JP3740489B2 - Glass envelope - Google Patents

Description

  The present invention relates to a glass envelope in which a plurality of glass members are sealed with a sealing material and the inside is configured in a reduced pressure state in a thin image display device applied to a color television or a computer terminal.

  Conventionally, when manufacturing a glass envelope having a space inside, a frit glass as a sealing material is applied or placed between glass members and put in a sealing means such as an electric furnace, or Put on a hot plate heater (may be sandwiched between hot plate heaters from above and below), heat the entire glass envelope to the sealing temperature, and seal the sealed part between the glass members with molten frit glass .

  In particular, when this glass envelope is used as a vacuum container of an image display device, conventionally, an electron-emitting device is used in the glass envelope. The electron-emitting devices are roughly classified into two types: a thermionic emission device and a cold cathode electron-emitting device. Cold cathode electron-emitting devices include field emission type (hereinafter referred to as “FE type”), metal / insulating layer / metal type (hereinafter referred to as “MIM type”), surface conduction electron-emitting device, and the like. is there. As examples of the FE type, those disclosed in the following Non-Patent Document 1 or Non-Patent Document 2 are known.

  As an example of the MIM type, one disclosed in Non-Patent Document 3 below is known.

Examples of the surface conduction electron-emitting device type are disclosed in Non-Patent Document 4 below. This surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current is passed through a small-area thin film formed on a substrate in parallel to the film surface. As this surface conduction electron-emitting device, a device using an SnO ₂ thin film by Erinson et al. In the following Non-Patent Document 4, a device using an Au thin film (the following Non-Patent Document 5), a device using an In ₂ O ₃ / SnO ₂ thin film ( The following non-patent document 6) and those using carbon thin films (the following non-patent document 7) have been reported.

  Development of flat panel image display devices that emit phosphors with an electron beam generated from these cold cathode electron-emitting devices has been underway. The surface conduction electron-emitting device emits electrons by passing a current through a conductive thin film partially having a high resistance portion. For example, the following Patent Document 1 already filed by the present applicant has been filed. Are disclosed in the publication.

In an image display device using electrons, a face envelope, a rear plate, and an outer frame are sealed with a sealant, and the inside is decompressed to form a glass envelope. An electron source that generates electrons, a driving circuit for the electron source, an image forming member having a phosphor that emits light by collision of electrons, an acceleration electrode for accelerating electrons toward the image forming member, and a high-voltage power source thereof Etc. need to be configured.
JP 7-235255 A W. P. Dyke & W. W. Dolan, “Field emission”, Advance in Electron Physics, 8, 89 (1956). C. A. Spindt, “PHYSICAL Properties of Thin-Film Field Emission Catalysts with Mollybdenium Cones”, J. Am. Appl. Phys. , 47, 5248 (1976) C. A. Mead, “Operation of Tunnel-Emission Devices”, J. Am. Appl. Phys. , 32, 646 (1961) M.M. I. Elinson, Radio Eng. Electron Phys. , 10, 1290, (1965) G. Dittmer: “Thin Solid Films”, 9, 317 (1972) M.M. Hartwell and C.H. G. Fonstad: “IEEE Trans. ED Conf.” 519 (1975) Hisashi Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (1983)

  However, the conventional glass envelope has the following problems.

  As described above, when manufacturing a glass envelope, a frit glass as a sealing material is applied or placed between glass members and placed in a sealing means such as an electric furnace, or a hot plate heater. (It may be sandwiched by a hot plate heater from above and below), and the entire glass envelope, including the part other than the sealing part, is heated to the sealing temperature. The method of sealing through glass is taken. For this reason, there has been a problem of using energy such as excess electric power for heating other than the sealing portion. In addition, there is a problem that it takes time to raise the entire glass envelope to the sealing temperature and to cool it to room temperature.

  The present invention has been made on the basis of the above circumstances, and glass that realizes sealing between glass members with a smaller amount of energy without heating the entire glass envelope to the sealing temperature as in the prior art. The purpose is to provide an envelope.

In order to achieve the above object, in the present invention, a glass envelope configured by sealing a plurality of glass members using a sealing material so that a sealing portion is square,
A heater is provided between the sealing material and the glass member, and the glass member includes a square-shaped face plate and a rear plate, and the square corners of the face plate and the rear plate are rounded or cut off. It is characterized by having a shape .

