JP3739650B2 - Hybrid IC package and hybrid IC - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a hybrid I C In particular, the present invention relates to a hybrid IC in which an electronic component mounted on a printed wiring board is packaged by resin sealing.
[0002]
[Prior art]
Conventionally, small hybrid ICs in which a plurality of electronic components are mounted on a printed wiring board have rapidly spread. There are those that are sealed or molded with resin, such as hybrid ICs of this type, those that cover parts with a metal case, and those that are housed in a metal case.
[0003]
In manufacturing such a hybrid IC, a printed wiring board is created for each hybrid IC, and electronic components are mounted on the printed wiring board, and then sealing or molding using a resin or mounting of a metal case is performed. Is going.
[0004]
For example, as shown in FIG. 2, this type of hybrid IC includes a printed wiring board 21 on which a predetermined printed wiring pattern is formed, and an IC, FET, resistor, capacitor, or the like is provided on the printed wiring board 21. An electronic component 22 is mounted. These electronic components 22 are soldered to the component mounting land electrodes 23 connected to the wiring pattern of the printed wiring board 21 by using the component mounting solder 24 to the terminal electrodes 22a of the electronic components 22. In order to protect and fix the mounted electronic component 22, the electronic component 22 is covered with a sealing resin 25 made of silicon resin or the like. Further, a metal casing 26 is covered so as to cover all of them.
[0005]
[Problems to be solved by the invention]
However, as shown in FIG. 2, the sealing resin 25 is often not filled between the printed wiring board 21 and the electronic component 22. When the sealing resin 25 is not filled between the printed wiring board 21 and the electronic component 22 as described above, a space 27 is formed between the terminal electrodes 22a of the electronic component 22, so that the completed hybrid IC 20 is reflowed by soldering. Further, as shown in FIG. 3, the solder 24 electrically connecting the land electrode 23 on the printed wiring board 21 and the terminal electrode 22a of the electronic component 22 melts and flows out into the space 27, and the terminal electrodes 22a are short-circuited. I had to do it.
[0006]
In view of the above problems, an object of the present invention is a hybrid I in which terminal electrodes of electronic components are not short-circuited during solder reflow. C Is to provide.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a printed wiring board, an electronic component mounted on a main surface of the printed wiring board, and the printed wiring board so as to seal the electronic component. It has a resin part formed on the main surface and terminal electrodes exposed to the outside. Ru Hybrid IC IC package mounted on a circuit board by solder reflow In between the land electrode for mounting the electronic component formed on the printed wiring board and the terminal electrode of the electronic component, Used during solder reflow Hybrid IC conductively connected by a conductive resin having a melting point higher than that of solder Implementation body Propose.
[0008]
Hybrid IC Implementation body According to the present invention, the gap between the land electrode for mounting the electronic component and the terminal electrode of the electronic component is Used during solder reflow Because it is conductively connected by a conductive resin having a melting point higher than that of solder , Ha Even when the hybrid IC is mounted on the parent printed wiring board, a solder reflow process is performed, and the conductive resin does not melt even if heat is applied to the electronic component or the printed wiring board. For this reason, even if a space (air layer) is formed between the terminal electrodes of the electronic component, the terminal electrodes are not short-circuited.
[0015]
Claims 2 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, The thickness of the land electrode for mounting the electronic component formed on the printed wiring board is set to a predetermined value larger than the minimum particle size of the filler in the resin including at least the resin portion and containing the filler, A hybrid IC on which the electronic component is mounted is proposed.
[0016]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, Since the thickness of the land electrode for mounting the electronic component is set to a predetermined value that is at least larger than the minimum particle diameter of the filler contained in the resin, the printed wiring board is formed when the resin portion is formed during manufacturing. At least a resin particle having a minimum particle size enters the gap between the main surface and the electronic component to form the isolation wall.
[0023]
Claims 3 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, A terminal electrode of the electronic component is mounted on a land electrode for mounting the electronic component formed on the printed wiring board, and a land electrode for mounting the electronic component formed on the printed wiring board. And a solder layer between the terminal electrode of the electronic component and the sum of the thickness of the solder layer and the land electrode is smaller than the minimum particle size of the filler in the resin that constitutes the resin portion and includes the filler A hybrid IC set to a large value is proposed.
[0024]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, Since the total thickness of the solder layer and the land electrode is set to a value larger than the minimum particle size of the filler contained in the resin, the main surface and the electrons are sealed when the resin is sealed during manufacturing. Resin particles having at least a minimum particle diameter can flow into the gap between the parts, and the isolation wall is formed by the resin particles.
[0025]
Claims 4 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, A resist layer having a thickness of L2 provided on a main surface of the printed wiring board and a land electrode having a thickness of L1 for mounting the electronic component, and the thickness of the land electrode and the thickness of the resist layer; The thickness L2 of the resist layer and the thickness of the land electrode so that the value of the difference L3 (= L1−L2) of L2 is larger than the minimum particle size of the filler in the resin constituting the resin portion and including the filler. A hybrid IC in which L1 is set is proposed.
[0026]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, Since the thickness L2 of the resist and the thickness L1 of the land electrode are set so that the value of the difference L3 is larger than the minimum particle size of the filler contained in the resin constituting the resin portion, In the above, at least the resin particles having the minimum particle diameter flow into the gap between the main surface of the printed wiring board and the electronic component to form the isolation wall.
[0027]
Claims 5 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, A resist layer having a thickness L2 provided on the main surface of the printed wiring board in the gap, a land electrode having a thickness L1 for mounting the electronic component, and a thickness L4 provided on the surface of the land electrode. Solder layer, and the value of the gap thickness L5 (= L1 + L4−L2) is larger than the minimum particle size of the filler in the resin constituting the resin part and including the filler. A hybrid IC is proposed in which the thickness, the thickness L2 of the resist layer, and the thickness L4 of the solder layer are set.
[0028]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, At the time of manufacture, at least a resin particle having a minimum particle size flows into a gap between the main surface of the printed wiring board and the electronic component to form the isolation wall.
