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JP3746307B2 - Sound effect generator for game machine control circuit - Google Patents
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JP3746307B2 - Sound effect generator for game machine control circuit - Google Patents

Sound effect generator for game machine control circuit Download PDF

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Publication number
JP3746307B2
JP3746307B2 JP10197694A JP10197694A JP3746307B2 JP 3746307 B2 JP3746307 B2 JP 3746307B2 JP 10197694 A JP10197694 A JP 10197694A JP 10197694 A JP10197694 A JP 10197694A JP 3746307 B2 JP3746307 B2 JP 3746307B2
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Japan
Prior art keywords
sound
board
generating
covering member
sound source
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JP10197694A
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Japanese (ja)
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JPH07284554A (en
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健吉 中島
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Heiwa Corp
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Heiwa Corp
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Description

【0001】
【産業上の利用分野】
本発明は遊技の進行に応じて所定効果音が発生される遊技機制御回路の効果音発生装置の改良に関する。
【0002】
【従来の技術】
遊技機は多種多彩な構成部材からなり、これらを中央処理装置によって制御される音声合成回路LSIで制御することにより、きわめて変化に富んだ内容の遊技が容易に提供される。
【0003】
すなわち音声合成回路LSIは、メモリに格納された制御プログラムを順次実行することにより、遊技機の全体いいかえれば各構成部材を動作させて遊技を進行させ、遊技を進行に応じて所定の効果音が発生される。
【0004】
これにより遊技者の聴覚を初め、視覚、触覚などを通して遊技変化が遊技者に付与される。そこで近年では遊技者の要望を満足させるため、視覚に直接触れる箇所の遊技機の構成部品点数を増大させ、これらを複雑に動作させると同時に、効果音を綿密に発生させるように制御するようにしている。
【0005】
これに対して遊技機の構成部品を制御するための回路は、上述した部品点数の増大に伴って実装密度の増大が必至で、そのため基板の多層化、チップコンデンサなどチップ状製品の採用、集積回路のウエハを基板に直接ボンディングすることなど、基板には様々なデザインが施されている。
【0006】
しかしながら現状にあっては、実装密度が限界まで達しつつあり、遊技機の構成簡素化および部品点数の減少が開発者の技術課題になっている。
【0007】
ところで遊技機を開発する場合、その試作時にハードウエアとソフトウエアとの両面から、各段階を追ってデバグしながら、遊技機の各構成部材が良好に動作するよう改良を施すことによって製品としての完成度を高めてゆく。
【0008】
また効果音にあっては、遊技機に備えられた音源部によって遊技の進行に応じて発生されるが、近年では、音質が良好であるだけでなく、多彩な音色そして高度な音楽性を有する変化に富んだものが望まれている。
【0009】
そこで現実音を音素材データに使用するため、サンプリングされた現実音が書き込まれたEP−ROM(またはマスクROM)を音発生部に設けている。
【0010】
この音源メモリに書き込まれた音素材データは、遊技機の全体を制御するための制御部により、遊技の進行に応じて読み出されて適宜、電子的な処理が施されたのち、音源部を音源メモリとともに構成している音発生部により、所定の効果音として発生される。
【0011】
音発生部は、音源メモリに書き込まれている音素材データを音声信号に変換するためのA/Dコンバータ、変換された音声信号を増幅したり、音色を調節するためのアンプ回路などから構成されている。
【0012】
音源メモリとしてのROMは、基板に半田付けで直接実装されることは稀で、ソケットを基板に半田付けしたうえ、各種ROMをソケットに着脱することで、異なる仕様の音源メモリすなわち新たな効果音の音素材データに交換できる。
【0013】
このため開発時には種々の効果音に係る実験が、手作業によるROM交換で実施される。
【0014】
【発明が解決しようとする課題】
ところがROMは、そのウエハが実質的に数ミリメートル四方程度の寸法であるにもかかわらず、ROM交換が人手を介して作業されることから、取り扱いを容易にせしめるため、その外形寸法は、たとえば32ピンのDIP(Dual Inline Package) の場合、42ミリメートル×16ミリメートルにもなり、基板への実装効率が良好であるとはいい難い。
【0015】
このことからソケットの採用は、プログラム仕様の変更がROM交換によって容易な反面、ボンディングなど、基板に直接実装する手段と比較して電子部品の実装面積を減少させる。
【0016】
このため基板に実装される電子部品の配置、および、各電子部品間を電気的に接続するためのラインの引き回しなど、基板デザインの観点から鑑みて、ソケットの採用に起因して、きわめて大きな開発上の制限を生み出す傾向があるため、開発期間の長期化を招き易く、コストアップの原因になる。
【0017】
また音源メモリは、ROM交換によって音素材データを容易に仕様変更できるものの、その仕様によっては周辺回路、とくに音発生部の仕様変更を要し、音源部、すなわち音源メモリおよび音発生部と、制御部とを同一基板に実装している場合、ROM交換に起因して音源部のみを仕様変更すればよいにもかかわらず、基板全体の仕様を変更しなければならない。
【0018】
これにより音源部および制御部の構成部材が実装された同一の基板を、遊技機の異なる機種間で共通使用することができず、コストダウンを図りにくい。また音源部および制御部を別個に構成すれば、制御部のみを異なる機種間で共通使用できるものの、部品点数の増加を招くので、取り扱いが不便である。
【0019】
さらにROM交換が容易であるため、製品出荷後、第三者によって正規ROMまたは、その周辺回路に対してハードウエア上の不正な改造を施したり、不正な制御プログラムおよびデータを包含させたROMに交換し易く、このような不正行為を確実に防止することは困難である。
【0020】
そこで本発明は、開発時および製品製造時にあっては音源メモリに格納されている音素材データの交換が容易、かつ、取り扱いが簡便であり、効果音発生のための回路が制御基板上で占める割合を可及的に減少せしめ、これにより制御基板の設計上制限を緩和するとともに、製品出荷後には正規な音源メモリを保護して不正行為が困難な遊技機制御回路の効果音発生装置の提供を目的としている。
【0021】
【課題を解決するための手段】