Further, in the present invention, a glass envelope configured by sealing a plurality of glass members using a sealing material so that a sealing portion is square,
A heater is provided between the sealing material and the glass member, and the glass member includes a rectangular glass outer frame, and a rectangular corner portion of the glass outer frame has a rounded shape or a cut shape. It is characterized by having .

Thus, a heater is provided between the sealing material and the glass member, and the square corners of the glass face plate and the glass rear plate have a rounded shape or a cut-off shape , or the glass. The square corner of the outer frame has a rounded shape or a cut-off shape , so that loss of heat energy when sealing the glass envelope can be suppressed, and the time required for temperature rise and fall can be shortened. Not only can the variation in temperature distribution at the sealing portion of the glass envelope be reduced, but the thermal stress of the glass member during sealing can be reduced. For this reason, there is no thermal strain between the glass members, and a non-defective product is obtained as a glass envelope.

  The glass face plate is formed with a phosphor and an electron accelerating electrode, the glass rear plate is formed with an electron source, and the electron source is a surface conduction electron-emitting device. It is preferable that

  In such a configuration, since the temperature of the image area is kept low compared to the conventional case where the entire envelope is heated at the sealing temperature without means for local heating, it is arranged in the image area. Thermal degradation of the electron-emitting device that is used can be avoided.

  As described above, according to the glass envelope of the present invention, when manufacturing using local heating, compared with the sealing step of heating the entire conventional glass envelope to the sealing temperature, Therefore, the effect of reducing the power consumption was obtained. Further, since the temperature for heating the entire envelope can be lowered, the time required for the sealing process can be shortened.

  Further, according to the glass envelope of the present invention, when manufacturing using local heating, the temperature of the sealed portion is kept uniform, so that the thermal stress near the corner of the outer frame where the thermal stress becomes the largest The possibility of cracking of the panel during sealing and cooling can be reduced, and the yield has been improved.

Hereinafter, the glass envelope of the present invention will be specifically described with reference to FIGS. 1 and 2. First, a simple configuration will be shown as an example in the case of applying the glass envelope of the present invention to the image forming unit of the image display device. That is, the glass envelope here includes a glass face plate, a rear plate arranged to face the glass face plate, and a glass outer frame that surrounds the peripheral portion between the face plate and the rear plate. Consists of
・ Regarding the method of locally heating and sealing the glass envelope When FIG. 1 is used, the entire glass envelope is heated by the hot plate heaters 6 and 7 (first heating means) from above and below. The structural conditions for locally heating the sealed portion of the glass envelope will be described.

  In FIG. 1, reference numeral 2 denotes a rectangular (particularly rectangular) glass face plate, 1 denotes a glass rear plate that is also disposed opposite to the glass face plate 2, and 3 denotes a face plate 2 and a rear plate. 1 is a rectangular (rectangular) glass outer frame that surrounds the peripheral edge thereof, 4 is a frit glass that is a sealing material, and 5 is an electric heater (second heating means) for locally heating the sealing material 4. It is.

As shown in FIG. 1, for example, a local heating heater is formed between the sealing material and the glass member (2, 1), and the sealing portion (sealing material) is locally applied to the sealing temperature using the local heating heater. In order to prevent the glass from cracking, the other part is assisted heated below the sealing temperature, and the sealing material is heated and melted by heat conduction from the glass member.
-About the temperature equalization method of a sealing part As mentioned above, when the assist heating by a 1st heating means and the local heating by a 2nd heating means are performed, the variation in temperature distribution arises in a sealing part. In the case of a normal glass envelope, the corner portion of the glass outer frame has a different temperature because the heat escape is different from that of the straight portion. That is, at the outer corner portion of the glass outer frame, the heat escape is larger than the straight portion, so that the temperature is likely to decrease. On the other hand, at the corner portion inside the glass outer frame, the temperature tends to rise. For this reason, the temperature difference becomes large near the corner portion, the thermal stress distortion becomes the largest, and it becomes easy to crack at the time of local heating sealing and subsequent cooling.

  Therefore, a temperature compensation means for the sealing portion is used. The following means (1) to (3) can be considered as this embodiment, but the means (1) and (2) are adopted as embodiments of the present invention.

