JP3736072B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-weight, small, and thin imaging device that can be mounted on a desktop or notebook personal computer, a mobile phone, and the like, and in particular, a peripheral circuit device including a solid-state imaging device, a drive circuit, a signal processing circuit, a control circuit, and the like. The present invention relates to an imaging device in which an optical system such as a lens and a diaphragm is integrated.
[0002]
[Prior art]
In recent years, in consumer video cameras, there are increasing demands for high-quality images such as faithful color reproducibility and fine detail expression, as well as miniaturization, thickness reduction, and weight reduction that are convenient to carry. In order to meet such demands, technological developments for reducing the size and thickness of an imaging device including a solid-state imaging element and its peripheral circuit elements have been actively conducted.
[0003]
FIG. 6 is a cross-sectional view of a main part of a conventional downsized imaging device. In FIG. 6, reference numeral 1 denotes a solid-state imaging device (hereinafter referred to as a CCD) in which a solid-state imaging device (hereinafter referred to as a CCD chip) is mounted inside a ceramic package. And mounted on the first printed circuit board 2. A circuit component 3 such as a resistor or a capacitor is also mounted on the first printed board 2 and is electrically connected to the CCD 1. Reference numeral 4 denotes a second printed circuit board electrically connected to the first printed circuit board 2 by a flexible cable 5, and each peripheral circuit element constituting the drive circuit section and signal processing circuit section of the CCD 1 on the upper surface thereof. 6 and circuit components 7 such as resistors and capacitors are mounted. The second printed circuit board 4 can be freely bent by the flexible cable 5 and is effective in reducing the area occupied by the imaging device.
[0004]
As shown in the figure, the conventional imaging device uses two printed circuit boards 2 and 4, and the first printed circuit board 2 is mounted with a solid-state imaging device 1 and a circuit component 3 mounted on a ceramic package or the like. A peripheral circuit element 6 and a circuit component 7 are mounted on the printed circuit board 4. The dimensions of these printed circuit boards are about 4 cm square, and the height of the two printed circuit boards superimposed is about 1 cm.
[0005]
A lens holder 8 is provided so as to cover the CCD 1, and the lens 9 is fixed at a position located at the center of the CCD 1. Reference numeral 10 denotes a case of an image pickup apparatus in which a diaphragm having a small diameter and an optical filter are provided at the center thereof.
[0006]
Such imaging devices are increasingly being used for imaging terminals of video cameras and electronic still cameras, or information terminals such as notebook computers and mobile phones, but these portable electronic devices are becoming smaller and lighter. However, as functions to be provided are required to be multi-functional, further miniaturization, weight reduction, and thinning of the components of these electronic devices have become essential conditions.
[0007]
In order to meet these demands, the inventors have previously proposed a new one-package module type imaging device that is reduced in size and thickness as shown in FIG.
[0008]
As shown in FIG. 7, in this imaging apparatus, a CCD chip 12 and a peripheral circuit element 13 made of a semiconductor chip are mounted in the vicinity of the CCD chip 12 inside a storage container 11, both of which are made of gold wire or the like. The wire leads 14 are bonded to a wiring group (not shown) formed on the bottom surface of the storage container 11. Similarly, the terminals of the wiring group are connected to pin leads 15 led out of the storage container 11 by wire leads 14. The storage container 11 thus configured is hermetically sealed by adhering a lens holder 16 to the upper surface thereof.
[0009]
The lens holder 16 is provided with an optical aperture 17 and a lens 18 constituting a pinhole lens at a portion located just on the upper surface of the CCD chip 12.
[0010]
Next, other peripheral components 20 and the like are mounted on the opposite surface of the substrate 19 on which the storage container 11 is placed, and the imaging device is completed.
[0011]
[Problems to be solved by the invention]
However, as seen in FIG. 7, the lens holder 16 and the storage container 11 are attached by the adhesives 21a and 21b applied to the upper surface of the peripheral part of the frame of the storage container 11, so that the adhesive can be seen in the figure. In the case where the lens holder 16 is applied with a non-uniform thickness, such as the thick portion 21a and the thin portion 21b, the lens holder 16 may be mounted unevenly. Therefore, the optical axis between the light receiving surface of the CCD chip 12 and the lens 18 is changed. The problem of inconsistency arises.