[0029]
Claims 6 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, A land electrode having a thickness of L1 for mounting the electronic component, and an auxiliary layer having a thickness of L6 provided on a main surface of the printed wiring board in the gap and including at least one of silk printing and a resist layer; And the value of the difference L7 (= L1-L6) between the thickness L1 of the land electrode and the thickness L6 of the auxiliary layer is smaller than the minimum particle diameter of the filler in the resin that constitutes the resin portion and contains the filler. A hybrid IC is proposed in which the land electrode thickness L1 and the auxiliary layer thickness L6 are set so as to be larger.
[0030]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, Since the thickness L1 of the land electrode and the thickness L6 of the auxiliary layer are set so that the value of the thickness L7 is larger than the minimum particle size of the filler contained in the resin constituting the resin portion, At least the resin particle having the minimum particle size flows into the gap between the main surface of the printed wiring board and the electronic component, thereby forming the isolation wall.
[0033]
Claims 7 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, A hybrid IC is proposed in which the height dimension of the isolation wall from the printed wiring board side to the electronic component side is larger than the maximum particle size of the filler in a resin that constitutes the resin part and contains the filler.
[0034]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, At the time of manufacture, resin particles having an arbitrary resin particle diameter flow into the gap to form the isolation wall.
[0035]
Claims 8 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficients of the wiring board and the resin part are almost equal, A hybrid IC is proposed in which the height dimension of the isolation wall from the printed wiring board side to the electronic component side has a value larger than the average particle diameter of the filler in the resin that constitutes the resin portion and contains the filler.
[0036]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, At the time of manufacture, resin particles having an average particle size or less flow into the gap to form the isolation wall.
[0037]
Claims 9 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: the separation wall for isolating the terminal electrode of the electronic component is formed in the gap between the main surface of the printed wiring board and the electronic component by the resin constituting the resin portion; The thermal expansion coefficient of the wiring board and the resin part is almost equal, A hybrid IC is proposed in which the height dimension of the isolation wall from the printed wiring board side to the electronic component side is larger than the minimum particle size of the filler in the resin that constitutes the resin part and contains the filler.
[0038]
According to the hybrid IC, Since the isolation wall is provided in the gap between the main surface of the printed wiring board and the electronic component and each terminal electrode is isolated by the isolation wall, the terminal electrode of the electronic component is subjected to heat from the outside. Even if the solder adhering to the metal melts, short circuit between different terminal electrodes is prevented by the isolation wall. Also, At the time of manufacture, at least resin particles having a minimum particle diameter flow into the gap to form the isolation wall.
[0039]
Claims 10 Then A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In the hybrid IC comprising: a separation wall that isolates the terminal electrode of the electronic component is formed of a resin that constitutes the resin portion, and the thermal expansion coefficient of the printed wiring board and the resin portion is substantially equal, The resin contains a filler, and the average value of the particle diameter of the filler existing in the gap between the main surface of the printed wiring board and the electronic component is the average of the particle diameter of the filler existing outside the gap. A hybrid IC having a value smaller than the value is proposed.
[0040]
According to the hybrid IC, Since the isolation wall is provided between different terminal electrodes of the electronic component and each terminal electrode is isolated by the isolation wall, heat applied from outside melts the solder attached to the terminal electrode of the electronic component Even so, short circuit between different terminal electrodes is prevented by the isolation wall. Also, Since only the resin particles having a small particle diameter among the resin particles constituting the resin portion are present in the gap, the average value of the resin particle diameters of the resin existing in the gap is outside the gap. The value is smaller than the average value of the resin particle diameter of the existing resin.
[0041]
Further, in claim 11, the claims 2 To claim 10 Either The hybrid IC described in 1) proposes a hybrid IC in which the electronic component is a chip-shaped electronic component.
[0042]
According to the hybrid IC, the isolation wall is formed in a gap between a chip-shaped electronic component having a low component mounting height and the main surface of the printed wiring board.
[0043]
Further, in claim 12, claims 2 to 10 are provided. Either In the hybrid IC described above, a hybrid IC is proposed which is a soldered electronic component in which the terminal electrode is soldered and mounted on the land electrode formed on the main surface of the printed wiring board.
[0044]
According to the hybrid IC, the isolation wall is formed in the gap between the soldered electronic component and the main surface of the printed wiring board.
[0045]
Further, in claim 13, the claim 2 To claim 10 Either The hybrid IC described in 1) proposes a hybrid IC in which the electronic component is a surface-mount type electronic component.
[0046]
According to the hybrid IC, the isolation wall is formed in a gap between the surface-mounted electronic component and the main surface of the printed wiring board.
[0047]
Further, in claim 14, the claim 2 To claim 10 Either The hybrid IC described in 1) proposes a hybrid IC in which the electronic component is a leadless electronic component.
[0048]
According to the hybrid IC, the isolation wall is formed in a gap between the leadless electronic component and the main surface of the printed wiring board.
[0051]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0052]
FIG. 1 is an external perspective view showing a hybrid IC according to the first embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line AA in FIG. In the figure, reference numeral 10 denotes a hybrid IC which has a rectangular parallelepiped shape having a predetermined size, for example, a thickness of 1.3 mm, a width of 4.0 mm, and a length of 20.0 mm, and a printed wiring pattern formed on a substrate. On the upper surface of the printed wiring board 11 so as to cover the board 11, the plurality of electronic components 12 (12a to 12j) mounted on the component mounting surface (one main surface: upper surface) of the printed wiring board 11, and the electronic component 12 The resin layer (resin portion) 13 is formed.
[0053]
The printed wiring board 11 is made of, for example, a ceramic substrate having a thickness of 0.4 mm and having a rectangular upper surface. A land electrode 15 for mounting electronic components is formed on the main surface (upper surface in the figure), and five terminals are formed on the lower surface. An electrode 16 is formed. Further, a resist layer 17 is formed on the upper surface of the printed wiring board 11 at portions other than the land electrodes 15.
[0054]
The electronic component 12 (12a to 12j) is an electronic component having a lead terminal electrode or a leadless electronic component and a chip-shaped electronic component not having a lead terminal electrode, a surface-mounted electronic component including an IC, and an electronic having two terminal electrodes. Various types of electronic components including electronic components having three or more terminal electrodes and various types of electronic components may be used.