  (1) By specifying the shape of the corners of the glass face plate 2 and the glass rear plate 1, heat escape from the outer frame can be reduced. For example, as shown in FIG. 1, the protruding portion from the glass outer frame 3 of the glass face plate 2 and the glass rear plate 1 only needs to be small at the corner. Specific shapes include means such as rounding corners or cutting off corners.

  (2) The shape of the corners of the glass outer frame 3 can reduce heat escape from the outer frame. For example, as shown in FIG. 2, the specific shape includes means for rounding the corner or cutting off the corner.

  (3) The electrical resistance value at the corner of the local heating heater 5 can be increased, and the heating temperature at the corner can be made higher than that at other portions, for example, the straight portion. That is, as specifically shown in FIG. 3, the width of the heater 5 is reduced at the corners. Although it can be dealt with even if the thickness is reduced, as described above, since the temperature is more likely to decrease at the outer corner portion, it is preferable that the heat is more easily generated on the outer side.

  In this way, for example, by suppressing the variation in the temperature distribution at the sealed portion to within ± 10 ° C., the tensile stress due to heat in the vicinity of the sealed portion can be suppressed to about 10 MPa or less. It is possible to prevent cracking of the glass member in the attaching process and the cooling process. In particular, in the manufacture of the glass envelope according to the present invention, the entire envelope is sealed without local heating means as in the prior art by locally heating the sealed portion and assisting heating the other portion. The glass envelope can be manufactured with less power or the like than when heating at the deposition temperature. Further, since the image area of the glass rear plate is maintained at the heating temperature of the assist (first heating means), the electron-emitting device is not deteriorated by heat. Furthermore, as described above, since the temperature of the sealing portion is uniformly maintained, the generation of thermal stress in the glass member is reduced, and the distortion of the glass member in the sealing step and the subsequent heating step is reduced.

  When an image forming apparatus is used, the glass envelope according to the present invention includes a phosphor and an electron accelerating electrode formed on the face plate 2 and an electron source formed on the rear plate 1. An image forming unit is configured. The electron source is preferably a surface conduction electron-emitting device, but is not limited thereto, and can be applied to a glass envelope for an image forming apparatus using the above-described cold cathode or hot cathode. It is also preferably applied to a glass envelope for a plasma display.

  Accordingly, a method for manufacturing an image forming portion (glass envelope) of an image display apparatus using a surface conduction electron-emitting device in which the present invention is preferably used will be described below. Since the present invention relates to sealing of an envelope, the present invention is applied not only to the manufacture of an image forming unit of an image display device using a surface conduction electron-emitting device but also to the manufacture of other glass envelopes. Needless to say, you can.

  Here, with reference to FIG. 4 and FIG. 5, an embodiment of the manufacture of an image display device having a surface conduction type electron-emitting device in which the present invention is used will be described in detail. In the present embodiment, an electron-emitting device and wiring are formed on the rear plate 1, and a phosphor and a metal back are formed on the face plate 2. First, the image display device of the present invention will be described with reference to FIG. 4, and then the manufacturing method will be described.

  FIG. 4 is a perspective view of the image display apparatus according to the present invention, and a part of the panel is cut away to show the internal structure. In the figure, reference numeral 55 denotes a rear plate, 56 denotes a support frame, and 57 denotes a face plate. The members 55 to 57 here form a glass envelope for maintaining the inside of the display panel in a vacuum. . When assembling the glass envelope, it is necessary to seal it in order to maintain sufficient strength and airtightness for joining the members. At this time, the inside of the glass envelope is evacuated to a vacuum state via an exhaust pipe (not shown). This exhaust pipe introduces an activated gas in the activation process generated during the process process. Also used as a tube.

  In the drawing, N × M surface conduction electron-emitting devices 52 are formed on the rear plate 55 (N and M are positive integers of 2 or more, and are appropriately set according to the target number of display pixels. In the N × M surface conduction electron-emitting devices, the number of row direction wirings 53 (also referred to as lower wirings) and N number of column direction wirings 54 (also referred to as upper wirings) are simple. Matrix wiring).

  A phosphor 58 is formed on the lower surface of the face plate 57. In this embodiment, since colors are used for image display, phosphors of the three primary colors red, green, and blue used in the field of CRT are separately applied to the fluorescent film 58. In the field of CRT, a known metal back 59 is provided on the surface of the fluorescent film 58 on the rear plate side. The metal back 59 is formed by forming the fluorescent film 58 on the face plate substrate 57, smoothing the fluorescent film 58, and vacuum-depositing Al thereon.