本発明は上記目的を達成するために、予め定められた複数種の効果音を発生させるための音源部(音源部6)を、前記効果音を構成している音素材データを少なくとも格納する音源メモリ(EP−ROM7またはマスクROM)と、前記音素材データに基いて前記効果音のいずれかに対応する効果音信号を発生させるための音発生部(音声合成回路LSI9)とで構成し、所定の制御手順に基いて遊技を進行させ、該遊技の進行に応じて音源部からいずれかの効果音を発生させる制御部(制御部10)を構成する電子部品を実装するための制御基板(制御基板5)を設け、音源メモリを構成する電子部品と音発生部を構成する電子部品とを実装するための音発生基板(音発生基板3)を設け、前記音源メモリ (7) を被覆する被覆部材 (4) を設け、被覆部材 (4) を装着するための第1装着部(装着孔 20 )を制御基板 (5) に形成し、前記第1装着部 (20) に係合する第2装着部(装着ピン 17 )を前記被覆部材 (4) に形成し、前記制御部 (10) に対して電気的に接続するための第1接続部(接続ピン 14 )を前記音発生基板 (3) に形成し、前記第1接続部 (14) に係合する第2接続部(接続孔 15 )を制御基板 (5) に形成し、前記音発生基板(3) を前記制御基板(5) に対して交差する向きに取り付ける構成を備えている。
【0022】
音源メモリ(7)を構成する電子部品が、書き換え可能なメモリ素子または書き換え不能なメモリ素子である集積回路からなり、該集積回路が着脱可能なソケット(ソケット13)を音発生基板(3) に固定している。
【0023】
音源メモリを被覆する被覆部材を装着するための第1装着部(第1装着部20)を制御基板に形成し、音発生基板を取り付けるための第1係合部(係合舌片22)と、第1装着部に係合する第2装着部(装着ピン17)とを被覆部材に形成し、音発生基板には第1係合部に対して着脱可能に係合する第2係合部(係合孔25)を形成している。
【0024】
少なくとも被覆部材および制御基板の一方に第1係合部および第2係合部による係合状態を解除するための解除部材(解除部材30)を挿通するための挿通孔が形成されている。
【0025】
【作用】
本発明を上記のように構成したので、音源部(6) が音源メモリ(7) と音発生部(9) とで構成され、その構成部品は音発生基板(3) に分割して実装され、少なくともいずれか一方に仕様変更を要するとき、音発生基板のみの交換で、制御基板を異なる機種間で共通使用でき、音発生基板は制御基板に対して交差する向きに取り付けられるため、音発生基板は制御基板面から延設され、音発生基板が制御基板を占める割合を、音源部の構成部材を制御基板に直接実装する場合と比較して、きわめて小さくでき、さらに音発生基板の被覆部材(4) が音源メモリを被覆することで、音源メモリと、音源メモリの周辺回路とに対する不正行為の発生を抑止する。
【0026】
音源メモリを構成する電子部品が集積回路からなり、該集積回路が着脱可能なソケット(13)を音発生基板に固定している場合、音源メモリをソケットに対して着脱することで、音源メモリを音発生基板に実装、または、音発生基板に実装されている音源メモリを取り外すことができる。
【0027】
第1装着部(20)を制御基板に形成し、第1装着部に係合する第2装着部(17)と、音発生基板を取り付けるための第1係合部(22)とを被覆部材に形成し、音発生基板には第1係合部(22)に対して着脱可能に係合する第2係合部(25)を形成している場合、第1係合部および第2係合部を係合させることによって被覆部材を音発生基板に装着し、第1係合部および第2係合部間の係合状態を解除することで、被覆部材を取り外すことができ、さらに第1装着部および第2装着部の係合によって、被覆部材を制御基板に装着できる。
【0028】
少なくとも被覆部材および制御基板の一方に第1係合部および第2係合部による係合状態を解除するための解除部材(30)を挿通するための挿通孔(23)が形成されている場合、挿通孔に解除部材を挿通することにより、第1係合部および第2係合部間の係合状態を解除することができる。
【0029】
【実施例】
つぎに、本発明の一実施例を図面に基いて詳細に説明する。図1は本発明に係る遊技機制御回路の効果音発生装置1の要部構成を表わしており、本実施例にあっては遊技機制御回路の効果音発生装置1を図2に示すパチンコ機2に設けた場合についてを以下に説明する。
【0030】
この遊技機制御回路の効果音発生装置1は、図3および図4に示す音発生基板3および被覆部材4を主構成としており、音発生基板3および被覆部材4はパチンコ機2の全体を制御するための制御回路(図示省略)が実装されたに示す制御基板5上に実装される。
【0031】
音発生基板3はガラスエポキシ系の合成樹脂などからなり、予め定められた複数種の効果音を発生させるための音源部6を構成するEP−ROM7、ROMアドレスラッチ回路8、および音声合成回路LSI9の各電子部品を実装する(後述)。
【0032】
この音源部6は、制御基板5と、制御基板5上の実装部品(図3および図5に一部図示)11とで構成された制御部10によって制御され、制御部10は、図示を省略したメモリに格納されたパチンコ機2の制御手順を順次実行することに基いて、パチンコ遊技を進行させ、そのパチンコ遊技の進行に応じていずれかの効果音を音源部6から発生させる。
【0033】
音発生基板3上には、音源メモリとしてのEP−ROM7、および、EP−ROM7をアクセスするためのROMアドレスラッチ回路8と、音発生部としての音声合成回路LSI9とを初め、チップ状電子部品12が両面に振り分けて実装され、これら7〜9,12が音発生基板3上に引き回されているライン(図示省略)によって電気的に接続されることで、音源部6を形成している。
【0034】
音声合成回路LSI9は、ROMアドレスラッチ回路8を介してEP−ROM7をアクセスし、EP−ROM7の所定アドレスに格納されている各音声データを読み取り、この音声データに基いて所定の音声をスピーカ(図示省略)から発生させる。
【0035】
音発生基板3は、一方の面にEP−ROM7が実装される一方、他方の面にはROMアドレスラッチ回路8および音声合成回路LSI9を構成する電子部品が実装されている。
【0036】
EP−ROM7は、音発生基板3に対してソケット13を介して実装されており、ソケット13は音発生基板3に対し、半田付けで固定されている。
【0037】
これによりEP−ROM7はソケット13に対して着脱可能に装着されるので、ソケット13に装着済のEP−ROM7をパチンコ遊技の仕様に応じて他機種用のEP−ROM7に交換できる。
【0038】
音発生基板3には、制御部10に対して電気的に接続するための第1接続部として、複数の接続ピン14が音発生基板3の一側辺に沿わせ、図6に示すように所定のピッチを隔てて並設され、各接続ピン14は図7のように音発生基板3に沿って突出する。
【0039】
他方、制御基板5には、接続ピン14の各ピッチに対応させ、第2接続部としての接続孔15が複数穿設されている。そして接続ピン14の表面と、接続孔15の開口部周辺とには、半田16に馴染み易くするための加工が施されている。
【0040】
また接続孔15には図示を省略したラインが制御部10から引き回され、接続ピン14を、それに対応する接続孔15に係合させた状態で半田16付けすることにより、音発生基板3、いいかえれば音源部6の各々7〜9,12と制御部10とは電気的に接続される。
【0041】
被覆部材4は、少なくともEP−ROM7(または図示を省略したマスクROM)を被覆するためのものであり、本実施例では制御基板5に装着された音発生基板3の全体を被覆し、そのために被覆部材4を制御基板5に装着する場合についてを以下に説明する。
【0042】
被覆部材4はプラスチックなどからなり、直方体状に形成されており、その一側面が開放され、その開放側面の角部位には、第2装着部としての装着ピン17が合計で4箇所突設されている。
【0043】
詳しくいえば、装着ピン17は被覆部材4の角部位に各々形成されたボス(図1参照)18を貫通して設けられ、先端のみが被覆部材4の開放側面から突出している。
【0044】
装着ピン17の先端には第1半田加工面19が形成されており、装着ピン17は制御基板5に穿設されている第1装着部としての装着孔20に係合する。この装着孔20の開口周辺部には第2半田加工面21が形成され、装着ピン17および装着孔20の係合時、第1半田加工面19および第2半田加工面21は互いに隣接する。
【0045】
これにより第1半田加工面19および第2半田加工面21を容易に半田16付けでき、被覆部材4は制御基板5に装着される。本実施例において装着孔20は接続孔15を囲むように、制御基板5上に4箇所穿設され、装着孔20のピッチは各装着ピン17の配列に基いて定められている。
【0046】
また被覆部材4の他側面、いいかえれば底面には第1係合部としての一対の係合舌片22,22が、図8ないし図10に示すように被覆部材4の内方に向かい、片持ち梁状に突出している。
【0047】
一対の係合舌片22,22は音発生基板3を被覆部材4に装着するためのものであり、被覆部材4の底面で、係合舌片22,22の基端にはそれぞれ一対の挿通孔23,23が形成されている一方、先端には戻り段部24,24が形成されている。
