JP3733800B2 - Electronic component recognition apparatus in electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component recognition apparatus in an electronic component mounting apparatus that recognizes an image of an electronic component when mounting the electronic component.
[0002]
[Prior art]
In an electronic component mounting apparatus that mounts an electronic component on a substrate, a method of correcting a positional shift of the electronic component by image recognition is frequently used in order to improve mounting position accuracy. In this method, the transfer head picks up and holds the electronic component from the parts feeder, images the electronic component with a camera, and performs image processing on the imaging result to detect a positional shift. When the electronic component is mounted on the board, the above-described positional deviation is corrected, and the electronic component is accurately positioned and mounted at the correct position.
[0003]
As an illumination method for imaging an electronic component with a camera, a conventional method of irradiating an electronic component with illumination light from below and receiving reflected light from the electronic component with a camera, or provided behind the electronic component Bump recognition is required for electronic parts with thin bumps formed on thin substrates such as CSP (Chip Size Package) such as transmissive illumination that illuminates the reflector and receives the reflected light with a camera. Various lighting methods such as side lighting used in cases are used.
[0004]
[Problems to be solved by the invention]
Incidentally, in recent years, versatility has been required for electronic component mounting apparatuses, and various types of mounting have been performed by the same mounting apparatus. For this reason, it is necessary to enable the above-described various methods to be realized with the same apparatus for illumination when imaging an electronic component. However, if light sources for different types of illumination methods are arranged in the same recognition device, the illumination light emitted from each light source is a dark image of a part other than the original irradiation target part, for example, when performing transmission recognition Therefore, it is not preferable in terms of recognition accuracy that the lower surface of the electronic component is irradiated with illumination light. However, if a plurality of light sources are arranged in an imaging station in a limited space, mutual interference of illumination light is unavoidable, and there is a problem that improvement in recognition accuracy due to illumination failure is hindered.
[0005]
Accordingly, an object of the present invention is to provide an electronic component recognition apparatus in an electronic component mounting apparatus that can improve recognition accuracy without interference of illumination light even when a plurality of light sources are arranged.
[0006]
[Means for Solving the Problems]
The electronic component recognition apparatus in the electronic component mounting apparatus according to claim 1, wherein an electronic component in the electronic component mounting apparatus that illuminates the electronic component held by the nozzle with an illuminating unit and captures an image with the imaging unit to recognize the image of the electronic component In the component recognition apparatus, the illumination unit is disposed above the nozzle and a first light source for irradiating illumination light on the lower surface of the electronic component held by the nozzle and recognizing the electronic component. A second light source for transmitting and recognizing the electronic component held by the nozzle by irradiating the reflected reflector, and illumination light is incident on the side surface of the bumped component held by the nozzle to A third light source that obtains an image having a background other than the bumps as a dark image and only the bumps as a bright image, and a light shielding unit disposed between the illumination unit and the illumination target. Point the light source Then, when the electronic component is reflected and recognized, the illumination light is restricted from being incident on a portion other than the lower surface of the electronic component that is the irradiation target portion of the first light source, and the second light source is turned on. When the electronic component is transmitted and recognized, the incidence of illumination light other than the reflecting plate is limited by the light shielding means, and when the third light source is turned on to recognize the bump of the bumped component, the bump Incidence of illumination light other than the side surfaces of the accessory parts is limited by the light shielding means .
[0007]
The electronic component recognition apparatus in the electronic component mounting apparatus according to claim 2 is the electronic component recognition apparatus in the electronic component mounting apparatus according to claim 1, wherein the light shielding means is a plate-shaped light shielding member.
[0008]
According to the present invention, by providing the light shielding means for preventing the illumination light irradiated from the plurality of light sources from being irradiated to the part other than the predetermined irradiation target part, the correct illumination condition is realized and the recognition accuracy is improved. be able to.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component recognition device according to an embodiment of the present invention, FIGS. 2 and 3 are cross-sectional views of the electronic component recognition device, and FIG. 4 is an image view of the electronic component recognition device.