  Although not used in this embodiment, a transparent conductive film such as ITO is interposed between the face plate substrate 57 and the fluorescent film 58 for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film. It may be provided.

  Reference symbols Dx1 to Dxm, Dy1 to Dyn, and Hv are electrical connection terminals of an airtight container provided to electrically connect the display panel and its electrical circuit (not shown). The terminals Dx1 to Dxm are electrically connected to the multi-electron beam source row wiring 53, the terminals Dy1 to Dyn are multi-electron beam source column wiring 54, and the terminal Hv is electrically connected to the faceplate metal back 59, respectively. Has been.

  Next, description will be made with reference to FIG. 5A and 5B are schematic views showing the configuration of the surface conduction electron-emitting device, where FIG. 5A is a plan view and FIG. 5B is a cross-sectional view. In FIG. 5, reference numeral 61 is a substrate, 62 and 63 are element electrodes, 64 is a conductive thin film, and 65 is an electron emission portion.

The electron emitting portion 65 is a portion in which the conductive thin film 64 is locally destroyed, deformed or altered by forming the conductive thin film 64 through the device electrodes 62 and 63 so as to be in an electrically high resistance state. 65, and the atmosphere surrounding the device is set to, for example, 1 × 10 ⁻³ Pa or less, and subsequently, for example, acetone is introduced into the atmosphere as an activation gas made of an organic substance. By applying a voltage to the device electrodes 62 and 63 and causing a current to flow through the device (activation process), a film containing carbon as a main component is formed at the same time as the formation of the electron emission portion 65 (described above in the prior art). The same as that disclosed in Patent Document 1).

An example of the method for manufacturing the glass envelope of the image display apparatus according to the present invention will be specifically described.
・ Regarding the creation of the rear plate (1) A lower wiring is formed by screen printing on a blue plate glass rear plate having a silicon oxide film formed on the surface, and then an interlayer insulating film is formed between the lower wiring and the upper wiring. . Furthermore, an upper wiring was formed, and an element electrode connected to the lower wiring and the upper wiring was formed.

  (2) Next, after forming a conductive thin film made of PdO, it was patterned to obtain a desired form.

(3) A frit glass for fixing the outer frame was formed at a desired position. Through the above steps, a rear plate on which a surface conduction electron-emitting device having a simple matrix wiring, a sealing material for an outer frame, and the like were formed could be produced.
-Preparation of face plate (1) A phosphor and a black conductor were formed on a blue glass substrate, the inner surface of the phosphor film was smoothed, and then an Al metal back was formed.

(2) A frit glass for fixing the outer frame was formed at a desired position. Through the above-described steps, a phosphor in which the three primary color phosphors are arranged in stripes, a sealing material for the outer frame, and the like were formed on the face plate.
-About creation of glass envelope by local heating of sealing part Glass envelope was created using the above-mentioned "local heating sealing method of glass envelope". At this time, the rear plate is held on the hot plate on the adjustment stage of X, Y, and θ, and the rear plate and the face plate are heated to below the sealing temperature while aligning the face plate. Separately, the sealing portion is heated to the sealing temperature by a local heater.

Although the sealing temperature is determined by the material of the frit glass, in this embodiment, the sealing temperature is 410 ° C. and is held for 10 minutes. At this time, the assist heating was set to 300 ° C. In this way, the glass envelope as the image forming unit of the image display device is sealed.
-Preparation of electron-emitting device (1) As described above, in the sealed glass envelope, the exhaust pipe (not shown) of the face plate is connected to a vacuum exhaust device (not shown), and glass The inside of the envelope was evacuated to a vacuum.

  (2) When the pressure in the glass envelope became 0.1 Pa or less, a voltage was applied to the electron-emitting device through the container outer terminals Dox1 to Doxm and Doy1 to Doyn, and a forming process was performed on the conductive thin film.

(3) Subsequently, when the pressure in the glass envelope becomes 1 × 10 ⁻³ Pa or less, 1 Pa of acetone is introduced into the glass envelope as an activation gas through the exhaust pipe, and the container external terminals Dox1 to A voltage was applied to the device through Doxm and terminals Doy1 to Doyn to activate the electron-emitting device.
-About the degassing process sealing in an airtight container (1) After exhausting activated gas fully, baking degassing of a glass envelope is performed. The heating temperature was 300 ° C. and the time was 10 hours.

