as the optical axis deviation amounts of the two fields of view of the image recognition optical system. After performing calibration based on the optical axis deviation amounts, the above components are A component mounting method for mounting on the circuit board.   When the position of the mark of the jig in the two states is recognized by the image recognition optical system a plurality of times, the position of the mark of the jig and the position of the jig held by the component holding and conveying device After the position of the mark of the jig in the state of being held on the calibration stage is recognized once by the image recognition optical system, the position of the mark of the jig in each state is similarly recognized. The component mounting method according to claim 10, wherein the above is repeated.   When the position of the mark of the jig in the two states is recognized by the image recognition optical system a plurality of times, the position of the mark of the jig in the state of being held by the component holding and conveying device is 11. The recognition according to claim 10, wherein the image recognition optical system recognizes a plurality of times, and the image recognition optical system recognizes the position of the mark of the jig held on the calibration stage a plurality of times. Component mounting method.   Recognize the positions of the marks of the jig held by the parts holding and conveying device and the jig held by the calibration stage at least three times, and based on the recognized results When there are a plurality of remaining shift amounts excluding the upper limit shift amount and the lower limit shift amount among the three or more calculated two field-of-view optical axis shift amounts, the average value thereof is obtained and When only one deviation remains except for the upper limit deviation and the lower limit deviation, the deviation is calculated instead of obtaining the average value. The component mounting method according to any one of claims 10 to 12, wherein the calibration is performed based on the calibration optical axis deviation amount obtained as the calibration optical axis deviation amount.   The positions of the marks of the jig held by the parts holding and conveying device and the jig held by the calibration stage are determined three times or more, and a certain amount of deviation is determined by any other If the difference from the deviation amount exceeds a certain threshold, an average value of the remaining deviation amounts excluding the deviation amount is obtained as the calibration optical axis deviation amount, and the obtained calibration light is obtained. The component mounting method according to claim 10, wherein the calibration is performed based on an amount of axis deviation.   The control unit (200) is configured to adjust the optical axis in the two fields of view between the position of the component recognized by the image recognition optical system a plurality of times with a predetermined time interval and the position of the circuit board. The component mounting apparatus according to claim 1, wherein a deviation amount is obtained, and an optical axis deviation amount for calibration is obtained based on the obtained result.   The component mounting method according to claim 10, wherein when the image recognition optical system (19) performs recognition a plurality of times, the recognition is performed a plurality of times with a predetermined time interval. A component holding and conveying device (15) for holding, conveying and mounting the component (13) on the circuit board (16);
A circuit board holding device (17) for holding the circuit board;
With one jig (21) capable of transmitting light and recognizing the same mark in the upper and lower fields of view being held in the component suction / conveying device, the position of the jig mark (22) is set to a certain one. While recognizing from the visual field and holding the jig on the calibration stage (20) movable with the circuit board holding device (17), the position of the mark (22) of the jig is defined as the visual field. Is an image recognition optical system (19) that recognizes in a different field of view,
The jig (21) recognized by the image recognition optical system is placed on a calibration stage that is movable together with the position of the component suction conveyance device and the circuit board holding device (17). The amount of deviation of the optical axis between the positions of the marks on the jig based on the recognition result between the fields of view with the position where the jig is held is determined for each of the two fields of view of the image recognition optical system. A control unit (200) for setting the optical axis deviation for calibration is provided.
A component mounting apparatus configured to mount the component on the circuit board after calibrating the image recognition optical system based on the calibration optical axis deviation amount obtained by the control unit. A component suction and transfer device (15) for holding and transporting the component (13) and mounting it on the circuit board (16);
A circuit board holding device (17) for holding the circuit board (16) ;
The component suction conveying device (15) and parts (13) held recognizable from the lower side, and the circuit the circuit board held (16) appreciably from the upper substrate holding device (17), respectively An image recognition optical system (19) for recognizing the position of the image in different fields of view ,
A calibration stage (20) that is placed to recognize one jig (21) that can transmit light and can recognize the same mark in the upper and lower fields of view ;
Using the jig (21), the image recognition optical system recognizes the mark (22) of the jig (21) held by the component suction conveyance device (15) from below, and the calibration stage. By recognizing the same mark of the jig placed on (20) from above, the optical axis deviation amounts of the lower visual field and the upper visual field of the image recognition optical system (19) are obtained,
A control unit (200) for setting the optical axis deviation for calibration of the two visual fields of the image recognition optical system (19) based on the obtained result,
A component mounting apparatus that calibrates the image recognition optical system based on the calibration optical axis deviation obtained by the control unit and mounts the component on the circuit board. The component mounting apparatus according to claim 18, wherein the calibration stage includes a regulation claw for positioning the jig. The component mounting apparatus according to claim 18, wherein the jig capable of transmitting light is made of glass. The image recognizing optical system recognizes the mark of the jig from below and recognizes the position of the mark of the jig a plurality of times in a state of recognizing the same mark of the jig from above. The position of the mark of the jig held by the component holding and conveying apparatus and the position of the mark of the jig held by the calibration stage once each for the image recognition optical The component mounting apparatus according to claim 18, wherein after the recognition by the system, the recognition of the position of the mark of the jig in each state is similarly repeated. When the image recognition optical system recognizes the mark of the jig from below and recognizes the position of the mark of the jig a plurality of times in a state where the same mark of the jig is recognized from above The position of the mark of the jig held by the component holding and conveying apparatus is recognized a plurality of times by the image recognition optical system, and the jig of the jig is held by the calibration stage. The component mounting apparatus according to claim 18, wherein the position of the mark is recognized a plurality of times by the image recognition optical system.

Images