[0012]
SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object thereof is to provide an imaging apparatus capable of simultaneously and reliably performing hermetic sealing and optical alignment when assembling a one-package camera module.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides an imaging apparatus including a lens holder having an optical diaphragm and a lens, and a storage container equipped with a solid-state imaging device and a peripheral circuit element. Each of which is provided with a step, and an optical positioning reference surface and an adhesive surface are respectively formed on the step, and a container for mounting a lens holder having an optical system on the optical positioning reference surface and a CCD chip, etc. Therefore, it is possible to obtain a high-quality image pickup apparatus that does not cause a deviation of the optical axis due to defective application of the adhesive as in the prior art.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention is an image pickup apparatus including a lens holder having an optical diaphragm and a lens, and a storage container on which a solid-state image pickup element and a peripheral circuit element are mounted, and the frame of the lens holder and the storage container Steps are provided in the peripheral part of the body, and an optical positioning reference surface and an adhesive surface are formed on the steps, and adhesion for hermetic sealing of the lens holder and the storage container constituting the imaging device And a reference surface for optical alignment of the lens holder forming the optical system and the receiving container and the storage container constituting the signal processing system are provided separately, so that it is extremely easy and reliable. Hermetic sealing and optical positioning can be performed at the same time, and a highly accurate imaging device can be obtained.
[0015]
The invention according to claim 2 of the present invention relates to the image pickup apparatus according to claim 1, wherein the optical positioning reference surface is provided on each inner side surface of the step between the lens holder and the storage container, and the adhesive surface is each outer surface of the step. Even if the adhesive is applied excessively, it does not flow into the imaging device and contaminate the CCD chip or the like.
[0016]
The invention according to claim 3 of the present invention relates to the imaging apparatus according to claim 1, wherein the optical positioning reference surface is provided on each outer surface of the step between the lens holder and the storage container, and the adhesive surface is within each of the steps. Since it is provided on the side surface and the adhesive can be prevented from being exposed to the outside air, a large adhesive force can be maintained.
[0017]
According to a fourth aspect of the present invention, there is provided an imaging apparatus comprising a lens holder including an optical diaphragm and a lens, and a storage container on which a solid-state imaging element and peripheral circuit elements are mounted. The optical alignment reference surface and the adhesive surface are respectively formed on the convex portion or the concave portion provided on the peripheral portion and the concave portion or the convex portion provided on the peripheral portion of the frame of the storage container. Since the portion and the recess are fitted to each other, optical alignment can be performed with a strong bonding force and high reliability.
[0018]
The invention according to claim 5 of the present invention relates to the imaging apparatus according to claim 4, wherein the contact surface between the tip of the convex portion and the bottom surface of the concave portion forms an optical positioning reference surface, and the low surface of the convex portion and the concave portion The gap with the higher surface forms an adhesive surface, and the adhesive surface can be provided on both sides of the outer surface and the inner surface of the frame body. It can be used for an imaging apparatus mounted on a required device.
[0019]
The invention according to claim 6 of the present invention relates to the imaging device according to claim 4, wherein the contact surface between the low surface of the convex portion and the high surface of the concave portion forms an optical alignment reference surface, and the tip of the convex portion The gap between the portion and the bottom surface of the recess forms an adhesive surface, and the same actions and effects as the invention of claim 5 can be obtained.
[0020]
Next, an imaging apparatus according to an embodiment of the present invention will be described with reference to the drawings. The basic configuration of the imaging apparatus according to the present invention is similar to that of the imaging apparatus shown in FIG. 7 previously proposed by the inventors. Therefore, the same parts as those in FIG. Will be described.