[0010]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The transport path 2 transports and positions the substrate 3. Therefore, the conveyance path 2 is a positioning portion for the substrate 3. A large number of parts feeders 4 are arranged in parallel on both sides of the conveyance path 2. The parts feeder 4 stores and supplies electronic parts P.
[0011]
On the X-axis table 6, a transfer head 7 for the electronic component P is mounted. The X-axis table 6 is installed on two Y-axis tables 5 arranged in parallel on the left and right sides. Therefore, by driving the X-axis table 6 and the Y-axis table 5, the transfer head 7 moves in the horizontal direction, picks up the electronic component P from the parts feeder 4, and mounts it on the substrate 3. An electronic component recognition device 8 for recognizing the electronic component P is disposed on the movement path of the transfer head 7. When the transfer head 7 holding the electronic component P moves in the X direction over the electronic component recognition device 8, the electronic component P is imaged by the electronic component recognition device 8, and the shape and position of the electronic component are recognized. Is done.
[0012]
Next, the transfer head 7 and the electronic component recognition apparatus 8 will be described with reference to FIG. In FIG. 2, the transfer head 7 is equipped with a suction nozzle 11 that vacuum-sucks the electronic component P. The suction nozzle 11 is integrally provided with a bowl-shaped reflecting plate 12. In a state where the electronic component is held in the suction hole at the lower end of the suction nozzle 11, the reflector 12 is positioned above the electronic component and reflects the illumination light from below to illuminate the electronic component from behind.
[0013]
The electronic component recognition device 8 is provided with a lens 20 and a camera 21. The camera 21 is connected to the image processing unit 22, and the image processing unit 22 processes the image data of the electronic component P recognized by the camera 21 and detects the displacement of the electronic component P. Around the lens 20, a light source unit 23 is disposed as illumination means so as to surround the transfer head 7 to be illuminated from obliquely below.
[0014]
The light source unit 23 has three types of light sources arranged at different positions, that is, a first light source 24, a second light source 25, and a third light source 26 made of LEDs. A light shielding plate 27 is disposed between these three types of light sources and the object to be illuminated. The light shielding plate 27 is a light-impermeable thin plate-like member, and is disposed at a predetermined position at a predetermined angle so that the illumination light emitted from each light source is outside the predetermined irradiation target site and obstructs the illumination conditions. Prevents the area from being irradiated.
[0015]
Next, the function of the light source unit 23 will be described with reference to FIGS. First, as shown in FIG. 3A, when the first light source 24 is turned on in a state where the suction nozzle 11 holds the chip part Pa, the illumination light is reflected on the lower surface of the chip part Pa. When the reflected light is received by the camera 21, the lower surface of the chip part Pa can be imaged as shown in FIG. That is, the first light source 24 is used when the recognition target is recognized by reflection.
[0016]
At this time, the light shielding plate 27 restricts the incidence of the illumination light from the first light source 24 on the portion other than the lower surface of the chip component Pa, which is a predetermined irradiation target site, in particular, the incidence on the reflection plate 12. This restricts the extra reflected light from other than the lower surface of the chip component Pa from entering the camera 21 and improves the recognition accuracy.
[0017]
Next, as shown in FIG. 3B, when the second light source 25 is turned on while the lead component Pb is held by the suction nozzle 11, the illumination light is reflected by the reflector 12 disposed above the suction nozzle 11. Is reflected downward. When the reflected light is received by the camera 21, as shown in FIG. 4B, the background image portion through which the reflected light is transmitted is a bright image and the range where the reflected light is blocked by the lead component Pb is a dark image. An image is obtained, and the outer shape of the lead component Pb can be recognized from this image. That is, the second light source 25 is used when transparently recognizing a recognition target.
[0018]
At this time, the light shielding plate 27 restricts the incidence of the illumination light from the second light source 25 to the part other than the reflection plate 12 which is a predetermined irradiation target site, in particular, the incidence to the lower surface of the lead component Pb. As a result, the extra reflected light other than the transmitted reflected light from the reflecting plate 12 is restricted from entering the camera 21, and the recognition accuracy is improved.