  (2) After completion of the degassing step, a part of the exhaust pipe is heated and melted to perform sealing (chip off). Thus, the image display device was completed.

  Hereinafter, the present invention will be described in detail with reference to specific examples. However, the present invention is not limited to these examples, and each element can be replaced within the scope of achieving the object of the present invention. Of course, design changes can be made.

[Example 1]
In the present embodiment, as temperature compensation means, the shape of the corners of the face plate and the rear plate is specified to compensate for the temperature drop at the corners of the sealed portion. This will be described with reference to FIG. That is, in the image forming apparatus of this embodiment, as described above, a face plate, a rear plate, an outer frame, frit glass, and a heater for local heating were prepared. The face plate and the rear plate have rounded corners in advance. The curvature radius is, for example, R = 5 mm. A frit glass having a sealing temperature of 410 ° C. was used.

  A frit glass is applied to the adhesive surface of the face plate and the outer surface of the glass frame that are formed with a phosphor and a metal back, and are fired at 410 ° C. for 10 minutes. The face plate and the glass outer frame were bonded to each other.

  Next, the glass outer frame integrated with the face plate is fixed to the rear plate. Here, as shown in FIG. 1, reference numeral 2 is a face plate, 1 is a rear plate, and 3 is a glass outer frame. 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.

  The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and further, the sealing portion is heated to a temperature at which the frit glass 4 is melted by the heater 5 for local heating (410 ° C. in this embodiment). Heat and hold this state for 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.

  Incidentally, in the case where the sealing portion is heated uniformly using the conventional face plate and rear plate having corners, the heat escape is large at the outer corners of the outer frame, and the temperature is partially reduced. Further, the heat escape becomes smaller at the inner corner of the outer frame, and conversely, the temperature partially increases, and the temperature difference becomes larger near the outer frame corner. Therefore, the thermal stress at this portion increases, and the glass member may break during heating or cooling.

  In this embodiment, the corners of the face plate 2 and the rear plate 1 are rounded to have a predetermined curvature, so that heat escape is reduced. In this example, the corners of the face plate 2 and the rear plate 1 were rounded to a curvature radius R = 5 mm. By using the face plate 2 and the rear plate 1 having such a shape to uniformly heat the sealing portion, the range of temperature distribution variation in the sealing portion can be suppressed to ± 10 ° C. or less. The tensile stress due to heat in the vicinity of the sealed portion was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and the product yield was improved.

[Example 2]
In the present embodiment, the temperature distribution at the corner of the sealed portion is compensated by appropriately setting the shape of the corner of the glass outer frame. That is, in the embodiment, a face plate, a rear plate, an outer frame, and a frit glass were prepared in the same manner as described above. The corner of the outer frame is rounded in advance. In particular, in this embodiment, the radius of curvature is set to R = 3.8 mm, which is the same as the width of the outer frame. A frit glass having a sealing temperature of 410 ° C. was used.

  A phosphor and a metal back are formed, frit glass is applied to the adhesive surface of the conductive face plate and the adhesive surface of the glass outer frame, and baked at 410 ° C. for 10 minutes. The plate and the glass outer frame were bonded.

  Next, a procedure for fixing the glass outer frame integrated with the face plate to the rear plate will be described. In FIG. 2, reference numeral 2 is a face plate, 1 is a rear plate, 3 is a glass outer frame, 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.

  The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and further, the sealing portion is heated to a temperature at which the frit glass 4 is melted by the heater 5 for local heating (410 ° C. in this embodiment). Hold for 10 minutes. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.

  When the sealing portion is uniformly heated using the outer frame having the corners as in the prior art, the heat escape is large at the outer corners of the outer frame, and the temperature partially decreases. On the other hand, the heat escape decreased at the inner corner of the outer frame, and conversely, the temperature partially increased, and the temperature difference increased near the corner of the outer frame. Therefore, the thermal stress in this portion is increased, and the glass member may be broken during heating or cooling.

  However, in the case of the present embodiment, the corner portion of the outer frame 3 is rounded so that the same radius of curvature as the width of the glass outer frame has a predetermined curvature. On the other hand, at the inner corner, the heat escape increased and the temperature difference became smaller. By using the outer frame of such a shape and heating the sealing portion uniformly, the variation range of the temperature distribution in the sealing portion can be suppressed to ± 10 ° C. or less. As a result, the sealing portion The tensile stress due to heat in the vicinity was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and yield was improved.