【0048】
これに対して音発生基板3には、係合舌片22,22に対して戻り段部24,24が、それぞれ着脱可能に係合する第2係合部としての一対の係合孔(後述〜図1ないし図6、図11および図12参照)25,25が形成されている。
【0049】
また一対の係合舌片22,22には、それぞれ図8に示す両係合舌片22,22の内側に向かって隣接する一対の解除舌片26,26が形成されており、解除舌片26,26と係合舌片22,22との間には、それぞれ段差27,27が形成されている。
【0050】
上述した挿通孔23,23は詳細は後述するが、係合舌片22,22および係合孔25,25による係合状態を解除させるためのもので、解除舌片26,26の基端から先端にかけて、テーパ面28,28が形成されている。
【0051】
また被覆部材4の互いに対向する内方壁面には、装着ピン17に沿って一対のガイド溝29,29が形成されている。一対のガイド溝29,29は、図5および図6に示す音発生基板3の短手の側片に摺動可能な寸法に形成されている。
【0052】
なお上述した係合舌片22,22および係合孔25,25による係合状態を解除するために専用の解除部材(図12参照)30を使用する。
【0053】
この解除部材30には解除舌片26,26の各々に対応して各挿通孔23,23に挿通可能な一対の解除舌片31,31と、音発生基板3を押し出すための一対の解除段部32,32とを備えている。そして解除部材30は、各解除舌片31,31同士は互いに平行に形成され、また各解除段部32,32同士も互いに平行に形成されている。
【0054】
また挿通孔23,23の開口内径の寸法と、段差27,27の幅寸法すなわち解除舌片26,26の幅寸法とは、解除部材30の使用部位の寸法に応じ、容易に挿通可能になるように定められている(図8参照〜後述)。
【0055】
この音発生基板3の側片およびガイド溝29,29の摺動により、音発生基板3が被覆部材4の底面に向かってガイドされ、係合孔25,25は、このガイド状態において、戻り段部24,24の先端が音発生基板3の表面に摺接する位置に穿設されている。
【0056】
係合孔25,25は本実施例において長孔に形成され、長手方向の内径寸法を戻り段部24,24の先端幅よりも大きく、かつ、短手方向の内径寸法を戻り段部24,24の先端が挿通可能な寸法に定めている。
【0057】
これにより音発生基板3およびガイド溝29,29の摺動により、戻り段部24,24の先端と音発生基板3の側片とが当接したとき、さらに音発生基板3を押圧すると、係合舌片22,22の先端が音発生基板3の側片を乗り越えながら、音発生基板3の表面を摺接し、やがて係合舌片22,22は係合孔25,25に対して円滑に係合される(図1および図11参照)。
【0058】
この状態で音発生基板3を上記係合時とは逆方向に摺動させようとしても、係合舌片22,22が係合孔25,25の開口に係止されるので、音発生基板3と被覆部材4とは一体になり、この一体状態は解除されない。
【0059】
そして係合舌片22,22および係合孔25,25による係合状態を解除するための解除部材30の先端を挿通孔23,23の開口に挿通させ、そのままテーパ面28,28に沿って図11中、矢印A方向に押圧すればよい。
【0060】
これにより戻り段部24,24と一体に形成されている解除舌片26,26は、解除部材(図12参照)30に摺動されながら漸次、全体が音発生基板3から離間し、戻り段部24,24が係合孔25,25から外れ、係合舌片22,22および係合孔25,25の係合状態は解除される。
【0061】
このように構成された遊技機制御回路の効果音発生装置1は、音源部6がEP−ROM7およびROMアドレスラッチ回路8と、音声合成回路LSI9と、チップ状電子部品12とで構成され、これらは音発生基板3の両面に分割して実装され、各構成部品のいずれかに仕様変更を要する場合、音発生基板3のみを交換すれば、制御基板5を異なる機種間で共通使用できる。
【0062】
音発生基板3を制御基板5に取り付ける場合、まず音発生基板3を被覆部材4のガイド溝29,29に挿通させながら、音発生基板3およびガイド溝29,29を摺動させると、係合舌片22,22および係合孔25,25の係合により、上述したように音発生基板3と被覆部材4とは一体化される。
【0063】
ここで誤って他機種用の音発生基板3を被覆部材4に一体化させた場合、専用の解除部材30の解除舌片31,31を先端から挿通孔23,23に挿通させることで、係合舌片22,22および係合孔25,25の係合状態は解除される。
【0064】
この状態から、さらに解除部材30を挿通させれば、解除段部32,32が音発生基板3を被覆部材4から押し出すので、音発生基板3は被覆部材4から取り外され、取り外された音発生基板3を正規の音発生基板3に交換して、上記同様の手順で新たな音発生基板3と被覆部材4とを一体化せしめる。
【0065】
なお音発生基板3上に実装される各電子部品のうち、予めEP−ROM7以外のものを実装した音発生基板3を予めきわめて多量に生産しておき、パチンコ機2の機種別製造予定に応じ、機種に対応するEP−ROM7を適宜、音発生基板3に実装し、被覆部材4を音発生基板3に対して半田付けすれば、機種に応じた在庫を容易に管理でき、また正規EP−ROM7が被覆部材4で保護される。
【0066】
つぎに上記一体状態の音発生基板3と被覆部材4とを制御基板5に近接させながら、各接続ピン14を対応する接続孔15にそれぞれ係合させ、同時に装着ピン17を装着孔20に係合する。
【0067】
こののち接続ピン14および接続孔15を半田16付けすることにより、音発生基板3と制御部10とが電気的に接続され、これにより音発生基板3は制御基板5に対し、図3に示すようにほぼ直交する状態で取り付けされる。
【0068】
この状態では被覆部材4がEP−ROM7を被覆していないので、EP−ROM7の交換は容易になされ、開発時の効果音に係るソフトウエア上およびハードウエア上の実験には簡便である。
【0069】
また音発生基板3が制御基板5に対し、ほぼ直交する状態で取り付けられているため、音発生基板3は制御基板5面から延設され、音発生基板3が制御基板5を占める割合を、音源部6の構成部材を制御基板5に直接実装する場合と比較して、きわめて小さくできる。
【0070】
これと同時に第1半田加工面19および第2半田加工面21を半田16付けすることにより、被覆部材4は音発生基板3を被覆した状態で制御基板5上に装着され、被覆部材4の開口端は制御基板5によって塞がれる(図3参照)。
【0071】
したがって音発生基板3は、被覆部材4によって全体が被覆され、EP−ROM7、ROMアドレスラッチ回路8および音声合成回路LSI9だけでなく、これらの周辺回路が保護される。
【0072】
なお本実施例では、ROMアドレスラッチ回路8と音声合成回路LSI9とを各々別個に設けた場合について説明しているが、音声合成回路LSI9によっては、ハードウエア上処理のみで動作可能なものもあり、音声合成回路LSI9の機種によってはROMアドレスラッチ回路8を省略できる。
【0073】
【発明の効果】
本発明は以上説明したように、また音発生基板は制御基板に対して交差する向きに取り付けられるため、音発生基板が制御基板を占める割合をきわめて小さくでき、制御基板の設計上制限を緩和せしめ、開発期間の長期化を抑止できる。
【0074】
さらに被覆部材が音発生基板を保護することで、音源メモリと、音源メモリの周辺回路とに対する不正行為の発生を抑止するとともに、音源部に仕様変更があっても、音発生基板のみを交換するだけで、制御基板を異なる機種間で共通使用でき、大量生産が可能になることから、コストダウンを容易に実現する。
【0075】
音源メモリを構成する電子部品が集積回路からなり、該集積回路が着脱可能なソケットを音発生基板に固定している場合、音発生基板上に実装される各電子部品のうち、予め音源メモリ以外のものを実装した音発生基板を予めきわめて多量に生産しておき、遊技機の機種別製造予定に応じ、機種に対応する音源メモリを適宜、音発生基板に実装し、被覆部材を音発生基板に対して半田付けすれば、機種に応じた在庫を容易に管理でき、また正規音源メモリが被覆部材で保護されることになる。
【0076】
第1装着部を制御基板に形成し、第1装着部に係合する第2装着部と、音発生基板を取り付けるための第1係合部とを被覆部材に形成し、音発生基板には第1係合部に対して着脱可能に係合する第2係合部を形成している場合、第1係合部および第2係合部の係合によって被覆部材を音発生基板に装着し、第1係合部および第2係合部間の係合状態を解除することで、被覆部材を取り外すことができ、さらに第1装着部および第2装着部の係合により、被覆部材を制御基板に装着し、音源メモリと、音源メモリの周辺回路とに対する不正行為の発生を抑止することができる。