[0055]
The resin layer 13 is made of, for example, a thermosetting resin or an ultraviolet curable resin having insulation, waterproofness, or heat resistance. Resins having chemical resistance, for example, resins having alkali resistance, acid resistance, and corrosion resistance, such as a resin that prevents chemical change due to leakage of electrolyte used in a battery, may be used. Further, for example, a resin containing a ferrite filler may be used. The printed wiring board 11 is not limited to a ceramic substrate, and may be a glass epoxy substrate, a paper epoxy substrate, a paper phenol substrate, a flexible substrate, or the like.
[0056]
As shown in FIG. 4, each electronic component 12 has a terminal electrode 121 electrically connected to the land electrode 15 by an ultraviolet curable conductive resin 18 and fixed.
[0057]
According to the hybrid IC 10 described above, even when a space (air layer) 19 is formed between the electronic component 12 and the surface of the printed wiring board 21 when the resin layer 13 is formed during manufacturing, the hybrid IC 10 Since the conductive resin 18 is not melted at the time of solder reflow such as when the circuit board is mounted on the parent circuit board, the terminal electrodes 121 of the electronic component 12 are not short-circuited.
[0058]
In addition, the resin layer 13 is provided. Just Since the shape of the hybrid IC 10 is formed in a rectangular parallelepiped, it is possible to easily cope with a packing form corresponding to various parts supply methods such as a tray, taping, or bulk feeder. Furthermore, since the printed wiring board 11 is reinforced by the resin layer 13, the printed wiring board 11 is not bent at the time of inspection.
[0059]
The conductive resin 18 may be other than an ultraviolet curable resin, such as a thermosetting resin, as long as it is a conductive resin that does not remelt due to heat at the time of filling the resin 13 or solder reflow. Good.
[0060]
Next, a method of manufacturing the hybrid IC 10 described above will be described with reference to a process explanatory diagram shown in FIG.
[0061]
First, an aggregate substrate 31 is formed in which printed wiring boards 11 of a plurality of hybrid ICs 10 are connected in a matrix (aggregate substrate manufacturing process). Here, an aggregate substrate 31 in which 12 printed wiring boards 11 are arranged in a 2 × 6 matrix is formed. The collective substrate 31 has a marker region 31a at the peripheral portion thereof, and a mark 31b indicating a cutting position is attached to the marker region 31a. In addition, it may replace with the mark 31 by a display, and may mark by a notch | incision, a recessed part, etc.
[0062]
Next, after mounting the electronic component 12 on the upper surface of the collective substrate 31 (electronic component mounting step), the resin layer 13 is formed on the upper surface side of the collective substrate 31 (resin layer forming step).
[0063]
As shown in FIG. 6, the resin layer 13 is formed by placing the collective substrate 31 on a base 41 on which the collective substrate 31 on which the electronic component 12 is mounted can be placed in a horizontal state, The frame member 42 is fixed so as to overlap the peripheral portion of the marker region 31a so as to hide 31b. Next, the above-described resin 43 is poured into the upper surface side of the collective substrate 31. Next, after the resin 43 is cured, the frame member 42 is removed, and then the collective substrate 31 is removed from the base 41, and the resin layer forming step is completed.
[0064]
Next, the collective substrate 31 on which the resin layer 13 is formed is cut using a dicing apparatus. At this time, as shown in FIG. 7, the cutting position is determined using the mark 31b attached to the marker region 31a of the collective substrate 31 as a mark, and the dicing device 44 is positioned. As a result, the collective substrate 31 is cut in a matrix along the boundary lines between the individual printed wiring boards 11 to obtain the hybrid IC 10 (separation process). Thus, when it cut | disconnects using a dicing apparatus, a cut surface will become a very smooth surface and shaping, such as a deburring, can be performed simultaneously. Furthermore, since the resin layer 13 is waterproof, it is possible to use a wet cutting method.
[0065]
According to the manufacturing method of the first embodiment described above, the resin layer 13 can be formed in the state of the collective substrate 31 and the shaping of the deburring and the like can be performed simultaneously with the separation of the collective substrate 31, so that the collective substrate is not used. In addition, the number of processes is reduced as compared with the case of manufacturing using individual printed wiring boards. Furthermore, when the surface is cut by the dicing device, the surface of the hybrid IC 10 is smooth, so that the display ink is less likely to permeate and a character display without fading can be formed on the surface of the hybrid IC 10.
[0066]
Moreover, since a metal casing is not required unlike the conventional example, the shape can be reduced and the cost can be reduced.
[0067]
In this embodiment, the resin layer 13 is formed using a transparent resin. However, when the electronic component 12 in the sealing resin and its arrangement need not be visible from the outside, a colored resin is used. Also good.
[0068]
Further, by forming a metal layer by applying and curing a resin in which a metal filler is dispersed on the upper surface of the resin layer 13, an electromagnetic field shielding effect can be provided, and EMC (Electro-Magnetic Compatibility) measures are taken. Can be effective.
[0069]
Moreover, when using it on comparatively high temperature conditions, it is preferable to use the thing of a material with a substantially equal coefficient of thermal expansion as resin of the printed wiring board 11 and the resin layer 13. FIG. Moreover, in order to improve the heat dissipation from the electronic component 12, it is preferable to form the resin layer 13 using resin with high thermal conductivity, for example, epoxy resin.
[0070]
In the present embodiment, the function of the hybrid IC 10 is not particularly limited, but the present invention can be applied to various hybrid ICs. For example, the present invention can be applied to a hybrid IC such as a high frequency power amplifier, an electronic volume, a DC / DC converter, an FET switch, a low power telemeter, a keyless transmitter, an inverter, and a battery protection circuit.
[0071]
Moreover, although the dicing apparatus is used for cutting the collective substrate 31, the present invention is not limited to this, and the collective substrate may be cut into each printed wiring board with a laser, water, a wire, or the like. In this case, the substrate shape can be flexibly shaped such as a round shape, a triangular shape, or other polygonal shapes. Furthermore, the shape of the resin layer 13 can be changed by changing the arrangement of the printed wiring boards 11 on the collective substrate 31 and the method of forming the resin layer 13. An example of this will be described below as a second embodiment with reference to FIGS.