[0019]
Next, as shown in FIG. 3C, when the third light source 26 is turned on while the bumped component Pc is held by the suction nozzle 11, the irradiated illumination light enters the side surface of the bumped component Pc. . Thus, the illumination light is incident only on the side surface of the bump B without entering the glossy surface on the lower surface of the bumped component Pc. As shown in FIG. 4C, the bumped component Pc is imaged by the camera 21 from below while the side surfaces of the bumps B are uniformly illuminated from the plurality of light source units 23 arranged around the periphery. Images other than the bump B of the bumped component Pc can be obtained as dark images of the background image, and only the bump B can be a bright image. That is, the light source 26 is used when it is necessary to irradiate from the side such as a bumped component.
[0020]
At this time, the light shielding plate 27 restricts the incidence of illumination light from the third light source 26 to a portion other than the side surface of the bumped component Pc, which is a predetermined illumination target site, in particular, the incidence to the lower surface of the bumped component Pc. This restricts the extra reflected light from the glossy surface other than the bump B on the lower surface of the bumped component Pc from entering the camera 21 and improves the recognition accuracy.
[0021]
As described above, the first light source for reflection recognition, the second light source for transmission recognition, and the third light source that is incident on the electronic components held by the nozzles from a specific side direction are integrally formed. In the electronic component recognition apparatus provided, by providing a light blocking means between the light source unit and the illumination target, it is possible to prevent different types of illumination light from interfering with each other and improve recognition accuracy.
[0022]
In the present embodiment, the example in which the light shielding plate 27 as the light shielding means is fixedly arranged is shown. However, the position and the arrangement angle of the light shielding plate 27 with respect to the light source unit 23 and the illumination target may be provided to be adjustable. Thereby, a better light-shielding effect can be obtained for each illumination target.
[0023]
【The invention's effect】
According to the present invention, since the light shielding means for preventing the illumination light emitted from the plurality of light sources from being applied to the parts other than the predetermined illumination target part is provided, the interference between the different illumination lights can be prevented. As a result, correct illumination conditions can be realized and recognition accuracy can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component recognition apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of an electronic component recognition apparatus according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of an electronic component recognition apparatus. FIG. 4 is an image of an electronic component recognition apparatus according to an embodiment of the invention.
7 Transfer Head 8 Electronic Component Recognition Device 11 Suction Nozzle 12 Reflector 21 Camera 22 Image Processing Unit 23 Light Source 24 First Light Source 25 Second Light Source 26 Third Light Source 27 Light-shielding Plate

Claims (2)

An electronic component recognition apparatus in an electronic component mounting apparatus that illuminates an electronic component held by a nozzle with an illuminating unit, captures an image with an imaging unit, and performs image recognition of the electronic component, wherein the illuminating unit is held by the nozzle A first light source for reflecting and recognizing the electronic component by illuminating the lower surface of the electronic component, and an electronic component held by the nozzle by irradiating a reflector disposed above the nozzle The second light source for transmitting and recognizing the light, and the illumination light is incident on the side surface of the bumped component held by the nozzle to make a background dark image except for the bump of the bumped component, and only the bump is a bright image A third light source for obtaining an image, and a light shielding means disposed between the illumination means and the illumination target.
When turning on the first light source and recognizing and reflecting the electronic component, the light shielding means restricts the incidence of illumination light to other than the lower surface of the electronic component that is the irradiation target portion of the first light source,
Further, when turning on the second light source and recognizing transmission of the electronic component, the incidence of illumination light other than the reflector is limited by the light shielding means,
In addition, when the third light source is turned on to recognize the bump of the bumped component, the incident of illumination light on the side other than the side surface of the bumped component is restricted by the light shielding means. Electronic component recognition apparatus in a mounting apparatus. 2. The electronic component recognition apparatus in an electronic component mounting apparatus according to claim 1, wherein the light shielding means is a plate-shaped light shielding member.

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