【0077】
少なくとも被覆部材および制御基板の一方に第1係合部および第2係合部による係合状態を解除するための解除部材を挿通するための挿通孔が形成されている場合、挿通孔に解除部材を挿通することにより、第1係合部および第2係合部間の係合状態を解除でき、製品組付時における作業性の低減を抑止する。
【図面の簡単な説明】
【図1】本発明の一実施例を示す要部斜視図である。
【図2】図1の装置を設けた遊技機の正面図である。
【図3】図1の装置の要部側面図である。
【図4】図1の被覆部材を示す斜視図である。
【図5】図3の装置の正面図である。
【図6】図5の音発生基板の正面図である。
【図7】図6の音発生基板の側面図である。
【図8】図1の被覆部材の平面図である。
【図9】図8のIX−IXに沿う被覆部材の断面図である。
【図10】図9の第1係合部の一部を示す斜視図である。
【図11】図10の第1係合部の使用例を示す側面図である。
【図12】図11と異なる状態を示す第1係合部の側面図である。
【符号の説明】
1 遊技機制御回路の効果音発生装置
3 音発生基板
4 被覆部材
5 制御基板
6 音源部
7 EP−ROM
8 ROMアドレスラッチ回路
9 音声合成回路LSI
10 制御部
13 ソケット
14 接続ピン
15 接続孔
16 半田
17 装着ピン
19 第1半田加工面
20 装着孔
21 第2半田加工面
30 解除部材
[0001]
[Industrial application fields]
The present invention relates to an improvement of a sound effect generating device of a gaming machine control circuit that generates a predetermined sound effect as a game progresses.
[0002]
[Prior art]
A gaming machine is composed of a wide variety of components, and by controlling these with a voice synthesis circuit LSI controlled by a central processing unit, a game with extremely varied contents can be easily provided.
[0003]
In other words, the voice synthesis circuit LSI sequentially executes the control program stored in the memory, so that, in other words, the entire gaming machine operates each component to advance the game, and a predetermined sound effect is generated as the game progresses. Generated.
[0004]
As a result, a game change is given to the player through visual perception, tactile sensation, etc. in addition to the player's hearing. Therefore, in recent years, in order to satisfy the demands of the player, the number of components of the gaming machine that directly touches the sight is increased, and these are operated in a complex manner, and at the same time, control is performed so that sound effects are closely generated. ing.
[0005]
On the other hand, the circuit for controlling the component parts of the gaming machine is inevitably required to increase the mounting density as the number of parts increases as described above. Various designs have been applied to the substrate, such as bonding the circuit wafer directly to the substrate.
[0006]
However, in the present situation, the mounting density is reaching the limit, and the simplification of the configuration of the gaming machine and the reduction in the number of parts are technical issues of the developer.
[0007]
By the way, when developing a gaming machine, it is completed as a product by making improvements so that each component of the gaming machine operates well while debugging each step from both the hardware and software sides at the time of prototyping. Increase the degree.
[0008]
In addition, sound effects are generated according to the progress of the game by the sound source unit provided in the gaming machine, but in recent years, not only the sound quality is good, but also has a variety of tones and advanced musicality. What is rich in change is desired.
[0009]
Therefore, in order to use the real sound for the sound material data, an EP-ROM (or mask ROM) in which the sampled real sound is written is provided in the sound generation unit.
[0010]
The sound material data written in the sound source memory is read out according to the progress of the game by the control unit for controlling the entire gaming machine and appropriately subjected to electronic processing. It is generated as a predetermined sound effect by a sound generator configured together with the sound source memory.
[0011]
The sound generator is composed of an A / D converter for converting sound material data written in the sound source memory into an audio signal, an amplifier circuit for amplifying the converted audio signal and adjusting the tone. ing.