[0072]
FIG. 8 is an external perspective view showing the hybrid IC 10B in the second embodiment, FIG. 9 is an external perspective view showing the collective substrate 32 in the second embodiment, and FIG. 10 is a diagram for explaining a resin layer forming step in the second embodiment. FIG. 11 is a cross-sectional view in the direction of arrows BB in FIG. 10, FIG. 12 is a diagram for explaining a separation process in the second embodiment, and FIGS. 13 and 14 are examples of use of the hybrid IC 10B in the second embodiment. FIG. In the figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
[0073]
The hybrid IC 10B according to the second embodiment is the same as the hybrid IC 10 according to the first embodiment except for the shape of the resin layer 13. In the hybrid IC 10B of the second embodiment, the resin layer 13 has a bowl shape as shown in FIG. When the resin layer 13 is formed in a bowl shape as described above, for example, as shown in FIG. 2 A mark 32b indicating a cutting position is attached to a, and a collective substrate 32 provided with a buffer region 32c in the width direction of each printed wiring board 11 is used. Further, at the time of manufacturing, as shown in FIGS. 10 to 12, after the collective substrate 32 on which the electronic components 12 are mounted is placed on the base 41, the frame member 42 is fixed to each marker region 32a and buffer region 32c. Then, a predetermined amount of resin 43 is poured. Next, after the resin 43 is cured and the frame member 42 is removed, the collective substrate 31 is removed from the base 41, and the collective substrate 32 on which the resin layer 13 is formed is cut using the dicing device 44. When the resin 43 is poured, the cross section of the resin 43 poured into a bowl shape as shown in FIG. 11 due to the surface tension of the resin 43. In addition, since both ends in the longitudinal direction of the printed wiring board 11 are also cut when cutting with the dicing device 44 in the separation step, a bowl-shaped hybrid IC 10B is obtained.
[0074]
Such a saddle-shaped hybrid IC 10B can be used by being easily fitted into the connector 50 as shown in FIGS. 13 and 14, for example.
[0075]
The connector 50 has an opening 51 that fits in the width direction of the hybrid IC 10B. A protrusion 52 for preventing the drop-off is provided on the inner surface on which the resin layer 13 abuts when the hybrid IC 10B is fitted. A bent electrode 53 having spring elasticity corresponding to each terminal electrode 16 is provided on the inner side surface facing 16.
[0076]
Since the shape of the hybrid IC 10B can be changed by changing the shape of the resin layer 13 in this way, it can be easily attached to and detached from the connector 50.
[0077]
Next, a third embodiment of the present invention will be described.
[0078]
FIG. 15 is a side sectional view showing the main part of the hybrid IC 10C in the third embodiment, and FIG. 16 is an enlarged view showing the main part in FIG. The appearance of the hybrid IC 10C in the third embodiment is the same as the hybrid IC 10 in the first embodiment shown in FIG. 1 or the hybrid IC 10B in the second embodiment shown in FIG. In the figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. Further, the difference between the third embodiment and the first or second embodiment is that the thickness L1 of the land electrode 15 formed on the main surface of the printed wiring board 11 is made larger than that of the first embodiment to make the electronic component 12 different. And the thickness of the gap 61 between the printed wiring board 11 (the surface of the resist layer 17) is set to a value larger than the minimum particle diameter of the resin particles forming the resin layer 13, and the terminal electrode 121 of the electronic component 12 That is, the same solder 62 as in the conventional example is used for the conductive connection between the land electrode 15 and the resin layer 13 is formed by vacuum printing.
[0079]
That is, in the third embodiment, a resin having an average particle diameter of 25 μm is used as a resin for forming the resin layer 13, and as shown in FIG. 15, the thickness L 1 of the land electrode 15, the thickness L 2 of the resist layer 17, The relationship of the thickness L3 of the gap 61 between the electronic component 12 and the printed wiring board 11 (the surface of the resist layer 17) is L3 = L1-L2, and the thickness L3 of the gap 61 is the resin particle forming the resin layer 13. It was set larger than the minimum particle size. Needless to say, the interval between the land electrodes 15 is set larger than the minimum particle diameter of the resin particles.
[0080]
Accordingly, at least resin particles having a minimum particle diameter can be caused to flow into the gap 61 between the electronic component 12 and the printed wiring board 11 in the resin layer forming process at the time of manufacture. In the completed hybrid IC 10C, the electronic component 12 and A height dimension larger than the minimum particle diameter and equal to the thickness L3 of the gap 61 is formed between the different terminal electrodes 121 of the electronic component 12 (12a to 12j) by the resin constituting the resin layer 13 with the printed wiring board 11. The isolation wall 13a which has can be formed. Since the isolation wall 13a is in close contact with the electronic component 12 and the resist layer 17 in the gap 61, each terminal electrode 121 is isolated by the isolation wall 13a.
[0081]
In addition, a resin adheres to the solder attached to the terminal electrodes of the electronic component 12 (12a to 12j), and the solder is surrounded by the resin. Further, the side and upper surfaces of the electronic component 12 (12a to 12j) are made of resin. The resin constituting the layer 13 is in close contact.
[0082]
Therefore, in the hybrid IC 10C of the third embodiment, even if the solder 62 is remelted during the solder reflow, the isolation wall 13a is formed by the resin filled between the adjacent terminal electrodes 121 of the electronic component 12. A short circuit between the terminal electrodes 121 of the electronic component 12 can be prevented.
[0083]
In the hybrid IC 10 </ b> C described above, the average particle size of the resin particles present in the gap 61 is smaller than the average particle size of the resin particles existing outside the gap 61.
[0084]
The thickness L3 of the gap 61 may be set larger than the average particle diameter of the resin particles constituting the resin layer 13. As described above, by setting the thickness L3 of the gap 61 to be larger than the average particle diameter of the resin particles, resin particles having an average particle diameter or less flow into the gap 61 when the resin layer is formed, and the height dimension is the average value. An isolation wall 13a larger than the particle size is formed. Further, if the thickness of the gap is set to be larger than the maximum particle diameter of the resin particles, an arbitrary resin particle flows into the gap 61 at the time of forming the resin layer, and the separating wall 13a whose height dimension is larger than the maximum particle diameter. Is formed.
