JP3745446B2 - Flat circuit body manufacturing method and vacuum forming die - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a flat circuit body and a vacuum forming die used in the manufacturing method.
[0002]
[Prior art]
The flat circuit body has a structure in which a plurality of electric wires are arranged in parallel between two films to be joined, and the production is performed by using a vacuum forming die for vacuum-sucking the film. FIG. 5 shows a conventional method described in Japanese Patent Laid-Open No. 6-500738 for manufacturing a flat circuit body.
[0003]
In FIG. 5, reference numeral 100 denotes a vacuum forming die, and a forming surface 110 is formed on the upper surface thereof. A first film (not shown) is set on the molding surface 110, and the electric wire 120 and the connector 130 are arranged on the first film as shown in (b). After this arrangement, the second film 140 is placed on the vacuum mold 100 as shown in FIG.
[0004]
By this vacuum suction, the first film and the second film are brought into close contact with each other and the electric wire 120 is sandwiched. In this state, the two films are joined by the hot melt adhesive applied by heating to the film. To do. By this joining, the electric wire 120 is fixed between the films. Thereafter, as shown in (d), the excess portion of the film is cut out by the cutter 150 or the like, and the product 160 is cut out from the film as shown in (e).
[0005]
[Problems to be solved by the invention]
The above-described method can be performed satisfactorily when the electric wires are arranged in a straight line, but has a problem when the electric wires are arranged in a curved line. FIG. 6 illustrates the problem in this case. A curved forming surface 210 is formed on the vacuum forming die 200, and a plurality of electric wires 220 are routed in parallel to the forming surface 210. 230 is a connector connected to the end of the electric wire. In this wiring, the state where each electric wire 220 shown in (a) is separated is ideal.
[0006]
However, when the forming surface 210 is curved, the electric wires 220 are concentrated and overlapped at the corners of the bent forming surface 210, and the overlapping portion 240 protrudes from the forming surface 210 as shown in FIG. When such a protrusion occurs, the electric wire cannot be sandwiched by the film, resulting in a defective product. In addition, the wire length of the electric wire also varies, which causes a problem that the electric wire cannot be fitted.
[0007]
This invention solves such a problem, and it aims at providing the manufacturing method which can prevent the mutual overlap of an electric wire when wiring an electric wire in curve shape. Another object of the present invention is to provide a vacuum mold that can be suitably used in this production method.
[0008]
[Means for Solving the Problems]
Production method of the invention of claim 1, sandwiched a plurality of electric wire laid in parallel above and below the film, in a method of a flat circuit body by joining the film with vacuum suction, mutually overlap when arranging the electric wires The electric wire is restrained so as not to match , and vacuum suction is performed in this restrained state.
[0009]
By constraining the overlapping of the wires, the wires can be routed in parallel and in a state of being separated from each other. For this reason, the protrusion from the molding surface is eliminated, and the necessary line length can be secured.
[0010]
In the invention of claim 2, a protrusion for restraining the electric wires is formed on the molding surface of the vacuum forming die so as not to overlap each other, and the first film is arranged on the molding surface and the first film is vacuum-sucked. Thereafter, an electric wire is routed between the protrusions, and a second film is placed on the electric wire to perform vacuum suction.
[0011]
By vacuum-sucking the first film disposed on the molding surface, the first film adheres to the molding surface and the protrusions. Thereby, a film becomes a shape similar to the molding surface which has a processus | protrusion. By arranging the electric wire between the projections on the molding surface through this film, it is possible to attach a ridge that makes the electric wires separate from each other. Accordingly, a flat circuit body having a structure in which the overlapping of the electric wires is prevented can be obtained.
[0012]
According to a third aspect of the present invention, a protrusion for restraining an electric wire is formed on a forming surface of a vacuum forming die so as not to overlap each other, and the electric wire is pushed between the protrusions in a state where the first film is disposed on the forming surface. Then, the second film is placed on the electric wire and vacuum suction is performed.
[0013]
By pushing the electric wire between the protrusions, the first film is brought into close contact with the molding surface, and the wrinkles that are separated from each other can be attached to the electric wire, and the flat circuit body has a structure that prevents the electric wires from overlapping. be able to. In this method, the number of vacuum suctions is reduced, and the number of steps is reduced and the manufacture is facilitated.
[0014]
According to a fourth aspect of the present invention, in the manufacturing method of the second or third aspect, the first film in which a slit corresponding to the protrusion is formed is disposed on the molding surface. The first film in which the slits corresponding to the protrusions are formed is in close contact with the molding surface simultaneously with the arrangement on the molding surface. Therefore, it does not become bulky on the molding surface and does not obstruct the subsequent wiring of the electric wires. In addition, it is not necessary to perform vacuum suction or push-in of the electric wire to bring the first film into close contact with the molding surface.