[0012]
A ROM as a sound source memory is rarely mounted directly on a board by soldering. By soldering a socket to a board and attaching / detaching various ROMs to / from the socket, a different sound source memory, that is, a new sound effect Can be exchanged for sound material data.
[0013]
For this reason, during development, experiments on various sound effects are carried out by manual ROM replacement.
[0014]
[Problems to be solved by the invention]
However, the ROM has a dimension of, for example, 32, in order to facilitate handling since the ROM is exchanged manually, even though the wafer is substantially several millimeters square. In the case of a DIP (Dual Inline Package) of pins, the size is 42 mm × 16 mm, and it is difficult to say that the mounting efficiency on the board is good.
[0015]
For this reason, the use of the socket facilitates changing the program specifications by exchanging the ROM, but reduces the mounting area of the electronic component as compared with a means for mounting directly on the substrate such as bonding.
[0016]
For this reason, from the viewpoint of board design, such as the arrangement of electronic components mounted on the board and the routing of lines for electrical connection between each electronic part, the use of sockets has resulted in extremely large development. Since it tends to create the above restrictions, the development period is likely to be prolonged, leading to increased costs.
[0017]
The sound source memory can easily change the specifications of the sound material data by exchanging the ROM. However, depending on the specifications, it may be necessary to change the specifications of the peripheral circuits, particularly the sound generator, and control the sound source, ie, the sound generator memory and the sound generator. When the unit is mounted on the same substrate, the specification of the entire substrate must be changed although only the sound source unit needs to be changed due to the ROM exchange.
[0018]
As a result, the same board on which the components of the sound source unit and the control unit are mounted cannot be used in common among different models of gaming machines, and it is difficult to reduce costs. In addition, if the sound source unit and the control unit are configured separately, only the control unit can be used in common among different models, but the number of parts is increased, which is inconvenient to handle.
[0019]
In addition, since ROM replacement is easy, after the product is shipped, a third party can modify the regular ROM or its peripheral circuit illegally on hardware, or include a ROM that contains illegal control programs and data. It is easy to exchange and it is difficult to reliably prevent such fraud.
[0020]
Therefore, according to the present invention, the sound material data stored in the sound source memory can be easily exchanged and handled easily during development and product manufacture, and a circuit for generating sound effects occupies the control board. Providing sound effect generators for game machine control circuits that reduce the rate as much as possible, thereby reducing restrictions on control board design and protecting legitimate sound source memory after product shipment and making it difficult to cheat It is an object.
[0021]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a sound source unit (sound source unit 6) for generating a plurality of predetermined types of sound effects, and a sound source for storing at least sound material data constituting the sound effects A memory (EP-ROM 7 or mask ROM) and a sound generator (speech synthesizer circuit LSI9) for generating a sound effect signal corresponding to one of the sound effects based on the sound material data, and a predetermined A control board (control) for mounting an electronic component that constitutes a control unit (control unit 10) that advances a game based on the control procedure of the game and generates any sound effect from the sound source unit according to the progress of the game A substrate 5), a sound generation substrate (sound generation substrate 3) for mounting the electronic components constituting the sound source memory and the electronic components constituting the sound generation unit, and covering the sound source memory (7) member (4) is provided, the Second section in which the first mounting portion for mounting the member (4) to (mounting hole 20) formed on the control board (5), engaging the first mounting portion (20) to (mounting pin 17) A first connection part (connection pin 14 ) formed on the covering member (4) and electrically connected to the control part (10 ) is formed on the sound generating board (3) , and the first A second connecting portion (connecting hole 15 ) that engages with the connecting portion (14) is formed on the control board (5) , and the sound generating board (3) is attached in a direction crossing the control board (5). It has a configuration.
[0022]
An electronic component constituting the sound source memory (7) is an integrated circuit which is a rewritable memory element or a non-rewritable memory element , and a socket (socket 13) to which the integrated circuit can be attached and detached is attached to the sound generating board (3) . It is fixed.
[0023]
A first mounting portion (first mounting portion 20) for mounting a covering member that covers the sound source memory is formed on the control board, and a first engagement portion (engaging tongue piece 22) for mounting the sound generating board; A second mounting portion (mounting pin 17) that engages with the first mounting portion is formed on the covering member, and a second engaging portion that is detachably engaged with the first engaging portion on the sound generating board. (Engagement hole 25) is formed.
[0024]
An insertion hole for inserting a release member (release member 30) for releasing the engaged state by the first engagement portion and the second engagement portion is formed in at least one of the covering member and the control board.
[0025]
[Action]
Since the present invention is configured as described above, the sound source section (6) is composed of a sound source memory (7) and a sound generation section (9), and the components are divided and mounted on the sound generation board (3). When at least one of the specifications needs to be changed, the control board can be used in common between different models by replacing only the sound generation board, and the sound generation board is mounted in a direction that intersects the control board. The board extends from the control board surface, and the proportion of the sound generation board occupying the control board can be made extremely small as compared to the case where the sound source component is directly mounted on the control board. By covering the sound source memory with (4), the occurrence of illegal acts on the sound source memory and the peripheral circuits of the sound source memory is suppressed.
[0026]
When the electronic component constituting the sound source memory is an integrated circuit, and the socket (13) to which the integrated circuit is removable is fixed to the sound generation board, the sound source memory can be removed by attaching / detaching the sound source memory to / from the socket. The sound source memory mounted on the sound generation board or the sound source memory mounted on the sound generation board can be removed.
[0027]
The first mounting portion (20) is formed on the control board, and the second mounting portion (17) engaged with the first mounting portion and the first engaging portion (22) for mounting the sound generating substrate are covered. When the second engagement portion (25) that is detachably engaged with the first engagement portion (22) is formed on the sound generating board, the first engagement portion and the second engagement portion are formed. The covering member can be attached to the sound generating board by engaging the joint portion, and the covering member can be removed by releasing the engagement state between the first engaging portion and the second engaging portion. The covering member can be mounted on the control board by the engagement of the first mounting portion and the second mounting portion.
[0028]
When at least one of the covering member and the control board is formed with an insertion hole (23) for inserting a release member (30) for releasing the engagement state by the first engagement portion and the second engagement portion The engagement state between the first engagement portion and the second engagement portion can be released by inserting the release member through the insertion hole.
[0029]
【Example】
Next, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a main configuration of a sound effect generating device 1 for a gaming machine control circuit according to the present invention. In this embodiment, the sound effect generating device 1 for a game machine control circuit is shown in FIG. The case where it is provided in 2 will be described below.
[0030]
The sound effect generating device 1 of this gaming machine control circuit mainly includes a sound generating board 3 and a covering member 4 shown in FIGS. 3 and 4, and the sound generating board 3 and the covering member 4 control the entire pachinko machine 2. A control circuit (not shown) for mounting is mounted on the control board 5 shown in FIG.