[0085]
When an auxiliary layer including a resist layer or silk printing is formed in the gap 61, the difference L7 between the land electrode thickness L1 and the auxiliary layer thickness L6 is larger than the minimum particle size of the resin particles. The same effect can be obtained by setting the thickness L1 of the land electrode and the thickness L6 of the auxiliary layer.
[0086]
Next, a method of manufacturing the hybrid IC 10C described above will be described with reference to a process explanatory diagram shown in FIG.
[0087]
First, an aggregate substrate 33 in which the printed wiring boards 11 of a plurality of hybrid ICs 10C are connected in a matrix is formed (aggregate substrate manufacturing process). Here, an aggregate substrate 33 in which 12 printed wiring boards 11 are arranged in a 2 × 6 matrix is formed. Further, the collective substrate 33 of the present embodiment has a configuration in which the marker region 31a is removed from the collective substrate 31 of the first embodiment.
[0088]
Next, after mounting the electronic component 12 on the upper surface of the collective substrate 33 (electronic component mounting step), the resin layer 13 is formed on the upper surface side of the collective substrate 33 using a vacuum printing method (resin layer forming step). When the electronic components 12 are mounted on the collective substrate 33, it is preferable to perform a baking process on these to remove moisture (humidity). If soldering is performed without removing moisture, an unexpected short circuit accident will occur. That is, when soldering is performed in a state of moisture absorption, there is no escape of force due to moisture expanded by heat during soldering, and a phenomenon generally called a popcorn phenomenon occurs, and a crack is generated in the substrate. In many cases, solder flows into the cracks and short circuits.
[0089]
As shown in FIG. 18, the resin layer 13 is formed by the vacuum printing method, as shown in FIG. 18, the collective substrate 33 is mounted on a frame member 42 in which the collective substrate 33 can be fitted in a horizontal state, and placed on the base 41. 2 Torr (= 266.644 Pa) vacuum and desorption foam (Preparation process). Next, the resin 43 described above is printed on the upper surface side of the collective substrate 33 to supply the resin (first printing step). In this state, a bubble-like space is often formed around the electronic component 12 on the collective substrate 33.
[0090]
Thereafter, the degree of vacuum is raised to, for example, about 150 Torr to generate a differential pressure, and the resin 43 is filled in the space around the electronic component 12 (resin filling step). As a result, a depression occurs on the surface of the resin 43, and the resin 43 is printed again in a non-vacuum state in which the degree of vacuum is released in order to fill the resin 43 in the depression (second printing step).
[0091]
Next, after the resin 43 is cured, the collective substrate 33 is removed from the base 41 and the frame member 42, and the resin layer forming step is completed.
[0092]
Before forming the resin layer 13, it is preferable to sufficiently remove the flux adhering to the surface of the collective substrate 33 and the surface of the electronic component 12. If the resin layer 13 is formed while the flux is adhered to the surface of the collective substrate 31 and the surface of the electronic component 12, the adhesive strength of the resin to the surface of the collective substrate 33 and the surface of the electronic component 12 decreases.
[0093]
Next, the collective substrate 33 on which the resin layer 13 is formed is cut using a dicing apparatus. At this time, the hybrid IC 10C is obtained by cutting in a matrix along the boundary line between the individual printed wiring boards 11 (separation step).
[0094]
According to the manufacturing method of the third embodiment described above, since the collective substrate 33 in which a plurality of printed wiring boards are arranged in a matrix and does not have a marker region is used, the substrate as in the first and second embodiments. Material waste can be greatly reduced.
[0095]
Furthermore, since the resin layer 13 can be formed in the state of the collective substrate 33 and the collective substrate 33 can be separated and shaping such as deburring can be performed simultaneously, it is manufactured using individual printed wiring boards without using the collective substrate. Compared to the case, the number of processes is reduced. In addition, when the resin layer 13 is formed using a transfer molding technique that is well known as a resin sealing technique, a mold is necessary, a press is required, burrs appear on the sealed one, and there is air entrainment and sealing. However, there is a drawback that voids (bubbles) are likely to enter, but all of these can be eliminated by using the vacuum printing method.
[0096]
Furthermore, since the resin layer 13 is formed by the vacuum printing method, the resin layer 13 can be formed without forming a gap around the electronic component 12, and the durability of the hybrid IC 10C can be improved.
[0097]
In the hybrid IC 10C, since the resin layer 13 is formed by a vacuum printing method, the surface of the resin layer 13 can be formed flat, so that it can be easily adsorbed by an automatic mounting machine and can be easily mounted at high density. .
[0098]
Next, a fourth embodiment of the present invention will be described.
[0099]
19 is a side cross-sectional view showing the main part of the hybrid IC 10D in the fourth embodiment, FIG. 20 is a plan view showing the main part of the printed wiring board of the hybrid IC 10D in the fourth embodiment, and FIG. 21 shows the main part in FIG. It is an enlarged view shown. The external appearance and main configuration of the hybrid IC 10D in the fourth embodiment are the same as those of the hybrid IC 10 of the first embodiment shown in FIG. 1 or the hybrid IC 10B of the second embodiment shown in FIG. It expresses with.
[0010]
The difference between the fourth embodiment and the first or second embodiment is that the gap between the main surface of the printed wiring board 11 and the electronic component 12 (12a to 12j) extends to the periphery of the electronic component 12. A resist intangible region 63 in which the resist layer 17 is not formed is provided on the main surface of the printed wiring board 11 and the thickness L1 of the land electrode 15 is set to be larger than the minimum particle size of the resin forming the resin layer 13. Further, the same solder 62 as in the conventional example is used for conductive connection between the terminal electrode 121 of the electronic component 12 and the land electrode 15. In this case, the thickness L2 of the resist layer 17 may be arbitrarily set. Here, it goes without saying that the interval between the land electrodes 15 is set larger than the minimum particle diameter of the resin particles.
[00101]
With the above configuration, at least resin particles having a minimum particle diameter can be caused to flow into the gap 64 between the electronic component 12 and the printed wiring board 11 in the resin layer forming process at the time of manufacture. In the completed hybrid IC 10D, the electronic component 12 And the printed wiring board 11 can form the isolation wall 13a with the resin.