[0021]
(Embodiment 1)
FIG. 1 shows the structure of an image pickup apparatus according to a first embodiment of the present invention. In FIG. 1, 11 is a storage container on which a CCD chip 12 and peripheral circuit elements 13 are mounted, and 16 is an image pickup apparatus assembled. In some cases, the lens holder has an optical diaphragm 17 and a lens 18 in a portion located on the upper surface of the CCD chip 12. The structure characterized by the present invention lies in the structure of the lens holder 16 and the peripheral frame portion of the storage container 11, and as shown in FIG. 1, the peripheral frame portion of the lens holder 16 has a protruding portion 16a and an outer portion on the inner side. In the peripheral frame portion of the storage container 11, a step having a bottom surface portion 11 a on the inner side and a protrusion portion 11 b on the outer side is provided.
[0022]
2 is an enlarged view of the structure of the peripheral frame in FIG. 1. When the lens holder 16 and the storage container 11 are combined, the protrusion 16a of the peripheral frame of the lens holder 16 and the storage container 11 are shown. Since the projection 16a and the bottom surface portion 11a are mechanically precisely formed, the optical surfaces of the lens holder 16 and the storage container 11 are optically in close contact with the bottom surface portion 11a of the peripheral frame portion. It can be used as a reference plane for general positioning. In addition, a gap D is formed between the bottom surface portion 16b of the peripheral frame portion of the lens holder 16 and the protruding portion 11b of the peripheral frame portion of the storage container 11, and the adhesive 22 is filled in the gap D to fill the lens holder. 16 and the storage container 11 can be hermetically sealed.
[0023]
(Embodiment 2)
Next, an imaging apparatus according to the second embodiment of the present invention will be described. FIG. 3 shows the structure of the image pickup apparatus according to the second embodiment of the present invention. The difference between the present embodiment and the first embodiment is that each of the peripheral frames of the lens holder 36 and the storage container 31. It is in the structure of the step of the part. That is, when the lens holder 36 and the storage container 31 are combined, the bottom surface part 36 b provided on the outer side of the peripheral frame part of the lens holder 36 and the protruding part 31 b provided on the outer side of the peripheral frame part of the storage container 31. Becomes a reference surface for optical positioning by mechanically contacting, and a protrusion 36a provided on the inner side of the peripheral frame portion of the lens holder 36 and a bottom surface provided on the inner side of the peripheral frame portion of the storage container 31. The adhesive 32 is filled in the gap D generated between the portion 31a.
[0024]
Note that, in the combination of steps of the lens holder of the imaging device and the peripheral frame portion of the storage container in the first and second embodiments of the present invention, although not shown in FIG. 2 and FIG. It is also possible to provide clearances in the sliding portions 17 and 37 and to use for optical alignment in the horizontal direction between the lens holder and the storage container.
[0025]
(Embodiment 3)
Next, an imaging apparatus according to the third embodiment of the present invention will be described. FIG. 4 shows the structure of the image pickup apparatus according to the third embodiment of the present invention. The difference between the present embodiment and the first and second embodiments is the lens holder 46 and the storage container 41. Each has a peripheral frame structure. That is, a convex portion 47 is provided on the upper surface of the peripheral frame portion of the lens holder 46, a concave portion 48 is provided on the upper surface of the peripheral frame portion of the storage container 41, and the height H of the convex portion 47 and the depth of the concave portion 48 are further provided. The relationship with the length L is H> L. Therefore, when the lens holder 46 and the storage container 41 are combined, the tip of the convex portion 47 and the bottom surface of the concave portion 48 are mechanically in close contact with each other and serve as a reference surface for optical positioning between the lens holder 46 and the storage container 41. Further, because of the relationship of H> L, a gap D is inevitably formed between the low surface 46a on both sides of the convex portion 47 and the high surface 41a on both sides of the concave portion 48, and the adhesive is filled in the gap D. The lens holder 46 and the storage container 41 can be hermetically sealed.
[0026]
(Embodiment 4)
Next, an imaging device according to a fourth embodiment of the present invention will be described. FIG. 5 shows the structure of an image pickup apparatus according to the fourth embodiment of the present invention. The difference between the present embodiment and the third embodiment is the peripheral frame of the lens holder according to the third embodiment. The height H of the convex portion provided in the portion and the depth L of the concave portion provided in the peripheral frame portion of the storage container, and the convex portion provided in the peripheral frame portion of the lens holder 56 in the present embodiment. The relationship between the height H of the portion 57 and the depth L of the recess 58 provided in the peripheral frame portion of the storage container 51 is that H <L.