[Reference example]
In this reference example, the temperature distribution at the corner of the sealing portion is compensated by adjusting the electric resistance distribution of the heater. That is, in this reference example, as described above, a face plate, a rear plate, an outer frame, a frit glass, and a heater for local heating were prepared. As for the heater for local heating, the width | variety of the heater was previously made small in the corner | angular part, as shown in FIG. In particular, in the present reference example, the width of the heater in the vicinity of the corner is set to about ½ of the width of the heater in the straight portion. A frit glass having a sealing temperature of 410 ° C. was used.

  A frit glass 8 is applied to the adhesion surface of the face plate 2 and the adhesion surface of the glass outer frame 3 formed with a phosphor and a metal back, and fired at 410 ° C. for 10 minutes. The face plate 2 and the glass outer frame 3 were bonded to each other.

  Next, a procedure for fixing the glass outer frame integrated with the face plate to the rear plate is shown. In FIG. 3, reference numeral 2 is a face plate, 1 is a rear plate, 3 is a glass outer frame, 4 is a frit glass, 6 and 7 are hot plate heaters for auxiliary heating, and 5 is a heater for local heating.

  The entire glass envelope is heated to 300 ° C. by the hot plate heaters 6 and 7, and further the heater 5 for local heating is heated to a temperature at which the frit glass 4 is melted (410 ° C. in this reference example) by 10. Hold for a minute. Thereafter, the panel is slowly cooled down to room temperature. Throughout this process, the temperature in the image area of the rear plate is kept at 305 ° C. or lower.

  Incidentally, when the sealing portion was heated with a conventional heater having a uniform width, the heat escape was large at the outer corner of the outer frame, and the temperature partially decreased. On the other hand, the heat escape is reduced at the inner corner of the outer frame, and conversely, the temperature is partially increased, and the temperature difference is increased near the outer frame angle. During the cooling, the glass member may break.

  In the case of this reference example, the temperature drop at the corner portion was reduced by increasing the resistance of the heater for local heating at the corner portion of the sealed portion. By heating the sealing portion using such a heater, the variation range of the temperature distribution in the sealing portion is suppressed to ± 10 ° C. or less. The stress was reduced to 10 MPa or less. As a result, cracking during heating and cooling was eliminated, and yield was improved.

It is a schematic diagram which shows Example 1 of the glass envelope of this invention. It is a schematic diagram which shows Example 2 of the glass envelope of this invention. It is a schematic diagram which shows the reference example of the glass envelope of this invention. It is a schematic diagram which shows an example of the electron source made into the simple matrix arrangement | positioning which can apply this invention. It is a schematic diagram which shows an example of the surface conduction electron-emitting device which can apply this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rear plate 2 Face plate 3 Outer frame 4 Frit glass 5 Local heater (2nd heating means)
6 Hot plate (first heating means)
7 Hot plate (first heating means)
8 Frit glass 51 Glass substrate 52 Surface conduction electron-emitting device 53 Row-direction wiring 54 Column-direction wiring 55 Rear plate 56 Glass outer frame 57 Face plate 58 Phosphor 59 Metal back 61 Substrate 62 Element electrode 63 Element electrode 64 Conductive thin film 65 Electron emission part

Claims (5)

A glass envelope that is configured by sealing a plurality of glass members using a sealing material so that a sealing portion is square,
A heater is provided between the sealing material and the glass member, and the glass member includes a square-shaped face plate and a rear plate, and the square corners of the face plate and the rear plate are rounded or cut off. Glass envelope characterized by having a curved shape . A glass envelope that is configured by sealing a plurality of glass members using a sealing material so that a sealing portion is square,
A heater is provided between the sealing material and the glass member, and the glass member includes a rectangular glass outer frame, and a rectangular corner portion of the glass outer frame has a rounded shape or a cut shape. A glass envelope comprising: The glass envelope according to claim 1 or 2, wherein the sealing material is frit glass. The glass envelope according to any one of claims 1 to 3, wherein a phosphor and an electron acceleration electrode are formed in the glass envelope, and an electron source is formed. The glass envelope according to claim 4, wherein the electron source is a surface conduction electron-emitting device.

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