[00102]
Therefore, in the hybrid IC 10D of the fourth embodiment, even if the solder 62 is remelted during the solder reflow, the isolation wall 13a is formed by the resin that flows between the adjacent terminal electrodes 121 of the electronic component 12. A short circuit between the terminal electrodes 121 of the component 12 can be prevented.
[00103]
In the hybrid IC 10D of the fourth embodiment, the height of the electronic component 12 mounted on the printed wiring board 11 can be reduced by the thickness of the resist layer 17 according to the hybrid IC 10C of the third embodiment described above. .
[00104]
In addition, as the formation method of the resin layer 13, you may use either the formation method in 1st Embodiment or 2nd Embodiment.
[00105]
Next, a fifth embodiment of the present invention will be described.
[00106]
FIG. 22 is a side sectional view showing the main part of the hybrid IC 10E in the fifth embodiment, and FIG. 23 is a plan view showing the main part of the printed wiring board of the hybrid IC 10E in the fifth embodiment. The external appearance and main configuration of the hybrid IC 10E in the fifth embodiment are the same as those of the hybrid IC 10 of the first embodiment shown in FIG. 1 or the hybrid IC 10B of the second embodiment shown in FIG. It expresses with.
[0107]
The difference between the fifth embodiment and the first or second embodiment is that the gap between the main surface of the printed wiring board 11 and the electronic component 12 (12a to 12j) extends to the periphery of the electronic component 12. A resist intangible region 63 where the resist layer 17 is not formed is provided on the main surface of the printed wiring board 11 and the land electrode 15 has a thickness L. 1 Is set to a value more than twice the particle size of the resin forming the resin layer 13, and the solder 62 similar to the conventional example is used for the conductive connection between the terminal electrode 121 of the electronic component 12 and the land electrode 15. It is.
[00108]
Further, the difference between the fifth embodiment and the above-described fourth embodiment is that the resist layer 17 is provided only in a predetermined region around the land electrode 15 in the gap between the main surface of the printed wiring board 11 and the electronic component 12. It is provided. Here, it goes without saying that the width of the non-resist forming region 63 between the land electrodes 15 is set to a value larger than the minimum particle size of the resin particles.
[00109]
With the above configuration, the thickness of the gap 64 in the resist non-formation region 63 between the electronic component 12 and the printed wiring board 11 is the same as the thickness L 1 of the land electrode 15. Thereby, in the resin layer formation process at the time of manufacture, the resin particles having at least the minimum particle diameter can be caused to flow into the gap 64 in the resist non-formation region 63 between the electronic component 12 and the printed wiring board 11, and the completed hybrid IC 10E is obtained. In FIG. 2, an isolation wall 13a is formed between the electronic component 12 and the printed wiring board 11 by resin particles having a minimum particle size.
[00110]
Therefore, in the hybrid IC 10E of the fifth embodiment, the separation wall 13a having a height dimension equal to the land electrode thickness L1 between the adjacent terminal electrodes 121 of the electronic component 12 even if the solder 62 is remelted during solder reflow. Therefore, short circuit between the terminal electrodes 121 of the electronic component 12 can be prevented.
[00111]
In addition, as the formation method of the resin layer 13, you may use either the formation method in 1st Embodiment or 2nd Embodiment.
[00112]
Next, a sixth embodiment of the present invention will be described.
[00113]
FIG. 24 is a side sectional view showing the main part of the hybrid IC 10F in the sixth embodiment, and FIG. 25 is a plan view showing the main part of the printed wiring board of the hybrid IC 10F in the sixth embodiment. The external appearance and main configuration of the hybrid IC 10F in the sixth embodiment are the same as the hybrid IC 10 of the first embodiment shown in FIG. 1 or the hybrid IC 10B of the second embodiment shown in FIG. It expresses with.
[00114]
The difference between the sixth embodiment and the first embodiment or the second embodiment is that the gap between the main surface of the printed wiring board 11 and the electronic component 12 (12a to 12j) extends to the periphery of the electronic component 12. A resist intangible region 63 where the resist layer 17 is not formed is provided on the main surface of the printed wiring board 11 and the thickness L1 of the land electrode 15 is set to a value larger than at least the minimum particle diameter of the resin particles forming the resin layer 13. In addition, the solder 62 similar to the conventional example is used for the conductive connection between the terminal electrode 121 of the electronic component 12 and the land electrode 15.
[00115]
Further, the difference between the sixth embodiment and the above-described fourth embodiment is that the resist layer 17 is provided only at the central portion between the land electrodes 15 facing each other between the main surface of the printed wiring board 11 and the electronic component 12. It is to have established. Here, two resist non-formation regions 63 are formed between the opposing land electrodes 15. Needless to say, the width of each resist non-formation region 63 is set to a value larger than the minimum particle size of the resin particles.
[00116]
With the above configuration, the thickness of the gap 64 in the resist non-formation region 63 between the electronic component 12 and the printed wiring board 11 is the same as the thickness L 1 of the land electrode 15. Thereby, in the resin layer formation process at the time of manufacture, the gap 64 in the resist non-formation region 63 between the electronic component 12 and the printed wiring board 11 can be filled with the resin particles having the minimum particle diameter. In the completed hybrid IC 10E An isolation wall 13 a having a height dimension equal to the thickness L 1 of the land electrode 15 is formed in the resist non-formation region 63 between the electronic component 12 and the printed wiring board 11.
[00117]
Accordingly, in the hybrid IC 10E of the fifth embodiment, even if the solder 62 is remelted at the time of solder reflow, the isolation wall 13a is formed between the adjacent terminal electrodes 121 of the electronic component 12, so that the terminal of the electronic component 12 A short circuit between the electrodes 121 can be prevented.
[00118]
In addition, as the formation method of the resin layer 13, you may use either the formation method in 1st Embodiment or 2nd Embodiment.
[00119]
Next, a seventh embodiment of the present invention will be described.