[0015]
The invention of claim 5 is a vacuum forming die used in the above manufacturing method, wherein protrusions are formed on the forming surface so as to be inserted between the electric wires so as not to overlap each other. And
[0016]
By forming the protrusions, the electric wires can be routed in a state of being separated from each other, and can be applied to manufacture of a flat circuit body.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
1 to 3 show an embodiment of the present invention. In this embodiment, as shown in FIG. 1, a “T” -shaped flat circuit body 1 is manufactured. The flat circuit body 1 has a plurality of electric wires 2 arranged in parallel so as to form a “T” shape, and a connector 3 to which an end of the electric wire 2 is connected, and excludes a connector connecting portion in the electric wire 2. The parts are fixed so as not to move with each other by being sandwiched between insulating upper and lower films. In FIG. 1, 4 is a first film located on the lower side of upper and lower films, and 5 is a vacuum forming die.
[0018]
FIG. 2 shows the vacuum forming die 5. The vacuum forming die 5 has a block-shaped main body 6 in which a plurality of small holes (not shown) for suction are formed, and a “T” -shaped flat molding surface 7 formed on the upper surface of the main body 6. ing. A connector housing recess 8 into which the connector 3 is fitted is opened at each end of the molding surface 7. The forming surface 7 of the vacuum forming mold 5 is placed so that the first film 4 is placed and the electric wire 2 is positioned on the first film 4. The electric wires 2 are routed in parallel with the molding surface 7 without overlapping each other. In order to perform such wiring, a plurality of small piece-like projections 10 are formed on the molding surface 7.
[0019]
The protrusions 10 restrain the mutual contact of the electric wires 2 and are arranged so as to match the shape of the flat circuit body 1 to be manufactured. In the example of illustration, it is provided in the part which adjoined each connector accommodating recessed part 8, and the part where "T" character cross | intersects. Further, at a portion where the “T” shape intersects, there are a “T” -shaped guide projection 10 a that guides the electric wire to be bent in the bending direction, and an “L” -shaped guide projection 10 b that is connected to the guide projection 10 a. Is provided. These guide protrusions 10a and 10b are restrained so that the electric wires 2 to be routed do not contact each other like the protrusions 10 on the connector housing recess 8 side, and constitute a part of the protrusions 10.
[0020]
In the manufacture of the flat circuit body 1 using the vacuum forming die 5, first, the first film 4 is disposed along the forming surface 7 of the vacuum forming die 5 as shown in FIG. 3. As shown in FIG. 1, the first film 4 in this embodiment is formed in a “T” shape as a whole, and slits 12 through which these penetrate through portions corresponding to the protrusions 10 including the guide protrusions 10 a and 10 b. Is formed. Accordingly, when the first film 4 is placed on the molding surface 7, the projections 10, 10 a, and 10 b penetrate the slits 12, so that the first film 4 can be in close contact with the molding surface 7.
[0021]
After arranging the first film 4, the connector 3 is fitted into the connector housing recess 8, and each electric wire 2 is routed along the molding surface 7. This wiring is performed so that the electric wire 2 is introduced between the protrusions 10, 10a, and 10b, whereby the adjacent electric wires 2 are prevented from contacting each other and are constrained from overlapping each other. Moreover, the electric wire 2 is inserted between the protrusions 10, 10 a, and 10 b, so that a bend against a bent state or a state separated from each other is attached.
[0022]
After the wire 2 is routed, a second film (not shown) is placed on the wire 2. Then, a cap 9 (see FIG. 1) is fitted into the connector housing recess 8, and vacuum suction is performed in this state. Thereby, while the 2nd film adheres to the 1st film 4, these films join mutually. Such joining can be performed by applying a hot-melt adhesive to the opposing surfaces of either or both films, and heating the film during or before adhesion.
[0023]
In such manufacture, since the electric wires 2 are restrained from overlapping each other, the electric wires do not protrude from the molding surface 7 due to the overlapping. Therefore, it is possible to manufacture the flat circuit body 1 with no defective product. In addition, the necessary wire length can be secured from the point where the electric wire does not protrude, and as a result, the assembly to the electrical component can be performed well.
[0024]
Although the 1st film 4 in which the slit 12 was formed was used in the above form, you may manufacture the flat circuit body 1 using the 1st film in which the slit is not formed. In this case, the first film is arranged on the molding surface 7 of the vacuum mold 5 and vacuum suction is performed in this arrangement state. By this vacuum suction, the first film comes into close contact with the molding surface 7 and the projections 10, 10a, and 10b, and thus has the same shape as the molding surface 7 having the projections. Thereafter, the electric wire 2 is routed between the protrusions 10, 10a, and 10b in the same manner as described above, and a second film is placed on the electric wire, and vacuum suction is performed again so that the film is brought into close contact and bonded.