[0031]
The sound generation board 3 is made of a glass epoxy based synthetic resin or the like, and includes an EP-ROM 7, a ROM address latch circuit 8, and a voice synthesis circuit LSI 9 that constitute a sound source unit 6 for generating a plurality of predetermined sound effects. Each electronic component is mounted (described later).
[0032]
The sound source unit 6 is controlled by a control unit 10 composed of a control board 5 and mounted parts (partially shown in FIGS. 3 and 5) 11 on the control board 5, and the control unit 10 is not shown. Based on the sequential execution of the control procedure of the pachinko machine 2 stored in the memory, the pachinko game is advanced, and any sound effect is generated from the sound source unit 6 in accordance with the progress of the pachinko game.
[0033]
On the sound generation board 3, an EP-ROM 7 as a sound source memory, a ROM address latch circuit 8 for accessing the EP-ROM 7, and a voice synthesis circuit LSI 9 as a sound generation unit, as well as chip-like electronic components 12 is distributed and mounted on both surfaces, and these sound sources 7 to 9 and 12 are electrically connected by lines (not shown) routed on the sound generation board 3 to form the sound source unit 6. .
[0034]
The voice synthesis circuit LSI 9 accesses the EP-ROM 7 via the ROM address latch circuit 8, reads each voice data stored at a predetermined address of the EP-ROM 7, and sends a predetermined voice to the speaker ( (Not shown).
[0035]
The sound generation board 3 has an EP-ROM 7 mounted on one surface, and electronic components constituting the ROM address latch circuit 8 and the speech synthesis circuit LSI 9 mounted on the other surface.
[0036]
The EP-ROM 7 is mounted on the sound generation board 3 via a socket 13, and the socket 13 is fixed to the sound generation board 3 by soldering.
[0037]
Thus, since the EP-ROM 7 is detachably attached to the socket 13, the EP-ROM 7 already attached to the socket 13 can be replaced with an EP-ROM 7 for another model according to the specifications of the pachinko game.
[0038]
As shown in FIG. 6, the sound generating board 3 has a plurality of connection pins 14 along one side of the sound generating board 3 as a first connecting part for electrical connection to the control unit 10. The connecting pins 14 are juxtaposed at a predetermined pitch, and the connecting pins 14 protrude along the sound generating board 3 as shown in FIG.
[0039]
On the other hand, the control board 5 is provided with a plurality of connection holes 15 as second connection portions corresponding to each pitch of the connection pins 14. Then, the surface of the connection pin 14 and the periphery of the opening of the connection hole 15 are processed to make it easy to become familiar with the solder 16.
[0040]
A line (not shown) is routed from the control unit 10 to the connection hole 15, and the connection pins 14 are soldered 16 in a state where the connection pins 14 are engaged with the corresponding connection holes 15. In other words, each of the sound source units 6 to 9 and 12 and the control unit 10 are electrically connected.
[0041]
The covering member 4 is for covering at least the EP-ROM 7 (or a mask ROM not shown). In this embodiment, the covering member 4 covers the entire sound generating board 3 mounted on the control board 5. The case where the covering member 4 is mounted on the control board 5 will be described below.
[0042]
The covering member 4 is made of plastic or the like and is formed in a rectangular parallelepiped shape. One side surface of the covering member 4 is opened, and a total of four mounting pins 17 as second mounting portions protrude from corner portions of the open side surface. ing.
[0043]
Specifically, the mounting pins 17 are provided through bosses 18 (see FIG. 1) formed respectively at the corner portions of the covering member 4, and only the tip protrudes from the open side surface of the covering member 4.
[0044]
A first soldering surface 19 is formed at the tip of the mounting pin 17, and the mounting pin 17 engages with a mounting hole 20 as a first mounting portion formed in the control board 5. A second soldering surface 21 is formed around the opening of the mounting hole 20, and when the mounting pin 17 and the mounting hole 20 are engaged, the first soldering surface 19 and the second soldering surface 21 are adjacent to each other.
[0045]
As a result, the first solder processed surface 19 and the second solder processed surface 21 can be easily soldered 16, and the covering member 4 is mounted on the control board 5. In the present embodiment, the mounting holes 20 are formed in four places on the control board 5 so as to surround the connection holes 15, and the pitch of the mounting holes 20 is determined based on the arrangement of the mounting pins 17.
[0046]
Further, on the other side of the covering member 4, in other words, on the bottom surface, a pair of engaging tongue pieces 22 and 22 as first engaging portions are directed inward of the covering member 4 as shown in FIGS. It protrudes like a cantilever.
[0047]
The pair of engaging tongue pieces 22 and 22 are for mounting the sound generating board 3 on the covering member 4. A pair of insertion tongue pieces 22 and 22 are inserted into the base ends of the engaging tongue pieces 22 and 22 on the bottom surface of the covering member 4. While holes 23 and 23 are formed, return steps 24 and 24 are formed at the tips.
[0048]
On the other hand, the sound generating board 3 has a pair of engaging holes (described later) as return step portions 24 and 24 which are detachably engaged with the engaging tongue pieces 22 and 22, respectively. 1 to 6, 11, and 12) 25 and 25 are formed.
[0049]
Further, the pair of engaging tongue pieces 22 and 22 are respectively formed with a pair of release tongue pieces 26 and 26 adjacent to the inside of the both engagement tongue pieces 22 and 22 shown in FIG. Steps 27 and 27 are formed between 26 and 26 and the engaging tongue pieces 22 and 22, respectively.
[0050]
Although the details of the insertion holes 23 and 23 will be described later, the insertion holes 23 and 23 are for releasing the engagement state of the engagement tongue pieces 22 and 22 and the engagement holes 25 and 25, and from the base ends of the release tongue pieces 26 and 26. Tapered surfaces 28 and 28 are formed toward the tip.
[0051]
A pair of guide grooves 29 and 29 are formed along the mounting pins 17 on the inner wall surfaces of the covering member 4 facing each other. The pair of guide grooves 29, 29 are formed to have dimensions that allow sliding on the short side piece of the sound generating board 3 shown in FIGS.
[0052]
A dedicated release member (see FIG. 12) 30 is used to release the engagement state by the engagement tongue pieces 22 and 22 and the engagement holes 25 and 25 described above.
[0053]
The release member 30 includes a pair of release tongues 31, 31 that can be inserted into the insertion holes 23, 23 corresponding to the release tongues 26, 26, and a pair of release stages for pushing out the sound generating board 3. Parts 32 and 32. In the release member 30, the release tongue pieces 31, 31 are formed in parallel with each other, and the release step portions 32, 32 are also formed in parallel with each other.
[0054]
The opening inner diameter of the insertion holes 23 and 23 and the width of the steps 27 and 27, that is, the width of the release tongues 26 and 26, can be easily inserted according to the size of the use site of the release member 30. (See FIG. 8 to be described later).
[0055]
The sound generating board 3 is guided toward the bottom surface of the covering member 4 by the sliding of the side pieces of the sound generating board 3 and the guide grooves 29, 29, and the engagement holes 25, 25 are in the return stage in this guide state. The tips of the portions 24 and 24 are formed at positions where the tips of the portions 24 and 24 are in sliding contact with the surface of the sound generating substrate 3.