[00120]
FIG. 26 is a side sectional view showing the main part of the hybrid IC 10G in the seventh embodiment, and FIG. 27 is an enlarged view showing the main part in FIG. The external view of the hybrid IC 10G in the seventh embodiment is the same as the hybrid IC 10 of the first embodiment shown in FIG. 1 or the hybrid IC 10B of the second embodiment shown in FIG. .
[0121]
The difference between the seventh embodiment and the first and second embodiments is that the thickness L is formed on the land electrode 15. 4 The solder layer 65 is provided, and the terminal electrode 121 of the electronic component 12 is soldered on the solder layer 65. Thereby, the thickness L5 of the gap between the electronic component 12 and the printed wiring board 11 (the surface of the resist layer 17) was set to a value larger than the minimum particle diameter of the resin particles forming the resin layer 13.
[00122]
With the above configuration, since the thickness L5 of the gap 64 between the electronic component 12 and the printed wiring board 11 is set to a value larger than the minimum particle diameter of the resin particles forming the resin layer 13, the resin layer at the time of manufacture In the forming step, the gap 64 between the electronic component 12 and the printed wiring board 11 can be filled with resin particles having at least a minimum particle diameter. In the completed hybrid IC 10G, the gap between the electronic component 12 and the printed wiring board 11 can be reduced. An isolation wall 13a in close contact with the resist layer 17 and the electronic component 12 (12a to 12j) is formed. Accordingly, in the hybrid IC 10G of the seventh embodiment, even if the solder 62 is remelted at the time of solder reflow, the isolation wall 13a is formed between the adjacent terminal electrodes 121 of the electronic component 12, so that the terminal of the electronic component 12 A short circuit between the electrodes 121 can be prevented. As the formation method of the resin layer 13, either the formation method in the first embodiment or the second embodiment may be used.
[00123]
In addition, the said 1st thru | or 7th embodiment is one specific example of this invention, Comprising: This invention is not limited only to these structures. For example, a mask 71 as shown in FIGS. 28 and 29 may be used in place of the frame member 42 in the resin layer forming process using the vacuum printing method. The mask 71 shown in the drawing has a tray shape, and has an opening 71a having an area corresponding to the collective substrate 31 at the center of the bottom surface, and a holding region 71b of the resin 43 is provided around the opening 71a. Further, a shielding wall 71c is provided below the opening 71a so as to surround the opening 71a. When forming the resin layer on the collective substrate 31, as shown in FIG. 29, after placing the collective substrate 31 on which electronic components are mounted on the base 41, the bottom surface of the mask 71 is formed on the collective substrate 31. The resin 43 is fixed according to the height of the target resin layer, and the squeegee 72 moves the resin 43 over the entire surface of the opening 71a to flow into the opening 71a. By using the mask 71 described above, the height of the resin layer 13 can be easily changed simply by changing the height of the shielding wall 71c.
[00124]
In addition, by setting the height of the land electrode and the height and position of the resist layer in the same way as the third to seventh embodiments with respect to the first and second embodiments, the printed wiring board and the electronic component are manufactured at the time of manufacture. The gap can be filled with resin, or the resin can be introduced to form an isolation wall in at least a part of the gap.
[00125]
In the third to seventh embodiments, the isolation wall is formed by allowing the resin to flow into the entire gap between the printed wiring board and the electronic component. However, the isolation wall may be formed in a part of the gap. Needless to say, similar effects can be obtained.
[0126]
【The invention's effect】
As described above, claim 1 of the present invention. In The described hybrid IC Implementation body According to the above, when solder reflow is performed between the land electrode for mounting electronic components and the terminal electrode of the electronic component on the parent circuit board Have Because it is conductively connected by a conductive resin having a melting point higher than that of solder , Ha Since the conductive resin does not melt even if heat is applied to the electronic component or printed wiring board when solder reflow processing is performed such as when mounting an hybrid IC on a parent printed wiring board, the terminal electrode of the electronic component There is no short circuit.
[0127]
Claims 2 to 14 According to the hybrid IC described in the above, at least the resin particles having at least the smallest particle size among the resin particles forming the resin portion can be caused to flow into the gap between the main surface of the printed wiring board and the electronic component during manufacturing. Therefore, it is possible to easily form an isolation wall that separates the terminal electrodes of the electronic component in the gap between the main surface and the electronic component when sealing with resin, and prevents a short circuit between the terminal electrodes. be able to.
[Brief description of the drawings]
FIG. 1 is an external perspective view showing a hybrid IC according to a first embodiment of the present invention.
FIG. 2 is a side sectional view showing a configuration of a conventional hybrid IC.
FIG. 3 is a diagram for explaining problems in a conventional hybrid IC;
4 is a cross-sectional view taken along line AA in FIG.
FIG. 5 is a process explanatory diagram illustrating a method of manufacturing a hybrid IC in the first embodiment of the present invention.
FIG. 6 is a view for explaining a resin layer forming step in the first embodiment of the present invention.
FIG. 7 is a view for explaining a separation step in the first embodiment of the present invention.
FIG. 8 is an external perspective view showing a hybrid IC in a second embodiment of the present invention.
FIG. 9 is an external perspective view showing a collective substrate in a second embodiment of the present invention.
FIG. 10 is a view for explaining a resin layer forming step in the second embodiment of the present invention.
11 is a cross-sectional view taken along the line BB in FIG.
FIG. 12 is a view for explaining a separation step in the second embodiment of the present invention.
FIG. 13 is a diagram illustrating an example of use of a hybrid IC in the second embodiment of the present invention.
FIG. 14 is a diagram for explaining a usage example of a hybrid IC in the second embodiment of the invention;
FIG. 15 is a side sectional view showing a main part of a hybrid IC according to a third embodiment of the invention.
16 is an enlarged view showing a main part in FIG.
FIG. 17 is a process explanatory diagram illustrating a method of manufacturing a hybrid IC in a third embodiment of the present invention.
FIG. 18 is a diagram illustrating a resin layer forming step in the third embodiment of the present invention.
FIG. 19 is a side sectional view showing a main part of a hybrid IC according to a fourth embodiment of the invention.
FIG. 20 is a plan view showing a main part of a printed wiring board of a hybrid IC according to a fourth embodiment of the present invention.
FIG. 21 is an enlarged view showing the main part in FIG. 19;
FIG. 22 is a side sectional view showing a main part of a hybrid IC according to a fifth embodiment of the invention.