[0027]
Therefore, the optical positioning reference surfaces are low surfaces 56a on both sides of the convex portion 57 provided on the peripheral frame portion of the lens holder 56 and high surfaces on both sides of the concave portion 58 provided on the peripheral frame portion of the storage container 51. It is a contact surface with 51a. Further, the hermetic sealing between the lens holder 56 and the storage container 51 by the adhesive is caused by the relationship of H <L, and the front end portion of the convex portion 57 of the peripheral frame portion of the lens holder 56 and the concave portion 58 of the peripheral frame portion of the storage container 51. This is done by filling the gap D with the bottom surface of the adhesive.
[0028]
In the third and fourth embodiments of the present invention, the sliding portions 49 and 59 at the time of assembling the lens holder and the storage container are used for the horizontal optical alignment between the lens holder and the storage container. It is possible to provide a slight clearance in the case.
[0029]
【The invention's effect】
As is clear from the above embodiment, the present invention provides a lens holder for an image pickup apparatus including a lens holder having an optical aperture and a lens, and a storage container on which a solid-state image pickup element and peripheral circuit elements are mounted, and a frame for the storage container. A step for providing a lens holder with an optical system on the optical positioning reference surface, a CCD chip, etc. by providing a step on the periphery and separately forming an optical positioning reference surface and an adhesive surface on the step. Since the container can be positioned optically with high accuracy, there is no occurrence of a misalignment of the optical axis due to poor application of the adhesive as in the prior art, and an extremely high quality imaging device can be obtained with a high yield. .
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an image pickup apparatus according to a first embodiment of the present invention. FIG. 2 is a partially enlarged cross-sectional view illustrating a combined structure of a lens holder and a storage container of the image pickup apparatus. FIG. 4 is a partially enlarged cross-sectional view showing a combined structure of imaging devices in the second embodiment. FIG. 4 is a partially enlarged cross-sectional view showing a combined structure of imaging devices in the third embodiment. FIG. 6 is a partial enlarged cross-sectional view showing the combined structure of the imaging device in the embodiment. FIG. 6 is a sectional view of the conventional imaging device. FIG. 7 is a sectional view of another conventional imaging device.
11 Storage container 11a Bottom surface (optical positioning reference surface)
11b Protruding part (adhesive surface)
12 CCD chip (solid-state image sensor)
13 Peripheral circuit element 16 Lens holder 16a Protruding part (optical positioning reference surface)
16b Bottom surface (adhesive surface)
17 Optical diaphragm 18 Lens

Claims (6)

An image pickup apparatus comprising a lens holder having an optical diaphragm and a lens, and a storage container equipped with a solid-state image sensor and a peripheral circuit element, wherein steps are provided in the periphery of the frame body between the lens holder and the storage container. An imaging apparatus in which an optical positioning reference surface and an adhesive surface are formed at the step. The imaging apparatus according to claim 1, wherein an optical positioning reference surface is provided on each inner surface of the step between the lens holder and the storage container, and an adhesive surface is provided on each outer surface of the step. The imaging apparatus according to claim 1, wherein an optical positioning reference surface is provided on each outer surface of the step between the lens holder and the storage container, and an adhesive surface is provided on each inner surface of the step. An imaging device comprising a lens holder having an optical diaphragm and a lens, and a storage container on which a solid-state imaging device and a peripheral circuit element are mounted, wherein a convex portion or a concave portion provided in a peripheral portion of a frame body of the lens holder, and An imaging device in which an optical alignment reference surface and an adhesive surface are respectively formed in a concave portion or a convex portion provided in a peripheral portion of a frame of a storage container. The contact surface of the front-end | tip of a convex part and the bottom face of a recessed part forms the optical positioning reference plane, The clearance gap between the low surface of the said convex part, and the high surface of the said recessed part forms the adhesive surface. Imaging device. The contact surface between the low surface of the convex portion and the high surface of the concave portion forms an optical positioning reference surface, and the gap between the tip portion of the convex portion and the bottom surface of the concave portion forms an adhesive surface. Imaging device.

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