[0056]
In the present embodiment, the engagement holes 25, 25 are formed as long holes, the inner diameter dimension in the longitudinal direction is larger than the tip width of the return step sections 24, 24, and the inner diameter dimension in the short direction is set to the return step section 24, The 24 tips are sized so that they can be inserted.
[0057]
As a result, when the sound generating board 3 and the guide grooves 29 and 29 are slid and the tips of the return step portions 24 and 24 come into contact with the side pieces of the sound generating board 3, if the sound generating board 3 is further pressed, The tips of the joint tongues 22 and 22 slidably contact the surface of the sound generating board 3 while getting over the side pieces of the sound generating board 3, and the engaging tongue pieces 22 and 22 eventually smoothly move with respect to the engaging holes 25 and 25. Engaged (see FIGS. 1 and 11).
[0058]
In this state, even if the sound generating board 3 is slid in the direction opposite to that at the time of engagement, the engaging tongue pieces 22 and 22 are locked to the openings of the engaging holes 25 and 25. 3 and the covering member 4 are integrated, and this integrated state is not released.
[0059]
Then, the distal end of the release member 30 for releasing the engagement state by the engagement tongue pieces 22 and 22 and the engagement holes 25 and 25 is inserted into the openings of the insertion holes 23 and 23, and is directly along the tapered surfaces 28 and 28. In FIG. 11, it may be pressed in the direction of arrow A.
[0060]
As a result, the release tongues 26 and 26 formed integrally with the return step portions 24 and 24 are gradually separated from the sound generating substrate 3 while being slid by the release member 30 (see FIG. 12), The portions 24, 24 are disengaged from the engagement holes 25, 25, and the engagement states of the engagement tongue pieces 22, 22 and the engagement holes 25, 25 are released.
[0061]
In the sound effect generator 1 of the gaming machine control circuit configured as described above, the sound source unit 6 includes an EP-ROM 7 and a ROM address latch circuit 8, a voice synthesis circuit LSI 9, and a chip-like electronic component 12. Is divided and mounted on both sides of the sound generation board 3, and if it is necessary to change the specifications of any of the components, the control board 5 can be used in common among different models if only the sound generation board 3 is replaced.
[0062]
When the sound generating board 3 is attached to the control board 5, first, the sound generating board 3 and the guide grooves 29 and 29 are slid while the sound generating board 3 is inserted into the guide grooves 29 and 29 of the covering member 4. By the engagement of the tongue pieces 22 and 22 and the engagement holes 25 and 25, the sound generating substrate 3 and the covering member 4 are integrated as described above.
[0063]
If the sound generating board 3 for another model is mistakenly integrated with the covering member 4, the release tongues 31 and 31 of the exclusive release member 30 are inserted through the insertion holes 23 and 23 from the tip. The engagement state of the tongue pieces 22, 22 and the engagement holes 25, 25 is released.
[0064]
If the release member 30 is further inserted from this state, the release step portions 32 and 32 push out the sound generating board 3 from the covering member 4, so that the sound generating board 3 is removed from the covering member 4 and the removed sound is generated. The substrate 3 is replaced with a regular sound generating substrate 3, and the new sound generating substrate 3 and the covering member 4 are integrated by the same procedure as described above.
[0065]
Of the electronic components mounted on the sound generation board 3, the sound generation board 3 on which the components other than the EP-ROM 7 are mounted in advance is produced in a very large amount in advance, and the pachinko machine 2 according to the production schedule according to the model. If the EP-ROM 7 corresponding to the model is appropriately mounted on the sound generating board 3 and the covering member 4 is soldered to the sound generating board 3, the stock corresponding to the model can be easily managed, and the regular EP- The ROM 7 is protected by the covering member 4.
[0066]
Next, while the integrated sound generating board 3 and the covering member 4 are brought close to the control board 5, each connection pin 14 is engaged with the corresponding connection hole 15, and at the same time, the mounting pin 17 is engaged with the mounting hole 20. Match.
[0067]
After that, the connection pins 14 and the connection holes 15 are soldered 16 so that the sound generation board 3 and the control unit 10 are electrically connected. As a result, the sound generation board 3 is shown in FIG. Are attached in a state of being substantially orthogonal.
[0068]
In this state, since the covering member 4 does not cover the EP-ROM 7, the EP-ROM 7 can be easily replaced, and is easy for software and hardware experiments related to sound effects during development.
[0069]
Further, since the sound generation board 3 is attached to the control board 5 so as to be substantially orthogonal, the sound generation board 3 extends from the control board 5 surface, and the ratio of the sound generation board 3 to the control board 5 is as follows. Compared with the case where the constituent members of the sound source unit 6 are directly mounted on the control board 5, it can be made extremely small.
[0070]
At the same time, the first soldering surface 19 and the second soldering surface 21 are soldered 16 so that the covering member 4 is mounted on the control substrate 5 while covering the sound generating substrate 3. The end is closed by the control board 5 (see FIG. 3).
[0071]
Therefore, the sound generating board 3 is entirely covered with the covering member 4 to protect not only the EP-ROM 7, the ROM address latch circuit 8 and the voice synthesis circuit LSI9 but also their peripheral circuits.
[0072]
In this embodiment, the case where the ROM address latch circuit 8 and the voice synthesis circuit LSI 9 are provided separately has been described. However, some voice synthesis circuits LSI 9 can operate only by processing on hardware. The ROM address latch circuit 8 can be omitted depending on the model of the speech synthesis circuit LSI9.
[0073]
【The invention's effect】
As described above, since the sound generation board is attached in a direction crossing the control board, the proportion of the sound generation board occupying the control board can be extremely small, and the restriction on the design of the control board can be relaxed. , Can prevent the development period from becoming longer.
[0074]
In addition, the covering member protects the sound generating board, thereby preventing the occurrence of fraudulent acts on the sound source memory and the peripheral circuit of the sound source memory, and replacing only the sound generating board even if the specification of the sound source section is changed. Therefore, the control board can be used in common among different models and mass production becomes possible, so cost reduction is easily realized.
[0075]
When the electronic components constituting the sound source memory are composed of integrated circuits, and the sockets to which the integrated circuits can be attached and fixed are fixed to the sound generation board, the electronic components mounted on the sound generation board are previously other than the sound source memory The sound generation board that has been mounted on the sound generator is produced in large quantities in advance, and according to the production schedule of each game machine, the sound source memory corresponding to the model is appropriately mounted on the sound generation board, and the covering member is the sound generation board If the soldering is performed, the stock corresponding to the model can be easily managed, and the regular sound source memory is protected by the covering member.