FIG. 23 is a plan view showing the main part of the printed wiring board of the hybrid IC in the fifth embodiment of the invention.
FIG. 24 is a side sectional view showing a main part of a hybrid IC according to a sixth embodiment of the present invention.
FIG. 25 is a plan view showing the main part of the printed wiring board of the hybrid IC in the sixth embodiment of the present invention.
FIG. 26 is a side sectional view showing the main part of a hybrid IC in a seventh embodiment of the invention.
FIG. 27 is an enlarged view showing the main part in FIG.
FIG. 28 is a diagram for explaining another resin layer forming method according to the present invention.
FIG. 29 is a diagram for explaining another resin layer forming method according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10,10B-10G ... Hybrid IC, 11 ... Printed wiring board, 12, 12a-12j ... Electronic component, 121 ... Terminal electrode, 13 ... Resin layer, 15 ... Land electrode, 16 ... Terminal electrode, 17 ... Resist layer, 18 ... conductive resin, 19 ... space (air layer), 31, 32, 33 ... collective substrate, 31a, 32a ... marker area, 31b, 32b ... mark, 32c ... buffer area, 41 ... base, 42 ... frame member, DESCRIPTION OF SYMBOLS 43 ... Resin, 44 ... Dicing apparatus, 50 ... Connector, 51 ... Opening part, 52 ... Projection, 53 ... Bending electrode, 61, 64 ... Gap, 62 ... Solder, 63 ... Resist intangible area, 65 ... Solder layer, 71 ... Mask, 71a ... Opening, 71b ... Holding area, 72 ... Squeegee.

Claims (14)

A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside in the hybrid IC mounting body mounted to the circuit board by solder reflow hybrid IC which Ru with bets,
The land electrode for mounting the electronic component formed on the printed wiring board and the terminal electrode of the electronic component are conductively connected by a conductive resin having a melting point higher than the melting point of the solder used during the solder reflow. A hybrid IC mounting body characterized by having A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
The thickness of the land electrode for mounting the electronic component formed on the printed wiring board is set to a predetermined value larger than the minimum particle size of the filler in the resin including at least the resin portion and containing the filler, the electronic component characteristics and to Ruha hybrid IC that is mounted on. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
A terminal electrode of the electronic component is mounted on a land electrode for mounting the electronic component formed on the printed wiring board, and a land electrode for mounting the electronic component formed on the printed wiring board. And a solder layer between the terminal electrode of the electronic component and the sum of the thickness of the solder layer and the land electrode is smaller than the minimum particle size of the filler in the resin that constitutes the resin portion and includes the filler It features and to Ruha hybrid IC that it is set to a large value. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
A resist layer having a thickness of L2 provided on a main surface of the printed wiring board in the gap, and a land electrode having a thickness of L1 for mounting the electronic component; The thickness L2 of the resist layer so that the value of the difference L3 (= L1−L2) from the thickness L2 of the resist layer is larger than the minimum particle diameter of the filler in the resin constituting the resin part and including the filler. features and to Ruha hybrid IC that thickness L1 of the land electrodes is set. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
A resist layer having a thickness L2 provided on the main surface of the printed wiring board in the gap, a land electrode having a thickness L1 for mounting the electronic component, and a thickness L4 provided on the surface of the land electrode. Solder layer, and the value of the gap thickness L5 (= L1 + L4−L2) is larger than the minimum particle size of the filler in the resin constituting the resin part and including the filler. features and to Ruha hybrid IC that the thickness L1 of the resist layer thickness L2 and the solder layer having a thickness of L4 is set. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
A land electrode having a thickness of L1 for mounting the electronic component, and an auxiliary layer having a thickness of L6 provided on a main surface of the printed wiring board in the gap and including at least one of silk printing and a resist layer; And the value of the difference L7 (= L1-L6) between the thickness L1 of the land electrode and the thickness L6 of the auxiliary layer is smaller than the minimum particle diameter of the filler in the resin that constitutes the resin portion and contains the filler. the features and to Ruha hybrid IC that thickness L6 of the land electrodes and the thickness L1 the auxiliary layer is set to be larger. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
It said partition wall of the printing height from the wiring board side to the electronic component side constitutes the resin portion, wherein the to Ruha to have a value larger than the maximum particle size of the filler in the resin containing the filler Hybrid IC. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
It said partition wall of the printing height from the wiring board side to the electronic component side constitutes the resin portion, wherein the to Ruha to have a value greater than the average particle size of the filler in the resin containing the filler Hybrid IC. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall for isolating the terminal electrode of the electronic component is formed in a gap between the main surface of the printed wiring board and the electronic component by a resin constituting the resin portion, and heat of the printed wiring board and the resin portion is formed. Expansion rate is almost equal,
It said partition wall of the printing height from the wiring board side to the electronic component side constitutes the resin portion, wherein the to Ruha to have a value greater than the minimum particle size of the filler in the resin containing the filler Hybrid IC. A printed wiring board, an electronic component mounted on the main surface of the printed wiring board, a resin portion formed on the main surface of the printed wiring board so as to seal the electronic component, and a terminal electrode exposed to the outside In a hybrid IC equipped with
An isolation wall that separates the terminal electrodes of the electronic component is formed of a resin that constitutes the resin portion, and the thermal expansion coefficient of the printed wiring board and the resin portion is substantially equal.
The resin contains a filler, and the average value of the particle diameter of the filler existing in the gap between the main surface of the printed wiring board and the electronic component is the average of the particle diameter of the filler existing outside the gap. It features and to Ruha hybrid IC that is smaller than the value. The electronic component is a hybrid IC according to any one of claims 2 to 10, characterized in that a chip-like electronic components. The electronic component is any of claims 2 to 10, characterized in that the land electrode formed on the main surface of the printed wiring board is soldered electronic component to be mounted terminal electrodes soldered to the hybrid IC according to any. The electronic component is a hybrid IC according to any one of claims 2 to 10 characterized in that it is a surface mount electronic component. The electronic component is a hybrid IC according to any one of claims 2 to 10 characterized in that it is a leadless electronic component.

Images