[0025]
In the case where the first film without the slit 12 is used, the following method can be performed in addition to such production. That is, a 1st film is arrange | positioned to the molding surface 7, and the electric wire 2 is pushed in between protrusion 10, 10a, 10b in this arrangement | positioning state. By this pressing, the first film can be brought into close contact with the molding surface 7. Therefore, after that, the second film is placed on the electric wire, and vacuum suction is performed to bond the first and second films in a close contact state. In this method, vacuum suction may be performed once and the number of times is reduced, so that the process can be simplified and the manufacture becomes easy.
[0026]
FIG. 4 shows another example of the vacuum mold 5, and the same elements as those in FIG. 2 are associated with the same reference numerals. In this vacuum forming die 5, the projection 20 for arranging the wires 2 so as not to overlap each other has a pin shape, and even if the projection 20 has such a shape, the wire 2 can be routed well.
[0027]
Although the case where the “T” -shaped flat circuit body 1 is manufactured has been described in the above embodiment, the flat circuit body can be manufactured in the same manner by operating in the same manner even in other shapes.
[0028]
【The invention's effect】
In the first aspect of the invention, the electric wires can be routed in parallel with each other in a state of being separated from each other by restraining the overlapping of the electric wires. For this reason, the protrusion from the molding surface is eliminated, and the necessary line length can be secured.
[0029]
According to the second aspect of the present invention, since the first film is brought into close contact with the molding surface and the protrusions by vacuum suction of the first film disposed on the molding surface, the first film has the same shape as the molding surface. By arranging the electric wire between the projections on the molding surface through this film, it is possible to attach a wrinkle that separates the electric wires from each other, and to make a flat circuit body with a structure that prevents the electric wires from overlapping each other. it can.
[0030]
According to the invention of claim 3, by pressing the electric wire between the protrusions, the first film is brought into close contact with the molding surface, and the wrinkles that are separated from each other can be attached to the electric wire, thereby preventing the overlapping of the electric wires. A flat circuit body having a structure can be obtained.
[0031]
In the invention of claim 4, since the slit corresponding to the protrusion on the molding surface is formed in the first film, the first film is in close contact with the molding surface simultaneously with the arrangement on the molding surface. Therefore, it does not become bulky on the molding surface and does not obstruct the subsequent wiring of the electric wires. Moreover, it is not necessary to push the electric wire.
[0032]
Since the vacuum forming die of the invention of claim 5 has projections on the molding surface that restrain the overlapping of the electric wires, the electric wires can be routed away from each other and can be applied to the manufacture of a flat circuit body. It becomes.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an arrangement in the manufacture of the present invention.
FIG. 2 is a perspective view of a vacuum forming die.
FIG. 3 is a partial plan view of a vacuum forming die.
FIG. 4 is a perspective view of another vacuum forming die.
5A to 5E are perspective views showing a conventional manufacturing process.
6A is a plan view showing an ideal routing state, and FIG. 6B is a plan view showing an undesirable routing state.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Flat circuit body 2 Electric wire 3 Connector 4 1st film 5 Vacuum forming die 7 Molding surface 10 Protrusion 10a 10b Guide protrusion

Claims (5)

In a method of sandwiching a plurality of electric wires arranged in parallel between upper and lower films and joining the films by vacuum suction to form a flat circuit body , the electric wires are restrained so as not to overlap each other when the electric wires are arranged, A method of manufacturing a flat circuit body, wherein vacuum suction is performed in a restrained state. Protrusions that restrain the wires so that they do not overlap each other are formed on the molding surface of the vacuum forming die, a first film is disposed on the molding surface, and the first film is vacuum-sucked, and then the wires are interposed between the projections. A method of manufacturing a flat circuit body, characterized in that a vacuum is sucked by placing a second film on an electric wire. Protrusions that restrain the wires so as not to overlap each other are formed on the molding surface of the vacuum forming die, and the electric wires are pushed between the projections with the first film disposed on the molding surface, and then the second film A method of manufacturing a flat circuit body, characterized in that vacuum suction is carried out on an electric wire.   4. The method for manufacturing a flat circuit body according to claim 2, wherein a first film having slits corresponding to the protrusions is disposed on the molding surface. In a vacuum forming die for manufacturing a flat circuit body that performs vacuum suction on a film sandwiching a plurality of electric wires arranged in parallel on the molding surface from above and below, the electric wires are inserted between the electric wires so as not to overlap each other. A vacuum forming die for manufacturing a flat circuit body , characterized in that a protrusion for restraining the surface is formed on a molding surface.

Images