[0076]
A first mounting portion is formed on the control board, a second mounting portion that engages with the first mounting portion, and a first engagement portion for mounting the sound generating substrate are formed on the covering member. When the second engagement portion that is detachably engaged with the first engagement portion is formed, the covering member is attached to the sound generation board by the engagement of the first engagement portion and the second engagement portion. The covering member can be removed by releasing the engagement state between the first engaging portion and the second engaging portion, and the covering member is controlled by the engagement of the first mounting portion and the second mounting portion. By attaching to the board, it is possible to suppress the occurrence of fraudulent acts on the sound source memory and the peripheral circuit of the sound source memory.
[0077]
When an insertion hole for inserting a release member for releasing the engagement state by the first engagement portion and the second engagement portion is formed in at least one of the covering member and the control board, the release member is formed in the insertion hole. By inserting the, the engagement state between the first engagement portion and the second engagement portion can be released, and a reduction in workability during product assembly is suppressed.
[Brief description of the drawings]
FIG. 1 is a perspective view of an essential part showing an embodiment of the present invention.
FIG. 2 is a front view of a gaming machine provided with the apparatus of FIG.
FIG. 3 is a side view of a main part of the apparatus shown in FIG. 1;
4 is a perspective view showing the covering member of FIG. 1. FIG.
FIG. 5 is a front view of the apparatus of FIG. 3;
6 is a front view of the sound generation board of FIG. 5. FIG.
7 is a side view of the sound generation board of FIG. 6. FIG.
8 is a plan view of the covering member of FIG. 1. FIG.
9 is a cross-sectional view of the covering member taken along the line IX-IX in FIG.
10 is a perspective view showing a part of the first engaging portion of FIG. 9. FIG.
11 is a side view showing an example of use of the first engagement portion of FIG.
12 is a side view of the first engaging portion showing a state different from FIG. 11. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Sound effect generator of a game machine control circuit 3 Sound generation board 4 Cover member 5 Control board 6 Sound source part 7 EP-ROM
8 ROM address latch circuit 9 Speech synthesis circuit LSI
10 Control unit
13 socket
14 Connection pin
15 Connection hole
16 Solder
17 Mounting pin
19 First solder surface
20 Mounting hole
21 Second solder surface
30 Release member

Claims (4)

予め定められた複数種の効果音を発生させるための音源部(6) と、所定の制御手順に基く遊技の進行に応じて前記音源部(6) からいずれかの効果音を発生させる制御部(10)とを備え、
前記音源部(6) を、前記効果音を構成している音素材データを少なくとも格納する音源メモリ(7) と、前記音素材データに基いて前記効果音のいずれかに対応する効果音信号を発生させるための音発生部(9) とで構成し、
前記制御部(10)を構成する電子部品を実装するための制御基板(5) を設け、
前記音源メモリ(7) を構成する電子部品と前記音発生部(9) を構成する電子部品とを実装するための音発生基板 (3) を設け、
前記音源メモリ (7) を被覆する被覆部材 (4) を設け、
前記被覆部材 (4) を装着するための第1装着部 (20) を前記制御基板 (5) に形成し、前記第1装着部 (20) に係合する第2装着部 (17) を前記被覆部材 (4) に形成し、
前記制御部 (10) に対して電気的に接続するための第1接続部 (14) を前記音発生基板 (3) に形成し、前記第1接続部 (14) に係合する第2接続部 (15) を制御基板 (5) に形成し、
前記音発生基板(3) を前記制御基板(5) に対して交差する向きに取り付けることを特徴とする遊技機制御回路の効果音発生装置。
A sound source unit (6) for generating a plurality of predetermined sound effects, and a control unit for generating any sound effect from the sound source unit (6) according to the progress of the game based on a predetermined control procedure (10) and Bei to give a,
The sound source unit (6) includes a sound source memory (7) for storing at least sound material data constituting the sound effect, and a sound effect signal corresponding to any of the sound effects based on the sound material data. And a sound generator (9) for generating
A control board (5) for mounting electronic components constituting the control unit (10) is provided,
A sound generation board (3) for mounting the electronic components constituting the sound source memory (7) and the electronic components constituting the sound generation unit (9) ;
A covering member (4) for covering the sound source memory (7 ) is provided,
Wherein the first mounting portion for mounting the cover member (4) to (20) formed on the control board (5), wherein the second attachment portion for engaging the first mounting portion (20) (17) Formed on the covering member (4) ,
A first connection part (14 ) for electrically connecting to the control part (10) is formed on the sound generating board (3) , and a second connection engaged with the first connection part (14). Part (15) is formed on the control board (5) ,
A sound effect generating device for a gaming machine control circuit, wherein the sound generating board (3) is attached in a direction crossing the control board (5).
前記音源メモリ(7)を構成する電子部品が、書き換え可能なメモリ素子または書き換え不能なメモリ素子である集積回路からなり、該集積回路が着脱可能なソケット(13)を音発生基板(3) に固定していることを特徴とする請求項1に記載の遊技機制御回路の効果音発生装置。 The electronic component constituting the sound source memory (7) is composed of an integrated circuit which is a rewritable memory element or a non-rewritable memory element , and a socket (13) to which the integrated circuit can be attached and detached is attached to the sound generating board (3). The sound effect generator for a gaming machine control circuit according to claim 1, wherein the sound effect generator is fixed. 前記音発生基板(3) を取り付けるための第1係合部(22) 被覆部材(4) に形成し、前記音発生基板(3) には前記第1係合部(22)に対して着脱可能に係合する第2係合部(25)を形成することを特徴とする請求項1または請求項2に記載の遊技機制御回路の効果音発生装置。First engaging portion for attaching the sound generating substrate (3) to (22) formed in the covering member (4), the sound generating substrate (3) on the said first engaging portion relative (22) The sound effect generating device for a gaming machine control circuit according to claim 1 or 2 , wherein a second engaging portion (25) that is detachably engaged is formed. 少なくとも被覆部材(4) および音発生基板(3) の一方に第1係合部(22)および第2係合部(25)による係合状態を解除するための解除部材(30)を挿通させる挿通孔(23)が形成されていることを特徴とする請求項1ないし請求項3のいずれかに記載の遊技機制御回路の効果音発生装置。A release member (30) for releasing the engagement state by the first engagement portion (22) and the second engagement portion (25) is inserted into at least one of the covering member (4) and the sound generating substrate (3). The sound effect generating device for a gaming machine control circuit according to any one of claims 1 to 3, wherein an insertion hole (23) is formed.
JP10197694A 1994-04-15 1994-04-15 Sound effect generator for game machine control circuit Expired - Fee Related JP3746307B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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JP3746307B2 true JP3746307B2 (en) 2006-02-15

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JP4513173B2 (en) * 2000-06-06 2010-07-28 株式会社三洋物産 Game machine
JP2002143502A (en) * 2000-11-15 2002-05-21 Heiwa Corp Mounting structure of board in game machine
JP5031786B2 (en) * 2004-09-17 2012-09-26 株式会社オリンピア Electronic circuit board

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